JP3525919B2 - Manufacturing equipment for multilayer ceramic electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a laminated ceramic electronic component formed by attaching a conductive layer to a green sheet.

[0002]

2. Description of the Related Art FIG. 5 is an external view of a conventional manufacturing apparatus for a monolithic ceramic electronic component, FIG. 6 is a detailed view of a main part of the manufacturing apparatus for a monolithic ceramic electronic component, and FIG. FIG. 3 is a partially cutaway perspective view of a general laminated ceramic electronic component manufactured using the same.

In FIG. 7, reference numeral 101 is a monolithic ceramic electronic component, and the monolithic ceramic electronic component 101 is
The conductive layers 103 and 104 are laminated through the green sheet 102 to form a laminated body 105, and the laminated body 105 is fired at a predetermined temperature and then paired so as to be connected to the edge portions of the conductive layers 103 and 104. The external electrodes 106 and 107 are formed, and the electrical characteristics of the capacitor, the semiconductor and the like that depend on the characteristics of the green sheet 102 are developed between the pair of external electrodes 106 and 107.

Next, the construction of the manufacturing apparatus for the monolithic ceramic electronic component will be described with reference to FIGS.

In FIGS. 5 and 6, reference numeral 110 denotes a monolithic ceramic electronic component manufacturing apparatus. The monolithic ceramic electronic component manufacturing apparatus 110 previously prints a ceramic slurry on the surface of a carrier film 111 and dries the green sheet. A supply roller 114 around which a green sheet laminated film 113 having 112 formed thereon is wound, and a conductive layer laminated film 1 in which a conductive layer 116 is formed by printing a conductive paste on the surface of a carrier film 115 in advance.
Supply roller 118 around which 17 is wound, the green sheet laminated film 113, and the conductive layer laminated film 11
7 and the pair of pressure bonding rollers 120 and 121 that form a laminated film 119 by pressure bonding, and the carrier film 115 from the conductive layer 116 of the laminated film 119.
A peeling roller 122 for peeling the carrier film 115, a take-up roller 123 for winding the carrier film 115, and the laminated film 11 after peeling the carrier film 115.
It is composed of a take-up roller 124 for taking up 9 pieces.

Reference numeral 125 is the conductive layer laminated film 1
A guide roller for guiding 17 to the pressure bonding rollers 120 and 121, a guide plate 126 for the laminated film 119,
A guide roller 27 guides the carrier film 115 separated from the laminated film 119 to the winding roller 123.

Next, the monolithic ceramic electronic component 101 is manufactured by using the monolithic ceramic electronic component manufacturing apparatus 110 having the above structure.
The manufacturing method of will be described.

First, the surface of a carrier film 115 containing polyester as a main component and having a thickness of several tens of μm is previously coated with A.
Conductive layer laminated film 117 having conductive layer 116 formed by printing an electrode paste containing g or Cu as a main component and drying it.
And a green sheet laminated film 113 in which a green sheet 112 is formed by applying a slurry made of a ceramic raw material on the surface of a carrier film 111 having a thickness of several tens of μm and containing polyester as a main component, and drying the slurry.

Next, the green sheet laminated film 113 is wound around the supply roller 114 and the conductive layer laminated film 117 is wound around the supply roller 118 and mounted on the laminated ceramic electronic component manufacturing apparatus 110.

Next, the conductive layer laminated film 117 is passed between the pressure bonding rollers 120 and 121 and the green sheet laminated film 113 is pressed against the pressure roller 12.
0, 121 between the conductive layer 116 and the green sheet 1
12 so as to pass through so that the pressure-bonding rollers 120,
121 is sequentially pressure-bonded to form a laminated film 119,
This laminated film 119 is conveyed to the upper surface of the guide plate 126.

Next, the laminated film 119 is conveyed onto the guide plate 126, the carrier film 115 is peeled from the conductive layer 116 and conveyed to the peeling roller 122, and is continuously fed to the take-up roller 123 via the guide roller 127. The laminated film 119 from which the carrier film 115 has been peeled off is continuously wound around the winding roller 124.

