JP3539109B2 - Manufacturing method of resistor - Google Patents

Manufacturing method of resistor Download PDF

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Publication number
JP3539109B2
JP3539109B2 JP02353397A JP2353397A JP3539109B2 JP 3539109 B2 JP3539109 B2 JP 3539109B2 JP 02353397 A JP02353397 A JP 02353397A JP 2353397 A JP2353397 A JP 2353397A JP 3539109 B2 JP3539109 B2 JP 3539109B2
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JP
Japan
Prior art keywords
hole
resin
resistor
foil
resistance foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP02353397A
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Japanese (ja)
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JPH10223418A (en
Inventor
洋 長谷川
紀光 知野見
浩一 池本
孝治 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP02353397A priority Critical patent/JP3539109B2/en
Publication of JPH10223418A publication Critical patent/JPH10223418A/en
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Publication of JP3539109B2 publication Critical patent/JP3539109B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、各種エレクトロニクス機器に使用される抵抗器の製造方法に関するもので、特に、電流検出回路などに使用される低抵抗である抵抗器の製造方法に関するものである。
【0002】
【従来の技術】
従来の抵抗器の製造方法としては、特開平6−267707号公報に開示されたものが知られている。
【0003】
以下、従来の抵抗器の製造方法について、図面を参照しながら説明する。
【0004】
図3(a)は従来の抵抗器の要部である抵抗体を透視した上面図、図3(b)は同側面図である。
【0005】
図において、1は第1のセラミック基板である。2は第1のセラミック基板1の上面に設けられた銅−ニッケル板、マンガニン板、コンスタンタン板、ニクロム板の各種金属の合金板からなる金属抵抗体である。3は第1のセラミック基板1の対向する側面で金属抵抗体2をU字型に折曲して設けられた一対の電流端子相当部である。4は第1のセラミック基板1の電流端子相当部3を有していない一側面に金属抵抗体2をU字型に折曲して設けられた一対の電圧端子相当部である。5は金属抵抗体2の抵抗値を調整するためにトリミングにより金属抵抗体2に設けられた切欠部である。6は金属抵抗体2を挟むように第1のセラミック基板1の上面に設けられた第2のセラミック基板である。
【0006】
以上のように構成された従来の抵抗器について、以下にその製造方法を説明する。
【0007】
図4は従来の抵抗器の製造方法の要部である抵抗体群の製造方法を示す図である。
【0008】
まず、図4(a)に示すように、各種金属の合金板を金型によるプレス打抜き加工により、金型抵抗体21が複数個連続した抵抗体群22を形成する。
【0009】
次に、図4(b)に示すように、抵抗体群22の両端の電流端子相当部23間に電流を流し、各金属抵抗体21の電圧端子相当部24間の電圧を計測しながら各金属抵抗体21にトリミングにより切欠部25を形成し、抵抗値修正をする。
【0010】
次に、抵抗体群22を個片に分割して金属抵抗体21を形成した後、この金属抵抗体21を挟み込むように接着剤により第1、第2のセラミック基板を貼り付け形成する。
【0011】
次に、第1のセラミック基板の対向する側面で金属抵抗体21を折曲して一対の電流端子相当部23を形成するとともに電流端子相当部23を有していない第1のセラミック基板の一側面で金属抵抗体21を折曲して一対の電圧端子相当部24を形成する。
【0012】
次に、金属抵抗体21を挟み込んだ第1、第2のセラミック基板との間を絶縁材によって絶縁封止する
【0013】
最後に、金属抵抗体21電流端子相当部23および電圧端子相当部24にニッケルメッキおよび半田メッキを施して従来の抵抗器を製造していた。
【0014】
【発明が解決しようとする課題】
しかしながら上記従来の製造方法では、各種金属の合金板を打抜いた金属抵抗体21を複数個連続して抵抗体群22を形成するため、その利用効率が悪いという課題を有していた。
【0015】
本発明は上記従来の課題を解決するもので、抵抗体を形成する金属箔の利用効率が優れた抵抗器の製造方法を提供することを目的とするものである。
