JP3551873B2 - Electronic component manufacturing method and device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, stabilization of a bending position at the time of performing a bending process and clevis (Clevis) are performed on a lead of an electronic component in which an electronic element such as a quartz oscillator is mounted on a lead frame and the whole is molded with a sealing resin. The present invention relates to a method and apparatus for bending a lead of an electronic component capable of preventing generation of a gap.
[0002]
[Prior art]
FIGS. 6A and 6B are a perspective view of a crystal unit and explanatory views of leads of the crystal unit.
The crystal resonator 1 includes a resin mold part 2 in which electronic elements and the like are built, and leads 3 protruding from the resin mold part 2. A concave portion 2 a for accommodating the tip end of the lead 3 is provided at the bottom of the resin mold portion 2, and the lead 3 is bent to the bottom side so as to surround the side portion of the resin mold portion 2. The tip of the lead 3 is housed in the recess 2a. By folding the lead 3 toward the bottom of the resin mold portion 2 in this manner, the height H of the crystal unit 1 including the resin mold portion 2 and the lead 3 is reduced, and the thickness and size are reduced. Such forming of the lead 3 is performed by bending three times using a progressive press die.
[0003]
FIG. 7 shows the bent state of the lead in each bending process, wherein an arrow a indicates a state before the bending, and an arrow b indicates that the root portion of the lead 3 is upwardly bent by the first bending process and the tip is bent. An arrow c indicates a state where the root portion of the lead 3 is bent downward by the second bending process. Then, finally, the tip of the lead 3 is folded toward the bottom by the third bending process to form the state shown in FIG. 6B.
[0004]
FIG. 8 is a diagram illustrating a press processing unit (stage) that performs the second bending.
The second bending stage includes a die 11, a stripper plate 12, and a punch 13. The lead 3 of the crystal unit 1 mounted on the die 11 is pressed on the die 11 by the stripper plate 12. In a fixed state, the punch 13 is lowered to perform press bending.
[0005]
[Problems to be solved by the invention]
However, in the above-mentioned second bending stage, the space between the stripper plate 12 and the die 11 for holding down the lead 3 (arrow d in the drawing) is small, so that the product cannot be fixed sufficiently. For this reason, although the root of the lead 3 must be bent at the edge position of the die 11, the lead 3 is actually bent from its base with respect to the resin mold 2. When the third bending process is further performed in this state, a gap (hereinafter, referred to as a clevis) is generated at a root portion of the lead 3 with respect to the resin mold portion 2 as shown in FIG. In addition, if the crystal resonator 1 is bent from the root portion in this manner, the height H of the entire crystal unit 1 is increased, and there is a problem that the required quality of the height cannot be secured.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method and an apparatus for bending a lead of an electronic component capable of stabilizing a bending position and preventing the occurrence of clevis during a bending process. .
[0007]
[Means for Solving the Problems]
(1) A method for manufacturing an electronic component according to one aspect of the present invention is a method for manufacturing an electronic component including a resin mold portion having a built-in electronic element and a lead protruding from the resin mold portion. A first step of forming a V-shaped groove near the root of the lead and bending a first portion of the lead to form a first bent portion, and pressing the tip of the lead. And a second step of bending the lead near the V-shaped groove downward.
[0008]
(2) In a method for manufacturing an electronic component according to another aspect of the present invention, the V-shaped groove of (1) is formed so as to be in a range of 1/3 to 1/2 of the thickness of the lead. is there.
[0009]
(3) In a method for manufacturing an electronic component according to another aspect of the present invention, in the second step (1) or (2), the lead is bent so as not to close the V-shaped groove.
(4) In a method for manufacturing an electronic component according to another aspect of the present invention, in any one of (1) to (3), the electronic component is a quartz oscillator.
