JP3558970B2 - Ultrafine particle thin film forming method and apparatus - Google Patents

Ultrafine particle thin film forming method and apparatus Download PDF

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Publication number
JP3558970B2
JP3558970B2 JP2000237481A JP2000237481A JP3558970B2 JP 3558970 B2 JP3558970 B2 JP 3558970B2 JP 2000237481 A JP2000237481 A JP 2000237481A JP 2000237481 A JP2000237481 A JP 2000237481A JP 3558970 B2 JP3558970 B2 JP 3558970B2
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Prior art keywords
thin film
ultrafine particles
ultrafine
substrate
forming
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JP2000237481A
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JP2002045735A (en
Inventor
純 明渡
広典 鳩野
正勝 清原
雄二 麻生
達郎 横山
勝彦 森
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National Institute of Advanced Industrial Science and Technology AIST
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National Institute of Advanced Industrial Science and Technology AIST
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Description

【0001】
【産業上の利用分野】
この発明は対象物の表面にサブミクロンオーダーの脆性材料超微粒子を堆積させて超微粒子薄膜を形成する技術に関するものである。このような技術はマイクロマシン、微細加工技術、半導体部品の実装、セラミックスコーティングに適用することができる。
【0002】
【従来の技術】
金属、セラミックス等の超微粒子をガス攪拌などによりエアロゾル化し、微小なノズルを通し加速したり、或いは、電気的に帯電させ電場勾配を用いて加速し、これを基板上に噴射・衝突させて堆積させることで、微細な機能部品やデバイス部品を形成する超微粒子の成膜技術が従来から知られている。
【0003】
【解決すべき課題】
しかるに従来のこの種の超微粒子の成膜技術では膜厚の制御が必ずしも容易でない。すなわち、形成される薄膜の最小厚さは、それを構成する材料の超微粒子の粒径によって決定されることになるが、ナノメーターオーダーの厚さの薄膜が透明電極や光触媒膜や光歪膜などにおいて必要とされているにもかかわらず、これらの薄膜を構成する市販されている材料の超微粒子としてはミクロンオーダーのものが多く、サブミクロンオーダーやナノメーターオーダーの材料の超微粒子は入手が容易でなく、価格も高価になる。このようなことから、極薄の超微粒子膜を形成することが必ずしも容易でない。
【0004】
次に、薄膜の強度を高めるためには薄膜を構成する超微粒子同士の接合を良好にする必要があり、そのためには超微粒子の表面が汚れや水蒸気の付着のない新しく活性のものである必要があるが、実際にはそのような超微粒子の表面を新しく活性に保つことが困難であるところから、薄膜の強度を高く維持することが必ずしも容易でない。
【0005】
次に薄膜を構成する材料の超微粒子の切り替えも容易でない。薄膜の種類によっては、大粒径の材料微粒子によって構成する必要のあるものや、小粒径の材料微粒子によって構成する必要のあるものや、さらには大粒径と小粒径のものを組み合わせて層を構成することが望まれるものがあるが、そのような各種粒径の選択や切り替えが困難である。
【0006】
この発明は上記の如き事情に鑑みてなされたものであって、ナノメーターオーダーの極薄の超微粒子膜を形成することができ、また、材料の超微粒子の表面を新しい活性なものにして、強固な超微粒子間接合の超微粒子薄膜を形成することができ、さらに、超微粒子薄膜の各種の層構成を採ることを可能にする超微粒子薄膜の形成方法及び形成装置を提供することを目的とするものである。
【0007】
【課題を解決するための手段】
この目的に対応して、この発明の超微粒子薄膜の形成方法は、基板上に脆性セラミック材料の超微粒子によって膜厚サブμmオーダー以下の薄膜を形成する場合に、減圧された成膜チャンバー内に反射面と前記基板とを配置し、材料微粒子をエアロゾル化して前記反射面に衝突させてから、この時に生じる超微粒子の機械的粉砕効果を用いて、新生表面を持つ活性化された超微粒子を生成し、これを減圧状態で、前記基板上に付着させることを特徴としている。
