JP3576484B2 - Resin sealing molding equipment - Google Patents

Resin sealing molding equipment Download PDF

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Publication number
JP3576484B2
JP3576484B2 JP2000363518A JP2000363518A JP3576484B2 JP 3576484 B2 JP3576484 B2 JP 3576484B2 JP 2000363518 A JP2000363518 A JP 2000363518A JP 2000363518 A JP2000363518 A JP 2000363518A JP 3576484 B2 JP3576484 B2 JP 3576484B2
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JP
Japan
Prior art keywords
resin
product
core
sealing
secondary battery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000363518A
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Japanese (ja)
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JP2002166447A (en
Inventor
芳宣 祝園
昭治 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2000363518A priority Critical patent/JP3576484B2/en
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to US10/362,690 priority patent/US6881371B2/en
Priority to KR1020037005417A priority patent/KR100822557B1/en
Priority to DE60142077T priority patent/DE60142077D1/en
Priority to CNB018175635A priority patent/CN100456528C/en
Priority to TW090125902A priority patent/TW507391B/en
Priority to PCT/JP2001/009226 priority patent/WO2002033766A1/en
Priority to EP01976787A priority patent/EP1343210B1/en
Publication of JP2002166447A publication Critical patent/JP2002166447A/en
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Publication of JP3576484B2 publication Critical patent/JP3576484B2/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、製品の構成要素を被覆するように溶融させた樹脂を充填して、硬化させた樹脂により製品の一面を樹脂封止する樹脂封止成形装置に関するものである。
【0002】
【従来の技術】
携帯電子機器のような製品では、使用環境が一定になく、移動を伴うため小型化、薄型化、軽量化が要求されると同時に防塵、防滴構造あるいは耐落下、耐衝撃性が要求される。これらの要求を満たすためには、製品の外装体の構造が重要な要素となる。図12は、製品の一例であり、携帯電子機器の電源として用いられる電池パックの構成例を示すもので、二次電池80と、電池保護回路等を構成した回路基板84とを外装体内に収容して、携帯電子機器の電源としての要求に応えている。
【0003】
この電池パックの外装体は下ケース82と上ケース83とからなるパックケースで構成されている。図12(a)に示すように、下ケース82内に電池保護回路を構成した回路基板84や入出力端子、接続板等を配置し、その上に、図12(b)に示すように、リチウムイオン二次電池として構成された二次電池80を配置して、二次電池80を接続板に接合する。次に、図12(c)に示すように、電池80に両面テープ85を貼着し、下ケース82に上ケース83を接合して電池パックが完成する。
【0004】
前記下ケース82と上ケース83との接合は、両者の周縁部で超音波接合等によりなされる。超音波接合の場合は、図13に示すように、下ケース82の周縁部に形成された突出部82aを上ケース83の周縁部に形成された凹部83a内に嵌入させ、突出部82aの先端と凹部83aの底との間で超音波溶接する。この接合構造により溶融した樹脂が外部に露出することがない。