[0010]
(5) An apparatus for manufacturing an electronic component according to another aspect of the present invention is a method for manufacturing an electronic component for manufacturing an electronic component including a resin mold part having a built-in electronic element and leads protruding from the resin mold part. An apparatus for bending a first portion of a lead to form a first bent portion , tilting the lead upward, and forming a V-shaped groove near a root of the lead. A punch, a first bending die formed corresponding to the first bending punch, a second bending punch for bending the vicinity of the root of the lead, and a second bending punch arranged to correspond to the second bending punch. A second bending die, a cam driver for further bending the bent portion near the root, and a third bending formed corresponding to the cam tribar. Has a wrench, at least, the first bending die in which projections for forming the V-shaped groove in the vicinity of the root of the lead is formed.
[0011]
(6) In the electronic component manufacturing apparatus according to another aspect of the present invention, the angle of the apex of the protrusion in the above (5) is set in a range of 60 ° to 80 °.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 2 is a cross-sectional view showing a configuration of a mold in which the electronic component manufacturing apparatus according to one embodiment of the present invention is incorporated.
The mold includes a lower die on which a die serving as a lower die processing portion is mounted, and an upper die on which a puncher serving as an upper die processing portion and a stripper for pressing and fixing an electronic component on the die are mounted. Are guided by a guide post (not shown) to perform an ascending / descending operation, and a lifter (not shown) lifts the lead frame from the upper surface of the die and sequentially punches and bends the lead frame at a predetermined pitch to manufacture the electronic component shown in FIG. Is what you do.
[0013]
In FIG. 2, reference numeral 100 denotes an upper die set. An upper die backing plate 101 is attached to a lower surface of the upper die set 100, and a punch plate 102 is attached to a lower surface of the upper die backing plate 101. Below the punch plate 102, a stripper plate 104 elastically supported by the upper die set 100 is arranged, and a stripper backing plate 103 is attached to the back side of the stripper plate 104. The stripper plate 104 incorporates stripper pieces such as a stripper A 104a, a stripper B 104b, and a stripper C04c for each process.
[0014]
Further, a misfeed pin 107 is attached to the upper die set 100 on the upstream side and the downstream side of the processing. The punch plate 102 has a gate cut punch 106, a tie bar cut punch 110, a lead cut punch 111, a bending punch A 112, a bending punch B 113, a cam driver 114, and a pinch cut punch 115 from the upstream side to the downstream side of the processing. Is attached. Then, these members (except for the cam driver 114) project downward through the holes provided in the stripper backing plate 103 and the stripper plate 104 when the upper die set 100 is lowered. Note that a bending punch C116 is disposed below the cam driver 114, and the bending punch C116 is supported by the stripper plate 104 via a coil spring 118. An upper stopper 120 is attached to the upper die set 100.
[0015]
A lower die set 200 is disposed below and opposite the upper die set 100, and a lower die backing plate 201 is mounted on the upper surface of the lower die set 200, and a die plate 202 is mounted thereon. Has been. The die plate 202 includes a gate cut die 206, a tie bar cut die 210, a lead cut die 211, a bending die A 212, a bending die B 213, a bending die C 216, and a pinch cut die 215 from the upstream side to the downstream side of the processing. At the center of the bending die A212, an ejector pin 221 elastically supported by a spring 222 is provided. The lower die set 200 is provided with a lower stopper 220 facing the upper stopper 120, and the lower die backing plate 201 and the die plate 202 are provided with holes into which the misfeed pins 107 are inserted at the time of pressing. (Not shown).
[0016]
The outline of the operation of the mold shown in FIG. 2 is as follows.
When the upper die set 100 is guided and lowered by a guide post (not shown), first, the stripper plate 104 presses the lead frame disposed on the die plate 202. Then, the punch plate 102 is lowered to perform the next press processing.
(1) The gate is cut by press working with the gate cut punch 106 and the gate cut die 206.
(2) The tie bar on the lead frame is cut by press working with the tie bar cut punch 110 and the tie bar cut die 210.