【0008】
また、この発明の超微粒子薄膜の形成装置は、サブμmオーダー以下の薄膜を形成する形成装置であって、減圧された成膜チャンバーと、前記成膜チャンバー内に脆性セラミック材料の超微粒子のエアロゾルを供給するエアロゾル供給装置と、前記成膜チャンバー内に配置された反射面とを備え、前記エアロゾルを前記反射面に吹きつけて前記超微粒子を前記反射面に衝突させてから、この時に生じる超微粒子の機械的粉砕効果を用いて、新生表面を持つ活性化された超微粒子を生成し、これを減圧状態で、前記成膜チャンバー内に配置された基板に付着するように構成したことを特徴としている。
【0009】
【実施の形態】
以下、この発明の詳細を一実施例を示す図面について説明する。
図1において、1は超微粒子薄膜形成装置である。超微粒子薄膜形成装置1は成膜チャンバー2を有する。成膜チャンバー2にはノズル3が取り付けられ、また真空配管4及び真空ポンプ5が接続している。ノズル3は成膜チャンバー2の外に設置されるエアロゾル発生装置6に接続している。真空配管4及び真空ポンプ5は成膜チャンバー2内を減圧する。成膜チャンバー2内にはフレーム7に反射体8及び基板11が取り付けられている。反射体8及び基板11はフレーム7に対して固定または位置が可変である。
【0010】
反射体8は反射面12を有し、反射面12の入射側がノズル3に対向している。反射面12はノズル3から噴出するエアロゾル中に含まれる材料の超微粒子を衝突せて反射させる面であるが、反射面12の硬度は衝突する超微粒子の硬度よりも大きく構成されている。ここで用いる超微粒子は酸化物、炭化物、窒化物等の脆性のあるセラミックス微粒子であり、粒径はサブミクロンオーダー以上のものである。反射面12の反射側に基板11が対向している。基板11はその表面に薄膜を形成する対象物であり、または、形成された薄膜を支持する支持体である。
【0011】
このように構成された超微粒子薄膜形成装置1を使用して、超微粒子薄膜は次のような操作によって形成される。成膜チャンバー2内を真空配管4及び真空ポンプ5を運転して減圧状態にしておく。この状態で、エアロゾル発生装置6を運転して材料の超微粒子とドライ空気、ヘリウム等のガスを混合して、超微粒子エアロゾルを発生させ、これを搬送管13を用いて、減圧された成膜チャンバー2に導入し、細い開口を有するノズル3を通して、硬質材料でできた反射体8の反射面12に照射する。この時反射面12に衝突した超微粒子21は、衝突の衝撃力で粉砕されナノメーターオーダーの粒径の表面活性の高い超微粒子22に変化する。その後、粉砕されたナノメーターオーダーの粒径の超微粒子は、反射面12の近傍におかれた基板11上に飛来、堆積し、透明性を有する強固な薄膜を形成する。反射面12で反射した超微粒子の粒径によって飛来位置及び飛来距離は異なるので、基板11の位置を選択することによって、その表面に形成される薄膜の粒径を選択することができる。
【0012】
【発明の効果】
従来、使用する超微粒子材料の粒径がサブμmオーダーのため、超微粒子膜の膜厚が最初に基板に付着する超微粒子の粒径に近くになり、サブμmオーダーの膜厚の薄膜を得ることは困難であったのに対し、本願発明では、超微粒子を直接成膜する基板に吹き付けるのではなく、一度、成膜の起こらないダイアモンドなどの非常に硬度の高い反射面に吹き付け、この時に生じる超微粒子の機械的粉砕効果を用いて、新生表面を持つ活性化されたナノメーターオーダーの超微粒子を生成し、これを基板に堆積させることで、結晶組織の微細なサブμmオーダー以下の薄膜形成を実現するものである。
【0013】
以上の説明から明らかな通り、この発明によれば、サブミクロンから数ミクロンオーダーの原料超微粒子を用いて、サブミクロン以下の厚みの緻密な薄膜を高速に形成することができるようになる。これによって、超微粒子を吹き付ける方法で、ITO(透明電極材料)、TiO2(光触媒)、PLZT(光歪材料)などの機能性セラミックス材料の透明性を有する薄膜を得ることができるようになる。
【0014】
【図面の簡単な説明】
【図1】超微粒子薄膜形成装置の構成説明図
【符号の説明】
1 超微粒子薄膜形成装置
2 成膜チャンバー
3 ノズル
4 真空配管
5 真空ポンプ
6 エアロゾル発生装置
7 フレーム
8 反射体
11 基板
12 反射面
13 搬送管
21 衝突前の超微粒子
22 衝突後の超微粒子
[0001]
[Industrial applications]
The present invention relates to a technique for depositing ultrafine particles of a brittle material on the order of submicrons on the surface of an object to form an ultrafine particle thin film. Such a technique can be applied to micromachines, fine processing techniques, mounting of semiconductor components, and ceramic coating.
