CN116571657B - Stamping forming equipment is used in diode subassembly production - Google Patents

Stamping forming equipment is used in diode subassembly production Download PDF

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Publication number
CN116571657B
CN116571657B CN202310566169.2A CN202310566169A CN116571657B CN 116571657 B CN116571657 B CN 116571657B CN 202310566169 A CN202310566169 A CN 202310566169A CN 116571657 B CN116571657 B CN 116571657B
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China
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fixedly connected
plate
diode
outside
stamping
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CN116571657A (en
Inventor
张帆
张延颇
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Jiangsu Poppula Semiconductor Co ltd
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Jiangsu Poppula Semiconductor Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21FWORKING OR PROCESSING OF METAL WIRE
    • B21F1/00Bending wire other than coiling; Straightening wire
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

The invention discloses a stamping forming device for producing a diode component, which specifically comprises the following components: the base is provided with a stable bottom plate and a rubber bottom plate arranged at the bottom of the base, a support column is fixedly connected above the base, a working box is fixedly connected above the support column, and a fixing plate is fixedly connected inside the working box; the collecting mechanism is used for collecting the diode assembly after stamping and moving the diode assembly outwards, the collecting mechanism comprises a conveying groove, a baffle is fixedly connected to the inside of the conveying groove, an electric push rod is fixedly connected to the outside of the baffle, and the conveying groove is formed in the fixing plate; the stamping mechanism is used for driving the diode component to move and conducting stamping bending treatment on the diode component, and comprises a fixed column. The stamping forming equipment for producing the diode component achieves the purpose of improving the service efficiency of the equipment.

Description

Stamping forming equipment is used in diode subassembly production
Technical Field
The invention relates to the technical field of diodes, in particular to stamping forming equipment for diode component production.
Background
A diode is an electronic device made of semiconductor material. The diode has two electrodes, an anode, also called anode; the negative electrode, called the negative electrode, turns on the diode when a forward voltage is applied between two stages of the diode, and turns off the diode when a reverse voltage is applied. The on and off of the diode corresponds to the on and off of the switch. The diode has unidirectional conductivity, and the current flows from the anode to the cathode through the tube when conducting. Diodes are one of the earliest emerging semiconductor devices and are very widely used. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, so that the functions of rectifying alternating current, detecting modulated signals, limiting amplitude, clamping, stabilizing power supply voltage and the like can be realized. The trail of the diode can be found either in common radio circuits or in other household appliances or industrial control circuits.
At present, stamping forming equipment is used in diode subassembly production, after bending the work to the diode, the diode can the downward movement, falls into equipment bottom, because the quantity is great, the diode is piled up and is twined together easily, is difficult to collect, and when the diode does not accord with the dimensional requirement, is difficult to discharge the diode that does not accord with the requirement from equipment.
Disclosure of Invention
In order to solve the technical problems, the present invention provides a press forming device for producing a diode assembly, which specifically includes:
the base is provided with a stable bottom plate and a rubber bottom plate arranged at the bottom of the base, a support column is fixedly connected above the base, a working box is fixedly connected above the support column, and a fixing plate is fixedly connected inside the working box;
the collecting mechanism is used for collecting the diode assembly after stamping and moving the diode assembly outwards, the collecting mechanism comprises a conveying groove and is used for receiving the diode, a baffle is fixedly connected to the inside of the conveying groove, an electric push rod is fixedly connected to the outside of the baffle, and the conveying groove is formed in the fixing plate;
the stamping mechanism is used for driving the diode component to move and conducting stamping bending processing on the diode component and comprises a fixed column, the driving component is fixedly connected to the outer part of the fixed column, a motor box is fixedly connected to the outer part of the fixed column, and the fixed column is fixedly connected to the upper surface of the fixed plate.
Preferably, the upper surface fixedly connected with swash plate of fixed plate is used for sheltering from the diode and for the diode direction, the upper surface fixedly connected with processing mechanism of working box, the outside fixedly connected with of working box accepts the case.
