JP3503740B2 - Anisotropic conductive adhesive and electronic device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electrical connection between minute circuits such as connection between LCD (liquid crystal display) and TCP (tape carrier package) and connection between TCP and PCB (printed circuit board). The present invention relates to an anisotropic conductive adhesive used.

[0002]

2. Description of the Related Art In recent years, LCD and TCP or TCP and PCB
The need for various fine circuit connections such as connection with the is dramatically increasing, and an anisotropic conductive adhesive in which conductive particles are dispersed in an adhesive resin has been used as the connection method. In this method, an anisotropic conductive adhesive is sandwiched between the members to be connected and heated and pressed to maintain electrical insulation between adjacent terminals in the plane direction and electrically conduct between the upper and lower terminals. . Anisotropic conductive adhesives have been frequently used for such applications because the adherend does not have heat resistance, and in a fine circuit, electrical shorts occur between adjacent terminals. The reason is that the connection method of cannot be applied.

This anisotropic conductive adhesive is classified into a thermoplastic type and a thermosetting type, but recently, an epoxy resin type thermosetting type which is more reliable than the thermoplastic type. Things are being widely used.

Regarding the thermoplastic type anisotropic conductive adhesive, SBS (styrene-butadiene-styrene), SI
Styrene-based copolymers such as S (styrene-isoprene-styrene) and SEBS (styrene-ethylene-butadiene-styrene) have been mainly used. The method of using these thermoplastic types is basically a melt fusion method,
The workability is generally considered to be better because it can be applied at a relatively low temperature and in a shorter time than thermosetting ones if conditions are selected, but the resin's moisture resistance, chemical resistance, etc. It was low and the connection reliability was low, so it could not withstand a long-term environmental test.

On the other hand, thermosetting type anisotropic conductive adhesives, which are currently the mainstream, are generally widely used as epoxy resin type thermosetting types having a good balance between storage stability and curability. However, in practice, these thermosetting types need to be heated and cured for about 30 seconds at a temperature of 150 to 200 ° C. from the viewpoint of curing reactivity in order to achieve both storage stability and curability of the resin. For example, 150 ℃
At the temperatures below, it was difficult to cure the resin within a practical connection time.

Further, regarding storage stability, for example, B
F ₃ amine complexes, dicyandiamide, organic acid hydrazides, systems containing latent curing agents such as imidazole compounds have been proposed, but those with excellent storage stability require a long time or high temperature for curing, On the contrary, there is a problem that the one that can be cured at a low temperature in a short time has poor storage stability, and both have advantages and disadvantages.

In addition to the above-mentioned problems, in connection workability of fine circuits using a thermosetting anisotropic conductive adhesive, what is once connected due to a cause of misalignment or the like is damaged or the connected member is damaged. There is a growing demand for peeling and rejoining (so-called repair) without damage. However, while most of them have advantages such as high adhesive strength and high reliability, it is extremely difficult to meet such seemingly contradictory requirements, and satisfactory ones have not been obtained.

In particular, recently, the LCD module has become larger in screen size, higher in definition, and narrower in frame rate.
The connection pitch has become finer and the connection has become narrower. For this reason, for example, in the connection between the LCD and the TCP, the connection pattern shifts due to the extension of the TCP at the time of connection, and the members inside the LCD are thermally affected by the temperature at the time of connection due to the narrow width of the connection portion. Problem has arisen. Further, in the connection between TCP and PCB, since the PCB has become longer, the PCB and the LCD warp due to the heating at the time of connection, causing a problem that the TCP wiring is disconnected.

Therefore, it has been considered to solve these problems by connecting at a lower temperature. For example, if a conventional thermoplastic type anisotropically conductive adhesive is used for connection, the temperature will be relatively low. Although connection is possible, there is a problem that connection reliability is poor because the resin has low moisture resistance and heat resistance. Also, when trying to connect at low temperature using an epoxy resin type anisotropic conductive adhesive which is the mainstream of thermosetting type, it is necessary to lengthen the connection time in order to cure the resin, and it is not practically applicable. There wasn't.