【0005】
【発明が解決しようとする課題】
しかしながら、従来の外装体の構成では分割されたケースを接合する構造が不可欠であり、上記従来例では下ケース82に上ケース83を接合するために両ケース82、83の側周面の厚さが必要となり、パックケース即ち電池パックとしての体積増、重量増が伴う課題があった。
【0006】
また、パックケースはハードケースであり、下ケース82に上ケース83を接合し、入出力端子を外部に露出させる必要があるため、微小な隙間が随所に発生し、防塵、防滴構造に構成することが困難であり、落下により破損しやすい構造であった。
【0007】
本発明が目的とするところは、製品の一面を樹脂封止して小型化、軽量化と共に防塵、防滴構造を実現するために好適な樹脂封止成形装置を提供することにある。
【0008】
【課題を解決するための手段】
上記目的を達成するための本発明は、製品の一面に樹脂を充填して製品の一面を樹脂封止する樹脂封止成形装置であって、前記製品を収容する製品収容体と、樹脂の充填空間につながるゲートとスプルーが形成されたコアと、このコアを製品収容体から離れる方向に付勢する弾性部材と、前記スプルーにノズル先端を当接させ、前記製品を収容した製品収容体に前記弾性部材の付勢に抗してコアを押圧し、ノズルからスプルーとゲートを通じて前記充填空間に樹脂を充填する樹脂注入ノズルとを備え、前記充填空間は前記製品の一面と前記コアの内面との間に形成され、製品収容体及びコアは、ゲート位置を衝き合わせ面とする割り型に構成されてなることを特徴とする。
【0009】
上記樹脂封止成形装置によれば、製品収容体内に製品を収容して樹脂注入ノズルを進出させるとコアは弾性部材の付勢に抗してキャビティに押圧されて、製品収容体とコアとからなる金型が閉じられるので、樹脂注入ノズルから樹脂を注入すると、樹脂は充填空間内に充填される。製品の樹脂封止する一面を充填空間に面するように製品収容体内に収容すると製品の一面は樹脂封止される。
【0010】
また製品収容体及びコアは、ゲート位置を衝き合わせ面とする割り型に構成しているので、金型内への製品の出し入れが容易であり、ゲート部分に生じるアンダーカットにも対応することができる。また、樹脂注入ノズルの進出動作により製品収容体とコアとの間が閉じられるので、製品の収容、取り出しが容易となる。
【0013】
【発明の実施の形態】
以下、添付図面を参照して本発明の実施形態について説明し、本発明の理解に供する。尚、以下に示す実施形態は本発明を具体化した一例であって、本発明の技術的範囲を限定するものではない。
【0014】
以下に示す実施形態は、電池パック(製品)の内装物を封止するパックケースに適用した例を示すものである。電池パックは、図1に示すように、扁平形のリチウムイオン二次電池に構成された二次電池1と、この二次電池1を過充電、過放電等から保護する電池保護回路を構成した回路基板9とを一体に組み合わせて、図2に示すような中間完成品50を形成し、この中間完成品50を図3に示すようにパックケース7内に収容し、パックケース7の開放端を樹脂封止して二次電池1の形態を損なうことなく電池パックに構成したものである。
【0015】
図1は、前記中間完成品50を分解して示すもので、二次電池1の封口部側に、この二次電池1の正極端子25に接合される接続板11、二次電池1上に配設されて回路基板9の座面を提供するスペーサ12、電池保護回路を構成すると共にプラス端子4、マイナス端子5及び温度検出端子6を形成した回路基板9が配設され、二次電池1の負極を構成する電池缶31の底面から側面に延出するリード板10が配設されている。
【0016】
前記二次電池1の正極端子25に、Lの字状に形成された接続板11の基部11bが接合され、電池缶31の底面には、リード板10の基部10bが接合され、リード部10aは電池缶31の側面に沿って封口部側に延出される。
【0017】
また、二次電池1の封口部側には、図2に示すようにスペーサ12が取り付けられる。スペーサ12は二次電池1上に位置決め嵌合され、負極である電池缶31との間の絶縁性が強化される。また、接続板11のリード部11aと、リード板10のリード部10aとは、スペーサ12及び回路基板9を通して回路基板9上に接合される。回路基板9の封口部側に実装された電子部品はスペーサ12の開口部内に収容されるので、回路基板9はその基板の厚さとスペーサ12の厚さとを加えた高さだけで二次電池1上に積層された状態となり、電池保護回路を設けることによる高さの増加が抑制される。
【0018】
図4は、回路基板9の表裏両面に形成された回路パターンを示すもので、基板上に電池保護回路と入出力端子とが構成されている。図4(b)に示すように、回路基板9の裏面側(スペーサ12側)には電池保護回路が構成され、図4(a)に示すように、表面側にはプラス端子用導体パターン4a、マイナス端子用導体パターン5a及び温度検出端子用導体パターン6aと、接続板11を接続するための接続板用導体パターン15及びリード板10を接続するためのリード板用導体パターン16とが形成されている。この両面に形成された回路パターンは要所でスルーホール30によって接続されている。この回路基板9に形成されたリード通し穴20から接続板11のリード部11aを通し、リード部11aを接続板用導体パターン15上に折り曲げてハンダ付けする。また、リード板10のリード部10aをリード板用導体パターン16上に折り曲げてハンダ付けする。この接続板11及びリード板10がハンダ付けされることにより、回路基板9はスペーサ12上に固定される。
