JP3573523B2 - Molding equipment - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to a molding apparatus in which a part for supplying a molding resin is improved.
[0002]
[Prior art]
For example, in a semiconductor component, a lead frame in which a semiconductor chip is mounted and a required wire bonding is performed is sealed in a resin package.
FIG. 9 shows an apparatus for molding such a resin package. The molding resin transport section 2 transports the molding resin 1, the lead frame transport section 4 transports the lead frame 3, and the transported molding section. A loader 5 for transferring the resin 1 and the lead frame 3; a molding unit 7 having a mold 6 for molding a resin package for encapsulating a semiconductor chip on the lead frame 3 with the transferred molding resin 1 by, for example, transfer molding; An unloader 9 for unloading 8, an unnecessary material break 10 for removing unnecessary materials such as runners and gates from the resin package of the molded product 8, and a product storage unit 13 for storing the product 11 from which unnecessary materials have been removed in a cassette 12. .
[0003]
In such a molding apparatus, a supply holder 14 shown in FIG. 10 and FIG. The supply holder 14 is provided with a required number of holding holes 15 for accommodating the molding resin 1, and is provided with insertion holes 16 at respective bottoms thereof.
[0004]
In this configuration, the short columnar molding resins 1 aligned by the parts feeder 17 shown in FIG. 9 are respectively charged into the holding holes 15 by a charging mechanism (not shown).
Next, as shown in FIG. 12, the supply holder 14 is located below the cylindrical molding resin guide 18 and the loader 5 is located above the molding resin guide 18 by a moving mechanism (not shown). You.
In this state, the push-up bar 19 is lifted from below the supply holder 14 by a drive mechanism (not shown), passes through the insertion hole 16, and pushes up the molding resin 1 stored in the holding hole 15.
[0005]
The push-up bar 19 further rises and pushes the molding resin 1 from the molding resin guide 18 into the transfer holder 20 provided on the loader 5 as shown in FIG.
Then, the shutter 21 provided on the transfer holder 20 is closed to hold the molding resin 1.
Thereafter, the push-up bar 19 descends, passes through the inside of the molding resin guide 18 and the inside of the supply holder 14 in order from the inside of the transfer holder 20, and when the supply holder 14 reaches the lower limit position, the supply holder 14 It is returned to the resin charging position.
[0006]
Note that the loader 5 shown in FIG. 9 has a plurality of rows of transfer holders 20. In this case, the supply operation of the molding resin 1 described above is repeatedly performed. The loader 5 having the molding resin 1 supplied to the entire transfer holder 20 is thereafter moved to a position on the mold 6 of the molding section 7 by a moving mechanism (not shown), where the shutter 21 is opened. The molding resin 1 is put into the mold 6 from the transfer holder 20, and the above-mentioned molding resin 1 is used to mold the resin package.
[0007]
[Problems to be solved by the invention]
In the above-mentioned conventional molding apparatus, the supply holder 14 cannot move while the push-up bar 19 is inserted (see FIG. 13). For this reason, the push-up rod 19 pushes the molding resin 1 from the supply holder 14 into the molding resin guide 18 and further into the transfer holder 20 of the loader 5, and the shutter 21 is closed, so that the push-up rod 19 is closed. The supply holder 14 cannot be returned to the molding resin charging position until the first through the inside of the transfer holder 20 and the inside of the molding resin guide 18 and the supply holder 14. Therefore, a long series of operation time for supplying the molding resin 1 is required, and there is a problem that productivity is low.
[0008]
Further, when the molding resin 1 is not properly supplied to the supply holder 14 due to clogging of the parts feeder 17 or the like, or when the supply holder 14 fails to store the molding resin 1, furthermore, when the molding resin 1 Even when the molding resin 1 is removed, the operation of transferring the molding resin 1 to the loader 5 is performed as it is, so that the molding operation is performed without supplying a part or all of the molding resin 1 to the molding unit 7. However, there is also a problem that a mold failure is caused.
[0009]
The present invention has been made in view of the above-described circumstances, and accordingly, has as its object to provide a molding apparatus capable of improving productivity by shortening a series of operation times for supplying a molding resin. It is another object of the present invention to provide a molding apparatus which can prevent a molding operation from being performed without a part or all of a molding resin being supplied to a molding section, and can solve the problem of defective molding.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, in the molding apparatus of the present invention, first, after holding and transporting the molding resin by a supply holder, the molding resin is transferred from the supply holder to a loader by a push-up rod. Further, in the apparatus to be transferred to a mold and molded, the supply holder is provided with a holding hole for accommodating a molding resin, and an insertion hole communicating with the holding hole and allowing the push-up rod to pass therethrough. with an opening which makes it possible to leave through relatively lifting rod in that direction provided released from the insertion hole in a direction perpendicular to the moving direction of the push-up rod, by its opening, the The supply holder is returned when the push-up rod is in a state of being inserted through the supply holder .