【0016】
【課題を解決するための手段】
上記目的を達成するために本発明は、帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程とを備えたものである。
【0017】
【発明の実施の形態】
本発明の請求項1に記載の発明は、帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子相当部を形成する工程と、前記外部端子相当部にめっきを施す工程とを備えたものである。
【0018】
また、請求項2に記載の発明は、予め表面にめっき処理を施した帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子を形成する工程とを備えたものである。
【0019】
そしてまた、請求項3に記載の発明は、帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔を有する抵抗箔に貫通孔を形成した際のバリを除去した後にめっき処理を施す工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子を形成する工程とを備えたものである。
【0020】
以下、本発明の一実施の形態における抵抗器の製造方法について、図面を参照しながら説明する。
【0021】
図1,2は本発明の一実施の形態における抵抗器の製造方法を示す図である。
【0022】
まず、図1(a)に示すように、予め帯状に成型してなる抵抗箔31の長手方向に、最終製品となる抵抗器の製造ピッチに対応した間隔を有するように略楕円形状の貫通孔32を打抜きにより形成する。
【0023】
次に、図1(b)に示すように、抵抗箔31の隣合う貫通孔32の近傍に4つの触針33を当接させて、4端子法により抵抗値を測定しながら、レーザ、回転刃、回転砥石、サンドブラスト等のトリミング方法によりトリミング溝34を形成する。
【0024】
次に、図1(c)に示すように、抵抗箔31のトリミング溝34を挟持するとともに隣合う貫通孔32の一部を挟持するように抵抗箔31の幅方向より熱可塑性樹脂フィルムからなる樹脂35を重ね合わせる。
【0025】
次に、図2(a)に示すように、樹脂35のみを加熱または超音波により抵抗箔31に一体化する。
【0026】
次に、図2(b)に示すように、抵抗箔31の貫通孔32の中心部分を打抜いて、樹脂35の対向する側面から抵抗箔31の端子相当部36が突出するように形成する。
【0027】
次に、図2(c)に示すように樹脂35の側面より突出する抵抗箔31の端子相当部36を樹脂35の側面および下面に沿って折曲する。
【0028】
最後に、端子相当部36にめっきを施して、抵抗器を製造するものである。
【0029】
以上のような製造方法において、抵抗箔31に樹脂35を一体化する際には、樹脂35のみを加熱または超音波処理するだけであるため、射出成型に比べて少ないエネルギーで一体化できるとともに、射出成型機を使用する際のランナー、ゲート等に消費される樹脂は皆無となって、樹脂の利用効率が高くなるものである。
【0030】
また、少ないエネルギーで一体化できるため、射出成型に比べて抵抗値変化が少なくなるものである。
【0031】
なお、上記本発明の一実施の形態では帯状に成型してなる抵抗箔を用いたが、予め抵抗箔に端子相当部に使用する金、銀、パラジウム、ロジウム、白金等の貴金属またはスズ、半田などをめっき処理した抵抗箔を用いれば、帯状の抵抗箔に連続めっきが容易にかつ精度よく行えるため、最終工程でのめっき処理は不要となり、上記本発明の一実施の形態と同様の効果が得られるものである。
【0032】
また、上記本発明の一実施の形態において、帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、トリミングを行う工程との間に、貫通孔を形成した際のバリを除去した後にめっき処理を施す工程を設ければ、最終手工程でのめっき処理は不要となり、上記本発明の一実施の形態と同様の効果が得られるものである。
【0033】
【発明の効果】
以上のように本発明の抵抗器の製造方法は、帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程とを備えているため、射出成型に比べて少ないエネルギーで一体化できるとともに、射出成型機を使用する際のランナー、ゲート等に消費される樹脂は皆無となって、樹脂の利用効率が高くなるものであり、また、少ないエネルギーで一体化できるため、射出成型に比べて抵抗値変化が少なくなる等優れた効果を有するものである。
【図面の簡単な説明】
【図1】(a)〜(c)本発明の一実施の形態における抵抗器の製造方法を説明する図
【図2】(a)〜(c)同抵抗器の製造方法を説明する図
【図3】(a)従来の抵抗器の要部である抵抗体を透視した上面図
(b)同側面図
【図4】(a)(b)同抵抗器の要部である抵抗体群の製造方法を示す図
【符号の説明】
31 抵抗箔
32 貫通孔
33 触針
35 樹脂
36 端子相当部
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of manufacturing a resistor used for various electronic devices, and more particularly to a method of manufacturing a low-resistance resistor used for a current detection circuit and the like.