(3) The lead 3 protruding from the resin mold portion 2 is cut to a predetermined length by press working with the lead cut punch 111 and the lead cut die 211.
[0017]
{Circle around (4)} The first bending process is performed on the lead 3 by pressing using a first bending stage including the bending punch A112, the bending die A212, the stripper A104a, and the ejector pin 221 (see FIG. 1).
{Circle around (5)} The second bending stage including the bending punch B113, the bending die B213 and the stripper B104b performs the second bending process on the lead 3 by press working (see FIG. 3).
{Circle around (6)} The third bending process is performed on the lead 3 by pressing using a third bending stage including the bending punch C116, the bending die C216, and the stripper C104c (see FIG. 4).
{Circle around (7)} The upper surface of the resin mold portion 2 is pressed by the punch 115 by press working with the pinch cut punch 115 and the pinch cut die 215, and the resin mold portion 2 in which the lead 3 is bent is separated from the lead frame. It is discharged downward through a hole 201a provided in the backing plate 201 and a hole 200a provided in the lower die set 200.
[0018]
Although the above-mentioned press processing of (1) to (7) is performed simultaneously, the lead frame is sequentially sent from the upstream side to the downstream side of the processing every time the press processing is performed. The pressing processes of ▼ to ７7 are sequentially performed. The misfeed pin 107 is for detecting the feed amount of the lead frame. If the lead frame feed amount is appropriate, the lead frame descends through holes provided in the lead frame at predetermined intervals. If the lead frame feed amount is inappropriate, the misfeed pin 107 hits the lead frame. Would. By detecting the amount of movement of the misfeed pin 107, in such a case, the press working is stopped by performing processing such as stopping the lowering of the upper die set 100. Further, the upper stopper 120 and the lower stopper 220, which are arranged to face each other, regulate the descending amount of the upper die set 100, that is, each punch, so that appropriate press working is performed.
[0019]
FIG. 1 is an explanatory diagram of a first bending process in a first bending stage.
In the bending die A212, an inclined protrusion 212a is formed in a region corresponding to the lead piece 3a between the root portion and the intermediate portion of the lead 3, and the surface of the protrusion 212a has a crystal oscillator. A projection 212b having an inverted V-shaped cross section is formed at a portion corresponding to the root of the lead 3 in a state where 1 is mounted on the ejector pin 221. The protrusion 212b forms an inverted V-shaped V-shaped groove on the lower surface side of the base of the lead 3. The height of the protrusion 212b is determined in consideration of the strength of the lead 3 after bending. The thickness of the V-shaped opening is preferably determined so that the V-shaped groove formed in the lead 3 is not closed after the second bending. That is, the angle of the vertex is desirably 60 ° to 80 °. The tip of the projection 212b preferably has a curved surface with a radius of curvature of 0.01 mm or more in order to prevent the lead 3 from cracking.
[0020]
In the first bending stage configured as described above, first, the stripper A104a descends prior to the bending punch A112, and pushes down the crystal resonator 1 which has been lifted up by the ejector pins 221 to bend the lead 3. It is pressed and fixed on the die A212. As a result, the entire lead 3 is slightly bent upward (for example, about 10 °), and the protrusion 212b provided on the surface of the bending die A212 cuts into the lower surface of the root of the lead 3 to form an inverted V-shape. A V-shaped groove 3c is formed. Then, while the lead 3 is pressed and fixed, the bending punch A112 descends to bend the lead piece 3b (first portion) between the middle part and the tip part of the lead 3 downward (for example, when the lead bending angle is 80).゜) The first bent portion 3d is formed, and the first bending process is performed.
[0021]
FIG. 3 is an explanatory diagram of the second bending process in the second bending stage.
The bending punch B113 has an inclined portion 113a formed inside the bending punch B113 so as to avoid pressing the root of the lead 3, and presses the tip 3a of the lead piece 3a as far as possible, ie, presses the vicinity of the first bent portion 3d. It is configured in shape. Also, in the bending die B213, an inclined portion 213a corresponding to the bending angle of the lead 3 is formed.