[0002]
[Prior art]
Ultrafine particles of metal, ceramics, etc. are aerosolized by gas agitation and accelerated through a fine nozzle, or accelerated using an electric charge and an electric field gradient, and sprayed and collided on the substrate to deposit Conventionally, a technique for forming ultra-fine particles for forming fine functional components and device components has been known.
[0003]
【task to solve】
However, it is not always easy to control the film thickness with the conventional ultrafine particle deposition technology of this kind. In other words, the minimum thickness of the thin film to be formed is determined by the particle size of the ultrafine particles of the material constituting the thin film. Despite the need for ultrafine particles of commercially available materials that make up these thin films, many of them are on the order of microns, and ultrafine particles of materials on the order of submicrons or nanometers are not available. Not easy and expensive. For this reason, it is not always easy to form an ultra-thin ultrafine particle film.
[0004]
Next, in order to increase the strength of the thin film, it is necessary to improve the bonding between the ultrafine particles constituting the thin film, and for that purpose, the surface of the ultrafine particles must be a new active material free of dirt and water vapor However, in practice, it is difficult to keep the surface of such ultrafine particles newly active, and it is not always easy to maintain the strength of the thin film at a high level.
[0005]
Next, it is not easy to switch the ultrafine particles of the material constituting the thin film. Depending on the type of thin film, those that need to be composed of fine particles of material with a large particle diameter, those that need to be composed of fine particles of material with a small particle diameter, and those that combine large and small particle diameters Although it is desired to form a layer, it is difficult to select or switch such various particle sizes.
[0006]
The present invention has been made in view of the above circumstances, and can form a nanometer-order ultra-thin ultra-fine particle film, and also makes the surface of the material ultra-fine particles a new active material. It is an object of the present invention to provide a method and an apparatus for forming an ultra-fine particle thin film which can form a strong ultra-fine particle thin film of ultra-fine particle bonding and which can adopt various layer configurations of the ultra-fine particle thin film. Is what you do.
[0007]
[Means for Solving the Problems]
In response to this object, the method for forming an ultrafine particle thin film according to the present invention includes the steps of: forming a thin film having a thickness of the order of sub-μm or less by using ultrafine particles of a brittle ceramic material on a substrate; The reflective surface and the substrate are arranged, and the material fine particles are aerosolized and collided with the reflective surface, and then, using the mechanical pulverizing effect of the ultrafine particles generated at this time, activated ultrafine particles having a new surface are formed. It is characterized in that it is produced and adhered on the substrate under reduced pressure .
[0008]
An apparatus for forming an ultrafine particle thin film according to the present invention is an apparatus for forming a thin film of sub-μm order or less, comprising: a reduced-pressure deposition chamber; and an aerosol of ultrafine particles of a brittle ceramic material in the deposition chamber. and the aerosol supply device for supplying, and a said deposited arranged reflecting surfaces within the chamber, wherein by blowing the aerosol to the reflective surface from collide ultrafine particles to the reflective surface, occurs when the ultrasonic Using the mechanical pulverizing effect of the fine particles, activated ultrafine particles having a nascent surface are generated, and this is configured to adhere to a substrate disposed in the film forming chamber under reduced pressure. And
[0009]
Embodiment
Hereinafter, the details of the present invention will be described with reference to the drawings showing one embodiment.
In FIG. 1, reference numeral 1 denotes an ultrafine particle thin film forming apparatus. The ultrafine particle thin film forming apparatus 1 has a film forming chamber 2. A nozzle 3 is attached to the film forming chamber 2, and a vacuum pipe 4 and a vacuum pump 5 are connected. The nozzle 3 is connected to an aerosol generator 6 installed outside the film forming chamber 2. The vacuum pipe 4 and the vacuum pump 5 reduce the pressure inside the film forming chamber 2. A reflector 8 and a substrate 11 are mounted on a frame 7 in the film forming chamber 2. The reflector 8 and the substrate 11 are fixed to the frame 7 or the position thereof is variable.
