JP2002166447A - Resin sealing molding apparatus - Google Patents

Resin sealing molding apparatus

Info

Publication number
JP2002166447A
JP2002166447A JP2000363518A JP2000363518A JP2002166447A JP 2002166447 A JP2002166447 A JP 2002166447A JP 2000363518 A JP2000363518 A JP 2000363518A JP 2000363518 A JP2000363518 A JP 2000363518A JP 2002166447 A JP2002166447 A JP 2002166447A
Authority
JP
Japan
Prior art keywords
resin
product
cavity
core
molding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000363518A
Other languages
Japanese (ja)
Other versions
JP3576484B2 (en
Inventor
Yoshinori Iwazono
芳宣 祝園
Shoji Konishi
昭治 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000363518A priority Critical patent/JP3576484B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to US10/362,690 priority patent/US6881371B2/en
Priority to PCT/JP2001/009226 priority patent/WO2002033766A1/en
Priority to CNB018175635A priority patent/CN100456528C/en
Priority to KR1020037005417A priority patent/KR100822557B1/en
Priority to TW090125902A priority patent/TW507391B/en
Priority to EP01976787A priority patent/EP1343210B1/en
Priority to DE60142077T priority patent/DE60142077D1/en
Publication of JP2002166447A publication Critical patent/JP2002166447A/en
Application granted granted Critical
Publication of JP3576484B2 publication Critical patent/JP3576484B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Battery Mounting, Suspending (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing molding apparatus which resin-seals an optional surface of a product to form an exterior body. SOLUTION: A semi-finished article 50 produced by assembling a plurality of components integrally is housed in a pack case 7 with its bottom surface opened, the case 7 is arranged in the cavity 62a of a cavity 62, a mold is closed, a resin injection nozzle 65 is advanced, a core 63 is pushes to the cavity 62 against the bias of a spring 64, a resin is packed in a filling space 63a, and the open bottom surface of the pack case 7 is resin-sealed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、製品の構成要素を
被覆するように溶融させた樹脂を充填して、硬化させた
樹脂により製品を封止した外装体を形成する樹脂封止成
形装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing molding apparatus for filling a resin melted so as to cover components of a product and forming an exterior body in which the product is sealed with the cured resin. Things.

【0002】[0002]

【従来の技術】携帯電子機器のような製品では、使用環
境が一定になく、移動を伴うため小型化、薄型化、軽量
化が要求されると同時に防塵、防滴構造あるいは耐落
下、耐衝撃性が要求される。これらの要求を満たすため
には、製品の外装体の構造が重要な要素となる。図12
は、製品の一例であり、携帯電子機器の電源として用い
られる電池パックの構成例を示すもので、二次電池80
と、電池保護回路等を構成した回路基板84とを外装体
内に収容して、携帯電子機器の電源としての要求に応え
ている。
2. Description of the Related Art In a product such as a portable electronic device, the use environment is not constant, and it is required to be reduced in size, thickness and weight due to movement, and at the same time, it is required to have a dust-proof, drip-proof structure or drop-proof, shock-resistant. Is required. In order to satisfy these requirements, the structure of the outer package of the product is an important factor. FIG.
Is an example of a product, and shows a configuration example of a battery pack used as a power source of a portable electronic device.
And a circuit board 84 including a battery protection circuit and the like are housed in an exterior body to meet a demand as a power source of a portable electronic device.

【0003】この電池パックの外装体は下ケース82と
上ケース83とからなるパックケースで構成されてい
る。図12(a)に示すように、下ケース82内に電池
保護回路を構成した回路基板84や入出力端子、接続板
等を配置し、その上に、図12(b)に示すように、リ
チウムイオン二次電池として構成された二次電池80を
配置して、二次電池80を接続板に接合する。次に、図
12(c)に示すように、電池80に両面テープ85を
貼着し、下ケース82に上ケース83を接合して電池パ
ックが完成する。
[0003] The exterior body of this battery pack is composed of a pack case composed of a lower case 82 and an upper case 83. As shown in FIG. 12A, a circuit board 84 constituting a battery protection circuit, an input / output terminal, a connection plate, and the like are arranged in a lower case 82, and, as shown in FIG. The secondary battery 80 configured as a lithium ion secondary battery is arranged, and the secondary battery 80 is joined to the connection plate. Next, as shown in FIG. 12C, a double-sided tape 85 is attached to the battery 80, and the upper case 83 is joined to the lower case 82 to complete the battery pack.