[0002]
[Prior art]
As a conventional method for manufacturing a resistor, a method disclosed in Japanese Patent Application Laid-Open No. 6-267707 is known.
[0003]
Hereinafter, a conventional method for manufacturing a resistor will be described with reference to the drawings.
[0004]
FIG. 3A is a top view of a conventional resistor as a perspective view of a resistor which is a main part of the resistor, and FIG. 3B is a side view of the resistor.
[0005]
In the figure, reference numeral 1 denotes a first ceramic substrate. Reference numeral 2 denotes a metal resistor provided on the upper surface of the first ceramic substrate 1 and made of an alloy plate of various metals such as a copper-nickel plate, a manganin plate, a constantan plate, and a nichrome plate. Reference numeral 3 denotes a pair of current terminal equivalent portions provided by bending the metal resistor 2 in a U-shape on opposite side surfaces of the first ceramic substrate 1. Reference numeral 4 denotes a pair of voltage terminal equivalent portions provided by bending the metal resistor 2 into a U-shape on one side of the first ceramic substrate 1 not having the current terminal equivalent portion 3. Reference numeral 5 denotes a notch provided in the metal resistor 2 by trimming to adjust the resistance value of the metal resistor 2. Reference numeral 6 denotes a second ceramic substrate provided on the upper surface of the first ceramic substrate 1 with the metal resistor 2 interposed therebetween.
[0006]
A method of manufacturing the conventional resistor configured as described above will be described below.
[0007]
FIG. 4 is a diagram showing a method of manufacturing a resistor group, which is a main part of a conventional method of manufacturing a resistor.
[0008]
First, as shown in FIG. 4A, a resistor group 22 in which a plurality of mold resistors 21 are formed is formed by pressing a metal alloy plate with a die.
[0009]
Next, as shown in FIG. 4B, a current is applied between the current terminal equivalent portions 23 at both ends of the resistor group 22 to measure the voltage between the voltage terminal equivalent portions 24 of each metal resistor 21 while measuring each voltage. A notch 25 is formed in the metal resistor 21 by trimming, and the resistance value is corrected.
[0010]
Then, after forming a metal resistor 21 resistor group 22 is divided into pieces, first with an adhesive so as to sandwich the metal resistor 21, to form paste a second ceramic substrate.
[0011]
Next, the first ceramic substrate having no current terminal-corresponding portion 23 together by bending a metal resistor 21 at opposite sides of the first ceramic substrate to form a pair of current terminals corresponding portion 23 one The metal resistor 21 is bent on the side surface to form a pair of voltage terminal equivalent portions 24 .
[0012]
Next, the first and second ceramic substrates sandwiching the metal resistor 21 are insulated and sealed with an insulating material.
[0013]
Finally, the current terminal portion 23 and the voltage terminal portion 24 of the metal resistor 21 are plated with nickel and solder to manufacture a conventional resistor.
[0014]
[Problems to be solved by the invention]
However, in the above conventional manufacturing method, since the metal resistor 21 punched alloy plate various metals plurality continuously forming the resistor group 22, there is a problem that the utilization efficiency is poor.
[0015]
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method of manufacturing a resistor having excellent use efficiency of a metal foil forming a resistor.
[0016]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a step of forming a substantially elliptical through hole in a strip-shaped resistance foil, and a step of adjusting a resistance value by bringing a measurement terminal into contact with the vicinity of the through hole. A step of sandwiching the resistance foil with a resin made of a thermoplastic resin film so as to cover a part of the adjacent through-holes, and then heating or ultrasonically integrating the resin with the resistance foil. is there.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the first aspect of the present invention, a step of forming a substantially elliptical through-hole in a belt-shaped resistance foil and a step of adjusting a resistance value by bringing a measuring terminal into contact with the vicinity of the through-hole. And, after sandwiching the resistance foil with a resin made of a thermoplastic resin film so as to cover a part of the adjacent through-hole, integrating the resin with the resistance foil by heating or ultrasonic waves, and Forming a terminal equivalent portion so as to protrude from the side surface of the resin, bending the terminal equivalent portion along the shape of the resin to form an external terminal equivalent portion, it is obtained by a step of plating the terminal corresponding portion.
