JP3552700B2 - Wire bonder and bonding method - Google Patents

Wire bonder and bonding method Download PDF

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Publication number
JP3552700B2
JP3552700B2 JP2001349083A JP2001349083A JP3552700B2 JP 3552700 B2 JP3552700 B2 JP 3552700B2 JP 2001349083 A JP2001349083 A JP 2001349083A JP 2001349083 A JP2001349083 A JP 2001349083A JP 3552700 B2 JP3552700 B2 JP 3552700B2
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Japan
Prior art keywords
wire
electric torch
capillary
tip
protrusion
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JP2001349083A
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JP2003152013A (en
Inventor
修 白石
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Sanken Electric Co Ltd
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Sanken Electric Co Ltd
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  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体装置の組立技術に係り、特に、ワイヤボンダ及びこのワイヤボンダを用いたボンディング方法に関する。
【０００２】
【従来の技術】
半導体装置の組み立て工程においては、半導体チップの表面に配設されたボンディングパッドとパッケージ基板（若しくはリードフレームの支持基板）のリード端子との間を、それぞれ電気的に接続する必要がある。このため、図８に示すように、ワイヤボンダを用いて、パッケージ基板（リードフレームの支持基板）１１に、半導体チップ９を搭載（マウント）し、半導体チップ９の表面のボンディングパッド８とリード端子（図示省略）の先端のポストとの間を、それぞれワイヤ（金属細線）３で結線する。
【０００３】
従来のワイヤボンダは、図８に示すように、パッケージ載置ステージ（リードフレーム載置ステージ）１２を備え、このパッケージ載置ステージ（リードフレーム載置ステージ）１２には、半導体チップ９が搭載されたパッケージ基板１１が載置される。更に、図８に示すように、ワイヤ５を繰り出すワイヤキャピラリ（以下において「キャピラリ」と略記する。）３、このキャピラリ３の動きに同期してワイヤ５をクランプするワイヤクランパ４、平板状の電気トーチ３６とを備える。平板状の電気トーチ３６にはリレー２９を介して電源２８が接続されている。半導体チップ９の表面のボンディングパッド８にワイヤ５をボンディングする際には、前もって、ワイヤ５の先端にボールを形成しておく必要がある。このため、図８に示す平板状の電気トーチ３６は、キャピラリ３の直下に相対的に水平移動可能で、キャピラリ３の直下に配置された状態で、リレー２９を閉じ、電源２８から高電圧を供給し、電気トーチ６とキャピラリ３から繰り出されたワイヤ５の先端との間に放電をなさせ、ワイヤ５の先端を溶融してボールを形成する。このボールを半導体チップ９の表面のボンディングパッド８に押圧し、熱圧着又は超音波ワイヤボンディングを行う。
【０００４】
【発明が解決しようとする課題】
しかし、従来の平板状の電気トーチ３６では、ワイヤ先端にボールを形成する際、平板状の電気トーチ３６とワイヤとの間が広すぎると放電がなされないか、放電がなされてもボールの直径が規格に満たない小さな場合がある。一方、このギャップが狭すぎても、ボールが大きく形成されてしまい、不良ボールが形成されるという問題点があった。
【０００５】
本発明は、上記課題を解決するためになされたものである。即ち、本発明の目的は、ワイヤボンディング時に適正な大きさのボールワイヤの先端にが再現性良く確実に形成出来るワイヤボンダを提供することにある。
【０００６】
更に、本発明の他の目的は、不良ボールの発生を抑制出来るボンディング方法を提供することにある。
【０００７】
【課題を解決するための手段】
上記目的を達成するために、本発明の第１の特徴は、（イ）ワイヤを繰り出すキャピラリと、（ロ）ワイヤをクランプするワイヤクランパと、（ハ）このワイヤクランパに電気的に接続されたワイヤ接触感知装置と、（ニ）ワイヤの先端との間で放電を生じさせるための平坦な表面を有する電気トーチ本体部、この電気トーチ本体部の端部に一定の障壁高さを有するように設けられた電気トーチ突出部とを備えた電気トーチと、（ホ）電気トーチに接続された低圧電源と、（ヘ）電気トーチを水平方向に移動させる電気トーチ駆動装置とを備えるワイヤボンダであることを要旨とする。
【０００８】
本発明の第１の特徴に係るワイヤボンダにおいて、キャピラリからのワイヤの繰り出し長が最適値よりも長すぎる場合には、電気トーチを水平移動すると、電気トーチ突出部がワイヤに接触する。このとき、低圧電源、電気トーチ、ワイヤ、ワイヤクランパ，ワイヤ接触感知装置により閉回路が形成され、この閉回路に短絡電流が流れる。ワイヤの繰り出し長が長ければ長いほど、ワイヤの繰り出し部の腹が引きずられて電気トーチ突出部に接触している時間が長くなり、短絡電流が流れる時間が長くなる。ワイヤの繰り出し長が、最適値より更に障壁高さ分を超えて長ければ、水平移動して電気トーチ突出部を通過した後、電気トーチ本体部の表面にまでワイヤの先端部が接触することになる。一方、ワイヤの繰り出し長が、最適値より長いが、障壁高さ分を超えるほどには長すぎなければ、水平移動により電気トーチ突出部を通過した後は、電気トーチ本体部の表面にはワイヤの先端部は接触しないので、電気トーチ突出部の厚さに相当する一定の時間のみ短絡電流が流れる。一方、キャピラリからのワイヤの繰り出し長が短か過ぎる場合には、電気トーチを水平移動しても電気トーチ突出部がワイヤに接触しないため、短絡電流は流れない。
【０００９】
又、ワイヤの繰り出し長が最適値より長い場合は、ワイヤの繰り出し長が短くなるにつれ、水平移動により電気トーチ突出部にワイヤが引きずられている時間が短くなり、短絡電流が流れる時間が次第に短くなる。ワイヤの繰り出し長が次第に短く調整され、所望の長さに近くなった場合には、電気トーチ突出部にワイヤの先端が、電気トーチ突出部の厚さに相当する時間だけ接触することになる。或いは、電気トーチ突出部のミクロな凹凸に起因して、移動中、瞬間的、断続的に接触する状態となる。このため、ワイヤの繰り出し長が適正の長さに調整された場合においては、低圧電源、電気トーチ、ワイヤ、ワイヤクランパ，ワイヤ接触感知装置からなる閉回路には、電気トーチ突出部の厚さに対応する時間だけ短絡電流が流れる。したがって、短絡電流が流れる時間を計測することにより、ワイヤの繰り出し長を適正の長さに調整することが出来る。即ち、電気トーチ突出部が定義する障壁高さにより、電気トーチとワイヤの先端との間の距離を最適放電ギャップに調整出来るので、この間の放電により、ワイヤの先端に設計通りの大きさのボールを再現性良く確実に形成出来る。
【００１０】
この様に、本発明の第１の特徴に係るワイヤボンダによれば、電気トーチの放電によるボール形成において、不良ボールの発生を抑制出来、ボンディング時の歩留まりが高いワイヤボンダを提供することが出来る。
【００１１】
本発明の第２の特徴は、（イ）キャピラリからワイヤを繰り出す工程と、（ロ）平坦な表面を有する電気トーチ本体部、この電気トーチ本体部の端部に一定の障壁高さを有するように設けられた電気トーチ突出部とを備えた電気トーチを水平移動させる工程と、（ハ）この水平移動により得られる、電気トーチ突出部とワイヤとの相対関係を、ワイヤをクランプしているワイヤクランパに電気的に接続されたワイヤ接触感知装置で判定する工程と、（ニ）このワイヤ接触感知装置により、ワイヤの先端と電気トーチ本体部の表面との距離が、最適放電ギャップであると判定された場合に、ワイヤと電気トーチ本体部との間に高電圧を印加し、ワイヤの先端にボールを形成する工程とを含むボンディング方法であることを要旨とする。
【００１２】
本発明の第２の特徴に係るボンディング方法は、第１の特徴で説明したワイヤボンダを用いるボンディング方法である。即ち、電気トーチとワイヤの先端との間の距離を最適放電ギャップに調整してから、この間で放電を発生し、ワイヤの先端にボールを形成しているので、ワイヤの先端に設計通りの大きさのボールを再現性良く確実に形成出来る。このため、本発明の第２の特徴に係るボンディング方法によれば、不良ボールの発生が少なくボンディング時の歩留まりが高いボンディング方法を提供することが出来る。
【００１３】
【発明の実施の形態】
以下本発明の実施例について図面を参照しながら説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。但し、図面は模式的なものであり、厚みと平面寸法との関係、各層の厚みの比率等は現実のものとは異なることに留意すべきである。したがって、具体的な厚みや寸法は以下の説明を参酌して判断すべきものである。又、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。
