JPH02284483A - Laminated piezoelectric element and its manufacture - Google Patents
Laminated piezoelectric element and its manufactureInfo
- Publication number
- JPH02284483A JPH02284483A JP1104464A JP10446489A JPH02284483A JP H02284483 A JPH02284483 A JP H02284483A JP 1104464 A JP1104464 A JP 1104464A JP 10446489 A JP10446489 A JP 10446489A JP H02284483 A JPH02284483 A JP H02284483A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- metal plate
- laminated
- plates
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 57
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 229910045601 alloy Inorganic materials 0.000 claims description 28
- 239000000956 alloy Substances 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000000446 fuel Substances 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000005121 nitriding Methods 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000006104 solid solution Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- -1 nickel nitride Chemical class 0.000 claims description 2
- 238000007743 anodising Methods 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 239000012298 atmosphere Substances 0.000 abstract description 6
- VIMMECPCYZXUCI-MIMFYIINSA-N (4s,6r)-6-[(1e)-4,4-bis(4-fluorophenyl)-3-(1-methyltetrazol-5-yl)buta-1,3-dienyl]-4-hydroxyoxan-2-one Chemical compound CN1N=NN=C1C(\C=C\[C@@H]1OC(=O)C[C@@H](O)C1)=C(C=1C=CC(F)=CC=1)C1=CC=C(F)C=C1 VIMMECPCYZXUCI-MIMFYIINSA-N 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011162 core material Substances 0.000 abstract 1
- 230000010287 polarization Effects 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 241001459693 Dipterocarpus zeylanicus Species 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- RWWYLEGWBNMMLJ-YSOARWBDSA-N remdesivir Chemical compound NC1=NC=NN2C1=CC=C2[C@]1([C@@H]([C@@H]([C@H](O1)CO[P@](=O)(OC1=CC=CC=C1)N[C@H](C(=O)OCC(CC)CC)C)O)O)C#N RWWYLEGWBNMMLJ-YSOARWBDSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は積層型圧電素子に係り、圧電アクチュエータと
して耐湿性に優れ、特に動作電圧が低く信頼性・生産性
に優れた全面電極方式の構造に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laminated piezoelectric element, and a piezoelectric actuator with a full-surface electrode structure that has excellent moisture resistance, particularly low operating voltage, and excellent reliability and productivity. It is related to.
圧電セラミクスは機械的エネルギと電気的エネルギの変
換を行う性質を有しており、力学量検出用センサやアク
チュエータへの応用開発が盛んに進められている。ただ
し、圧電セラミクスの印加電圧あたりの伸び率が小さい
ために、実用的な変位を得るには非常に檀;い′直圧を
印加する必要がある。そこで、圧電セラミクスの厚さを
なるへく薄くして多数枚積層する構造により、印加電圧
を低くする方法がよく用いられる。このような構造の圧
電素子は積層型圧電素子と呼はれる。Piezoelectric ceramics have the property of converting mechanical energy and electrical energy, and their application to sensors and actuators for detecting mechanical quantities is being actively developed. However, since the elongation rate of piezoelectric ceramics per applied voltage is small, it is necessary to apply a very large direct pressure to obtain a practical displacement. Therefore, a method is often used in which the applied voltage is lowered by making the thickness of the piezoelectric ceramic as thin as possible and laminating a large number of piezoelectric ceramics. A piezoelectric element having such a structure is called a laminated piezoelectric element.
積層型圧電素子の最も進んだ製造技術にクリーンシート
法がある。この方法においては、圧電材料の粉末を適当
な溶媒に分散させ、得られたスラリをシート状に成形し
たものに電極用として金属ペーストをスクリーン印刷法
等により塗布したのち、そのシートを多数枚積層した乾
燥・焼結を行う。この製法により、圧電素子の最大伸び
率として一般的な0.1% を得るための印加電圧を]
、00■にまで低減することができるようになった。こ
のような従来のグリーンシート法による積層型圧電索子
の公知例としては、例えば、特公昭5932040号公
報や、センサ技術第3巻第12号(1983)の第31
頁に記載の論文などがある。The clean sheet method is the most advanced manufacturing technology for laminated piezoelectric elements. In this method, piezoelectric material powder is dispersed in a suitable solvent, the resulting slurry is formed into a sheet, a metal paste is applied as an electrode by screen printing, etc., and then a number of sheets are laminated. Drying and sintering are performed. With this manufacturing method, the applied voltage to obtain the typical maximum elongation rate of piezoelectric elements of 0.1%]
, 00■. Known examples of laminated piezoelectric cords made by the conventional green sheet method include, for example, Japanese Patent Publication No. 5932040 and Sensor Technology Vol. 3, No. 12 (1983), No. 31.
There are papers listed on the page.
また、積層型圧′111素子の内部応力を低減し、信頼
性を向上させた電極構造として、圧電セラミクスと電極
の面積を等しくした全面電極方式が持分111’(63
−17354号公報に記載されている。その全面電極方
式積層型圧電素子の断面図を第7図、第8図に示す。第
8図は第7図のA−A断1f11図である。In addition, as an electrode structure that reduces the internal stress of the laminated pressure element and improves its reliability, a full-surface electrode structure in which the area of the piezoelectric ceramic and the electrode are equal is used.
It is described in the publication No.-17354. Cross-sectional views of the full-surface electrode type laminated piezoelectric element are shown in FIGS. 7 and 8. FIG. 8 is a sectional view 1f11 taken along line A-A in FIG. 7.
尚この他にも本発明の関連従来例としては特開昭62−
62571号、同6] −27688号公報等が挙げら
れる。In addition, as a related prior art example of the present invention, Japanese Patent Application Laid-Open No. 62-
No. 62571, No. 6]-27688, and the like.
前者の従来技術では圧電セラミクス板]のクリーンシー
1〜の焼結と電極2との積層が約1300℃で同時に行
われる。よって、電4@2の月料には高温で安定な貴金
属、特に銀パラジウム(AgPd)合金が用いられるこ
とか多かった。ところが、上記銀パラジウム合金の電極
を用いた圧電素子には多湿雰囲気での動作において電極
の短絡が発生するという問題点かあった。このIh’l
因は、圧電素子の側面を保護するモールド用樹脂5の内
部に水か浸透して電極間か導通するためか、あるいは、
積層体と樹脂5の間に水の層が形成され、その中に銀が
イオン(Ag+)として溶出しそれか電界に吸引され隣
りの電極付近に堆積して導通経路を形成するためである
と考える。この現象は一般にマイクレージョンと呼はれ
銀rM、f4!を用いる電気部品に共通の課題である。In the former conventional technique, the sintering of the clean sheets 1 to 1 of the piezoelectric ceramic plate and the lamination with the electrodes 2 are performed simultaneously at about 1300°C. Therefore, noble metals that are stable at high temperatures, especially silver-palladium (AgPd) alloys, were often used for the monthly charges for Den 4@2. However, the piezoelectric element using the silver-palladium alloy electrodes has a problem in that short circuits occur between the electrodes when operated in a humid atmosphere. This Ih'l
The reason may be that water penetrates into the molding resin 5 that protects the side surfaces of the piezoelectric element and conducts between the electrodes, or
This is because a layer of water is formed between the laminate and the resin 5, and silver is eluted into the layer as ions (Ag+), or it is attracted by the electric field and deposited near the adjacent electrode, forming a conductive path. think. This phenomenon is generally called micrasion. Silver rM, f4! This is a common problem for electrical components that use
一方、後者の従来技術である全面電極方式積)X”パ)
型圧電素子では、第7図に示すように電極2ど外部引出
し用リード端子3を互い違いに接続するために、電極2
の端部に沿って絶縁物4で被覆する方法が用いられてい
る。しかし、この方法では絶縁耐圧を稼ぐために絶縁物
4の幅及び厚さを電極2の厚さに比へて十分大きくする
必要があるため、電極間距離または圧電セラミクス板子
の厚さを小さくするのに障害となり、結果として動作電
圧の低減が困難になるという問題があった。また、リー
ド端子3を絶縁物4の凹凸の上に形成するため、その信
頼性に問題かあった。さらに工程か複雑になるために、
歩留りか低くなり生産コス1−が高くなるという問題も
あった。On the other hand, the latter conventional technology, the full electrode method
In the type piezoelectric element, as shown in FIG. 7, in order to alternately connect the electrodes 2 and external lead terminals 3,
A method is used in which an insulating material 4 is coated along the edges of the material. However, in this method, it is necessary to make the width and thickness of the insulator 4 sufficiently large compared to the thickness of the electrode 2 in order to increase the dielectric strength, so the distance between the electrodes or the thickness of the piezoelectric ceramic board must be made small. This poses a problem in that it becomes difficult to reduce the operating voltage. Furthermore, since the lead terminals 3 are formed on the unevenness of the insulator 4, there is a problem in their reliability. To further complicate the process,
There is also the problem that the yield is low and the production cost 1- is high.