【0004】前記下ケース82と上ケース83との接合
は、両者の周縁部で超音波接合等によりなされる。超音
波接合の場合は、図13に示すように、下ケース82の
周縁部に形成された突出部82aを上ケース83の周縁
部に形成された凹部83a内に嵌入させ、突出部82a
の先端と凹部83aの底との間で超音波溶接する。この
接合構造により溶融した樹脂が外部に露出することがな
い。
The lower case 82 and the upper case 83 are joined at their peripheral edges by ultrasonic joining or the like. In the case of ultrasonic bonding, as shown in FIG. 13, the protrusion 82 a formed on the peripheral edge of the lower case 82 is fitted into the recess 83 a formed on the peripheral edge of the upper case 83, and the protrusion 82 a
Is ultrasonically welded between the tip of the groove and the bottom of the recess 83a. With this joint structure, the molten resin is not exposed to the outside.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
外装体の構成では分割されたケースを接合する構造が不
可欠であり、上記従来例では下ケース82に上ケース8
3を接合するために両ケース82、83の側周面の厚さ
が必要となり、パックケース即ち電池パックとしての体
積増、重量増が伴う課題があった。
However, in the structure of the conventional exterior body, a structure for joining the divided cases is indispensable. In the above conventional example, the upper case 8 is connected to the lower case 82.
The thickness of the side peripheral surfaces of both cases 82 and 83 is required in order to join 3, and there is a problem that the volume and weight of the pack case, that is, the battery pack, increase.

【0006】また、パックケースはハードケースであ
り、下ケース82に上ケース83を接合し、入出力端子
を外部に露出させる必要があるため、微小な隙間が随所
に発生し、防塵、防滴構造に構成することが困難であ
り、落下により破損しやすい構造であった。
The pack case is a hard case, and it is necessary to join the upper case 83 to the lower case 82 and expose the input / output terminals to the outside. It was difficult to construct a structure, and the structure was easily damaged by falling.

【0007】本発明が目的とするところは、製品の内部
構成要素を薄い外装体で隙間なく覆って小型化、軽量化
と共に防塵、防滴構造を実現するための樹脂封止成形装
置を提供することにある。
An object of the present invention is to provide a resin-sealing molding apparatus for realizing a dust-proof and drip-proof structure as well as miniaturization and weight reduction by completely covering the internal components of a product with a thin exterior body. It is in.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
の本発明は、製品の所要面に樹脂を充填して製品を樹脂
封止する樹脂封止成形装置であって、前記製品を収容す
るキャビティと、樹脂の充填空間につながるゲートが形
成されたコアと、このコアをキャビティから離れる方向
に付勢する弾性部材と、前記ゲートにノズル先端を当接
させ、前記空洞内に製品を収容したキャビティに前記弾
性部材の付勢に抗してコアを押圧し、ノズルからゲート
を通じて前記充填空間に樹脂を充填する樹脂注入ノズル
と、を備えてなることを特徴とする。
According to the present invention, there is provided a resin-sealing molding apparatus for filling a required surface of a product with a resin and sealing the product with a resin. A cavity, a core formed with a gate connected to a space filled with resin, an elastic member for urging the core in a direction away from the cavity, and a nozzle tip contacting the gate to accommodate a product in the cavity. A resin injection nozzle that presses the core against the cavity against the bias of the elastic member and fills the filling space with the resin from the nozzle through the gate.

【0009】上記樹脂封止成形装置によれば、キャビテ
ィ内に製品を収容して樹脂注入ノズルを進出させるとコ
アは弾性部材の付勢に抗してキャビティに押圧されて金
型が閉じられるので、樹脂注入ノズルから樹脂を注入す
ると、樹脂は充填空間内に充填される。製品の樹脂封止
する所要面を充填空間に面するようにキャビティ内に収
容すると製品は樹脂封止される。また、樹脂注入ノズル
の進出動作によりキャビティとコアとの間が閉じられる
ので、製品の収容、取り出しが容易となる。
According to the above resin encapsulation / molding apparatus, when the product is accommodated in the cavity and the resin injection nozzle is advanced, the core is pressed by the cavity against the bias of the elastic member and the mold is closed. When the resin is injected from the resin injection nozzle, the resin is filled in the filling space. When the required surface of the product to be sealed with resin is accommodated in the cavity so as to face the filling space, the product is sealed with resin. Further, the space between the cavity and the core is closed by the advance operation of the resin injection nozzle, so that the product can be easily stored and taken out.

【0010】上記構成において、キャビティ及びコア
は、ゲート位置を衝き合わせ面とする割り型に構成する
ことができ、金型内への製品の出し入れが容易であり、
ゲート部分に生じるアンダーカットにも対応することが
できる。
In the above configuration, the cavity and the core can be configured as a split mold having a gate position as an abutting surface, so that a product can be easily taken in and out of the mold.
It is possible to cope with an undercut generated in the gate portion.