Thereafter, a laminated film 119 manufactured by using the manufacturing apparatus 110 for the laminated ceramic electronic component.
The carrier film 111 is peeled from the laminated sheet to obtain a laminated sheet in which the green sheet 112 and the conductive layer 116 are laminated, and a plurality of the laminated sheets are laminated and pressure-bonded to form a laminated body block (not shown). The body block is cut into a predetermined size to form a laminated body 105. Then, the laminated body 105 is baked, and an electrode paste is applied to the surface of the laminated body 105 and baked to form the external electrodes 106 and 107.
Thus, the monolithic ceramic electronic component 101 having the structure described above is completed.

[0013]

However, in the conventional apparatus for manufacturing a laminated ceramic electronic component, the overlapping surface of the green sheet 112 and the conductive layer 116 is exposed in advance, so that the green sheet 112 and the conductive layer 1 are exposed.
It is easy to be dried before laminating 16 and 16 and a sufficient adhesion state cannot be obtained, and thus a laminated ceramic electronic component manufactured using this is liable to suffer from structural defects such as cracks and delamination, and electrical characteristics It had a problem of being damaged.

The present invention solves the above-mentioned conventional problems and is capable of laminating a green sheet and a conductive layer in a state of having an excellent adhesive effect, and a laminated ceramic electronic component having excellent mechanical and electrical characteristics. The manufacturing apparatus of

[0015]

In order to achieve the above-mentioned object, it has the following constitution.

[0016] According to a first aspect of the present invention includes a first means for cutting the ends along the green sheet formed on the first carrier film in the longitudinal direction of the film, first
The carrier film from the second rotating roller to form a gap
A third rotating roller and a fourth rotating roller which are formed to face each other.
The second rotating roller, which is fed toward the gap of the roller
And apply tension between the third and fourth rotating rollers.
A second means for peeling the first carrier film from the green sheet, and a third means for obtaining a laminate film by sticking the peeling surface of the green sheet on the upper surface of the conductive layer formed on the second carrier film. And a first carrier , which is an apparatus for manufacturing a monolithic ceramic electronic component configured by means.
Constant tension on the green sheet after peeling from the film
Correct wrinkles and distortion of green sheet by adding
Since the green sheet can be continuously peeled off while
Monolithic ceramic with excellent crimp strength and good appearance accuracy
Function and effect of being able to obtain an electronic component manufacturing apparatus
Is obtained.

According to a second aspect of the present invention, as a first means, the carrier film surface of the green sheet formed on the first carrier film is closely attached to the upper surface of the first rotating roller and is sent out. The green sheet is placed on both ends of the first rotating roller, and the cutting blade is pressed against the first sheet.
2. A cutting mechanism for cutting both ends along the longitudinal direction of the green sheet formed on the carrier film of claim 1.
An apparatus for producing a monolithic ceramic electronic component according to claim 1, which is capable of stably peeling an extremely thin green sheet without being affected by scratches, distortions and the like that are likely to occur on the end surface of a carrier film. It is possible to obtain the action and effect.

In a third aspect of the present invention, as a first means, concave grooves are formed at both ends of the first rotating roller overlapping the cutting blade, and the cutting blade is overlapped with the concave groove. The multilayer ceramic electronic component manufacturing apparatus according to claim 2, further comprising a cutting mechanism configured to cut a green sheet formed on the carrier film without disposing the carrier film and cutting the carrier film. It is possible to obtain an operation effect that it is possible to obtain an apparatus for manufacturing a monolithic ceramic electronic component that can accurately cut a green sheet without being affected even if the surface has scratches or irregularities.

[0019]

[0020]

In a fourth aspect of the present invention, as a third means, a green sheet and a second sheet separated by the first means are provided in a gap between the third rotating roller and the fourth rotating roller. The apparatus for producing a monolithic ceramic electronic component according to claim 1, wherein the electroconductive layer formed on the carrier film is sent out, laminated and pressed to form a laminated film. Since the green sheet and the conductive layer can be pressure-bonded with each other with a pressing force, it is possible to obtain a function and effect that it is possible to obtain a manufacturing apparatus for a monolithic ceramic electronic component having good pressure-bonding strength and appearance accuracy.