【００１４】
（ワイヤボンダ）
図１に示すように、本発明の実施の形態に係るワイヤボンダは、中央にワイヤ５を繰り出す貫通孔を備えるキャピラリ３、このキャピラリ３の動きに同期してワイヤ５をクランプするワイヤクランパ４、このワイヤクランパ４に接続されたワイヤ接触感知装置７、このワイヤ接触感知装置７の一端に接続され、先端に電気トーチ突出部６ａを有する電気トーチ６とを備える。更に、図１に示すワイヤボンダは、パッケージ基板（若しくはリードフレーム）１１を載置するパッケージ載置ステージ（リードフレーム載置ステージ）１２を備える。ワイヤ５は、アルミニウム（Ａｌ）線や金（Ａｕ）線からなる金属細線である。
【００１５】
キャピラリ３は、パッケージ基板（若しくはリードフレーム）１１に搭載された半導体チップ９の上のボンディングパッド８及びリード端子（図示省略）にワイヤ５を供給し、このワイヤ５をボンディングパッド８及びリード端子（図示省略）に対して押圧する。即ち、キャピラリ３の先端部は、ワイヤ５を導出する機能と共に、ワイヤ５に形成されたボール５ａを押圧することが出来る機能を有している。このキャピラリ３は、図示を省略したボンディングアームの先端に装着され、キャピラリ駆動装置３ａにより駆動される。キャピラリ駆動装置３ａは、ボンディングパッド８（又はリード端子（図）に対し、キャピラリ３を相対的に上下に移動し、且つ相対的に水平方向にも移動するように駆動する。ワイヤクランパ４は、ワイヤ５を挟むことが出来るように構成されており、ワイヤ５の切断時等にワイヤ５を挟持する。更に、ワイヤクランパ４は、ワイヤ５に微小電流を流すために、ワイヤ５にワイヤ接触感知装置７を電気的に接続する機能を有する。ワイヤクランパ４も、図示を省略したボンディングアームに装着され、ワイヤクランパ駆動装置４ａにより駆動される。ボンディングアームは、例えば揺動モータによる揺動駆動等の駆動・制御がなされるようにしても良い。更にこのボンディングヘッドは、例えば、Ｘテーブル駆動モータにより駆動されるＸテーブル上に配置され、又、ＸテーブルはＹテーブル駆動モータにより駆動されるＹテーブル上に配置されるようにしても良い。キャピラリ駆動装置３ａ、ワイヤクランパ駆動装置４ａ、ボンディングアーム揺動モータ、Ｘテーブル駆動モータ及びＹテーブル駆動モータは、図示を省略した制御装置により制御される。
【００１６】
パッケージ載置ステージ（リードフレーム載置ステージ）１２は、例えば金属材料から構成され、平坦な上部端面を有する。即ち、パッケージ載置ステージ（リードフレーム載置ステージ）１２は、パッケージ基板１１若しくリードフレームの少なくとも一枚分を載置出来る平坦な上部端面を有する。
【００１７】
ボンディングパッド８及びリード端子（図示省略）の先端部表面は、それぞれボンディング用のポストとして機能する。即ち、パッケージ基板１１の上に搭載される半導体チップ９の表面のボンディングパッド８とそれぞれのポストとの間は、複数のワイヤ５を通して、それぞれ電気的に接続される。
【００１８】
本発明の実施の形態に係るワイヤボンダに用いられるパッケージ基板（リードフレームの支持基板）１１には、絶縁性基板若しくは導電性基板が用いられる。絶縁性基板としてはアルミナ（Ａｌ２Ｏ３）、窒化アルミニウム（ＡｌＮ）等のセラミックが使用可能である。一方、導電性基板としては、打ち抜き成形やエッチング等で所定の形状にパターニングされたされた金属板材、例えばアルミニウム（Ａｌ）、銅（Ｃｕ）、Ｃｕ−Ｆｅ，Ｃｕ−Ｃｒ，Ｃｕ−Ｎｉ−Ｓｉ，Ｃｕ−Ｓｎ等の銅合金、Ｎｉ−Ｆｅ、Ｆｅ−Ｎｉ−Ｃｏ等のニッケル・鉄合金、或いは銅とステンレスの複合材料等を用いることが可能である。リードフレームの場合は、リード端子（図示省略）も、パッケージ基板１１と同一の材料から構成することが可能である。更に、これらの金属にニッケル（Ｎｉ）メッキや金（Ａｕ）メッキ等を施したものなどから構成しても良い。パッケージ基板１１には半導体チップ９が半田や接着剤を介して固着されている。ワイヤ５は、アルミニウム（Ａｌ）線や金（Ａｕ）線からなる金属細線である。
【００１９】
電気トーチ６は、図２（ａ）に示すように、平板上の電気トーチ本体部６ｂの上面、即ち、電気トーチ放電面６ｃの一部に高さｈの電気トーチ突出部６ａを備えた側面形状を有している。即ち、電気トーチ突出部６ａは、電気トーチ本体部６ｂの先端（右端）に垂直の側壁を有した矩形ブロックとして形成され、側面から見るとＬ字形である。図２（ｂ）に示すように、電気トーチ突出部６ａは正面から見ると、矩形（四角形）を基礎とした凹多角形の形状を有したＵ字ブロックである。即ち、正面から見て、電気トーチ突出部６ａの中央には、深さｄ、幅（横幅）Ｗの凹部（Ｕ字形溝）が形成されている。Ｕ字形溝の側壁は垂直で、底面は水平で有り、側壁と底面は直交している。しかし、より一般のＵ字形溝と同様に、側壁と底面とは、単一若しくは複数の曲率半径を有した曲線で交わり、丸コーナを構成しても良い。又側壁と底面とのなすコーナを直線上に面取りした面取りコーナを有しても良い。但し、凹部の深さｄが一定の深さに設定された直線状（平面状）の底面を有していることが好ましく、丸コーナの丸め部や面取りコーナの面取り部はなるべく小さい方が良い。電気トーチ突出部６ａの凹部の幅Ｗは、ワイヤ５の径よりも十分大きく設定される。例えば、ワイヤ５の径を３０〜５０μｍとすれば、電気トーチ突出部６ａの凹部の幅Ｗは、１５０〜２５０μｍ程度にすれば良い。丸コーナの丸め部や面取りコーナの面取り部があると、実効的な幅Ｗが小さくなるので留意すべきである。
【００２０】
一方、凹部の深さｄは、以下に述べるように電気トーチ６を一定速度でスイングしたときに、キャピラリ３から繰り出されたワイヤ５の長さが正常なときにはワイヤ５がこの凹部を通過して電気トーチ放電面６ｃに接触しない寸法に設定される。即ち、所望の大きさのボールを形成するためのワイヤ５の先端と電気トーチ放電面６ｃとの距離、即ち”最適放電ギャップ”となるように障壁高さΔを設定しておけば、常に一定の最適放電ギャップΔで放電し、ボールを形成することが可能になる。図２から分かるように、障壁高さΔは：
Δ ＝ ｈ−ｄ ・・・・・（１）
で与えられる。例えば、本発明の実施の形態では、この凹部の深さｄを５０〜１００μｍに、障壁高さ（即ち最適放電ギャップ）Δは、所望のボールの大きさが７０μｍならば、３０〜１５０μｍ程度に設定している。図３に示すように、キャピラリ３から繰り出されたワイヤ５の繰り出し長が、必要以上に長い場合は、ワイヤ５の繰り出し部が電気トーチ突出部６ａに接触し、ワイヤクランパ４に接続されたワイヤ接触感知装置７に微小電流が流れる。又、図４に示すように、繰り出し長が適正であっても、キャピラリ３から繰り出されたワイヤ５の先端が曲がっている場合には、電気トーチ突出部６ａ分にワイヤ５が接触するため、ワイヤ接触感知装置７に微小電流が流れる。即ち、ワイヤクランパ４は、ワイヤクランパ４に接続されたワイヤ接触感知装置７を用いて、電気トーチ６を水平移動した際に、ワイヤ５が電気トーチ６に接触したかを検知し、キャピラリ３からのワイヤ５の繰り出し長が正常であるか、繰り出し部が曲がっていないか否かを検出する。電気トーチ６は、図１に示すように電気トーチ駆動装置６ｄに接続されており、キャピラリ３の下方に一定速度で水平移動（スイング）可能なように構成されている。電気トーチ６の一端は、図７に示すように、低圧側保護抵抗Ｒ４及び２端子切り替えリレー２６を介して低圧電源２３のプラス端子に接続されている。低圧電源２３のマイナス端子は接地されている。
【００２１】
ワイヤ接触感知装置７は、図７のように、ダイオードＤ１、感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２からなる直列回路と、感知抵抗Ｒ２に並列接続されたフォトカプラ２１と、フォトカプラ２１の出力をベース端子に入力する増幅用トランジスタＱ２とから構成されている。この結果、ワイヤクランパ４は、ダイオードＤ１及び感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２を介して接地される。したがって、２端子切り替えリレー２６を低圧電源２３側に接続して（閉じて）、電気トーチ６に低圧電源２３からの電圧を印加したときに、電気トーチ６がワイヤ５に接触すると、低圧電源２３、低圧側保護抵抗Ｒ４，２端子切り替えリレー２６，電気トーチ６、ワイヤ５、ワイヤクランパ４，ダイオードＤ１、感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２の閉回路に短絡電流Ｉが流れる。感知抵抗Ｒ２には並列にフォトカプラ２１の半導体発光素子（発光ダイオード）Ｄ２が接続されており、このフォトカプラ２１を構成するフォトトランジスタＱ１の出力は、増幅用トランジスタＱ２のベースに入力される。即ち、フォトトランジスタＱ１と増幅用トランジスタＱ２とはダーリントン接続されている。フォトトランジスタＱ１と増幅用トランジスタＱ２とからなるダーリントン回路の出力は、リレー駆動回路２７の制御信号となる。
【００２２】
