JP3591469B2 - Electronic component mounting equipment - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on an edge of a substrate such as a display panel.
[0002]
[Prior art]
Electronic components such as connectors and semiconductor chips are mounted on a plurality of edges of a substrate such as a display panel. When positioning the substrate in this step, it is necessary to perform not only horizontal positioning in the XY directions but also positioning in the rotation direction for rotating the substrate by an integral multiple angle of 90 degrees. Conventionally, this rotational positioning is performed by rotating a holding table for holding a substrate around a vertical axis.
[0003]
By the way, in recent years, display panels have been miniaturized in accordance with applications such as mobile phones, and there has been a demand for a mounting apparatus that can efficiently perform mounting operations on small substrates.
[0004]
[Problems to be solved by the invention]
However, in an electronic component mounting apparatus, such as a display panel, which mainly targets the edge of the substrate, the size and arrangement of each part of the apparatus are greatly restricted by the size of the target substrate. For this reason, it has been difficult to mount small-sized substrates with mounting devices targeting large-sized substrates, and dedicated devices for small-sized substrates cannot be used for the production of large-sized substrates. There was a problem that it was difficult.
[0005]
Accordingly, it is an object of the present invention to provide an electronic component mounting apparatus capable of mounting a plurality of types of substrates having different sizes.
[0006]
[Means for Solving the Problems]
2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus mounts the electronic component on an edge of the substrate by a mounting head, wherein the substrate holding section holds the substrate, and the substrate holding section is mounted on the electronic component mounting apparatus. A rotation drive mechanism having a plurality of rotation drive shafts for positioning the substrate in the rotation direction by rotating the holding section about a vertical axis; and a moving table for moving the rotation drive mechanism in a horizontal direction. A plurality of types of substrate holders that individually hold at least two types of substrates, large and small, can be selectively mounted on the drive shaft.
[0007]
An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, wherein the plurality of rotary drive shafts are held by a board holding unit mounted on the rotary drive shafts. The edges of the at least two types of substrates are arranged so as to be able to be received by a common receiving portion.
[0008]
According to the present invention, a substrate holding portion for holding a substrate is mounted, and a plurality of rotation drive shafts for positioning the substrate in a rotational direction by rotating the substrate holding portion around a vertical axis are provided. By selectively mounting a plurality of types of board holding parts that are individually held on a rotary drive shaft according to the type of the board, it is possible to mount a plurality of types of boards having different sizes with the same mounting apparatus. it can.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of a θ-axis table of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 4 and FIG. 5 are explanatory views of an operation of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 6 is a perspective view of a substrate according to the embodiment of the present invention. It is.
[0010]
First, the configuration of the electronic component mounting apparatus will be described with reference to FIG. In this electronic component mounting apparatus, an electronic component such as a connector or a semiconductor chip is mounted on an edge of a substrate such as a display panel by bonding. In FIG. 1, the electronic component mounting apparatus includes a board positioning section 1, a bonding section 2, and a board transport section 3. The substrate positioning unit 1 is configured by stacking a θ-axis table 6 on a moving table including an X-axis table 4 and a Y-axis table 5.
[0011]
The X-axis table 4 and the Y-axis table 5 are provided with feed screws 8 and 10 that are driven to rotate by motors 7 and 9, respectively. By driving the motors 7 and 9, the θ-axis table 6 moves in the horizontal direction. I do. Here, the configuration of the θ-axis table 6 will be described with reference to FIG. In FIG. 2A, one rotation drive shaft 14 fitted to the worm wheel 13 and two rotation drive shafts fitted to the worm wheel 15 are mounted on the horizontal base member 6a of the θ-axis table 6. 16 stands upright. The same worm shaft 12 meshes with the worm wheels 13 and 15, and when the worm shaft 12 is rotationally driven by the motor 11, the rotary drive shafts 14 and 16 rotate together.
