JP3489926B2 - High frequency circuit device - Google Patents

High frequency circuit device

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Publication number
JP3489926B2
JP3489926B2 JP30923895A JP30923895A JP3489926B2 JP 3489926 B2 JP3489926 B2 JP 3489926B2 JP 30923895 A JP30923895 A JP 30923895A JP 30923895 A JP30923895 A JP 30923895A JP 3489926 B2 JP3489926 B2 JP 3489926B2
Authority
JP
Japan
Prior art keywords
frequency signal
ground potential
high frequency
wire
frequency circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30923895A
Other languages
Japanese (ja)
Other versions
JPH09148524A (en
Inventor
佳弘 野谷
隆幸 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP30923895A priority Critical patent/JP3489926B2/en
Priority to DE1996141875 priority patent/DE19641875C2/en
Publication of JPH09148524A publication Critical patent/JPH09148524A/en
Application granted granted Critical
Publication of JP3489926B2 publication Critical patent/JP3489926B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • General Physics & Mathematics (AREA)
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  • Wire Bonding (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、高周波回路装置に
関し、特に高周波回路要素間をワイヤにより接続してな
る高周波回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit device, and more particularly to a high frequency circuit device in which high frequency circuit elements are connected by wires.

【０００２】[0002]

【従来の技術】従来のベース基板上に二つの高周波半導
体チップ素子をダイボンディングし、これらの素子間を
高周波信号ワイヤにより接続した高周波回路装置の断面
図，及び上面図をそれぞれ図２５，図２６に示す。高周
波半導体チップ素子６１は、半導体基板表面に、目的に
応じてＦＥＴ，抵抗，キャパシタ等が配置されたＩＣ
（集積回路）パターン５，上記高周波信号ワイヤ２をボ
ンディングするための高周波信号ボンディングパッド
４，及び高周波信号を伝達するための高周波伝送線路６
を設けてなる高周波回路要素である。ここで高周波伝送
線路６においては、所望の特性インピーダンスが得られ
るように、半導体基板の誘電率，厚み，及び線路の幅な
どが設定されている。また、高周波信号ワイヤ２は、高
周波半導体チップ素子６１の高周波信号ボンディングパ
ッド４にワイヤボンディングされており、これらのボン
ディングパッド４の間で高周波信号を伝達するためのも
のである。また、半導体チップ素子６１は、半田等のダ
イボンディング材３によって、キャリアあるいはパッケ
ージのベースメタルであるベース基板２０に取り付けら
れている。25 and 26 are a cross-sectional view and a top view of a high-frequency circuit device in which two high-frequency semiconductor chip elements are die-bonded on a conventional base substrate and these elements are connected by a high-frequency signal wire. Shown in. The high frequency semiconductor chip element 61 is an IC in which FETs, resistors, capacitors, etc. are arranged on the surface of a semiconductor substrate according to the purpose.
(Integrated circuit) pattern 5, high frequency signal bonding pad 4 for bonding the high frequency signal wire 2 and high frequency transmission line 6 for transmitting a high frequency signal
Is a high-frequency circuit element. Here, in the high frequency transmission line 6, the permittivity, thickness, line width, etc. of the semiconductor substrate are set so that a desired characteristic impedance is obtained. Further, the high frequency signal wire 2 is wire-bonded to the high frequency signal bonding pad 4 of the high frequency semiconductor chip element 61, and is for transmitting a high frequency signal between these bonding pads 4. The semiconductor chip element 61 is attached to the base substrate 20 which is the base metal of the carrier or the package by the die bonding material 3 such as solder.

