JP2011207222A - Method and apparatus for manufacturing ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component, capable of improving adhesion of a ceramic sheet to a ceramic shaft.SOLUTION: The method for manufacturing the ceramic electronic component includes a first winding step which mounts the ceramic sheet 12 on the plane of a base 4, mounts the ceramic shaft 13 on the end of the ceramic sheet 12, interposes the ceramic sheet 12 and the ceramic shaft 13 between the plane of the pressing part 8 and the plane of the base 4, and move the base 4 in a direction H parallel to the plane of the base 4, thereby winding the ceramic sheet 12 around the rotating ceramic shaft 13 to form a ceramic substrate.

Description

  The present invention relates to a ceramic electronic component manufacturing method and a ceramic electronic component manufacturing apparatus.

  Ceramic heaters are used in various heaters for automotive oxygen sensors, soldering irons, oil vaporizer heat sources such as oil fan heaters, industrial equipment such as hot water heaters, electronic parts, and general households. .

  Patent Document 1 discloses a method for manufacturing a ceramic heater having a step of winding a ceramic sheet around a ceramic shaft using a roller and a base.

Japanese Patent No. 3694408

  In the manufacturing method described in Patent Document 1, since the roller surface is a curved surface, the distance between the roller surface and the base is not constant. Therefore, the direction and magnitude of the force acting on the ceramic shaft and the ceramic sheet sandwiched between the roller and the base are not constant. Therefore, control of the pressure applied to the ceramic shaft and the ceramic sheet by the roller and the base becomes insufficient. As a result, the ceramic sheet may not be uniformly pressed against the ceramic shaft, resulting in uneven winding, or the end of the ceramic sheet may peel off from the ceramic shaft. Moreover, although the edge part of the ceramic sheet wound around the ceramic axis | shaft is easy to peel compared with other places, it was difficult to crimp | bond the edge part of a ceramic sheet locally using a roller. As a result, in the completed ceramic heater, the ceramic sheet is easily peeled off from the ceramic shaft, and the variation in reliability regarding the appearance of the ceramic heater and continuous energization, intermittent energization, or resistance value increase is increased.

  Further, in the manufacturing method described in Patent Document 1, when the rotation speed of the roller is increased to increase the tact time, the ceramic shaft or the ceramic sheet is ejected from between the roller and the base, or the rotation of the roller is caused by the ceramic. In some cases, the roller could idle without being transmitted to the shaft. For this reason, it has been difficult to sufficiently shorten the tact time.

  The above problem is not only in the method of manufacturing a ceramic heater, but also in a ceramic electronic device including a ceramic shaft, a ceramic sheet wound around the ceramic shaft, and an electrode portion, such as a piezoelectric conversion element, a multilayer cylindrical capacitor, and a spark plug. It was a common problem in the production of parts.

  The present invention has been made in view of the above-described problems of the prior art, and provides a ceramic electronic component manufacturing method and a ceramic electronic component manufacturing apparatus capable of improving the adhesion of a ceramic sheet to a ceramic shaft. For the purpose.

  In order to achieve the above object, a method of manufacturing a ceramic electronic component according to the present invention includes placing a ceramic sheet on a plane of a base, placing a ceramic shaft on an end of the ceramic sheet, and The ceramic sheet and the ceramic shaft are sandwiched between the base plate and the plane of the base, and at least one of the base or the pressing portion is moved in parallel to the plane of the base, so that the ceramic sheet is rotated on the rotating ceramic shaft. Is wound to form a ceramic substrate.

  According to the said invention, the adhesiveness of the ceramic sheet with respect to a ceramic shaft can be improved.

  In the method for manufacturing a ceramic electronic component according to the present invention, the ceramic base is sandwiched between the plane of the pressing portion and the plane of the base, and at least one of the base or the pressing portion is placed on the plane of the base. It is preferable to provide a second winding step of rotating the ceramic substrate by moving the ceramic substrate in parallel.

  The adhesion of the ceramic sheet to the ceramic shaft is further improved by the second winding step.

  The hardness of the base in the second winding step is preferably higher than the hardness of the base in the first winding step. This further improves the adhesion of the ceramic sheet to the ceramic shaft.

  The method of manufacturing a ceramic electronic component according to the present invention includes a pressing unit in a state where an end of a ceramic sheet located on a surface of a ceramic shaft in a ceramic base is opposed to a plane of a pressing unit or a plane of a base. It is preferable to provide an end pressurizing step in which the ceramic base is sandwiched between the flat surface and the base surface.

  By pressurizing the end of the ceramic sheet in the end pressurizing step, the adhesion of the end of the ceramic sheet to the ceramic shaft is improved.

  An apparatus for manufacturing a ceramic electronic component according to the present invention includes a pressing portion having a flat surface, a base having a flat surface facing the flat surface of the pressing portion, and at least one of the pressing portion and the base. A vertical direction moving mechanism that moves in a direction perpendicular to the plane; and a parallel direction moving mechanism that moves at least one of the pressing unit and the base in a direction parallel to the plane of the base.