[0011]
Secondly, the molding apparatus of the present invention is characterized in that a sensor for detecting the presence or absence of the resin for conveyance through the opening is provided in the supply holder.
Thirdly, the molding apparatus of the present invention is characterized in that the sensor is disposed obliquely with respect to the supply holder.
[0012]
Fourth, in the molding apparatus of the present invention, when the sensor detects the absence of the resin for conveyance molding, the supply holder is returned to supply the molding resin to the non-container for molding resin. It shall be the feature.
[0013]
[Action]
According to the first means, the supply holder allows the push-up rod to relatively escape from the opening opened in a direction perpendicular to the moving direction of the push-up rod even when the push-up rod is inserted. The lever can be released from the lever and returned to the molding resin charging position.
[0014]
According to the second means, the presence or absence of the molding resin in the supply holder can be detected by the sensor during a period after the molding resin is supplied to the supply holder and before the molding resin is transferred to the loader. This can be done using the return opening of the supply holder described above.
According to the third means, while the resin powder tends to fall from the supply holder, the sensor can be shifted from the falling position.
[0015]
According to the fourth means, Ru can be performed supplying the molding resin for molding portion more reliably.
[0016]
【Example】
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
First, the overall configuration of the molding apparatus is the same as that described above (see FIG. 9), and the supply holder 31 is different from the supply holder 14 described above.
[0017]
As shown in FIGS. 1 and 2, the supply holder 31 has a required number of, for example, planar circular holding holes 32 for accommodating the molding resin 1, and has an insertion hole 33 at each bottom thereof. Further, an opening 34 is formed from each bottom to the peripheral side to open from the insertion hole 33 in a direction (rightward in the figure) orthogonal to the moving direction of the push-up bar 19 (see FIG. 3). . The opening 34 has the same width as the insertion hole 33, is continuous from the insertion hole 33, and is formed wider than the outer diameter of the push-up bar 19.
[0018]
On the other hand, the cylinder 35 shown in FIG. 3 is moved from a molding resin charging position to a transfer position to the loader 5 by a moving mechanism (not shown). 31 is attached.
[0019]
Further, as shown in FIG. 4, a sensor 37 is disposed on a movement path of the supply holder 31 from a molding resin injection position to a transfer position to the loader 5. In this case, the sensor 37 is composed of an optical sensor having a light projecting part 37a and a light receiving part 37b. The openings 34 are disposed so as to pass through the openings 34, and are particularly arranged so as to face each other diagonally.
[0020]
In the case of the above-described configuration, the short columnar molding resins 1 aligned by the parts feeder 17 (see FIG. 9) are respectively charged into the holding holes 32 of the supply holder 31 by a charging mechanism (not shown).
Next, as shown in FIG. 3, the cylinder 35 is moved to a position immediately below the molding resin guide 18 by a moving mechanism (not shown) with the supply holder 31, and a loader is placed above the molding resin guide 18. 5 is moved and positioned by a moving mechanism (not shown).
[0021]
At this time, along the movement path, the sensor 37 detects the presence or absence of the molding resin 1 in the supply holder 31. The detection of the presence or absence of the molding resin 1 is specifically performed by detecting whether or not a light receiving signal is output from the light receiving unit 37b in response to light being emitted from the light emitting unit 37a. When the molding resin 1 is “present” in 31, the light emitted from the light projecting portion 37 a is blocked by the molding resin 1 and does not reach the light receiving portion 37 b, and no light receiving signal is output from the light receiving portion 37 b.
[0022]
On the other hand, when the supply resin 31 does not have the molding resin 1 in the “absence” state, the light emitted from the light projecting portion 37a is not blocked by the molding resin 1 and passes through the opening 34 of the supply holder 31 to the light receiving portion 37b. Therefore, a light receiving signal is output from the light receiving unit 37b. Accordingly, when there is no light receiving signal from the light receiving portion 37b, it is detected that the molding resin 1 is present in the supply holder 31, and when there is a light receiving signal from the light receiving portion 37b, it is detected that the molding resin 1 is not present in the supply holder 31. .
[0023]
This light receiving signal is input to a control device (not shown), and the control device determines whether the input is normal or abnormal depending on the presence or absence of the input. Then, the supply holder 31 is returned to the molding resin charging position together with the cylinder 35, the molding resin 1 is charged into the holding hole 32 in which the molding resin is not stored, and the position immediately below the molding resin guide 18 is returned again. Move to
[0024]
At the position after the movement, as shown in FIG. 5, the supply holder 31 is moved directly below the molding resin guide 18 by the cylinder 35 moving the rod 36 forward.