【０００３】図２７は従来の高周波半導体チップ素子が
パッケージに実装されてなる高周波回路装置を示す上面
図である。この図においては、図２５，図２６と同一部
分には同一符号を付している。パッケージ７０は、金属
または表面に金属膜が形成されたセラミック基板等から
なるベース基板２０と、この基板２０上に設けられた下
層セラミック枠体２１，及びこの下層セラミック枠体２
１上に設けられた上層セラミック枠体２２とからなるも
のである。上層セラミック枠体２２上には、通常パッケ
ージ７０内を気密封止するための蓋が接着されている
が、この図ではその図示を省略している。下層セラミッ
ク枠体２１の表面上には、上層セラミック枠体２２の内
側と外側（すなわちパッケージ７０の内側と外側）の間
で高周波信号の伝達を行うためのパッケージ側伝送線路
９が、上層セラミック枠体２２の下を通って設けられて
おり、そのパッケージ内の部分はボンディングパッドと
しても用いることが可能である。このパッケージ側伝送
線路９においても高周波信号を伝送するため所望の線路
特性インピーダンスが得られるように、下層セラミック
枠体２１の誘電率，厚み，線路の幅などが設定されてい
る。ベース基板２０上には、上記の高周波半導体チップ
素子６１と、アルミナセラミック基板などにメッキ等を
用いて金属膜からなる高周波伝送線路６を形成してなる
高周波信号伝送用スルー線路６８が半田などによりダイ
ボンディングされている。このスルー線路６８において
も、高周波信号を伝送するため線路の特性インピーダン
スが所望の値となるように、アルミナセラミック基板の
誘電率，厚み，線路の幅などが設定されている。図２７
に示した例では、高出力を得るため、二つの高周波半導
体チップ素子６１を直列に配置し、さらにパッケージの
内部寸法にこれら二つの素子の長さを合わせるためのス
ルー線路６８が設けられ、そしてこれらの素子６１間、
素子６１とスルー線路６８の間、及びスルー線路６８と
パッケージ７０の間、素子６１とパッケージ７０の間の
電気的な接続をボンディングワイヤ２によって行ってい
る。ここでは簡易化のため、高周波信号ワイヤ２による
高周波信号線路の接続についてのみ図示し、バイアス端
子等を接続するボンディングワイヤの図示は省略してい
る。さらに、スルー線路６８はここでは上記のように長
さ調整のために用いているが、たとえば入出力のインピ
ーダンス整合回路として用いる場合もある。FIG. 27 is a top view showing a high frequency circuit device in which a conventional high frequency semiconductor chip element is mounted in a package. In this figure, the same parts as those in FIGS. 25 and 26 are designated by the same reference numerals. The package 70 includes a base substrate 20 made of a metal or a ceramic substrate having a metal film formed on the surface thereof, a lower layer ceramic frame 21 provided on the substrate 20, and the lower layer ceramic frame 2.
The upper layer ceramic frame 22 is provided on the upper surface of the first layer. A lid for hermetically sealing the inside of the package 70 is usually adhered to the upper ceramic frame body 22, but the illustration is omitted in this figure. On the surface of the lower ceramic frame body 21, the package side transmission line 9 for transmitting a high frequency signal between the inside and the outside of the upper ceramic frame body 22 (that is, the inside and the outside of the package 70) is provided. It is provided under the body 22, and the part in the package can be used also as a bonding pad. In this package side transmission line 9 as well, the dielectric constant, thickness, line width, etc. of the lower layer ceramic frame 21 are set so that a desired line characteristic impedance is obtained for transmitting a high frequency signal. On the base substrate 20, the high frequency semiconductor chip element 61 and the high frequency signal transmission through line 68 formed by forming a high frequency transmission line 6 made of a metal film on an alumina ceramic substrate or the like by soldering or the like. It is die-bonded. Also in this through line 68, the dielectric constant, the thickness, the width of the line, etc. of the alumina ceramic substrate are set so that the characteristic impedance of the line for transmitting a high frequency signal becomes a desired value. FIG. 27
In the example shown in FIG. 2, two high frequency semiconductor chip elements 61 are arranged in series in order to obtain a high output, and a through line 68 for adjusting the lengths of these two elements to the internal dimensions of the package is provided, and Between these elements 61,
The bonding wire 2 electrically connects the element 61 and the through line 68, between the through line 68 and the package 70, and between the element 61 and the package 70. Here, for simplification, only the connection of the high-frequency signal line with the high-frequency signal wire 2 is shown, and the bonding wire for connecting the bias terminal and the like is omitted. Further, although the through line 68 is used here for adjusting the length as described above, it may be used as an input / output impedance matching circuit, for example.