【0019】
図4(a)に示すように、回路基板9の表面側に形成されたプラス端子用導体パターン4a上にはプラス端子4、マイナス端子用導体パターン5a上にはマイナス端子5、温度検出端子用導体パターン6a上には温度検出端子6が接合される。これらの端子は、銅ニッケル合金の板材もしくはこの銅ニッケル合金の板材とステンレス鋼とのクラッド材等を用いることにより、導電性、接合性、耐蝕性に優れたものとなる。また、端子として板材を接合することなく、各導体パターンに金メッキを施してそのまま端子として利用することもできる。
【0020】
上記のように二次電池1に回路基板9を取り付けることにより、図2に示したように、中間完成品50が形成される。この中間完成品50は、図5(a)に示すように、上面13にプラス端子窓4c、マイナス端子窓5c、温度検出端子窓6cが設けられ、図5(c)に示すように底部14が開放されたパックケース7内に、図5(b)に示すように収容され、底部14を以下に示す樹脂封止成形装置60によって樹脂封止することにより中間完成品50はパックケース7内に密閉される。
【0021】
図6〜図9は、樹脂封止成形装置60による樹脂封止の各工程を順に示すもので、各図(a)(b)に金型部分を直交する2方向の断面で示している。
【0022】
図6において、成形金型を構成する製品収容体(以下キャビティと称す)62及びコア63は割り型構造に形成して、中間完成品50の出し入れを可能にすると共に、ゲート部分のスプルー67によって生じるアンダーカットに対応できるようにしている。キャビティ62には空洞62aが形成され、コア63の内面は樹脂の充填空間63aに接する樹脂成形面となっており、またコア63には前記充填空間63aにつながるゲート66と、このゲート66につながるスプルー67とが形成されている。また、コア63はスプリング(弾性部材)64によってキャビティ62から離れる方向に付勢されている。図示するようにキャビティ62を開き、パックケース7を被せた中間完成品50、すなわち二次電池の樹脂封止前製品を、その開放端をコア63側にして空洞62a内に挿入する。
【0023】
次に、図7に示すように、キャビティ62及びコア63を閉じ、樹脂注入ノズル65をキャビティ62側に進出させることにより、コア63をスプリング64の付勢に抗してキャビティ62に押圧させる。図8に示すように、キャビティ62にコア63が密着し、パックケース7の開放端上にコア63に形成された樹脂成形面が位置するので、樹脂注入ノズル65から樹脂70をスプルー67内に吐出すると、樹脂70はゲート66を通じて充填空間63a内に充填される。この樹脂70の充填によりパックケース7の開放端は樹脂封止される。また、充填された樹脂70はパックケース7と中間完成品50との間の隙間にも侵入するので、パックケース7と中間完成品50とは一体化され、パックケース7を薄い樹脂成形品によって構成しても強度が補われ、電池パックを小型化することができる。
【0024】
充填した樹脂70を硬化させた後、図9に示すように、キャビティ62及びコア63を開き、樹脂注入ノズル65を後退させると樹脂封止成形された電池パックを取り出すことができる。成形された樹脂70は、図10(a)に示すように、ゲート66及びスプルー67によって作られた不要部分70aが残っているので、これを切り取ることにより、図10(b)に示すように、パックケース7と樹脂70によって中間完成品50を被覆した電池パックが完成する。
【0025】
以上説明した樹脂封止成形装置60は、開放されたパックケース7の底部を樹脂封止するように構成しているが、上面を開放端とするケース内に中間完成品50を挿入し、端子部分に開口部を形成して上面を樹脂封止するように構成することもできる。これはコア63の充填空間63aに端子部分に当接する突出部を形成することにより実施することができる。
【0026】
また、図11に示すように、キャビティ62に形成する空洞62aを、その容積が中間完成品50の周囲に間隙ができるサイズに形成し、空洞62aの内壁の複数箇所に中間完成品50を宙吊り状態に支持するピン75を設けて構成することにより、樹脂注入ノズル65から注入された樹脂70は図示するように中間完成品50の周囲に充填され、全面を樹脂封止することができる。この場合にも前述のように端子部分に開口部が形成されるようにする。
【0027】
以上説明した樹脂封止成形に用いる樹脂は、ポリアミド系、ポリウレタン系のホットメルトが好適なものとなる。また、樹脂を硬化させたときの硬度が低くなるように調整することにより、衝撃吸収の効果が得られ、電池パックに落下等の衝撃に対する耐衝撃性が向上し、携帯電子機器の電源として好適なものとなる。
【0028】
【発明の効果】