[0022]
In the second bending stage configured as described above, the bending punch B104b descends while the quartz oscillator 1 is positioned by the bending die B213 and the stripper B104b, and the vicinity of the first bent portion 3d is pressed. Then, it is bent at the position of the V-shaped groove 3c formed by the first bending process (the bending angle of the lead is, for example, 42 °), and the second bending process is performed.
[0023]
In this way, by forming the V-shaped groove 3c in advance, the bending position of the V-shaped groove 3c is stabilized, and bending at an appropriate position can be performed. Further, since the bending punch B113 is shaped to press the tip side of the lead piece 3a, the stress applied to the root of the lead 3 can be reduced. For this reason, the occurrence of clevis can be prevented.
[0024]
FIG. 4 is an explanatory diagram of the third bending process by the third bending stage.
The bending punch C116 is provided with an inner wall 116a having a predetermined angle with respect to the vertical direction (in this example, the inclination of the inner wall 116a is, for example, about 7 °). It has become. The inner wall end portion 116b of the bending punch C116 has a curved shape, and the curved surface portion of the tip portion 116b of the bending punch C116 starts abutting from the vicinity of the tip portion of the lead piece 3a during press working. It is.
[0025]
The bending punch C116 shown in FIG. 4 is driven by the cam driver 114 and descends obliquely, presses the second bent lead 3 shown in FIG. (The bending angle of the root portion of the lead is, for example, 83 °) and a third bending process is performed. In the third bending process, it is difficult to hold the lead 3 with the stripper C104c and the bending die C216 because of the processing of folding the lead 3, but the V-shaped groove 3c of the lead 3 is formed as described above. 2 is not completely closed even after the bending process, and a certain amount of opening is left. Therefore, the bending position is determined even in the third bending process in which the bending die C216 does not contribute to the bending process, and the bending process at an appropriate position is performed. Is performed. Further, the stress on the root of the lead 3 is reduced by the V-shaped groove 3c.
[0026]
As described above, according to the present embodiment, the protrusion 212b is provided on the surface of the bending die A212 of the first bending stage, and the inverted V-shaped V is formed on the lower surface side of the root of the lead 3 by the protrusion 212b. Since the V-shaped groove 3c is formed, the bending position at the time of the next second bending step is determined at the position of the V-shaped groove 3c, and the bending process can be performed at an appropriate position.
[0027]
In addition, since the bending punch B113 in the second bending stage is formed so as to press the tip end of the lead piece 3a as much as possible (approximately in the vicinity of the first bent portion 3d), the stress on the root of the lead 3 is reduced. can do. As a result, the stress applied to the root of the lead 3 is reduced, and the occurrence of clevis can be prevented. As a result, the height quality requirement of the crystal unit 1 can be satisfied.
[0028]
Further, in the third bending process in the third bending stage, the lead 3 cannot be pressed by the stripper C104c and the bending die C216 because the lead piece 3b is folded into the bottom of the resin mold part 2 because of the processing. Normally, it is difficult to specify the bending position. However, as in the present embodiment, the V-shaped groove 3c is formed so that the V-shaped groove 3c is not completely closed after the second bending step and a certain opening is left. Also in the third bending step, the bending position is determined and the bending can be performed at the correct position. Further, the stress on the root of the lead 3 is reduced by the V-shaped groove 3c.
[0029]
In the present embodiment, the lead 3 to be bent is described as an example in which the lead 3 is provided along the longitudinal direction of the resin mold portion 2 as shown in FIG. As shown, it is of course also possible to use one provided at both ends in the longitudinal direction.
[0030]
【The invention's effect】
As described above, according to the present invention, since the V-shaped groove is formed near the root of the lead at the time of the first step, the bending position in the next second step is determined at the position of the V-shaped groove. Can be bent at various positions. Further, in the next second step, since the leading end side of the lead is pressed, the stress applied to the root of the lead is reduced, and the generation of clevis can be prevented.