An anisotropic conductive adhesive capable of low temperature connection, in which conductive particles are dispersed in an adhesive resin containing a cationically polymerizable substance and a sulfonium salt (JP-A-7-90237). Also, a method in which conductive particles are dispersed in an epoxy resin or the like and a 4- (dialkylamino) pyridine derivative (JP-A-4-189883) has been proposed, but the storage stability of the adhesive resin and the connected circuit terminal It has not been put to practical use due to problems such as corrosion.

Also, as a means for enabling low temperature connection,
In a thermosetting anisotropic conductive adhesive in which conductive particles are dispersed in a resin composition containing a radical polymerizable resin, an organic peroxide, a thermoplastic elastomer, maleimide, etc., the radical polymerizable resin is a phenolic hydroxyl group. Anisotropic conductive adhesive characterized by being a (meth) acryloylated novolak resin having the above, and further addition of an aminosilane coupling agent for the purpose of improving adhesiveness and connection reliability have been proposed. However, a resin system that satisfies all of curability, workability, adhesiveness after high-temperature and high-humidity treatment, connection reliability, storability, etc. has not been obtained. Therefore, it can be connected at a lower temperature in a shorter time, and the adhesiveness, connection reliability,
There is an increasing demand for anisotropic conductive adhesives that have excellent storage stability and repairability.

[0012]

SUMMARY OF THE INVENTION The present invention is an LCD and a T.
In electrical connection between minute circuits such as connection with CP and connection between TCP and PCB, connection at low temperature and short time is also possible, and adhesion, connection reliability, storage stability, and repairability are achieved. Another object of the present invention is to provide an excellent heat-curable anisotropic conductive adhesive.

[0013]

DISCLOSURE OF THE INVENTION The present invention provides a radically polymerizable resin (A), an organic peroxide (B), a thermoplastic elastomer (C), and a phosphoric ester (D) represented by the formula (1). ), An anisotropic conductive adhesive containing conductive particles in an adhesive resin composition containing the epoxysilane coupling agent (E) represented by the formula (2) and / or the formula (3) as an essential component, As the radically polymerizable resin, the general formula UA-1 to UA-7
An anisotropic conductive adhesive using a urethane acrylate represented by any of the above.

[Chemical 6]

[Chemical 7]

[Chemical 8]

[0014]

[Chemical formula 9]

[Chemical formula 10]

Further, it is an electronic device in which electronic / electrical parts are electrically joined by using the anisotropic conductive adhesive according to claim 1. More preferably, the electronic / electrical device is a semiconductor element, a semiconductor device, a printed circuit board, a liquid crystal display (LCD) panel, a plasma display panel (PDP), or an electroluminescence (E).
L) panel, field emission display (F
ED) panel, is a tape carrier package, the electronic device is an image display module, computer, TV,
Electronic devices that are measuring devices and communication devices.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The anisotropic conductive adhesive of the present invention comprises a radically polymerizable resin, an organic peroxide, a thermoplastic elastomer, and a phosphoric ester represented by the formula (1), (2).
In the anisotropic conductive adhesive containing conductive particles in the resin composition containing the epoxysilane coupling agent represented by the formula and / or formula (3) as an essential component, the radical polymerizable resin is urethane acrylate. Is characterized by.

This anisotropic conductive adhesive is a phosphoric ester adhesive represented by the formula (1) when different materials such as TCP and PCB or LCD and TCP are connected in the connection use in LCD manufacturing. Coupling action between the resin and the metal part of the adherend (TCP, PCB, etc.),
In addition to the coupling action between the adhesive resin of the epoxy silane coupling agent represented by the formulas (2) and (3) and the metal part of the adherend, urethane acrylate has flexibility of a cured product due to its ether bond. And the adhesiveness due to urethane bond, and the phosphoric acid acrylate represented by the formula (1) and urethane acrylate are copolymerized to obtain a cured product having more excellent heat resistance. It has excellent adhesive strength and connection reliability that could not be obtained.

Further, since the thermoplastic elastomer is present in the cured product, it can be easily removed from the adherend by selecting an appropriate solvent, so that the repair work is easy. Further, among the urethane acrylates, when a bifunctional urethane acrylate having a diisocyanate structure and a polyol structure represented by the general formula (4) is used, the curability, the adhesiveness, and the flexibility are excellent.