In a fifth aspect of the present invention, as a third means, the carrier film surface of the conductive layer formed on the carrier film is brought into close contact with one of the inner surfaces of the third and fourth rotating rollers. 5. The apparatus for manufacturing a laminated ceramic electronic component according to claim 4, comprising a laminating mechanism that heats and pressurizes so as to narrow a gap between the third rotating roller and the fourth rotating roller to form a laminated body film. As a result, since the green sheet and the conductor layer can be continuously laminated by applying a constant pressure and temperature, it is possible to obtain an operation effect that a manufacturing apparatus for a laminated ceramic electronic component having good pressure bonding strength and appearance accuracy can be obtained. .

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION The invention described in claims 1 to 7 of the present invention will be described below by using one embodiment as an apparatus for producing a monolithic ceramic electronic component.

FIG. 1 is an external view of a manufacturing apparatus for a monolithic ceramic electronic component according to an embodiment of the present invention, FIG. 2 is a layout diagram of a manufacturing apparatus for a monolithic ceramic electronic component according to the embodiment, and FIGS. FIG. 3 is a detailed view of a manufacturing apparatus for a monolithic ceramic electronic component according to the same embodiment.

In FIG. 1 to FIG. 4, reference numeral 1 denotes a monolithic ceramic electronic component manufacturing apparatus. The monolithic ceramic electronic component manufacturing apparatus 1 continues a green sheet 10 formed on a first carrier film 9 from a supply roller 14. First means 2 for cutting out both ends of the first carrier film 9 along the longitudinal direction of the first carrier film 9, second means 3 for peeling the first carrier film 9 from the green sheet 10, and second means 2. The third means 4 for continuously feeding the conductive layer 12 formed on the carrier film 11 from the supply roller 15 and sticking the release surface of the green sheet 10 on the upper surface of the conductive layer 12 to obtain the laminated film 13. And the first carrier film 9 separated by the second means 3 is wound around a winding roller 16, and the laminated film 1 Has a configuration that wound on the take-up roller 17.

As the first means 2, the upper surface of the first rotating roller 5 is fed out while the surface of the first carrier film 9 is closely contacted, and the green sheets 10 are placed on both ends of the first rotating roller 5. Press the cutting blades 20 and 21,
A cutting mechanism that cuts both ends along the longitudinal direction of the green sheet 10 is configured, and the cutting mechanism includes a concave groove 1 that overlaps the cutting blades 20 and 21 at both ends of the first rotating roller 5.
8 and 19 are formed so that the green sheet 10 can be cut without cutting the first carrier film 9.

As the second means 3, the first carrier film 9 is sent out along the second rotary roller 6, and the third rotary roller 7 and the fourth rotary roller 7 which face each other with a gap therebetween are formed.
The peeling mechanism configured to feed the green sheet 10 into the gap between the rotating roller 8 and the first carrier film 9 and the green sheet 10 is peeled off. The speed of the second rotary roller 6 is set to be slower than the speed of the third and fourth rotary rollers 7 and 8, and the green sheet 10 is rotated by the second rotary roller 6 and the third and fourth rotary rollers 6. The rollers 7 and 8 are configured to be conveyed while applying tension.

[0028] As the third means 4, the third and fourth
The green sheet 10 and the second carrier film 11 separated by the first means 2 in the gap between the rotating rollers 7, 8.
The conductive layer 12 attached to the substrate is sent out, and the laminated film is laminated and pressed to form a laminated film 13. This laminated mechanism is composed of the third and fourth rotating rollers 7 and 8.
A heater (not shown) for closely heating the surface of the second carrier film 11 is built in one surface of the above, and operates to narrow the gap between the third and fourth rotating rollers 7 and 8. The pressure can be adjusted.

