JP3604182B2 - Method and apparatus for removing excess coating liquid at end of substrate surface - Google Patents

Method and apparatus for removing excess coating liquid at end of substrate surface Download PDF

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JP3604182B2
JP3604182B2 JP29018194A JP29018194A JP3604182B2 JP 3604182 B2 JP3604182 B2 JP 3604182B2 JP 29018194 A JP29018194 A JP 29018194A JP 29018194 A JP29018194 A JP 29018194A JP 3604182 B2 JP3604182 B2 JP 3604182B2
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substrate
coating
liquid
thin plate
coating liquid
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JPH08141484A (en
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松 隆 泰 小
川 俊 二 宮
上 慎一郎 村
羽 洋 吉
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Description

【0001】
【産業上の利用分野】
本発明は、LCD用カラーフィルターに代表される大型ガラス基板などの枚葉基板への塗布液の塗布終了後における、基板面端部の過剰塗布液除去方法およびその方法に用いられる装置に関する。
【0002】
【従来の技術】
従来、LCD用カラーフィルターに代表される大型ガラス基板などの枚葉基板への塗布液のコーティング方式としては、スピンコーティング方式が知られている。
【0003】
この方式は、塗布効率が10%程度と低く、しかも基板のコーナー部分で塗布膜厚が厚くなり過ぎるという欠点がある。この欠点を解決でき、かつ枚葉基板に塗布液を効率よく塗布する方法としては、ナイフコート方式、ロールコート方式、ダイコート方式があるが、これらの方式を用いて均一な膜厚を得るには、基板表面の平滑度が塗布精度以下でなければならないという問題がある。この問題をも解決できる液塗布方式として、塗布液ビードを基板面と塗布ヘッドの間に形成し、基板と塗布ヘッドを相対移動させて、基板面に塗布液を塗布する方式を、出願人はさきに国際出願PCT/JP94/00845号(国際出願日:平成6年5月27日)において提案した。
【0004】
【発明が解決しようとする課題】
上述のナイフコート方式、ロールコート方式、ダイコート方式を用いて塗布を行う場合においても、また上述の国際出願に記載の方式を用いて塗布を行う場合においても、塗布終了時に基板の塗布終了端部に過剰の塗布液が残留し、この残留液のために、塗布膜厚の均一領域が縮小したり、部分的な乾燥不良が生じたりして、塗布膜の品質が阻害される原因となっている。
【0005】
そこで上記国際出願に開示した方法では、過剰塗布液を除去するために、過剰塗布液を真空吸引することによる除去や、吸収性ロールによる除去が行われる。しかしながら、真空吸引による過剰塗布液の除去は処理に時間がかかり、また、吸収性ロールによる除去は、特に有機溶剤系塗布液を用いる場合に、有機溶剤の種類によっては耐性を有するロール材質を選定するのが困難であったり、溶剤の揮発性が高く水系に比べて洗浄が困難であり、かつ機構的に複雑である。
【0006】
本発明は、上述の問題を解決するためになされたもので、その目的は、過剰塗布液の除去をきれいに短時間で行うことができる、基板面端部の過剰塗布液除去方法および装置を得ることにある。
【0007】
【課題を解決するための手段】
本願発明は、基板面への塗布液の塗布終了時に基板面端部寄りに残留する過剰塗布液を除去する、基板面端部の過剰塗布液除去方法であって、基板面への塗布液の塗布作業の前に、前記端部寄り基板部分のみを被覆薄板により覆い、塗布作業の終了後に、前記被覆薄板を取り外すことによって、被覆薄板上に残留した過剰塗布液を除去する方法であって、前記被覆薄板と連続する面をもった主体部を多孔質材により形成しておき、前記主体部を、前記端部寄り基板部分に隣接する基板端縁に近接させ、前記主体部の面および被覆薄板の面に残留する過剰塗布液を、前記多孔質材を経て吸引し、被覆薄板の基板からの取り外し時に前記主体部をも、その面に付着する過剰塗布液と共に取り外すことを特徴とする
【0010】
また、本願発明による方法は、前記薄板および主体部を、塗布終了後、次の塗布作業が開始されるまでの間に洗浄することを特徴とする。
【0011】
本願発明による基板面端部の過剰塗布液除去装置は、基板面への液塗布装置に支持される基板の過剰塗布液が残留する側の端面に液塗布時に近接させられる近接位置と、液塗布終了後に基板から離隔させられる離隔位置との間で移動可能に設けられた基板被覆部材を備え、この基板被覆部材は、その近接位置で前記端部の基板面を覆う被覆薄板を有し、液塗布時に前記被覆部材の面に付着する過剰塗布液が、被覆部材が離隔位置へ移動させられることにより除去され、前記基板被覆部材が、その近接位置で前記端部基板面に隣接する基板端縁に近接する主体部を有し、前記被覆薄板と主体部が同じ平面をもっており、
前記主体部が、前記被覆薄板と同じ面をなす部分に多孔質部をもち、この多孔質部が吸引手段に接続されていることを特徴とする。
【0015】
【作用】
本願発明の基板面端部の過剰塗布液除去方法では、基板面への塗布液の塗布作業の前に基板の端部寄り部分を被覆薄板により覆っておき、基板面へ塗布液を塗布する。これにより、被覆薄板の表面をも含めて基板面に塗布液膜が形成され、過剰塗布液が被覆薄板の表面に残留する。したがって、被覆薄板を取り外せば過剰塗布液も一緒に除去される。
【0016】
また、基板面へ塗布液の塗布により、被覆薄板に連続する面をもつ主体部の面にも過剰塗布液が付着するので、被覆薄板と主体部を基板から取り外すことにより過剰塗布液が除去される。
【0017】
また、主体部を多孔質材により構成することにより、多孔質材に吸引力を作用させて主体部面の過剰塗布液を除去することができる。
【0018】
また、塗布終了後、被覆薄板および主体部を次の被覆作業までに洗浄する。
【0019】
本願発明の基板面端部の過剰塗布液除去装置では、基板被覆部材を近接位置に置くことにより、基板端部の面が基板被覆部材により被覆される。この状態で液の塗布を行うと、塗布液は基板の面および基板被覆部材の面に付着し、特に基板被覆部材の面には過剰塗布液が残留する。したがって、基板被覆部材を取り外せば過剰塗布液は除去される。
【0020】
また、基板被覆部材に設けられている主体部の表面に塗布液、特に過剰塗布液が付着し、塗布後に主体部を含めて基板被覆部材を取り外すと過剰塗布液が除去される。