[Chemical formula 11]

In particular, those having an isophorone diisocyanate structure of the formula (5) and a polybutylene glycol structure of the formula (6) in the repeating unit have flexibility and adhesion of the cured product due to the asymmetric structure and a suitable distance between ether bonds. The balance of properties is TCP, PCB and L in LCD manufacturing.
The present invention has been found to be capable of high-strength and highly reliable connection because it is optimal for connection between different materials such as CD and TCP.

[Chemical formula 12]

The urethane acrylate used in the present invention is one having at least one or more (meth) acryloyloxy group in the molecule and at least one or more urethane bond in the molecule. Examples of such compounds include compounds obtained by reacting a compound having two or more alcoholic hydroxyl groups with a diisocyanate compound and a (meth) acrylate having an alcoholic hydroxyl group, or a compound having a diisocyanate compound and an alcoholic hydroxyl group (meth ) A compound obtained by reacting with an acrylate can be mentioned.

Examples of the diisocyanate compound include tolylene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, etc. Among them, isophorone diisocyanate can be preferably used.

Examples of the compound having two or more alcoholic hydroxyl groups include ethylene glycol, propylene glycol, 1,3-butanediol, 1,6-hexanediol, 1,4-cyclohexanediol and bis (2-hydroxyethyl) terephthalate. Polyhydric alcohols such as trimethylolethane and trimethylolpropane, and polyols such as polyethylene glycol, polypropylene glycol, polybutylene glycol or copolymers of ethylene glycol and propylene glycol, and copolymers of ethylene glycol and butylene glycol can be used. . Among these, polyols are preferably used, and polybutylene glycol or a polyol having a polybutylene glycol structure in the molecule is more preferably used.

As the (meth) acrylate having a hydroxyl group, ethylene glycol mono (meth) acrylate,
Examples thereof include propylene glycol mono (meth) acrylate, diethylene glycol mono (meth) acrylate, glycerin di (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol tri (meth) acrylate and the like.

Further, in order to ensure its storage stability, it is possible to add a polymerization inhibitor such as quinones, polyhydric phenols and phenols in advance (for example, JP-A-4-
No. 146951, etc.). Further, in order to improve curability, fluidity during heating, and workability, acrylates such as trimethylolpropane triacrylate (TMPTA), pentaerythritol diallylate monostearate, tetraethylene glycol diacrylate, pentaerythritol tetraacrylate, and styrene. It is also possible to use it after diluting it with various monomers and general reactive diluents.

The organic peroxide used in the present invention is not particularly limited, and for example, 1,1,3,3-
Tetramethylbutylperoxy-2-ethylhexanate, t-butylperoxy-2-ethylhexanate,
t-hexylperoxy-2-ethylhexanate,
1,1-bis (t-butylperoxy) -3,3,5-
Examples thereof include trimethylcyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, bis (4-t-butylcyclohexyl) peroxydicarbonate and the like. These peroxides may be used alone or as a mixture of two or more kinds of organic peroxides in order to control the curability. Further, various polymerization inhibitors may be added in advance in order to improve the storage stability. Further, it may be diluted with a solvent or the like and used to facilitate the work of dissolving it in the resin. It goes without saying that the type and blending amount of the organic peroxide used in the present invention are determined in consideration of the curability and the storage stability of the adhesive when blending each peroxide.

The thermoplastic elastomer used in the present invention is not particularly limited, but examples thereof include polyester resins, polyurethane resins, polyimide resins, polybutadiene, polypropylene, styrene-butadiene-styrene copolymers, polyacetal resins and polyvinyl butyral resins. , Butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-methacrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, polyvinyl acetate resin, nylon, styrene-isoprene copolymer, styrene -Butylene-styrene block copolymer,
Styrene-ethylene-butylene-styrene block copolymer, polymethylmethacrylate resin, etc. can be used. Among them, considering properties such as adhesiveness and connection reliability when used as an anisotropic conductive adhesive, acrylonitrile-butadiene-methacrylic acid copolymer, polyester,
Polyamide resin, nylon, polyvinyl butyral resin, styrene-ethylene-butylene-styrene block copolymer and the like can be more preferably used.