  According to the ceramic electronic component manufacturing apparatus according to the present invention, the ceramic electronic component manufacturing method according to the present invention can be implemented.

  The method and apparatus for manufacturing a ceramic electronic component according to the present invention are suitable for manufacturing a ceramic heater.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a ceramic electronic component and the manufacturing apparatus of a ceramic electronic component which can improve the adhesiveness of the ceramic sheet with respect to a ceramic shaft can be provided.

It is the schematic of the manufacturing apparatus of the ceramic heater which concerns on one Embodiment of this invention. It is the schematic which shows the 1st winding process with which the manufacturing method of the ceramic heater which concerns on one Embodiment of this invention is provided. It is the schematic which shows the 2nd winding process with which the manufacturing method of the ceramic heater which concerns on one Embodiment of this invention is provided. It is the schematic which shows the edge part pressurization process with which the manufacturing method of the ceramic heater which concerns on one Embodiment of this invention is provided. It is the schematic of the base with which the manufacturing apparatus of the ceramic heater which concerns on other embodiment of this invention is provided. It is the schematic of the rod-shaped ceramic heater obtained by the manufacturing method of the ceramic heater which concerns on one Embodiment of this invention. It is a perspective view of the piezoelectric transducer which concerns on other embodiment of this invention. It is sectional drawing of the piezoelectric transducer which concerns on other embodiment of this invention. It is a perspective exploded view of a piezoelectric transducer according to another embodiment of the present invention.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or equivalent elements are denoted by the same reference numerals. Also, the positional relationship between the top, bottom, left and right is as shown in the drawing. Further, when the description overlaps, the description is omitted.

(Ceramic electronic component manufacturing equipment)
Below, as one embodiment of the present invention, a ceramic heater manufacturing apparatus which is a kind of ceramic electronic component and a ceramic heater manufacturing method using the apparatus will be described. As shown in FIG. 1, the ceramic heater manufacturing apparatus 2 according to this embodiment includes a plate-like pressing portion 8 and a base 4. The plane of the pressing portion 8 and the plane of the base 4 are opposed in parallel.

  The pressing portion 8 is fixed to the support 10. The support 10 is connected to the vertical movement mechanism 18. The vertical direction moving mechanism 18 freely moves the support 10 and the pressing portion 8 fixed thereto in a direction perpendicular to the plane of the base 4.

  The base 4 is fixed to the support base 6. The support base 6 is connected to the parallel movement mechanism 20. The parallel movement mechanism 20 freely moves the support base 6 and the base 4 fixed thereto in a direction parallel to the plane of the base 4.

  It is preferable that at least one of the base 4 or the pressing portion 8 has flexibility. When the base 4 or the pressing portion 8 has flexibility, the ceramic shaft and the ceramic sheet sandwiched between the base 4 and the pressing portion 8 in the first winding step, the second winding step, or the end pressing step. Depending on the surface shape, the surface of the base 4 or the pressing portion 8 is deformed, and the ceramic shaft or the ceramic sheet is sunk into the base 4 or the pressing portion 8 (see FIGS. 2 to 4). Thereby, the contact area of the base 4 and the pressing part 8, and a ceramic shaft and a ceramic sheet becomes large, and it becomes easy to pressurize a ceramic shaft and a ceramic sheet uniformly. As a result, the adhesion of the ceramic sheet to the ceramic shaft is likely to be improved.

  Examples of the material having flexibility include Si sponge, Si rubber, chloroprene rubber, and urethane rubber. What is necessary is just to comprise the base 4 and the pressing part 8 from these materials. The hardness of urethane rubber is higher than that of chloroprene rubber. The hardness of chloroprene rubber is higher than that of Si rubber. The hardness of Si rubber is higher than that of Si sponge. The smaller the hardness of the base 4 or the pressing part 8, the larger the contact area between the base 4 and the pressing part 8, the ceramic shaft and the ceramic sheet, and the smaller the pressure acting on the ceramic shaft and the ceramic sheet.

  The ceramic heater manufacturing apparatus 2 may include a heating mechanism for heating the base 4. For example, by performing the first winding step, the second winding step, or the end pressure step while heating the base 4, the thermoplastic ceramic sheet is easily formed, and the adhesion of the ceramic sheet to the ceramic shaft Will improve.

(Method for manufacturing ceramic electronic components)
Below, the manufacturing method of the ceramic heater which is 1 type of a ceramic electronic component is demonstrated as one Embodiment of this invention. The method for manufacturing a ceramic heater is performed using the above-described ceramic heater manufacturing apparatus according to the present embodiment.