【０００４】[0004]

【発明が解決しようとする課題】上記の図２７に示され
た従来の高周波回路装置におけるパッケージ内部での高
周波信号は、パッケージ側線路９、高周波信号ワイヤ
２、高周波信号伝送用スルー線路６８、高周波信号ワイ
ヤ２、高周波半導体チップ素子６１上の高周波伝送線路
６、高周波信号ワイヤ２、高周波半導体チップ素子６１
上の高周波伝送線路６、高周波信号ワイヤ２、パッケー
ジ側伝送線路９の順に伝送されていく。ここでパッケー
ジ側伝送線路９、スルー線路６８、高周波半導体チップ
素子６１上の高周波伝送線路６は、前述のように線路の
特性インピーダンスを所望の値とすることが可能で、通
常これは５０Ωになっている。一方、高周波信号ワイヤ
２の部分では特性インピーダンスの制御が不可能なた
め、この部分でインピーダンスの不整合がおこり、高周
波信号の反射損失が増加する。たとえば、長さ４ｍｍの
高周波信号伝送用スルー線路６８を両端間の距離が７５
〜１００μｍとなるように２ヶ並べその間を直径２５μ
ｍのＡｕワイヤで接続し、これらのスルー線路６８の上
記高周波信号ワイヤが接続されていない端の間で高周波
信号の減衰量を測定した結果を図２８に示す。この図か
らわかるように、この試料では高周波信号ワイヤでのイ
ンピーダンス不整合により、高周波信号の減衰量は１０
ｄＢを越えている。このように従来の図２７に示したよ
うな高周波回路装置においては、高周波信号ワイヤ２で
のインピーダンス不整合により、高周波半導体チップ素
子１の性能を最大限に引き出すことができないという問
題があった。The high-frequency signal inside the package in the conventional high-frequency circuit device shown in FIG. 27 is generated by the package side line 9, the high-frequency signal wire 2, the high-frequency signal transmission through line 68, and the high-frequency signal. Signal wire 2, high-frequency transmission line 6 on high-frequency semiconductor chip element 61, high-frequency signal wire 2, high-frequency semiconductor chip element 61
The upper high-frequency transmission line 6, the high-frequency signal wire 2, and the package-side transmission line 9 are transmitted in this order. Here, the package-side transmission line 9, the through line 68, and the high-frequency transmission line 6 on the high-frequency semiconductor chip element 61 can set the characteristic impedance of the line to a desired value as described above, and normally this is 50Ω. ing. On the other hand, since the characteristic impedance cannot be controlled in the portion of the high frequency signal wire 2, impedance mismatch occurs in this portion, and the reflection loss of the high frequency signal increases. For example, a through line 68 for high frequency signal transmission having a length of 4 mm is used, and the distance between both ends is
Two pieces are arranged to be ~ 100 μm and the diameter between them is 25 μm.
FIG. 28 shows a result of measuring the attenuation amount of the high frequency signal between the ends of the through lines 68 to which the high frequency signal wires are not connected, which are connected by the Au wires of m. As can be seen from this figure, in this sample, the amount of attenuation of the high frequency signal was 10 due to the impedance mismatch in the high frequency signal wire.
It is over dB. As described above, in the conventional high-frequency circuit device as shown in FIG. 27, there is a problem that the performance of the high-frequency semiconductor chip element 1 cannot be maximized due to the impedance mismatch in the high-frequency signal wire 2.

【０００５】この発明は、上記の問題に鑑みなされたも
のであり、高周波信号ワイヤにおけるインピーダンス不
整合による高周波信号の減衰のない高周波回路装置を提
供することを目的とするものである。The present invention has been made in view of the above problems, and an object of the present invention is to provide a high-frequency circuit device in which the high-frequency signal is not attenuated due to impedance mismatch in the high-frequency signal wire.