以上の説明の通り本発明によれば、製品の一面を樹脂封止する樹脂封止成形装置において、製品の収容、取り出しが容易となる。
【図面の簡単な説明】
【図1】実施形態に係る中間完成品の構成を示す分解斜視図。
【図2】中間完成品の構成を示す(a)は平面図、(b)端側面図。
【図3】電池パックの完成状態を示す斜視図。
【図4】回路基板の構成を示す(a)は表面側、(b)は裏面側の平面図。
【図5】パックケースの構成を示す(a)は上面図、(b)は側面図、(c)は底面図。
【図6】樹脂封止成形装置の構成を直交する2方向(a)(b)の断面で示し、第1工程の状態を示す断面図。
【図7】同上第2工程の状態を示す断面図。
【図8】同上第2工程の状態を示す断面図。
【図9】同上第3工程の状態を示す断面図。
【図10】(a)は樹脂封止成形の完了状態、(b)は電池パックの完成状態を示す断面図。
【図11】電池パックの全面を樹脂封止する構成を示す断面図。
【図12】従来構成になる電池パックの構成と組み立て順序を(a)(b)(c)の順に示す斜視図。
【図13】従来構成になるパックケースの接合状態を示す部分断面図。
【符号の説明】
7 パックケース
50 中間完成品(製品)
60 樹脂封止成形装置
62 キャビティ
62a 空洞
63 コア
63a 充填空間
64 スプリング(弾性部材)
65 樹脂注入ノズル
66 ゲート
70 樹脂
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin-sealing molding apparatus that fills a molten resin so as to cover components of a product , and seals one surface of the product with the cured resin.
[0002]
[Prior art]
In products such as portable electronic devices, the use environment is not constant, and it is required to be smaller, thinner and lighter because of the movement, and at the same time, it is required to have a dust proof, drip proof structure or drop resistance and impact resistance. . In order to satisfy these requirements, the structure of the outer package of the product is an important factor. FIG. 12 is an example of a product, showing a configuration example of a battery pack used as a power source of a portable electronic device, in which a secondary battery 80 and a circuit board 84 including a battery protection circuit and the like are housed in an exterior body. Thus, it has responded to the demand as a power source for portable electronic devices.
[0003]
The exterior body of this battery pack is constituted by a pack case including a lower case 82 and an upper case 83. As shown in FIG. 12A, a circuit board 84 constituting a battery protection circuit, input / output terminals, a connection plate, and the like are arranged in a lower case 82, and further, as shown in FIG. The secondary battery 80 configured as a lithium ion secondary battery is arranged, and the secondary battery 80 is joined to the connection plate. Next, as shown in FIG. 12C, a double-sided tape 85 is attached to the battery 80, and the upper case 83 is joined to the lower case 82 to complete the battery pack.