本発明の目的は多湿雰囲気においても電極の短絡が発生
せず、特に動作電圧が低く信頼性に優れた低コストの全
面電極方式積層型圧電素子の構造を提供することにある
。An object of the present invention is to provide a structure of a low-cost, all-over electrode type multilayer piezoelectric element that does not cause electrode short circuits even in a humid atmosphere, has particularly low operating voltage, and is excellent in reliability.
上記l」的を達成するために、電極たる金Jべ板として
アルミニウムまたはアルミニウムを主成分とする合金、
もしくはニッケルまたはニッケルを主成分とする合金か
ら選はれる単層ないし複数層の平板を用い、さらに金属
板を交互に一対のリード端子のうちの一方と電気的に接
触させ、それ以外の他方のリーザ端子及びモールド用樹
脂との境界部を電気絶縁性化合物に化学変化させた。In order to achieve the above objective, aluminum or an alloy mainly composed of aluminum as the gold plate serving as the electrode,
Alternatively, a single-layer or multi-layer flat plate selected from nickel or an alloy containing nickel as a main component is used, and the metal plate is alternately brought into electrical contact with one of a pair of lead terminals, and the other is electrically contacted with the other. The boundary between the riser terminal and the molding resin was chemically changed to an electrically insulating compound.
上記手段は圧電セラミクス板と金属板の面積が等しいい
わゆる全面電極方式の積層型圧電#子に対して特に有効
である。The above means is particularly effective for a so-called full-surface electrode type laminated piezoelectric element in which the area of the piezoelectric ceramic plate and the metal plate are equal.
本発明の圧電素子、その製法或いは応用前例は次の各項
目の特徴を備えている。The piezoelectric element of the present invention, its manufacturing method, or its application examples have the following features.
(1)複数の圧電セラミクス板と該各ハ三電セラミクス
扱間に介在する金属板との積層体の側面に一対の外部引
き出し用り−1一端子を付設しで成り、前記金属板はア
ルミニウム、アルミニラ11層合金、ニッケル、ニッケ
ル系合金から選ばれるt)1層乃至複数層の平板である
積層型圧電索f・において、前記金属板は交互に前記リ
ード端子の内の一方と電気的に接触させ、かつ他方のり
−1・端子と前記金属板とは電気的に非接触とし°C1
その非接触端部は前記金)ρを板の電気絶縁イ′1−化
合物置換体となっていること。(1) A pair of external lead-out terminals is attached to the side surface of a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between each of the piezoelectric ceramic plates, and the metal plate is made of aluminum. , alumina 11-layer alloy, nickel, and nickel-based alloy t) In the laminated piezoelectric cable f, which is a flat plate of one layer or multiple layers, the metal plate is alternately electrically connected to one of the lead terminals. contact, and the other glue-1 terminal and the metal plate are not in electrical contact °C1
The non-contact end thereof shall be an electrically insulating compound substituted for the gold) ρ of the plate.
(2)複数の圧電セラミクス板と該各圧電セラ(クス板
間に介在する金属板との積層体の側面に一対の外部引き
出し用リード端子を付設して成り、前記金属板は酸化及
び/または窒化によって化学的に安定になる活性金属又
は該活性金IIル主体の合金でできた単層乃至複数層の
平板である積層型圧f4i素子において、前記金1pt
板は交互に1′I「記リード端子の内の一方のみと電気
的に接触させ、かつ他方のり−1一端子と前記金属板と
は電気的に非接触として、その非接触端部は前記金属板
の電気絶縁性化合物置換体となっていること。(2) A pair of lead terminals for external extraction is attached to the side surface of a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between the piezoelectric ceramic plates, and the metal plate is oxidized and/or In a laminated pressure f4i element which is a single-layer or multi-layer flat plate made of an active metal or an alloy mainly composed of active gold II which becomes chemically stable by nitriding, the gold 1pt
The plates are alternately brought into electrical contact with only one of the lead terminals 1'I', and the other terminal and the metal plate are not in electrical contact with each other, with the non-contact end being in electrical contact with the metal plate. It is a substitute for an electrically insulating compound on a metal plate.
(3)複数の圧電セラミクス板と該各圧電セラミクス板
間に介在する金属板との積層体の側面に一対の外部引き
出し用り−1く端子を付設して成る積層型圧電素子にお
いて、前記金属板は交互に前記リード端子の内の一方と
電気的に接触させ、かつ他方のり−1一端子とr+f記
金属扱とは電気的に非接触として、その非接触部は前記
金属板材料の酸化物及び/または窒化物としたこと。(3) A laminated piezoelectric element comprising a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between the piezoelectric ceramic plates, and a pair of external lead-out terminals attached to the side surface of the laminate, in which the metal The plates are electrically contacted alternately with one of the lead terminals, and the other terminal and the metal terminals r+f are electrically not in contact with each other, and the non-contact portion is free from oxidation of the metal plate material. and/or nitride.
(4)前記電気絶縁性化合物は陽極酸化アルミニウム、
陽極酸化ニッケル、プラズマ放電窒化アルミニウム、プ
ラズマ放電窒化ニッケルから選ばれるものであること。(4) The electrically insulating compound is anodized aluminum,
Must be selected from anodized nickel, plasma discharge aluminum nitride, and plasma discharge nickel nitride.
(5)前記積層体の側1−fI口こモールド用樹脂で被
覆してなること。(5) The side 1-fI of the laminate is coated with resin for molding.
(6)前記圧電セラミクス板と前記金属板の平面寸法が
略等しいこと。(6) The piezoelectric ceramic plate and the metal plate have substantially the same planar dimensions.
(月)
(7)前記金属板に適用する合金ば、アルミニラ11に
シリコン、マクネシウム又はゲルマニラ11のいずれか
或いは混合物を固溶させたものであることを特徴とする
。(Mon) (7) The alloy applied to the metal plate is characterized in that silicon, magnesium, gel manila 11, or a mixture thereof is dissolved in alumina 11 as a solid solution.
(8)前記金属板に適用する合金は、ニッケルにクロム
、パラジウム又は銅のいずれか或いは混合物を固溶させ
たものであること。(8) The alloy applied to the metal plate is one in which chromium, palladium, copper, or a mixture thereof is dissolved in nickel.
(9)前記積層体の外部にヒータを付設したこと。(9) A heater is attached to the outside of the laminate.