The phosphoric acid ester in the present invention (1)
It is not particularly limited as long as it is represented by the formula,
You may use it individually or in mixture of 2 or more types. Specifically, as the phosphoric acid ester, (meth) acryloyloxyethyl acid phosphate, (meth) acryloyloxypropyl acid phosphate, (meth) acryloyloxyisopropyl acid phosphate, (meth) acryloyloxypolyoxyethylene glycol acid phosphate , (Meth) acryloyloxypolyoxypropylene glycol acid phosphate,
Examples thereof include caprolactone-modified (meth) acryloyloxyethyl acid phosphate, di (meth) acryloyloxypropyl acid phosphate, and di [caprolactone-modified (meth) acryloyloxyethyl] acid phosphate.

The epoxysilane coupling agent used in the present invention is not limited as long as it is represented by the formulas (2) and (3), and may be used alone or in combination of two or more kinds. Specifically, as the epoxy silane coupling agent, β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4epoxycyclohexyl) ethyltriethoxysilane, β- (3,4epoxycyclohexyl) ethyl Dimethoxymethylsilane, β
-(3,4 epoxycyclohexyl) ethylmethoxydimethylsilane, β- (3,4 epoxycyclohexyl)
Ethyldiethoxyethylsilane, β- (3,4 epoxycyclohexyl) ethylethoxydiethylsilane, γ-
Glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethoxydimethylsilane, γ-glycidoxypropylethyldiethoxysilane, γ -Glycidoxypropylethoxydiethylsilane and the like.

Phosphate ester (D) represented by the formula (1)
The blending amount of {(D)} / {(A) + (B) + (C)} = (0.1
50) / 100 is preferable. If the blending amount is less than 0.1 parts by weight, the coupling effect cannot be obtained and sufficient adhesive force cannot be obtained, and if the blending amount exceeds 50 parts by weight, curability and storage stability are deteriorated. Such a problem occurs.

The phosphoric acid ester (D) represented by the formula (1) and the epoxysilane coupling agent (E) represented by the formulas (2) and (3) are blended in a weight ratio of {(D ) + (E)} / {(A) + (B) + (C)} =
More preferably, it is (0.1-20) / 100. If the blending amount is less than 0.1 parts by weight, the coupling effect cannot be obtained and sufficient adhesive force cannot be obtained, and if the blending amount exceeds 20 parts by weight, curability and storage stability are deteriorated. Such a problem occurs.

Phosphate ester (D) represented by the formula (1)
The mixing ratio of the epoxysilane coupling agent (E) represented by the formulas (2) and (3) is preferably (D) / (E) = 90/10 to 10/90 by weight. The ratio of phosphate ester (D) is 9
When it exceeds 0/10, the pH of the resin composition decreases, which causes a problem of deterioration in storage stability. Also, 10
If it is less than / 90, a sufficient coupling effect cannot be obtained and the adhesive strength deteriorates.

The conductive particles used in the present invention are not particularly limited as long as they have conductivity, and various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold are used. Metal alloys, metal oxides, carbon, graphite, glass, ceramics, plastic particles, and the like whose surface is coated with a metal are applicable. The particle size, material, and compounding amount of these conductive particles can be appropriately selected depending on the pitch and pattern of the circuit to be connected, the thickness and material of the circuit terminal, and the like.

Further, the anisotropic conductive adhesive of the present invention is used for electronic devices such as semiconductor elements, semiconductor devices, printed circuit boards, flexible printed circuit boards, liquid crystal display panels, PDP panels, EL panels, FED panels, tape carrier packages and the like. -It can be used for electrical connection of electrical parts, and various image display modules (LC
D, PDP, EL, FED, etc.), computers, televisions, measuring devices, communication devices, and other electronic devices. By using these, the electronic devices can be made smaller, lighter, and easier to manufacture. At the same time, it also achieves the ease of repair.

[0034]

EXAMPLES The present invention will be described below with reference to Examples and Comparative Examples. <Evaluation Method> The evaluation samples and evaluation methods used in Examples and Comparative Examples are shown below. 1. Evaluation sample Adherend A: Copper foil / polyimide = 25/75 μm 0.5
TCP plated with μm tin (pitch 0.3 mm, number of terminals 60) Substrate B: 0.8 mm thick 4-layer board (FR-4) inner / outer layer copper foil 18 μm flash gold-plated PCB (pitch 0.3)
mm, 60 terminals)

2. Adhesive Strength Evaluation Method The adherend A and the adherend B were adhered under the conditions of 130 ° C., 30 kg / cm ² , and 15 s, and evaluation was performed by a 90 ° peel test.

