JP3516410B2 - Method for producing silicone emulsion pressure-sensitive adhesive composition - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for producing a silicone emulsion pressure-sensitive adhesive composition containing no organic solvent.

[0002]

2. Description of the Related Art Silicone pressure sensitive adhesives are excellent in heat resistance, cold resistance, weather resistance and chemical resistance, and are therefore particularly used in severe environments where they are deteriorated by acrylic or rubber pressure sensitive adhesives. Conventional silicone adhesives have extremely high viscosity because their main raw materials are solid silicone resin and ultra-high-viscosity raw silicone rubber, so they cannot be applied as they are.Therefore, they are diluted with an organic solvent during application. Has been used.

[0003]

In this case, the coating workability is improved, but on the other hand, safety measures and environmental measures against the organic solvent volatilized during drying are required. In addition, there is a drawback that the substrate to be coated is limited because it is required to have solvent resistance. Silicone content without diluting with organic solvent
It is possible to use low-viscosity raw silicone rubber as a raw material in order to obtain a coating viscosity at 100%, but in this case the adhesive properties are inferior to conventional adhesives and storage stability is poor. It is not suitable for practical use because it easily gels. From such a situation, the present invention provides a silicone-based pressure-sensitive adhesive composition that exhibits adhesive properties equivalent to those of conventional pressure-sensitive adhesives but cannot be coated because the viscosity is too high without an organic solvent,
Adhesive composition that can be applied without using an organic solvent
The present invention has been made in an attempt to provide a manufacturing method of.

[0004]

As a result of intensive studies to solve the above problems, the inventors of the present invention have found that a silicone having adhesive properties equivalent to those of the prior art and having a viscosity that is difficult to apply in a state containing no solvent. The present invention has been accomplished by finding that a silicone emulsion pressure-sensitive adhesive composition composed of a pressure-sensitive adhesive, an emulsifier and water solves the above disadvantages and drawbacks and provides adhesive properties equivalent to those of conventional pressure-sensitive adhesives.

The present invention firstly comprises (A) an organopolysiloxane represented by the following general formula (1) having a viscosity at 25 ° C. of 1 × 10 ⁶ cS or less and an organopolysiloxane represented by the general formula (2). to contain one or more alkenyl unsaturated groups selected by the average value 0.0001 mol / 100 g or more
And 100 parts by weight of an organopolysiloxane that,

[Chemical 3] (However, in the formula, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group containing no alkenyl unsaturated group, n and l are 0 to 3 respectively.
, K and q are 0 or positive integers, j and p are 100 or more integers, m is an integer of 0 to 10, and (B) R ² ₃ SiO _0.5 unit (provided that R ^{2 in} the formula is Is a monovalent hydrocarbon group) and SiO ₂ units, and 100 parts by weight of component (A) is an organic solvent solution of an organopolysiloxane having a molar ratio of R ² ₃ SiO _0.5 units / SiO ₂ units of 0.6 to 1.3. As opposed to
After mixing, heating and reacting with 100 to 200 parts by weight as a solid content, (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule, H / Vi = 0. After blending so as to be 1 to 15 [where H is the number of moles of hydrogen atoms bonded to silicon atoms in the component (C), and Vi is the number of moles of all alkenyl groups in the component (A). ], The organic solvent is distilled off to render it solvent-free, and then 1 to 30 parts by weight of the (D) emulsifier is added to 1 to 30 parts by weight and (E) water to )-(C) 25-
After 200 parts by weight was added and emulsified and dispersed, just before use, the platinum catalyst (F) was added to the total amount of the components (A) to (C) so as to be 1 to 5,000 ppm as platinum. And a method for producing a silicone emulsion pressure-sensitive adhesive composition, which comprises emulsifying and dispersing again,

Secondly, (a) the viscosity at 25 ° C. is 1 × 10 ⁶ c
S An organopolysiloxane represented by the following general formula (3)

[Chemical 4] (However, R ³ in the formula is an unsubstituted or substituted monovalent hydrocarbon group, r
Is an integer of 100 or more) and (b) R ⁴ ₃ SiO _0.5 unit (however, R ^{4 in} the formula is a monovalent hydrocarbon group) and SiO ₂ unit. R ⁴ ₃ SiO _0.5 unit / SiO ₂ unit mol After heating and reacting an organic solvent solution of an organopolysiloxane having a ratio in the range of 0.6 to 1.3, the organic solvent is distilled off to make it solvent-free, and then (c) an emulsifier and (d) water are added to emulsify the mixture. After the dispersion, just before use, (e) an organic peroxide is added, and the method is a method for producing a silicone emulsion pressure-sensitive adhesive composition, which comprises emulsifying and dispersing again.