In this state, the push-up bar 19 is raised from below the supply holder 31 by a drive mechanism (not shown), passes through the insertion hole 33 of the supply holder 31, and pushes up the molding resin 1 housed in the holding hole 32.
[0025]
The pushed-up molding resin 1 is pushed into the molding resin guide 18 as shown in FIG. 6 as the push-up bar 19 continues to rise, and in this case, the cylinder 35 moves the rod 36 backward. The supply holder 31 is separated from the push-up bar 19. At this time, in response to the horizontal movement of the supply holder 31, the push-up bar 19 remains at a position for pushing up the molding resin 1 relatively through the opening 34 of the supply holder 31. Further, the supply holder 31 returns to the molding resin charging position together with the cylinder 35, and receives the next molding resin 1 charging.
[0026]
On the other hand, the push-up bar 19 further rises, and pushes the molding resin 1 from the molding resin guide 18 into the transfer holder 20 of the loader 5 as shown in FIG. Then, the shutter 21 of the transfer holder 20 is closed to hold the molding resin 1.
[0027]
Thereafter, the push-up bar 19 descends, sequentially passes through the inside of the molding resin guide 18 from the inside of the transfer holder 20, and reaches the lower limit position. At this time, the supply holder 31 which has returned to the molding resin charging position has received the next molding resin 1 and is moved to the transfer position to the loader 5 as soon as the charging is completed. Enter the loading operation.
[0028]
When the molding resin 1 is supplied to the entire transfer holder 20, the loader 5 is moved to a position on the mold 6 of the molding section 7 by a moving mechanism (not shown). The molding resin 1 is put into the mold 6 from the mounting holder 20, and a resin package for enclosing the semiconductor chip on the lead frame 3 is molded with the injected molding resin 1.
[0029]
As described above, in this configuration, when the push-up bar 19 pushes the molding resin 1 from the supply holder 31 into the molding resin guide 18 (see FIG. 6), the supply holder 31 is moved to the molding resin input position. After the push-up bar 19 further pushes the molding resin 1 from the inside of the molding resin guide 18 to the transfer holder 20 of the loader 5, the inside of the molding resin guide 18 and the inside of the supply holder 14 are sequentially moved. It is possible to shorten a series of operation times for supplying the molding resin 1 as compared with the conventional case where it is necessary to wait until it comes out and returns to the lower limit position, thus improving the productivity. Can be.
[0030]
In addition, between the time when the molding resin 1 is supplied to the supply holder 31 and the time when the molding resin 1 is transferred to the transfer holder 20 of the loader 5, the presence or absence of the molding resin 1 in the supply holder 31 is determined by the sensor 37. If the supply of the molding resin 1 to the supply holder 31 fails due to clogging of the parts feeder 17 or the like, or if the supply holder 31 fails to accommodate the molding resin 1, furthermore, the molding may be artificial. When the molding resin 1 is taken out, the transfer operation of the molding resin 1 to the loader 5 can be avoided as it is, and a part or all of the molding resin 1 is not supplied to the molding section 7. It is possible to prevent a problem that a molding operation is performed as it is and a mold failure is caused.
[0031]
Moreover, in this case, this can be performed by using the return opening portion 34 of the supply holder 31 that leaves the push-up bar 19 as described above, and it is necessary to separately provide a dedicated configuration for detection in the supply holder 31. Therefore, it is possible to prevent the supply holder 31 from becoming more complicated and lowering the strength.
[0032]
Further, when the above-mentioned sensor 37 detects the absence of the molding resin 1 in the supply holder 31, it may be displayed and notified to stop the operation of the entire apparatus. Since the holder 31 is returned to the injection position of the molding resin and the holding hole 32 not containing the molding resin 1 is introduced, the molding resin 1 is more reliably supplied to the molding section 7. Thus, the problem of mold failure in the molding section 7 can be more reliably solved.
[0033]
In addition, the sensor 37 is disposed obliquely with respect to the supply holder 31, whereby the sensor 37 can be displaced from the drop position with respect to the resin powder that tends to drop from the supply holder 31. 37 (in the case of the above configuration, particularly, the light receiving portion 37b) does not accumulate resin powder, so that occurrence of a detection error can be prevented.