Preferably, the push plate is fixedly connected with the outside of the electric putter, the communication channel has been seted up to the inside of transportation groove for transport diode, the spout has been seted up to the inside of fixed plate, the inside middle part fixedly connected with fixed circular plate of spout.
Preferably, the left and right sides of fixed plectane are fixedly connected with respectively and connect, the inside fixedly connected with electric telescopic column of connect, electric telescopic column outside fixedly connected with stereoplasm spring is used for driving the scraper blade vibration.
Preferably, the outside fixedly connected with slide of stereoplasm spring, slide sliding connection is in the inside of spout, the outside fixedly connected with of slide links up the swash plate, the outside fixedly connected with scraper blade that links up the swash plate, the bottom fixedly connected with rubber bottom plate of scraper blade prevents to destroy the diode.
Preferably, the motor box is fixedly connected with a motor in the motor box, the output end of the motor is fixedly connected with a rotating shaft, the rotating roller is fixedly connected with the outside of the rotating shaft, the fixing rod is fixedly connected with the outside of the motor box, and the shell is fixedly connected with the outside of the fixing rod.
Preferably, the fixed slot has been seted up to the inside of shell, the inside fixedly connected with second electric telescopic column of fixed slot, the outside fixedly connected with stamping plate of second electric telescopic column is used for bending the diode, the outside fixedly connected with screens base of shell.
Preferably, the driving assembly comprises a fixing ring, an outer fixedly connected with bent rod of the fixing ring, an outer fixedly connected with branch rod of the bent rod, a clamping ring of the outer fixedly connected with of the branch rod, a backup plate of the inner fixedly connected with of the clamping ring, a second electric push rod of the inner fixedly connected with of the backup plate, a fixing ball of the outer fixedly connected with of the second electric push rod, and used for striking the braid, and the fixing ring is fixedly connected to the outer of the fixing column.
Preferably, the processing mechanism comprises a reinforcing plate, the upper surface fixedly connected with second baffle of reinforcing plate, the outside fixedly connected with a plurality of deflector of second baffle, the surface of deflector is smooth, the bottom fixedly connected with of reinforcing plate accepts the board, the screens recess has been seted up at the middle part of accepting the board, reinforcing plate fixedly connected with is at the upper surface of working box.
Preferably, the inside fixedly connected with fan of gusset plate, the upper surface fixedly connected with standpipe of gusset plate, the outside fixedly connected with of standpipe turns to the joint, the inside rotation that turns to the joint is connected with the air feeder.
The invention provides a stamping forming device for producing a diode component. The beneficial effects are as follows:
1. this stamping forming equipment is used in diode subassembly production is through setting up collection mechanism, in conventional equipment, bend the work back to the diode, and the diode can the downward movement, falls into the equipment bottom, because the quantity is great, and the diode is easy to pile up the winding together, is difficult to collect, and when the diode does not accord with the dimensional requirement, is difficult to discharge the diode that does not accord with the requirement out of the equipment, so carry out categorised storage and transportation with the diode, can prevent simultaneously to cause the damage to the diode. The purpose of being convenient for classifying, recycling and transporting the diode is achieved.
2. This stamping forming equipment is used in diode subassembly production, through setting up processing mechanism, before bending the work and going on, bend and the preliminary treatment of inspection to the diode, the diode can block in the inside of draw-in groove, the less diode of size, under the extrusion of draw-in groove and the motion of braid, can break away from braid downward movement gradually, and under the extrusion of draw-in groove and the motion of braid, the diode is bent slightly gradually. The purpose of being convenient for carry out first bending and dust removal pretreatment to the diode is achieved.
3. The stamping forming equipment for the diode component production can fix the braid position before the processing mechanism works by arranging the stamping mechanism. Then, the motor is used for controlling, driving the braid and the diode to move, extruding and bending the diode by matching with stamping plates on the left side and the right side, and performing a second more accurate bending work on the basis of first bending. The purpose of being convenient for carry out secondary bending on the diode is achieved.
