JP3525858B2 - Resin sealing method for flip-chip mounted body, resin-sealed printing mask used for this method, and semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing method for a flip-chip mounting body, a print mask for resin-sealing a flip-chip mounting body used in this method, and a semiconductor device.

[0002]

2. Description of the Related Art In a flip chip mounting body in which a semiconductor chip is pump-connected on a wiring board in a face-down form,
Dispersion of thermal stress caused by the difference in thermal expansion between the wiring board and the semiconductor chip and prevention of moisture intrusion into the interface between the wiring board and the semiconductor chip are necessary for improving its reliability, and it is called an underfill material. A low-viscosity, high-fluidity encapsulant is injected into the gap between the wiring board and the semiconductor chip. In the general method of the injection method in this case, as shown in FIG. 7, a part of the sealing resin 2 is dispensed around the semiconductor chip 12 on the wiring board 11 of the flip-chip mounting body 1 while the sealing resin 2 is dispensed. 3 is applied by extrusion, and the sealing resin 2 thus applied to the periphery of the chip 12 is made to penetrate into the gap S between the substrate 11 and the chip 12 by utilizing the capillary phenomenon. At this time, since air escapes from the uncoated portion around the chip 12 as indicated by the arrow, no unfilled portion remains inside the gap S. In the figure, 13 is a bump.

In the recent flip chip mounting body, the gap S between the substrate and the chip is, for example, 100 μm to 20 μm.
m, the bump layout spreads from the peripheral area of the chip (peripherals) to the entire surface of the chip (area), and the bump arrangement density is uneven. The chip size increases from 5 mm square to 20 mm square. There is a tendency to This is because the flip chip mounting body is used for a CPU of a personal computer and a thin and lightweight mobile device. The injection of the underfill material in the flip chip mounting body is very important for improving the above-mentioned reliability, and naturally, if voids remain in the gap S or are not filled after the injection is completed, Its performance is impaired. However, as described above, due to the evolution of chip size and bump arrangement, it has become very difficult to secure reliability with the conventional injection method that relies only on the use of capillary phenomenon. The method also had the drawback of long injection times. This long injection time has become a particularly serious obstacle in recent years when price reduction due to mass production of semiconductor chips has become very important.

Therefore, in Japanese Patent Laid-Open No. 11-297902, as shown in FIG. 8A, the print mask 3 is mounted on the flip chip mounting body 1 so that the chip 12 is accommodated in the opening 31. Overlap, in a vacuum atmosphere,
By injecting the sealing resin 2 into the opening 31 and then returning the atmosphere to the atmospheric pressure, the injected sealing resin 2 has a differential pressure between vacuum and atmospheric pressure (shown by a solid arrow in the figure). Board 11
A method of forcibly entering the gap S between the chip 12 and the tip has been proposed. The forced infiltration method using this differential pressure not only has the advantage that the filling time is short, but is also effective for filling the sealing resin in large chips or chips with narrow gaps. The improved method also has an advantage that voids contained in the resin can be injected while the coating is performed in a vacuum.

However, this method has a problem that voids 14 are likely to remain in the gap S between the substrate 11 and the chip 12. This is due to the following. That is,
In this improved method, when the degree of vacuum is reduced and air is introduced into the periphery of the chip, this air is attracted to the depressurization condition in the gap S and enters the gap S before the sealing resin to force the sealing resin. In order to prevent the loss of the infiltration action, the entire circumference of the chip 12 is completely surrounded by the sealing resin 2 to prevent air from entering the gap S. Due to the pressure difference when the atmosphere is returned to the atmospheric pressure, the sealing resin 2 is uniformly pressed from the entire periphery of the chip 12 as indicated by the thick arrow in FIG.
As a result, as shown in FIG. 8C, a void 14 corresponding to the initial vacuum degree (not an absolute vacuum) remains in the center of the gap S. .