(1,0)前記電気絶縁性化合物tit換休金体at板
毎に受力。(1,0) Force received by each of the electrically insulating compound titanium metal body at plates.
に位置せしめること。to be located in
(11)流体の流れる流路途」−に流路の絞り調節機構
を備えてなるマスフローコン1ヘローラにおいて、該調
節機構溝が流路に血するダイヤフラムと該ダイヤフラム
に連接される圧電素子とからなり、該圧電素子が前記(
])乃牟(9)のいずれかにより構成されること。(11) In a mass flow controller 1 roller equipped with a flow channel throttling adjustment mechanism in the flow path of the fluid, the adjustment mechanism groove is composed of a diaphragm that flows into the flow path and a piezoelectric element connected to the diaphragm. , the piezoelectric element is
]) Nomu (9).
(J2)シリンダの移動に伴って移動する燃料流路と該
シリンダを内蔵させる外筒に形成した燃料流路とが該シ
リンダの移動にて接続、切断されるインジェクションバ
ルブにおいて、前記シリンダの駆動手段として前記(1
)乃至(9)のいずれかによる積層型圧電素子を用いる
こと。(J2) In an injection valve in which a fuel flow path that moves with the movement of the cylinder and a fuel flow path formed in an outer cylinder in which the cylinder is housed are connected and disconnected by the movement of the cylinder, a drive means for the cylinder. As mentioned above (1
) to (9).
03)複数の圧電セラミクス板間夫々に金属板を介在さ
せて積層することにより積層体を形成し、次いで該積層
体の側面に一対の外部引き出し用リード端子を付設する
ことを特徴とする積層型圧電素子の製法において、前記
金属板を圧電セラミクス板間に積層後一層おきに金属板
の端部を陽極酸化処理して割断し、この陽極酸化処理部
位と未処理金属板端部とを直接覆うように一方のリード
端子を形成し、次いで未処理金属板端部の他端面を陽極
酸化処理して後残りのリード端子を形成すること。03) A laminate type characterized in that a laminate is formed by laminating a plurality of piezoelectric ceramic plates with metal plates interposed between them, and then a pair of lead terminals for external extraction are attached to the side surfaces of the laminate. In the method for manufacturing a piezoelectric element, after the metal plates are laminated between piezoelectric ceramic plates, the ends of the metal plates are anodized and cut every other layer, and the anodized parts and the untreated ends of the metal plates are directly covered. One lead terminal is formed in this manner, and then the other end surface of the untreated metal plate end is anodized to form the remaining lead terminals.
(14)陽極酸化処理に替えてプラズマ放′市窒化処理
を行うこと。(14) Performing plasma open-air nitriding treatment instead of anodic oxidation treatment.
本発明の積層型圧電装置(例えばアクチュエータ、セン
サ)は、例えは上記圧電素子の各電極の内十極をまとめ
る外部り−1くと、−極をまとめる外部リードとを圧電
素子側面に付設したものである。The laminated piezoelectric device (for example, an actuator, a sensor) of the present invention has, for example, an external lead that brings together ten poles of each electrode of the piezoelectric element, and an external lead that brings together the negative poles, which are attached to the side surface of the piezoelectric element. It is something.
(]3)
本発明の積層型圧電素子の製法は、焼成済圧電セラミク
ス材の層と゛市極層とを交互に積層後、この圧電セラミ
クス材の焼成温度より低い温度で加熱し、或いは加熱・
加圧して、所定時間保持することにより接合、特に好ま
しくは拡散接合、することになる。(]3) The method for manufacturing the laminated piezoelectric element of the present invention involves alternately laminating layers of fired piezoelectric ceramic material and "city pole layers" and then heating at a temperature lower than the firing temperature of the piezoelectric ceramic material, or by heating and heating.
By applying pressure and holding it for a predetermined period of time, bonding, particularly preferably diffusion bonding, is performed.
焼成済圧電セラミクスとは圧電セラミクスグリンシ−1
−を焼成したものである。What is fired piezoelectric ceramics?Piezoelectric ceramics Grinshi-1
- is fired.
尚、接合工程後に加圧を除去することなく冷却すること
が好ましく、特に接合=1−程後の冷却過程にあっては
、圧電セラミクスのキュリー点よりも20〜70℃高い
温度で電圧を印加してセラミクスを分極させることが望
ましい。ここでキューリ点とは圧電セラミクスの特性を
喪失する温度をいい、分極とは圧電素子にするためのセ
ラミクスの一処理工程を意味する。In addition, it is preferable to cool down without removing the pressure after the bonding process, and in particular, in the cooling process after bonding = 1, a voltage is applied at a temperature 20 to 70°C higher than the Curie point of the piezoelectric ceramics. It is desirable to polarize the ceramics. Here, the Curie point refers to the temperature at which piezoelectric ceramics lose their properties, and polarization refers to a processing step of ceramics to form a piezoelectric element.
一般に圧電セラミクス材にベロゲスカイ1〜型結晶構造
をもつ強誘電性材料であって、キューリー点以上の温度
では立方晶・キューリー点以下の温度では立方晶より変
形した結晶相を呈して結晶構(]4)
造にすれ即ち極性(方向性)が生ずる。焼成直後の圧電
セラミクスは結晶粒子の集合体であり、各結晶粒子内に
極性の異なる部分か混在する。焼成しただけの圧″市セ
ラミタスの状態では各結晶粒子について極性のべり1−
ル総和はゼロであって、全体としては無イセ性である。In general, piezoelectric ceramic materials are ferroelectric materials that have a Belogesky 1-type crystal structure, and exhibit a cubic crystalline phase at temperatures above the Curie point, and a crystalline phase more deformed than cubic at temperatures below the Curie point. 4) In other words, polarity (directivity) occurs in the structure. Piezoelectric ceramics immediately after firing is an aggregate of crystal grains, and portions with different polarities coexist within each crystal grain. In the state of pressurized ceramitas that has just been fired, each crystal grain has a polarity of 1-
The total sum is zero, and the whole is free from fraud.
これにIシr定の電界を印加することによって各結晶粒
子争に極性の方向が定まりこれを分極といい、このよう
な処理を分極処理という。By applying an electric field of constant Ir to this, the direction of polarity is determined for each crystal grain, and this is called polarization, and such processing is called polarization processing.
電極材としては、膜、箔、ペーストいずれの状態で用い
ても差し支えないが、従来技術としては純アルミニウ1
1.ニッケル或いはアルミニラ11糸合金、ニッケル系
合金か好適である。銀と異なりマイグレーションを起こ
さないからである。同じ観点で白金(Pt)や1.Jd
(パラジウム)も適用し得る。更にアルミニウム電極を
用いるなら、画表皮材がアルミニウムーシリコン系合金
、層相がアルミニウムの3層構造のものが好適である。The electrode material may be used in the form of film, foil, or paste, but as a conventional technology, pure aluminum 1
1. Preferred are nickel, alumina 11 thread alloy, and nickel-based alloy. This is because unlike silver, it does not undergo migration. From the same point of view, platinum (Pt) and 1. Jd
(palladium) can also be applied. Furthermore, if an aluminum electrode is used, it is preferable to use a three-layer structure in which the image surface material is an aluminum-silicon alloy and the layer phase is aluminum.
尚、積層状態は手抜積層に限定されず、円筒状の積層物
でもかまわない。Note that the laminated state is not limited to laminated layers, but may be a cylindrical layered product.