4. This stamping forming equipment is used in diode subassembly production drives the subassembly through setting up, after bending work, some diodes can block in the outside of bandage, often need the manual dismantlement diode of workman, so in equipment to the diode downstream after the striking form promotes bending, the follow-up collection of being convenient for, and prevent that the diode from piling up in the outside of braid. The purpose of conveniently driving the diode to move downwards is achieved.
Drawings
FIG. 1 is a schematic diagram of a press forming apparatus for producing diode assemblies according to the present invention;
FIG. 2 is a schematic view of the bottom structure of the press forming apparatus for producing diode assemblies according to the present invention;
FIG. 3 is a schematic view of the structure of the collecting mechanism of the present invention;
FIG. 4 is an enlarged schematic view of a portion of FIG. 3A according to the present invention;
FIG. 5 is a schematic view of a processing mechanism according to the present invention;
FIG. 6 is an enlarged schematic view of a portion of the invention at B in FIG. 5;
FIG. 7 is a schematic view of a stamping mechanism according to the present invention;
FIG. 8 is a schematic diagram of a driving assembly according to the present invention.
In the figure: 1. a base; 2. a support column; 3. a working box; 4. a fixing plate; 5. a sloping plate; 6. a collection mechanism; 601. a transport tank; 602. a baffle; 603. an electric push rod; 604. a communication passage; 605. a chute; 606. fixing the circular plate; 607. a joint; 608. an electric telescopic column; 609. a hard spring; 610. a connecting sloping plate; 611. a scraper; 7. a processing mechanism; 701. a reinforcing plate; 702. a second baffle; 703. a guide plate; 704. a receiving plate; 705. a standpipe; 706. an air blower; 707. a groove; 708. an electric telescopic rod; 709. an arc-shaped plate; 8. a punching mechanism; 801. fixing the column; 802. driving the assembly; 8021. a fixing ring; 8022. bending a rod; 8023. a branch rod; 8024. a clamping ring; 8025. a backup plate; 8026. a second electric push rod; 803. a motor case; 804. a rotating shaft; 805. a rotating roller; 806. a fixed rod; 807. a housing; 808. a fixing groove; 809. a second electrically-operated telescopic column; 810. a clamping base; 9. the carrying box.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
As shown in fig. 1 to 8, the present invention provides a technical solution: the method specifically comprises the following steps:
the base 1 is provided with a stable bottom plate and a rubber bottom plate arranged at the bottom of the base 1, a support column 2 is fixedly connected above the base 1, a working box 3 is fixedly connected above the support column 2, and a fixing plate 4 is fixedly connected inside the working box 3;
the collecting mechanism 6 is used for collecting the stamped diode assemblies and moving the diode assemblies outwards, the collecting mechanism 6 comprises a conveying groove 601, a baffle 602 is fixedly connected to the inside of the conveying groove 601, an electric push rod 603 is fixedly connected to the outside of the baffle 602, and the conveying groove 601 is formed in the fixing plate 4;
the stamping mechanism 8 is used for driving the diode component to move and conducting stamping bending processing on the diode component, the stamping mechanism 8 comprises a fixed column 801, a driving component 802 is fixedly connected to the outer portion of the fixed column 801, a motor box 803 is fixedly connected to the outer portion of the fixed column 801, and the fixed column 801 is fixedly connected to the upper surface of the fixed plate 4.
The upper surface fixedly connected with swash plate 5 of fixed plate 4, the upper surface fixedly connected with processing mechanism 7 of working box 3, the outside fixedly connected with of working box 3 accepts case 9. The diode bending device has the advantages of being convenient for bending the diode and collecting the diode. The diodes are manually placed inside the braid and the braid is opened up before the device is used. The braiding is manually arranged in the punching mechanism 8 and the processing mechanism 7, the processing mechanism 7 is started to pretreat the diode, then the punching mechanism 8 is started to start punching, and after the work is finished, the collecting mechanism 6 can be started to collect the bent diode.