<Ceramic sheet and ceramic shaft formation process>
First, a ceramic raw material powder, a molding binder and an organic solvent are mixed by a wet method to obtain a ceramic composition. The ceramic raw material powder contains a base material and a sintering aid. The base, for example, a starting material corresponding to _Al 2 _{O 3.} The sintering aid is, for example, a raw material corresponding to an oxide such as SiO ₂ , CaO, Mg and ZrO ₂ . The ceramic raw material powder may be calcined before firing. The ceramic composition may further contain a raw material of high-temperature high-strength ceramics similar to alumina, such as mullite and spinel, and oxides of rare earth elements.

  A ceramic composition is molded by a doctor blade method or the like to produce a rectangular ceramic sheet 12. Moreover, the ceramic composition is extruded to produce a tubular ceramic shaft 13 having a hollow structure. The ceramic shaft 13 may be cylindrical instead of tubular. The outer peripheral length of the ceramic shaft 13 and the length of one side of the ceramic sheet 12 are substantially equal. The axial length of the ceramic shaft 13 and the length of the other side of the ceramic sheet 12 are substantially equal.

  A heating part in which a resistance heating material is embedded is formed on one side of the ceramic sheet 12 by screen printing or the like. Further, a drawer portion connected to the heat generating portion is formed by screen printing or the like. A through hole penetrating the ceramic sheet 12 is formed in a portion of the ceramic sheet 12 where the end of the lead portion is located, and a conductive paste is filled in the through hole.

  A refractory metal such as W, Mo, Re, or the like can be used for the resistance heating material embedded in the heat generating portion, the lead portion, and an electrode pad described later.

  An electrode pad (metallization) is formed so as to cover a through hole located on the surface of the ceramic sheet 12 opposite to the one surface on which the lead portion is formed. Further, an adhesive 22 is applied on one surface of the ceramic sheet 12 on which the heat generating portion and the lead portion are formed.

<First winding step>
In the first winding step, as shown in FIGS. 1 and 2A, one side of the ceramic sheet 12 coated with the adhesive 22 is opposed to the pressing portion 8 and the ceramic sheet 12 is placed on the plane of the base 4. . The ceramic shaft 13 is placed on the end of the ceramic sheet 12. At this time, one side of the ceramic sheet 12 having the same axial length as the ceramic shaft 13 and the ceramic shaft 13 are arranged in parallel.

  By bringing the ceramic shaft 13 into close contact with the end of the ceramic sheet 12 in the first winding step, winding unevenness can be prevented.

  In addition, as shown in FIG. 1, FIG. 2A etc., the jig | tool (guide) inclined with respect to the surface of the base 4 may be installed in the end of the surface of the base 4. FIG. The ceramic shaft 13 may be positioned by bringing the surface of the ceramic shaft 13 into contact with the surface of the jig.

  Next, as shown in FIG. 2B, the pressing portion 8 is vertically moved toward the plane of the base 4, and the ceramic sheet 12 and the ceramic shaft 13 are interposed between the plane of the pressing portion 8 and the plane of the base 4. Is inserted. Note that the pressure acting on the ceramic sheet 12 and the ceramic shaft 13 sandwiched between the plane of the pressing portion 8 and the plane of the base 4 can be freely adjusted by the vertical movement mechanism 18.

  Next, as shown in FIG. 2C, the ceramic sheet 12 is started to be wound around the ceramic shaft 13 rotated in the R direction by moving the base 4 in the H direction parallel to the plane of the base 4. Further, by continuing to move the base 4 in the H direction, the entire ceramic sheet 12 is wound around the ceramic shaft 13 as shown in FIG. 2D. As described above, when the ceramic shaft 13 is placed on the end portion of the ceramic sheet 12 placed on the plane of the base 4, the ceramic shaft 13 is orthogonal to the H direction. The moving speed of the base 4 in the H direction can be freely adjusted by the parallel moving mechanism 20.

  As shown in FIG. 2E, a ceramic base including the ceramic shaft 13 and the ceramic sheet 12 press-bonded to the outer peripheral surface of the ceramic shaft 13 with an adhesive is formed by the first winding process described above. In the ceramic substrate, an adhesive, a heat generating part, and a lead part are sandwiched between the ceramic shaft 13 and the ceramic sheet 12.

  In a 1st winding process, it is preferable that the static friction coefficient of the surface of the base 4 is 1-2, and the durometer hardness of the base 4 is 5-20. When the surface friction coefficient and the hardness of the base 4 are within the above numerical ranges, the sliding of the ceramic sheet 12 on the base is suppressed, and the ceramic sheet 12 can be easily wound around the ceramic shaft 13. For example, Si sponge is suitable as a material constituting the base 4 whose surface friction coefficient and hardness are within the above numerical ranges. For example, Si rubber may be used as the material constituting the pressing portion 8.