【0021】
また、被覆薄板と主体部が同じ平面をもっていることにより、これらの平面への過剰塗布液の付着が自然に行われる。
【0022】
また、多孔質部で吸引が行われることにより、多孔質部を経て基板被覆部材の表面に付着している過剰塗布液の除去が効果的になされる。
【0023】
【実施例】
以下、図面を参照して本発明の実施例を説明するが、その前にガラス基板への塗布液の塗布方法の一例を図1から図4を参照して説明する。
【0024】
本発明で塗布処理される枚葉基板Sは、典型的にはLCDカラーフィルター用大型ガラス基板であり、また、基板に塗布される液は、ガラス基板上に微細パターンを形成するための感光性樹脂である。ガラス基板は非可撓性であるが、本発明で処理される基板はこのようなガラス基板に限らずプラスチック、金属、紙等でもよく、また基板自体が可撓性をもっていてもよい。また、塗布される液は、水系、溶剤系等各種の液を用いることができ、顔料、染料、フィラー、増感剤、樹脂、添加剤等を単独または組合せて混合することができる。
【0025】
図1において、Sは基板である。図1は基板Sへの液塗布の開始時の状態を示している。
【0026】
図1のように、基板ホルダ8の下面の吸着面に、水平に対し角度θをなして基板Sが吸着保持されている。そして、基板Sの最も高い端縁S1の近傍下面の直下に、塗布ヘッドHの直線状スリット13が一定のクリアランスをおいて位置するように、ホルダ8の位置を定めておく。
【0027】
感光性樹脂のような塗布液Rは、塗布液タンク15内に貯えられていて、ポンプ16等の送液手段によって塗布ヘッドH内へ送られて、スリット13から上方へ送り出され、塗布液ビードBが形成される。塗布液ビードBは、基板Sの下面(主面)と塗布ヘッドHとのクリアランスに塗布液Rの液溜まりとして形成され、この液ビードBは基板Sの下面に付着する。基板下面と塗布ヘッドHの間の最小クリアランスは、塗布液Rの粘度、表面張力等の物性により、塗布液Rがクリアランスからこぼれ出さずに塗布液ビードBが形成されるように設定される。塗布液ビードBが図1のように形成された時に、基板Sの低い側に面するメニスカスLと、基板の高い側に面するメニスカスLが形成されるが、前記傾斜角度θのために、メニスカスL、Lの高さ寸法h、hは、h<hとなる。
【0028】
次に、図2の塗布開始状態から基板Sの下面である主面に塗布を行うには次のようにする。
【0029】
前記クリアランスを一定に維持したまま、図示しないガイドレールに沿って図2の位置からホルダ8を右斜め上方へ移動させると、図3の状態から、図4に示すように基板Sが一定の傾斜角度θで塗布ヘッドHに対し斜め右上方へ移動する。これと平行して、塗布液ポンプ16で塗布液Rを塗布ヘッドHに送り続けてビードBを形成し続けると、塗布液Rは基板Sの下面の主面に順次付着して塗布層Raが形成される。この塗布工程中、塗布液Rは、順次塗布された量だけ補うようにポンプ16によって塗布液ビードBに供給され、ビードの形状を一定に保つようにする。そして、図4に示すように、塗布ヘッドHが基板Sの最も低い端縁S2に近い塗布範囲最終端に到達した時点で、基板Sの移動を停止し、次いで、クリアランス内に残留している塗布液ビードBを除去したのち、必要により塗布ヘッドHを基板Sに支障のない場所まで離脱させる。
【0030】
その後、基板Sを水平に、上向きあるいは下向きにして乾燥ユニット内でホットプレートあるいは熱風、遠赤外線ヒーター等の乾燥手段を用いて塗布膜Raを乾燥させて均一な塗布膜を形成する。
【0031】
以上のようにして行う基板への液塗布の方法は、基本的に、出願人の国際出願PCT/JP94/00845号に記載されている。
【0032】
前述のようにして基板Sの面に塗布液の膜Raを形成した場合、図4に示すように、基板Sの低い側の端縁S2の近傍に過剰塗布液Rbが残留する。このような過剰塗布液Rbの溜りは、図1から図4に示す方法以外の方法を用いて塗布液膜Raを形成した場合にも発生する。たとえば、ロールコーター、エクストリュジョンコーター等により基板面に塗布液膜を形成した場合にも同様に発生する。本発明は、このような残留過剰塗布液を確実に除去しようとするものである。
【0033】
図5は残留過剰塗布液を除去する本発明の装置の一実施例を示す。同図において、1は、図1から図4に示したと同じ作動原理をもつ塗布液塗布装置であり、図1に示した傾斜角θは零または零に近い場合を示している。基板ホルダ8は軸2により枢支されていて傾斜角θを調節可能に、かつ上下反転可能に設けられている。ホルダ8の下面には基板Sが保持されており、基板Sの下面には既に塗布液の膜Raが形成されている。
【0034】
ホルダ8の下方には塗布ヘッドHが設けられている。塗布ヘッドHは図1に示した場合とまったく同じ原理で塗布液を上方へ送り出す直線状スリット13をもっている。図1の場合には、塗布ヘッドHに対して基板Sが移動するように構成されているが、図5の例では、ホルダ8に支持された基板Sは移動せず、塗布ヘッドHが左右に移動するようになっている。本発明では、基板Sおよび塗布ヘッドHのいずれか一方が他方に対して移動すればよいのであって、どちらを移動させるかは任意である。
【0035】
塗布ヘッドHはテーブル3上に支持されており、このテーブル3は、第1の移動手段、すなわち、上下方向の移動機構4を介して左右方向の移動台5上に支持されている。移動台5のナット部6は、基台11上に回転可能に支持された送りねじ7に螺合している。送りねじ7はサーボモータMにより回転駆動されるようになっている。よって、サーボモータMの作動により移動台5は左右方向に移動する。送りねじ7、ナット部6およびサーボモータMは、第2の移動手段、すなわち、水平方向の移動機構を構成する。
【0036】
塗布ヘッドHは、基板Sの面への塗布幅に相当する長さをもったブロック状部材で、その上面には、図1に示す塗布液タンク15からポンプ16により送られてくる塗布液Rの送り出し用スリット13が塗布ヘッドHの長手方向に形成されている。このスリット13の底部は適当な接続手段により前記ポンプ16に接続されている。
【0037】
図5において、20は本発明の特徴をなす基板被覆部材で、この基板被覆部材20は、基台19上に設けたエアシリンダのような移動機構21のピストンロッド22の先端に回転駆動可能に支持されていて、これから述べるような運動を行うようになっている。すなわち、移動機構21が図において右方へ伸長するように作動すると、基板被覆部材20も右方に移動して、ホルダ8により保持されている基板Sの端縁に近接する位置に達する。ここで、基板被覆部材20は適当な回転駆動機構により反時計方向に回動させられて、基板Sに対して図6に示すような近接位置をとる。基板被覆部材20は、被覆薄板20aとそれと一体をなす主体部20bとから構成されている。被覆薄板20aおよび主体部20bは基板Sの被覆幅全体に亘る長さをもち、それらの下面は同じ平面を構成している。主体部20bはブロック状部材で、被覆薄板20aに隣接する面24は被覆薄板20aの面にほぼ垂直をなす当接面となっている。基板被覆部材20が図6に示す近接位置にある場合には、被覆薄板20aは基板Sの端部の面に面接触状態で接し、また当接面24は基板Sの端縁に面接触するようになる。一方、前記移動機構21が収縮方向に作動すると、基板被覆部材20は基板Sから離れた図5の離隔位置を取る。