3. Connection reliability (heat resistance / moisture resistance) evaluation method Adhesives A and B were adhered under the conditions of 130 ° C., 30 kg / cm ² , and 15 s, immediately after sample preparation and at a temperature of 85.
The connection resistance after standing for 500 hours at 85 ° C. and 85% humidity was measured. Those that could not be measured were regarded as poor conduction (OPEN).

4. Storability evaluation method After storing the anisotropic conductive adhesive in an atmosphere of 25 ° C for 2 weeks, 1
Under the conditions of 30 ° C., 30 kg / cm ² , and 15 s, the adherends A and B were adhered to each other and the connection resistance was measured. .

<Example 1> As a radically polymerizable resin,
340 parts by weight of a 50% solution of a urethane acrylate represented by the formula UA-1 obtained by reacting pentaerythritol triacrylate and hexamethylene diisocyanate in methyl ethyl ketone, 1,1,3,3 as an organic oxide. 5 parts by weight of, -tetramethylbutyl peroxyhexanoate, 500 parts by weight of a 20% solution of acrylonitrile-butadiene-methacrylic acid copolymer dissolved in methyl ethyl ketone as a thermoplastic elastomer, and caprolactane modified as a phosphoric ester (meth) 5 parts by weight of acryloyloxyethyl acid phosphate and 1.5 parts of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane as an epoxysilane coupling agent.
By weight, 7 parts by weight of Ni / Au-plated polystyrene particles (average particle size 5 μm) as conductive particles are mixed and uniformly dispersed, and then the thickness after drying on a polyethylene terephthalate film subjected to mold release treatment. After casting and drying so as to have a thickness of 45 μm, slitting was performed to obtain an anisotropic conductive adhesive having a width of 2 mm. Using this, evaluation was performed according to the method described above.

[Chemical 13]

[Table 1]

<Examples 2 to 13> Anisotropic conductive adhesives were obtained in the same manner as in Example 1 with the compounding ratios shown in Tables 2 and 3.
Using this, the same evaluation as in Example 1 was performed.

[Table 2]

[Table 3]

Example 14 The same as Example 1 except that urethane acrylate represented by the formula UA-2 obtained by reacting pentaerythritol dimethacrylate with tolylene diisocyanate was used as the radically polymerizable resin. Then, an anisotropic conductive adhesive was obtained and evaluated in the same manner.

Example 15 Example 1 was repeated except that urethane acrylate represented by the formula UA-3 obtained by reacting pentaerythritol dimethacrylate with isophorone diisocyanate was used as the radically polymerizable resin.
An anisotropic conductive adhesive was obtained in the same manner as above and evaluated in the same manner. <Example 16> An anisotropic conductive adhesive was obtained in the same manner as in Example 1 except that pentaerythritol triacrylate and tolylene diisocyanate UA-4 were used as the radically polymerizable resin. It evaluated similarly.

[Chemical 14]

Example 17 As a radically polymerizable resin, UA-obtained by reacting propylene glycol monomethacrylate and hexamethylene diisocyanate.
An anisotropic conductive adhesive was obtained and evaluated in the same manner as in Example 1 except that the bifunctional urethane acrylate represented by the formula 5 was used. <Example 18> U obtained by reacting ethylene glycol, hexamethylene diisocyanate, and ethylene glycol monomethacrylate as a radically polymerizable resin
An anisotropic conductive adhesive was obtained and evaluated in the same manner as in Example 1 except that the bifunctional urethane acrylate represented by the formula A-6 was used.

[Chemical 15]

Example 19 A repeating unit R1 in the formula (4) obtained by reacting butylene glycol, isophorone diisocyanate and butylene glycol monomethacrylate as a radically polymerizable resin has an isophorone diisocyanate structure and has a repeating structure. An anisotropic conductive adhesive was obtained and evaluated in the same manner as in Example 1 except that a bifunctional urethane acrylate (UA-7 formula) in which the unit R2 had a polybutylene glycol structure was used.