[0034]
8 shows a second embodiment of the present invention, in which the holding hole 38 of the supply holder 31 is formed in a polygon (for example, a hexagonal plane) instead of the holding hole 32 of the first embodiment. In this manner, the holding of the molding resin 1 (flat circular shape) in the supply holder 31 is performed by the side of the inner surface of the holding hole 38 and the outer surface of the molding resin 1. Since it can be performed by contact (each indicated by a point P), the problem of the displacement of the molding resin 1 due to the opening 34 does not occur, and the transfer to the loader 5 can be reliably performed. It can be solved reliably.
[0035]
In addition, the present invention is not limited to the one that molds a resin package of a semiconductor component, but can be similarly applied to all those that mold a resin molded product having the same circumstances. Further, the molding resin 1 is not limited to a plane circular shape, but may be a polygon, for example, a hexagon or the like as the holding hole 38.
In addition, the present invention is not limited to the embodiment described above and shown in the drawings, and can be implemented with appropriate modifications without departing from the scope of the invention.
[0036]
【The invention's effect】
The molding device of the present invention is as described above, and has the following effects.
First, after the molding resin is held and conveyed by a supply holder, the resin is transferred from the supply holder to a loader by a push-up rod, and further transferred from the loader to a mold and molded. The holder is provided with a holding hole for accommodating the molding resin, and an insertion hole communicating with the holding hole and allowing the push-up rod to pass therethrough, and is opened from the insertion hole in a direction orthogonal to the moving direction of the push-up rod. An opening which allows the push-up rod to relatively pass through the supply holder in the direction, and allows the push-up rod to pass through the supply holder when the push-up rod is inserted through the supply holder. the by the the back, and can also be returned to the molding resin loading position in a state where the supply holder lifting rod is inserted, in achieving reduction of a series of operating time for the supply of the molding resin , It is possible to achieve improved productivity.
[0037]
Secondly, by providing a sensor for detecting the presence or absence of the transfer molding resin through the opening in the supply holder, the molding operation is performed without supplying a part or all of the molding resin to the molding portion. Can be avoided, the problem of mold failure can be solved, and it is not necessary to separately provide a configuration dedicated to detection in the supply holder, and a decrease in the strength of the supply holder can be prevented.
[0038]
Third, by disposing the sensor obliquely with respect to the supply holder, it is possible to prevent the resin powder that tends to fall from the supply holder from accumulating on the sensor, thereby preventing detection errors from occurring. it can.
[0039]
Fourthly, when the sensor detects the absence of the resin for transfer molding, the supply holder is returned and the resin for molding is introduced into the non-contained portion of the resin for molding. The supply can be performed more reliably, and the problem of mold failure in the molding section can be more reliably solved.
[Brief description of the drawings]
FIG. 1 is a plan view of a supply holder showing a first embodiment of the present invention. FIG. 2 is a vertical sectional view taken along line AA of FIG. 1. FIG. FIG. 4 is a longitudinal sectional view of a sensor part. FIG. 5 is a longitudinal sectional view of an operation of a main part in a second state. FIG. 6 is a vertical sectional view of an operation of a main part in a third state. FIG. FIG. 8 is a view corresponding to FIG. 1 showing a second embodiment of the present invention. FIG. 9 is a plan view of the entire molding apparatus. FIG. 10 is a view corresponding to FIG. 1 showing a conventional example. FIG. 12 is a longitudinal sectional view taken along line BB of FIG. 12; FIG. 5 is equivalent to FIG. 13; FIG. 13 is equivalent to FIG. 7;
1 is a molding resin, 5 is a loader, 6 is a mold, 7 is a molding section, 31 is a supply holder, 32 is a holding hole, 33 is an insertion hole, 34 is an opening, 35 is a cylinder, 37 is a sensor, 37a is A light projecting unit, 37b is a light receiving unit, and 38 is a holding hole.

Claims (4)

After the molding resin is held and transported by the supply holder, the resin is transferred from the supply holder to a loader by a push-up rod, and further transferred from the loader to a mold and molded. A holding hole for accommodating the resin for application, an insertion hole communicating with the holding hole and allowing the push-up rod to pass therethrough, and opening the push-up rod from the insertion hole in a direction orthogonal to the moving direction of the push-up rod and pushing up in that direction. An opening is provided to allow the rod to relatively pass through and be separated , and the opening allows the push-up rod to return the supply holder when the supply holder is inserted. Characteristic mold equipment. 2. The molding apparatus according to claim 1, wherein a sensor for detecting the presence or absence of the resin for conveyance molding through an opening is provided for the supply holder. 3. The molding apparatus according to claim 2, wherein the sensor is disposed obliquely with respect to the supply holder. 3. The molding apparatus according to claim 2, wherein when the sensor detects the absence of the resin for conveyance molding, the supply holder is returned to charge the molding resin into the non-contained portion of the molding resin.

Images