  In the first winding step, it is preferable to carry out without stretching the ceramic sheet 12. When the first winding step is performed while the ceramic sheet 12 is stretched, a restoring force acts on the ceramic sheet 12 wound around the ceramic shaft 13 and the ceramic sheet 12 is easily peeled off.

<Second winding process>
In this embodiment, it is preferable to perform the following 2nd winding process after a 1st winding process.

  In the second winding step, as shown in FIG. 3A, the ceramic base is placed on the plane of the base 4a. At this time, the ceramic shaft 13 provided in the ceramic base is orthogonal to the H direction. Moreover, it is preferable to make both ends of the ceramic sheet 12 located on the surface of the ceramic shaft 13 in the ceramic base face the plane of the base 4a. Then, as shown in FIG. 3B, the ceramic base is sandwiched between the plane of the pressing portion 8 and the plane of the base 4a, the base 4a is moved in the H direction, and the ceramic base is rotated in the R direction. As shown in FIGS. 3A, 3B, and 3C, when the ceramic base is rotated halfway in the R direction, the entire ceramic base is in contact with either the pressing portion 8 or the base 4a. The whole is crimped again. In the second winding step, it is preferable to apply a large force that does not damage the ceramic sheet 12 and the ceramic shaft 13 in order to suppress the opening of both ends of the ceramic sheet 12 positioned on the surface of the ceramic shaft 13. .

  The hardness of the base 4a used in the second winding step is preferably higher than the hardness of the base 4 used in the first winding step. As a result, the pressure acting on the ceramic sheet 13 in the second winding step becomes larger than that in the first winding step, and the ceramic sheet 12 can be easily pressed against the ceramic shaft 13. For example, when the base 4 made of Si sponge is used in the first winding step, the base 4a made of chloroprene rubber having higher hardness than Si sponge may be used in the second winding step.

  In the second winding step, it is preferable that the static friction coefficient of the surface of the base 4a is 0.1 to 1, and the durometer hardness of the base 4a is 50 to 90. When the surface friction coefficient and hardness of the base 4a are within the above numerical range, the adhesion between the ceramic shaft 13 and the ceramic sheet 12 can be easily improved.

<End pressurization process>
In this embodiment, it is preferable to perform the following edge pressurization process after a 2nd winding process.

  In the end pressurizing step, as shown in FIG. 4A, the ceramic base is placed on the plane of the base 4a. At this time, the ceramic shaft 13 provided in the ceramic base is orthogonal to the H direction. Further, both end portions of the ceramic sheet 12 positioned on the surface of the ceramic shaft 13 in the ceramic base are opposed to the plane of the base 4a. In the end pressure process, the same base 4a as that used in the second winding process may be used.

  Next, as shown in FIG. 4B, the pressing portion 8 is vertically moved toward the plane of the base 4a, and the ceramic base is sandwiched between the plane of the pressing portion 8 and the plane of the base 4a. Thereby, the both ends of the ceramic sheet 12 are pressed against the plane of the base 4a. Thereby, the shape retention property of the both ends of the ceramic sheet 12 crimped | bonded to the ceramic shaft 13 improves, and it becomes difficult to restore | restore the both ends of the ceramic sheet 12 in the state before an edge part pressurization process. As a result, it is possible to prevent the both end portions of the ceramic sheet 12 from being peeled off and opened in the binder removal step or firing step of the ceramic substrate.

  In the end pressurizing step, for example, the ceramic base may be kept between the pressing portion 8 and the base 4a for a certain time while heating the base 4a against which both ends of the ceramic sheet 12 are pressed. preferable. Thereby, the shape retention property of the both ends of the ceramic sheet 12 crimped | bonded to the ceramic shaft 13 further improves.

  In addition, when an end part pressurization process is implemented immediately after a 1st winding process, without performing a 2nd winding process, the shape of a ceramic base | substrate may collapse | crumble. Specifically, a part other than the end portion of the ceramic sheet 12 may peel from the ceramic shaft 13 in a direction parallel to the plane of the base 4a during the end portion pressing step. After improving the adhesiveness of the ceramic sheet 12 to the ceramic shaft 13 in the second winding step, the ceramic sheet 12 in the end pressurizing step is hardly peeled by performing the end pressurizing step, The shape of the ceramic substrate is difficult to collapse.

  Next, in the firing step, the ceramic substrate is heated in a reducing atmosphere of about 1450 to 1650 ° C.

  After the firing step, Ni plating is applied to the surface of the electrode pad. A metal lead is brazed onto the Ni plating by using a brazing material to form an electrode portion. As the brazing material, for example, a brazing material composed of at least one of Ag, Au, Cu, Ni, and Pd can be used. Ni plating is applied to protect the brazing material and the metal leads. Thereby, the ceramic heater shown in FIG. 6 is obtained.