Therefore, according to this improved method, FIG.
As shown in FIG. 5, a non-through hole (blind via hole) 15 is provided in the lower center of the chip 12 on the substrate 11 to prevent the void remaining. That is,
When the sealing resin 2 enters the gap S between the substrate 11 and the chip 12, the void 14 is moved to the non-penetrating hole 15 by this intrusion pressure so that the resin is filled in the entire lower region of the chip 12. To do. However, this non-through hole installation does not always mean that the void 14 is moved to the non-through hole 15 as intended when the resin penetration speed varies due to the unevenness of the bump arrangement and the unevenness of the bump intervals. There is also a problem that the bump 13 can be formed only in the "peripheral chip" in which the bumps 13 are present only in the peripheral portion of the chip 12 and cannot be formed in the "area bump chip" in which the bumps 13 are full-scale bumps.

[0007]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a resin sealing method for a flip chip mounting body, which is less likely to cause void residue, is compatible with area bump chips, and has high productivity. It is an object of the present invention to provide a highly reliable semiconductor device having a resin-encapsulated print mask and a small amount of voids remaining.

[0008]

In order to solve the above problems, as a result of diligent studies, the present inventor found that the resin coating around the chip should not be applied at a part of the periphery of the chip instead of the entire periphery of the chip. It has been found that the above-mentioned problem can be solved by making the coating amount in a part of the periphery of the chip smaller than that in other peripheral parts. That is, only a part of the periphery of the chip is not coated with the resin or the coating amount is small, so that the air in the gap is filled with the sealing resin which enters the gap between the substrate and the chip, and the resin is not coated or the coating amount is small around the chip. By extruding from the part of to the outside of the gap, it is possible to prevent the void remaining.

The inventor of the present invention has also found that the following atmospheric pressure control should be carried out when the resin is injected. That is, the atmosphere is first set to a high vacuum to apply the resin, and then the intermediate vacuum is once returned to infiltrate the resin gap, the atmosphere pressure is set to the high vacuum again, and at the same time, the printing mask is removed to remove the resin non-use. This is an atmospheric pressure control in which the sealing resin in the portion where the coating or the coating amount is small is supplemented by natural flow from the other portion and finally returned to atmospheric pressure. The inventor further
The inventors have also devised a structure of a print mask suitable for use in carrying out this resin sealing method. Therefore, a resin sealing method for a flip chip mounting body according to the present invention is a resin for a flip chip mounting body in which a printing mask is superposed on the flip chip mounting body and the sealing resin is printed and injected around the semiconductor chip on the wiring board. in the sealing method, when the air in the gap with the sealing resin to intrude into the gap of the wiring board and the semiconductor chip to expel from one side of the chip bets
At that time, if the sealing resin has a high pressure of 0.7 KPa or less,
Inject around the chip under vacuum, and set the atmospheric pressure to 0.7.
By returning to a medium vacuum exceeding KPa and lower than atmospheric pressure
The sealing resin is immersed in the gap due to the pressure difference between the inside and outside of the gap.
Then, the atmosphere pressure is returned to high vacuum again and the flip
Remove the mask from the mounting body, and then
Is to be returned to atmospheric pressure .

In the above, by applying the sealing resin around the semiconductor chip in a part of the entire circumference of the chip without applying or applying a small amount, it is easy to expel the air in the gap to one side of the chip. It is better to let The print mask for resin encapsulation of the flip chip mounting body according to the present invention,
A mask to be superposed on the flip chip mounting body when injecting a sealing resin around the semiconductor chip on the wiring board, wherein the semiconductor chip is provided on the back surface side of the portion corresponding to the semiconductor chip arrangement position on the wiring board. In a printing mask having a recess for accommodating a resin, and a slit for injecting a sealing resin at a position corresponding to the periphery of the recess,
, The Thickness of the peripheral wall of the chip accommodation recess part is characterized in that it is thicker than the other portions, and 2,
Said slits, said chip characterized in that the opening area is smaller than in other portions in part of the housing recess entire periphery, the 3, slit, except for a part of the recess entire periphery, the It is characterized in that the width becomes narrower as it goes down.

A semiconductor device according to the present invention comprises a flip chip mounting body which is resin-sealed by the above method.

