JP3555724B2 - Substrate processing equipment - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a substrate for a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, a substrate for an optical disk, and the like. The present invention relates to a substrate processing apparatus that supplies a processing liquid to a substrate and performs a predetermined process such as a cleaning process on the substrate.
[0002]
[Prior art]
FIG. 9 shows an example of this type of conventional substrate processing apparatus.
The apparatus shown in FIG. 9 is an apparatus for performing a cleaning process using a chemical solution or pure water on a substrate, and has a function of separating a chemical solution and a waste solution and draining them.
[0003]
The apparatus includes a spin chuck 100 rotatable around a vertical axis while holding a substrate W in a horizontal posture by suction, a motor 102 for rotating the spin chuck 100 at a high speed via a rotation shaft 101, An elevating mechanism 103 for elevating and lowering the spin chuck 100, a cup 104 surrounding the substrate W to be processed to form a processing chamber 104a, and supplying a cleaning liquid such as a chemical solution or pure water to the substrate W from obliquely above or obliquely below. Cleaning nozzles 105a, 105b, 105c, and 105d for cleaning.
[0004]
A drain port 106 for draining a cleaning liquid used for cleaning the substrate W is formed at the bottom of the cup 104. The inner wall surface of the cup 104 receives the cleaning liquid scattered from the rotating substrate W during processing and guides the cleaning liquid to the drain port 106. Further, a gas intake port 107 for taking in gas is formed at the upper end of the cup 104. This type of substrate processing apparatus is installed in a clean room. In the clean room, a clean gas flows downflow from the ceiling to the floor. The down-flow clean gas is taken into the processing chamber 104a in the cup 104 from the gas intake port 107 and exhausted from the exhaust port 108 provided in the cup 104 to discharge mist of the cleaning liquid floating in the processing chamber 104a. It is configured as follows.
[0005]
A substantially disk-shaped gutter member 110 having a ring-shaped gutter groove 109 facing the drainage port 106 is rotatably mounted below the cup 104 on a protective cylinder 111 surrounding the rotating shaft 101. . A drainage outlet 112 is formed at a predetermined location on the bottom of the gutter groove 109. A ring gear 113 is fixed to the outer periphery of the gutter member 110, and a drive gear 115 attached to a drive shaft of a motor 114 meshes with the ring gear 113. Further below the gutter member 110, there are provided a waste drain 116 for discarding waste liquid used in the cleaning process, and a collection drain 117 for collecting a chemical solution. With such a configuration, the drain 114 of the gutter member 109 can be selectively positioned above either the waste drain 116 or the recovery drain 117 by driving the motor 114.
[0006]
This conventional device operates as follows.
First, an unprocessed substrate W is delivered to the spin chuck 100 from a transfer robot (not shown) while the spin chuck 100 is raised and protruded from above the cup 104. The spin chuck 100 that has received the substrate W is lowered by the elevating mechanism 103, and the substrate W is positioned in the processing chamber 104a. Then, the substrate W is rotated together with the spin chuck 100, a chemical solution is supplied to the substrate W from the cleaning liquid nozzles 105a to 105d, and the substrate W is subjected to a cleaning process using the chemical solution. In this chemical cleaning process, the chemical liquid can be collected for reuse by locating the drainage outlet 112 above the recovery drain 117. After a predetermined chemical solution cleaning processing time has elapsed, the cleaning solution supplied to the substrate W from the cleaning solution nozzles 105a to 105d is switched from the chemical solution to pure water, and the rinsing process of washing the chemical solution attached to the substrate W with pure water is performed. W. At the time of this rinsing process, the waste liquid (pure water mixed with the chemical solution) used for the cleaning process can be discarded by positioning the drain outlet 112 above the waste drain 116. When a predetermined rinsing time has elapsed, the supply of pure water from the cleaning liquid nozzles 105a to 105d is stopped, and the substrate W is rotated as it is to shake off and dry the pure water adhering to the substrate W. When the drying of the substrate W is completed, the rotation of the spin chuck 100 is stopped. Then, in a state where the spin chuck 100 is raised by the elevating mechanism 103 and protrudes from above the cup 104, the transfer robot (not shown) receives the cleaned substrate W from the spin chuck 100 and performs a cleaning process on one substrate W. Ends.
[0007]
[Problems to be solved by the invention]
However, the substrate W after cleaning by the conventional apparatus may be contaminated, and the conventional apparatus has a problem in finishing accuracy of cleaning. The present inventor investigated this inconvenience and found out that the following causes were caused.
[0008]
That is, the present inventor analyzed the flow of gas in the processing chamber 104a of the conventional apparatus by simulation, and found that convection of the air flow occurred in the lower region 200 of the spin chuck 100. On the other hand, during the processing, the cleaning liquid scattered from the rotating substrate W hits the inner wall surface of the cup 104, and a part thereof becomes a mist mist and floats in the processing chamber 104a. The mist of the cleaning liquid is originally to be exhausted from the exhaust port 108, but is returned to the substrate W side by the convection of the airflow in the lower region 200 of the spin chuck 100, and during the drying of the substrate W, or It is considered that the mist of the cleaning liquid re-attached to the substrate W after the completion, and contaminated the cleaned substrate W.
[0009]
The present inventor further investigated the cause of the convection of the airflow in the lower region 200 of the spin chuck 100, and found that the distance between the substrate W held by the spin chuck 100 and the inner wall surface of the cup 104 was large, The flow rate of the gas flowing into the processing chamber 104a from the opening decreases, so that a part of the airflow in the processing chamber 104a flows to the lower region 200 of the spin chuck 100 without being exhausted from the exhaust port 108, and The simulations revealed that the convection of the airflow was generated in the air.
[0010]
Therefore, for example, if the cup 104 is designed so that the inner wall surface of the cup 104 is close to the substrate W held by the spin chuck 100, it is considered that convection of airflow in the region 200 below the spin chuck 100 can be eliminated. . However, when the cleaning liquid scattered from the rotating substrate W hits the inner wall surface of the cup 104, a part thereof rebounds toward the substrate W side. , The cleaning liquid rebounding from the inner wall surface of the cup 104 easily adheres to the substrate W again, and contaminates the substrate W on the contrary.