【0011】また、製品をその所要面を覆うケース内に
収容し、ケースに被覆されていない面に充填空間を形成
すると、製品の任意面を樹脂封止することができ、ケー
スと製品との間の隙間にも樹脂が充填されるので、ケー
スの薄型化による製品の小型化や密閉性を図ることがで
きる。
Further, when the product is accommodated in a case covering the required surface and a filling space is formed on a surface not covered by the case, an arbitrary surface of the product can be sealed with a resin, and the case and the product can be sealed. Since the resin is filled also in the gap between them, it is possible to reduce the size and seal of the product by reducing the thickness of the case.

【0012】また、製品をその外面と所定間隔を設けて
キャビティ及びコア内に宙吊り状態に支持し、製品の全
面に充填空間を設けて樹脂を充填すると、製品の全面を
樹脂封止することができる。
When the product is suspended in the cavity and the core at a predetermined distance from the outer surface of the product and is filled with resin by providing a filling space on the entire surface of the product, the entire surface of the product can be sealed with resin. it can.

【0013】[0013]

【発明の実施の形態】以下、添付図面を参照して本発明
の実施形態について説明し、本発明の理解に供する。
尚、以下に示す実施形態は本発明を具体化した一例であ
って、本発明の技術的範囲を限定するものではない。
Embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.

【0014】以下に示す実施形態は、電池パック(製
品)の内装物を封止するパックケースに適用した例を示
すものである。電池パックは、図1に示すように、扁平
形のリチウムイオン二次電池に構成された二次電池1
と、この二次電池1を過充電、過放電等から保護する電
池保護回路を構成した回路基板9とを一体に組み合わせ
て、図2に示すような中間完成品50を形成し、この中
間完成品50を図3に示すようにパックケース7内に収
容し、パックケース7の開放端を樹脂封止して二次電池
1の形態を損なうことなく電池パックに構成したもので
ある。
The embodiment described below shows an example in which the present invention is applied to a pack case for sealing the interior of a battery pack (product). As shown in FIG. 1, the battery pack includes a secondary battery 1 configured as a flat lithium ion secondary battery.
And a circuit board 9 which constitutes a battery protection circuit for protecting the secondary battery 1 from overcharge, overdischarge, etc., to form an intermediate completed product 50 as shown in FIG. The product 50 is housed in the pack case 7 as shown in FIG. 3, and the open end of the pack case 7 is sealed with a resin to form a battery pack without impairing the form of the secondary battery 1.

【0015】図1は、前記中間完成品50を分解して示
すもので、二次電池1の封口部側に、この二次電池1の
正極端子25に接合される接続板11、二次電池1上に
配設されて回路基板9の座面を提供するスペーサ12、
電池保護回路を構成すると共にプラス端子4、マイナス
端子5及び温度検出端子6を形成した回路基板9が配設
され、二次電池1の負極を構成する電池缶31の底面か
ら側面に延出するリード板10が配設されている。
FIG. 1 is an exploded view of the intermediate completed product 50. A connection plate 11 joined to a positive electrode terminal 25 of the secondary battery 1 is provided on the side of a sealing portion of the secondary battery 1; A spacer 12 disposed on 1 to provide a seating surface for the circuit board 9;
A circuit board 9, which forms a battery protection circuit and has a positive terminal 4, a negative terminal 5, and a temperature detection terminal 6, is provided, and extends from the bottom surface to the side surface of the battery can 31 constituting the negative electrode of the secondary battery 1. A lead plate 10 is provided.

【0016】前記二次電池1の正極端子25に、Lの字
状に形成された接続板11の基部11bが接合され、電
池缶31の底面には、リード板10の基部10bが接合
され、リード部10aは電池缶31の側面に沿って封口
部側に延出される。
A base 11b of an L-shaped connecting plate 11 is joined to a positive electrode terminal 25 of the secondary battery 1, and a base 10b of a lead plate 10 is joined to a bottom surface of a battery can 31. The lead portion 10a extends toward the sealing portion along the side surface of the battery can 31.