分極は圧電セラミクス自体が体積増加し、大きな内部応
力を発生させる。そこで冷却中に分極処理を施こせは、
冷却による体積収縮と分極による体積増加の一’l’
叛により内部歪み(内部応力)か緩和されることになり
、圧電セラミクスの強度信頼性が向上することになる。Polarization causes the piezoelectric ceramic itself to increase in volume and generate large internal stress. Therefore, if a polarization treatment is performed during cooling,
Volume contraction due to cooling and volume increase due to polarization: 'l'
Internal strain (internal stress) is alleviated by the repulsion, and the strength reliability of piezoelectric ceramics is improved.
電極金属として純/ルミニウ11或いはアルミニウム系
合金を用いると、積層化温度(接合温度)を非常に低く
下げることができるため、熱応力の発生が小さい。また
アルミニウムは活性金属であるため、圧電セラミクスと
の接合性が向−1−する。When pure/Luminium 11 or an aluminum-based alloy is used as the electrode metal, the lamination temperature (junction temperature) can be lowered to a very low level, so that the generation of thermal stress is small. Furthermore, since aluminum is an active metal, bondability with piezoelectric ceramics is improved.
更に本発明は圧電セラミクス層相BHの接層用のインサ
ート材が電極材と兼用しているため製作−にも簡便であ
る。Furthermore, the present invention is easy to manufacture because the insert material for contacting the piezoelectric ceramic layer phase BH also serves as the electrode material.
本発明では電極材料としてアルミニウムやニッケルを用
いることが主眼点である。アルミニウムやニッケルは消
6′トな表面を右する場合非常に活性な金属であるが、
表面が酸化あるいは窒化されると化学的に安定ないわゆ
る不働態に変化する性jcTを有している。よってJ:
記両金属材料の活性面を利用して、焼結済みの圧電セラ
ミクス板同士を接合により積層し、そのまま金属材料を
電極として用いることができる。そしてその際積層体の
側面に露出する部分に安定化処理を施すと、多湿雰囲気
での動作中に水に濡れた状態が発生しても電気的な導通
を起こさず、また、水中にイオンとして溶出してマイグ
レーションを起こすこともなくなる。The main point of the present invention is to use aluminum or nickel as the electrode material. Aluminum and nickel are very active metals when working with hard surfaces.
It has a property jcT that changes to a chemically stable so-called passive state when the surface is oxidized or nitrided. Therefore J:
Utilizing the active surfaces of both metal materials, sintered piezoelectric ceramic plates can be stacked together by bonding, and the metal materials can be used as electrodes as they are. At that time, if a stabilizing treatment is applied to the exposed side of the laminate, electrical conduction will not occur even if it gets wet during operation in a humid atmosphere, and ions will not form in the water. Elution and migration will no longer occur.
特に圧電セラミクス板の全面に電極を形成する全面電極
方式の積層型圧電素子に本発明を適用すると、当該素子
の側面に凹凸を作ることなく絶縁物を形成することがで
きる。したがって、圧電セラミクスの厚さを薄くでき動
作電圧を低くすることができる。また、リード端子を平
坦な側面の上に形成するため、その信頼性が向上する。In particular, when the present invention is applied to a laminated piezoelectric element of a full-surface electrode type in which electrodes are formed on the entire surface of a piezoelectric ceramic plate, an insulator can be formed without creating unevenness on the side surface of the element. Therefore, the thickness of the piezoelectric ceramic can be reduced and the operating voltage can be lowered. Furthermore, since the lead terminal is formed on the flat side surface, its reliability is improved.
さらに工程か簡単になるため生産性も向上する。Furthermore, the process becomes simpler, which improves productivity.
以−ド、本発明の一実施例を第[図により説明する。第
1図は本発明による積層圧電素子で、その側面をモール
ド用樹脂で被覆する前の状態の視斜図である。また、第
2図は第1図に示した素子の平面A、 B Cによる切
り口の断面図である。An embodiment of the present invention will now be described with reference to FIG. FIG. 1 is a perspective view of a laminated piezoelectric element according to the present invention in a state before its side surface is coated with a molding resin. Further, FIG. 2 is a sectional view taken along planes A and B C of the element shown in FIG. 1.
応力が加えられた場合に電気分極を生じる性質すなわち
圧電性を有する誘電体セラミクスは圧電セラミクスと呼
ばれ、チタン酸バリウム(Ilai’j−D、q) r
チタン酸鉛(P b Tコ、 Os) +チタン酸ジル
コン酸鉛(Pb (Zr、Ti)08)などが普及して
いる。Dielectric ceramics that have the property of generating electrical polarization when stress is applied, that is, piezoelectricity, are called piezoelectric ceramics, and barium titanate (Ilai'j-D, q) r
Lead titanate (PbT, Os) + lead zirconate titanate (Pb(Zr,Ti)08) and the like are popular.
これらの圧電セラミクスの粉末を溶剤に混合して得られ
るペーストからグリーンシートを作り、これを成形・焼
結することにより得られる圧mセラミクス板1を第1図
及び第2図に示すように複数枚用い、その各層間に電極
板2a、2bを配h’<+: L/、加熱及び加圧によ
り積層体を得る。この積層体の側面の2箇所に電極板2
a、2bの外部引出し用リード端子3a、3bを形成し
、電極板2a。A green sheet is made from a paste obtained by mixing these piezoelectric ceramic powders with a solvent, and a plurality of piezoelectric ceramic plates 1 obtained by forming and sintering the green sheet are made into a plurality of piezoelectric ceramic plates 1 as shown in FIGS. 1 and 2. electrode plates 2a and 2b are arranged between each layer, h'<+: L/, and a laminate is obtained by heating and pressurizing. Electrode plates 2 are placed at two locations on the side of this laminate.
Lead terminals 3a and 3b for external extraction of electrodes a and 2b are formed, and an electrode plate 2a is formed.
2bを一層おきにリード端子3a、3bに交互に接続す
る。その際に、リード端子:3a、3bて(Wわれず積
層体の側面に露出する電極2a、2bの端面を電気絶縁
性化合物4a、4bたとえば酸化物や窒化物に変化させ
る。さらに、第2図に示すようにリード端子3aに接続
する電極2aはリード端子3bとの電気的接触を防ぐた
めにその境界部で電気絶縁性化合物4aに、リード端子
3bに接続する電極2bはリード端子3aとの電気的接
触を防ぐためにその境界部で電気絶縁性化合物4bに変
化させる。なお、各電極板2a、2bの材質はアルミニ
ウム若しくはアルミニウムにシリコン又はマグネシウム
又はゲルマニウムを固溶させた合金、あるいは、ニッケ
ル若しくはニッケルにクロム又はパラジウム又は銅を固
溶させた合金から選ぶ。そして、特に望ましい構成は第
3図に示すものであり、アルミニラ11かニッケルの心
材21の両面にアルミニウム合金かニッケル合金の表皮
材22を形成しである。2b are alternately connected to lead terminals 3a and 3b on every other layer. At this time, the end surfaces of the electrodes 2a, 2b that are exposed on the side surfaces of the laminate are changed to an electrically insulating compound 4a, 4b, for example, an oxide or a nitride. As shown in the figure, the electrode 2a connected to the lead terminal 3a is coated with an electrically insulating compound 4a at its boundary to prevent electrical contact with the lead terminal 3b, and the electrode 2b connected to the lead terminal 3b is coated with an electrically insulating compound 4a to prevent electrical contact with the lead terminal 3b. In order to prevent electrical contact, the boundary portion is changed to an electrically insulating compound 4b.The material of each electrode plate 2a, 2b is aluminum, an alloy of aluminum with silicon, magnesium, or germanium dissolved in solid solution, or nickel or nickel. The alloy is selected from alloys in which chromium, palladium, or copper is dissolved in nickel.A particularly desirable configuration is shown in FIG. It is formed.