[0011]
In addition, when a predetermined processing liquid is supplied to a substrate while rotating the substrate to perform a predetermined processing on the substrate, it is generally known that the processing liquid is re-adhered to the substrate, thereby lowering the finishing accuracy of the processing. Have been. Therefore, not only in the cleaning process but also in other substrate processes, there may be a problem that the processing liquid re-adheres to the substrate due to the same configuration as the above-described conventional device due to the configuration of the device including the cup.
[0012]
Further, the conventional device has a function of separating the chemical liquid and the waste liquid and draining the liquid. However, in the configuration of the conventional device, the path from the cup 104 to the drainage flow outlet 112 of the gutter member 110 via the drainage port 106 is provided. Is commonly used for the chemical liquid to be collected and the waste liquid to be discarded. Therefore, mixing of the two liquids in this route cannot be avoided, and the separation and drainage of the chemical liquid and the waste liquid are insufficient. there were.
[0013]
The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a substrate processing apparatus capable of suppressing re-adhesion of a processing liquid to a substrate and improving the accuracy of substrate processing. Aim.
[0014]
Another object of the present invention is to suitably achieve the above main object in an apparatus having a function of separating and discharging a plurality of types of processing liquids used for processing.
[0015]
Still another object of the present invention is to provide an apparatus having a function of separating and discharging a plurality of types of processing liquids used in the processing, wherein the above-mentioned main object is suitably achieved, and the plurality of types of processing liquids used in the processing are used. It is an object of the present invention to provide an apparatus capable of suitably performing the separation waste liquid.
[0016]
[Means for Solving the Problems]
The present invention has the following configuration to achieve such an object.
That is, according to the present invention, there is provided a substrate holding means for holding a substrate in a horizontal posture, a substrate rotating means for rotating the substrate held by the substrate holding means around a vertical axis, and the substrate holding means. An inner wall surface that is provided so as to surround the substrate held by the means, receives the processing liquid scattered from the substrate rotated by the substrate rotating means, and guides the processing liquid to a lower liquid discharge port. A guide member having an inclined portion that becomes smaller, formed on the inner wall surface, and a gas intake port for taking in a gas at an upper end portion of the inclined portion, provided below the substrate holding means, An exhaust port for exhausting the gas taken in by the port, and an exhaust port disposed above the substrate holding means, having a smaller diameter than the gas intake port of the guide member, and being held by the substrate holding means. The processing liquid supply unit for supplying a processing liquid to the vicinity of the rotation center of the substrate top surface from the surface facing opposite the upper surface of the substrate And a gas supply path for supplying a clean gas between the facing surface and the substrate upper surface. An atmosphere blocking member comprising: a lifting / lowering unit that relatively raises / lowers the substrate holding unit and the guide member; and a contact / separation unit that relatively moves / disconnects the atmosphere blocking member to / from the substrate holding unit. When processing the substrate with the processing liquid, lifting and lowering control means for controlling the lifting and lowering means so that the inclined portion of the guide member is located at the height position of the substrate held by the substrate holding means, the substrate with the processing liquid At the time of processing, the atmosphere shielding member is arranged at a predetermined distance from the upper surface of the substrate held by the substrate holding means. Close the central part of the gas intake of the guide member And a contact / separation control means for controlling the contact / separation means as described above.

[0017]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, an exhaust tank provided with the exhaust port at the bottom, and the exhaust port provided around the exhaust tank and the drain port provided at the bottom. A receiving member provided with a drainage tank provided below the substrate holding means, and the elevating means moves the guide member up and down with respect to the substrate holding means and the receiving member. It is.
[0018]
According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect, the processing liquid supply unit provided in the atmosphere blocking member is configured to be capable of selectively supplying a plurality of types of processing liquids, The guide member is formed with a plurality of inclined portions corresponding to the respective types of processing liquids arranged concentrically at an interval from each other, and between the lower portion of the innermost inclined portion and each of the inclined portions. Drainage ports are respectively provided below and below the drainage guide channel formed in the gap of, and the diameter of the gas intake port at the upper end of each inclined portion is formed to be substantially the same. Controlling the elevating means so that the inclined portion of the guide member corresponding to the type of the processing liquid supplied to the substrate is positioned at the height position of the substrate held by the substrate holding means. It is.
[0019]
According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, an exhaust tank provided with the exhaust port at the bottom and a concentric arrangement around the exhaust tank and exhaust at the bottom respectively. A receiving member provided with a plurality of drainage tanks corresponding to each type of processing liquid having a liquid port is provided below the substrate holding means, and the elevating means is provided on the substrate holding means and the receiving member. On the other hand, the guide member is configured to be moved up and down.
[0020]
[Action]
The operation of the invention described in claim 1 is as follows.
When the substrate is held by the substrate holding means, the elevation control means relatively moves the substrate holding means and the guide member so that the inclined portion of the guide member is positioned at the height of the substrate held by the substrate holding means. Control means for raising and lowering the device. On the other hand, the contact / separation control means is configured to contact / separate the atmosphere blocking member relative to the substrate holding means so as to dispose the atmosphere blocking member at a predetermined distance from the upper surface of the substrate held by the substrate holding means. Control the release means.
[0021]
Then, while the substrate held by the substrate holding unit is rotated around the vertical axis by the substrate rotating unit, the processing liquid is supplied from the processing liquid supply unit provided in the atmosphere blocking member to the vicinity of the rotation center on the upper surface of the substrate. Then, a predetermined process is performed on the substrate.
[0022]
At this time, most of the processing liquid scattered from the rotated substrate is received by the inclined portion of the guide member, and is guided to the lower drain port along the inclined portion. In addition, a part of the processing liquid that has hit a part of the inclined part becomes a mist mist and floats in the space inside the inner wall surface of the guide member.