【0038】
図5に示すように基板Sの表面に塗布ヘッドHによって塗布液膜Raを形成する前に、ホルダ8に保持されている基板Sの端部に図6に示す状態で被覆部材20が当接させられ、この状態で塗布ヘッドHによる塗布作業が行われる。基板Sの面に対する液の塗布は、図5において塗布ヘッドHが基板Sの右端の下方にある位置で開始される。塗布ヘッドHのスリット13から送り出される塗布液Rが基板Sの下面との間にビードB(図1に示すような)を形成するように塗布ヘッドHを上昇させた状態で、塗布ヘッドHは送りねじ7により図5において左方へ移動させられ、これによって、図1から図4に示したと同じようにして塗布液層Raが形成される。図5の右方に仮想線で示す塗布ヘッドHの位置は、塗布途中の位置を示す。塗布が進行して塗布ヘッドHが図5に示す実線位置を過ぎると塗布が終了する。この塗布終了位置は、図示しない位置検出器により検出されて検出信号が出され、この検出信号が図示しない制御装置に入力され、制御装置からの信号により塗布ヘッドHの上下方向移動機構4が下方に作動し塗布ヘッドHを下降させる。
【0039】
塗布液膜Raは図6に示すように形成され、かつ既に述べたように端部に過剰塗布液Rbが残留する。ところが、被覆部材20があるために、過剰塗布液Rbは被覆薄板20aから主体部20bにかけて、特に主体部20bの領域に付着する。次に、被覆部材20は基板Sから離して離隔位置へ戻す。これにより、基板Sは図7に示すように過剰塗布液Rbを除去された状態になり、塗布液膜Raの端部に僅かに盛り上がった塗布液部分のみが残るようになる。被覆薄板20aがあることによって、基板Sの端縁への塗布液の回り込みが回避される。主体部20bは、その当接面24が基板Sの端縁に当たることによって被覆薄板20aの正しい位置決めを確実にする。
【0040】
図8は他の実施例を示す。この実施例が図6の実施例と主として異なる点は、主体部20bが多孔質材により形成されていることである。ただし、この実施例では、被覆薄板20aに続いて隔壁26が多孔質材の側面に形成され、かつ多孔質材主体部20bの背後に同様に隔壁27が設けられている。多孔質材主体部20bの、隔壁26と反対の側は真空ポンプのような吸引手段(図示しない)に矢印Vで示すように接続されている。多孔質材としては、ポリエチレン、ポリプロピレン、ポリスチレン、ポリメチルメタアクリレート、アクリロニトリル系共重合体、エチレン酢酸ビニル共重合体、テフロン(デュポン社の商標)のようなフッ素系樹脂、セラミックス(Al系、ZrO、CaO系)が挙げられる。また、多孔質材の気孔率は、セラミックについては50〜85%、その他については30〜45%程度である。
【0041】
この実施例の作用は図6に示した実施例の作用と実質的に同じである。ただし、この実施例では、塗布終了時に図8に示すように残留する過剰塗布液Rbは、多孔質材主体部20bに作用する真空吸引力により主体部20b内に吸引された後、吸引手段に吸引されてしまう。したがって、被覆部材20を基板Sから離すときにそれに付着している過剰塗布液Rbが垂れるなどの問題が解消する。以上のようにして被覆部材20によって過剰塗布液Rbを除去した後の基板Sの状態は図9に示す通りである。なお、隔壁26、27は吸引作用を一層確実なものとする。
【0042】
図10から図13は、図8について原理的に説明した実施例のより具体的な構成を示したものである。図8に付したと同じ符号により同じまたは均等な部材を示し、異なる部材のみについて説明すると、この具体的実施例では多孔質材主体部20bを、その吸引用の面29を除いて吸引ケーシング30により覆い、この吸引ケーシング30に真空ポンプ等の吸引手段に連なる配管31を接続している。前記隔壁27は吸引ケーシング30内で仕切壁を構成しており、これにより多孔質材主体部20bに有効に吸引力が作用するようになっている。図10は基板Sへの塗布中の状態を示しており、図11は液の塗布終了時に形成された過剰塗布液Rbを多孔質材主体部20bを介して吸引ケーシング30内に吸引している状態を示している。図12の状態では、吸引が終わろうとしており、多孔質材主体部20bを内部に含む吸引ケーシング30が基板Sから離れて隔離位置へ向かっている。図12から分かるように、この構成を採用することにより、多孔質材主体部20bの表面に付着する過剰塗布液の大部分は吸引力により消失し、それが垂れるようなことはない。図13に示すように、吸引ケーシング30は基板Sの幅方向に長い形状を有しており、複数の配管31を備えている。
【0043】
以上に述べた実施例では、基板への液の塗布はビードを用いて基板の下面に対して行われている。しかし、本発明の原理が基板の上面に液を塗布する場合にも用いうることは明らかである。また、ビードを用いない他の液塗布にも本発明の原理を使用することができる。
【0044】
図14は本発明の原理をエクストリュージョンコーターに用いた例を示す。塗布ヘッドHはこの例では、基板Sの上面との間に一定のクリアランスをおいて右方から左方に送られ、塗布ヘッドHからは下方に向かって塗布液が押し出される。塗布膜厚は塗布速度と液吐出圧によって定まる。この例では、多孔質材主体部20bの吸引面は上方を向き、被覆薄板20aは基板Sの上面に添うように載置される。そして、過剰塗布液Rbは被覆部材20の上面に残留する。
【0045】
なお、以上述べた実施例では、被覆薄板20aおよび主体部20bは、基板Sの主面および端縁に面接触状態で当接するようにしているが、被覆薄板20aはその先端縁が基板主面に接していればよく、また主体部20bは基板端縁に近接していればよい。
【0046】
図15は、本発明の原理を使用して塗布液膜を形成した場合(黒丸で示す)と、本発明の原理を使用しなかった場合(黒四角で示す)とを比較して示すグラフである。このグラフから明らかなように、本発明の原理を使用した場合には、塗布液膜厚は、本発明の原理を使用しなかった場合に比し、明らかに均一性が高くなっている。
【0047】
【発明の効果】
以上に述べたように、請求項1による過剰塗布液除去方法では、基板の端縁近傍を被覆薄板により覆っておいて被覆薄板の部分をも含めて液の塗布を行うので、塗布終了後に被覆薄板を基板から離すことによって、主として被覆薄板上に残留する過剰塗布液を除去することができる。
【0048】
請求項2による過剰塗布液除去方法では、被覆薄板の他に主体部を設けて、その主体部を基板の端縁に近接させるので、被覆薄板の基板に対する位置決めを行い易く、しかも基板端縁への塗布液の回り込みを防ぐことができる。
【0049】
請求項3による過剰塗布液除去方法によれば、主体部を多孔質材により形成することによって、主体部の表面に付着する過剰塗布液を多孔質材を経て真空吸引により除去することができ、過剰塗布液の除去が一層確実になる。
【0050】
請求項4による過剰塗布液除去方法によれば、次の塗布工程までの時間を利用して被覆薄板および主体部を洗浄して、次の過剰塗布液除去工程を確実に実施することができる。
【0051】