[0031]
Further, since the V-shaped groove is formed so as to be in the range of 1/3 to 1/2 of the plate thickness of the lead, the strength of the concave portion of the lead is maintained.
[0032]
Further, in the second step, since the lead is bent so as not to close the V-shaped groove, the bending position is determined at the V-shaped groove position in the next bending process, and the bending position is determined at an appropriate position. A bending process can be performed.
[0033]
In addition, since the bending process can be performed at an appropriate position in this manner, it is possible to form the lead of the crystal unit as an electronic component as desired, and to obtain a crystal unit that can satisfy the height quality requirement. Obtainable.
[0034]
Further, since a projection for forming a V-shaped groove near the root of the lead is formed in the first bending die for forming the first bent portion, a concave portion (V-shaped groove) is formed in the lead. Can be.
[0035]
Also, since the angle of the apex of the protrusion is set in the range of 60 ° to 80 °, the concave portion formed in the lead has a size that does not close even after bending near the root of the lead, and the bending near the root is The bending at the time of further bending the portion can be accurately performed.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a first bending process in a first bending stage of the present invention.
FIG. 2 is a configuration diagram of a press die into which an electronic component manufacturing apparatus according to an embodiment of the present invention is incorporated.
FIG. 3 is an explanatory diagram of a second bending process in a second bending stage.
FIG. 4 is an explanatory diagram of a third bending process in a third bending stage.
FIG. 5 is a perspective view of a lead of the crystal unit and an explanatory diagram of the lead of the crystal unit (part 1).
FIG. 6 is a perspective view of a lead of the crystal unit and an explanatory diagram of the lead of the crystal unit (part 2).
FIG. 7 is a state diagram in each step until a lead of the crystal resonator of FIG. 6 is obtained.
FIG. 8 is an explanatory view of a second bending stage for performing a second bending process on the lead of the crystal unit shown in FIG. 6;
FIG. 9 is an explanatory diagram of a clevis.
[Explanation of symbols]
1 crystal oscillators (electronic components)
2 Resin molded part 3 Lead 3a Lead piece 3b Lead piece (first part)
3c V-shaped groove 3d First bent portion 113 Bending punch B
212 Bending Die A
212b protrusion

Claims (6)

In a method of manufacturing an electronic component having a resin mold portion having a built-in electronic element and a lead protruding from the resin mold portion,
A first step of forming a V-shaped groove near the root of the lead at the same time as bending the vicinity of the root of the lead upward, and bending a first portion of the lead to form a first bent portion ;
A second step of bending the lead near the V-shaped groove downward,
A method for producing an electronic component having at least: The method according to claim 1, wherein the V-shaped groove is formed so as to be in a range of １ ／ to の of a thickness of the lead. The method according to claim 1, wherein the lead is bent so as not to close the V-shaped groove in the second step. 4. The method according to claim 1, wherein the electronic component is a quartz oscillator. An electronic component manufacturing apparatus for manufacturing an electronic component having a resin mold portion containing an electronic element and leads protruding from the resin mold portion,
A first bending punch for bending a first portion of the lead to form a first bent portion , tilting the lead upward, and forming a V-shaped groove near a root of the lead ; A first bending die formed corresponding to the first bending punch;
A second bending punch for bending the vicinity of the root of the lead, and a second bending die arranged corresponding to the second bending punch;
A cam driver for further bending the bent portion near the root, a third bending punch formed corresponding to the cam driver,
Has at least
An apparatus for manufacturing an electronic component, wherein a protrusion for forming a V-shaped groove is formed near a root of the lead on the first bending die. 6. The electronic component manufacturing apparatus according to claim 5, wherein an angle of a vertex of the protrusion is set in a range of 60 to 80 degrees.

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