【0017】また、二次電池1の封口部側には、図2に
示すようにスペーサ12が取り付けられる。スペーサ1
2は二次電池1上に位置決め嵌合され、負極である電池
缶31との間の絶縁性が強化される。また、接続板11
のリード部11aと、リード板10のリード部10aと
は、スペーサ12及び回路基板9を通して回路基板9上
に接合される。回路基板9の封口部側に実装された電子
部品はスペーサ12の開口部内に収容されるので、回路
基板9はその基板の厚さとスペーサ12の厚さとを加え
た高さだけで二次電池1上に積層された状態となり、電
池保護回路を設けることによる高さの増加が抑制され
る。
Further, a spacer 12 is attached to the sealing portion side of the secondary battery 1 as shown in FIG. Spacer 1
Numeral 2 is positioned and fitted on the secondary battery 1 to enhance the insulation between the secondary battery 1 and the battery can 31, which is the negative electrode. Also, the connection plate 11
And the lead portion 10a of the lead plate 10 are joined onto the circuit board 9 through the spacer 12 and the circuit board 9. Since the electronic components mounted on the sealing portion side of the circuit board 9 are accommodated in the opening of the spacer 12, the circuit board 9 has a height of the sum of the thickness of the board and the thickness of the spacer 12 alone. It becomes a state of being stacked on top, and an increase in height due to the provision of the battery protection circuit is suppressed.

【0018】図4は、回路基板9の表裏両面に形成され
た回路パターンを示すもので、基板上に電池保護回路と
入出力端子とが構成されている。図4(b)に示すよう
に、回路基板9の裏面側(スペーサ12側)には電池保
護回路が構成され、図4(a)に示すように、表面側に
はプラス端子用導体パターン4a、マイナス端子用導体
パターン5a及び温度検出端子用導体パターン6aと、
接続板11を接続するための接続板用導体パターン15
及びリード板10を接続するためのリード板用導体パタ
ーン16とが形成されている。この両面に形成された回
路パターンは要所でスルーホール30によって接続され
ている。この回路基板9に形成されたリード通し穴20
から接続板11のリード部11aを通し、リード部11
aを接続板用導体パターン15上に折り曲げてハンダ付
けする。また、リード板10のリード部10aをリード
板用導体パターン16上に折り曲げてハンダ付けする。
この接続板11及びリード板10がハンダ付けされるこ
とにより、回路基板9はスペーサ12上に固定される。
FIG. 4 shows a circuit pattern formed on both the front and back surfaces of the circuit board 9, on which a battery protection circuit and input / output terminals are formed. As shown in FIG. 4 (b), a battery protection circuit is formed on the back side (spacer 12 side) of the circuit board 9, and as shown in FIG. 4 (a), the positive terminal conductor pattern 4a is formed on the front side. A negative terminal conductor pattern 5a and a temperature detection terminal conductor pattern 6a,
Connection plate conductor pattern 15 for connecting connection plate 11
In addition, a lead plate conductor pattern 16 for connecting the lead plate 10 is formed. The circuit patterns formed on both sides are connected at important points by through holes 30. The lead through hole 20 formed in the circuit board 9
Through the lead portion 11a of the connection plate 11, and
a is bent over the connection plate conductor pattern 15 and soldered. Further, the lead portion 10a of the lead plate 10 is bent over the lead plate conductor pattern 16 and soldered.
The circuit board 9 is fixed on the spacer 12 by soldering the connection plate 11 and the lead plate 10.

【0019】図4(a)に示すように、回路基板9の表
面側に形成されたプラス端子用導体パターン4a上には
プラス端子4、マイナス端子用導体パターン5a上には
マイナス端子5、温度検出端子用導体パターン6a上に
は温度検出端子6が接合される。これらの端子は、銅ニ
ッケル合金の板材もしくはこの銅ニッケル合金の板材と
ステンレス鋼とのクラッド材等を用いることにより、導
電性、接合性、耐蝕性に優れたものとなる。また、端子
として板材を接合することなく、各導体パターンに金メ
ッキを施してそのまま端子として利用することもでき
る。
As shown in FIG. 4A, the plus terminal 4 is formed on the plus terminal conductor pattern 4a formed on the front side of the circuit board 9, and the minus terminal 5 is formed on the minus terminal conductor pattern 5a. The temperature detection terminal 6 is joined onto the detection terminal conductor pattern 6a. By using a copper-nickel alloy plate or a clad material of the copper-nickel alloy and stainless steel, these terminals are excellent in conductivity, bonding property, and corrosion resistance. Also, each conductor pattern can be plated with gold and used as a terminal without joining a plate material as a terminal.

【0020】上記のように二次電池1に回路基板9を取
り付けることにより、図2に示したように、中間完成品
50が形成される。この中間完成品50は、図5(a)
に示すように、上面13にプラス端子窓4c、マイナス
端子窓5c、温度検出端子窓6cが設けられ、図5
(c)に示すように底部14が開放されたパックケース
7内に、図5(b)に示すように収容され、底部14を
以下に示す樹脂封止成形装置60によって樹脂封止する
ことにより中間完成品50はパックケース7内に密閉さ
れる。
By attaching the circuit board 9 to the secondary battery 1 as described above, an intermediate completed product 50 is formed as shown in FIG. This intermediate product 50 is shown in FIG.
As shown in FIG. 5, a plus terminal window 4c, a minus terminal window 5c, and a temperature detection terminal window 6c are provided on the upper surface 13.
As shown in FIG. 5B, the bottom 14 is housed in the pack case 7 having the bottom 14 opened as shown in FIG. 5C, and the bottom 14 is resin-sealed by a resin-sealing molding device 60 described below. The intermediate completed product 50 is sealed in the pack case 7.