[0004]
The lower case 82 and the upper case 83 are joined at their peripheral edges by ultrasonic joining or the like. In the case of ultrasonic bonding, as shown in FIG. 13, the protrusion 82 a formed on the periphery of the lower case 82 is fitted into the recess 83 a formed on the periphery of the upper case 83, and the tip of the protrusion 82 a And ultrasonic welding between the bottom of the recess 83a. With this joining structure, the molten resin is not exposed to the outside.
[0005]
[Problems to be solved by the invention]
However, the structure of joining the divided cases is indispensable in the configuration of the conventional exterior body. In the above-described conventional example, the thickness of the side peripheral surfaces of the two cases 82 and 83 is required to join the upper case 83 to the lower case 82. However, there is a problem that the volume and weight of the pack case, that is, the battery pack, increase.
[0006]
Also, the pack case is a hard case, and the upper case 83 needs to be joined to the lower case 82 to expose the input / output terminals to the outside. The structure was difficult to perform, and the structure was easily damaged by falling.
[0007]
An object of the present invention is to provide a resin-sealing molding apparatus suitable for realizing a dust-proof and drip-proof structure as well as miniaturization and weight reduction by sealing one surface of a product with a resin.
[0008]
[Means for Solving the Problems]
The present invention for achieving the above object is a resin sealing molding apparatus for filling a resin on one surface of a product and sealing the one surface of the product with a resin. a core gate and sprue are formed leading to the space, the the core and an elastic member for biasing in a direction away from the product container, is brought into contact with the nozzle tip to the sprue, the product container containing the said product A resin injection nozzle that presses the core against the bias of the elastic member and fills the filling space with a resin from a nozzle through a sprue and a gate , wherein the filling space is formed between one surface of the product and the inner surface of the core. It is characterized in that the product container and the core are formed in a split shape with the gate position as an abutting surface .
[0009]
According to the resin sealing and molding apparatus and accommodates a product in the product housing body is advanced resin injection nozzle core is pressed into the cavity against the biasing force of the elastic member, and the product container and the core since a mold having is closed, when the resin is injected from the resin injection nozzle, the resin is filled into the filling space. When accommodating the one surface of the resin sealing products in the product container so as to face the charging space one surface of the product is resin-sealed.
[0010]
In addition, since the product container and the core are configured in a split mold with the gate position as the abutting surface, it is easy to put the product in and out of the mold, and it is possible to cope with the undercut generated in the gate part. it can. Further, since the space between the product container and the core is closed by the advance operation of the resin injection nozzle, the product can be easily stored and taken out.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings to facilitate understanding of the present invention. The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0014]
The embodiment described below shows an example in which the present invention is applied to a pack case for sealing the interior of a battery pack (product). As shown in FIG. 1, the battery pack constituted a secondary battery 1 configured as a flat lithium ion secondary battery and a battery protection circuit for protecting the secondary battery 1 from overcharge, overdischarge, and the like. The circuit board 9 and the circuit board 9 are integrally combined to form an intermediate completed product 50 as shown in FIG. 2, and this intermediate completed product 50 is accommodated in the pack case 7 as shown in FIG. Is sealed in a resin to form a battery pack without impairing the form of the secondary battery 1.
[0015]
FIG. 1 is an exploded view of the intermediate completed product 50. On the side of the sealing portion of the secondary battery 1, a connection plate 11 joined to the positive electrode terminal 25 of the secondary battery 1 and on the secondary battery 1 are shown. A spacer 12 which is provided to provide a seating surface of the circuit board 9, and a circuit board 9 which constitutes a battery protection circuit and has a plus terminal 4, a minus terminal 5, and a temperature detection terminal 6 are provided. A lead plate 10 extending from the bottom surface to the side surface of the battery can 31 constituting the negative electrode is provided.
[0016]
A base 11b of an L-shaped connecting plate 11 is joined to a positive electrode terminal 25 of the secondary battery 1, a base 10b of a lead plate 10 is joined to a bottom surface of the battery can 31, and a lead 10a Extends along the side surface of the battery can 31 toward the sealing portion.