The outside fixedly connected with push pedal of electric putter 603, the inside of transportation groove 601 has been seted up intercommunication passageway 604, and spout 605 has been seted up to the inside of fixed plate 4, and the inside middle part fixedly connected with of spout 605 is fixed plectane 606.
The left and right sides of fixed plectane 606 are fixedly connected with respectively and connect 607, and the inside fixedly connected with of connect 607 is electric telescopic column 608, and electric telescopic column 608 outside fixedly connected with stereoplasm spring 609.
The outside fixedly connected with slide of stereoplasm spring 609, slide sliding connection is in the inside of spout 605, and the outside fixedly connected with of slide links up swash plate 610, and the outside fixedly connected with scraper blade 611 of linking swash plate 610, the bottom fixedly connected with rubber bottom plate of scraper blade 611. Has the advantages of convenient sorting and recycling and transportation of the diodes. Since two transport tanks 601 are provided, diodes falling from the processing mechanism 7 and the punching mechanism 8 respectively enter the inside of the two transport tanks 601 when the upper Fang Erji pipe moves downwards; the transport tank 601 below the processing mechanism 7 receives the diode before punching, and the transport tank 601 below the punching mechanism 8 receives the diode which has been pretreated and punched. At this time, the electric telescopic column 608 can be repeatedly opened, the electric telescopic column 608 drives the external hard spring 609 and the sliding plate to slide in the sliding groove 605, and further drives the connection inclined plate 610 and the scraping plate 611 outside the sliding plate to move left and right in the transportation groove 601, so that the diodes are prevented from being stacked together, and the diodes are prevented from moving outside the transportation groove 601. After the collection of the diode is finished, the electric push rod 603 outside the baffle 602 can be opened, and the electric push rod 603 drives the diode to enter the communication channel 604 through the transportation groove 601 so as to move outwards. The diodes in the communication channels 604 on both sides are different in state, and the raw diodes are on one side and the diodes after bending are on the other side.
In the pushing process, the hard spring 609 is pulled back and forth to generate vibration, so as to drive the external scraping plate 611 to vibrate, so that the falling diode is prevented from being clamped on the surface of the scraping plate 611, the scraping plate 611 is inclined, can guide the diode, and can scrape the diode in the conveying groove 601 from the bottom.
The inside fixedly connected with motor of motor case 803, the output fixedly connected with pivot 804 of motor, the outside fixedly connected with rotor 805 of pivot 804, the outside fixedly connected with dead lever 806 of motor case 803, the outside fixedly connected with shell 807 of dead lever 806.
The fixed slot 808 is formed in the shell 807, the second electric telescopic column 809 is fixedly connected to the inside of the fixed slot 808, the stamping plate is fixedly connected to the outside of the second electric telescopic column 809, and the clamping base 810 is fixedly connected to the outside of the shell 807.
The driving assembly 802 comprises a fixing ring 8021, a bent rod 8022 is fixedly connected to the outer portion of the fixing ring 8021, a branch rod 8023 is fixedly connected to the outer portion of the bent rod 8022, a clamping ring 8024 is fixedly connected to the outer portion of the branch rod 8023, a backup plate 8025 is fixedly connected to the inner portion of the clamping ring 8024, a second electric push rod 8026 is fixedly connected to the inner portion of the backup plate 8025, a fixing ball is fixedly connected to the outer portion of the second electric push rod 8026, and the fixing ring 8021 is fixedly connected to the outer portion of the fixing column 801. The diode bending device has the advantages that the diode is bent for the second time and is driven to move. The top end of the braid is manually engaged and connected to the inside of the clamp base 810, and the processing mechanism 7 is turned on to perform pretreatment work. After the work is finished, the braid is manually placed in the rotating roller 805 and the shell 807, a motor in the motor box 803 is started, the motor drives the rotating shaft 804 to rotate, the rotating roller 805 is further driven to rotate, the braid follows the rotating roller 805 to rotate, the second electric telescopic column 809 is started, and the second electric telescopic column 809 drives the stamping plate to impact and bend the diode.