[0018]
The invention of claim 2 includes the steps of forming a through hole of substantially elliptical shape in a strip of resistive foil plated beforehand surface, the measuring terminal by contact in the vicinity of the through hole A step of adjusting the resistance value and, after sandwiching the resistance foil with a resin made of a thermoplastic resin film so as to cover part of the adjacent through-holes, integrate the resin with the resistance foil by heating or ultrasonic waves Forming the external terminal by bending the through-hole so that the terminal equivalent portion protrudes from the side surface of the resin, and bending the terminal equivalent portion along the shape of the resin. it is obtained by a process.
[0019]
And also, the invention according to claim 3, plating forming a through hole of substantially elliptical shape in a strip of resistor foil, after removing the burr of forming the through holes to the resistance foil having the through-hole wherein the step of performing processing, and a step of adjusting the resistance value by abutting the measuring terminals in the vicinity of the through hole, a resin comprising a thermoplastic resin film so as to cover a portion of the adjacent through-holes A step of integrating the resin with the resistance foil by heating or ultrasonic waves after sandwiching the resistance foil, and a step of punching the through hole and forming a terminal equivalent portion from a side surface of the resin, along the shape of the resin is obtained and forming the external terminal by bending the terminal-corresponding portion.
[0020]
Hereinafter, a method for manufacturing a resistor according to an embodiment of the present invention will be described with reference to the drawings.
[0021]
1 and 2 are views showing a method for manufacturing a resistor according to an embodiment of the present invention.
[0022]
First, as shown in FIG. 1A, a substantially elliptical through hole is formed in the longitudinal direction of a resistor foil 31 formed in a belt shape in advance so as to have an interval corresponding to a manufacturing pitch of a resistor as a final product. 32 is formed by punching.
[0023]
Next, as shown in FIG. 1 (b), four styluses 33 are brought into contact with adjacent through holes 32 of the resistance foil 31, and while measuring the resistance value by the four-terminal method, the laser and the rotation are performed. The trimming groove 34 is formed by a trimming method such as a blade, a rotary grindstone, and sand blast.
[0024]
Next, as shown in FIG. 1 (c), a thermoplastic resin film than the width direction of the resistance foil 31 so as to sandwich a portion of the adjacent through-holes 32 with sandwiching the trimming groove 34 of the resistor foil 31 The resin 35 is overlaid.
[0025]
Next, as shown in FIG. 2A, only the resin 35 is integrated with the resistance foil 31 by heating or ultrasonic waves.
[0026]
Next, as shown in FIG. 2B, a central portion of the through-hole 32 of the resistance foil 31 is punched, and the terminal equivalent part 36 of the resistance foil 31 is formed to protrude from the opposite side surface of the resin 35. .
[0027]
Next, as shown in FIG. 2C, the terminal equivalent portion 36 of the resistance foil 31 protruding from the side surface of the resin 35 is bent along the side surface and the lower surface of the resin 35.
[0028]
Finally, in which plated to terminal-corresponding portion 36, to produce a resistor.
[0029]
In the above manufacturing method, when integrating the resin 35 to the resistor foil 31, since it is only heated or sonicated only resin 35, it is possible to integrate with less energy than the injection molding, When the injection molding machine is used, no resin is consumed in the runners, gates, etc., and the utilization efficiency of the resin is increased.
[0030]
In addition, since it can be integrated with a small amount of energy, the change in resistance value is smaller than that in injection molding.
[0031]
In the above-described embodiment of the present invention, a resistor foil formed in a belt shape is used. By using a resistance foil plated with, for example, continuous plating can be easily and accurately performed on a strip-shaped resistance foil, so that the plating treatment in the final step becomes unnecessary, and the same effects as those of the above-described embodiment of the present invention can be obtained. It is obtained.
[0032]
Also, in one embodiment of the present invention, a step of forming a through hole of substantially elliptical shape in a strip of resistor foil, between the step of trimming, the burr of forming the through hole after removing If the step of performing the plating process is provided, the plating process in the final hand process becomes unnecessary, and the same effect as in the above-described embodiment of the present invention can be obtained.