請求項5による過剰塗布液除去装置では、基板の端縁近傍を基板被覆部材により覆っておいて基板被覆部材の部分をも含めて液の塗布を行うので、塗布終了後に基板被覆部材を基板から離すことによって、主として基板被覆部材上に残留する過剰塗布液を除去することができる。
【0052】
請求項6による過剰塗布液除去装置では、基板被覆部材に主体部を設けて、その主体部を基板端縁に近接させるようにしているので、被覆薄板の基板に対する位置決めを容易に行うことができ、しかも基板端縁への塗布液の回り込みを防ぐことができる。
【0053】
請求項7による過剰塗布液除去装置によれば、基板被覆部材の被覆薄板と主体部が同じ面をもつようにしてあるので、塗布時の過剰塗布液がその面に付着し易いという利点がある。
【0054】
請求項8による過剰塗布液除去装置によれば、主体部を多孔質材により形成してあることによって、その表面に付着する過剰塗布液を多孔質材を経て真空吸引により除去することができ、過剰塗布液の除去を確実に行うことができる。
【図面の簡単な説明】
【図1】基板への塗布液の塗布の一例を示す原理図。
【図2】基板への液塗布開始時の状態を示す図。
【図3】同じく、塗布途中の状態を示す図。
【図4】同じく、塗布完了時の状態を示す図。
【図5】本発明による過剰塗布液除去装置の一実施例の正面図。
【図6】図5に示す過剰塗布液除去装置において、基板の端部に基板被覆部材を当接させて液塗布を終了した状態を示す拡大図。
【図7】図6に示す状態から基板被覆部材を離して過剰塗布液を除去した基板を示す図。
【図8】図6に示す例とは異なる実施例を示す図。
【図9】図8に示す状態から基板被覆部材を離して過剰塗布液を除去した基板を示す図。
【図10】図8に示す実施例をさらに具体化した実施例を示す図。
【図11】図10の実施例における液塗布工程の進んだ状態を示す図。
【図12】図10の実施例における液塗布工程のさらに進んだ状態を示す図。
【図13】図10、11、12に示す吸引ケーシングの側面図。
【図14】本発明の原理を適用した他の実施例を示す図。
【図15】本発明の原理を使用して液塗布を行った場合と、本発明の原理を使用しないで液塗布を行った場合とを比較して示す塗布膜厚分布グラフ。
【符号の説明】
S 基板
S2 基板端縁
R 塗布液
Ra 塗布液膜
Rb 過剰塗布液
H 塗布ヘッド
B ビード
8 基板ホルダ
13 塗布液供給スリット
20 基板被覆部材
20a 被覆薄板
20b 主体部
24 当接面
26 隔壁
27 隔壁
29 吸引面
30 吸引ケーシング
31 吸引用配管
[0001]
[Industrial applications]
The present invention relates to a method for removing an excess coating solution on an edge of a substrate surface after the application of the coating solution to a single substrate such as a large glass substrate represented by a color filter for an LCD, and an apparatus used for the method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a spin coating method is known as a method of coating a coating liquid on a single-wafer substrate such as a large glass substrate represented by a color filter for LCD.
[0003]
This method has the drawback that the coating efficiency is as low as about 10%, and the coating film thickness becomes too large at the corners of the substrate. There are knife coating, roll coating, and die coating methods that can solve this disadvantage and efficiently apply the coating liquid to a single-wafer substrate. To obtain a uniform film thickness using these methods, In addition, there is a problem that the smoothness of the substrate surface must be lower than the coating accuracy. As a solution application method that can also solve this problem, the applicant applied a method in which a coating solution bead is formed between the substrate surface and the application head, and the substrate and the application head are relatively moved to apply the application solution to the substrate surface. It was proposed earlier in International Application No. PCT / JP94 / 00845 (international application date: May 27, 1994).
[0004]
[Problems to be solved by the invention]
Even when the coating is performed using the above-described knife coating method, roll coating method, or die coating method, or when performing the coating using the method described in the international application described above, the coating end edge of the substrate at the end of the coating. An excess coating solution remains in the coating, and the remaining solution causes a reduction in the uniform area of the coating film thickness and a partial drying failure, which causes the quality of the coating film to be impaired. I have.