[0017]
Further, a spacer 12 is attached to the sealing portion side of the secondary battery 1 as shown in FIG. The spacer 12 is positioned and fitted on the secondary battery 1, and the insulation between the spacer 12 and the battery can 31, which is the negative electrode, is enhanced. Further, the lead portion 11a of the connection plate 11 and the lead portion 10a of the lead plate 10 are joined on the circuit board 9 through the spacer 12 and the circuit board 9. Since the electronic components mounted on the sealing portion side of the circuit board 9 are accommodated in the opening of the spacer 12, the circuit board 9 has the secondary battery 1 only at the height obtained by adding the thickness of the board and the thickness of the spacer 12. It becomes a state of being stacked on top, and an increase in height due to the provision of the battery protection circuit is suppressed.
[0018]
FIG. 4 shows a circuit pattern formed on both the front and back surfaces of the circuit board 9, on which a battery protection circuit and input / output terminals are formed. As shown in FIG. 4 (b), a battery protection circuit is formed on the back side (spacer 12 side) of the circuit board 9, and as shown in FIG. 4 (a), the positive terminal conductor pattern 4a is formed on the front side. , A negative terminal conductor pattern 5a and a temperature detection terminal conductor pattern 6a, and a connection plate conductor pattern 15 for connecting the connection plate 11 and a lead plate conductor pattern 16 for connecting the lead plate 10. ing. The circuit patterns formed on both sides are connected by through holes 30 at important points. The lead portion 11a of the connection plate 11 is passed through the lead through hole 20 formed in the circuit board 9, and the lead portion 11a is bent onto the connection plate conductor pattern 15 and soldered. Further, the lead portion 10a of the lead plate 10 is bent over the lead plate conductor pattern 16 and soldered. The circuit board 9 is fixed on the spacer 12 by soldering the connection plate 11 and the lead plate 10.
[0019]
As shown in FIG. 4A, the positive terminal 4 is formed on the positive terminal conductor pattern 4a formed on the surface side of the circuit board 9, the negative terminal 5 is formed on the negative terminal conductor pattern 5a, and the temperature detection terminal is formed. The temperature detection terminal 6 is joined on the conductor pattern 6a. By using a copper-nickel alloy plate or a clad material of the copper-nickel alloy and stainless steel, these terminals are excellent in conductivity, bonding property, and corrosion resistance. In addition, it is also possible to apply gold plating to each conductor pattern and use the conductor pattern as it is without joining a plate material as a terminal.
[0020]
By attaching the circuit board 9 to the secondary battery 1 as described above, an intermediate completed product 50 is formed as shown in FIG. As shown in FIG. 5 (a), the intermediate completed product 50 is provided with a plus terminal window 4c, a minus terminal window 5c, and a temperature detection terminal window 6c on the upper surface 13, and a bottom portion 14 as shown in FIG. 5 (c). As shown in FIG. 5B, the intermediate completed product 50 is housed in the pack case 7 by sealing the bottom portion 14 with a resin molding device 60 described below. Sealed.
[0021]
6 to 9 sequentially show each step of resin sealing by the resin sealing molding apparatus 60, and show a mold portion in two views orthogonal to each other in FIGS.
[0022]
In FIG. 6, a product container (hereinafter referred to as a cavity) 62 and a core 63 constituting a molding die are formed in a split mold structure to enable the intermediate finished product 50 to be taken in and out, and to be sprued by a sprue 67 at a gate portion. It is designed to cope with the undercut that occurs. A cavity 62a is formed in the cavity 62, and the inner surface of the core 63 is a resin molding surface in contact with the resin filling space 63a . The core 63 has a gate 66 connected to the filling space 63a and a gate 66 connected to the gate 66. A sprue 67 is formed. The core 63 is urged by a spring (elastic member) 64 in a direction away from the cavity 62. As shown in the figure, the cavity 62 is opened, and the intermediate completed product 50 covered with the pack case 7, that is, the product before resin sealing of the secondary battery is inserted into the cavity 62a with its open end facing the core 63.