[0012]

DETAILED DESCRIPTION OF THE INVENTION [Resin sealing method Hereinafter, the resin sealing method of the flip chip mounting body according to the present invention will be described with reference to FIG. In the method of the present invention, as shown in FIG. 1A, a print mask (indicated by a chain double-dashed line in the figure) 3 is superposed on the flip chip mounting body 1 to surround the semiconductor chip 12 on the wiring board 11. In the method of printing and injecting the sealing resin 2 into the substrate, the substrate 11 and the chip 1 are
The air in the gap S is expelled from the one side portion P of the chip 12 by the sealing resin 2 that enters the gap S of No. 2 as shown by the thick arrow in FIG. As shown in FIGS. 1A and 1B, the sealing resin 2 is not infiltrated or has a small infiltration amount in the one-side portion P. By infiltrating into the gap S from a portion, the air in the gap S can easily go out of the gap S through the one side portion P. Therefore, the gap S
This makes it easy to expel the air inside to one side of the chip.

In the method of the present invention, in carrying out the above steps, first, the sealing resin 2 is passed through the slit (not shown) formed in the mask 3 under a high vacuum of 0.7 KPa or less, and the chip 12 is formed. Print around the area. At this time,
As shown in FIGS. 1 (a) and 1 (b), by using a printing mask to be described later according to the present invention, a portion P around the chip 12 is made to have no resin infiltration or a small infiltration amount. To do. Next, when the atmospheric pressure is changed to a medium vacuum that exceeds 0.7 KPa and is lower than atmospheric pressure, a pressure difference (outside of the gap S> inside of the gap) occurs. Therefore, the sealing resin 2 around the chip 12 is forced to invade the gap S due to this pressure difference, and the air in the gap S (the air existing under the high vacuum of 0.7 KPa or less) is shown in FIG. While pushing out to the outside through one side portion P as shown by the arrow in a), that is, the portion P where the resin does not penetrate or the amount of penetration is small, (c) of FIG.
As shown in FIG. However, as shown in FIG. 1D, in one side portion (portion where resin has not penetrated or the amount of penetration is small) P at this stage,
Below the chip 12, there is still a small gap that is not blocked by the sealing resin 2. It should be noted that this FIG.
It is the figure which looked at (c) from the arrow direction of the figure. Therefore, next, the print mask 3 is removed from the substrate 11 while returning the atmospheric pressure to the high vacuum again. Then, the sealing resin 2 of the other portion naturally flows into this portion P, and (e) of FIG.
As shown in FIG. 3, the unfilled portion is closed and the gap S is sufficiently filled with the sealing resin 2. After that, the atmosphere is returned to atmospheric pressure. Then, even if a very small amount of air remains in the gap S, the void in the high vacuum atmosphere contracts due to the pressure difference and becomes dwarfed because the atmosphere returns to the atmospheric pressure.

In the method of the present invention, preferably, the squeegee speed at the time of print injection is low at the time of injection of the sealing resin 2 around the chip 12, and high at other times. This is because at low speeds, the printing pressure increases and the amount of sealing resin injected from the slits 31 increases, and at high speeds, the printing pressure decreases and the amount of sealing resin injections from the slits 31 decreases. In the method of the present invention, since the sealing resin is injected under reduced pressure, air and the like contained in the sealing resin can be degassed, and a semiconductor device with few voids can be obtained. According to the method of the present invention, through the process described above, the flip-chip mounting body 1 which is resin-sealed in the state in which the void S has few voids or in which only minute voids are present,
It can be manufactured at a higher speed than the conventional injection method using only the capillary phenomenon.

Up to this point, the description has been given of the resin encapsulation in the flip chip mounting body in which the semiconductor chip is mounted on the wiring board by bump connection, but the BGA (or CSP) is mounted on the mother board (wiring board) with the solder balls. The resin sealing method described above can also be applied to the resin sealing when mounted. In this case, the size and overall thickness of the package are larger than those of the flip chip, and the thickness and size of the mask are accordingly large. [Print Mask for Resin Encapsulation] When the resin encapsulation method of the present invention is carried out, it is preferable to realize non-penetration or small infiltration amount of the encapsulation resin 2 in a part P of the entire periphery of the chip 12. However, in order to facilitate the realization thereof, it is preferable to use the resin sealing print mask of the present invention described below.