図３に示すようにキャピラリ３からのワイヤ５の繰り出し長が長い場合、及び図４に示すようにワイヤの繰り出し部５が曲がっている場合には、電気トーチ６を一定速度で水平移動すると、少なくとも電気トーチ突出部６ａの凹部の底部がワイヤ５に接触する。このとき、低圧電源２３、低圧側保護抵抗Ｒ４，２端子切り替えリレー２６，電気トーチ６、ワイヤ５、ワイヤクランパ４，ダイオードＤ１、感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２の閉回路が形成され、この閉回路に短絡電流Ｉが流れる。この短絡電流Ｉに基づいて感知抵抗Ｒ２の両端間に所定の電位差が生じると半導体発光素子（発光ダイオード）Ｄ２が点灯して、フォトトランジスタＱ１に電流が流れ、増幅用トランジスタＱ２のコレクターエミッタ間電圧が低下する。ワイヤ５の繰り出し長が長ければ長いほど、電気トーチ突出部６ａの凹部の底部にワイヤ５の繰り出し部が、長い時間接触することが可能であるので、その分長い時間、発光ダイオードＤ２が点灯し、増幅用トランジスタＱ２のコレクターエミッタ間電圧の低下が顕著になる。ワイヤ５の繰り出し長が、所定の値（最適値）より更に障壁高さΔ分を超えて長ければ、一定速度で水平移動して、電気トーチ突出部６ａの凹部のスイング方向に測った検出距離を通過した後、電気トーチ放電面６ｃにまでワイヤの先端部が接触することになる。「検出距離」は、スイング方向に測られ、電気トーチ突出部６ａの厚さに相当する。一方、ワイヤ５の繰り出し長が、最適値より長いが、障壁高さΔ分を超えるほど長くなければ、水平移動により電気トーチ突出部６ａの凹部の検出距離を通過した後は、電気トーチ放電面６ｃにはワイヤの先端部は接触しないので、ワイヤの繰り出し部５の腹が引きずられて接触している一定の時間のみ発光ダイオードＤ２が点灯する。発光ダイオードＤ２の点灯時間は、ワイヤ５の繰り出し長の最適値より長い分にほぼ比例することが可能である。発光ダイオードＤ２の点灯時間が所定の時間より長ければ、増幅用トランジスタＱ２のコレクターエミッタ間電圧は所定の値（ボンディング下限電圧）より低い値に低下する。このボンディング下限電圧より低下した増幅用トランジスタＱ２のコレクターエミッタ間電圧を制御信号として、リレー駆動回路２７に入力し、２端子切り替えリレー２６を低圧電源２３側に接続したままに維持する。この場合は、ワイヤボンディングを行わない。そして、キャピラリ駆動装置３ａにより、キャピラリ３を相対的に上方に移動するか、キャピラリ３からのワイヤ５の繰り出し長を短くするように再調整する。
【００２３】
一方、キャピラリ３からのワイヤ５の繰り出し長が短か過ぎる場合には、電気トーチ６を水平移動しても電気トーチ突出部６ａがワイヤ５に接触しないため、低圧電源２３、低圧側保護抵抗Ｒ４，２端子切り替えリレー２６，電気トーチ６、ワイヤ５、ワイヤクランパ４，ダイオードＤ１、感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２の閉回路に短絡電流Ｉは流れない。したがって、感知抵抗Ｒ２間に電位差は生ぜず、発光ダイオードＤ２が点灯しないのでフォトトランジスタＱ１に電流が流れることはなく、増幅用トランジスタＱ２のコレクターエミッタ間電圧は高いままであり、ワイヤ５先端にボール５ａは形成されない。したがって、この場合もワイヤボンディングを行われない。そして、キャピラリ駆動装置３ａにより、キャピラリ３を相対的に下方に移動するか、キャピラリ３からのワイヤ５の繰り出し長を長くするように再調整する。
【００２４】
上述したように、ワイヤ５の繰り出し長が最適値より長い場合は、ワイヤ５の繰り出し長が短くなるにつれ、水平移動により電気トーチ突出部６ａの凹部にワイヤの接触する時間が短くなり、発光ダイオードＤ２の点灯時間が次第に短くなる。ワイヤ５のキャピラリ３からの繰り出し長が次第に短く調整され、所望の長さに近くなった場合には、電気トーチ突出部６ａの底部にワイヤ５の先端が、検出距離に対応する時間だけ接触することになる。或いは、電気トーチ突出部６ａの底部のミクロな凹凸に起因して、スイング方向に移動中、瞬間的、突発的に接触する状態となる。電気トーチ突出部６ａとワイヤ５とが、機械的には接触していないが、トンネル電流、電界放出電流や放電電流等が流れる場合もある。このため、ワイヤ５の繰り出し長が適正の長さに調整された場合においては、低圧電源２３、低圧側保護抵抗Ｒ４，２端子切り替えリレー２６，電気トーチ６、ワイヤ５、ワイヤクランパ４，ダイオードＤ１、感知回路保護抵抗Ｒ１及び感知抵抗Ｒ２の閉回路には、検出距離（電気トーチ突出部６ａの厚さ）に対応する時間だけ短絡電流Ｉが流れる。この短時間の短絡電流Ｉに基づいて感知抵抗Ｒ２の両端間に電位差が生じ、発光ダイオードＤ２が検出距離に対応した短時間のみ点灯（若しくは断続的点灯）して、フォトトランジスタＱ１に微少電流が流れる。発光ダイオードＤ２の全光量が、ワイヤ５の繰り出し長が長い場合に比し少ないので、フォトトランジスタＱ１から出力される電流は、微少になる。このため、増幅用トランジスタＱ２のコレクターエミッタ間電圧は、相対的に高い下限値（ボンディング下限電圧）を有する。しかし、増幅用トランジスタＱ２のコレクターエミッタ間電圧は、ワイヤ５が短すぎ、発光ダイオードＤ２が全く点灯しない場合に比しては、相対的に低い上限値（ボンディング上限電圧）を有する。したがって、この下限値（ボンディング下限電圧）と上限値（ボンディング上限電圧）との間の範囲内の電圧値が、ボンディング可能な制御信号である。このボンディング可能な制御信号がリレー駆動回路２７に入力されると、リレー駆動回路２７は、２端子切り替えリレー２６を駆動して電気トーチ６の一端に高圧側保護抵抗Ｒ３を介して高圧電源２２を接続する。これにより、電気トーチ６とワイヤ５の先端との間には、障壁高さΔが規定する最適放電ギャップにおいて放電が生じて、ワイヤ５の先端が溶融して設計通りの大きさのボール５ａが形成される。尚、フォトカプラ２１等には、高電圧が印加されないように保護回路が接続されているが、それらの図示は省略する。
【００２５】
本発明の実施の形態においては、ワイヤ５の繰り出し長が長すぎる場合、ワイヤ５の先端と電気トーチ６との間隔が開きすぎている場合、及びワイヤ５の先端が曲がっている場合に、これらの状態を簡単且つ確実に感知することが出来る。つまり、ワイヤ５の繰り出し長が適正の長さになるまで、ワイヤ５の繰り出し長の調整のステップと、電気トーチ６の水平移動による電気トーチ突出部６ａのワイヤ５に接触・非接触の判定のステップをカット・アンド・トライで繰り返すことにより、適正且つ効率の良いワイヤボンディング動作を実行することが出来る。このため、信頼性の高く良好なワイヤボンディングを生産性良く行うことが出来る。
【００２６】
（ボンディング方法）
次に、本発明の実施の形態に係るボンディング方法を、図５及び図６を用いて説明する。
【００２７】
（イ）まず、パッケージ基板（又はリードフレームの支持基板）１１に半導体チップ９を搭載し、導電性ペーストや金（Ａｕ）−錫（Ｓｎ）半田等を用いて固定する。そして、図５（ａ）に示すように、半導体チップ９が搭載されたパッケージ基板１１をワイヤボンダのパッケージ載置ステージ（リードフレーム載置ステージ）１２に載置する。パッケージ載置ステージ１２は、熱圧着ボンディングに必要な温度にパッケージ基板１１を加熱する。そして、ワイヤボンダのキャピラリ３からワイヤ５を、一定の繰り出し長で導出する。
【００２８】
（ロ）次に、図５（ｂ）に示すように、電気トーチ６を第一ボンディングポイント１に一定速度でスイング（水平移動）させる。既に述べたように、キャピラリ３からのワイヤ５の繰り出し長が長すぎる場合（図３参照。）、繰り出しが曲がっている場合（図４参照。）及びワイヤ５の先端と電気トーチ６との間隔が開きすぎている場合には、電気的にこれらの異常を検知し、ワイヤボンディング動作は実行されない。そして、ワイヤ５の繰り出し長が適正の長さになるまで、繰り出し長の調整のステップと、電気トーチ６の水平移動による電気トーチ突出部６ａのワイヤ５に接触・非接触の判定のステップをカット・アンド・トライで繰り返す。ワイヤ５の繰り出し長の調整の結果、図５（ｃ）に示すように繰り出し長が適正になれば、増幅用トランジスタＱ２のコレクターエミッタ間電圧が、規定範囲内の電圧値を出力する。この規定範囲内の電圧値を、リレー駆動回路２７の制御信号として入力し、２端子切り替えリレー２６を駆動して電気トーチ６の一端に高圧電源２２を接続する。これにより、図５（ｃ）に示す電気トーチ６とワイヤ５の先端との間を最適放電ギャップΔに調整した状態で放電を生じさせ、ワイヤ５の先端を溶融してボール５ａを形成する。
【００２９】
（ハ）ワイヤ５の先端にボール５ａが形成された後、図５（ｄ）に示すように電気トーチ６は第一ボンディングポイント１から離れた位置に戻る。そして、キャピラリ駆動装置３ａにより、図６（ｅ）に示すように半導体チップ９のボンディングパッド８の真上にキャピラリ３を移動させる。更にその後、図６（ｆ）に示すように、半導体チップ９の表面にキャピラリ３を下降させ、ボンディングパッド８の表面にワイヤ５を供給する。図６（ｆ）に示す状態で、ワイヤ５をボンディングパッド８に押圧し熱圧着ボンディングする、或いは更に超音波を加えることにより超音波ボンディングする。
【００３０】
（ニ）次に、キャピラリ駆動装置３ａを駆動して、キャピラリ３を図６（ｇ）に示すように上昇させる。更に、キャピラリ駆動装置３ａは、図６（ｈ）に示す状態を経由する適切な軌跡を描かせながら、キャピラリ３を図６（ｉ）に示す第二ボンディングポイント２まで移動する。キャピラリ３の、この軌跡によって、図６（ｉ）に示すような適切なワイヤループ５が得られる。
【００３１】
（ホ）キャピラリ３が第二ボンディングポイント２の位置に来たら、第一ボンディングポイント１の場合と同様に、キャピラリ３の先端を用いてワイヤ５をリード端子１３に押圧し、熱圧着ボンディングする。或いは更に超音波を加えることにより、超音波ボンディングする。この結果、図６（ｉ）に示すように、ワイヤ５により、半導体チップ９の表面のボンディングパッド８とリード端子１３との間が電気的に接続される。