[0023]
However, the central portion of the gas inlet of the guide member is closed by the atmosphere blocking member arranged at a predetermined distance from the upper surface of the substrate. Therefore, the gas flows into the space inside the inner wall surface of the guide member from a narrow gap between the gas intake port of the guide member and the atmosphere blocking member, flows through the gap, and flows down around the substrate. As a result, the flow velocity of the gas flowing through the exhaust port provided below the substrate holding means becomes relatively high, and gas convection hardly occurs in the space below the substrate holding means. In addition, since the airflow flowing down around the substrate serves as an air curtain, it is also possible to suppress the mist of the processing liquid floating outside the air curtain from flowing toward the substrate inside the air curtain. it can. Furthermore, since the mist of the processing liquid is prevented from re-adhering to the substrate, it is not necessary to design the apparatus such that the inclined portion of the guide member is brought closer to the substrate held by the substrate holding means than necessary. In addition, since the processing liquid scattered from the rotated substrate is received by the inclined portion having a smaller diameter as it goes upward, most of the processing liquid rebounds downward, and the processing liquid flows to the substrate side. Bounce can be reduced. Therefore, re-adhesion of the processing liquid to the substrate can be suitably suppressed.
[0024]
According to the second aspect of the present invention, the gas flowing from the gap between the gas inlet of the guide member and the atmosphere blocking member flows down around the substrate and is provided below the substrate holding means. The gas is exhausted from an exhaust port provided at the bottom of the exhaust tank via an exhaust tank constituting a member. On the other hand, the processing liquid scattered from the rotated substrate passes through a drainage tank provided around the exhaust tank along the inclined portion of the guide member, and is discharged from a drainage port provided at the bottom of the drainage tank. Liquid. Further, since the mist of the processing liquid generated by hitting the inclined portion of the guide member floats in the drainage tank, the mist is less likely to re-adhere to the substrate.
[0025]
The elevating means is configured to elevate and lower the guide member with respect to the substrate holding means and the receiving member.In the control by the elevating control means, the elevating means raises and lowers the guiding member with respect to the substrate holding means and the receiving member. The height of the guide member with respect to the substrate holding means is controlled such that the inclined portion of the guide member is located at the height of the substrate held by the substrate holding means.
[0026]
According to the third aspect of the present invention, the inclined portion of the guide member corresponding to the type of the processing liquid to be supplied to the substrate is positioned at the height position of the substrate held by the substrate holding means by the elevation control means. The elevating means is controlled so as to perform. Then, the processing liquid corresponding to the inclined portion is supplied to the substrate from the processing liquid supply unit provided in the atmosphere blocking member, and the substrate is processed. The processing liquid supplied to the substrate is drained from an individual drain port below it along the inclined portion of the guide member corresponding to the processing liquid.
[0027]
When processing by supplying another type of processing liquid to the substrate, the elevation control means sets the inclined portion of the guide member corresponding to the another type of processing liquid at the height position of the substrate held by the substrate holding means. Is controlled so that is located, and another type of processing liquid is supplied to the substrate from the processing liquid supply unit provided in the atmosphere blocking member, and the substrate is processed. This other type of processing liquid is drained from an individual drainage port below it along the slope of the guide member corresponding to the processing liquid.
[0028]
Therefore, a plurality of types of processing liquids used for processing can be separated and drained. At the time of processing with each type of processing liquid, the atmosphere blocking member is disposed above the substrate held by the substrate holding means. The re-adhesion of the processing liquid can be suitably suppressed.
[0029]
In addition, since the diameter of the gas intake port at the upper end of each inclined portion is formed to be substantially the same, the gap between each gas intake port of the guide member and the atmosphere blocking member is substantially the same at all the gas intake ports. It is also possible to perform the treatment under the same gas inflow conditions.
[0030]
Furthermore, since each type of processing liquid is drained at a separate inclined portion, a drain guide channel, and a drain port, the respective liquids are not mixed and drained, and the separated drain of each liquid is also suitably performed. I can do it.
[0031]
According to the fourth aspect of the present invention, the receiving member is provided with a plurality of drainage tanks corresponding to the respective types of processing liquid, each of which has a drainage port at the bottom, and is provided concentrically around the exhaust tank. The processing liquid scattered from the substrate to be rotated is provided along the inclined portion of the guide member corresponding to the processing liquid, through the drainage tank corresponding to the processing liquid, and provided at the bottom of the drainage tank. Drained from the drain port.
[0032]
The elevating means is configured to elevate and lower the guide member with respect to the substrate holding means and the receiving member, similarly to the invention described in claim 2. The guide member is moved up and down with respect to the member, and the elevating means is controlled so that the inclined portion of the guide member corresponding to the type of the processing liquid supplied to the substrate is positioned at the height of the substrate held by the substrate holding means. Is done.
[0033]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.
This apparatus is for performing a cleaning process using a chemical solution or pure water on a semiconductor wafer (substrate) W to be processed, and has a function of separating a chemical solution and a waste solution and draining them.
[0034]
The substrate W is held in a horizontal posture by a spin chuck 1 as a substrate holding unit. The spin chuck 1 has a spin base 3 attached to an upper end of a rotating shaft 2 so as to be integrally rotatable. On the upper surface of the spin base 3, three or more substrate holding members 4 for holding the outer peripheral portion of the substrate W at three or more places are provided upright at regular intervals along the periphery of the spin base 3. In FIG. 1 and subsequent figures, only one substrate holding member 4 is shown to avoid complicating the drawing.
[0035]
Each of the substrate holding members 4 includes a substrate supporting portion 4a that supports the outer peripheral portion of the substrate W from below and a substrate holding portion 4b that presses the outer peripheral end surface of the substrate W supported by the substrate supporting portion 4a to hold the substrate W. Have. Each substrate holding member 4 is configured to be switchable between a holding state in which the substrate holding portion 4b presses the outer peripheral end surface of the substrate W and a non-holding state in which the substrate holding portion 4b is separated from the outer peripheral end surface of the substrate W. The switching between the holding state and the non-holding state is realized by, for example, a link mechanism disclosed in Japanese Patent Publication No. 3-9607.