[0012]
Here, the two rotation drive shafts 16 and 14 are arranged on different sides of the worm shaft 12, and are arranged to be offset in the Y direction. As shown in FIG. 2A, a substrate holder 18 for a small substrate is mounted on the two rotary drive shafts 16, and a large-sized rotary drive shaft 14 is mounted on the rotary drive shaft 14 as shown in FIG. 2B. The substrate holding unit 17 for the substrate is selectively mounted (see also FIG. 1).
[0013]
These substrate holders 17 and 18 are provided with suction holes 17a and 18a, respectively, and target substrates 24 and 25 (see FIGS. 3, 4 and 5) are respectively placed on substrate holders 17 and 18. In the mounted state, the substrates 24 and 25 are held by the substrate holders 17 and 18 by vacuum suction from the suction holes 17a and 18a by vacuum suction means (not shown). That is, a plurality of types of substrate holding units that individually hold at least two types of substrates, large and small, can be selectively mounted on the rotary drive shafts 14 and 16 of the θ-axis table 6.
[0014]
By driving the motor 11 in a state where the substrate holders 18 and 17 corresponding to the rotation drive shafts 16 and 14 are individually mounted, the substrate holders 18 and 17 rotate around the vertical axis in a horizontal plane. Thus, the position of the substrate placed and held on the substrate holding units 17 and 18 in the θ direction can be adjusted and positioned. That is, the θ-axis table 6 has a plurality of rotation drive shafts 14 and 16 on which the substrate holders 17 and 18 are mounted and which rotates the substrate holders 17 and 18 around a vertical axis to position the substrate in the rotational direction. It is a rotation drive mechanism.
[0015]
Here, as shown in FIG. 3, the rotary drive shafts 14 and 16 are arranged in a state where two large and small substrates 25 and 24 are held by the substrate holding portions 17 and 18 mounted on the rotary drive shafts 14 and 16. The edges of the substrates 25 and 24 are arranged so that they can be supported by the common support 20. Thus, the electronic components can be mounted on different types of substrates by a single bonding means.
[0016]
On the side of the bonding section 2, a board transfer section 3 for transferring a board to be mounted is provided. The substrate transfer section 3 has a transfer head 23 mounted on the distal end portion of the transfer arm 22 and sucks and holds the transfer target substrate by the suction nozzle of the transfer head 23. When the transfer arm 22 is moved by a drive mechanism (not shown), the transfer head 23 takes out the substrate from a substrate supply unit (not shown) and transfers it to the bonding unit 2. Here, the transfer head 23 can be exchanged according to the size of the substrate to be transported, and different types of substrates can be transported by the same substrate transport unit 3.
[0017]
This electronic component mounting apparatus is configured as described above, and the operation will be described below with reference to FIGS. In this electronic component mounting operation, as shown in FIG. 6, a driver chip 27 is mounted on an edge of a substrate 24 such as a display panel by bonding. Here, the chip 27 is mounted not only on one edge 24a of the substrate 24 but also on an edge 24b in a direction perpendicular to the one edge 24a.
[0018]
First, with reference to FIG. 4, the mounting for the small-sized substrate 24 will be described. First, a setup change operation corresponding to the board type is performed. As shown in FIG. 4, the substrate holding unit 18 corresponding to the substrate 24 is mounted on the two rotary drive shafts 16 of the θ-axis table 6 (see FIG. 2A), and the transfer arm 22 of the substrate transfer unit 3 , A two-sheet suction type transfer head 23a corresponding to the substrate 24 is mounted.
[0019]
Next, the substrate 24 is taken out of the substrate supply unit (not shown) by the substrate transport unit 3 and the transport arm 22 is moved to transfer the substrate 24 onto the substrate holding unit 18. Then, when the substrate 24 is held by the substrate holding unit 18 by vacuum suction from the suction holes 18a (FIG. 2A), the substrate 24 is positioned. That is, by driving the X-axis table 4 and the Y-axis table 5, the edge 24a of the substrate 24 is aligned with the lower receiving portion 20. Here, the relative position between the two substrates 24 is adjusted by a pre-center stage provided in advance in the substrate supply unit, and the substrate 24 is placed on the substrate holding unit 18 without any relative displacement. Since they are transferred, the two substrates 24 can be simultaneously positioned by the same positioning operation.