【００３２】
（ヘ）次に、キャピラリ駆動装置３ａを駆動してキャピラリ３を上昇させ、ワイヤクランパ４でワイヤ５を保持し、図６（ｊ）に示すようにワイヤ５を第二ボンディングポイント２から切断する。これが終了すると、再び図５（ａ）に戻り、同様な操作を、半導体チップ９の表面の他のボンディングパッドに対して行う。
【００３３】
（その他の実施の形態）
本発明は上記の形態によって記載したが、この開示の一部をなす部分及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様様な代替実施の形態、実施例及び運用技術が明らかとなろう。
【００３４】
例えば、ワイヤ５のキャピラリ３からの繰り出し長を、ワイヤ接触感知装置７からの信号を用いてフィードバック制御することも可能である。即ち、ワイヤ５の繰り出し長が最適値より長い場合は、ワイヤ５の繰り出し長の余分な長さは、水平移動により電気トーチ突出部６ａの凹部にワイヤの繰り出し部が引きずられながら接触する時間に対応するので、半導体発光素子（発光ダイオード）Ｄ２の点灯時間、若しくは増幅用トランジスタＱ２のコレクターエミッタ間電圧をキャピラリ駆動装置３ａ及びクランパ駆動装置４ａにフィードバックして、ワイヤ５の先端の位置を、電気トーチ突出部６ａとワイヤ５との間が最適な間隙値になるように制御することが可能である。ワイヤ５の先端の位置の上下駆動は、走査型トンネル顕微鏡のように、電磁駆動又は磁歪素子若しくは電歪素子を用いて制御すれば良い。又、電気トーチ突出部６ａとワイヤ５との間に存在する微少なエヤーギャップ中を流れる微少電流をワイヤ接触感知装置７が検出し、これをフィードバックするようにしても良い。即ち、機械的には接触していな場合であっても、一定の間隙値以下であれば、電気トーチ突出部６ａとワイヤ５との間には、トンネル電流、電界放出電流や放電電流等の微少な電流が流れるのでこれらを検出すればよい。この微少電流の測定は、図７に示すフォトカプラ２１とは別に、高感度な電流検出回路を感知回路保護抵抗Ｒ１，感知抵抗Ｒ２と直列接続して用いても良い。即ち、走査型トンネル顕微鏡と同様に、これらの微少電流をキャピラリ駆動装置３ａ及びクランパ駆動装置４ａにフィードバックして、ワイヤ５の先端の位置を、電気トーチ突出部６ａとワイヤ５との間が最適な間隙値になるように制御しても良い。
【００３５】
この様に、本発明はここでは記載していない様様な実施の形態等を含むことは勿論である。したがって、本発明の技術的範囲は上記の説明から妥当な請求の範囲に係る発明特定事項によってのみ定められるものである。
【００３６】
【発明の効果】
本発明によれば、ワイヤボンディング時に適正な大きさのボールワイヤの先端にが再現性良く確実に形成出来るワイヤボンダを提供することが出来る。この結果、ボンディング不良が防止され、電気的信頼性が向上した半導体装置を実装することが出来る。
【００３７】
又、本発明によれば、不良ボールの発生を抑制出来るボンディング方法を提供することが出来る。この結果、ボンディング不良に伴う製品不良を減少させ、歩留まりを向上させることが出来る。
【図面の簡単な説明】
【図１】本発明の実施の形態に係るワイヤボンダを説明するための模式的な構成図である。
【図２】図２（ａ）は、本発明の実施の形態に係る電気トーチの側面図で、図２（ｂ）は、その正面図である。
【図３】図３（ａ）は、本発明の実施の形態に係る電気トーチとワイヤとの関係を示す側面図で、図３（ｂ）は、その正面図である。
【図４】本発明の実施の形態に係る電気トーチとワイヤとの関係を示す他の模式図（正面図）である。
【図５】図５（ａ）〜（ｄ）は、本発明の実施形態に係るボンディング方法を説明する模式的な工程図（その１）である。
【図６】図６（ｅ）〜（ｊ）は、本発明の実施形態に係るボンディング方法を説明する模式的な工程図（その２）である。
【図７】本発明の実施形態に係るボンディング装置の電流経路に着目した模式図である。
【図８】従来技術に係るワイヤボンダを説明するための模式的な構成図である。
【符号の説明】
１ 第一ボンディングポイント
２ 第二ボンディングポイント
３ キャピラリ
３ａ キャピラリ駆動装置
４ ワイヤクランパ
４ａ ワイヤクランパ駆動装置
５ ワイヤ
５ａ ボール
６ 電気トーチ
６ａ 電気トーチ突出部
６ｂ 電気トーチ本体部
６ｃ 電気トーチ放電面
６ｄ 電気トーチ駆動装置
７ ワイヤ接触感知装置
８ ボンディングパッド
９ 半導体チップ
１１ パッケージ基板（若しくはリードフレーム）
１２ パッケージ載置ステージ（リードフレーム載置ステージ）
１３ リード端子
２１ フォトカプラ
２２ 高圧電源
２３ 低圧電源
２６ ２端子切り替えリレー
２７ リレー駆動回路
２８ 電源
２９ リレー
３６ 平板型電気トーチ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device assembly technique, and more particularly to a wire bonder and a bonding method using the wire bonder.
[0002]
[Prior art]
In the assembly process of the semiconductor device, it is necessary to electrically connect the bonding pads disposed on the surface of the semiconductor chip and the lead terminals of the package substrate (or the support substrate of the lead frame). For this reason, as shown in FIG. 8, a semiconductor chip 9 is mounted (mounted) on a package substrate (lead frame support substrate) 11 using a wire bonder, and the bonding pads 8 and lead terminals (lead terminals) on the surface of the semiconductor chip 9 are mounted. A wire (metal thin wire) 3 is connected between each post and a post at the front end (not shown).
[0003]
As shown in FIG. 8, the conventional wire bonder includes a package mounting stage (lead frame mounting stage) 12, and a semiconductor chip 9 is mounted on the package mounting stage (lead frame mounting stage) 12. The package substrate 11 is placed. Further, as shown in FIG. 8, a wire capillary (hereinafter abbreviated as “capillary”) 3 that feeds the wire 5, a wire clamper 4 that clamps the wire 5 in synchronization with the movement of the capillary 3, and a flat plate-like electric And a torch 36. A power source 28 is connected to the flat electric torch 36 via a relay 29. When bonding the wire 5 to the bonding pad 8 on the surface of the semiconductor chip 9, it is necessary to form a ball at the tip of the wire 5 in advance. For this reason, the flat electric torch 36 shown in FIG. 8 is relatively horizontally movable directly under the capillary 3, and in a state where it is disposed directly under the capillary 3, the relay 29 is closed and a high voltage is supplied from the power supply 28. Then, a discharge is generated between the electric torch 6 and the tip of the wire 5 fed out from the capillary 3, and the tip of the wire 5 is melted to form a ball. This ball is pressed against the bonding pad 8 on the surface of the semiconductor chip 9 to perform thermocompression bonding or ultrasonic wire bonding.