As shown in FIG. 2, the print mask 3 of the present invention has a recess 3 for accommodating the chip 12 on the back side thereof.
Have two. The gap between the ceiling surface of the recess 32 and the upper surface of the chip 12 is preferably as narrow as possible in the case of a package in which the upper part of the chip is exposed and not sealed with resin. This gap is not necessary at all, but if a load is applied to the chip, it may cause bump connection to break or the chip to crack or chip.Therefore, eliminating the gap above the chip is very preferable. Absent. The thickness of the gap above the chip is not limited, but is more than 0 μm, 2
It is preferably 00 μm or less. If the gap above the chip is too wide, the sealing resin 2 does not sufficiently penetrate into the gap S below the chip during resin printing injection or resin infiltration using the atmospheric pressure difference, but rather is introduced into the gap above. May result.

For the same reason as above, the peripheral wall 321 of the recess 32 is formed.
The gap between the chip and the tip 12 should be as narrow as possible. However, it is better that the gap beside the chip is slightly larger than the gap above the chip. The reason is that the injected resin 2 needs to form a fillet on the side surface of the chip later.
This fillet plays a very important role in improving the reliability of the flip chip encapsulant. If the fillet is small, chip peeling or the like is likely to occur. As shown in FIG. 2B, the print mask 3 has slits 31 all around the chip storage recess 32. The slit 31 has a bridge 311 in part so that the ceiling wall of the recess 32 does not fall. Therefore, the slit 31
Is not continuous all around, and is disconnected at the bridge 311.
In this embodiment, bridges 311 (a)-(d) are provided at the four corners.
However, the number of bridges is not limited. The bridges 311 (a) to (d) are kept strong enough to withstand this pressure even if the squeegee moves while pressurizing the print mask 3 during print injection. There is a need. It is preferable that the opening area of the slit 31 does not become too small and the printing injection of the sealing resin 2 is hindered.

The thickness of the bridges 311 (a)-(d) is
In order to suspend the concave portion 32 to have a strength enough to withstand printing, or to make the sealing resin non-penetration into a specific slit or to make a small infiltration amount, for example, the bridge 31 adjacent to the specific slit is used.
1 (a) and 311 (b) have the same thickness as the mask (the same thickness as the peripheral wall portion 321 (a)), and the bridge 31
The peripheral walls 1 (a) and 311 (b) are in contact with the wiring board, and the thickness of the bridges 311 (c) and 311 (d) having a large resin infiltration amount other than the above is not in contact with the wiring board.
It may have the same thickness as 21. In this case, a clearance is created between the wiring board and the bridge connecting the ceiling wall of the recess 32 and the mask outside the slit.
The resin enters through this clearance.
Even if the slits with large penetration amount are independent and not connected, the resin is connected by the clearance under the bridge.Therefore, let the resin penetrate into the surroundings except one side of the slit that does not penetrate the chip or the slit with small penetration amount. You can The bridges 311 (a) to 311 (d) are required to have a thickness for maintaining bridge strength that can withstand squeegee printing.

In the above, the bridges 311 (a) and 3
11 (b) contacts the wiring board, and bridge 311 (c)
Although 311 (d) and the wiring board are not in contact with each other, any bridge may have a clearance between itself and the wiring board. In FIG. Bridge 311 when print injection is performed to
The clearances of (c) and 311 (d) are bridge 3
It is preferably larger than the clearance of 11 (a) and 311 (b). The slit length is preferably about the same as each side of the chip 12 even when the chip 12 has a rectangular shape. Since the slit width is related to the above-mentioned fillet, it is preferably up to about 5 mm.

The thickness of the peripheral wall 321 of the chip accommodating recess 32 is not particularly limited, but is preferably up to about 5 mm because it is related to the fillet. However, the thickness of the peripheral wall of the recess near the slit where the sealing resin 2 is introduced later may be thicker than 5 mm. In the method of the present invention, in order to push the air in the gap S to the one side portion P of the chip 12, it is preferable to make the coating state of the sealing resin 2 unevenly distributed as described above. The print mask according to the present invention has the following structure for this uneven distribution.