【0021】図6〜図9は、樹脂封止成形装置60によ
る樹脂封止の各工程を順に示すもので、各図(a)
(b)に金型部分を直交する2方向の断面で示してい
る。
FIGS. 6 to 9 show the respective steps of resin sealing by the resin sealing molding apparatus 60 in order.
(B) shows a cross section of the mold portion in two orthogonal directions.

【0022】図6において、成形金型を構成するキャビ
ティ62及びコア63は割り型構造に形成して、中間完
成品50の出し入れを可能にすると共に、ゲート部分の
スプルー67によって生じるアンダーカットに対応でき
るようにしている。キャビティ62には空洞62aが形
成され、コア63には樹脂の充填空間63aと、この充
填空間63aにつながるゲート66と、このゲート66
につながるスプルー67とが形成されている。また、コ
ア63はスプリング(弾性部材)64によってキャビテ
ィ62から離れる方向に付勢されている。図示するよう
にキャビティ62を開き、パックケース7を被せた中間
完成品50を、その開放端をコア63側にして空洞62
a内に挿入する。
In FIG. 6, the cavity 62 and the core 63 constituting the molding die are formed in a split mold structure so that the intermediate finished product 50 can be taken in and out, and the undercut caused by the sprue 67 in the gate portion can be accommodated. I can do it. A cavity 62 a is formed in the cavity 62, a resin filling space 63 a in the core 63, a gate 66 connected to the filling space 63 a,
Are formed. The core 63 is urged by a spring (elastic member) 64 in a direction away from the cavity 62. As shown, the cavity 62 is opened and the intermediate product 50 covered with the pack case 7 is placed in the cavity 62 with its open end facing the core 63.
Insert into a.

【0023】次に、図7に示すように、キャビティ62
及びコア63を閉じ、樹脂注入ノズル65をキャビティ
62側に進出させることにより、コア63をスプリング
64の付勢に抗してキャビティ62に押圧させる。図8
に示すように、キャビティ62にコア63が密着し、パ
ックケース7の開放端上にコア63に形成された充填空
間63aが位置するので、樹脂注入ノズル65から樹脂
70をスプルー67内に吐出すると、樹脂70はゲート
66を通じて充填空間63a内に充填される。この樹脂
70の充填によりパックケース7の開放端は樹脂封止さ
れる。また、充填された樹脂70はパックケース7と中
間完成品50との間の隙間にも侵入するので、パックケ
ース7と中間完成品50とは一体化され、パックケース
7を薄い樹脂成形品によって構成しても強度が補われ、
電池パックを小型化することができる。
Next, as shown in FIG.
Then, the core 63 is closed and the resin injection nozzle 65 is advanced toward the cavity 62, whereby the core 63 is pressed against the cavity 62 against the bias of the spring 64. FIG.
As shown in FIG. 7, the core 63 is in close contact with the cavity 62 and the filling space 63 a formed in the core 63 is located on the open end of the pack case 7. The resin 70 is filled into the filling space 63a through the gate 66. The filling of the resin 70 seals the open end of the pack case 7 with the resin. Further, since the filled resin 70 also enters the gap between the pack case 7 and the intermediate completed product 50, the pack case 7 and the intermediate completed product 50 are integrated, and the pack case 7 is formed by a thin resin molded product. Even if it composes, strength is supplemented,
The battery pack can be downsized.

【0024】充填した樹脂70を硬化させた後、図9に
示すように、キャビティ62及びコア63を開き、樹脂
注入ノズル65を後退させると樹脂封止成形された電池
パックを取り出すことができる。成形された樹脂70
は、図10(a)に示すように、ゲート66及びスプル
ー67によって作られた不要部分70aが残っているの
で、これを切り取ることにより、図10(b)に示すよ
うに、パックケース7と樹脂70によって中間完成品5
0を被覆した電池パックが完成する。
After the filled resin 70 is cured, the cavity 62 and the core 63 are opened and the resin injection nozzle 65 is retracted as shown in FIG. Molded resin 70
As shown in FIG. 10 (a), the unnecessary portion 70a formed by the gate 66 and the sprue 67 remains as shown in FIG. 10 (a). Intermediate finished product 5 by resin 70
Thus, a battery pack coated with 0 is completed.