[0023]
Next, as shown in FIG. 7, the cavity 62 and the core 63 are closed, and the resin injection nozzle 65 is advanced toward the cavity 62, thereby pressing the core 63 against the bias of the spring 64. As shown in FIG. 8, the core 63 is in close contact with the cavity 62, and the resin molding surface formed on the core 63 is located on the open end of the pack case 7, so that the resin 70 is injected from the resin injection nozzle 65 into the sprue 67. Upon discharge, the resin 70 is filled into the filling space 63a through the gate 66. The filling of the resin 70 seals the open end of the pack case 7 with the resin. Further, since the filled resin 70 also enters the gap between the pack case 7 and the intermediate completed product 50, the pack case 7 and the intermediate completed product 50 are integrated, and the pack case 7 is formed by a thin resin molded product. Even with this configuration, the strength is supplemented, and the size of the battery pack can be reduced.
[0024]
After curing the filled resin 70, as shown in FIG. 9, the cavity 62 and the core 63 are opened, and the resin injection nozzle 65 is retracted, so that the resin-encapsulated battery pack can be taken out. As shown in FIG. 10A, an unnecessary portion 70a formed by the gate 66 and the sprue 67 remains in the molded resin 70. By cutting the unnecessary portion 70a, as shown in FIG. Then, a battery pack in which the intermediate completed product 50 is covered with the pack case 7 and the resin 70 is completed.
[0025]
The resin sealing molding device 60 described above is configured to seal the bottom of the opened pack case 7 with resin, but the intermediate completed product 50 is inserted into a case having an upper surface as an open end, and a terminal is inserted. An opening may be formed in a portion and the upper surface may be sealed with resin. This can be implemented by forming a protrusion in contact with the terminal portion in the filling space 63a of the core 63.
[0026]
As shown in FIG. 11, a cavity 62a formed in the cavity 62 is formed to have a size such that a space is formed around the intermediate completed product 50, and the intermediate completed product 50 is suspended at a plurality of locations on the inner wall of the cavity 62a. By providing the pin 75 for supporting the state, the resin 70 injected from the resin injection nozzle 65 is filled around the intermediate completed product 50 as shown in the figure, and the entire surface can be sealed with resin. Also in this case, the opening is formed in the terminal portion as described above.
[0027]
The resin used for the resin encapsulation described above is preferably a polyamide-based or polyurethane-based hot melt. In addition, by adjusting the hardness of the resin to be low when cured, an effect of absorbing shock is obtained, and the shock resistance against shocks such as dropping on the battery pack is improved, which is suitable as a power supply for portable electronic devices. It becomes something.
[0028]
【The invention's effect】
As described above, according to the present invention, in a resin-sealing molding apparatus for sealing one surface of a product with a resin, the product can be easily stored and taken out.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a configuration of an intermediate completed product according to an embodiment.
FIG. 2A is a plan view showing the configuration of an intermediate completed product, and FIG.
FIG. 3 is a perspective view showing a completed state of the battery pack.
FIGS. 4A and 4B are plan views showing the configuration of the circuit board, in which FIG.
5 (a) is a top view, FIG. 5 (b) is a side view, and FIG. 5 (c) is a bottom view showing the configuration of the pack case.
FIG. 6 is a cross-sectional view showing the configuration of the resin encapsulation / molding apparatus in cross sections in two orthogonal directions (a) and (b), showing a state of a first step.
FIG. 7 is a sectional view showing a state of a second step of the same.
FIG. 8 is a sectional view showing a state of a second step of the above.
FIG. 9 is a sectional view showing a state of a third step of the above.
10A is a cross-sectional view illustrating a completed state of resin encapsulation molding, and FIG. 10B is a cross-sectional view illustrating a completed state of a battery pack.