In the print mask 3 shown in FIG. 2, the lower end edge of the peripheral wall 321 of the chip accommodating recess 32 has a part 321 thereof.
It is at the same height as the upper end of the gap S except that it is located below the upper end of the gap S below the chip 12 in (a).
The lower end edge of the other part of the peripheral wall 321 may be positioned higher than the upper end of the gap S. The lower end edge of the peripheral wall portion 321 (a) has only to be located below the upper end of the gap S as described above, but is preferably in contact with the surface of the substrate 11. In the print mask 3 shown in FIG. 3,
The thickness of the peripheral wall 321 of the chip accommodating recess 32 is a part of
21 (a) is thicker than the other portions.

In the print mask 3 shown in FIG. 4, the slit 3
1 is a part 31 of the entire circumference of the chip storage recess 32.
In (a), the opening area is smaller than in other parts. A part of the slit 31 (a) has a small opening area in FIG. 4 (a) due to its narrow width, and has a mesh shape in FIG. 4 (b). As a result, the opening area becomes smaller. Figure 5
In the print mask 3 shown in, the width of the slit 31 is gradually narrowed as it goes downward, except for a part 31 (a) of the entire circumference of the chip storage recess 32. This is preferably realized by forming the outer surface of the inner surface of the slit 31 into an inclined surface as shown in the figure.

In the print mask shown in FIGS. 2 and 3, the peripheral wall 321 of the chip accommodating recess 32 has a portion that is long or has a thickness. Therefore, in this portion 321 (a),
The sealing resin 2 injected from the slits 31 is larger than the sealing resin 2 injected from the slits 31 in other portions.
The distance to reach the chip 12 becomes long, and as a result, in this portion 321 (a), the coating state of the sealing resin 2 is either uncoated or the coating amount is small. In the print mask shown in FIG. 4, the opening area of a part of the slit 31 (a) is smaller than that of the other part. Therefore, when viewed per unit time, the slit 31 (a) is injected from the slit. The amount of the sealing resin that is injected is smaller than the amount of the sealing resin that is injected from the slits in other portions. As a result, in this portion, the coating state of the sealing resin 2 is non-coated or the coating amount is small.

In the print mask seen in FIG. 5, the slit 31
Has the same width from the top to the bottom in a part 31 (a) of its entire circumference, but the width becomes narrower in all the other parts toward the bottom, so that the other part ( In the hem narrowing portion), the injection speed of the sealing resin increases as it goes downward, whereas the injection speed of the sealing resin in part 31 (a) does not increase. As a result, this part 31
In a, the coating state of the sealing resin 2 is non-coating or the coating amount is small. Although not shown in the drawings, the structures of FIGS. 2 to 5 may be combined in the print mask according to the present invention.

When the peripheral wall 321 of the chip accommodating recess is cut out as shown in FIG. 6A in at least a part of the entire circumference, the sealing resin 2 is introduced also into the gap above the chip 12. can do. Even if a through hole 33 that penetrates above the print mask 3 is formed in the ceiling wall of the chip storage recess 32 as shown in FIG.
The sealing resin 2 can be introduced into the gap above. As a result, the entire chip 12 can be covered with the sealing resin 2. As shown in FIGS. 2 to 6, the slit 31
It is preferable that a space 35 for resin cutting is formed on the entire outer periphery of the print mask 3 through the annular wall 34, and the space 35 is communicated with the outside of the print mask 3 through the air passage hole 36. It is preferable that at least a part of the entire circumference of the lower end edge of the annular wall 34 has a clearance of 0.01 to 0.5 mm from the surface of the substrate 11.