[0033]
【The invention's effect】
As described above, the method for manufacturing a resistor according to the present invention includes the steps of forming a substantially elliptical through-hole in a belt-shaped resistance foil, and adjusting a resistance value by bringing a measurement terminal into contact with the vicinity of the through-hole. And a step of integrating the resin with the resistive foil by heating or ultrasonic after sandwiching the resistive foil with a resin made of a thermoplastic resin film so as to cover part of the adjacent through-holes. As a result, it can be integrated with less energy compared to injection molding, and no resin is consumed in runners, gates, etc. when using an injection molding machine, which increases the efficiency of resin use. In addition, since they can be integrated with a small amount of energy, they have excellent effects such as a small change in resistance value as compared with injection molding .
[Brief description of the drawings]
1 (a) illustrating a ~ (c) the production method of FIG. FIG. 2 (a) ~ (c) the resistors for explaining a manufacturing method of resistor according to an embodiment of the present invention FIG. [ FIG. 3 (a) is a perspective view of a resistor which is a main part of a conventional resistor. FIG. 3 (b) is a side view of the same. FIG. 4 (a) and FIG. Diagram showing manufacturing method [Description of reference numerals]
31 resistance foil 32 through hole 33 stylus 35 resin 36 terminal equivalent part

Claims (3)

帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子相当部を形成する工程と、前記外部端子相当部にめっきを施す工程とを備えた抵抗器の製造方法。A step of forming a substantially elliptical through-hole in the belt-shaped resistance foil, a step of adjusting a resistance value by bringing a measurement terminal into contact with the vicinity of the through-hole, and covering a part of the adjacent through-hole. A step of sandwiching the resistance foil with a resin made of a thermoplastic resin film and then integrating the resin with the resistance foil by heating or ultrasonic waves, and punching out the through hole to form a terminal equivalent portion from a side surface of the resin. Forming the external terminal equivalent part by bending the terminal equivalent part along the shape of the resin, and plating the external terminal equivalent part . Manufacturing method of resistor. 予め表面にめっき処理を施した帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子を形成する工程とを備えた抵抗器の製造方法。A step of forming a substantially elliptical through-hole in a strip-shaped resistance foil having a surface plated in advance, a step of adjusting a resistance value by bringing a measuring terminal into contact with the vicinity of the through-hole, After sandwiching the resistance foil with a resin made of a thermoplastic resin film so as to cover a part of the matching through hole, a step of integrating the resin with the resistance foil by heating or ultrasonic waves after punching the through hole, A method for manufacturing a resistor, comprising: forming a terminal equivalent portion so as to protrude from a side surface of the resin; and bending the terminal equivalent portion along the shape of the resin to form an external terminal. 帯状の抵抗箔に略楕円形状の貫通孔を形成する工程と、前記貫通孔を有する抵抗箔に貫通孔を形成した際のバリを除去した後にめっき処理を施す工程と、前記貫通孔の近傍に測定用端子を当接させて抵抗値の調整をする工程と、前記隣合う貫通孔の一部を覆うように熱可塑性樹脂フィルムからなる樹脂で前記抵抗箔を挟んだ後加熱または超音波により前記樹脂を前記抵抗箔と一体化する工程と、前記貫通孔を打抜いて前記樹脂の側面より端子相当部が突出するように形成する工程と、前記樹脂の形状に沿って前記端子相当部を折曲して外部端子を形成する工程とを備えた抵抗器の製造方法。A step of forming a substantially elliptical through-hole in the belt-shaped resistance foil, a step of plating after removing burrs when the through-hole is formed in the resistance foil having the through-hole, and a step of performing plating near the through-hole. A step of adjusting the resistance value by contacting the measurement terminals, and heating or ultrasonically after sandwiching the resistance foil with a resin made of a thermoplastic resin film so as to cover a part of the adjacent through hole. A step of integrating a resin with the resistance foil; a step of punching the through hole to form a terminal equivalent portion so as to project from a side surface of the resin; and folding the terminal equivalent portion along the shape of the resin. method for producing a resistor and forming an external terminal and music.
JP02353397A 1997-02-06 1997-02-06 Manufacturing method of resistor Expired - Fee Related JP3539109B2 (en)

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