  As shown in FIG. 6, the ceramic heater includes a ceramic substrate 11 in which a heat generating portion 14 and a drawer portion 15 are built. The ceramic substrate 11 has a configuration in which a ceramic sheet 12 is wound around a ceramic shaft 13. The ceramic base 11 is provided with an electrode portion 16 for supplying power to the resistance heating material. The lead portion 15 is electrically connected to the electrode portion 16. A metal lead 17 is brazed to the electrode portion 16.

  In the conventional manufacturing method using a roller for winding a ceramic sheet, if the rotation speed of the roller is increased to shorten the tact time, the ceramic shaft or the ceramic sheet is ejected from between the roller and the base, or the rotation of the roller is prevented. In some cases, the roller could idle without being transmitted to the ceramic shaft. For this reason, it has been difficult to sufficiently shorten the tact time. On the other hand, in this embodiment, since a roller is not used, these problems do not occur. In this embodiment, since the ceramic sheet 12 starts to be wound after the ceramic shaft 13 is brought into close contact with the end of the ceramic sheet 12 in the first winding step, the ceramic sheet 12 is unlikely to be detached from the ceramic shaft 13 during winding. . For these reasons, in this embodiment, the moving speed of the base can be increased compared to the conventional case, and as a result, the tact time can be shortened.

  In the present embodiment, the ceramic sheet is wound around the ceramic shaft while pressing the ceramic shaft and the ceramic sheet between the plane of the pressing portion and the plane of the base arranged at a certain distance. Therefore, in this embodiment, compared with the conventional manufacturing method using a roller, the direction and magnitude of the force acting on the ceramic shaft and the ceramic sheet sandwiched between the pressing portion and the base are stabilized. The pressure applied to the sheet can be easily controlled. As a result, in this embodiment, the ceramic sheet can be uniformly crimped to the ceramic shaft.

  In this embodiment, the ceramic sheet is difficult to peel from the ceramic shaft in the completed ceramic heater. Therefore, the appearance of the ceramic heater is improved, and the reliability regarding continuous energization, intermittent energization, or resistance value change is improved.

  In this embodiment, the first winding step, the second winding step, and the end pressure step described above can be continuously performed using a pair of pressing portions and a base. On the other hand, in the conventional manufacturing method using a roller, when an end pressurization process like this embodiment is carried out, the winding process using a roller and the end pressurization using a pressing part different from the roller The process needs to be performed individually. Therefore, in this embodiment, it becomes possible to simplify the manufacturing process of a ceramic heater compared with the past.

  As mentioned above, although one suitable embodiment of the present invention was described in detail, the present invention is not limited to the above-mentioned embodiment.

  For example, the manufacturing apparatus may include a vertical movement mechanism that moves the base instead of the pressing unit. Moreover, the manufacturing apparatus may include a parallel direction moving mechanism that moves the pressing portion instead of the base. In this case, the same effect as the above-described embodiment can be achieved.

  Further, by increasing the area of each plane of the base and the pressing portion, it is possible to increase the number of windings per moving distance of the base. In other words, by placing a plurality of ceramic sheets on the base at the same time and placing the ceramic shaft on the end of each ceramic sheet, the ceramic sheets are wound around the plurality of ceramic shafts in a single first winding step. Also good. In this case, the same effect as the above-described embodiment can be achieved.

  When the first winding step, the second winding step, and the end pressure step are performed continuously, for example, as shown in FIG. 5, the second base having higher hardness than the first base 4 and the first base 4. A base 4 a may be provided, and the second base 4 a may be covered with a part of the first base 4. The hardness of the region where the second base 4a is covered with a part of the first base 4 is higher than the hardness of the region where only the first base 4 is disposed. The first winding process is performed in the area where only the first base 4 is arranged, and the second base 4a is covered with a part of the first base 4 continuously after the first winding process. What is necessary is just to perform a 2 winding process and an edge part pressurization process. In this case, the same effect as the above-described embodiment can be achieved. Moreover, you may comprise a pressing part from the 1st member and the 2nd member whose hardness is higher than a 1st member. Even if a 1st winding process is performed in the area | region comprised from a 1st member among pressing parts, and a 2nd winding process and an edge part pressurization process are performed in the area | region comprised from a 2nd member among pressing parts. Good. In this case, the same effect as the above-described embodiment can be achieved.

  The pressing portion may be tilted with respect to the base so that the distance between the plane of the base and the plane of the pressing portion is shortened along the direction in which the base is moved. In this case, the same effect as the above-described embodiment can be achieved.

  The method and apparatus for manufacturing a ceramic electronic component according to the present invention can also be applied to manufacturing other ceramic electronic components including a ceramic shaft, a ceramic sheet wound around the ceramic shaft, and an electrode portion. For example, you may manufacture the piezoelectric transducer shown in FIGS. 7-9 with the manufacturing method and manufacturing apparatus of this invention.