The second electric push rod 8026 in the backup plate 8025 is opened, and the second electric push rod 8026 drives the fixed ball to repeatedly strike the middle part of the braid, so that the diode is promoted to move downwards, and the diode enters the collecting mechanism 6 at the bottom.
The processing mechanism 7 comprises a reinforcing plate 701, the upper surface of the reinforcing plate 701 is fixedly connected with a second baffle 702, the outer part of the second baffle 702 is fixedly connected with a plurality of guide plates 703, the outer surface of the guide plates 703 is smooth, the bottom of the reinforcing plate 701 is fixedly connected with a bearing plate 704, the middle part of the bearing plate 704 is provided with a clamping groove, and the reinforcing plate 701 is fixedly connected with the upper surface of the working box 3.
The inside fixedly connected with fan of gusset plate 701, the upper surface fixedly connected with standpipe 705 of gusset plate 701, the outside fixedly connected with of standpipe 705 turns to the joint, turns to the inside rotation of joint and is connected with air blower 706.
The inside of gusset plate 701 has seted up recess 707, and the inside fixedly connected with electric telescopic handle 708 of recess 707, the outside fixedly connected with arc 709 of electric telescopic handle 708, a plurality of draw-in groove has been seted up to the inside of arc 709. The diode has the advantages of being convenient for carrying out first bending and dust removal pretreatment on the diode. The braiding is manually pressed to enable the middle part of the braiding to be located in the clamping grooves in the bearing plate 704, then the electric telescopic rods 708 on the two sides are started, the electric telescopic rods 708 drive the arc-shaped plates 709 to move towards the middle part, the diodes are gradually located in the clamping grooves until the diodes are adjusted to be located at the center positions, the fan is started, wind in the fan moves to the blower 706 through the steering joint outside the vertical pipe 705 and gradually moves outwards, primary dust is blown to the diodes in the middle part, and after the dust moves to the guide plate 703 on the other side, the dust moves to the bearing box 9 obliquely. After the punching mechanism 8 is started, the braid is driven to move upwards, and the diode in the clamping groove can be bent by the clamping groove in the rising process, so that the first bending work is performed. The smaller diode is extruded by the arc 709 when the braid moves upward, gradually drops down through the braid gap, and moves downward through the gap between the receiving plate 704 and the middle part of the work box 3 into the transportation tank 601.
Working principle: the diodes are manually placed inside the braid and the braid is opened up before the device is used. The braiding is manually placed in the punching mechanism 8 and the processing mechanism 7, the top end of the braiding is manually connected in the clamping base 810 in a clamping mode, the braiding is manually pressed, the middle of the braiding is located in the clamping groove in the bearing plate 704, and the processing mechanism 7 is started to conduct pretreatment. The processing mechanism 7 is started, then the electric telescopic rods 708 on two sides are started, the electric telescopic rods 708 drive the arc-shaped plates 709 to move towards the middle, the diodes are gradually positioned in the clamping grooves until the diodes are adjusted to be positioned at the central positions, the fan is started, wind in the fan moves to the blower 706 through the steering joint outside the vertical pipe 705 and gradually moves outwards, primary dust is blown to the diodes in the middle, and the dust moves to the guide plate 703 on the other side and then moves to the receiving box 9 in an inclined mode. After the punching mechanism 8 is started, the braid is driven to move upwards, and the diode in the clamping groove can be bent by the clamping groove in the rising process, so that the first bending work is performed.