A guide roller 22 conveys the first carrier film 9 having the green sheets 10 laminated thereon, and 23.
Is a guide roller that conveys the green sheet 10 to the take-up roller 16 of the first carrier film 9 after peeling, 24 is a guide roller that conveys the second carrier film 11 on which the conductive layer 12 is laminated, and 25 is the guide roller. It is a guide roller that conveys the laminated film 13 to the winding roller 17, and is configured to convey the ultrathin green sheet 10 and the conductive layer 12 without damage.

The operation of the apparatus for manufacturing a monolithic ceramic electronic component according to the embodiment of the present invention will be described below.

First, the width is 14 mm and the thickness is 10 μ in advance.
m green sheet 10 having a width of 140 mm and a thickness of 30 μm
Forming the first carrier film 9 on the supply roller 14
And the conductive layer 12 having a thickness of several μm on the other hand.
mm, the shape on the second carrier film 11 having a thickness of 30μm
It is formed and wound around the supply roller 15.

Next, the green sheet 10 is formed.
First lead the carrier film 9, 2m from both ends in the longitudinal direction of the green sheet 10 in the first unit 2
While cutting the width of m with the cutting blades 20 and 21, the first rotating roller 5 is rotated and conveyed to the second means 3. At this time, disc-shaped cutting blades 20 and 21 are used, and the winding diameter of the first carrier film 9 of the supply roller 14 is detected by a sensor at any time, and the tension of about 8 N is applied to the first carrier film 9. Transport while controlling so that
Both ends of the green sheet 10 can be cut uniformly.

Then, the second means constructed in the second means 3
The first carrier film 9 using the rotating roller 6 of
The green sheet 10 is peeled from the sheet, the first carrier film 9 is conveyed along the rotation of the second rotating roller 6, and is wound around the winding roller 16 while being guided by the guide roller 23. The green sheet 10 peeled from the film 9 is passed through the gap between the third rotating roller 7 and the fourth rotating roller 8 forming the third means 4.

On the other hand, the third rotation forming the third means so that the second carrier film 11 in which the conductive layer 12 wound around the supply roller 15 is laminated is overlapped with the green sheet 10 via the guide roller 24. It is passed between the roller 7 and the fourth rotating roller 8. At this time, the second
The carrier film 11 of No. 4 is closely attached to the third rotating roller 7, and the third rotating roller 7 and the fourth rotating roller 7 are arranged so that the surface of the green sheet 10 from which the first carrier film 9 is peeled off directly overlaps the conductive layer 12. And between the rotating roller 8 and.

If the conveying speed of the green sheet 10 is too slow, the green sheet 10 is stretched and a predetermined thickness cannot be obtained, and if too fast, the green sheet 10 is moved to the first position at a predetermined position of the second rotating roller 6. Since it becomes difficult to peel the carrier film 9 from the carrier film 9, an appropriate speed is determined and set accurately with the ceramic material forming the green sheet 10. Here, 5 m per minute is set.
And the moving speed.

Next, the third rotating roller 7 and the fourth rotating roller 8 are pressed so that they come close to each other, and the heater incorporated in the third rotating roller 7 is activated to heat it to about 50.degree. Meanwhile, the green sheet 10 and the conductive layer 12 are pressure-bonded to each other to continuously form the laminated film 13.

Next, the laminate film 13 is continuously wound around the winding roller 17 via the guide roller 25 to obtain the roll-shaped continuous laminate film 13.

Next, as shown in FIG. 7, a plurality of the laminate films 13 are alternately laminated and pressure-bonded to form a laminate block (not shown), and the laminate block is cut into a predetermined size. The laminated body 105 is formed. After that, the laminated body 107 is fired, and an electrode paste is applied to the surface of the laminated body 107 and baked to complete the laminated ceramic electronic component 101 in which the external electrodes 106 and 107 are formed.