以」二のような電極材料及び絶縁構造を採用すると次の
ような効果が得られる。The following effects can be obtained by adopting the electrode material and insulating structure as described below.
まずアルミニウムを主成分とした゛電極を用いた場合、
加熱及び加圧により積層体を形成する際に加熱温度58
0〜660℃では、電極の表皮層のみ液相となるため、
アルミニラ11合金電極表面の酸化皮膜は破壊し、その
活性なアルミニラ11合金の液相が圧電セラミクスとの
密着及び反応を促進させる。一方、心月のアルミニウム
は固相のままで、一定の電極厚さを保持する。ニッケル
電極を用いた場合は、適正加熱温度か異なるた番づて)
に1理はアルミニウムの場合と同じである。First, when using an electrode mainly composed of aluminum,
Heating temperature 58 when forming a laminate by heating and pressurizing
At 0 to 660°C, only the skin layer of the electrode becomes a liquid phase, so
The oxide film on the surface of the Aluminum 11 alloy electrode is destroyed, and the active liquid phase of the Aluminum 11 alloy promotes adhesion and reaction with the piezoelectric ceramic. On the other hand, Shingetsu's aluminum remains in a solid phase, maintaining a constant electrode thickness. When using nickel electrodes, the appropriate heating temperature or different ordering)
The following principle is the same as for aluminum.
次に、圧電セラミクス板の積層に用いた電イセの端面を
絶縁物に変化させたことにより、従来例(第7図)にお
ける圧″市セラミクス扱1の厚さに対する制限がなくな
り、動作電圧の低減かII目71<になった。また従来
例とは異なり積層体の側面が平坦であるため、リード端
子3の形状か滑らかになり断線の発生率が低くなった。Next, by changing the end face of the electric strainer used for laminating the piezoelectric ceramic plates to an insulating material, there is no longer a restriction on the thickness of the piezoelectric ceramic plate 1 in the conventional example (Fig. 7), and the operating voltage can be reduced. The reduction was 71<.Also, unlike the conventional example, since the side surfaces of the laminate are flat, the shape of the lead terminal 3 is smooth and the incidence of wire breakage is low.
さらに、多I!lI!宥囲気での動作時に水が浸透して
もマイグレーションや電極2の短絡の発生率が低くなっ
た。Furthermore, many I! lI! Even if water penetrates during operation in a comfortable atmosphere, the incidence of migration and short circuit of the electrode 2 is reduced.
次に、第4図を用いて積層型圧電素子の製法を説明する
。a)成形・焼結済みの圧電セラミクス]とアルミニウ
ム合金の電極2a、2bを交11.に重ねた後、ホラ1
へプレスを用いて、アルゴン宥囲気中で0.2〜ikg
/mm”の圧力で加圧しながら600“Cまで加熱し1
時間保持して積層体を形成し、側面を研摩した後、1層
おきに電極2aが露出している側面に電極3′を形成し
た。b)電極3′に陽極酸化処理を行った。すると、電
極3′に接触している電極2aの端面が酸化物4aに変
化する。C)この積層体を縦に割断し電極2aと2bが
同じ面積になる全面電極構造となるようにした。図はb
)を右側から見たもので、酸化物4aの位置を明確にす
るために突出しているように示した。d)酸化物4aと
電極2bが交互に存在する側面にり一1〜端子3aを形
成し、電44!2bと電気的に接触させた。e)リード
端子3aに陽極酸化処理を行った。すると、リ−1(端
子3aに接触している電極2bの端面か酸化物4bに変
化する。Next, a method for manufacturing a laminated piezoelectric element will be explained using FIG. a) Molded and sintered piezoelectric ceramic] and aluminum alloy electrodes 2a and 2b are crossed 11. After overlaying it, hora 1
0.2 to 1 kg in an argon atmosphere using a hepress
Heat to 600"C while pressurizing at 1/mm" pressure.
After holding for a time to form a laminate and polishing the side surfaces, electrodes 3' were formed on the side surfaces where the electrodes 2a were exposed every other layer. b) The electrode 3' was anodized. Then, the end surface of the electrode 2a that is in contact with the electrode 3' changes to an oxide 4a. C) This laminate was cut vertically to form a full-surface electrode structure in which electrodes 2a and 2b had the same area. The figure is b
) is seen from the right side, and the oxide 4a is shown protruding to make the position clear. d) Terminals 1 to 3a were formed on the side surfaces where the oxides 4a and electrodes 2b were alternately present, and brought into electrical contact with the electrodes 44!2b. e) The lead terminal 3a was anodized. Then, the end surface of the electrode 2b that is in contact with the lead 1 (the terminal 3a) changes into an oxide 4b.
f)金属部が露出している電極2aと酸化物4bが交互
に存在する側面にリード端子3bを形成し、電極28と
電気的に接触させた。この後は図示を省略したか、リー
ド端子;3に電圧印加用のリード線を接合し、積層体の
側面をモールド用樹脂で被(2])
覆した。そして最後に所定の圧電性を付与するための分
極処理を行い積kIIJ(’I圧電素子とした。f) Lead terminals 3b were formed on the side surfaces where the electrodes 2a and oxides 4b with exposed metal parts were alternately present, and brought into electrical contact with the electrodes 28. After this, although not shown in the drawings, a lead wire for voltage application was connected to the lead terminal 3, and the side surface of the laminate was covered with molding resin (2). Finally, a polarization process was performed to impart a predetermined piezoelectricity, resulting in a product kIIJ('I piezoelectric element).
なお、電極2にニッケル合金を用いる場合は、加熱温度
は]]−〇〇〜] 300℃である。Note that when a nickel alloy is used for the electrode 2, the heating temperature is ]]-〇〇~] 300°C.
また、陽極酸化による電極の選択的な酸化を行わず、従
来方法による絶縁構造を採用した場合でも、積層体をモ
ール1−用樹脂で被覆する前に、積層体の側面に露出し
ている電極の端面を、例えばグロー放電プラズマによる
酸化や窒化を行うことにより多湿雰囲気での動作時にお
ける電極の短絡を防止する効果がある。In addition, even if an insulating structure is adopted using the conventional method without selectively oxidizing the electrodes by anodic oxidation, the electrodes exposed on the sides of the laminate may be removed before the laminate is coated with molding resin. By oxidizing or nitriding the end face using, for example, glow discharge plasma, it is effective to prevent short-circuiting of the electrodes during operation in a humid atmosphere.
」二に示した実施例では電極の端ifnは平滑であった
が、それと異なる他の実施例を第5図を用いで説明する
。圧電セラミクス1と電極2を積層する際に加熱温度を
電極2の融点以上にすると、電極2か溶融して第5図に
示すように積層体の側面にはみ出してくる。この形状の
電極2に陽極酸化処理を施し酸化物4を形成する。この
ような形状を採用することにより、圧電セラミクス1と
電極2の密着が改善され積層体の強度が向上する。しか
も、従来例のように厚い絶縁物を必要としないので圧電
セラミクス」、の厚さを薄くするのに適している。In the embodiment shown in Section 2, the end ifn of the electrode was smooth, but another embodiment different from that will be described with reference to FIG. When the piezoelectric ceramic 1 and the electrode 2 are laminated, if the heating temperature is made higher than the melting point of the electrode 2, the electrode 2 will melt and protrude from the side surface of the laminate as shown in FIG. The electrode 2 having this shape is subjected to anodic oxidation treatment to form an oxide 4. By adopting such a shape, the adhesion between the piezoelectric ceramic 1 and the electrode 2 is improved, and the strength of the laminate is improved. Moreover, unlike the conventional example, it does not require a thick insulator, so it is suitable for reducing the thickness of piezoelectric ceramics.