The present invention will be described in detail below. First, the components (A) to (F) used in the present invention will be described. The component (A) is one selected from the chain organopolysiloxane represented by the general formula (1) and the chain organopolysiloxane represented by the general formula (2) having a viscosity at 25 ° C. of 1 × 10 ⁶ cS or less. Alternatively, it is an organopolysiloxane in which two or more kinds of alkenyl unsaturated groups have an average value of 0.0001 mol / 100 g or more.

R ^{1 in the} general formulas (1) and (2) is an unsubstituted or substituted monovalent hydrocarbon group containing no alkenyl unsaturated group, specifically, methyl group, ethyl group, propyl group, butyl group. Groups such as alkyl groups, phenyl groups, aryl groups such as tolyl groups, benzyl groups, aralkyl groups such as phenethyl groups,
Examples thereof include haloalkyl groups such as chloropropyl group and trifluoropropyl group, and methyl group and phenyl group are particularly preferable industrially. It is essential that the content of the alkenylic unsaturated group is 0.0001 mol / 100 g or more on average, and if it is less than 0.0001 mol / 100 g, the crosslinking density is low and the cohesive force is low. Preferably 0.0003 to 0.001 mol / 100g
If it exceeds 0.001 mol, tack and adhesive strength will be low. m may be in the range of 0 to 10, but is preferably 0.
Further, n and l in the general formulas (1) and (2) are 0 to 3 respectively.
Is an integer of 0 or a positive integer. The component (A) may have an alkenyl unsaturated group having the above-mentioned value as an average of all organopolysiloxane molecules, but it is preferable that this group is distributed as uniformly as possible. Further, the length of the siloxane chain is an integer of 100 or more as j and p in the general formulas (1) and (2), preferably 200 to 1000. When j and p are less than 100, adhesive properties and storage stability are poor and the target of the present invention cannot be achieved. If it is more than 2000, it becomes too viscous when used as an adhesive and it becomes extremely difficult to emulsify it.

As described above, the MQ resin as the component (B) is R
It is composed of ² ₃ SiO _0.5 units and SiO ₂ units, and preferably has a hydroxyl group. R ² in the formula is a monovalent hydrocarbon group, and examples thereof include an alkyl group such as a methyl group, an ethyl group, a propyl group and a butyl group, an alkenyl group such as a vinyl group and an allyl group, and the like. A vinyl group is preferable, and it is particularly preferable that 95 mol% or more of all R ² groups are methyl groups. Further, the molar ratio of R ² ₃ SiO _0.5 unit / SiO ₂ unit is 0.6 to
1.3. If this ratio is less than 0.6, the tackiness and tack may decrease, and if it exceeds 1.3, the cohesive force may decrease. The blending amount of the component (B) is preferably 100 to 200 parts by weight with respect to 100 parts by weight of the component (A).

The organohydrogenpolysiloxane as the component (C) functions as a crosslinking agent and crosslinks with the alkenyl unsaturated group by hydrosilylation reaction. The component (C) is not particularly limited as long as it contains at least two hydrogen atoms bonded to silicon atoms in one molecule, and examples thereof include those represented by the following formula. (CH ₃ ) ₃ SiO [Si (C
H ₃ ) ₂ O] _a [SiH (CH ₃ ) O] _b Si (CH ₃ ) ₃ , (CH ₃ ) ₃ SiO [SiH (CH ₃ ) O]
_{c Si (CH 3) 3,} [SiH (CH 3) O] d: cyclic siloxane, (CH _{3) 2} HS
_{iO [Si (CH 3) 2} O] e SiH (CH 3) 2, (CH 3) 2 HSiO [Si (CH 3) 2 O] f [S
iH (CH ₃ ) O] _g SiH (CH ₃ ) ₂ (where a, b, c, e,
f and g each represent an integer of 2 or more, and d represents an integer of 3 or more. ) Further, it contains (CH ₃ ) ₂ HSiO _0.5 unit and / or (CH ₃ ) HSiO unit, and further contains (CH ₃ ) ₃ SiO _0.5 unit, (CH ₃ ) ₂ SiO unit, (C ₆ H ₅ ).
₂ SiO units, (CH ₃ ) SiO _1.5 units, (C ₆ H ₅ ) SiO _1.5 units and Si
Hydrogen polysiloxane having at least one type of unit selected from O ₂ units can be used.
The blending amount of the component (C) is the ratio (H / Vi) of the number of moles (H) of hydrogen atoms bonded to silicon atoms in the component (C) and the number of moles (Vi) of all alkenyl groups in the component (A). Is 0.1 to 15,
In particular, it is preferable to mix it in the range of 1-10. If this ratio is less than 0.1, the crosslink density will be low and the cohesive force will be low, and if it exceeds 15, tack and tackiness will be low and foaming due to hydrogen gas may be likely to occur.