[0005]
Therefore, in the method disclosed in the above-mentioned international application, in order to remove the excess coating solution, the excess coating solution is removed by vacuum suction or by an absorbent roll. However, removal of the excess coating solution by vacuum suction takes a long time to process, and removal by an absorbent roll selects a roll material that has resistance depending on the type of organic solvent, especially when using an organic solvent-based coating solution. It is difficult to clean, and the solvent has high volatility, so that it is difficult to wash as compared with an aqueous system, and is mechanically complicated.
[0006]
The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a method and an apparatus for removing an excess coating solution at an edge of a substrate surface, which can remove the excess coating solution neatly in a short time. It is in.
[0007]
[Means for Solving the Problems]
The present invention is a method for removing excess coating liquid at the edge of a substrate surface, which removes excess coating liquid remaining near the edge of the substrate surface when coating of the coating liquid on the substrate surface is completed. Prior to the coating operation, only the substrate portion near the end is covered with a coating thin plate, and after the coating operation is completed, by removing the coating thin plate, a method of removing excess coating liquid remaining on the coating thin plate , A main portion having a surface continuous with the coated thin plate is formed of a porous material, and the main portion is brought close to a substrate edge adjacent to the substrate portion near the end portion, and the surface of the main portion and the coating are formed. The excess coating solution remaining on the surface of the thin plate is sucked through the porous material, and the main body is removed together with the excess coating solution attached to the surface when the coated thin plate is removed from the substrate .
[0010]
Further, the method according to the present invention is characterized in that the thin plate and the main portion are washed after the coating is completed and before the next coating operation is started.
[0011]
The apparatus for removing excess coating liquid at the edge of a substrate surface according to the present invention includes a proximity position that is brought close to an end surface of a substrate supported by the liquid coating apparatus on the side where excess coating liquid remains on the substrate when liquid is applied; A substrate covering member movably provided between a separation position separated from the substrate after completion, the substrate covering member having a covering thin plate covering the substrate surface at the end portion at a position close to the substrate covering member; Excessive application liquid adhering to the surface of the covering member at the time of application is removed by moving the covering member to the separated position, and the substrate covering member is moved to a position near the end substrate surface adjacent to the end substrate surface. Has a main body part close to, the coated thin plate and the main body part have the same plane,
The main body portion has a porous portion at a portion on the same surface as the covering thin plate, and the porous portion is connected to suction means .
[0015]
[Action]
In the method of removing excess coating liquid at the edge of the substrate surface according to the present invention, a portion near the edge of the substrate is covered with a coating thin plate before applying the coating liquid to the substrate surface, and the coating liquid is applied to the substrate surface. As a result, a coating liquid film is formed on the substrate surface including the surface of the coated thin plate, and the excess coating liquid remains on the surface of the coated thin plate. Therefore, when the coated thin plate is removed, the excess coating solution is also removed.
[0016]
Also, by applying the coating liquid to the substrate surface, the excess coating liquid also adheres to the surface of the main part having a surface continuous with the coated thin plate, so the excess coating liquid is removed by removing the coated thin plate and the main part from the substrate. You.
[0017]
In addition, since the main body is made of a porous material, an excess force can be removed from the main body surface by applying a suction force to the porous material.
[0018]
After the application, the coated thin plate and the main body are washed by the next coating operation.
[0019]
In the apparatus for removing excess coating liquid at the end of the substrate surface according to the present invention, the surface of the end of the substrate is covered with the substrate covering member by placing the substrate covering member at a close position. When the liquid is applied in this state, the coating liquid adheres to the surface of the substrate and the surface of the substrate covering member, and the excess coating liquid remains particularly on the surface of the substrate covering member. Therefore, the excess coating liquid is removed by removing the substrate covering member.
[0020]
Further , the coating liquid, particularly the excess coating liquid, adheres to the surface of the main portion provided on the substrate coating member . When the substrate coating member including the main portion is removed after the application, the excessive coating liquid is removed.
[0021]
In addition, since the coating thin plate and the main body have the same plane, the excessive coating solution is naturally attached to these planes.
[0022]
In addition, by performing suction in the porous portion, the excess coating solution adhering to the surface of the substrate covering member via the porous portion is effectively removed.
[0023]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Before that, an example of a method of applying a coating liquid to a glass substrate will be described with reference to FIGS. 1 to 4.
[0024]
The single-wafer substrate S applied by the present invention is typically a large-sized glass substrate for an LCD color filter, and a liquid applied to the substrate is a photosensitive liquid for forming a fine pattern on the glass substrate. Resin. Although the glass substrate is inflexible, the substrate processed in the present invention is not limited to such a glass substrate, but may be plastic, metal, paper, or the like, or the substrate itself may have flexibility. As the liquid to be applied, various liquids such as water-based and solvent-based liquids can be used, and pigments, dyes, fillers, sensitizers, resins, additives, and the like can be used alone or in combination.
[0025]
In FIG. 1, S is a substrate. FIG. 1 shows a state at the start of liquid application to the substrate S.
[0026]
As shown in FIG. 1, the substrate S is suction-held on the suction surface on the lower surface of the substrate holder 8 at an angle θ with respect to the horizontal. Then, the position of the holder 8 is determined so that the linear slit 13 of the coating head H is located with a certain clearance immediately below the lower surface near the highest edge S1 of the substrate S.
[0027]
The coating liquid R such as a photosensitive resin is stored in a coating liquid tank 15, is sent into the coating head H by a liquid sending means such as a pump 16, is sent upward from the slit 13, and is coated with a coating liquid bead. B is formed. The coating liquid bead B is formed as a liquid pool of the coating liquid R in a clearance between the lower surface (main surface) of the substrate S and the coating head H, and the liquid bead B adheres to the lower surface of the substrate S. The minimum clearance between the lower surface of the substrate and the coating head H is set so that the coating liquid R does not spill out of the clearance and the coating liquid bead B is formed due to physical properties such as the viscosity and the surface tension of the coating liquid R. When the coating liquid bead B is formed as shown in FIG. 1, the meniscus L 1 that faces the lower substrate S side, while the meniscus L 2 facing the high substrate side is formed, for the inclination angle θ In addition, the heights h 1 and h 2 of the meniscuses L 1 and L 2 satisfy h 1 <h 2 .