[0004]
[Problems to be solved by the invention]
However, in the conventional flat electric torch 36, when the ball is formed at the tip of the wire, if the space between the flat electric torch 36 and the wire is too wide, no discharge is performed, or the diameter of the ball is not affected by the discharge. May be smaller than the standard. On the other hand, even if the gap is too narrow, the ball is formed large and there is a problem that a defective ball is formed.
[0005]
The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a wire bonder that can be reliably formed on the tip of a ball wire of an appropriate size during wire bonding with good reproducibility.
[0006]
Furthermore, another object of the present invention is to provide a bonding method capable of suppressing the generation of defective balls.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the first feature of the present invention is that (a) a capillary for feeding out a wire, (b) a wire clamper for clamping the wire, and (c) an electrical connection to the wire clamper. An electric torch main body having a flat surface for generating a discharge between the wire contact sensing device and the tip of the wire, so that the end of the electric torch main body has a certain barrier height It is a wire bonder comprising an electric torch provided with an electric torch protrusion provided, (e) a low-voltage power source connected to the electric torch, and (f) an electric torch drive device for moving the electric torch horizontally. Is the gist.
[0008]
In the wire bonder according to the first feature of the present invention, when the wire feed length from the capillary is too long than the optimum value, when the electric torch is moved horizontally, the electric torch protrusion comes into contact with the wire. At this time, a closed circuit is formed by the low-voltage power source, the electric torch, the wire, the wire clamper, and the wire contact sensing device, and a short-circuit current flows through the closed circuit. The longer the wire feed length, the longer the time during which the wire feed portion is dragged and is in contact with the electric torch protruding portion, and the time during which the short-circuit current flows becomes longer. If the wire feed length is longer than the optimum value by more than the barrier height, the tip of the wire contacts the surface of the electric torch main body after moving horizontally and passing through the electric torch main body. Become. On the other hand, if the feeding length of the wire is longer than the optimum value but not so long as to exceed the height of the barrier, the wire is placed on the surface of the electric torch main body after passing through the electric torch protruding portion by horizontal movement. Since the front end of the contact is not in contact, a short-circuit current flows only for a certain time corresponding to the thickness of the electric torch protrusion. On the other hand, when the wire feeding length from the capillary is too short, the electric torch protrusion does not contact the wire even if the electric torch is moved horizontally, so that no short circuit current flows.
[0009]
In addition, when the wire feed length is longer than the optimum value, as the wire feed length becomes shorter, the time that the wire is dragged to the protruding portion of the electric torch due to horizontal movement becomes shorter, and the time when the short-circuit current flows becomes gradually shorter. Become. When the feeding length of the wire is gradually adjusted to be close to a desired length, the tip of the wire comes into contact with the electric torch protrusion for a time corresponding to the thickness of the electric torch protrusion. Or, due to the micro unevenness of the protruding portion of the electric torch, it is in a state of contact instantaneously and intermittently during movement. For this reason, when the wire feeding length is adjusted to an appropriate length, the closed circuit composed of the low voltage power source, the electric torch, the wire, the wire clamper, and the wire contact sensing device has a thickness of the electric torch protruding portion. A short-circuit current flows for the corresponding time. Therefore, by measuring the time during which the short-circuit current flows, the wire feeding length can be adjusted to an appropriate length. That is, the distance between the electric torch and the tip of the wire can be adjusted to the optimum discharge gap by the barrier height defined by the protruding portion of the electric torch. Can be reliably formed with good reproducibility.
[0010]
As described above, according to the wire bonder according to the first feature of the present invention, it is possible to provide a wire bonder that can suppress the generation of defective balls in ball formation by electric torch discharge and has a high yield during bonding.
[0011]
The second feature of the present invention is that (a) a step of drawing out a wire from a capillary, (b) an electric torch main body having a flat surface, and an end of the electric torch main body so as to have a certain barrier height. A step of horizontally moving an electric torch provided with an electric torch protrusion provided on the wire, and (c) a wire clamping the wire with respect to the relative relationship between the electric torch protrusion and the wire obtained by the horizontal movement. A step of determining with a wire contact sensing device electrically connected to the clamper; and (d) the wire contact sensing device determines that the distance between the tip of the wire and the surface of the electric torch main body is the optimum discharge gap. In this case, the gist is a bonding method including a step of applying a high voltage between the wire and the electric torch main body to form a ball at the tip of the wire.
[0012]
The bonding method according to the second feature of the present invention is a bonding method using the wire bonder described in the first feature. That is, the distance between the electric torch and the tip of the wire is adjusted to the optimum discharge gap, and then a discharge is generated between them and a ball is formed at the tip of the wire. The ball can be reliably formed with good reproducibility. For this reason, according to the bonding method according to the second feature of the present invention, it is possible to provide a bonding method in which the generation of defective balls is small and the yield during bonding is high.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
[0014]
(Wire bonder)
As shown in FIG. 1, a wire bonder according to an embodiment of the present invention includes a capillary 3 having a through-hole for feeding out a wire 5 at the center, a wire clamper 4 that clamps the wire 5 in synchronization with the movement of the capillary 3, A wire contact sensing device 7 connected to the wire clamper 4 and an electric torch 6 connected to one end of the wire contact sensing device 7 and having an electric torch protrusion 6a at the tip. Further, the wire bonder shown in FIG. 1 includes a package placement stage (lead frame placement stage) 12 on which a package substrate (or lead frame) 11 is placed. The wire 5 is a thin metal wire made of an aluminum (Al) wire or a gold (Au) wire.
[0015]
The capillary 3 supplies wires 5 to bonding pads 8 and lead terminals (not shown) on the semiconductor chip 9 mounted on the package substrate (or lead frame) 11, and the wires 5 are connected to the bonding pads 8 and lead terminals (not shown). Press against (not shown). That is, the tip portion of the capillary 3 has a function of depressing the ball 5 a formed on the wire 5 as well as a function of leading the wire 5. The capillary 3 is attached to the tip of a bonding arm (not shown) and is driven by a capillary driving device 3a. The capillary drive device 3a drives the capillary 3 so as to move up and down relative to the bonding pad 8 (or lead terminal (FIG.)) And also in the horizontal direction. The wire 5 is configured so that the wire 5 can be sandwiched, and the wire 5 is sandwiched when the wire 5 is cut, etc. Further, the wire clamper 4 senses wire contact with the wire 5 in order to pass a minute current through the wire 5. It has a function of electrically connecting the device 7. The wire clamper 4 is also mounted on a bonding arm (not shown) and is driven by a wire clamper driving device 4a. Further, the bonding head may be driven by an X table drive motor, for example. The X table may be arranged on a Y table driven by a Y table drive motor, a capillary drive device 3a, a wire clamper drive device 4a, a bonding arm swing motor, X The table drive motor and the Y table drive motor are controlled by a control device (not shown).
[0016]
The package mounting stage (lead frame mounting stage) 12 is made of, for example, a metal material and has a flat upper end surface. That is, the package placement stage (lead frame placement stage) 12 has a flat upper end surface on which at least one of the package substrate 11 or the lead frame can be placed.
[0017]
The front surfaces of the bonding pads 8 and lead terminals (not shown) function as bonding posts, respectively. That is, the bonding pads 8 on the surface of the semiconductor chip 9 mounted on the package substrate 11 and the respective posts are electrically connected through the plurality of wires 5.
[0018]
As the package substrate (lead frame support substrate) 11 used in the wire bonder according to the embodiment of the present invention, an insulating substrate or a conductive substrate is used. As an insulating substrate, alumina (Al 2 O 3 ), Ceramics such as aluminum nitride (AlN) can be used. On the other hand, as a conductive substrate, a metal plate material patterned into a predetermined shape by stamping or etching, for example, aluminum (Al), copper (Cu), Cu-Fe, Cu-Cr, Cu-Ni-Si , Cu-Sn and other copper alloys, nickel-iron alloys such as Ni-Fe and Fe-Ni-Co, or a composite material of copper and stainless steel can be used. In the case of a lead frame, the lead terminals (not shown) can also be made of the same material as the package substrate 11. Further, these metals may be made of nickel (Ni) plating or gold (Au) plating. A semiconductor chip 9 is fixed to the package substrate 11 via solder or an adhesive. The wire 5 is a thin metal wire made of an aluminum (Al) wire or a gold (Au) wire.