[0010]
The reflector 8 has a reflection surface 12, and the incident side of the reflection surface 12 faces the nozzle 3. The reflecting surface 12 is a surface that collides and reflects the ultrafine particles of the material contained in the aerosol ejected from the nozzle 3, and the hardness of the reflecting surface 12 is configured to be greater than the hardness of the colliding ultrafine particles. The ultrafine particles used here are brittle ceramic fine particles such as oxides, carbides and nitrides, and have a particle size of the order of submicron or more. The substrate 11 faces the reflection side of the reflection surface 12. The substrate 11 is an object on which a thin film is formed, or is a support for supporting the formed thin film.
[0011]
Using the ultrafine particle thin film forming apparatus 1 configured as described above, an ultrafine particle thin film is formed by the following operation. The inside of the film forming chamber 2 is evacuated by operating the vacuum pipe 4 and the vacuum pump 5. In this state, the aerosol generator 6 is operated to mix the ultrafine particles of the material with a gas such as dry air or helium to generate ultrafine aerosol, which is then reduced in film by using the transport pipe 13. After being introduced into the chamber 2, the light is irradiated on the reflecting surface 12 of the reflector 8 made of a hard material through the nozzle 3 having a narrow opening. At this time, the ultrafine particles 21 colliding with the reflection surface 12 are crushed by the impact force of the collision and are changed to ultrafine particles 22 having a particle size of nanometer order and high surface activity. Thereafter, the pulverized ultrafine particles having a particle size on the order of nanometers fly and deposit on the substrate 11 placed in the vicinity of the reflection surface 12 to form a strong thin film having transparency. Since the flying position and the flying distance vary depending on the particle diameter of the ultrafine particles reflected by the reflecting surface 12, the particle diameter of the thin film formed on the surface can be selected by selecting the position of the substrate 11.
[0012]
【The invention's effect】
Conventionally, since the particle size of the ultra-fine particle material used is on the order of sub-μm, the thickness of the ultra-fine particle film is close to the particle size of the ultra-fine particles that first adhere to the substrate, and a thin film having a thickness of the order of sub μm is obtained. Although it was difficult, in the present invention, instead of spraying the ultrafine particles directly on the substrate on which the film was formed, it was once sprayed on a very hard reflecting surface such as diamond where film formation did not occur. Activated nanometer-order ultrafine particles with a nascent surface are generated using the mechanical crushing effect of the generated ultrafine particles, and deposited on a substrate to form a thin film with a fine crystal structure of sub-μm order or less. To achieve the formation.
[0013]
As is apparent from the above description, according to the present invention, a dense thin film having a thickness of submicron or less can be formed at a high speed by using raw material ultrafine particles of submicron to several micron order. This makes it possible to obtain a transparent thin film of a functional ceramic material such as ITO (transparent electrode material), TiO2 (photocatalyst), and PLZT (photostrictive material) by a method of spraying ultrafine particles.
[0014]
[Brief description of the drawings]
FIG. 1 is a diagram illustrating the configuration of an ultrafine particle thin film forming apparatus.