[0028]
Next, the application to the main surface, which is the lower surface of the substrate S, from the application start state in FIG.
[0029]
When the holder 8 is moved obliquely upward and rightward from the position shown in FIG. 2 along a guide rail (not shown) while maintaining the clearance constant, the substrate S is tilted from the state shown in FIG. It moves obliquely upward and to the right with respect to the coating head H at an angle θ. In parallel with this, when the coating liquid R is continuously fed to the coating head H by the coating liquid pump 16 to continuously form the beads B, the coating liquid R is sequentially attached to the main surface of the lower surface of the substrate S, and the coating layer Ra is formed. It is formed. During this coating process, the coating liquid R is supplied to the coating liquid bead B by the pump 16 so as to supplement the applied amount in order, so that the shape of the bead is kept constant. Then, as shown in FIG. 4, when the coating head H reaches the final end of the coating range near the lowest edge S2 of the substrate S, the movement of the substrate S is stopped, and then the coating head H remains in the clearance. After removing the coating liquid bead B, the coating head H is separated to a place where the substrate S is not hindered, if necessary.
[0030]
Thereafter, the coating film Ra is dried using a drying means such as a hot plate, hot air, or a far-infrared heater in a drying unit with the substrate S horizontally or upward or downward to form a uniform coating film.
[0031]
The method of applying the liquid to the substrate as described above is basically described in the applicant's international application PCT / JP94 / 00845.
[0032]
When the coating liquid film Ra is formed on the surface of the substrate S as described above, the excess coating liquid Rb remains near the lower edge S2 of the substrate S as shown in FIG. Such accumulation of the excess coating liquid Rb also occurs when the coating liquid film Ra is formed using a method other than the methods shown in FIGS. For example, the same problem occurs when a coating liquid film is formed on a substrate surface by a roll coater, an extrusion coater, or the like. The present invention is intended to reliably remove such residual excess coating solution.
[0033]
FIG. 5 shows an embodiment of the apparatus of the present invention for removing the residual excess coating solution. In the figure, reference numeral 1 denotes a coating liquid application device having the same operation principle as shown in FIGS. 1 to 4, and shows a case where the inclination angle θ shown in FIG. 1 is zero or nearly zero. The substrate holder 8 is pivotally supported by the shaft 2 so that the tilt angle θ can be adjusted and the substrate holder 8 can be turned upside down. The substrate S is held on the lower surface of the holder 8, and the film Ra of the coating liquid is already formed on the lower surface of the substrate S.
[0034]
A coating head H is provided below the holder 8. The coating head H has a linear slit 13 for sending the coating liquid upward in exactly the same principle as that shown in FIG. In the case of FIG. 1, the substrate S is configured to move with respect to the coating head H. However, in the example of FIG. 5, the substrate S supported by the holder 8 does not move, and the coating head H moves left and right. To move to. In the present invention, one of the substrate S and the coating head H only needs to move with respect to the other, and which one to move is arbitrary.
[0035]
The coating head H is supported on a table 3, and the table 3 is supported on a horizontal moving table 5 via a first moving means, that is, a vertical moving mechanism 4. The nut 6 of the moving table 5 is screwed to a feed screw 7 rotatably supported on a base 11. The feed screw 7 is driven to rotate by a servo motor M. Therefore, the movable base 5 moves in the left-right direction by the operation of the servo motor M. The feed screw 7, the nut 6, and the servomotor M constitute a second moving means, that is, a horizontal moving mechanism.
[0036]
The coating head H is a block-shaped member having a length corresponding to the coating width on the surface of the substrate S. On the upper surface thereof, a coating liquid R sent from a coating liquid tank 15 shown in FIG. Are formed in the longitudinal direction of the coating head H. The bottom of the slit 13 is connected to the pump 16 by a suitable connecting means.
[0037]
In FIG. 5, reference numeral 20 denotes a substrate covering member which is a feature of the present invention. The substrate covering member 20 is rotatably driven by the tip of a piston rod 22 of a moving mechanism 21 such as an air cylinder provided on a base 19. It is supported and will perform the exercises described below. That is, when the moving mechanism 21 operates to extend rightward in the drawing, the substrate covering member 20 also moves rightward and reaches a position close to the edge of the substrate S held by the holder 8. Here, the substrate covering member 20 is rotated counterclockwise by an appropriate rotation driving mechanism to take a close position to the substrate S as shown in FIG. The substrate covering member 20 is composed of a covering thin plate 20a and a main body 20b integral therewith. The covering thin plate 20a and the main portion 20b have a length that covers the entire covering width of the substrate S, and their lower surfaces constitute the same plane. The main body portion 20b is a block-shaped member, and the surface 24 adjacent to the coating thin plate 20a is a contact surface that is substantially perpendicular to the surface of the coating thin plate 20a. When the substrate covering member 20 is in the proximity position shown in FIG. 6, the covering thin plate 20a comes into surface contact with the end surface of the substrate S, and the contact surface 24 comes into surface contact with the edge of the substrate S. Become like On the other hand, when the moving mechanism 21 operates in the contracting direction, the substrate covering member 20 takes the separated position shown in FIG.
[0038]
Before the coating liquid film Ra is formed on the surface of the substrate S by the coating head H as shown in FIG. 5, the covering member 20 abuts on the end of the substrate S held by the holder 8 in the state shown in FIG. In this state, the coating operation by the coating head H is performed. The application of the liquid to the surface of the substrate S is started at a position where the application head H is below the right end of the substrate S in FIG. With the coating head H raised so that the coating liquid R sent out from the slit 13 of the coating head H forms a bead B (as shown in FIG. 1) with the lower surface of the substrate S, the coating head H 5 is moved to the left in FIG. 5 by the feed screw 7, whereby the coating liquid layer Ra is formed in the same manner as shown in FIGS. The position of the coating head H indicated by a virtual line on the right side of FIG. 5 indicates a position in the middle of coating. When the application proceeds and the application head H passes the position indicated by the solid line in FIG. 5, the application is completed. The application end position is detected by a position detector (not shown) and a detection signal is output. The detection signal is input to a control device (not shown), and the vertical movement mechanism 4 of the coating head H is moved downward by a signal from the control device. To lower the coating head H.