[0036]
An electric motor 6 as a substrate rotating means is interlockingly connected near the lower end of the rotating shaft 2 by a belt transmission mechanism 5 or the like. When the electric motor 6 is driven, the rotating chuck 2 and the spin chuck 1 are rotated together with the spin chuck. The substrate W held at 1 is rotated around a vertical axis J.
[0037]
The rotating shaft 2 is formed of a cylindrical member having a hollow. A cleaning liquid supply pipe 7 penetrates the hollow portion, and the lower surface of the substrate W held by the spin chuck 1 from the cleaning liquid supply section 7a at the upper end thereof. The cleaning liquid is supplied to the vicinity of the rotation center. The cleaning liquid supply pipe 7 is connected to a pipe 8 in communication. The base end of the pipe 8 is branched, and a chemical liquid supply source 9 is connected to one branch pipe 8a, and a pure water supply source 10 is connected to the other branch pipe 8b. The branch pipes 8a, 8b are provided with opening / closing valves 11a, 11b, and by switching the opening / closing of the opening / closing valves 11a, 11b, the cleaning liquid supply section 7a can selectively switch between the chemical solution and pure water. It has become.
[0038]
The gap between the inner wall surface of the hollow portion of the rotating shaft 2 and the outer wall surface of the cleaning liquid supply pipe 7 serves as a gas supply path 12. The gas supply path 12 is connected to a gas supply source 15 via a pipe 14 provided with an opening / closing valve 13, and is connected to a gas supply section 12 a at the upper end of the gas supply path 12 to connect the spin base 3 and the substrate W to each other. It is configured such that a clean gas such as clean air or clean inert gas (such as nitrogen gas) can be supplied to a space between the lower surface and the space.
[0039]
The rotating shaft 2, the belt transmission mechanism 5, the electric motor 6, and the like are housed in a cylindrical casing 16 provided on the base member 20.
[0040]
A receiving member 21 is fixedly attached around the casing 16 on the base member 20. The receiving member 21 is provided with cylindrical partition members 22a, 22b, 22c standing upright. The partition members 22a to 22c and the outer wall surface of the casing 16 allow the exhaust tank 23, the first drain tank 24a, A second drainage tank 24b is formed. The space between the outer wall surface of the casing 16 and the inner wall surface of the inner partition member 22a is the exhaust tank 23, and the space between the outer wall surface of the inner partition member 22a and the inner wall surface of the middle partition member 22b is a fourth space. The first drainage tank 24a is a space between the outer wall surface of the intermediate partition member 22b and the inner wall surface of the outer partition member 22c.
[0041]
An exhaust port 26 connected to an exhaust duct 25 is provided at the bottom of the exhaust tank 23, and the gas in the exhaust tank 23 is sucked from the exhaust port 26. A first drain port 28a connected to the recovery drain 27 is provided at the bottom of the first drain tank 24a, and a waste drain 29 is connected to the bottom of the second drain tank 24b. A second drain port 28b is provided.
[0042]
In addition, in FIG. 1 and subsequent figures, in order to avoid complicating the drawing, each of the partition members 22a to 22c and a later-described guide member 30 show only a cross-sectional shape.
[0043]
Above the first and second drainage tanks 24a and 24b, a cylindrical guide member 30 is provided so as to vertically move so as to surround the spin chuck 1 and the substrate W held by the spin chuck. The guide member 30 is formed with two inclined portions 31a and 31b whose diameter decreases as going upward. The respective inclined portions 31a and 31b are arranged concentrically with an interval therebetween. Further, gas intake ports 32a and 32b having the same diameter R are formed at the upper ends of the inclined portions 31a and 31b. Further, vertical portions 33 and 34a are connected to a lower end portion of the inclined portion 31a, and a vertical portion 34b is connected to a lower end portion of the inclined portion 31b. The inclined portions 31a, 31b are connected via vertical portions 34a, 34b, and a large number of openings 35 forming a drain guide channel are formed in the connecting portion in the circumferential direction. The guide member 30 has an annular groove 36 formed between the vertical portion 33 and the vertical portion 34a. The groove 36 is fitted into the intermediate partition member 22b, and the vertical portions 34a and 34b are The guide member 30 is disposed so as to fit into the second waste liquid tank 24b.
[0044]
When the inclined portion 31a is located at the height position HW of the substrate W held by the spin chuck 1, the cleaning liquid scattered from the rotated substrate W is received by the inclined portion 31a, and the inclined portion 31a, the vertical portion The liquid is guided to the first drainage tank 24a along 33, and is discharged from the first drainage port 28a. In this device, the inclined portion 31a, the vertical portion 33, the first drainage tank 24a, and the first drainage port 28a are used for collecting the chemical solution, and are not shown through the first drainage port 28a via the recovery drain 27. The chemical is collected in the collection tank, and the chemical collected from the collection tank is supplied to the chemical supply source 9, so that the chemical is reused.
[0045]
Further, when the inclined portion 31b is located at the height position HW of the substrate W held by the spin chuck 1, the cleaning liquid scattered from the rotating substrate W is received by the inclined portion 31b, and the inclined portion 31b, Along the vertical portion 34b, the liquid is guided from the opening 35 to the second drain tank 24b, and is drained from the second drain port 28b. In this device, the inclined portion 31b, the vertical portion 34b, the opening 35, the second drain tank 24b, and the second drain port 28b are disposed of waste liquid (pure water mixed with a chemical solution) after being used for the cleaning process. The waste liquid is discarded from the second drain port 28b through the waste drain 29.
[0046]
The structure of an example of the elevating mechanism for elevating and lowering the guide member 30 will be described with reference to FIG.