[0020]
Then, by rotating the motor 11 of the θ-axis table 6, the rotational position of the substrate 24 is aligned in the θ direction, and the edge 24a of the substrate 24 is moved relative to the lower receiving portion 20 in each of the X, Y, and θ directions. After the alignment, the electronic component 27 is bonded to the edge 24a by the mounting head 21. Thereafter, the same mounting operation is performed on the edge 24b shown in FIG. That is, by rotating the rotation drive shaft 16 by 90 degrees, the edge portion 24 b is aligned with the lower receiving portion 20.
[0021]
In the above example, an example is shown in which the two substrates 24 are aligned at the same time. However, if the relative positions of the two substrates 24 vary without performing pre-centering, the first After performing the positioning and bonding only on the substrate 24, the same positioning and bonding may be performed on the other substrates 24.
[0022]
FIG. 5 shows an example in which a large-sized substrate 25 is targeted. In this case, when the setup is in the bait line, the substrate holder 17 corresponding to the substrate 25 is mounted on the rotary drive shaft 14, and the transfer head 23 b for a large substrate is mounted on the transport arm 22. Then, as in the example of FIG. 4, the substrate 25 is taken out of the substrate supply unit (not shown) by the substrate transport unit 3, the transport arm 22 is moved, and the substrate 25 is transferred onto the substrate holding unit 17.
[0023]
Then, if the substrate 25 is held by the substrate holding unit 17 by vacuum suction from the suction holes 17a (FIG. 2B), the substrate 25 is positioned. That is, similarly to the case of the substrate 24, the edge of the mounting target of the substrate 25 is aligned with the lower receiving portion 20. When the X, Y, and θ directions are aligned with the lower receiving portion 20, the electronic component is bonded to the edge by the mounting head 21.
[0024]
In the mounting operation for such different types of substrates, even when substrates of different sizes are held by the substrate holding unit, the edges of these substrates are supported by a common support portion, Mounting can be performed by a common mounting head. Therefore, the mounting operation can be performed with high operation efficiency by using the same device for a plurality of types of substrates. Further, when a small substrate is targeted, high productivity can be realized because a plurality of substrates can be processed simultaneously.
[0025]
【The invention's effect】
According to the present invention, at least two types of substrates, large and small, are provided on a plurality of rotary drive shafts, which are mounted with a substrate holding unit for holding a substrate and rotate the substrate holding unit about a vertical axis to position the substrate in the rotational direction. Are mounted in accordance with the type of substrate, so that a plurality of types of substrates having different sizes can be mounted on the same mounting apparatus.
[Brief description of the drawings]
1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a perspective view of a θ-axis table of the electronic component mounting apparatus according to one embodiment of the present invention; FIG. 4 is a partial cross-sectional view of the electronic component mounting apparatus according to the embodiment. FIG. 4 is an explanatory diagram of the operation of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 5 is an operation of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a perspective view of a substrate according to an embodiment of the present invention.
DESCRIPTION OF SYMBOLS 1 Substrate positioning part 2 Bonding part 3 Substrate transport part 6 Theta axis table 14, 16 Rotation drive shaft 17, 18 Substrate holding part 24, 25 Substrate

Claims (2)

An electronic component mounting apparatus for mounting an electronic component on a peripheral portion of a substrate by a mounting head, wherein the substrate holding portion for holding the substrate and the substrate holding portion are mounted and the substrate holding portion is rotated about a vertical axis. A rotary drive mechanism having a plurality of rotary drive shafts for positioning the substrate in the rotational direction; and a moving table for moving the rotary drive mechanism in the horizontal direction. The rotary drive shaft has at least two types of substrates, large and small. An electronic component mounting apparatus characterized in that a plurality of types of board holding sections individually held can be selectively mounted. The plurality of rotary drive shafts can receive the edges of the at least two types of large and small substrates held by the substrate holding portions mounted on the rotary drive shafts by a common support portion. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is arranged as follows.

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