Component (D) is conventionally used for emulsifying silicone compounds, for example, anionic surfactants such as long-chain polyoxyethylene alkyl ether sulfates and nonionic surfactants such as polyoxyethylene alkyl ethers. Alternatively, it may be appropriately selected from cationic surfactants such as benzyl ammonium salt. The amount of component (D) is preferably in the range of 1 to 30 parts by weight, particularly 5 to 15 parts by weight, based on 100 parts by weight of the organopolysiloxane. If this amount is less than 1 part by weight, the emulsion stability will be poor, and if it exceeds 30 parts by weight, the tackiness will be impaired. The amount of water as the component (E) to be added is not particularly limited, but it is 25 to 100 parts by weight of the organopolysiloxane.
It is preferably 200 parts by weight.

The component (F) is a platinum-based catalyst such as chloroplatinic acid. The amount of platinum added is 1 to 5000 ppm, especially 5 to 2000 ppm as platinum based on the total amount of the components (A) to (C). Is preferred. If the addition amount is less than 1 ppm, the crosslinking density may be low and the cohesive force may be lowered. If the addition amount is more than 5000 ppm, the tack and the adhesive force may be lowered and the pot life may be shortened, which is economically disadvantageous. Furthermore, for the purpose of prolonging the pot life, various ethynyl compounds, amine compounds,
A phosphorus compound or the like can be added as a control agent for the crosslinking reaction (hydrosilylation reaction).

Next, the components (a) to (e) used in the present invention will be described. The component (a) is a chain organopolysiloxane represented by the above general formula (3) having a viscosity at 25 ° C. of 1 × 10 ⁶ cS or less. R ³ in the formula is an unsubstituted or substituted monovalent hydrocarbon group, and examples thereof include the same groups as R ^{1 of the} component (A) and alkenyl groups. r is an integer of 100 or more, preferably 200 to 10
00. When r is less than 100, the adhesive property and storage stability are poor and the target of the present invention cannot be achieved. If it is more than 2000, it becomes too viscous when used as an adhesive and it becomes extremely difficult to emulsify it. The MQ resin as the component (b) has the same range as that of the component (B). As the emulsifier of the component (c), one having the same range as that of the component (D) is used. The water used as the component (d) is in the same range as in the case of the component (E).

Component (e) is a vulcanizing agent for curing components (a) and (b), and is not particularly limited as long as it is an organic peroxide. This includes, for example, benzoyl peroxide, cumyl peroxide, t-butyl cumyl peroxide, t
-Butyl, 2,4-dichlorobenzoyl peroxide, t-butyl isobutyrate peroxide, t-butyl benzoate peroxide, t-butyl-2-ethyl hexalate peroxide,
2,2-bis-peroxide t-butyl octane, 1,1-bis-peroxide t-butyl cyclohexane, 2,5-dimethyl-
2,5-diperoxybenzoylhexane and the like can be mentioned.
The amount of component (e) added is preferably 0.5 to 5% by weight, particularly 1 to 3% by weight, based on the total amount of components (a) and (b). The strength tends to decrease, and if it exceeds 5% by weight, the tack and the adhesive strength become low and the decomposition residue of the peroxide tends to remain.