次に、第6図を用いて積層型圧電素子の他の製法を説明
する。a)成形・がt結済みの圧電セラミクス]と一層
おきに+h目にの異なるアルミニウム合金型442a、
2bを交互に重ねた後、ホラ1〜ブレスを用いて、アル
ゴン雰囲気中で0.2〜1kg/rm12の圧力で加圧
しながら600℃まで加熱し1時間保持して積層体を形
成し、側面を研摩した後、広い面積の電極2aだけか露
出している側面に″正極3′を形成した。b)電極73
′ に陽極酸化処理を行った。すると、電極3′に接触
している電極2aの端面が酸化物4aに変化する。図で
は電極3′の対向面も酸化物に変化することを強調する
ために酸化物4か突出しているように示したか、実際は
平滑な血になる。c)J型棒2aと2bが同じ面積にな
り全面電極構造となるように積層体を切削加工した。d
)一層才?きに酸化処理が施された電極2aの上からリ
ード端子a bを形成し、電極2bと電気的に接触させ
た。0)電極X3))に陽極酸化処理を行った。すると
、電極3bに接/’I!II している電極2bの端面
が酸化物4 bに変化する。Next, another method of manufacturing a laminated piezoelectric element will be explained using FIG. a) shaped and bonded piezoelectric ceramics] and aluminum alloy molds 442a that are different from +h every other layer,
After stacking layers 2b alternately, heat to 600°C under pressure of 0.2 to 1 kg/rm12 in an argon atmosphere using a blower and hold for 1 hour to form a laminate. After polishing, a "positive electrode 3' was formed on only the wide area of the electrode 2a or the exposed side surface. b) Electrode 73
′ was anodized. Then, the end surface of the electrode 2a that is in contact with the electrode 3' changes to an oxide 4a. In the figure, the oxide 4 is shown to be protruding to emphasize that the opposite surface of the electrode 3' is also changed into an oxide, but in reality it becomes a smooth blood. c) The laminate was cut so that the J-shaped rods 2a and 2b had the same area and had a full-surface electrode structure. d
) Even more talented? Lead terminals a and b were then formed on the electrode 2a which had been subjected to the oxidation treatment, and brought into electrical contact with the electrode 2b. 0) Electrode X3)) was anodized. Then, contact with electrode 3b /'I! The end surface of the electrode 2b, which is oxide 4b, changes to oxide 4b.
f)金属[nJが露出している゛f’ll極2aと酸化
物4[)が交互に存在する側面にリード端子3aを形成
し、電極2aと電気的に接触させた。この後は重連の実
施例と同様である。この方法は積層体の割断を必要とし
ない比較的広い面積の電極を用いる積層型圧電素子の製
作に適している。f) Lead terminals 3a were formed on the side surfaces where metal [nJ was exposed, f'll electrodes 2a and oxides 4] were alternately present, and brought into electrical contact with the electrodes 2a. The rest is the same as in the multiplex embodiment. This method is suitable for manufacturing a laminated piezoelectric element that uses electrodes with a relatively wide area and does not require cutting the laminated body.
尚、上記各実施例においては圧電素子の最外層を被覆す
るモール1〜用樹脂の透水性を改善して水の浸入を防ぐ
、或いは金属カバーで完全に覆うなどの手段を講じても
良い。モールド用樹脂としてはエポキシ樹脂(大半の半
導体素子のモール1くに用いられている)、またはその
中に硬化促進剤としてのフェノールノボラック樹脂や可
どう作付与剤としてのシリコーンゴムあるいは強度を^
ノ、ぬるだめのフィラーとしてシリカやアルミナの粉末
を混合したもの。その他にはボリイミ1〜樹脂やフッ素
樹脂などが挙げられる。In each of the above embodiments, measures may be taken such as improving the water permeability of the resin for molding 1~ covering the outermost layer of the piezoelectric element to prevent water from entering, or completely covering the piezoelectric element with a metal cover. The resin for molding is epoxy resin (used in the molding of most semiconductor devices), or phenol novolak resin as a curing accelerator, silicone rubber as a flexibility imparting agent, or strength.
No, a mixture of silica and alumina powder as a filler for a slimy tank. Other examples include Boliimi 1-resin and fluororesin.
また酸化窒化によって化学的に安定になる活性金ノρt
は、AQ、、AQ、系合金、Ni、Ni系合金の他、S
n(スズ)+ Sn系合金、]n(インジウム)、■n
系合金、−L’i(チタン) 、 ’J” j系合金。In addition, activated gold ρt becomes chemically stable through oxidation and nitridation.
In addition to AQ, , AQ, alloys, Ni, and Ni-based alloys, S
n (tin) + Sn-based alloy, ]n (indium), ■n
-L'i (titanium), 'J' j-based alloy.
Zr(シルコニウ” ) + l r系合金、Cu(銅
)。Zr (Silconium) + L r-based alloy, Cu (Copper).
Cu系合金、 Fe (鉄)、Fe系合金、Zn(ll
i鉛)、Zn系合金等が挙げられる。Cu-based alloy, Fe (iron), Fe-based alloy, Zn(ll
Examples include lead), Zn-based alloys, etc.
第9図は本発明の積層型圧電素子を用いたマスフローコ
ン1ヘローラの構造の一例を示す縦断面図である。第9
図において圧電素子」−4に電圧を印加することにより
伸縮させ、その運動をタイヤフラt112に伝達し、制
御すべき流体(例えはカス)の流路に設置されたオリフ
ィス13の開放を調y1′lすることによって流星を制
allする。FIG. 9 is a longitudinal sectional view showing an example of the structure of a mass flow controller 1 roller using the laminated piezoelectric element of the present invention. 9th
In the figure, the piezoelectric element "-4 is expanded and contracted by applying a voltage, and the movement is transmitted to the tire flat t112, and the opening of the orifice 13 installed in the flow path of the fluid (for example, waste) to be controlled is controlled y1' Control the meteor by pressing the button.
このようなマスフローコントローラは流鰍の設定に対す
る応答性が従来のソレノイドを用いたものよりも飛躍的
に向1−する1、さらに、従来構造の圧″屯素子を用い
た場合に問題となる寿命の短かさ及び動作電圧の静さか
改善される。This kind of mass flow controller has dramatically better responsiveness to the setting of the gill than that using a conventional solenoid1, and also has a shorter service life, which is a problem when using a pressure element with a conventional structure. Improved shortness and quiet operation voltage.
第10図は本発明の積層型圧電素子を用いたインシエク
ションバルブ(燃料噴射弁)の構造の一例を示す縦断面
図である。第L 0図において圧電素子21に電圧を印
加することにより伸縮させ、その運動をシリンダ22に
伝達し、燃料流入側の流路2;3とシリングに設のられ
た流路24との接続を行う。その場合、圧″屯素子への
通′Cハ時間を調節することにより燃料の噴射量が制御
される、。FIG. 10 is a longitudinal sectional view showing an example of the structure of an injection valve (fuel injection valve) using the laminated piezoelectric element of the present invention. In Figure L0, the piezoelectric element 21 is expanded and contracted by applying a voltage, and the movement is transmitted to the cylinder 22, thereby establishing a connection between the flow passages 2 and 3 on the fuel inlet side and the flow passage 24 provided in the cylinder. conduct. In that case, the amount of fuel to be injected is controlled by adjusting the passage time to the pressure element.