The guide member 30 is supported by a lifting member 41 via a support member 40. A screw shaft 42 is screwed into the elevating member 41 and is slidably fitted on the guide rail 43. By driving the motor 44 connected to the screw shaft 42, the elevating member 41 is raised and lowered, and the guide member 30 is raised and lowered accordingly. The elevating member 41, the screw shaft 42, the guide rail 43, the motor 44 and the like constitute an elevating mechanism 45 corresponding to the elevating means.
[0047]
The guide member 30 has a first height H1 at which the inclined portion 31a is located at the height position HW of the substrate W held by the spin chuck 1, and a second height at which the inclined portion 31b is located at the height position HW of the substrate W. The gas intake port 32b above the height H2 is moved up and down at three levels of a third height position H3 located below the height position HW of the substrate W. At the height positions of the elevating member 41 corresponding to the above-mentioned first to third height positions H1 to H3 of the guide member 30, sensors 46a to 46c for detecting the elevating member 41, such as reflection type optical sensors, are provided. The motor 44 is driven and controlled based on the detection signals from the sensors 46a to 46c, and the guide member 30 is positioned at the first to third height positions H1 to H3. As shown in FIG. 3, the elevation control is configured to be performed by a control unit 50 functioning as elevation control means and contact / separation control means.
[0048]
Returning to FIG. 1, an atmosphere blocking member 60 having an opening at the center is disposed above the spin chuck 1. The atmosphere blocking member 60 has a diameter slightly larger than the diameter of the substrate W and smaller than the diameter R of the gas intake ports 32a and 32b of the guide member 30, and has a hollow cylindrical support shaft 61. It is attached to the lower end part so as to be integrally rotatable. The support shaft 61 is rotatably supported by a support arm 62. A driven pulley 63 is attached to the support shaft 61 so as to be integrally rotatable. An endless belt 66 is stretched between the driven pulley 63 and a driven pulley 65 connected to a driving shaft of a motor 64. By driving the motor 64, the atmosphere blocking member 60 is moved together with the support shaft 61 in the vertical direction. It is configured to be rotated around the axis J of the.
[0049]
The support arm 62 is moved up and down by a contact / separation mechanism 67 corresponding to a contact / separation unit, and the vertical movement of the support arm 62 causes the atmosphere blocking member 60 to come and go with the spin chuck 1. In this apparatus, a lower position LH in which the atmosphere blocking member 60 is separated from the upper surface of the substrate W held by the spin chuck 1 by a predetermined distance WB, and the upper surface of the substrate W held by the atmosphere blocking member 60 by the spin chuck 1 The atmosphere blocking member 60 is configured to be able to move up and down between a two-stage position and an upper position HH which is largely separated from the upper position. The contact / separation mechanism 67 that realizes such contact / separation movement is configured by a mechanism using a screw shaft or the like, or an air cylinder or the like, like the elevating mechanism 45. As shown in FIG. 3, the contact / separation control is also performed by the control unit 50.
[0050]
Returning to FIG. 1, the cleaning liquid supply pipe 70 penetrates the center opening of the atmosphere blocking member 60 and the hollow part of the support shaft 61, and the substrate W held on the spin chuck 1 from the cleaning liquid supply part 70 a at the lower end thereof. The cleaning liquid can be supplied to the vicinity of the rotation center on the upper surface of the liquid crystal display. The cleaning liquid supply pipe 70 is connected to a pipe 71 in communication. The base end of the pipe 71 is branched, and a chemical supply 9 is connected to one branch 71a, and a pure water supply 10 is connected to the other branch 71b. Opening / closing valves 72a and 72b are provided in each of the branch pipes 71a and 71b, and by switching the opening and closing of these opening / closing valves 72a and 72b, the chemical liquid and pure water can be selectively switched and supplied from the cleaning liquid supply unit 70a. It has become.
[0051]
The gap between the inner wall surface of the opening at the center of the atmosphere blocking member 60 and the inner wall surface of the hollow portion of the support shaft 61 and the outer wall surface of the cleaning liquid supply pipe 70 is a gas supply path 73. The gas supply path 73 is connected to the gas supply source 15 via a pipe 75 provided with an opening / closing valve 74, and the gas supply path 73 a at the lower end of the gas supply path 73 is connected to the atmosphere blocking member 60 and the substrate W. It is configured such that a clean gas can be supplied to a space between the upper surface of the device and the upper surface of the device.
[0052]
The control unit 50 controls the rotation of the spin chuck 1, the rotation of the atmosphere blocking member 60, and the cleaning liquid supplied from the cleaning liquid supply units 7a and 70a, in addition to the control of raising and lowering the guide member 30 and controlling the contact and separation of the atmosphere blocking member 60. It is also configured to perform control such as supply control and supply control of gas from the gas supply units 12a and 73a.
[0053]
The operation of the apparatus having the above configuration will be described with reference to FIGS. 4 shows a state in which the substrate W is delivered to and from the spin chuck 1, FIG. 5 shows a state of a chemical cleaning process, and FIG. 6 shows a state of a rinsing process and a drying process.
[0054]
First, as shown in FIG. 4, the guide member 30 is positioned at the third height position H3, the spin chuck 1 is projected from above the guide member 30, and the atmosphere blocking member 60 is positioned at the upper position HH. Thus, the space between the atmosphere blocking member 60 and the spin chuck 1 is increased. In this state, a transfer robot (not shown) transfers the unprocessed substrate W to the spin chuck 1. The spin chuck 1 holds the received substrate W.
[0055]
When the reception of the substrate W is completed, as shown in FIG. 5, the guide member 30 is positioned at the first height position H1, and the guide member 30 is moved to the height position HW of the substrate W held by the spin chuck 1. With the inclined portion 31a positioned, the atmosphere blocking member 60 is positioned at the lower position LH, and the distance between the upper surface of the substrate W held by the spin chuck 1 and the atmosphere blocking member 60 is set to WB. As a result, the central portion of the gas intake port 32a at the upper end of the inclined portion 31a is closed by the atmosphere blocking member 60. The interval WB is an interval at which the atmosphere blocking member 60 is arranged so as to close the central portion of the gas intake port 32a.