【0025】以上説明した樹脂封止成形装置60は、開
放されたパックケース7の底部を樹脂封止するように構
成しているが、上面を開放端とするケース内に中間完成
品50を挿入し、端子部分に開口部を形成して上面を樹
脂封止するように構成することもできる。これはコア6
3の充填空間63aに端子部分に当接する突出部を形成
することにより実施することができる。
The resin sealing and molding apparatus 60 described above is configured to seal the opened bottom portion of the pack case 7 with resin, but inserts the intermediate completed product 50 into a case having an open end on the upper surface. Alternatively, an opening may be formed in the terminal portion to seal the upper surface with resin. This is core 6
The third filling space 63a can be implemented by forming a protruding portion in contact with the terminal portion.

【0026】また、図11に示すように、キャビティ6
2に形成する空洞62aを、その容積が中間完成品50
の周囲に間隙ができるサイズに形成し、空洞62aの内
壁の複数箇所に中間完成品50を宙吊り状態に支持する
ピン75を設けて構成することにより、樹脂注入ノズル
65から注入された樹脂70は図示するように中間完成
品50の周囲に充填され、全面を樹脂封止することがで
きる。この場合にも前述のように端子部分に開口部が形
成されるようにする。
Further, as shown in FIG.
2, the volume of the intermediate completed product 50 is
Is formed in such a size that a gap is formed around the periphery thereof, and pins 75 for supporting the intermediate completed product 50 in a suspended state are provided at a plurality of positions on the inner wall of the cavity 62a, so that the resin 70 injected from the resin injection nozzle 65 As shown in the figure, the resin is filled around the intermediate completed product 50, and the entire surface can be sealed with resin. Also in this case, the opening is formed in the terminal portion as described above.

【0027】以上説明した樹脂封止成形に用いる樹脂
は、ポリアミド系、ポリウレタン系のホットメルトが好
適なものとなる。また、樹脂を硬化させたときの硬度が
低くなるように調整することにより、衝撃吸収の効果が
得られ、電池パックに落下等の衝撃に対する耐衝撃性が
向上し、携帯電子機器の電源として好適なものとなる。
As the resin used in the resin encapsulation described above, a polyamide-based or polyurethane-based hot melt is suitable. In addition, by adjusting the hardness of the resin to be low when cured, an effect of absorbing shock is obtained, and the shock resistance against shocks such as dropping on the battery pack is improved, which is suitable as a power supply for portable electronic devices. It becomes something.

【0028】[0028]

【発明の効果】以上の説明の通り本発明によれば、製品
の任意外面を樹脂封止することができ、外装体を薄く構
成することができるので、製品の小型化を向上させるこ
とができる。また、製品を密閉構造に被覆することがで
きるので、防塵、防滴構造に構成することができ、携帯
電子機器等に適用するのに好適なものとなる。
As described above, according to the present invention, an arbitrary outer surface of a product can be sealed with a resin, and the outer body can be made thin, so that the size of the product can be reduced. . Further, since the product can be covered in a sealed structure, it can be configured in a dustproof and drip-proof structure, which is suitable for application to portable electronic devices and the like.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施形態に係る中間完成品の構成を示す分解斜
視図。
FIG. 1 is an exploded perspective view showing a configuration of an intermediate completed product according to an embodiment.

【図2】中間完成品の構成を示す(a)は平面図、
(b)端側面図。
FIG. 2A is a plan view showing the configuration of an intermediate completed product.
(B) End side view.

【図3】電池パックの完成状態を示す斜視図。FIG. 3 is a perspective view showing a completed state of the battery pack.

【図4】回路基板の構成を示す(a)は表面側、(b)
は裏面側の平面図。
FIGS. 4A and 4B show the configuration of a circuit board, FIG.
Is a plan view of the back side.

【図5】パックケースの構成を示す(a)は上面図、
(b)は側面図、(c)は底面図。
5A is a top view showing the configuration of the pack case, FIG.
(B) is a side view, (c) is a bottom view.

【図6】樹脂封止成形装置の構成を直交する2方向
(a)(b)の断面で示し、第1工程の状態を示す断面
図。
FIG. 6 is a cross-sectional view showing the configuration of the resin encapsulation molding apparatus in cross sections in two orthogonal directions (a) and (b), showing a state of a first step.

【図7】同上第2工程の状態を示す断面図。FIG. 7 is a sectional view showing a state of a second step of the above.

【図8】同上第2工程の状態を示す断面図。FIG. 8 is a sectional view showing a state of a second step of the same.