[0019]
As shown in FIG. 2 (a), the electric torch 6 has a top surface of an electric torch main body 6b on a flat plate, that is, a side surface provided with an electric torch protrusion 6a having a height h on a part of the electric torch discharge surface 6c. It has a shape. That is, the electric torch protrusion 6a is formed as a rectangular block having a vertical side wall at the tip (right end) of the electric torch main body 6b, and is L-shaped when viewed from the side. As shown in FIG. 2B, when viewed from the front, the electric torch protrusion 6a is a U-shaped block having a concave polygonal shape based on a rectangle (square). That is, when viewed from the front, a recess (U-shaped groove) having a depth d and a width (lateral width) W is formed at the center of the electric torch protrusion 6a. The side wall of the U-shaped groove is vertical, the bottom surface is horizontal, and the side wall and the bottom surface are orthogonal. However, like a more general U-shaped groove, the side wall and the bottom surface may intersect with a curve having a single or a plurality of curvature radii to form a round corner. Moreover, you may have the chamfering corner which chamfered the corner which a side wall and a bottom face on a straight line. However, it is preferable to have a straight (planar) bottom surface in which the depth d of the concave portion is set to a constant depth, and the rounded portion of the round corner and the chamfered portion of the chamfered corner should be as small as possible. . The width W of the recess of the electric torch protrusion 6 a is set sufficiently larger than the diameter of the wire 5. For example, if the diameter of the wire 5 is 30 to 50 μm, the width W of the concave portion of the electric torch protrusion 6 a may be about 150 to 250 μm. It should be noted that if there is a rounded portion of a round corner or a chamfered portion of a chamfered corner, the effective width W becomes small.
[0020]
On the other hand, the depth d of the concave portion is such that when the electric torch 6 is swung at a constant speed as described below, the wire 5 passes through the concave portion when the length of the wire 5 fed out from the capillary 3 is normal. The dimension is set so as not to contact the electric torch discharge surface 6c. That is, if the barrier height Δ is set so that the distance between the tip of the wire 5 and the electric torch discharge surface 6c for forming a ball of a desired size, that is, the “optimum discharge gap” is set, it is always constant. It is possible to form a ball by discharging at the optimum discharge gap Δ. As can be seen from FIG. 2, the barrier height Δ is:
Δ = h−d (1)
Given in. For example, in the embodiment of the present invention, the depth d of the recess is 50 to 100 μm, and the barrier height (that is, the optimum discharge gap) Δ is about 30 to 150 μm if the desired ball size is 70 μm. It is set. As shown in FIG. 3, when the drawing length of the wire 5 drawn from the capillary 3 is longer than necessary, the drawing portion of the wire 5 comes into contact with the electric torch protruding portion 6 a and the wire connected to the wire clamper 4. A minute current flows through the contact sensing device 7. Further, as shown in FIG. 4, even when the feeding length is appropriate, when the tip of the wire 5 fed out from the capillary 3 is bent, the wire 5 comes into contact with the electric torch protruding portion 6a. A minute current flows through the wire contact sensing device 7. That is, the wire clamper 4 uses the wire contact sensing device 7 connected to the wire clamper 4 to detect whether the wire 5 is in contact with the electric torch 6 when the electric torch 6 is moved horizontally. It is detected whether the feeding length of the wire 5 is normal or whether the feeding portion is not bent. As shown in FIG. 1, the electric torch 6 is connected to an electric torch drive device 6 d and is configured to be horizontally movable (swing) at a constant speed below the capillary 3. As shown in FIG. 7, one end of the electric torch 6 is connected to the plus terminal of the low-voltage power supply 23 via the low-voltage protection resistor R4 and the two-terminal switching relay 26. The negative terminal of the low-voltage power supply 23 is grounded.
[0021]
As shown in FIG. 7, the wire contact sensing device 7 has a series circuit composed of a diode D1, a sensing circuit protection resistor R1 and a sensing resistor R2, a photocoupler 21 connected in parallel to the sensing resistor R2, and an output of the photocoupler 21. An amplifying transistor Q2 is input to the base terminal. As a result, the wire clamper 4 is grounded via the diode D1, the sensing circuit protection resistor R1, and the sensing resistor R2. Therefore, when the two-terminal switching relay 26 is connected (closed) to the low voltage power source 23 side and the voltage from the low voltage power source 23 is applied to the electric torch 6, when the electric torch 6 contacts the wire 5, the low voltage power source 23. The short circuit current I flows through the closed circuit of the low voltage side protection resistor R4, the two-terminal switching relay 26, the electric torch 6, the wire 5, the wire clamper 4, the diode D1, the sensing circuit protection resistor R1, and the sensing resistor R2. A semiconductor light emitting element (light emitting diode) D2 of a photocoupler 21 is connected in parallel to the sensing resistor R2, and the output of the phototransistor Q1 constituting the photocoupler 21 is input to the base of the amplifying transistor Q2. That is, the phototransistor Q1 and the amplifying transistor Q2 are Darlington connected. The output of the Darlington circuit composed of the phototransistor Q1 and the amplifying transistor Q2 becomes a control signal for the relay drive circuit 27.
[0022]
When the feeding length of the wire 5 from the capillary 3 is long as shown in FIG. 3 and when the feeding portion 5 of the wire is bent as shown in FIG. 4, when the electric torch 6 is moved horizontally at a constant speed, At least the bottom of the recess of the electric torch protrusion 6 a contacts the wire 5. At this time, a closed circuit of the low voltage power source 23, the low voltage side protection resistor R4, the two-terminal switching relay 26, the electric torch 6, the wire 5, the wire clamper 4, the diode D1, the sensing circuit protection resistor R1, and the sensing resistor R2 is formed. A short circuit current I flows in the closed circuit. When a predetermined potential difference occurs between both ends of the sensing resistor R2 based on the short circuit current I, the semiconductor light emitting element (light emitting diode) D2 is turned on, a current flows through the phototransistor Q1, and the collector-emitter voltage of the amplifying transistor Q2 Decreases. The longer the feeding length of the wire 5 is, the longer the feeding portion of the wire 5 can come into contact with the bottom of the concave portion of the electric torch projection 6a, so that the light emitting diode D2 is lit for a longer time. The decrease in the collector-emitter voltage of the amplifying transistor Q2 becomes significant. If the feeding length of the wire 5 is longer than the predetermined value (optimum value) by more than the barrier height Δ, the detection distance measured in the swing direction of the concave portion of the electric torch protrusion 6a is moved horizontally at a constant speed. After passing, the tip of the wire comes into contact with the electric torch discharge surface 6c. The “detection distance” is measured in the swing direction and corresponds to the thickness of the electric torch protrusion 6a. On the other hand, when the feeding length of the wire 5 is longer than the optimum value but not so long as to exceed the barrier height Δ, the electric torch discharge surface after passing the detection distance of the concave portion of the electric torch protrusion 6a by horizontal movement. Since the tip of the wire does not come into contact with 6c, the light emitting diode D2 is lit only for a certain period of time when the wire feeding portion 5 is dragged and in contact. The lighting time of the light emitting diode D <b> 2 can be approximately proportional to the amount longer than the optimum value of the feeding length of the wire 5. If the lighting time of the light emitting diode D2 is longer than a predetermined time, the collector-emitter voltage of the amplifying transistor Q2 is lowered to a value lower than a predetermined value (bonding lower limit voltage). The collector-emitter voltage of the amplifying transistor Q2 lower than the bonding lower limit voltage is input as a control signal to the relay drive circuit 27, and the two-terminal switching relay 26 is kept connected to the low voltage power source 23 side. In this case, wire bonding is not performed. Then, the capillary drive device 3a moves the capillary 3 relatively upward or readjusts the wire 5 from the capillary 3 so that the feeding length of the wire 5 is shortened.
[0023]
On the other hand, when the feeding length of the wire 5 from the capillary 3 is too short, the electric torch protrusion 6a does not come into contact with the wire 5 even if the electric torch 6 is moved horizontally, so that the low voltage power supply 23 and the low voltage side protective resistance R4 , The two-terminal switching relay 26, the electric torch 6, the wire 5, the wire clamper 4, the diode D1, the sensing circuit protection resistor R1, and the sensing resistor R2, the short circuit current I does not flow. Therefore, no potential difference is generated between the sensing resistors R2 and the light emitting diode D2 is not lit, so that no current flows through the phototransistor Q1, the collector-emitter voltage of the amplifying transistor Q2 remains high, and the ball 5 is connected to the tip of the wire 5 5a is not formed. Therefore, also in this case, wire bonding is not performed. Then, the capillary drive device 3a moves the capillary 3 relatively downward or readjusts the length of the wire 5 from the capillary 3 to be extended.