REFERENCE SIGNS LIST 1 Ultrafine particle thin film forming apparatus 2 Film forming chamber 3 Nozzle 4 Vacuum pipe 5 Vacuum pump 6 Aerosol generator 7 Frame 8 Reflector 11 Substrate 12 Reflective surface 13 Transport pipe 21 Ultrafine particles before collision 22 Ultrafine particles after collision

Claims (8)

基板上に脆性セラミック材料の超微粒子によって膜厚サブμmオーダー以下の薄膜を形成する場合に、減圧された成膜チャンバー内に反射面と前記基板とを配置し、材料微粒子をエアロゾル化して前記反射面に衝突させてから、この時に生じる超微粒子の機械的粉砕効果を用いて、新生表面を持つ活性化された超微粒子を生成し、これを減圧状態で、前記基板上に付着させることを特徴とする超微粒子薄膜の形成方法When forming a thin film having a thickness of the order of sub-μm or less using ultrafine particles of a brittle ceramic material on a substrate, a reflecting surface and the substrate are arranged in a reduced-pressure deposition chamber, and the material particles are aerosolized to form the aerosol. After colliding with the surface, by using the mechanical crushing effect of the ultrafine particles generated at this time, activated ultrafine particles having a nascent surface are generated and adhered to the substrate under reduced pressure. For forming ultrafine particle thin film 前記反射面の硬度は衝突する超微粒子の硬度よりも大きいことを特徴とする請求項1記載の超微粒子薄膜の形成方法2. The method for forming an ultrafine particle thin film according to claim 1, wherein the hardness of the reflection surface is higher than the hardness of the ultrafine particles colliding. 前記反射面に衝突する前の前記超微粒子の大きさは前記薄膜の厚さよりも大きいことを特徴とする請求項1記載の超微粒子薄膜の形成方法2. The method according to claim 1, wherein the size of the ultrafine particles before colliding with the reflection surface is larger than the thickness of the thin film. 前記反射面と前記基板との相対距離が可変であることを特徴とする請求項1記載の超微粒子薄膜の形成方法2. The method according to claim 1, wherein a relative distance between the reflection surface and the substrate is variable. サブμmオーダー以下の薄膜を形成する形成装置であって、減圧された成膜チャンバーと、前記成膜チャンバー内に脆性セラミック材料の超微粒子のエアロゾルを供給するエアロゾル供給装置と、前記成膜チャンバー内に配置された反射面とを備え、前記エアロゾルを前記反射面に吹きつけて前記超微粒子を前記反射面に衝突させてから、この時に生じる超微粒子の機械的粉砕効果を用いて、新生表面を持つ活性化された超微粒子を生成し、これを減圧状態で、前記成膜チャンバー内に配置された基板に付着するように構成したことを特徴とする超微粒子薄膜の形成装置A film forming apparatus for forming a thin film of sub-μm order or less, comprising: a film forming chamber under reduced pressure; an aerosol supply device for supplying an aerosol of ultrafine particles of a brittle ceramic material into the film forming chamber; And a reflecting surface disposed on the reflecting surface, the aerosol is sprayed on the reflecting surface to cause the ultrafine particles to collide with the reflecting surface, and then, using a mechanical pulverizing effect of the ultrafine particles generated at this time, a new surface is formed. An apparatus for forming an ultrafine particle thin film , wherein the activated ultrafine particles are generated and adhered to a substrate disposed in the film forming chamber under reduced pressure. 前記反射面の硬度は衝突する超微粒子の硬度よりも大きく構成されていることを特徴とする請求項5記載の超微粒子薄膜の形成装置6. The apparatus for forming an ultrafine particle thin film according to claim 5, wherein the hardness of the reflecting surface is configured to be higher than the hardness of the colliding ultrafine particles. 前記反射面に衝突する前の前記超微粒子の大きさは前記薄膜の厚さよりも大きいことを特徴とする請求項5記載の超微粒子薄膜の形成装置The ultrafine particle thin film forming apparatus according to claim 5, wherein the size of the ultrafine particles before colliding with the reflecting surface is larger than the thickness of the thin film. 前記反射面と前記基板との相対距離が可変であることを特徴とする請求項6記載の超微粒子薄膜の形成装置7. The apparatus according to claim 6, wherein a relative distance between the reflection surface and the substrate is variable.
JP2000237481A 2000-08-04 2000-08-04 Ultrafine particle thin film forming method and apparatus Expired - Lifetime JP3558970B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012046818A (en) * 2010-07-26 2012-03-08 Fujitsu Ltd Film deposition device, film deposition method and film deposition substrate
US9752227B2 (en) 2014-06-25 2017-09-05 Fuchita Nanotechnology Ltd. Deposition method

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JP2012046818A (en) * 2010-07-26 2012-03-08 Fujitsu Ltd Film deposition device, film deposition method and film deposition substrate
US9752227B2 (en) 2014-06-25 2017-09-05 Fuchita Nanotechnology Ltd. Deposition method
US10266938B2 (en) 2014-06-25 2019-04-23 Fuchita Nanotechnology Ltd. Deposition method, deposition apparatus, and structure

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