[0039]

As described above, the apparatus for manufacturing a monolithic ceramic electronic component of the present invention comprises first means for cutting both ends of the green sheet formed on the first carrier film along the longitudinal direction of the film, and Second means for peeling the first carrier film from the green sheet, and third means for sticking the peeling surface of the green sheet to the upper surface of the conductive layer formed on the second carrier film to obtain a laminate film. Since the surface of the green sheet which overlaps the conductive layer can be covered with the first carrier film in advance to prevent drying and contamination by the above constitution, the surface of the green sheet from which the first carrier film is peeled off and the conductive layer are Highly reliable monolithic ceramic electronic components with improved adhesive strength, less structural defects such as delamination and poor adhesion, and good electrical characteristics There is an advantage that it is possible to obtain a manufacturing apparatus.

[Brief description of drawings]

FIG. 1 is an external view of a manufacturing apparatus for a monolithic ceramic electronic component according to an embodiment of the present invention.

FIG. 2 is a layout diagram of an apparatus for manufacturing a monolithic ceramic electronic component according to the same embodiment.

FIG. 3 is a detailed view of an apparatus for manufacturing a monolithic ceramic electronic component according to the same embodiment.

FIG. 4 is a detailed view of an apparatus for manufacturing a monolithic ceramic electronic component according to the same embodiment.

FIG. 5 is an external view of a manufacturing apparatus for a monolithic ceramic electronic component in a conventional example.

FIG. 6 is a detailed view of an apparatus for manufacturing a monolithic ceramic electronic component in the conventional example.

FIG. 7 is a partially cutaway perspective view showing an example of a laminated ceramic electronic component.

[Explanation of symbols]

1 Multilayer ceramic electronic component manufacturing equipment 2 First means 3 second means 4 third means 5 First rotating roller 6 Second rotating roller 7 Third rotating roller 8 Fourth rotating roller 9 First carrier film 10 green sheets 11 Second carrier film 12 Conductive layer 13 Laminated film 14,15 Supply roller 16,17 Take-up roller 18,19 concave groove 20,21 cutting blade 22,23,24,25 Guide roller 101 multilayer ceramic electronic components 102 green sheets 103, 104 conductive layer 105 laminate 106,107 external electrodes

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ikutaka Asada 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kenji Wada 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP 2001-23854 (JP, A) JP 8-56078 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4 / 00-17 / 00

Claims (5)

(57) [Claims] 1. A first means for cutting both ends of a green sheet formed on a first carrier film along a longitudinal direction of the film, and a first carrier film for a second rotation.
Third rotation from the roller facing each other with a gap
Send it toward the gap between the roller and the fourth rotating roller,
The second rotating roller and the third and fourth rotating rollers
A second means for peeling the first carrier film from the green sheet while applying a tension between the second carrier film and the peeling surface of the green sheet on the upper surface of the conductive layer formed on the second carrier film; An apparatus for producing a monolithic ceramic electronic component comprising a third means for obtaining a film. 2. As a first means, the green sheet formed on the first carrier film is fed while being brought into close contact with the upper surface of the first rotating roller, and the green sheet is attached to both ends of the first rotating roller. The apparatus for manufacturing a monolithic ceramic electronic component according to claim 1, wherein a cutting mechanism configured to cut the both ends of the green sheet formed on the first carrier film by pressing the cutting blade against the green sheet formed on the first carrier film. 3. A first means for overlapping a cutting blade as a first means.
Forming a groove at both ends of the rotary roller, and the cutting blade is arranged so as to overlap with the groove so as to cut a green sheet formed on the carrier film without cutting the carrier film. 2. An apparatus for manufacturing a monolithic ceramic electronic component according to 2. 4. A third rotating roller as a third means
The gap separated from the fourth rotation roller by the first means
Conduction formed on the lean sheet and the second carrier film
Layer and send it out, stack and pressurize the laminated film
The manufacturing apparatus for a monolithic ceramic electronic component according to claim 1, which constitutes a laminating mechanism to be formed . 5. As a third means, third and fourth rotary rollers are provided.
Conductor layer formed on the carrier film on one side of the roller
The third and fourth carrier film surfaces are closely contacted and heated.
Apply pressure to close the gap between the rotating rollers and
The apparatus for manufacturing a monolithic ceramic electronic component according to claim 4, which constitutes a laminating mechanism that forms a rum .