[0024]
As described above, when the feeding length of the wire 5 is longer than the optimum value, as the feeding length of the wire 5 becomes shorter, the time for which the wire comes into contact with the concave portion of the electric torch protruding portion 6a is shortened due to the horizontal movement. The lighting time of D2 is gradually shortened. When the feeding length of the wire 5 from the capillary 3 is gradually adjusted to be close to a desired length, the tip of the wire 5 comes into contact with the bottom of the electric torch protrusion 6a for a time corresponding to the detection distance. It will be. Alternatively, due to the micro unevenness at the bottom of the electric torch protrusion 6a, a contact is made instantaneously and suddenly while moving in the swing direction. Although the electric torch protrusion 6a and the wire 5 are not in mechanical contact, a tunnel current, a field emission current, a discharge current, or the like may flow. Therefore, when the feeding length of the wire 5 is adjusted to an appropriate length, the low voltage power source 23, the low voltage side protection resistor R4, the two-terminal switching relay 26, the electric torch 6, the wire 5, the wire clamper 4, and the diode D1. In the closed circuit of the sensing circuit protection resistor R1 and the sensing resistor R2, the short-circuit current I flows for a time corresponding to the detection distance (the thickness of the electric torch protrusion 6a). A potential difference occurs between both ends of the sensing resistor R2 based on the short-circuit current I for a short time, and the light emitting diode D2 is lit only for a short time corresponding to the detection distance (or intermittently lit), and a small current is applied to the phototransistor Q1. Flowing. Since the total amount of light from the light emitting diode D2 is smaller than when the wire 5 is extended, the current output from the phototransistor Q1 is very small. For this reason, the collector-emitter voltage of the amplifying transistor Q2 has a relatively high lower limit (bonding lower limit voltage). However, the collector-emitter voltage of the amplifying transistor Q2 has a relatively low upper limit (bonding upper limit voltage) as compared with the case where the wire 5 is too short and the light emitting diode D2 is not lit at all. Therefore, a voltage value within a range between the lower limit (bonding lower limit voltage) and the upper limit (bonding upper limit voltage) is a control signal that can be bonded. When this bondable control signal is input to the relay drive circuit 27, the relay drive circuit 27 drives the two-terminal switching relay 26 and applies the high-voltage power supply 22 to one end of the electric torch 6 via the high-voltage side protective resistor R3. Connecting. As a result, a discharge occurs between the electric torch 6 and the tip of the wire 5 in the optimum discharge gap defined by the barrier height Δ, and the tip of the wire 5 melts to form a ball 5a having a size as designed. It is formed. Note that a protection circuit is connected to the photocoupler 21 and the like so that a high voltage is not applied, but illustration thereof is omitted.
[0025]
In the embodiment of the present invention, when the feeding length of the wire 5 is too long, when the distance between the tip of the wire 5 and the electric torch 6 is too wide, and when the tip of the wire 5 is bent, This state can be detected easily and reliably. That is, the adjustment step of the wire 5 feeding length and the determination of whether or not the wire 5 of the electric torch protrusion 6a is in contact with the wire 5 by the horizontal movement of the electric torch 6 until the feeding length of the wire 5 reaches an appropriate length. By repeating the steps by cutting and trying, an appropriate and efficient wire bonding operation can be performed. For this reason, reliable and favorable wire bonding can be performed with high productivity.
[0026]
(Bonding method)
Next, the bonding method according to the embodiment of the present invention will be described with reference to FIGS.
[0027]
(A) First, the semiconductor chip 9 is mounted on the package substrate (or the support substrate of the lead frame) 11 and fixed using a conductive paste, gold (Au) -tin (Sn) solder, or the like. Then, as shown in FIG. 5A, the package substrate 11 on which the semiconductor chip 9 is mounted is mounted on a package mounting stage (lead frame mounting stage) 12 of a wire bonder. The package mounting stage 12 heats the package substrate 11 to a temperature necessary for thermocompression bonding. Then, the wire 5 is led out from the capillary 3 of the wire bonder with a constant feeding length.
[0028]
(B) Next, as shown in FIG. 5B, the electric torch 6 is swung (horizontally moved) to the first bonding point 1 at a constant speed. As already described, when the feeding length of the wire 5 from the capillary 3 is too long (see FIG. 3), when the feeding is bent (see FIG. 4), and the distance between the tip of the wire 5 and the electric torch 6 When is opened too much, these abnormalities are electrically detected, and the wire bonding operation is not executed. Then, the step of adjusting the feeding length and the step of determining whether or not the wire 5 of the electric torch protruding portion 6a is moved horizontally by the electric torch 6 are cut until the feeding length of the wire 5 reaches an appropriate length.・ Repeat with and-try. As a result of adjusting the extension length of the wire 5, if the extension length becomes appropriate as shown in FIG. 5C, the collector-emitter voltage of the amplifying transistor Q2 outputs a voltage value within a specified range. A voltage value within the specified range is input as a control signal for the relay drive circuit 27, the two-terminal switching relay 26 is driven, and the high voltage power supply 22 is connected to one end of the electric torch 6. Thus, a discharge is generated in a state where the gap between the electric torch 6 and the tip of the wire 5 shown in FIG. 5C is adjusted to the optimum discharge gap Δ, and the tip of the wire 5 is melted to form the ball 5a.
[0029]
(C) After the ball 5 a is formed at the tip of the wire 5, the electric torch 6 returns to a position away from the first bonding point 1 as shown in FIG. Then, the capillary drive device 3a moves the capillary 3 directly above the bonding pad 8 of the semiconductor chip 9 as shown in FIG. Thereafter, as shown in FIG. 6 (f), the capillary 3 is lowered to the surface of the semiconductor chip 9 and the wire 5 is supplied to the surface of the bonding pad 8. In the state shown in FIG. 6F, the wire 5 is pressed against the bonding pad 8 for thermocompression bonding, or ultrasonic bonding is performed by applying ultrasonic waves.
[0030]
(D) Next, the capillary drive device 3a is driven to raise the capillary 3 as shown in FIG. 6 (g). Furthermore, the capillary drive device 3a moves the capillary 3 to the second bonding point 2 shown in FIG. 6 (i) while drawing an appropriate locus via the state shown in FIG. 6 (h). With this locus of the capillary 3, an appropriate wire loop 5 as shown in FIG. 6 (i) is obtained.
[0031]
(E) When the capillary 3 comes to the position of the second bonding point 2, as in the case of the first bonding point 1, the tip of the capillary 3 is used to press the wire 5 against the lead terminal 13 for thermocompression bonding. Alternatively, ultrasonic bonding is performed by applying ultrasonic waves. As a result, as shown in FIG. 6 (i), the bonding pads 8 on the surface of the semiconductor chip 9 and the lead terminals 13 are electrically connected by the wires 5.
[0032]
(F) Next, the capillary drive device 3a is driven to raise the capillary 3, hold the wire 5 with the wire clamper 4, and cut the wire 5 from the second bonding point 2 as shown in FIG. 6 (j). . When this is completed, the process returns to FIG. 5A again, and the same operation is performed on the other bonding pads on the surface of the semiconductor chip 9.
[0033]
(Other embodiments)
Although the present invention has been described in the above form, it should not be understood that the parts and drawings that form a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.
[0034]
For example, the feeding length of the wire 5 from the capillary 3 can be feedback-controlled using a signal from the wire contact sensing device 7. That is, when the feeding length of the wire 5 is longer than the optimum value, the extra length of the feeding length of the wire 5 is the time when the feeding portion of the wire is dragged to the recess of the electric torch protrusion 6a by horizontal movement. Therefore, the lighting time of the semiconductor light emitting element (light emitting diode) D2 or the collector-emitter voltage of the amplifying transistor Q2 is fed back to the capillary drive device 3a and the clamper drive device 4a, and the position of the tip of the wire 5 is It is possible to control the gap between the torch protrusion 6a and the wire 5 so as to have an optimum gap value. The vertical driving of the position of the tip of the wire 5 may be controlled using electromagnetic driving, a magnetostrictive element, or an electrostrictive element as in a scanning tunneling microscope. Alternatively, the wire contact sensing device 7 may detect and feed back a minute current flowing through a minute air gap existing between the electric torch protrusion 6a and the wire 5. That is, even if the contact is not mechanical, if the gap value is less than a certain value, a tunnel current, a field emission current, a discharge current, or the like is present between the electric torch protrusion 6a and the wire 5. Since a minute current flows, these may be detected. For the measurement of the minute current, a high-sensitivity current detection circuit may be used in series with the sensing circuit protection resistor R1 and the sensing resistor R2 separately from the photocoupler 21 shown in FIG. That is, as in the scanning tunnel microscope, these minute currents are fed back to the capillary drive device 3a and the clamper drive device 4a so that the position of the tip of the wire 5 is optimal between the electric torch protrusion 6a and the wire 5. You may control so that it may become a small gap value.
[0035]
As described above, the present invention naturally includes embodiments and the like which are not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.
[0036]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the wire bonder which can form reliably at the front-end | tip of a ball wire of an appropriate magnitude | size at the time of wire bonding with sufficient reproducibility can be provided. As a result, bonding failure can be prevented, and a semiconductor device with improved electrical reliability can be mounted.
[0037]
Further, according to the present invention, it is possible to provide a bonding method capable of suppressing the generation of defective balls. As a result, product defects associated with bonding defects can be reduced and yield can be improved.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram for explaining a wire bonder according to an embodiment of the present invention.
FIG. 2 (a) is a side view of the electric torch according to the embodiment of the present invention, and FIG. 2 (b) is a front view thereof.
FIG. 3 (a) is a side view showing the relationship between the electric torch and the wire according to the embodiment of the present invention, and FIG. 3 (b) is a front view thereof.
FIG. 4 is another schematic diagram (front view) showing the relationship between the electric torch and the wire according to the embodiment of the present invention.
FIGS. 5A to 5D are schematic process diagrams (part 1) for explaining a bonding method according to an embodiment of the present invention.
FIGS. 6E to 6J are schematic process diagrams (part 2) for explaining the bonding method according to the embodiment of the present invention.