The silicone emulsion pressure-sensitive adhesive composition of the present invention is produced by a known method (A).
Chain organopolysiloxane as component and MQ as component (B)
After the resin is heated and reacted, the component (C), organohydrogenpolysiloxane, is added to render it solvent-free,
After adding the emulsifier of the component (D) and the water of the component (E), the resulting mixture was emulsified and dispersed using a high shear emulsification disperser such as a homomixer, a colloid mill, a high pressure homogenizer, and the like.
Immediately before use, the platinum-based catalyst of the component (F) is added and emulsified and dispersed again to produce the composition. Further, a chain-free organopolysiloxane as the component (a) and an MQ resin as the component (b) are reacted by heating and then the solvent is removed to obtain a solventless composition (c).
The emulsifier of the component and the water of the component (d) are added, and the resulting mixture is emulsified and dispersed using a high shear emulsification disperser such as a homomixer, a colloid mill or a high pressure homogenizer. It can be manufactured by adding an organic peroxide and emulsifying and dispersing again. There is no particular limitation on the apparatus such as an emulsifying machine and the manufacturing method used in this case, and it may be selected depending on the viscosity of the solventless composition which is a dispersoid.

When the silicone emulsion pressure-sensitive adhesive composition obtained by the production method of the present invention is applied to various substrates or structures and dried, a pressure-sensitive adhesive layer having excellent pressure-sensitive adhesive properties can be obtained. . In the case of a composition containing the components (A) to (F), this adhesive layer usually crosslinks at 100 to 130 ° C. for 1 to 3 minutes to obtain a high cohesive force, but when it cannot be heated, it gradually increases at room temperature over time. The curing progresses, and finally the cohesive force equivalent to that obtained by heat curing is obtained. In the case of the composition containing the components (a) to (e), the composition is crosslinked at 130 to 200 ° C. for 1 to 15 minutes, but it does not cure with time at room temperature.

[0017]

EXAMPLES The present invention will now be described in detail by way of examples, which should not be construed as limiting the invention. In addition,% in an example represents weight%. (Reference Example 1) Terminal hydroxy-blocked linear methyl vinyl polysiloxane (vinyl content 0.0003 mol / 100 g, viscosity 2400 c
S) MQ consisting of 200 g and (CH ₃ ) ₃ SiO _0.5 unit and SiO ₂ unit
Toluene solution of resin [(CH ₃ ) ₃ SiO _0.5 unit / SiO ₂ unit molar ratio = 0.85] was mixed with 300 g of solid content, reacted at 100 ° C. for 10 hours, then cooled and trimethylsilyl-blocked linear methyl hydrogen Polysiloxane (≡Si-H content 1.57 mol /
Toluene was added to give a silicone adhesive toluene solution so that the silicone content would be 40%. To 100 g of the obtained silicone adhesive toluene solution was added chloroplatinic acid.
0.8g of 0.5% isopropanol solution was added, thickness 25μm,
A polyimide film having a width of 20 mm was coated so that the dry film thickness was 30 μm, and then heated at 130 ° C. for 1 minute to produce a polyimide-based adhesive tape. Reference Example 2 All of the toluene was distilled off from the silicone pressure sensitive adhesive toluene solution prepared in Reference Example 1 to obtain a solventless silicone pressure sensitive adhesive, but it could not be coated because of its high viscosity.

Example 1 To 100 g of the solvent-free silicone adhesive obtained in Reference Example 2 was added 5 g of polyoxyethylene tridecyl ether and 100 g of water, and this was emulsified and dispersed by a homomixer to give a silicone emulsion adhesive. I
Got 100 g of the obtained silicone emulsion adhesive I
Then, 1 g of 0.5% isopropanol solution of chloroplatinic acid was added, and the mixture was emulsified and dispersed by a homomixer to obtain a curable silicone emulsion pressure-sensitive adhesive. Next, this curable silicone emulsion pressure-sensitive adhesive was applied and heated in the same manner as in Reference Example 1 to prepare a polyimide-based pressure-sensitive adhesive tape.