  In the manufacture of the piezoelectric transducer 110, first, a thin plate-like first piezoelectric element 111 having a first electrode portion 111a formed on the surface and a second piezoelectric element having a second electrode portion 112a formed on the surface. 112 is manufactured.

As a material of the piezoelectric elements 111 and 112, a piezoelectric ceramic composition containing PZT (PbZrO ₃ .PbTiO ₃ ) as a main component is used. A slurry obtained by mixing the powder of the piezoelectric ceramic composition with a solvent, a dispersant, a binder, a plasticizer, etc., using a blade or the like, has a uniform thickness (for example, a thickness of 20 to 100 μm) on a plane Stretch out into a sheet. When the solvent is evaporated from the sheet-like slurry and dried, a flexible sheet called a green sheet can be obtained. A small amount of a modifying element such as Sr, Sn, Sb, or Mn may be added to PZT.

  Next, a paste-like electrode material (for example, Pt-based or Ag-Pd-based electrode material) is printed on the surface of the green sheet to a thickness of 1 to several μm by means such as screen printing, and the electrode portion 111a. And 112a, respectively. The first piezoelectric element 111 and the second piezoelectric element 112 are obtained by cutting the green sheet on which each electrode is printed into a predetermined size.

  Next, the second piezoelectric element 112 is stacked on the first piezoelectric element 111 and bonded to form a stacked body. This laminated body corresponds to the ceramic sheet 12 in the embodiment according to the ceramic heater.

  In the laminated body forming step, the surface of the first piezoelectric element 111 on which the electrode portion 111a is formed is opposed to the surface of the second piezoelectric element 112 on which the electrode portion 112a is not formed. Further, in the step of forming the laminated body, in order to expose the end portion of the electrode portion 111a of the first piezoelectric element 111 located on the lower side, the notch portion 112b is formed on the end portion of the second piezoelectric element 112 located on the upper side. Form. Thereby, a lead wire can be connected to the electrode part 111a of the piezoelectric element 111 on the lower side.

  Next, a cylindrical ceramic substrate is formed by winding the laminated body around the middle shaft 113 in a state where the first piezoelectric element 111 constituting the laminated body is opposed to the middle shaft 113 (ceramic shaft). For the winding around the central shaft 113 of the laminate, a manufacturing apparatus and a manufacturing method similar to those of the above-described embodiment relating to the ceramic heater may be applied. When there is a possibility that a gap is generated between the middle shaft 113 and the laminated body in the first winding step, it is preferable to fill the gap using a component that bonds the middle shaft 113 and the laminated body. Thereby, winding shift can be prevented. As a component for adhering the intermediate shaft 113 and the laminate, for example, a paste composed of a powder of a piezoelectric ceramic composition similar to that included in the intermediate shaft 113 and the laminate, a binder, a solvent, and the like may be used.

  The middle shaft 113 may be produced by, for example, extruding a slurry containing a piezoelectric ceramic composition similar to that used for each piezoelectric element.

  After the obtained ceramic substrate is fired at a predetermined temperature condition, lead wires are connected to the electrode portions 111a and 112a, respectively. Then, when each piezoelectric element is polarized by applying a predetermined high DC voltage between the leads, the piezoelectric conversion element 110 is completed. When the piezoelectric conversion element 110 is cut into a desired length (for example, about 5 mm), it can be used as an actuator drive element.

It is also possible to manufacture a multilayered cylindrical capacitor in substantially the same manner as the piezoelectric transducer 110 except that a green sheet is formed using a dielectric ceramic composition such as BaTiO ₃ instead of the piezoelectric ceramic composition. is there. Moreover, the manufacturing apparatus and manufacturing method of this invention can also be applied to manufacture of a spark plug.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

Example 1
Baking step after 91.2 wt% of _Al 2 _O 3, 5.9 wt% of _SiO 2, 1.7 wt% of CaO, contained 0.1% by weight of MgO and 1.1 wt% of ZrO ₂ In order to obtain ceramics, the base material and the sintering aid were weighed to prepare ceramic raw material powder. A ceramic raw material powder, a molding binder and an organic solvent were wet mixed to obtain a ceramic composition slurry. This slurry was molded by a doctor blade method to obtain a ceramic sheet a having a thickness of 0.3 mm and a ceramic sheet b having a thickness of 0.1 mm. On the surface of the ceramic sheet b, a heat generating part made of W-Re and a lead part made of W-Mo were screen-printed. A through hole was formed in a portion of the ceramic sheet a facing the position where the end of the lead portion of the ceramic sheet b was located, and a conductive paste was filled in the through hole. The ceramic sheet a and the ceramic sheet b were superposed, heated and pressurized, and pressed to form a ceramic sheet c. An electrode pad was screen-printed on the surface of the ceramic sheet c on the ceramic sheet a side so as to overlap the through hole, and the lead portion and the electrode pad were made conductive. Then, the ceramic sheet c was cut into a predetermined size. An adhesive mainly composed of an organic solvent was applied to the surface of the cut ceramic sheet c on the side where the electrode pads were not printed.