[0056]
In this state, the substrate W is rotated together with the spin chuck 1, and a chemical liquid is supplied from the cleaning liquid supply units 7 a and 70 a to both upper and lower surfaces of the substrate W to perform a chemical liquid cleaning process. During this chemical cleaning process, the chemical that is shaken off from the outer peripheral portion of the rotated substrate W and scattered around is received by the inclined portion 31a, and is first drained along the inclined portion 31a and the vertical portion 33. The liquid is guided to 24a, drained from the first drain port 28a, and collected in the collection tank via the collection drain 27.
[0057]
Further, a part of the chemical solution scattered from the substrate W and hitting the inclined portion 31a becomes a mist and floats. However, in this device, the central portion of the gas intake port 32a of the guide member 30 is closed by the atmosphere blocking member 60 arranged at a predetermined distance WB from the upper surface of the substrate W. The gas flows into the space inside the space through a narrow annular gap 80 between the gas intake port 32a of the guide member 30 and the atmosphere blocking member 60, flows through the gap 80, and causes the substrate W and the spin. The flow velocity of the gas flowing down the periphery of the base 3 and flowing to the exhaust port 26 below the spin chuck 1 becomes relatively high, so that gas convection hardly occurs in the space below the spin chuck 1. Further, since the airflow flowing down around the substrate W serves as an air curtain, it is necessary to suppress the mist of the chemical solution floating outside the air curtain from flowing to the substrate W side inside the air curtain. Also. Further, since a part of the airflow also flows into the first drainage tank 24a, the mist of the chemical liquid floating near the inclined portion 31a is pushed into the first processing tank 24a by the airflow. Therefore, it is possible to suppress the mist of the chemical solution from re-adhering to the substrate W.
[0058]
The guide member 30 is arranged so that the inclined portion 31a of the guide member 30 and the substrate W held on the spin chuck 1 are sufficiently separated from each other, and the inclined portion 31a (31b) of the guide member 30 is In addition, since the atmosphere blocking member 60 is also arranged above the substrate W, the inconvenience that the rebound of the chemical solution from the inclined portion 31a adheres to the substrate W is unlikely to occur.
Therefore, the re-adhesion of the chemical solution to the substrate W can be suitably suppressed.
[0059]
When a predetermined chemical liquid cleaning processing time has elapsed, the supply of the chemical liquid from the cleaning liquid supply units 7a and 70a is stopped. Then, as shown in FIG. 6, the guide member 30 is positioned at the second height position H2, and the inclined portion 31b of the guide member 30 is positioned at the height position HW of the substrate W held by the spin chuck 1. . At this time, the atmosphere blocking member 60 is kept at the lower position LH, that is, the interval between the upper surface of the substrate W held by the spin chuck 1 and the atmosphere blocking member 60 is maintained at WB. In this state, the vertical gap ZL between the upper and lower gas intake ports 32a, 32b is determined so that the center of the gas intake port 32b at the upper end of the inclined portion 31b is closed by the atmosphere blocking member 60.
[0060]
In this state, a rinsing process is performed in which pure water is supplied to the upper and lower surfaces of the substrate W from the cleaning liquid supply units 7a and 70a, and the chemical solution attached to the substrate W is washed away with the pure water. During this rinsing process, waste liquid (pure water mixed with a chemical solution) that is shaken off from the outer peripheral portion of the rotating substrate W and scattered around is received by the inclined portion 31b, and travels along the inclined portion 31b and the vertical portion 34b. The liquid is guided from the opening 35 to the second drain tank 24b, drained from the second drain port 28b, and discarded through the waste drain 29.
[0061]
Further, a part of the waste liquid scattered from the substrate W and hitting the inclined portion 31b floats as a mist, but the action similar to that in the case of cleaning with the chemical solution is preferably used to suppress the reattachment of the waste liquid to the substrate W. Can be. Further, an air curtain is formed so as to close the opening between the upper end of the partition member 22a and the gas intake port 32a by the airflow flowing down around the spin base 3, and a part of the airflow is directed to the inclined portion 31a. The mist of the chemical solution flowing into the first drainage tank 24a along with the mist and floating in the first drainage tank 24a is also prevented from re-adhering to the substrate W.
[0062]
After a predetermined rinsing time has elapsed, the supply of pure water from the cleaning liquid supply units 7a and 70a is stopped, and the positional relationship among the spin chuck 1, the guide member 30, and the atmosphere blocking member 60 is maintained as in FIG. A drying process is performed in which the rotation of the chuck 1 is continued and pure water adhering to the substrate W is shaken off to dry the substrate W. During this drying process, the waste liquid (pure water) that is shaken off from the outer peripheral portion of the rotated substrate W and scattered around is received by the inclined portion 31b, and along the inclined portion 31b, the vertical portion 34b, and from the opening 35. The liquid is guided to the second drain tank 24b, drained from the second drain port 28b, and discarded through the waste drain 29.
[0063]
In addition, by the same action as in the case of the chemical liquid cleaning and the rinsing treatment, the re-adhesion of the chemical liquid and the waste liquid to the substrate W during and after the drying is suitably suppressed.
[0064]
When a predetermined drying processing time has elapsed, the rotation of the spin chuck 1 is stopped. Then, as shown in FIG. 4, the guide member 30 is located at the third height position H3, and the atmosphere blocking member 60 is located at the upper position HH. The substrate W is received from the spin chuck 1, and the cleaning process for one substrate W is completed.
[0065]
At the time of the cleaning process using a chemical solution or pure water, the atmosphere blocking member 60 may be rotated as necessary, or gas may be supplied from the gas supply ports 12a and 73a.