【図9】同上第3工程の状態を示す断面図。FIG. 9 is a sectional view showing a state of a third step of the above.

【図10】(a)は樹脂封止成形の完了状態、(b)は
電池パックの完成状態を示す断面図。
10A is a cross-sectional view illustrating a completed state of the resin sealing molding, and FIG. 10B is a cross-sectional view illustrating a completed state of the battery pack.

【図11】電池パックの全面を樹脂封止する構成を示す
断面図。
FIG. 11 is a cross-sectional view showing a configuration in which the entire surface of the battery pack is resin-sealed.

【図12】従来構成になる電池パックの構成と組み立て
順序を(a)(b)(c)の順に示す斜視図。
FIG. 12 is a perspective view showing a configuration and an assembling order of a battery pack having a conventional configuration in the order of (a), (b) and (c).

【図13】従来構成になるパックケースの接合状態を示
す部分断面図。
FIG. 13 is a partial cross-sectional view showing a joined state of a conventional pack case.

【符号の説明】[Explanation of symbols]

7 パックケース 50 中間完成品(製品) 60 樹脂封止成形装置 62 キャビティ 62a 空洞 63 コア 63a 充填空間 64 スプリング(弾性部材) 65 樹脂注入ノズル 66 ゲート 70 樹脂 7 Pack case 50 Intermediate finished product (product) 60 Resin sealing molding device 62 Cavity 62a Cavity 63 Core 63a Filling space 64 Spring (elastic member) 65 Resin injection nozzle 66 Gate 70 Resin

フロントページの続き Fターム(参考) 4F202 AD02 AH37 CA11 CB01 CB17 CK06 CK54 4F206 AD02 AH37 JA07 JB17 JL02 JN14 JQ55 JQ81 5H040 AA01 AA32 AA33 AY08 JJ01 JJ10 Continued on the front page F term (reference) 4F202 AD02 AH37 CA11 CB01 CB17 CK06 CK54 4F206 AD02 AH37 JA07 JB17 JL02 JN14 JQ55 JQ81 5H040 AA01 AA32 AA33 AY08 JJ01 JJ10

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 製品の所要面に樹脂を充填して製品を樹
脂封止する樹脂封止成形装置であって、 前記製品を収容するキャビティと、樹脂の充填空間につ
ながるゲートが形成されたコアと、このコアをキャビテ
ィから離れる方向に付勢する弾性部材と、前記ゲートに
ノズル先端を当接させ、前記空洞内に製品を収容したキ
ャビティに前記弾性部材の付勢に抗してコアを押圧し、
ノズルからゲートを通じて前記充填空間に樹脂を充填す
る樹脂注入ノズルと、を備えてなることを特徴とする樹
脂封止成形装置。
1. A resin molding apparatus for filling a required surface of a product with a resin and sealing the product with a resin, wherein a core having a cavity for accommodating the product and a gate connected to a space filled with the resin is formed. And an elastic member for urging the core in a direction away from the cavity, and a nozzle tip contacting the gate to press the core against the urging of the elastic member against the cavity containing the product in the cavity. And
A resin injection nozzle for filling the filling space with a resin from a nozzle through a gate.
【請求項2】 キャビティ及びコアは、ゲート位置を衝
き合わせ面とする割り型に構成されてなる請求項1に記
載の樹脂封止成形装置。
2. The resin-sealing molding apparatus according to claim 1, wherein the cavity and the core are configured as a split mold having a gate position as an abutting surface.
【請求項3】 製品をその所要面を覆うケース内に収容
し、ケースに被覆されていない面に対応する位置に充填
空間が形成されてなる請求項1または2に記載の樹脂封
止成形装置。
3. The resin sealing and molding apparatus according to claim 1, wherein the product is accommodated in a case covering a required surface thereof, and a filling space is formed at a position corresponding to a surface not covered by the case. .
【請求項4】 製品をその外面と所定間隔を設けてキャ
ビティ及びコア内に宙吊り状態に支持し、製品の全面に
充填空間が設けられてなる請求項1または2に記載の樹
脂封止成形装置。
4. The resin sealing and molding apparatus according to claim 1, wherein the product is supported in a suspended state in the cavity and the core with a predetermined distance from the outer surface thereof, and a filling space is provided on the entire surface of the product. .
JP2000363518A 2000-10-20 2000-11-29 Resin sealing molding equipment Expired - Fee Related JP3576484B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000363518A JP3576484B2 (en) 2000-11-29 2000-11-29 Resin sealing molding equipment
PCT/JP2001/009226 WO2002033766A1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
CNB018175635A CN100456528C (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
KR1020037005417A KR100822557B1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
US10/362,690 US6881371B2 (en) 2000-10-20 2001-10-19 Method for forming outer packaging body of product
TW090125902A TW507391B (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of product
EP01976787A EP1343210B1 (en) 2000-10-20 2001-10-19 Method and device for forming outer package body of a battery pack
DE60142077T DE60142077D1 (en) 2000-10-20 2001-10-19 METHOD AND DEVICE FOR FORMING A HOUSING BODY OF A BATTERY PACK