Then, the punching mechanism 8 is started, the braid is manually placed in the rotating roller 805 and the shell 807, a motor in the motor box 803 is started, the motor drives the rotating shaft 804 to rotate, and then the rotating roller 805 is driven to rotate, at the moment, the braid follows the rotating roller 805 to rotate, the second electric telescopic column 809 is started, and the second electric telescopic column 809 drives the punching plate to impact and bend the diode. The second electric push rod 8026 in the backup plate 8025 is opened, and the second electric push rod 8026 drives the fixed ball to repeatedly strike the middle part of the braid, so that the diode is promoted to move downwards, and the diode enters the collecting mechanism 6 at the bottom. The punching operation is started.
After the work is finished, the collection mechanism 6 can be started to collect the bent diodes, and as the two transport tanks 601 are arranged, when the upper diodes move downwards, the diodes falling from the processing mechanism 7 move downwards and enter the inside of the transport tanks 601. After the punching mechanism 8 is finished, the diode after bending is moved downward to fall into the inside of the transport tank 601. At this time, the electric telescopic column 608 can be repeatedly opened, the electric telescopic column 608 drives the external hard spring 609 and the sliding plate to slide in the sliding groove 605, and further drives the connection inclined plate 610 and the scraping plate 611 outside the sliding plate to move left and right in the transportation groove 601, so that the diodes are prevented from being stacked together, and the diodes are prevented from moving outside the transportation groove 601. After the collection of the diode is finished, the electric push rod 603 outside the baffle 602 can be opened, and the electric push rod 603 drives the diode to enter the communication channel 604 through the transportation groove 601 so as to move outwards. The diodes in the communication channels 604 on both sides are different in state, and the raw diodes are on one side and the diodes after bending are on the other side.
In the pushing process, the hard spring 609 is pulled back and forth to generate vibration, so as to drive the external scraping plate 611 to vibrate, so that the falling diode is prevented from being clamped on the surface of the scraping plate 611, the scraping plate 611 is inclined, can guide the diode, and can scrape the diode in the conveying groove 601 from the bottom.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.

Claims (1)

1. The utility model provides a stamping forming equipment is used in diode subassembly production, specifically includes:
base (1), its characterized in that: the base (1) is provided with a stable bottom plate and a rubber bottom plate arranged at the bottom of the base (1), a support column (2) is fixedly connected above the base (1), a working box (3) is fixedly connected above the support column (2), and a fixing plate (4) is fixedly connected inside the working box (3);
the collecting mechanism (6) is used for collecting the diode assemblies after stamping and moving the diode assemblies outwards, the collecting mechanism (6) comprises a conveying groove (601), a baffle plate (602) is fixedly connected to the inside of the conveying groove (601), an electric push rod (603) is fixedly connected to the outside of the baffle plate (602), and the conveying groove (601) is formed in the fixing plate (4);
the stamping mechanism (8) is used for driving the diode assembly to move and conducting stamping bending treatment on the diode assembly, the stamping mechanism (8) comprises a fixed column (801), a driving assembly (802) is fixedly connected to the outer part of the fixed column (801), a motor box (803) is fixedly connected to the outer part of the fixed column (801), and the fixed column (801) is fixedly connected to the upper surface of the fixed plate (4);
the upper surface of the fixed plate (4) is fixedly connected with an inclined plate (5), the upper surface of the working box (3) is fixedly connected with a processing mechanism (7), and the outer part of the working box (3) is fixedly connected with a receiving box (9);
the electric pushing rod (603) is fixedly connected with a pushing plate, a communication channel (604) is formed in the transportation groove (601), a sliding groove (605) is formed in the fixing plate (4), and a fixing circular plate (606) is fixedly connected to the middle part of the inside of the sliding groove (605);