(Example 2) Terminal hydroxy-blocked linear methyl vinyl polysiloxane (vinyl content 0.0003 mol / 100)
g, viscosity 2400 cS) 100 g and linear dimethylvinylpolysiloxane blocked with dimethylvinylsilyl at the end (vinyl content 0.0007
Mol / 100 g, viscosity 920cS) 100g and (CH _{3) 3} SiO _0.5 units and
MQ resin consisting of SiO ₂ units [(CH ₃ ) ₃ SiO _0.5 unit / SiO ₂
A toluene solution with a unit molar ratio = 0.85] was mixed in a solid content of 300 g and reacted at 100 ° C for 10 hours, after which all of the toluene was distilled off and cooled, and the terminal trimethylsilyl-blocked linear methylhydrogenpolysiloxane (≡Si -H content 1.57 mol / 100
g) 0.4 g was added to obtain a solventless silicone adhesive. A silicone emulsion pressure-sensitive adhesive II was obtained from the obtained solventless silicone pressure-sensitive adhesive in the same manner as in Example 1. Further, a curable silicone emulsion pressure sensitive adhesive was obtained from the obtained silicone emulsion pressure sensitive adhesive II in the same manner as in Example 1. Next, this curable silicone emulsion pressure-sensitive adhesive was applied and heated in the same manner as in Reference Example 1 to prepare a polyimide-based pressure-sensitive adhesive tape.

(Example 3) MQ resin [(CH ₃ ) ₃ SiO _0.5 unit / SiO ₂ consisting of 100 g of terminal hydroxy-blocked linear methyl polysiloxane (viscosity 700 cS) and _0.5 (CH ₃ ) ₃ SiO and SiO ₂ units Unit molar ratio = 0.85] solid solution of toluene solution
After mixing 150 g and reacting at 100 ° C. for 10 hours to give a pressure-sensitive adhesive, all the toluene was distilled off to obtain a solventless silicone pressure-sensitive adhesive. A silicone emulsion pressure-sensitive adhesive III was obtained in the same manner as in Example 1 from the obtained solventless silicone pressure-sensitive adhesive. Furthermore, 100 g of the obtained silicone emulsion adhesive III
1 g of benzoyl peroxide was added to the mixture, and the mixture was emulsified and dispersed with a homomixer to obtain a curable silicone emulsion pressure-sensitive adhesive. Next, this curable silicone emulsion pressure-sensitive adhesive was applied in the same manner as in Reference Example 1 and heated at 200 ° C. for 5 minutes to prepare a polyimide-based pressure-sensitive adhesive tape.

The silicone emulsion adhesives I to III obtained in Examples 1 to 3 were subjected to the following tests. The results are shown in Table 1. <Emulsion viscosity> The viscosity at 25 ° C was measured with a BM type rotational viscometer. <Storage stability> 100 g of the emulsion was put in a glass bottle, allowed to stand at room temperature, and visually observed.

With respect to the adhesive tapes obtained in Reference Example 1 and Examples 1 to 3, tack, adhesive strength, cohesive strength, and heat resistance were measured by the following methods. The results are shown in Table 1. <Tack> Place the adhesive layer of the adhesive tape on the slope with an inclination angle of 30 ° and roll the steel ball (SUJ2 of JIS G-4805) from the running distance of 10 cm to cover the range of the adhesive layer. The maximum diameter (inch) of the steel ball that stops inside is shown (tilted ball tack measurement method). Measurement conditions are temperature 25 ± 2
℃, relative humidity 65 ± 5%. <Adhesive strength> The adhesive tape was pressure-bonded to a SUS304 plate by reciprocating once at a pressure-bonding speed of 300 mm / min using a roller (made of metal covered with a rubber layer having a thickness of about 6 mm and having a weight of 2000 ± 50 g). After leaving for 20 hours at 25 ± 2 ℃ and 65 ± 5% relative humidity, 300mm using Shimadzu Corporation autograph
The peeling force when peeled off in the 180 ° direction at a speed of / min was measured. <Cohesive strength> Just like the test piece for measuring the adhesive strength (adhesive area is length x width = 10 mm x 20 mm), they are stuck together, a load of 1 kg is applied to the lower end of this adhesive tape, and after hanging at room temperature for 30 minutes The deviation distance was read and measured with a microscope. <Heat resistance> Laminated in exactly the same way as the test piece for measuring the adhesive strength (adhesive area is length x width = 10 mm x 20 mm), put 1 kg of weight on the lower end of this adhesive tape, and put it in an oven at 100 ° C for 2 hours. The deviation distance after standing was read and measured with a microscope.

