JP3614414B2 - Curing furnace for resin sealing of semiconductor chips - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a curing furnace for resin sealing of a semiconductor chip that accelerates curing of a resin sealing part after resin sealing is performed on a mounted semiconductor chip.
[0002]
[Prior art]
Conventionally, a film work in which a semiconductor chip is wound on a reel by inner lead bonding in a previous process is unwound from the reel in the next step, and the semiconductor chip is resin-sealed in a resin sealing portion, and then for resin sealing The resin sealing portion is cured in a curing furnace.
[0003]
In the resin-encapsulating curing furnace, in order to save space, the conveyance path in the furnace body is provided in three stages in the vertical direction, and a pre-process such as a screen printing process for resin-sealing the mounted semiconductor chip. The film work transported from the inlet provided on the lower end 1 side is first transported horizontally in the forward direction toward the other end, and then the upper part is fed by the first feed roll provided on the other end. It is folded back in the direction, this time horizontally transported in the reverse direction to the second feed roll provided on the inlet side with the resin sealing part on the bottom, and finally folded back upward by the second feed roll. It is horizontally transported in the forward direction to the outlet provided in the upper part on the other end side with the sealing part as the upper surface. In addition, heating means such as a far-infrared panel heater is appropriately disposed in the transport path, and the resin sealing portion is made tack-free (in a state where the resin does not stick even if touched and the resin does not drip) in the first transport path. It is made to harden | cure with the conveyance path of the 2nd step and the 3rd step. Such a configuration is already known in Japanese Patent Application Laid-Open No. 5-228492.
[0004]
[Problems to be solved by the invention]
However, the feed rolls arranged at the turn-up part of the curing furnace are sprocket rolls, and the teeth of the sprocket rolls are successively placed in the sprocket holes drilled at a constant pitch in both ends in the width direction of the film work. The film work can be transported reliably, but the film work tension cannot be maintained when the film work is replaced, that is, when the reel on the unwinder side or the reel on the winder side is replaced. There is a case.
[0005]
At this time, the film work in the curing furnace is disengaged from the sprocket roll teeth, and in the next operation, the sprocket roll teeth often do not enter the sprocket holes of the film work, and the film work falls off the sprocket roll. There is. Such a phenomenon becomes remarkable as the film work becomes thinner.
Accordingly, an object of the present invention is to provide a curing furnace for resin sealing of a semiconductor chip in which the film work is prevented from dropping off from a sprocket roll part disposed at a folded part of the film work in the curing furnace.
[0006]
[Means for Solving the Problems]
A curing furnace for resin sealing of a semiconductor chip according to the present invention that achieves the above object has a film work in which resin sealing is performed on a semiconductor chip mounted at a constant pitch, and has a heating means, from the entrance of the furnace body. In a curing furnace that is horizontally arranged in multiple stages toward the outlet and that is continuously transported along a conveyance path in which a feed roll is disposed in each folded portion, the sealing resin is cured. A sprocket roll is used as the feed roll disposed at least at the first turn-up portion of the film work conveyed from the inlet into the furnace body, and guide rolls are provided at the upper and lower parts of the sprocket roll so that the film work does not come off. It is characterized by.
[0007]
If only one guide roll is provided on one side of the sprocket roll, for example, if only one tooth of the sprocket roll is missing and all other teeth are missing due to the degree of slackness of the film work, Although it is difficult to completely engage the sprocket roll teeth with the sprocket holes of the film work, if the guide rolls are provided at two positions above and below the sprocket roll as in the present invention, the sprocket roll teeth and the film work The sprocket hole is never disengaged.
[0008]
In a curing furnace for resin sealing of semiconductor chips, if the transport path of the film work is configured in three stages in order to shorten the length of the curing furnace, rolls are required at two places in the folded portion. Since the resin-sealed part of the film is conveyed to the curing furnace, the film is formed on the upper and lower parts of the sprocket roll disposed at least at the first turn-up part of the film work conveyed from the inlet of the furnace body into the furnace body. It is necessary to provide a guide roll so that the workpiece does not come off.
[0009]
In addition, when the guide roll has both flange portions straddling the teeth of the sprocket roll and is configured not to press the sprocket roll, it is possible to reduce unnecessary tension on the film work, There is an effect that it is possible to avoid the problem that the joint portion of the semiconductor chip mounting portion peels off due to the deformation.
[0010]
Moreover, since it does not press with the said guide roll, there exists an effect that a film work is not damaged.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention are described below.
[0012]
The reel that has been wound with the semiconductor chip mounted on the inner lead portion of the film work formed at a constant pitch is set in an unwinding machine (not shown), and the unwound film work 1 is a resin-sealed portion (see FIG. The semiconductor chip portion 1a is resin-sealed by, for example, stencil printing means, and then transported to a curing furnace and the sealing resin is cured, and then wound up by a winder (not shown).