On the back surface of the print mask 3 removed from the substrate 11 after the resin injection described above, the sealing resin 2 is often left attached on the outer peripheral portion of the slit 31. With such adhesion, when the print mask 3 is overlaid on the substrate 11 for the next resin injection, the above-described adhered resin becomes a stain on the surface of the substrate 11, and this stain causes a wiring short circuit. To wake up. However, as described above, by forming the space 35 for cutting the resin, it becomes possible to prevent the resin from adhering to the outer periphery of the slit on the back surface of the mask. Therefore, it is possible to print the same shape even if the printing is performed many times in succession.

The semiconductor device according to the present invention is formed by resin-sealing the flip-chip mounting body by the method described above.

[0028]

EXAMPLES Examples and comparative examples using the print mask according to the present invention will be shown. (Examples 1 to 7 and Comparative Examples 1 and 2) As a sealing material, Pana Sealer CV5186S (manufactured by Matsushita Electric Works, Ltd.) was used. The mask uses the one of SUS304,
The uneven processing was performed by an etching method. A glass substrate was used as the substrate and the chip, and flip-chip mounting with solder bumps was used. As a squeegee, SUS3
A 04 hard squeegee was used. The specific sizes are as follows.

Chip size: 12 × 12 mm Chip thickness: 0.3 mm Number of bumps: 98, 200 μm pitch area array type Gap between chip and substrate: 50 μm Squeegee speed: 10 mm / sec per step (however,
The speed control was 50 mm / sec. ) While printing the substrate with an electric heater under the stage at 50 ° C. during printing, the encapsulating resin was printed and injected using the above printing mask, and after removing the printing mask, the time required for all steps was measured. The conditions in each Example and Comparative Example are shown in Table 1.

Then, the presence or absence of non-filling was visually observed from the back surface of the glass substrate in a horizontal state. In addition, after the resin was cured at 100 ° C. for 1 hour and 150 ° C. for 3 hours, the presence or absence of bubbles was similarly observed with a microscope from the back surface of the glass substrate. The results are shown in Table 1. In Comparative Example 2, the sealing material was injected into the three sides of the chip using a dispenser having a nozzle inner diameter of 0.6 mm and an extrusion air pressure of 2 kg / cm ² .

[0031]

[Table 1]

[0032]

According to the resin encapsulation method for a flip chip mounting body according to the present invention, a semiconductor device having few or very few voids can be obtained with high productivity. The use of the mask for injecting the sealing resin of the flip chip mounting body according to the present invention facilitates the implementation of the resin sealing method according to the present invention. Since the semiconductor device according to the present invention is resin-encapsulated in the flip-chip mounting body by the above-described method, it has few voids or is extremely small and has high reliability.

[Brief description of drawings]

FIG. 1 is a partial side sectional view (a), a partial plan view (b) and (c) and a partial side view (d) showing a usage state of an embodiment of a sealing resin injecting mask according to the present invention. ), (E).

FIG. 2 is a partial plan view (b) showing a usage state of another embodiment of the mask according to the present invention and a partial side sectional view (a) taken along a two-dot chain line AA of the partial plan view. is there.

FIG. 3 is a partial side sectional view showing a usage state of a mask according to another embodiment of the present invention.

FIG. 4 is a partial side sectional view showing a usage state of two masks according to still another embodiment of the present invention.

FIG. 5 is a partial side sectional view showing a usage state of a mask according to still another embodiment of the present invention.

FIG. 6 is a partial side sectional view showing a usage state of two masks according to still another embodiment of the present invention.

FIG. 7 is a partial side sectional view (a) and a partial plan view (b) showing a conventional resin sealing method.

FIG. 8 is a partial side sectional view (a) and partial plan views (b) and (c) showing a resin sealing method according to a conventional improvement.