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000363518A JP3576484B2 (en) 2000-11-29 2000-11-29 Resin sealing molding equipment

Publications (2)

Publication Number Publication Date
JP2002166447A true JP2002166447A (en) 2002-06-11
JP3576484B2 JP3576484B2 (en) 2004-10-13

Family

ID=18834620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000363518A Expired - Fee Related JP3576484B2 (en) 2000-10-20 2000-11-29 Resin sealing molding equipment

Country Status (1)

Country Link
JP (1) JP3576484B2 (en)

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JP2004006213A (en) * 2002-03-22 2004-01-08 Matsushita Electric Ind Co Ltd Battery pack
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US6861821B2 (en) 2001-06-28 2005-03-01 Matsushita Electric Industrial Co., Ltd. Battery with resin integrated resin substrate
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US7597994B2 (en) 2001-12-04 2009-10-06 Panasonic Corporation Battery pack
JP2009241317A (en) * 2008-03-29 2009-10-22 Sanyo Electric Co Ltd Mold for insert molding and method for manufacturing resin molded body using this mold
US7759001B2 (en) 2002-02-13 2010-07-20 Panasonic Corporation Battery and method of manufacturing the battery
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US6861821B2 (en) 2001-06-28 2005-03-01 Matsushita Electric Industrial Co., Ltd. Battery with resin integrated resin substrate
US7597994B2 (en) 2001-12-04 2009-10-06 Panasonic Corporation Battery pack
US7972721B2 (en) 2002-02-13 2011-07-05 Panasonic Corporation Method for manufacturing battery pack
JP2003308815A (en) * 2002-02-13 2003-10-31 Matsushita Electric Ind Co Ltd Battery pack and its manufacturing method
US7759001B2 (en) 2002-02-13 2010-07-20 Panasonic Corporation Battery and method of manufacturing the battery
EP1487032A1 (en) * 2002-02-13 2004-12-15 Matsushita Electric Industrial Co., Ltd. Battery pack manufacturing method
US7927386B2 (en) 2002-02-13 2011-04-19 Matsushita Electric Industrial Co., Ltd. Method for manufacturing a battery pack
JP4629952B2 (en) * 2002-02-13 2011-02-09 パナソニック株式会社 Manufacturing method of secondary battery
US7429432B2 (en) 2002-02-13 2008-09-30 Matsushita Electric Industrial Co. Ltd. Battery pack having circuit substrate resin molded to battery
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JP2011023369A (en) * 2002-02-13 2011-02-03 Panasonic Corp Battery pack
JP2004006213A (en) * 2002-03-22 2004-01-08 Matsushita Electric Ind Co Ltd Battery pack
JP4589596B2 (en) * 2002-03-22 2010-12-01 パナソニック株式会社 Battery pack
US7248021B2 (en) 2002-03-22 2007-07-24 Matsushita Electric Industrial Co., Ltd. Battery pack with resin integrated substrate and vent
US7951505B2 (en) 2004-04-27 2011-05-31 Panasonic Corporation Fuel cell system that supplies to individual cells of a fuel cell stack independently
JP2006093152A (en) * 2004-09-22 2006-04-06 Samsung Sdi Co Ltd Battery pack case
US8778529B2 (en) 2004-11-29 2014-07-15 Samsung Sdi Co., Ltd. Lithium secondary battery
JP2006156402A (en) * 2004-11-29 2006-06-15 Samsung Sdi Co Ltd Lithium secondary battery
JP2008117654A (en) * 2006-11-06 2008-05-22 Sony Corp Battery pack
JP2009241317A (en) * 2008-03-29 2009-10-22 Sanyo Electric Co Ltd Mold for insert molding and method for manufacturing resin molded body using this mold
KR101146214B1 (en) 2011-03-22 2012-05-11 삼성테크윈 주식회사 Method for forming waterproof structure of intermediate case member
CN108461285A (en) * 2017-12-29 2018-08-28 安徽瀚宇电气有限公司 A kind of anti-bulge self-healing locomotive capacitor of buffer-type
CN108461285B (en) * 2017-12-29 2023-07-11 安徽瀚宇电气有限公司 Buffer type bulge-preventing self-healing locomotive capacitor
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