<Comparative Examples 1 to 3> With the compounding ratios shown in Table 4,
An anisotropic conductive adhesive was obtained in the same manner as in Example 1. Using this, the same evaluation as in Example 1 was performed.

[Table 4] <Comparative Example 4> An anisotropic conductive adhesive was obtained and evaluated in the same manner as in Example 1 except that a vinyl ester resin having a structure of formula (7) was used as the radically polymerizable resin.

[Chemical 16]

Comparative Example 5 An anisotropic conductive adhesive was obtained in the same manner as in Example 1 except that the bismaleimide resin having the structure of formula (8) was used as the radically polymerizable resin.
It evaluated similarly.

[Chemical 17] <Comparative Example 6> An anisotropic conductive adhesive was obtained and evaluated in the same manner as in Example 1 except that an amine-modified bismaleimide resin having a structure of formula (9) was used as the radically polymerizable resin.

[Chemical 18]

<Embodiment 20> A driver I for driving a panel using the anisotropic conductive adhesive of Embodiment 1 in a liquid crystal display for a 15-inch personal computer.
A tape carrier package having C mounted thereon and a printed circuit board having signal processing circuit components mounted thereon were connected. The width of the anisotropic conductive adhesive is 2 mm, and the pressure bonding condition is 140 ° C x 30
It was carried out at kg / cm ² × 20 sec. After that, a display test as a liquid crystal display for a computer was performed and it was confirmed that there was no problem. Furthermore, the above-mentioned connecting portion is 100
After the TCP was peeled off by heating at ℃ and the anisotropic conductive adhesive was removed, the adhesive part was washed with methyl ethyl ketone, and TCP was connected again using a new anisotropic conductive adhesive, and the display test was performed. There was no

<Comparative Example 7> The same test as in Example 20 was conducted except that the anisotropic conductive adhesive of Comparative Example 1 was used. There was no problem in the display test immediately after connection, but TC
Since the adhesive force between P and the printed circuit board was weak, a defect of peeling the adhesive portion occurred during the assembly work. Also, in the vibration shock test, the TCP and the printed circuit board were peeled off.

[0048]

By using the anisotropic conductive adhesive of the present invention, fine circuit electrodes can be connected at a low temperature of about 130 ° C., and workability, adhesiveness, long-term reliability and storage stability can be achieved. An anisotropic conductive adhesive having excellent repairability can be obtained.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H05K 3/32 H05K 3/32 B (56) References JP-A-10-195403 (JP, A) JP-A-9-169958 ( JP, A) JP 7-292048 (JP, A) JP 10-269853 (JP, A) Katsutoshi Ando, Relationship between Acrylate Resin Structure and Bonding Strength, Proceedings of the Network Polymer Conference, 1998 Year, Vol. 48, pp. 13-16 (58) Fields investigated (Int.Cl. ⁷ , DB name) C09J 175/16 C08F 290/06 H01B 1/20-1/24 H01B 5/16 C09J 4 / 00-4/06 H05K 3/32-3/34

Claims (4)

(57) [Claims] 1. A radically polymerizable resin (A), an organic peroxide (B), a thermoplastic elastomer (C), and (1).
Phosphate ester (D) represented by the formula, formula (2) and /
Alternatively, in the anisotropic conductive adhesive containing conductive particles in the adhesive resin composition composed of the epoxysilane coupling agent (E) represented by the formula (3), a radical polymerizable resin is used.
An anisotropic conductive adhesive characterized by using the urethane acrylate represented by any one of formulas UA-1 to UA-7 . [Chemical 1] [Chemical 2] [Chemical 3] [Chemical 4] [Chemical 5] 2. An electronic device in which electronic / electrical parts are electrically joined using the anisotropically conductive adhesive according to claim 1. 3. The electronic / electrical component is a semiconductor element, a semiconductor device, a printed circuit board, a liquid crystal display (LC).
D) panel, plasma display panel (PDP),
The electronic device according to claim 2, which is an electroluminescence (EL) panel, a field emission display (FED) panel, or a tape carrier package. Wherein the electronic device is an image display module, computer, television, instrumentation, claim 2 which is a communication device
Electronic device described.