【０００６】[0006]

【課題を解決するための手段】この発明（請求項１）に
係る高周波回路装置は、高周波信号ボンディングパッ
ド，及びこの高周波信号ボンディングパッドの両側に設
けられた接地電位ボンディングパッドを各々有する複数
の高周波回路要素と、隣接する二つの上記高周波回路要
素の間において上記高周波信号ボンディングパッドの間
を接続する高周波信号ワイヤと、これら二つの高周波回
路要素の間においてこの高周波信号ボンディングパッド
の両側に設けられた上記接地電位ボンディングパッドの
間を接続するこの高周波信号ワイヤに平行に設けられた
接地電位ワイヤと、その表面上に上記高周波回路要素が
設けられており、少なくとも上記高周波信号ワイヤ及び
上記接地ワイヤ直下の表面部分が接地電位である接地電
位基板と、上記接地電位基板と上記高周波信号ワイヤ及
び上記接地電位ワイヤとの間に設けられた樹脂からなる
誘電体とを備えたものである。A high frequency circuit device according to the present invention (claim 1) comprises a plurality of high frequency signals each having a high frequency signal bonding pad and ground potential bonding pads provided on both sides of the high frequency signal bonding pad. A circuit element, a high-frequency signal wire connecting between the high-frequency signal bonding pads between two adjacent high-frequency circuit elements, and both sides of the high-frequency signal bonding pad between the two high-frequency circuit elements. The ground potential wire provided in parallel with the high frequency signal wire connecting between the ground potential bonding pads and the high frequency circuit element on the surface thereof.
Is provided, and at least the high-frequency signal wire and
The surface of the ground wire directly below is the ground potential.
Board, the ground potential board, the high-frequency signal wire, and
And a resin provided between the ground potential wire and
And a dielectric .

【０００７】 また、この発明（請求項２）に係る高周
波回路装置は、高周波信号ボンディングパッド，及びこ
の高周波信号ボンディングパッドの両側に設けられた接
地電位ボンディングパッドを各々有する複数の高周波回
路要素と、隣接する二つの上記高周波回路要素の間にお
いて上記高周波信号ボンディングパッドの間を接続する
高周波信号ワイヤと、これら二つの高周波回路要素の間
においてこの高周波信号ボンディングパッドの両側に設
けられた上記接地電位ボンディングパッドの間を接続す
るこの高周波信号ワイヤに平行に設けられた接地電位ワ
イヤと、その表面上に上記高周波回路要素が設けられて
おり、少なくとも上記高周波信号ワイヤ及び上記接地ワ
イヤ直下の表面部分が接地電位である接地電位基板と、
上記接地電位基板と上記高周波信号ワイヤ及び上記接地
電位ワイヤとの間に設けられた高誘電率材料が混入され
た樹脂からなる誘電体とを備えたものである。A high frequency circuit device according to the present invention (claim 2) is a high frequency signal bonding pad, and
On the both sides of the high-frequency signal bonding pad of
Multiple high frequency circuits each having a ground potential bonding pad
Between the circuit element and the two adjacent high-frequency circuit elements above.
And connect between the high frequency signal bonding pads
Between the high-frequency signal wire and these two high-frequency circuit elements
On both sides of this high-frequency signal bonding pad.
Connect between the ground potential bonding pads
The ground potential wire parallel to the high-frequency signal wire
An ear and a ground potential substrate in which the high-frequency circuit element is provided on the surface of the ear, and at least the surface portion immediately below the high-frequency signal wire and the ground wire has a ground potential;
A high dielectric constant material provided between the ground potential substrate and the high frequency signal wire and the ground potential wire is mixed.
And a dielectric made of resin .

【０００８】 また、この発明（請求項３）に係る高周
波回路装置は、高周波信号ボンディングパッドを各々有
する複数の高周波回路要素と、隣接する二つの上記高周
波回路要素の間において、これら各高周波回路要素の高
周波信号ボンディングパッドの間を接続する高周波信号
ワイヤと、その表面上に上記高周波回路要素が設けられ
ており、少なくともこの高周波信号ワイヤ直下の表面部
分が接地電位である接地電位基板と、上記接地電位基板
と上記高周波信号ワイヤとの間に設けられた樹脂からな
る誘電体とを備えたものである。Further, a high-frequency circuit device according to the present invention (claim 3) includes a plurality of high-frequency circuit elements each having a high-frequency signal bonding pad, and between each of the two adjacent high-frequency circuit elements. A high-frequency signal wire connecting between the high-frequency signal bonding pads, and a high-frequency circuit element provided on the surface of the high-frequency signal wire; and a ground potential substrate having a ground potential at least on the surface immediately below the high-frequency signal wire; It is made of resin provided between the potential substrate and the high-frequency signal wire.
And a dielectric.