FIG. 11 is a cross-sectional view showing a configuration in which the entire surface of the battery pack is resin-sealed.
FIG. 12 is a perspective view showing a configuration and an assembling order of a battery pack having a conventional configuration in the order of (a), (b) and (c).
FIG. 13 is a partial cross-sectional view showing a joined state of a conventional pack case.
[Explanation of symbols]
7 Pack case 50 Intermediate finished product (product)
Reference Signs List 60 resin sealing molding device 62 cavity 62a cavity 63 core 63a filling space 64 spring (elastic member)
65 Resin injection nozzle 66 Gate 70 Resin

Claims (3)

製品の一面に樹脂を充填して製品の一面を樹脂封止する樹脂封止成形装置であって、
前記製品を収容する製品収容体と、樹脂の充填空間につながるゲートとスプルーが形成されたコアと、このコアを製品収容体から離れる方向に付勢する弾性部材と、前記スプルーにノズル先端を当接させ、前記製品を収容した製品収容体に前記弾性部材の付勢に抗してコアを押圧し、ノズルからスプルーとゲートを通じて前記充填空間に樹脂を充填する樹脂注入ノズルとを備え、
前記充填空間は前記製品の一面と前記コアの内面との間に形成され、
製品収容体及びコアは、ゲート位置を衝き合わせ面とする割り型に構成されてなることを特徴とする樹脂封止成形装置。
A resin sealing molding device for filling a resin on one side of the product and sealing the one side of the product with a resin,
A product container for storing the product, a core having a gate and a sprue connected to a resin filling space, an elastic member for urging the core in a direction away from the product container , and a nozzle tip against the sprue. is contact, the press the core against the urging of the elastic member, and a resin injection nozzle for filling the resin into the filling space through the sprue and the gate from the nozzle into the product container containing the said product,
The filling space is formed between one surface of the product and an inner surface of the core,
A resin sealing molding apparatus , wherein the product container and the core are configured in a split mold having a gate position as an abutting surface .
製品は二次電池の樹脂封止前製品である請求項1に記載の樹脂封止成形装置。The resin sealing molding apparatus according to claim 1, wherein the product is a product before resin sealing of a secondary battery. 二次電池の樹脂封止前製品は、製品の構成要素を被うケースを有し、前記ケースによって被覆されていない面が樹脂封止される前記製品の一面に該当することを特徴とする請求項2に記載の樹脂封止成形装置。The pre-resin-sealed product of the secondary battery has a case that covers the components of the product, and a surface not covered by the case corresponds to one surface of the product that is resin-sealed. Item 3. The resin molding apparatus according to Item 2.
JP2000363518A 2000-10-20 2000-11-29 Resin sealing molding equipment Expired - Fee Related JP3576484B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000363518A JP3576484B2 (en) 2000-11-29 2000-11-29 Resin sealing molding equipment
KR1020037005417A KR100822557B1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
DE60142077T DE60142077D1 (en) 2000-10-20 2001-10-19 METHOD AND DEVICE FOR FORMING A HOUSING BODY OF A BATTERY PACK
CNB018175635A CN100456528C (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
US10/362,690 US6881371B2 (en) 2000-10-20 2001-10-19 Method for forming outer packaging body of product
TW090125902A TW507391B (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
PCT/JP2001/009226 WO2002033766A1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
EP01976787A EP1343210B1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of a battery pack

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JP3929839B2 (en) 2001-06-28 2007-06-13 松下電器産業株式会社 Batteries and battery packs
JP4494713B2 (en) 2001-12-04 2010-06-30 パナソニック株式会社 Battery pack
CN100356612C (en) * 2002-02-13 2007-12-19 松下电器产业株式会社 Method of manufacturing battery pack
JP4629952B2 (en) 2002-02-13 2011-02-09 パナソニック株式会社 Manufacturing method of secondary battery
JP4440548B2 (en) 2002-02-13 2010-03-24 パナソニック株式会社 Battery and manufacturing method thereof
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