the left side and the right side of the fixed circular plate (606) are respectively and fixedly connected with a joint (607), the inside of the joint (607) is fixedly connected with an electric telescopic column (608), and the outside of the electric telescopic column (608) is fixedly connected with a hard spring (609);
the outer part of the hard spring (609) is fixedly connected with a sliding plate, the sliding plate is slidably connected in the sliding groove (605), the outer part of the sliding plate is fixedly connected with a connecting inclined plate (610), the outer part of the connecting inclined plate (610) is fixedly connected with a scraping plate (611), and the bottom of the scraping plate (611) is fixedly connected with a rubber bottom plate;
the motor box (803) is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating shaft (804), the outer part of the rotating shaft (804) is fixedly connected with a rotating roller (805), the outer part of the motor box (803) is fixedly connected with a fixed rod (806), and the outer part of the fixed rod (806) is fixedly connected with a shell (807);
a fixing groove (808) is formed in the shell (807), a second electric telescopic column (809) is fixedly connected to the inside of the fixing groove (808), a stamping plate is fixedly connected to the outside of the second electric telescopic column (809), and a clamping base (810) is fixedly connected to the outside of the shell (807);
the driving assembly (802) comprises a fixed ring (8021), a bent rod (8022) is fixedly connected to the outside of the fixed ring (8021), a branch rod (8023) is fixedly connected to the outside of the bent rod (8022), a clamping ring (8024) is fixedly connected to the outside of the branch rod (8023), a backup plate (8025) is fixedly connected to the inside of the clamping ring (8024), a second electric push rod (8026) is fixedly connected to the inside of the backup plate (8025), a fixed ball is fixedly connected to the outside of the second electric push rod (8026), and the fixed ring (8021) is fixedly connected to the outside of the fixed column (801);
the processing mechanism (7) comprises a reinforcing plate (701), wherein the upper surface of the reinforcing plate (701) is fixedly connected with a second baffle plate (702), the outer part of the second baffle plate (702) is fixedly connected with a plurality of guide plates (703), the outer surface of the guide plates (703) is smooth, the bottom of the reinforcing plate (701) is fixedly connected with a bearing plate (704), the middle part of the bearing plate (704) is provided with a clamping groove, and the reinforcing plate (701) is fixedly connected with the upper surface of the working box (3);
the inside of the reinforcing plate (701) is fixedly connected with a fan, the upper surface of the reinforcing plate (701) is fixedly connected with a vertical pipe (705), the outside of the vertical pipe (705) is fixedly connected with a steering joint, and the inside of the steering joint is rotationally connected with an air blower (706);
the inside of gusset plate (701) is seted up flutedly (707), the inside fixedly connected with electric telescopic handle (708) of recess (707), the outside fixedly connected with arc (709) of electric telescopic handle (708), a plurality of draw-in groove has been seted up to the inside of arc (709), and electric telescopic handle (708) drive arc (709) to the middle part motion, and wind in the fan moves to air feeder (706) through the outside steering joint of standpipe (705).
CN202310566169.2A 2023-05-19 2023-05-19 Stamping forming equipment is used in diode subassembly production Active CN116571657B (en)

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CN116571657B true CN116571657B (en) 2024-01-09

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CN114985642A (en) * 2022-06-30 2022-09-02 苏州查斯特电子有限公司 Diode synchronous pin cutting and bending device
CN217719519U (en) * 2022-07-18 2022-11-01 江苏宝浦莱半导体有限公司 Good heat dissipation's diode forming device
CN217990754U (en) * 2022-06-20 2022-12-09 东莞市华荣通信技术有限公司 Fuse cutting and bending equipment

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JP2001168258A (en) * 1999-12-06 2001-06-22 Seiko Epson Corp Manufacturing method of electronic component and device thereof
CN211191778U (en) * 2019-11-12 2020-08-07 昆山裕莱祥电子科技有限公司 Automatic resistance bending and cutting integrated machine
CN217990754U (en) * 2022-06-20 2022-12-09 东莞市华荣通信技术有限公司 Fuse cutting and bending equipment
CN114985642A (en) * 2022-06-30 2022-09-02 苏州查斯特电子有限公司 Diode synchronous pin cutting and bending device
CN217719519U (en) * 2022-07-18 2022-11-01 江苏宝浦莱半导体有限公司 Good heat dissipation's diode forming device

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