【０００９】 また、この発明（請求項４）に係る高周
波回路装置は、高周波信号ボンディングパッドを各々有
する複数の高周波回路要素と、隣接する二つの上記高周
波回路要素の間において、これら各高周波回路要素の高
周波信号ボンディングパッドの間を接続する高周波信号
ワイヤと、その表面上に上記高周波回路要素が設けられ
ており、少なくともこの高周波信号ワイヤ直下の表面部
分が接地電位である接地電位基板と、上記接地電位基板
と上記高周波信号ワイヤとの間に設けられた高誘電率材
料が混入された樹脂からなる誘電体とを備えたものであ
る。The high-frequency circuit device according to the present invention (claim 4) has high- frequency signal bonding pads, respectively.
Multiple high-frequency circuit elements and two adjacent high-frequency circuits
Between the high-frequency circuit elements,
High frequency signal High frequency signal connecting between bonding pads
A wire and the high frequency circuit element on the surface
And at least the surface part just below this high-frequency signal wire.
A ground potential substrate whose component is ground potential, and the above ground potential substrate
And a high dielectric constant material provided between the high frequency signal wire and
And a dielectric made of a resin mixed with a material.

【００１０】[0010]

【００１１】[0011]

【００１２】[0012]

【００１３】[0013]

【発明の実施の形態】実施の形態１． 構成１． この発明の実施の形態１における高周波回路装置は、図
１，２，３，４，５，または図７，８に示すように、高
周波信号ボンディングパッド（４，９），（９），及び
この高周波信号ボンディングパッド（４，９），（９）
の両側に設けられた接地電位ボンディングパッド（１
１，３１），（３２）を各々有する複数の高周波回ｓ路
要素（１，８），（１００）と、隣接する二つの上記高
周波回路要素（１，８），（１００）の間において上記
高周波信号ボンディングパッド（４，９），（９）の間
を接続する高周波信号ワイヤ（２），（１０２）と、こ
れら二つの高周波回路要素（１，８），（１００）の間
においてこの高周波信号ボンディングパッド（４，
９），（９）の両側に設けられた上記接地電位ボンディ
ングパッド（１１，３１），（３２）の間を接続するこ
の高周波信号ワイヤ（２），（１０２）に平行に設けら
れた接地電位ワイヤ（１２），（１１２）とを備えたも
のである。これにより、上記高周波信号ワイヤ（２），
（１０２）と上記接地電位ワイヤ（１２），（１１２）
とは、疑似的なコプレーナ型高周波伝送線路を構成する
こととなり、これらのワイヤの間の距離等を適切な値に
設定することにより、この伝送線路の特性インピーダン
スを、上記高周波回路要素（１，８），（１００）のイ
ンピーダンスと整合させることができる。このため、上
記高周波信号ワイヤ（２），（１０２）と上記高周波回
路要素（１，８），（１００）との間のインピーダンス
不整合に起因する高周波信号の減衰を防止することがで
きる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Configuration 1. Frequency circuit equipment in the first embodiment of the invention, as shown in FIGS. 1, 2, 3, 4 or 7 and 8, the high-frequency signal bonding pads (4,9), (9), and This high frequency signal bonding pad (4, 9), (9)
Ground potential bonding pads (1
1, 31) and (32) respectively, and a plurality of high frequency circuit elements (1, 8) and (100), and between the two adjacent high frequency circuit elements (1, 8) and (100). The high frequency signal wire (2), (102) connecting between the high frequency signal bonding pads (4, 9), (9) and the high frequency signal between these two high frequency circuit elements (1, 8), (100). Signal bonding pad (4,
9), the ground potential provided in parallel with the high frequency signal wires (2), (102) connecting between the ground potential bonding pads (11, 31), (32) provided on both sides of (9). It is provided with wires (12) and (112). Thereby, the high frequency signal wire (2),
(102) and the ground potential wires (12), (112)
Means that a pseudo coplanar type high frequency transmission line is constructed, and by setting the distance between these wires to an appropriate value, the characteristic impedance of this transmission line is changed to the above high frequency circuit element (1, It is possible to match the impedances of 8) and (100). Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wires (2) and (102) and the high frequency circuit elements (1, 8) and (100).

