【０００１】
【産業上の利用分野】
本発明はＣｕ／Ｍｎ／Ｓｎ系合金よりなる抵抗素子の比抵抗値が小さく、且つ、抵抗温度係数の小さい合金材料を提供すると、同時に抵抗素子部と端子部の接触抵抗を可能な限り小さくする目的で使製作する低抵抗の製法であり、且つ、プレス加工等によりブランク抜きした製品を次工程で抵抗値調整（トリミング加工）する為、製品に歪み（反り）が発生し難くい方法で作製された抵抗素子に関する。
【０００２】
【従来の技術】
従来技術では、Ｃｕ／Ｎｉ、Ｎｉ／Ｃｒ合金等よりなる抵抗箔、金属板にＣｕ及び半田をクラッド加工した帯状材料を図−１に記載の様に目標抵抗値に因って、両端が電極に構成される様に帯状材料の中心部を一定幅で切削、除去した帯材をプレス加工によりブランク抜きして、目標抵抗値の抵抗素子を作製する工法の為、素子の反りが発生し易く、且つ、目標抵抗値に対する抵抗精度の確保が難しい。
【０００３】
【発明が解決しようとする課題】
従来技術では、この様な素子の作製は異種金属の接合が作製後、端子部を半田、溶接等で接続する場合、オーミック・コンタクトが充分得られない欠点があった。この欠点の改善に当たって、クラッド接合、及び熱拡散法による半田層を形成する。、又温度係数を小さくする為、 Ｃｕ／Ｍｎ／Ｓｎ系材料を採用する事により、抵抗温度係数の小さい高精度の抵抗素子の製作が容易になる。
【０００４】
【課題を解決するための手段】
上記課題は、Ｃｕ／Ｍｎ／Ｓｎ＝９２．５〜８９／６〜８／１．５〜３重量％で温度係数の極めて小さい材質の（数ｐｐｍ／℃）抵抗素子部と接続端子部をクラッドによりり接続する。又、電極の半田層を熱拡散方式によって非常に安定した接合を可能とし、電気的に高信頼性の製品を安価に製造出来き、更にエンドレスに延びた帯状材料から、自動ブランク打抜き加工後、抵抗調整をする為、反りの少ない素子が可能となり、総合歩留まりが向上する。従って、結果的に低価格で製作が可能となる。
【０００５】
【発明の実施の形態】
【０００６】
【実施例１】本発明の図−１はＣｕ／Ｍｎ／Ｓｎ＝９２．５〜８９／６〜８／１．５〜３重量％の金属板▲１▼を、Ｃｕクラッド▲２▼、半田▲３▼を熱拡散で作製した帯状材を作製する。しかる後、自動プレス加工によりブランク打ち抜きをした後、ブランク打ち抜き品の半田層面の中心部を抵抗値に合わせて、専用の切削工具を用いて目標抵抗値に合わせて切削し抵抗値調整をする。次工程で素子の表面（Ｃｕ／Ｍｎ／Ｓｎ系合金層）を全面保護材料▲４▼を使用いて塗装し、裏面は切削加工面のみ保護塗装し、表面に規定の捺印を施した後、抵抗値測定をし包装する。
【０００７】
【実施例２】本発明の図２は実施例１の抵抗合金材を金属板に替わって、帯状
箔加工した▲５▼を帯状材料の長さ方向を横断するように各素子を任意の個数ずつ、切断分離した後、素子表面を絶縁皮膜▲４▼で絶縁保護した後、裏面は切削加工面のみ保護塗装し、表面に規定の捺印表示し、抵抗値測定をした後包装する。
【０００８】
【実施例３】請求項１又は２の抵抗器の製造方法に於いて、帯状材料をＣｕ、Ｎｉ▲６▼クラッド（図３）及びＣｕ、Ｐｄクラッド材▲７▼（図４）を用いて製作す
る。
【０００９】
【発明の効果】
本発明は低抵抗領域の抵抗素子を製作する場合、抵抗材料の比抵抗値が小さく、且つ抵抗温度特性（抵抗温度係数）が小さく、又、抵抗素子部と端子部との接触を圧着によるクラッド法並びに、熱拡散による半田層を製作する為、非常に安定した、抵抗素子が製作可能である。また帯状材料の為、連続加工が容易で二端子、四端子の機械的加工が容易で且つ、電気的にも安定した抵抗器の量産が可能となる。
【図面の簡単な説明】
【図１】実施例１の金属板断面図
【図２】実施例２の金属箔断面図
【図３】実施例３のＮｉクラッド材断面図
【図４】実施例３のＰｄクラッド材断面図
【符号の説明】
▲１▼抵抗金属板 ▲５▼抵抗箔材
▲２▼銅クラッド材 ▲６▼Ｎｉクラッド材
▲３▼半田電極部 ▲７▼Ｐｄクラッド材
▲４▼保護材料[0001]
[Industrial applications]
The present invention provides an alloy material having a small specific resistance value and a small temperature coefficient of resistance of a resistance element made of a Cu / Mn / Sn-based alloy, and at the same time, reduces the contact resistance between the resistance element portion and the terminal portion as much as possible. It is a low resistance manufacturing method used for the purpose, and it is manufactured by a method that does not easily generate distortion (warpage) in the product in order to adjust the resistance value (trimming processing) in the next process for the blanked product by press working etc. Related to the resistance element.