[0039]
The coating liquid film Ra is formed as shown in FIG. 6, and the excess coating liquid Rb remains at the end as described above. However, due to the presence of the covering member 20, the excess coating solution Rb adheres from the covering thin plate 20a to the main portion 20b, and particularly adheres to the region of the main portion 20b. Next, the covering member 20 is separated from the substrate S and returned to the separated position. As a result, the substrate S is in a state where the excess coating solution Rb has been removed as shown in FIG. 7, and only the coating solution portion slightly raised at the end of the coating solution film Ra remains. The presence of the coating thin plate 20a prevents the coating liquid from flowing around the edge of the substrate S. The main body portion 20b ensures correct positioning of the covering thin plate 20a by the contact surface 24 abutting against the edge of the substrate S.
[0040]
FIG. 8 shows another embodiment. This embodiment differs from the embodiment of FIG. 6 mainly in that the main portion 20b is formed of a porous material. However, in this embodiment, the partition wall 26 is formed on the side surface of the porous material following the covering thin plate 20a, and the partition wall 27 is similarly provided behind the porous material main portion 20b. The side of the porous material main portion 20b opposite to the partition 26 is connected to a suction means (not shown) such as a vacuum pump as shown by an arrow V. As the porous material, polyethylene, polypropylene, polystyrene, polymethyl methacrylate, acrylonitrile copolymer, ethylene-vinyl acetate copolymer, fluorine resin such as Teflon (DuPont trademark), ceramic (Al 2 0 3 System, ZrO 2 , CaO system). The porosity of the porous material is about 50 to 85% for ceramics, and about 30 to 45% for others.
[0041]
The operation of this embodiment is substantially the same as the operation of the embodiment shown in FIG. However, in this embodiment, as shown in FIG. 8, the residual excess coating liquid Rb at the end of the coating is sucked into the main body 20b by the vacuum suction force acting on the porous main body 20b, and then is applied to the suction means. It will be sucked. Therefore, when the covering member 20 is separated from the substrate S, the problem that the excess coating liquid Rb attached to the covering member 20 drips is solved. The state of the substrate S after the excess coating liquid Rb is removed by the covering member 20 as described above is as shown in FIG. In addition, the partition walls 26 and 27 make the suction action more reliable.
[0042]
FIGS. 10 to 13 show a more specific configuration of the embodiment explained in principle with reference to FIG. 8, the same or equivalent members are indicated by the same reference numerals as those in FIG. 8, and only the different members will be described. In this specific embodiment, the porous material main portion 20b is replaced by a suction casing 30 except for a suction surface 29 thereof. And a pipe 31 connected to a suction means such as a vacuum pump is connected to the suction casing 30. The partition wall 27 constitutes a partition wall in the suction casing 30, so that a suction force effectively acts on the porous material main portion 20b. FIG. 10 shows a state during the application to the substrate S, and FIG. 11 sucks the excess application liquid Rb formed at the end of the application of the liquid into the suction casing 30 via the porous material main portion 20b. The state is shown. In the state of FIG. 12, the suction is about to end, and the suction casing 30 including the porous material main portion 20b therein is separated from the substrate S and headed to the isolated position. As can be seen from FIG. 12, by employing this configuration, most of the excess coating liquid adhering to the surface of the porous material main portion 20b disappears due to the suction force, and does not drop. As shown in FIG. 13, the suction casing 30 has a long shape in the width direction of the substrate S, and includes a plurality of pipes 31.
[0043]
In the embodiment described above, the application of the liquid to the substrate is performed on the lower surface of the substrate by using a bead. However, it is clear that the principle of the present invention can also be used for applying a liquid to the upper surface of a substrate. Also, the principles of the present invention can be used for other liquid applications that do not use beads.
[0044]
FIG. 14 shows an example in which the principle of the present invention is applied to an extrusion coater. In this example, the coating head H is sent from the right to the left with a certain clearance between the coating head H and the upper surface of the substrate S, and the coating liquid is extruded downward from the coating head H. The coating film thickness is determined by the coating speed and the liquid discharge pressure. In this example, the suction surface of the porous material main portion 20b faces upward, and the coated thin plate 20a is placed along the upper surface of the substrate S. Then, the excess coating liquid Rb remains on the upper surface of the covering member 20.
[0045]
In the above-described embodiment, the covering thin plate 20a and the main body 20b are configured to abut on the main surface and the edge of the substrate S in a surface contact state. And the main body portion 20b only needs to be close to the substrate edge.
[0046]
FIG. 15 is a graph showing a comparison between a case where a coating liquid film is formed using the principle of the present invention (shown by a black circle) and a case where the principle of the present invention is not used (shown by a black square). is there. As is apparent from this graph, when the principle of the present invention is used, the coating liquid film thickness is clearly higher than when the principle of the present invention is not used.
[0047]
【The invention's effect】
As described above, in the method for removing excess coating liquid according to the first aspect, since the vicinity of the edge of the substrate is covered with the coating thin plate and the liquid is applied including the portion of the coating thin plate, the coating is performed after the coating is completed. By separating the thin plate from the substrate, it is possible to remove excess coating liquid mainly remaining on the coated thin plate.
[0048]
In the method for removing excess coating liquid according to the second aspect, the main body is provided in addition to the coated thin plate, and the main body is brought close to the edge of the substrate. Of the coating liquid can be prevented.
[0049]
According to the excess coating liquid removing method according to the third aspect, by forming the main part with a porous material, the excess coating liquid adhering to the surface of the main part can be removed by vacuum suction through the porous material, The removal of the excess coating solution is further ensured.
[0050]
According to the method for removing excess coating liquid according to the fourth aspect, the coating thin plate and the main body can be washed using the time until the next coating step, and the next excess coating liquid removing step can be reliably performed.
[0051]
In the excess coating liquid removing apparatus according to the fifth aspect, since the vicinity of the edge of the substrate is covered with the substrate coating member and the liquid is applied including the portion of the substrate coating member, the substrate coating member is removed from the substrate after the application is completed. By separating, the excess coating liquid mainly remaining on the substrate covering member can be removed.
[0052]
In the apparatus for removing excess coating liquid according to the sixth aspect, the main body is provided on the substrate covering member and the main body is brought close to the edge of the substrate. Moreover, it is possible to prevent the coating liquid from flowing around the edge of the substrate.