【００１４】構成２． この発明の実施の形態１における高周波回路装置は、図
１，２，３，４，５に示すように、上記の構成１の高周
波回路装置において、上記複数の高周波回路要素のうち
の少なくとも一つを、半導体チップからなる高周波半導
体チップ素子（１）である上記高周波回路要素を含むも
のとしたものである。これにより、上記高周波信号ワイ
ヤ（２）と上記接地電位ワイヤ（１２）とは上記のよう
に疑似的なコプレーナ型高周波伝送線路を構成すること
となり、高周波半導体チップ素子（１）の間を接続する
この伝送線路を高周波半導体チップ素子（１）にインピ
ーダンス整合させることができ、上記高周波信号ワイヤ
（２）の接続部分でのインピーダンス不整合に起因する
高周波信号の減衰を防止することができる。Structure 2. Frequency circuit equipment in the first embodiment of the invention, as shown in FIG. 1, 2, 3, 4, Oite high frequency circuit equipment configuration 1 described above, among the plurality of high-frequency circuit components At least one of the above includes the above-mentioned high-frequency circuit element which is a high-frequency semiconductor chip element (1) including a semiconductor chip. As a result, the high frequency signal wire (2) and the ground potential wire (12) form a pseudo coplanar high frequency transmission line as described above, and connect between the high frequency semiconductor chip elements (1). This transmission line can be impedance-matched with the high-frequency semiconductor chip element (1), and attenuation of the high-frequency signal due to impedance mismatch at the connection part of the high-frequency signal wire (2) can be prevented.

【００１５】構成３． この発明の実施の形態１における高周波回路装置は、図
７，８に示すように、上記の構成１の高周波回路装置に
おいて、上記複数の高周波回路要素のうちの少なくとも
一つを、半導体チップからなる高周波半導体チップ素子
（１０１）をパッケージの内側に設けてなる高周波半導
体パッケージ素子（１００）としたものである。これに
より、上記高周波信号ワイヤ（１０２）と上記接地電位
ワイヤ（１１２）とは上記のように疑似的なコプレーナ
型高周波伝送線路を構成することとなり、高周波半導体
パッケージ素子（１００）の間を接続するこの伝送線路
を高周波半導体パッケージ素子（１００）にインピーダ
ンス整合させることができ、上記高周波信号ワイヤ（１
０２）の接続部分でのインピーダンス不整合に起因する
高周波信号の減衰を防止することができる。Configuration 3. Frequency circuit equipment in the first embodiment of the invention, as shown in FIGS. 7 and 8, Oite <br/> high frequency circuit equipment configuration 1 mentioned above, at least of the plurality of high-frequency circuit components One is a high frequency semiconductor package element (100) in which a high frequency semiconductor chip element (101) made of a semiconductor chip is provided inside a package. As a result, the high frequency signal wire (102) and the ground potential wire (112) form a pseudo coplanar high frequency transmission line as described above, and connect between the high frequency semiconductor package elements (100). This transmission line can be impedance-matched to the high frequency semiconductor package element (100), and the high frequency signal wire (1
It is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch at the connection part of 02).

【００１６】実施例１．この発明の実施の形態１におけ
る一実施例について説明する。図１，図２，図３に本実
施例１による、ベース基板上に二つの高周波半導体チッ
プ素子を備え、これらの素子の間をワイヤで接続した高
周波回路装置の斜視図，側面図，上面図を示す。上記高
周波半導体チップ素子１は、ＧａＡｓ等からなる半導体
基板の表面に、ＩＣ（集積回路）パターン５，高周波信
号ボンディングパッド４，接地電位ボンディングパッド
１１，及び高周波信号を伝達するための高周波伝送線路
６を設けてなる高周波回路要素である。ただし、図１は
上記ワイヤ２，１２及びボンディングパッド４，１１の
近傍を拡大して示した図である。Example 1. An example of the first embodiment of the present invention will be described. 1, 2, and 3 are perspective views, side views, and top views of a high-frequency circuit device according to the first embodiment, which is provided with two high-frequency semiconductor chip elements on a base substrate and connects these elements with wires. Indicates. The high frequency semiconductor chip element 1 includes an IC (integrated circuit) pattern 5, a high frequency signal bonding pad 4, a ground potential bonding pad 11, and a high frequency transmission line 6 for transmitting a high frequency signal on a surface of a semiconductor substrate made of GaAs or the like. Is a high-frequency circuit element. However, FIG. 1 is an enlarged view showing the vicinity of the wires 2 and 12 and the bonding pads 4 and 11.