[Explanation of symbols]

1 Flip chip assembly 11 board 12 chips 2 Sealing resin 3 masks 31 slits 32 recess 321 peripheral wall P part (one side part)

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinji Hashimoto 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Naoki Kanagawa 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works, Ltd. 56) References JP-A-11-297902 (JP, A) JP-A-8-306717 (JP, A) JP-A-10-229267 (JP, A) JP-A-11-145191 (JP, A) JP HEI 10-335359 (JP, A) JP HEI 11-233536 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/56 H05K 1/18

Claims (13)

(57) [Claims] 1. A resin encapsulation method for a flip chip mounting body, wherein a printing mask is superposed on the flip chip mounting body, and a sealing resin is printed and injected around the semiconductor chip on the wiring board. Air in the gap is expelled from one side of the chip by a sealing resin that enters the gap, and at the same time, the sealing resin is blown under a high vacuum of 0.7 KPa or less.
Is injected into the surrounding area and the atmospheric pressure exceeds 0.7 KPa to the atmosphere.
The pressure inside and outside the gap can be reduced by returning to a medium vacuum that is lower than the pressure.
Force difference causes the sealing resin to enter the gap and
Back to the high vacuum again and the front from the flip chip mount
Take off the mask and then return the atmospheric pressure to atmospheric pressure.
A method for sealing a flip-chip mounting body with a resin, comprising: 2. The application of the sealing resin around the semiconductor chip is made non-penetrating or having a small permeating amount in a part of the entire circumference of the chip, so that the air in the gap can be easily expelled to one side of the chip. The resin sealing method of the flip chip mounting body according to claim 1, wherein 3. The squeegee speed at the time of the print injection,
At the time of printing injecting a sealing resin around the semiconductor chip slow and fast at the other, according to claim 1 or
2. The resin sealing method for a flip chip mounting body according to 2 . Wherein said semiconductor chip includes a ball grid array semiconductor chip having a similar form to the flip chip type semiconductor chip, the flip chip mounting according to any one <br/> of claims 1 to 3 Method for sealing body resin. 5. A mask which is superposed on a flip chip mounting body when a sealing resin is injected around a semiconductor chip on a wiring board, the back surface of a portion corresponding to a semiconductor chip arrangement position on the wiring board. A side is provided with a recess for accommodating the semiconductor chip, and a slit for injecting a sealing resin is provided at a position corresponding to the periphery of the recess, and the thickness of the peripheral wall of the chip accommodating recess is partly thicker than other parts. A printed mask for resin encapsulation of a flip chip mounting body, which is characterized in that 6. A mask which is superposed on a flip chip mounting body when a sealing resin is injected around a semiconductor chip on a wiring board, the back surface of a portion corresponding to a semiconductor chip arrangement position on the wiring board. provided with a recess for accommodating the semiconductor chip on the side provided with a slit for the sealing resin injected into the position which corresponds to the periphery of the recess, the slit, than in other portions in part of the entire periphery the chip housing recess A print mask for resin encapsulation of a flip-chip mounting body, which has a small opening area. 7. The resin-encapsulating print mask according to claim 6 , wherein a part of the slit has a smaller opening area due to a narrower width thereof. 8. The resin-encapsulating print mask according to claim 6 , wherein a part of the slit has a mesh-like opening, so that the opening area is small. 9. A mask which is superposed on a flip chip mounting body when a sealing resin is injected around a semiconductor chip on a wiring board, the back surface of a portion corresponding to a semiconductor chip arrangement position on the wiring board. A recess for accommodating the semiconductor chip is provided on the side, and a slit for injecting the sealing resin is provided at a portion corresponding to the periphery of the recess, and the slit has a width downward except for a part of the entire periphery of the recess. A print mask for resin encapsulation of a flip-chip mounting body, which is characterized by gradually narrowing as it goes. 10. a through hole in the ceiling wall of the recess, according to any one of claims 5 to 9, the printing mask resin sealing. 11. A space for resin cutting is provided on the entire outer circumference of the slit via an annular wall, the space communicates with the outside of the mask, and the lower end edge of the annular wall has a circumference of the entire circumference. At least a part of the wiring board surface is 0.0
Clearance 1~0.5mm adapted occurs, a resin sealing printing mask according to any one of claims 5 to 10. 12. at least one bridge connecting the ceiling wall and the slit outer mask of the recess, said is adapted to the clearance between the wiring substrate surface occurs, one of the claims 5 to 11 The printing mask for resin encapsulation according to Item 1 . 13. A flip chip mounting body according to any one of claims 1 to 4.
A semiconductor device, which is resin-encapsulated by the method according to any one of 1 to 3 above.