[0023]

[Table 1]

[0024]

The silicone emulsion pressure-sensitive adhesive composition obtained by the production method of the present invention does not contain an organic solvent and thus can be safely used even in a poor ventilation condition. Because of its viscosity, it can be easily applied to complicated uneven surfaces and curved surfaces by spray coating or the like.
In addition, since the organic solvent does not volatilize in the pressure-sensitive adhesive sheet manufacturing process and the like, safety measures and environmental measures are unnecessary, and workability is improved. In addition, it has become possible to apply it to substrates that are eroded by organic solvents, expanding its applications.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI C08L 83/07 C08L 83/07 (72) Inventor Isamu Moriizumi 1 Hitomi, Daiji, Matsuida-cho, Usui-gun, Gunma Shin-Etsu Chemical Co., Ltd. (56) Reference JP 64-45467 (JP, A) JP 2-58587 (JP, A) JP 3-17178 (JP, A) JP 6- 80949 (JP, A) JP-A-4-335083 (JP, A) JP-A-5-179598 (JP, A) JP-A-4-126787 (JP, A) JP-A-52-154856 (JP, A) JP 60-115661 (JP, A) JP 7-11228 (JP, A) JP 5-194930 (JP, A) JP 7-197008 (JP, A) JP 7-70542 (JP, A) Kunio Ito, Silicone Handbook, Nikkan Kogyo Shin Company, August 31, 1990, 647-649 (58) investigated the field (Int.Cl. ^7, DB name) C09J 183/00 - 201/10 C08L 83/00 - 101/16

Claims (2)

(57) [Claims] 1. A type selected from (A) an organopolysiloxane represented by the following general formula (1) and an organopolysiloxane represented by the general formula (2) having a viscosity at 25 ° C. of 1 × 10 ⁶ cS or less, or 100 parts by weight of an organopolysiloxane containing two or more kinds of alkenyl unsaturated groups in an average value of 0.0001 mol / 100 g or more; (However, in the formula, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group containing no alkenyl unsaturated group, n and l are 0 to 3 respectively.
, K and q are each 0 or a positive integer, j and p are each an integer of 100 or more, m is an integer of 0 to 10, and (B) R ² ₃ SiO _0.5 unit (provided that R ^{2 in} the formula is Is a monovalent hydrocarbon group) and SiO ₂ units, and 100 parts by weight of component (A) is an organic solvent solution of an organopolysiloxane having a molar ratio of R ² ₃ SiO _0.5 units / SiO ₂ units of 0.6 to 1.3. On the other hand, after mixing, heating and reacting with 100 to 200 parts by weight as a solid content, (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule is added to H / Vi. = 0.1 to 15 after mixing [where H is the number of moles of hydrogen atoms bonded to silicon atoms in the component (C) and Vi is the number of moles of all alkenyl groups in the component (A)] Then, the organic solvent is removed by distillation to remove the solvent, and then (D) the emulsifier (A) 1 to 30 parts by weight per 100 parts by weight of the total amount of the components (C) to (E) and 25 to about 100 parts by weight of the total amount of the components (A) to (C)
After 200 parts by weight was added and emulsified and dispersed, just before use, the platinum catalyst (F) was added to the total amount of the components (A) to (C) so as to be 1 to 5,000 ppm as platinum. Then, the method for producing a silicone emulsion pressure-sensitive adhesive composition comprising emulsifying and dispersing again. 2. (a) An organopolysiloxane represented by the following general formula (3) having a viscosity at 25 ° C. of 1 × 10 ⁶ cS or less. (However, R ³ in the formula is an unsubstituted or substituted monovalent hydrocarbon group, r
Is an integer of 100 or more) and (b) R ⁴ ₃ SiO _0.5 unit (however, R ^{4 in} the formula is a monovalent hydrocarbon group) and SiO ₂ unit. R ⁴ ₃ SiO _0.5 unit / SiO ₂ unit mol After heating and reacting an organic solvent solution of an organopolysiloxane having a ratio in the range of 0.6 to 1.3, the organic solvent is distilled off to make it solvent-free, and then (c) an emulsifier and (d) water are added to emulsify the mixture. A method for producing a silicone emulsion pressure-sensitive adhesive composition, which comprises dispersing (e) an organic peroxide (e) immediately before use and emulsifying and dispersing again.