[0002]
[Prior art]
In the prior art, a resistive foil made of Cu / Ni, Ni / Cr alloy, or the like, or a band-shaped material obtained by cladding a metal plate with Cu and solder is used, as shown in FIG. The center of the strip material is cut at a fixed width and the blank is removed by pressing to create a resistance element with a target resistance value. Moreover, it is difficult to secure the resistance accuracy with respect to the target resistance value.
[0003]
[Problems to be solved by the invention]
In the prior art, such a device has a drawback that a sufficient ohmic contact cannot be obtained when terminals are connected by soldering, welding, or the like after the bonding of dissimilar metals. To remedy this drawback, a solder layer is formed by cladding and heat diffusion. By using a Cu / Mn / Sn-based material to reduce the temperature coefficient, it becomes easy to manufacture a high-precision resistance element having a small temperature coefficient of resistance.
[0004]
[Means for Solving the Problems]
The object is to clad a resistive element part (several ppm / ° C.) and a connecting terminal part made of a material having Cu / Mn / Sn = 92.5 to 89/6 to 8 / 1.5 to 3% by weight and having a very small temperature coefficient. Connection. Also, it enables extremely stable bonding of the solder layer of the electrode by the thermal diffusion method, making it possible to manufacture electrically highly reliable products at a low cost. Since the resistance is adjusted, an element with less warpage is possible, and the overall yield is improved. Therefore, as a result, it can be manufactured at low cost.
[0005]
BEST MODE FOR CARRYING OUT THE INVENTION
[0006]
Embodiment 1 FIG. 1 of the present invention shows that a metal plate (1) with Cu / Mn / Sn = 92.5 to 89/6 to 8 / 1.5 to 3% by weight, a Cu clad (2) and a solder (3) A belt-like material prepared by thermal diffusion is prepared. Thereafter, after blank punching is performed by automatic press working, the center of the solder layer surface of the blank punched product is adjusted to the resistance value, and cutting is performed using a dedicated cutting tool according to the target resistance value to adjust the resistance value. In the next step, the surface of the device (Cu / Mn / Sn-based alloy layer) is painted using the entire surface protective material (4), the back surface is coated only with the cut surface, and the surface is marked with a specified seal. Measure and package.
[0007]
Second Embodiment FIG. 2 of the present invention shows that the resistance alloy material of the first embodiment is replaced with a metal plate, and a strip-shaped foil-processed (5) is provided with an arbitrary number of elements so as to cross the length direction of the strip material. After cutting and separating each element, the element surface is insulated and protected with an insulating film (4), the back surface is coated with a protective coating only on the machined surface, the surface is marked with a specified seal, the resistance value is measured, and packaging is performed.
[0008]
[Embodiment 3] In the method of manufacturing a resistor according to claim 1 or 2, the band-like material is formed by using Cu, Ni (6) clad (FIG. 3) and Cu, Pd clad (7) (FIG. 4). To manufacture.
[0009]
【The invention's effect】
According to the present invention, when a resistance element in a low resistance region is manufactured, a specific resistance value of a resistance material is small, a resistance temperature characteristic (resistance temperature coefficient) is small, and a contact between a resistance element portion and a terminal portion is formed by crimping. Since the solder layer is manufactured by the method and heat diffusion, a very stable resistance element can be manufactured. In addition, since the band-shaped material is used, continuous processing is easy, mechanical processing of two terminals and four terminals is easy, and mass production of electrically stable resistors can be performed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a metal plate according to a first embodiment. FIG. 2 is a cross-sectional view of a metal foil according to a second embodiment. FIG. 3 is a cross-sectional view of a Ni clad material according to a third embodiment. [Explanation of symbols]
(1) Resistance metal plate (5) Resistance foil material (2) Copper clad material (6) Ni clad material (3) Solder electrode part (7) Pd clad material (4) Protective material