  A ceramic shaft was prepared by extruding the ceramic composition slurry.

  The following first winding process, second winding process, and end pressure process were performed using the manufacturing apparatus shown in FIG.

<First winding step>
In the first winding step, first, one side of the ceramic sheet c to which the adhesive was applied was opposed to the plate-like pressing portion, and the ceramic sheet c was placed on the plane of the base. The ceramic shaft was placed on the end of the ceramic sheet c. Next, the plate-shaped pressing portion is vertically moved toward the plane of the base, the ceramic sheet c and the ceramic shaft are sandwiched between the plane of the pressing portion and the plane of the base, and the ceramic sheet c and the ceramic shaft Was brought into close contact. In the first winding step, a base made of silicon sponge and a pressing portion made of silicon rubber were used, and in the first winding step, the base was heated to 80 ° C. in advance.

  Next, by moving the base in a direction parallel to the plane of the base and rotating the ceramic shaft, the ceramic sheet c was wound around the ceramic shaft to form a ceramic base. The moving speed of the base was adjusted to 300 mm / sec.

<Second winding process>
In the second winding step after the first winding step, the base made of silicon sponge was replaced with a base made of chloroprene rubber, and the base made of chloroprene rubber was heated to 80 ° C. in advance. In the second winding step, a pressing portion made of silicon rubber was used.

  In the second winding step, the ceramic base was placed on the plane of the base made of chloroprene rubber. At this time, both ends of the ceramic sheet c located on the surface of the ceramic shaft in the ceramic base were opposed to the plane of the base. Then, the ceramic base is sandwiched between the plane of the plate-like pressing portion and the plane of the base, the base is moved in a direction parallel to the plane, the ceramic base is rotated, and additional winding is performed. .

<End pressurization process>
In the end pressure step after the second winding step, a chloroprene rubber base was heated to 80 ° C. in advance using a chloroprene rubber base. In the end pressure process, a pressing part made of silicon rubber was used.

  In the end pressurizing step, the ceramic base was placed on the plane of the base. At this time, both ends of the ceramic sheet c located on the surface of the ceramic shaft in the ceramic base were opposed to the plane of the base.

  Next, the pressing portion was vertically moved toward the plane of the base, and the ceramic base was sandwiched between the plane of the pressing portion and the plane of the base. Thereby, both ends of the ceramic sheet c were pressurized for 40 seconds.

  After the edge pressing step, the ceramic substrate was fired in a reducing atmosphere furnace at 1500 to 1600 ° C. After firing, an underlying Ni plating was formed on the surface of the electrode pad. Using a solder made of Au—Cu, a metal lead was brazed to the underlying Ni plating to obtain a ceramic heater of Example 1. A vacuum furnace was used for brazing. In the ceramic heater of Example 1, peeling of the ceramic sheet c from the ceramic shaft was not confirmed.

[Visual inspection]
After the first winding process, the appearance of the ceramic substrate of Example 1 before performing the second winding process was examined to check for appearance defects. The appearance defect means peeling of the ceramic sheet c from the ceramic shaft. As a result of the appearance inspection, the ceramic substrate of Example 1 had no appearance defect.

(Example 2)
A ceramic substrate of Example 2 was formed by performing only the first winding process in the same manner as in Example 1 except that the moving speed of the base in the first winding process was adjusted to 500 mm / sec. As a result of appearance inspection similar to that of Example 1, the ceramic substrate of Example 2 had no appearance defect.

(Comparative Example 1)
In Comparative Example 1, the moving speed of the base in the first winding step was adjusted to 500 mm / sec. In Comparative Example 1, a roller having a surface formed of silicon rubber was used instead of the plate-like pressing portion. Except for the above items, only the first winding step was performed in the same manner as in Example 1, and the ceramic substrate of Comparative Example 1 was formed. As a result of an appearance inspection similar to that of Example 1, an appearance defect was found in the ceramic substrate of Comparative Example 1. Moreover, it turned out that this external appearance defect originates in the idle rotation of a roller.

  From the comparison between the example and the comparative example, in the example, it was confirmed that the base moving speed can be increased without causing the ceramic sheet c to peel off, and as a result, the tact time can be shortened.

[Measurement of hardness and friction coefficient]
The hardness and static friction coefficient of the silicon sponge base, the chloroprene rubber base, and the silicon rubber pressing part used in Example 1 were measured. The hardness was measured using a durometer: JIS-K-7215 method. The static friction coefficient was measured using JIS-K-7125 method.

  The durometer hardness of the base made of silicon sponge was 12. The coefficient of static friction of the base made of silicon sponge was 1.6.

  The durometer hardness of the chloroprene rubber base was 70. The static friction coefficient of the chloroprene rubber base was 0.4.