[0013]
As shown in FIG. 1, the curing furnace has an inlet 3 formed in the lower part on one end side of the furnace body 2 and an outlet 4 formed in the upper part on the other end side. The conveyance path of the film work 1 in the furnace body 2 is configured in three stages. The first stage is between the inlet 3 and a rotation-free sprocket roll 5 in which a miniature bearing is inserted into a shaft that does not have a drive unit disposed on the other end side, and the second stage is the sprocket roll 5, Between the rotation roll-free feed roll 6 in which a miniature bearing is inserted into a shaft that does not have a drive unit disposed on the upper side of the inlet 3 side, and the third stage is between the feed roll 6 and the outlet 4. A zigzag shape is formed from the inlet 3 toward the outlet 4.
[0014]
Each transport path is provided with heating means 7a, 7b, 7c such as a far-infrared panel heater and the like, and guide rails 8a, 8b, 8c, and each side of the sprocket roll 5 and the feed roll 6 has an arc shape. Heating means 9, 10 such as a far infrared panel heater is provided. The guide rails 8a, 8b, 8c are for supporting both ends of the film work 1 in the width direction. Since the feed roll 6 is in contact with the lower surface of the surface on which the semiconductor chip is mounted, it may be a cylindrical roll, but a sprocket roll can also be used. In that case, a later-described guide roll is necessary.
[0015]
Reference numerals 11 and 12 are guide rolls provided on the upper and lower parts of the sprocket roll 5, respectively, and the details thereof are shown in FIGS.
[0016]
That is, the guide roll 11 is disposed at a position where the film work 1 is just separated from the teeth 5a of the sprocket roll 5 so that the film work 1 is conveyed to the second-stage conveyance path. Is disposed at a location where it is transported through the transport path and just contacts the sprocket roll 5. Note that both end portions of the guide rolls 11 and 12 have both flange portions 13 so as to straddle the teeth 5a and 5b of the sprocket roll 5 and the like.
[0017]
According to the curing furnace of the present invention, the film work 1 in which the semiconductor chip portion 1a is resin-sealed is the furnace body 2 while both ends of the width direction are supported by the guide rail 8a with the semiconductor chip portion 1a facing up. The resin-sealed portion is made tack-free by being radiated and heated by the heating means 7a in the first-stage transport path. Next, the sprocket roll 5 is pressed by the guide rolls 11 and 12 so that the sprocket holes of the film work 1 are not removed from the teeth 5a and 5b, etc., and is transported to the second-stage transport path while being heated by the heating means 9. . In the conveyance path, as in the case of the first-stage conveyance path, both ends in the width direction of the film work 1 are supported by the guide rails 8b and conveyed in the reverse direction while being heated by the heating means 7b. Next, the film work 1 is reversed by the feed roll 6 while being heated by the heating means 10, both ends in the width direction of the film work 1 are supported by the guide rails 8 c in the third-stage transport path, and heated by the heating means 7 c. Then, it is conveyed in the forward direction and is carried out from the outlet 4.
[0018]
【The invention's effect】
According to the curing furnace for resin sealing of a semiconductor chip of the present invention, the feed roll disposed at least at the first turn-up portion of the film work conveyed from the entrance of the furnace body into the furnace body is a sprocket roll, and the sprocket Since the guide rolls are provided so that the film work does not come off at the upper and lower parts of the roll, the engagement between the sprocket roll teeth and the sprocket holes of the film work is completely eliminated.
[Brief description of the drawings]
FIG. 1 is a front sectional view of a curing furnace for resin sealing of a semiconductor chip of the present invention.
FIG. 2 is a detailed view of a sprocket roll portion of a curing furnace for resin sealing of a semiconductor chip of the present invention.
FIG. 3 is a side view of a sprocket roll portion and an upper guide roll portion of a curing furnace for resin sealing of a semiconductor chip of the present invention.
4 is a view taken in the direction of arrows XX in FIG. 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Film work 2 Furnace main body 3 Inlet 4 Outlet 5 Sprocket roll 6 Feed roll 7a, 7b, 7c Heating means 8a, 8b, 8c Guide rail 9 Heating means 10 Heating means 11 Guide roll 12 Guide roll 13 Both ends

Claims (2)

A film work in which resin sealing is performed on a semiconductor chip mounted at a constant pitch, has heating means, is horizontally arranged in multiple stages from the entrance to the exit of the furnace body, and feed rolls are provided to each folded portion. In a curing furnace in which the sealing resin is cured by continuously transporting along the arranged conveyance path, it is disposed at least at the first turn-up portion of the film work conveyed from the furnace body entrance into the furnace body. The installed feed roll is a sprocket roll, and guide rolls are provided at the upper and lower parts of the sprocket roll so that the film work does not come off even when the tension of the film work cannot be maintained when replacing the film work. Curing furnace for resin sealing of semiconductor chips. 2. The curing furnace for resin sealing of a semiconductor chip according to claim 1, wherein the guide roll has both flange portions straddling the teeth of the sprocket roll and is configured not to press the sprocket roll.

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