[0066]
The inventor of the present invention simulated the gas flow between the case where the atmosphere blocking member 60 was arranged as shown in FIGS. 5 and 6 and the case where the atmosphere blocking member 60 was not arranged using this device. In this case, as compared with the case where no gas is disposed, the gas flowing through the gap 80 between the gas intake ports 32a and 32b of the guide member 30 and the atmosphere blocking member 60 and flowing around the substrate W and the spin base 3 ( It was confirmed that the flow velocity in the region 300) in FIGS. 5 and 6 was increased, and the convection of the gas in the space below the spin chuck 1 was reduced.
[0067]
In addition, when the cleaning process was performed on the substrate W by operating as described above, no chemical solution or waste liquid adhered to the substrate W, and the finishing accuracy of the cleaning was good.
[0068]
Further, according to this apparatus, since the drain path of the chemical solution and the waste liquid is separated, the separation and drainage of the chemical solution and the waste liquid can be performed well. Further, according to this device, the guide member 30 is moved up and down with respect to the spin chuck 1 and the receiving member 21 to minimize the members to be vertically displaced in the device. As compared with the case where the spin chuck 1 is moved up and down with respect to the guide member 30 (cup 104) or the member having the functions of the guide member 30 and the receiving member 21 like the cup 104 is moved up and down with respect to the spin chuck 1. The device configuration can be simplified, the device can be made compact, and the structure of the lifting mechanism 45 can be simplified.
[0069]
In the above-described embodiment, an apparatus for separating and discharging two kinds of liquids has been described. However, if configured as shown in FIG. 7, an apparatus for separating and discharging three kinds of liquids can be realized. Reference numeral 31c in FIG. 7 denotes an inclined portion for discharging the third liquid, 32c denotes a gas intake port formed at the upper end of the inclined portion 31c, and 34c denotes a vertical portion connected to the lower end of the inclined portion 31c. , 24c are a third drainage tank for draining the third liquid, 22d is a partition member, and 27a and 27b are collection drains for individually collecting different liquids. Other symbols are the same as those in the above embodiment. In the configuration of FIG. 7, by forming the diameter R of each of the gas intake ports 32 a, 32 b, and 32 c to be substantially the same, the gap between each of the gas intake ports 32 a, 32 b, and 32 c and the atmosphere blocking member 60 is reduced. The gas inlets 32a, 32b, and 32c can be made substantially the same, and the processing can be performed under substantially the same gas inflow conditions. Further, by forming the vertical interval ZL2 between the gas intake ports 32b and 32c to be substantially the same as the vertical interval ZL between the gas intake ports 32a and 32b (ZL ≒ ZL2), the substrate W held by the spin chuck 1 is formed. When the guide member 30 is moved up and down so that the inclined portions 31a to 31c are positioned at the height position HB, the height of the atmosphere blocking member 60 is maintained at HL (the upper surface of the substrate W held by the spin chuck 1 and Even when the distance between the atmosphere blocking member 60 and the atmosphere blocking member 60 is maintained at WB, the atmosphere blocking member 60 can be arranged with the same positional relationship in the height direction between the gas intake ports 32a to 32c and the atmosphere blocking member 60. The processing can be performed under substantially the same gas inflow conditions. Accordingly, with this configuration, it is not necessary to change the height of the atmosphere blocking member 60 for each of the gas intake ports 32a to 32c, and the control of the approach and separation of the atmosphere blocking member 60 is simplified.
[0070]
Further, an apparatus for separating and discharging four or more kinds of liquids can be realized by a configuration similar to that of FIG.
[0071]
Further, the present invention can be similarly applied to an apparatus having no function of separating and discharging two or more types of liquids. In this case, the device may be configured as shown in FIG.
[0072]
In the above embodiment, an apparatus for performing a cleaning process on a substrate W has been described as an example. However, the present invention provides various types of substrate processing for supplying a predetermined processing to the substrate W by supplying another processing liquid to the substrate W. The same can be applied to the device.
[0073]
In addition, the present invention is not limited to an apparatus for processing a semiconductor wafer, but also applies to an apparatus for processing various substrates such as a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk. Can be applied to
[0074]
【The invention's effect】
As is apparent from the above description, according to the first aspect of the present invention, the processing liquid is supplied to the substrate in a state where the atmosphere shielding member is arranged so as to close the central portion of the gas inlet of the guide member. Since the system is configured to perform the predetermined processing, the flow velocity of the gas taken in from the narrow gap between the gas intake port and the atmosphere blocking member can be made relatively high, and the mist of the processing liquid adheres to the substrate again. Can be suppressed, and the finishing accuracy of the processing can be improved. Further, since the processing is performed on the substrate by arranging an inclined portion having a smaller diameter toward the upper side at the height position of the substrate held by the substrate holding means, the processing liquid is transferred from the inclined portion to the substrate. Bounce can also be suppressed. Therefore, the re-adhesion of the processing liquid to the substrate can be reduced, and the finishing accuracy of the processing can be improved.
[0075]
According to the second aspect of the present invention, since the receiving member including the exhaust tank and the drain tank provided around the exhaust tank is provided, the mist of the processing liquid can be stopped in the drain tank. It is possible to more reliably suppress the mist of the treatment liquid from re-adhering to the substrate.
[0076]
Further, since the elevating means is configured to elevate and lower the guide member with respect to the substrate holding means and the receiving member, and to minimize the members to be displaced up and down in the apparatus, the substrate holding means is provided with respect to the guide member. Compared with lifting and lowering, or lifting and lowering a member having the functions of a guide member and a receiving member with respect to the substrate holding means, the apparatus configuration can be simplified, the apparatus can be made more compact, and the structure of the lifting means can be simplified. You can also
[0077]
According to the invention as set forth in claim 3, the guide member is formed with a plurality of inclined portions corresponding to the respective types of processing liquids arranged concentrically at an interval from each other, and the innermost inclined portion. A drain port is provided below the portion and a drain guide channel formed in a gap between the inclined portions, respectively, and a diameter of a gas intake port at an upper end portion of each inclined portion is substantially the same. The elevation control means controls the elevation means so that the inclined portion of the guide member corresponding to the type of the processing liquid supplied to the substrate is located at the height position of the substrate held by the substrate holding means. With such a configuration, it is possible to separate and discharge a plurality of types of processing liquids. In an apparatus capable of separating and discharging a plurality of types of processing liquids, it is preferable to re-attach the processing liquid to the substrate. Can be suppressed.