FIG. 7 is a schematic view focusing on a current path of the bonding apparatus according to the embodiment of the present invention.
FIG. 8 is a schematic configuration diagram for explaining a wire bonder according to a conventional technique.
[Explanation of symbols]
1 First bonding point
2 Second bonding point
3 Capillary
3a Capillary drive device
4 Wire clamper
4a Wire clamper drive device
5 wires
5a ball
6 Electric torch
6a Electric torch protrusion
6b Electric torch body
6c Electric torch discharge surface
6d electric torch drive device
7 Wire contact sensing device
8 Bonding pads
9 Semiconductor chip
11 Package substrate (or lead frame)
12 Package placement stage (lead frame placement stage)
13 Lead terminal
21 Photocoupler
22 High voltage power supply
23 Low voltage power supply
26 2-terminal switching relay
27 Relay drive circuit
28 Power supply
29 Relay
36 Flat Electric Torch

Claims (12)

ワイヤを繰り出すキャピラリと、
前記ワイヤをクランプするワイヤクランパと、
該ワイヤクランパに電気的に接続されたワイヤ接触感知装置と、
前記キャピラリからの繰り出された前記ワイヤの先端との間で放電を生じさせるための平坦な表面を有する電気トーチ本体部、前記ワイヤの繰り出し長が最適値よりも長すぎる場合には、前記ワイヤが接触するように、前記電気トーチ本体部の端部に一定の障壁高さを有するように設けられた電気トーチ突出部とを備えた電気トーチと、
前記電気トーチに接続され、前記電気トーチ突出部が前記ワイヤに接触したとき、前記電気トーチ、前記ワイヤ、前記ワイヤクランパ，前記ワイヤ接触感知装置を経由する閉回路を形成し、前記電気トーチ突出部と前記ワイヤとの接触を前記ワイヤ接触感知装置に検知させる低圧電源と、
前記電気トーチを水平方向に移動させる電気トーチ駆動装置
とを備えることを特徴とするワイヤボンダ。A capillary for feeding out the wire;
A wire clamper for clamping the wire;
A wire contact sensing device electrically connected to the wire clamper;
An electric torch main body having a flat surface for generating a discharge with the tip of the wire drawn out from the capillary, and when the wire drawing length is too long than the optimum value, the wire An electric torch provided with an electric torch protrusion provided to contact the end of the electric torch main body so as to have a certain barrier height;
When the electric torch protrusion contacts with the wire, the electric torch protrusion forms a closed circuit via the electric torch, the wire, the wire clamper, and the wire contact sensing device. A low-voltage power supply that causes the wire contact sensing device to detect contact with the wire ;
An electric torch drive device that moves the electric torch in a horizontal direction. 前記電気トーチ突出部は、中央部が前記障壁高さであり、その両側は中央部に比して高く構成されていることを特徴とする請求項１に記載のワイヤボンダ。2. The wire bonder according to claim 1, wherein the electric torch protruding portion is configured such that a central portion has the barrier height, and both sides thereof are higher than the central portion. 前記電気トーチ突出部は、垂直の側壁を有した凹多角形のブロックとして形成され、前記中央部に構成された凹部の底部が前記障壁高さを定義するように、一定の横幅の範囲内において、平坦に構成されていることを特徴とする請求項２に記載のワイヤボンダ。The electric torch protrusion is formed as a concave polygonal block having a vertical side wall, and the bottom of the recess formed in the central portion defines the barrier height within a certain lateral width. The wire bonder according to claim 2, wherein the wire bonder is configured to be flat. 前記障壁高さは、所望の大きさのボールを前記ワイヤの先端に形成するための最適放電ギャップに設定されていることを特徴とする請求項１〜３のいずれか１項に記載のワイヤボンダ。The wire bonder according to any one of claims 1 to 3, wherein the barrier height is set to an optimum discharge gap for forming a ball of a desired size at the tip of the wire. 前記ワイヤ接触感知装置は、
前記ワイヤクランパと接地間に電気的に挿入された感知抵抗と、
該感知抵抗に並列接続されたフォトカプラと、
該フォトカプラの出力をベース端子に入力する増幅用トランジスタ
とを含むことを特徴とする請求項１〜４のいずれか１項に記載のワイヤボンダ。The wire contact sensing device comprises:
A sensing resistor electrically inserted between the wire clamper and ground;
A photocoupler connected in parallel to the sensing resistor;
The wire bonder according to any one of claims 1 to 4, further comprising an amplifying transistor that inputs an output of the photocoupler to a base terminal. 前記ワイヤクランパと接地間に、前記感知抵抗、ダイオード及び感知回路保護抵抗とからなる直列回路が挿入されていることを特徴とする請求項５に記載のワイヤボンダ。The wire bonder according to claim 5, wherein a series circuit including the sensing resistor, a diode, and a sensing circuit protection resistor is inserted between the wire clamper and the ground. 前記フォトカプラは、半導体発光素子と該半導体発光素子の光を検出するフォトトランジスタとからなり、該フォトトランジスタと前記増幅用トランジスタとはダーリントン接続されていることを特徴とする請求項５又は６に記載のワイヤボンダ。7. The photocoupler includes a semiconductor light emitting element and a phototransistor that detects light of the semiconductor light emitting element, and the phototransistor and the amplifying transistor are Darlington connected. The wire bonder described. 前記電気トーチと前記低圧電源との間に挿入された２端子切り替えリレーと、
前記ワイヤ接触感知装置の出力信号を入力し前記リレーを駆動するリレー駆動回路
とを更に備えることを特徴とする請求項１〜７のいずれか１項に記載のワイヤボンダ。A two-terminal switching relay inserted between the electric torch and the low-voltage power source;
The wire bonder according to claim 1, further comprising a relay drive circuit that inputs an output signal of the wire contact sensing device and drives the relay. 前記２端子切り替えリレーの一方の端子に前記低圧電源が接続され、
前記２端子切り替えリレーの他方の端子に、前記低圧電源より高電圧の高圧電源が接続され、
該高圧電源により、前記電気トーチと前記ワイヤの先端との間に放電を生じさせることを可能としたことを特徴とする請求項８に記載のワイヤボンダ。The low-voltage power supply is connected to one terminal of the two-terminal switching relay;
A high-voltage power source having a higher voltage than the low-voltage power source is connected to the other terminal of the two-terminal switching relay ,
9. The wire bonder according to claim 8 , wherein a discharge can be generated between the electric torch and the tip of the wire by the high-voltage power source . キャピラリからワイヤを、繰り出す工程と、
平坦な表面を有する電気トーチ本体部、該電気トーチ本体部の端部に一定の障壁高さを有するように設けられた電気トーチ突出部とを備えた電気トーチを水平移動させる工程と、
該水平移動により得られる、前記電気トーチ突出部と前記ワイヤとの相対関係を、前記ワイヤをクランプしているワイヤクランパに電気的に接続されたワイヤ接触感知装置で判定する工程と、
該ワイヤ接触感知装置により、前記ワイヤの先端と前記電気トーチ本体部の表面との距離が、最適放電ギャップであると判定された場合に、前記ワイヤと前記電気トーチ本体部との間に高電圧を印加し、前記ワイヤの先端にボールを形成する工程
とを含むことを特徴とするボンディング方法。A step of feeding a wire from a capillary;
A step of horizontally moving an electric torch comprising an electric torch main body having a flat surface and an electric torch protrusion provided at an end of the electric torch main body so as to have a certain barrier height;
Determining the relative relationship between the electric torch protrusion and the wire obtained by the horizontal movement with a wire contact sensing device electrically connected to a wire clamper clamping the wire;
When the wire contact sensing device determines that the distance between the tip of the wire and the surface of the electric torch main body is an optimum discharge gap, a high voltage is applied between the wire and the electric torch main body. And a step of forming a ball on the tip of the wire. 前記電気トーチを一定速度で水平移動して、前記ワイヤと前記電気トーチ突出部とを接触させることを特徴とする請求項１０に記載のボンディング方法。The bonding method according to claim 10, wherein the electric torch is horizontally moved at a constant speed to bring the wire and the electric torch protrusion into contact with each other. 前記ワイヤ接触感知装置は、前記ワイヤクランパと接地間に電気的に挿入された感知抵抗と、該感知抵抗に並列接続された半導体発光素子とを備え、
前記キャピラリから繰り出された前記ワイヤの余分な長さに対応した時間、前記半導体発光素子を点灯させることにより、前記ワイヤの長さを検知し、前記ワイヤの先端と前記電気トーチ本体部の表面との距離が最適放電ギャップであるか否かを判定することを特徴とする請求項１１に記載のボンディング方法。The wire contact sensing device includes a sensing resistor electrically inserted between the wire clamper and ground, and a semiconductor light emitting device connected in parallel to the sensing resistor,
By lighting the semiconductor light emitting element for a time corresponding to the extra length of the wire drawn out from the capillary, the length of the wire is detected, and the tip of the wire and the surface of the electric torch main body The bonding method according to claim 11, wherein it is determined whether or not the distance is an optimum discharge gap.
JP2001349083A 2001-11-14 2001-11-14 Wire bonder and bonding method Expired - Fee Related JP3552700B2 (en)

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