  The durometer hardness of the pressing portion made of silicon rubber was 50. The static friction coefficient of the pressing part made of silicon rubber was 10.

(Example 3)
In Example 3, an actuator driving element was manufactured by the following method.

First, a ceramic powder of a piezoelectric ceramic composition containing PZT (PbZrO ₃ .PbTiO ₃ ) as a main component was mixed with a solvent, a dispersant, a binder, a plasticizer, and the like to prepare a slurry. Using a blade, the slurry was stretched into a sheet of constant thickness on a flat surface. The solvent was evaporated from the sheet-like slurry and dried to obtain a green sheet.

  On the surface of the green sheet, a paste-like electrode material was printed to a predetermined thickness by screen printing to form a first electrode portion and a second electrode portion. By cutting the green sheet on which each electrode is printed into a predetermined size, a thin plate-like first piezoelectric element having a first electrode portion formed on the surface and a second electrode portion formed on the surface are formed. A second piezoelectric element was produced.

  A laminated body (ceramic sheet) was formed by laminating and bonding the second piezoelectric element on the first piezoelectric element. In the step of forming the laminated body, the surface on which the electrode portion of the first piezoelectric element was formed was opposed to the surface on which the electrode portion of the second piezoelectric element was not formed. Moreover, in the formation process of a laminated body, in order to expose the edge part of the electrode part of the 1st piezoelectric element located below, the notch part was formed in the edge part of the 2nd piezoelectric element located above.

  A cylindrical middle shaft (ceramic shaft) was manufactured by extruding a slurry containing a piezoelectric ceramic composition similar to that used for each piezoelectric element.

  The first winding step and the second winding step were performed in the same manner as in Example 1 with the first piezoelectric element constituting the multilayer body (ceramic sheet) facing the middle shaft (ceramic shaft). Through these steps, the laminated body was wound around the central shaft to form a cylindrical ceramic substrate.

  After the obtained ceramic substrate was fired under a predetermined temperature condition, lead wires were connected to the first and second electrode portions, respectively. Then, a predetermined high DC voltage was applied between the lead wires to polarize each piezoelectric element to obtain a piezoelectric conversion element. The piezoelectric transducer was cut to a desired length to obtain the actuator drive element of Example 3.

  As a result of an appearance inspection similar to that of Example 1, the ceramic substrate of Example 3 had no appearance defect.

DESCRIPTION OF SYMBOLS 2 ... Evaluation apparatus of a ceramic heater, 4, 4a ... Base, 6 ... Support stand, 8 ... Pushing part, 10 ... Support, 11 ... Ceramic base | substrate, 12. ..Ceramic sheet, 13... Ceramic shaft, 14... Heating portion, 15 .. Drawing portion, 16 .. Electrode portion, 17 .. Metal lead, 18.・ ・ ・ Parallel movement mechanism 22 ... Adhesive 110 ... Piezoelectric conversion element 111 ... First piezoelectric element 112 ... Second piezoelectric element 111a ... First Electrode part, 112a ... 2nd electrode part, 113 ... Middle axis (ceramic axis).

Claims (7)

A ceramic sheet is placed on the plane of the base, a ceramic shaft is placed on the end of the ceramic sheet, and the ceramic sheet and the ceramic shaft are sandwiched between the plane of the pressing portion and the plane of the base. First winding for forming a ceramic base by winding the ceramic sheet around the rotating ceramic shaft by moving at least one of the base or the pressing portion in parallel with the plane of the base. Comprising the steps,
Manufacturing method of ceramic electronic components. By sandwiching the ceramic base between the plane of the pressing portion and the plane of the base, and moving at least one of the base or the pressing portion in parallel to the plane of the base A second winding step of rotating the ceramic substrate,
The method for manufacturing a ceramic electronic component according to claim 1. The hardness of the base in the second winding step is higher than the hardness of the base in the first winding step,
A method for manufacturing a ceramic electronic component according to claim 2. In the state where the end of the ceramic sheet located on the surface of the ceramic shaft in the ceramic base is opposed to the plane of the pressing section or the plane of the base, the plane of the pressing section and the plane of the base An end pressurizing step of sandwiching the ceramic substrate between
The manufacturing method of the ceramic electronic component as described in any one of Claims 1-3. The ceramic electronic component is a ceramic heater;
The manufacturing method of the ceramic electronic component as described in any one of Claims 1-4. A pressing portion having a flat surface;
A base having a plane opposite to the plane of the pressing portion;
A vertical movement mechanism for moving at least one of the pressing portion and the base in a direction perpendicular to the plane of the base;
A parallel direction moving mechanism for moving at least one of the pressing portion or the base in a direction parallel to the plane of the base;
Comprising
Manufacturing equipment for ceramic electronic components. The ceramic electronic component is a ceramic heater;
The apparatus for manufacturing a ceramic electronic component according to claim 6.

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