このようなインジェクションバルブは従来構造の圧電素
子を用いた場合のような壇;電圧印加相の昇圧トランス
を必要とすす、また燃料ミストの付着による寿命の劣化
などの問題がなくなる。そして、燃料噴射の応答性と精
度の向」−という圧電素子を用いる利点が最大限に活用
できる。Such an injection valve eliminates problems such as the need for a step-up transformer for the voltage application phase and the deterioration of life due to adhesion of fuel mist, which occur when piezoelectric elements of conventional structure are used. In addition, the advantages of using piezoelectric elements, such as improved responsiveness and accuracy of fuel injection, can be utilized to the fullest.
第11図は本発明の積層型圧゛市素子を用いた精密位置
決め用移動ステージの構造の一例をン[<す側+f口図
である。第11図においてステージ34はポールネジな
どのリニアアクチュエータ;3;3によって移動する粗
動ステージである。そして、その−1−に設置される微
動用のステージ32を圧電素r−31によって移動させ
る。FIG. 11 is a side view showing an example of the structure of a movement stage for precision positioning using the laminated pressure displacement element of the present invention. In FIG. 11, the stage 34 is a coarse movement stage that is moved by a linear actuator such as a pole screw. Then, the fine movement stage 32 installed at -1- is moved by the piezoelectric element r-31.
(z6)
このような移動ステージに本発明の圧電素子を用いるこ
とにより従来のものよりも優れた位置決めの応答性及び
精度を有する圧電素子応用型棒!l!lノステージの耐
湿性及び信頼性を高めることができ、湿度の高い環境で
も信頼性に優れた動作を行う移動ステージを構成するこ
とかできる。(z6) By using the piezoelectric element of the present invention in such a moving stage, a piezoelectric element-applied rod has better positioning responsiveness and accuracy than conventional ones! l! The moisture resistance and reliability of the stage can be improved, and a moving stage that can operate with excellent reliability even in a humid environment can be constructed.
第」−2図は本発明の積層型圧電素子を用いたプリンタ
の印字ヘラ1くの構造の一例を示す側面図である。第1
2図において圧電素子41が発生させる変位が板ばね4
2のてこを通して印字ピン43に伝達され印字が行われ
る。FIG. 2 is a side view showing an example of the structure of a printing spatula 1 of a printer using the laminated piezoelectric element of the present invention. 1st
In Figure 2, the displacement generated by the piezoelectric element 41 is caused by the leaf spring 4.
It is transmitted to the printing pin 43 through the lever No. 2, and printing is performed.
このような印字ヘッドは応答性に優れるだけではなく、
非常に小形の構造で印字力が強いという利点を有してお
り、また湿度の高い環境においても十分な信頼性を維持
できる高い性能を発揮する。These printheads are not only highly responsive;
It has the advantage of having a very compact structure and strong printing power, and also exhibits high performance that maintains sufficient reliability even in humid environments.
本発明によれは、積層型圧電素子の耐湿性を向」ニさせ
、全1m″型棒方式素子の動作電圧を下げ信頼性を向上
させることができるという効果が得られる。According to the present invention, the moisture resistance of the laminated piezoelectric element can be improved, and the operating voltage of all 1 m'' rod type elements can be lowered and reliability can be improved.
第1図は本発明の一実施例の積層型圧電素子でモールド
用樹脂を被覆する前の積層体の斜視図、第2図はその断
面図、第3図は積層用電極の最も効果的な構造を示す斜
視図、第4図は本発明の一実施例の積層型圧電索r・の
製造工程を小す流Jし模式図、第5図は電極の端面の一
形状を示す断面図、第6図は本発明の他の実施例の積J
?11型圧電素子の造製工程を示す流れ模式図、第′7
図は従来例になる全面電極方式積層型圧′?fL素子の
2方向断面図、第8図は第7図のA−A断面図、第9図
は応用例に係るマスフローコントローラの縦断面図、第
1.0図は応用例に係るインシシクションバルブの縦断
面図、第11図はノ、F、:用例に係る精密位置決め用
移動ステージの縦断面図、第12図は応用例に係るプリ
ンタの印字ヘッドの縦断面図である。
1・・・圧電セラミクス板、2・・・電極板、:3・・
リー1−端子、4・・電気絶縁性化合物、5・・モール
1−用樹脂。FIG. 1 is a perspective view of a laminated piezoelectric element according to an embodiment of the present invention before being coated with molding resin, FIG. 2 is a cross-sectional view thereof, and FIG. A perspective view showing the structure, FIG. 4 is a schematic diagram illustrating the manufacturing process of a laminated piezoelectric cable according to an embodiment of the present invention, and FIG. 5 is a sectional view showing one shape of the end surface of the electrode. FIG. 6 shows the product J of another embodiment of the present invention.
? Flow schematic diagram showing the manufacturing process of an 11-type piezoelectric element, No. 7
The figure shows a conventional example of a full-surface electrode type laminated pressure sensor. 8 is a sectional view taken along the line A-A in FIG. 7, FIG. 9 is a vertical sectional view of a mass flow controller according to an application example, and FIG. 1.0 is an incision diagram according to an application example. FIG. 11 is a vertical cross-sectional view of a valve; FIG. 11 is a vertical cross-sectional view of a movement stage for precision positioning according to an application example; FIG. 12 is a vertical cross-sectional view of a print head of a printer according to an application example. 1... Piezoelectric ceramic plate, 2... Electrode plate, :3...
Lee 1-terminal, 4...electrical insulating compound, 5...resin for molding 1-.
Claims (14)
に介在する金属板との積層体の側面に一対の外部引き出
し用リード端子を付設して成り、前記金属板はアルミニ
ウム,アルミニウム系合金,ニッケル,ニッケル系合金
から選ばれる単層乃至複数層の平板である積層型圧電素
子において、前記金属板は交互に前記リード端子の内の
一方と電気的に接触させ、かつ他方のリード端子と前記
金属板とは電気的に非接触として、その非接触端部は前
記金属板の電気絶縁性化合物置換体となっていることを
特徴とする積層型圧電素子。1. A pair of external lead terminals is attached to the side surface of a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between the piezoelectric ceramic plates, and the metal plate is made of aluminum, aluminum alloy, nickel, or nickel. In a laminated piezoelectric element that is a flat plate with a single layer or multiple layers selected from a series of alloys, the metal plates are alternately brought into electrical contact with one of the lead terminals, and the other lead terminal and the metal plate are alternately brought into electrical contact with one of the lead terminals. is electrically non-contact, and the non-contact end portion is an electrically insulating compound substitute for the metal plate.
に介在する金属板との積層体の側面に一対の外部引き出
し用リード端子を付設して成り、前記金属板は酸化及び
/または窒化によって化学的に安定になる活性金属又は
該活性金属主体の合金でできた単層乃至複数層の平板で
ある積層型圧電素子において、前記金属板は交互に前記
リード端子の内の一方のみと電気的に接触させ、かつ他
方のリード端子と前記金属板とは電気的に非接触として
、その非接触端部は前記金属板の電気絶縁性化合物置換
体となっていることを特徴とする積層型圧電素子。2. A pair of external lead terminals is attached to the side surface of a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between the piezoelectric ceramic plates, and the metal plate is chemically oxidized and/or nitrided. In a laminated piezoelectric element that is a single-layer or multi-layer flat plate made of a stable active metal or an alloy mainly composed of the active metal, the metal plate is alternately brought into electrical contact with only one of the lead terminals. , and the other lead terminal and the metal plate are not electrically in contact with each other, and the non-contact end portion is an electrically insulating compound substitute for the metal plate.