[0053]
According to the apparatus for removing excess coating liquid according to the seventh aspect, the coating thin plate of the substrate coating member and the main body have the same surface, so that there is an advantage that the excess coating liquid during coating easily adheres to the surface. .
[0054]
According to the excess coating liquid removing device according to claim 8, since the main portion is formed of the porous material, the excess coating liquid adhering to the surface thereof can be removed by vacuum suction through the porous material, Excessive application liquid can be reliably removed.
[Brief description of the drawings]
FIG. 1 is a principle view showing an example of application of a coating solution to a substrate.
FIG. 2 is a diagram showing a state at the start of liquid application to a substrate.
FIG. 3 is a diagram showing a state during application.
FIG. 4 is a diagram showing a state at the time of completion of application.
FIG. 5 is a front view of an embodiment of the excess coating liquid removing apparatus according to the present invention.
6 is an enlarged view showing a state in which the substrate coating member is brought into contact with an end of the substrate and the liquid application is completed in the excess application liquid removing apparatus shown in FIG. 5;
FIG. 7 is a view showing the substrate from which the excess coating liquid has been removed by separating the substrate covering member from the state shown in FIG. 6;
FIG. 8 is a view showing an embodiment different from the example shown in FIG. 6;
FIG. 9 is a view showing a substrate from which the excess coating liquid has been removed by separating the substrate covering member from the state shown in FIG. 8;
FIG. 10 is a diagram showing an embodiment that further embodies the embodiment shown in FIG. 8;
FIG. 11 is a view showing a state in which a liquid application step in the embodiment of FIG. 10 has advanced.
FIG. 12 is a diagram showing a further advanced state of the liquid applying step in the embodiment of FIG. 10;
FIG. 13 is a side view of the suction casing shown in FIGS.
FIG. 14 is a diagram showing another embodiment to which the principle of the present invention is applied.
FIG. 15 is a coating film thickness distribution graph showing a comparison between a case where liquid coating is performed using the principle of the present invention and a case where liquid coating is performed without using the principle of the present invention.
[Explanation of symbols]
S substrate S2 substrate edge R coating liquid Ra coating liquid film Rb excess coating liquid H coating head B bead 8 substrate holder 13 coating liquid supply slit 20 substrate coating member 20a coating thin plate 20b main body 24 contact surface 26 partition wall 27 partition wall 29 suction Surface 30 Suction casing 31 Suction pipe

Claims (3)

基板面への塗布液の塗布終了時に基板面端部寄りに残留する過剰塗布液を除去する、基板面端部の過剰塗布液除去方法であって、基板面への塗布液の塗布作業の前に、前記端部寄り基板部分のみを被覆薄板により覆い、塗布作業の終了後に、前記被覆薄板を取り外すことによって、被覆薄板上に残留した過剰塗布液を除去する方法であって、
前記被覆薄板と連続する面をもった主体部を多孔質材により形成しておき、前記主体部を、前記端部寄り基板部分に隣接する基板端縁に近接させ、前記主体部の面および被覆薄板の面に残留する過剰塗布液を、前記多孔質材を経て吸引し、被覆薄板の基板からの取り外し時に前記主体部をも、その面に付着する過剰塗布液と共に取り外す
ことを特徴とする基板面端部の過剰塗布液除去方法
A method for removing excess coating liquid at the edge of a substrate surface, which removes excess coating liquid remaining near the edge of the substrate surface at the end of coating of the coating liquid on the substrate surface, the method comprising: A method of removing only the excess coating liquid remaining on the coating thin plate by covering only the substrate portion near the end with the coating thin plate and removing the coating thin plate after the coating operation is completed ,
A main portion having a surface continuous with the coated thin plate is formed of a porous material, and the main portion is brought close to a substrate edge adjacent to the substrate portion near the end portion, and the surface of the main portion and the coating are formed. The excess coating solution remaining on the surface of the thin plate is sucked through the porous material, and the main body is removed together with the excess coating solution attached to the surface when the coated thin plate is removed from the substrate.
A method for removing excess coating liquid from an edge of a substrate surface .
前記被覆薄板および主体部を、塗布終了後、次の塗布作業が開始されるまでの間に洗浄することを特徴とする請求項1記載の基板面端部の過剰塗布液除去方法。2. The method according to claim 1, wherein the coated thin plate and the main body are washed after the coating is completed and before the next coating operation is started. 基板面への液塗布装置に支持される基板の過剰塗布液が残留する側の端面に液塗布時に近接させられる近接位置と、液塗布終了後に基板から離隔させられる離隔位置との間で移動可能に設けられた基板被覆部材を備え、この基板被覆部材は、その近接位置で前記端部の基板面を覆う被覆薄板を有し、液塗布時に前記被覆部材の面に付着する過剰塗布液が、被覆部材が離隔位置へ移動させられることにより除去され
前記基板被覆部材が、その近接位置で前記端部基板面に隣接する基板端縁に近接する主体部を有し、
前記被覆薄板と主体部が同じ平面をもっており、
前記主体部が、前記被覆薄板と同じ面をなす部分に多孔質部をもち、この多孔質部が吸引手段に接続されている
ことを特徴とする基板面端部の過剰塗布液除去装置。
Movable between a close position where the excess coating liquid of the substrate supported by the liquid coating device on the substrate surface where the excess coating liquid remains remains at the time of liquid coating and a separation position where it is separated from the substrate after liquid coating is completed The substrate coating member has a coating thin plate that covers the substrate surface at the end portion in the vicinity of the substrate coating member, and excess coating liquid that adheres to the surface of the coating member at the time of liquid application, The covering member is removed by being moved to the separated position ,
The substrate covering member has a main body portion close to a substrate edge adjacent to the end substrate surface at the proximity position,
The coated thin plate and the main body have the same plane,
An excess coating solution at an end of a substrate surface , wherein the main body portion has a porous portion at a portion on the same surface as the coated thin plate, and the porous portion is connected to suction means. Removal device.
JP29018194A 1994-11-24 1994-11-24 Method and apparatus for removing excess coating liquid at end of substrate surface Expired - Lifetime JP3604182B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29018194A JP3604182B2 (en) 1994-11-24 1994-11-24 Method and apparatus for removing excess coating liquid at end of substrate surface

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Application Number Priority Date Filing Date Title
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JP3604182B2 true JP3604182B2 (en) 2004-12-22

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