[0078]
In addition, since the diameter of the gas intake port at the upper end of each inclined portion of the guide member is formed to be substantially the same, the gap between each gas intake port of the guide member and the atmosphere blocking member is reduced by all the gas intake ports. And the processing can be performed under the same gas inflow conditions.
[0079]
Furthermore, each type of processing liquid can be drained at a separate inclined portion, a drain guide channel, and a drain port, and the respective liquids are not mixed and drained. You can do it too.
[0080]
According to the fourth aspect of the present invention, since the receiving member including the exhaust tank and the plurality of drain tanks provided concentrically around the exhaust tank and corresponding to the respective types of processing liquids is provided, a plurality of types are provided. In an apparatus capable of separating and discharging the processing liquid, it is possible to more reliably suppress the mist of the processing liquid from re-adhering to the substrate.
[0081]
Further, since the elevating means is configured to elevate the guide member with respect to the substrate holding means and the receiving member, the apparatus can be made compact and the structure of the elevating means can be simplified.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view illustrating a configuration of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a front view illustrating a configuration of an example of an elevating mechanism for elevating and lowering a guide member.
FIG. 3 is a block diagram illustrating a configuration of a control system of the apparatus according to the embodiment.
FIG. 4 is a view for explaining the operation of the apparatus according to the embodiment, and is a longitudinal sectional view showing a state in which a substrate is delivered to a spin chuck.
FIG. 5 is a view for explaining the operation of the apparatus according to the embodiment, and is a longitudinal sectional view showing a state of a chemical solution cleaning process.
FIG. 6 is a view for explaining an operation of the apparatus according to the embodiment, and is a longitudinal sectional view showing a state of a rinsing process and a drying process.
FIG. 7 is a longitudinal sectional view showing a configuration of a main part of a modified example for separating and discharging three types of liquids.
FIG. 8 is a longitudinal sectional view showing a configuration of a main part of a modified example not having a function of separating and draining liquid.
FIG. 9 is a longitudinal sectional view showing a configuration of a conventional device.
[Explanation of symbols]
1: Spin chuck
6: Electric motor
21: Receiving member
23: Exhaust tank
24a, 24b: drainage tank
26: Exhaust port
28a, 28b: drain port
30: guide member
31a, 31b: Inclined part
32a, 32b: Gas inlet
45: Elevating mechanism
50: control unit
60: Atmosphere blocking member
67: Contact / separation mechanism
70a: cleaning liquid supply unit
W: Substrate
HW: height position of substrate held by spin chuck
WB: Distance between upper surface of substrate and atmosphere shielding member during substrate processing

Claims (4)

Substrate holding means for holding the substrate in a horizontal position,
Substrate rotating means for rotating the substrate held by the substrate holding means around a vertical axis,
An inner wall surface is provided so as to surround the substrate held by the substrate holding means, receives the processing liquid scattered from the substrate rotated by the substrate rotation means, and guides the processing liquid to a lower drain port, and goes upward. A guide member in which an inclined portion having a smaller diameter is formed on the inner wall surface, and a gas intake port for taking in gas is formed at an upper end portion of the inclined portion,
An exhaust port that is provided below the substrate holding unit and that exhausts gas taken in by the gas intake port;
It is disposed above the substrate holding means, has a smaller diameter than the gas intake port of the guide member, and is located near the center of rotation of the upper surface of the substrate from the opposing surface opposing the upper surface of the substrate held by the substrate holding means. A processing liquid supply unit for supplying a processing liquid , and an atmosphere blocking member including a gas supply path for supplying a clean gas between the facing surface and the upper surface of the substrate ,
Lifting means for relatively lifting and lowering the substrate holding means and the guide member,
Contacting / separating means for relatively bringing the atmosphere blocking member into and out of contact with the substrate holding means,
Lifting and lowering control means for controlling the raising and lowering means so that the inclined portion of the guide member is located at a height position of the substrate held by the substrate holding means when processing the substrate with the processing liquid;
When processing the substrate with the processing liquid, the contact / separation means is arranged such that the atmosphere blocking member is arranged at a predetermined distance from the upper surface of the substrate held by the substrate holding means, and the central portion of the gas intake port of the guide member is closed. Contact / separation control means for controlling
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
A receiving member provided with an exhaust tank provided with the exhaust port at the bottom and a drain tank provided around the exhaust tank and provided with the drain port at the bottom is provided below the substrate holding means. ,
The substrate processing apparatus, wherein the elevating unit moves the guide member up and down with respect to the substrate holding unit and the receiving member. The substrate processing apparatus according to claim 1,
The processing liquid supply unit provided in the atmosphere blocking member is configured to be capable of selectively supplying a plurality of types of processing liquids,
The guide member is formed with a plurality of inclined portions corresponding to the respective types of processing liquids arranged concentrically at an interval from each other, and between the lower portion of the innermost inclined portion and each of the inclined portions. Drainage ports are respectively provided below and below the drainage guide channel formed in the gap of, and the diameter of the gas intake port at the upper end of each inclined portion is formed substantially the same,
The elevation control unit controls the elevation unit such that the inclined portion of the guide member corresponding to the type of the processing liquid supplied to the substrate is located at a height position of the substrate held by the substrate holding unit. A substrate processing apparatus characterized by the above-mentioned. The substrate processing apparatus according to claim 3,
An exhaust tank provided with the exhaust port at the bottom, and a plurality of drain tanks provided concentrically around the exhaust tank and corresponding to each type of processing liquid having a drain port at the bottom are provided. Disposed below the substrate holding means,
The substrate processing apparatus, wherein the elevating means moves the guide member up and down with respect to the substrate holding means and the receiving member.

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