に介在する金属板との積層体の側面に一対の外部引き出
し用リード端子を付設して成る積層型圧電素子において
、前記金属板は交互に前記リード端子の内の一方と電気
的に接触させ、かつ他方のリード端子と前記金属板とは
電気的に非接触として、その非接触部は前記金属板材料
の酸化物及び/または窒化物としたことを特徴とする積
層型圧電素子。3. In a laminated piezoelectric element, a pair of lead terminals for external extraction is attached to the side surface of a laminate of a plurality of piezoelectric ceramic plates and a metal plate interposed between the piezoelectric ceramic plates, wherein the metal plates are alternately connected to the leads. One of the terminals is electrically contacted, and the other lead terminal and the metal plate are not in electrical contact, and the non-contact portion is made of oxide and/or nitride of the metal plate material. A multilayer piezoelectric element characterized by:
極酸化ニッケル,プラズマ放電窒化アルミニウム,プラ
ズマ放電窒化ニッケルから選ばれるものであることを特
徴とする請求項1又は2に記載の積層型圧電素子。4. 3. The multilayer piezoelectric element according to claim 1, wherein the electrically insulating compound is selected from anodic aluminum oxide, anodized nickel, plasma discharge aluminum nitride, and plasma discharge nickel nitride.
ことを特徴とする請求項1乃至4いずれかに記載の積層
型圧電素子。5. 5. The laminated piezoelectric element according to claim 1, wherein a side surface of the laminated body is coated with a molding resin.
等しいことを特徴とする請求項1乃至5いずれかに記載
の積層型圧電素子。6. 6. The laminated piezoelectric element according to claim 1, wherein the piezoelectric ceramic plate and the metal plate have substantially the same planar dimensions.
コン,マグネシウム又はゲルマニウムのいずれか或いは
混合物を固溶させたものであることを特徴とする請求項
1乃至6いずれかに記載の積層型圧電素子。7. 7. The laminated piezoelectric element according to claim 1, wherein the alloy applied to the metal plate is aluminum in which one or a mixture of silicon, magnesium, and germanium is dissolved as a solid solution.
パラジウム又は銅のいずれか或いは混合物を固溶させた
ものであることを特徴とする請求項1乃至7いずれかに
記載の積層型圧電素子。8. The alloy applied to the metal plate is nickel, chromium,
The laminated piezoelectric element according to any one of claims 1 to 7, characterized in that it contains palladium, copper, or a mixture thereof as a solid solution.
する請求項1乃至8いずれかに記載の積層型圧電素子。9. 9. The laminated piezoelectric element according to claim 1, further comprising a heater provided outside the laminated body.
位置せしめることを特徴とする請求項1又は2又は4乃
至9いずれかに記載の積層型圧電素子。10. 10. The laminated piezoelectric element according to claim 1, wherein the electrically insulating compound substitutes are alternately positioned on each metal plate.
えてなるマスフローコントローラにおいて、該調節機構
構が流路に面するダイヤフラムと該ダイヤフラムに連接
される圧電素子とからなり、該圧電素子が前記請求項1
乃至10のいずれかにより構成されることを特徴とする
マスフローコントローラ。11. In a mass flow controller comprising a flow channel throttling adjustment mechanism in the middle of a flow path through which a fluid flows, the adjustment mechanism includes a diaphragm facing the flow path and a piezoelectric element connected to the diaphragm, and the piezoelectric element Claim 1
A mass flow controller comprising any one of 1 to 10.
リンダを内蔵させる外筒に形成した燃料流路とが該シリ
ンダの移動にて接続、切断されるインジェクションバル
ブにおいて、前記シリンダの駆動手段として前記請求項
1乃至10のいずれかによる積層型圧電素子を用いるこ
とを特徴とするインジェクションバルブ。12. In an injection valve in which a fuel flow path that moves with the movement of a cylinder and a fuel flow path formed in an outer cylinder in which the cylinder is housed are connected and disconnected by the movement of the cylinder, the above-mentioned claim is provided as a driving means for the cylinder. An injection valve characterized by using the laminated piezoelectric element according to any one of Items 1 to 10.
せて積層することにより積層体を形成し、次いで該積層
体の側面に一対の外部引き出し用リード端子を付設する
ことを特徴とする積層型圧電素子の製法において、前記
金属板を圧電セラミクス板間に積層後一層おきに金属板
の端部を陽極酸化処理して割断し、この陽極酸化処理部
位と未処理金属板端部とを直接覆うように一方のリード
端子を形成し、次いで未処理金属板端部の他端面を陽極
酸化処理して後残りのリード端子を形成することを特徴
とする積層型圧電素子の製法。13. A laminated piezoelectric element characterized in that a laminated body is formed by laminating a plurality of piezoelectric ceramic plates with metal plates interposed between them, and then a pair of lead terminals for external extraction are attached to the side surfaces of the laminated body. In the manufacturing method, after the metal plates are laminated between piezoelectric ceramic plates, the ends of the metal plates are anodized and cut every other layer, and the anodized parts and the untreated ends of the metal plates are directly covered. A method for manufacturing a multilayer piezoelectric element, which comprises forming one lead terminal, and then anodizing the other end surface of an untreated metal plate end to form the remaining lead terminals.
うことを制御とする請求項13記載の積層圧電素子の製
法。14. 14. The method for manufacturing a laminated piezoelectric element according to claim 13, wherein the control includes performing plasma discharge nitriding treatment in place of the anodizing treatment.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1104464A JPH02284483A (en) | 1989-04-26 | 1989-04-26 | Laminated piezoelectric element and its manufacture |
US07/510,875 US5163209A (en) | 1989-04-26 | 1990-04-18 | Method of manufacturing a stack-type piezoelectric element |
DE69020629T DE69020629T2 (en) | 1989-04-26 | 1990-04-25 | Layered piezoelectric element and method for its production. |
EP90107871A EP0395018B1 (en) | 1989-04-26 | 1990-04-25 | Stack-type piezoelectric element and process for production thereof |
US07/913,348 US5233260A (en) | 1989-04-26 | 1992-07-15 | Stack-type piezoelectric element and process for production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1104464A JPH02284483A (en) | 1989-04-26 | 1989-04-26 | Laminated piezoelectric element and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02284483A true JPH02284483A (en) | 1990-11-21 |
Family
ID=14381311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1104464A Pending JPH02284483A (en) | 1989-04-26 | 1989-04-26 | Laminated piezoelectric element and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02284483A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005072370A (en) * | 2003-08-26 | 2005-03-17 | Ngk Insulators Ltd | Multilayer ceramics electronic component and manufacturing method therefor |
JP2006093449A (en) * | 2004-09-24 | 2006-04-06 | Fuji Photo Film Co Ltd | Laminated structure, laminated structure array and manufacturing method thereof |
JP2018508121A (en) * | 2015-02-25 | 2018-03-22 | エプコス アクチエンゲゼルシャフトEpcos Ag | Method for manufacturing a multilayer device and multilayer device |
-
1989
- 1989-04-26 JP JP1104464A patent/JPH02284483A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005072370A (en) * | 2003-08-26 | 2005-03-17 | Ngk Insulators Ltd | Multilayer ceramics electronic component and manufacturing method therefor |
JP2006093449A (en) * | 2004-09-24 | 2006-04-06 | Fuji Photo Film Co Ltd | Laminated structure, laminated structure array and manufacturing method thereof |
JP2018508121A (en) * | 2015-02-25 | 2018-03-22 | エプコス アクチエンゲゼルシャフトEpcos Ag | Method for manufacturing a multilayer device and multilayer device |
US10608161B2 (en) | 2015-02-25 | 2020-03-31 | Epcos Ag | Method for manufacturing multilayer components, and multilayer component |
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