【００１７】上記ＩＣパターン５は、上記半導体基板上
に目的に応じてＦＥＴ（電界効果トランジスタ），抵
抗，キャパシタ等を配置したものである。また、高周波
伝送線路６において所望の特性インピーダンスが得られ
るように、半導体基板の誘電率，厚み，及び線路の幅な
どが設定されている。また、高周波信号ワイヤ２は、高
周波半導体チップ素子１の高周波信号ボンディングパッ
ド４にワイヤボンディングされており、二つの素子１の
これらのボンディングパッド４の間で高周波信号を伝達
するためのものである。さらに、接地電位ワイヤ１２
は、それぞれの素子１の接地電位ボンディングパッド１
１にワイヤボンディングされており、上記高周波信号ワ
イヤ２に平行に設けられている。なお、高周波信号ワイ
ヤ２，及び接地電位ワイヤ１２は直径２５μｍ程度のＡ
ｕワイヤからなり、これらのワイヤのワイヤボンディン
グは熱圧着法，超音波熱圧着法等を用いて行われる。The IC pattern 5 is formed by arranging FETs (field effect transistors), resistors, capacitors, etc. on the semiconductor substrate according to the purpose. Further, the permittivity, thickness, line width, etc. of the semiconductor substrate are set so that a desired characteristic impedance can be obtained in the high-frequency transmission line 6. The high-frequency signal wire 2 is wire-bonded to the high-frequency signal bonding pad 4 of the high-frequency semiconductor chip element 1, and is for transmitting a high-frequency signal between the bonding pads 4 of the two elements 1. Further, the ground potential wire 12
Is the ground potential bonding pad 1 of each element 1.
1 is wire-bonded and is provided in parallel with the high-frequency signal wire 2. The high-frequency signal wire 2 and the ground potential wire 12 are A with a diameter of about 25 μm.
U wires are used, and wire bonding of these wires is performed by using a thermocompression bonding method, an ultrasonic thermocompression bonding method, or the like.

【００１８】上記半導体チップ素子１は、半田等のダイ
ボンディング材３によって、キャリアあるいはパッケー
ジのベースメタルであるベース基板２０に取り付けられ
ている。ベース基板２０は、通常全体がＣｕＷ等の金属
であるか、または表面にメッキなどを用いてＡｕ等の金
属膜が形成されたセラミック基板であり、この金属また
は金属膜の電位は接地電位に固定される。さらに、高周
波半導体チップ素子１の裏面、すなわちダイボンディン
グ面は一般に半田等のダイボンディング材３を介してベ
ース基板２０表面に電気的に接触しているため、その電
位は接地電位となっている。この場合、上記接地電位ボ
ンディングパッド１１は、スルーホール（図示せず）に
より上記の半導体基板裏面に接続されることによって接
地電位に固定される。このスルーホールは、素子１を構
成する半導体基板の表面と裏面の間に設けられた貫通孔
の内面にＡｕメッキ等によりメタライズを施すことによ
り形成される。図では省略しているが、このスルーホー
ルは、接地電位ボンディングパッド１１に隣接する領域
に設け、スルーホールと接地電位ボンディングパッド１
１の間は半導体基板表面上に金属膜を形成して接続すれ
ばよい。なお、スルーホールを用いずに、半導体基板の
側面にメタライズを行うことにより、接地電位ボンディ
ングパッド１１と半導体基板裏面とを接続してもよい。The semiconductor chip element 1 is attached to a base substrate 20 which is a base metal of a carrier or a package by a die bonding material 3 such as solder. The base substrate 20 is usually a metal such as CuW or a ceramic substrate on the surface of which a metal film such as Au is formed by plating or the like, and the potential of this metal or metal film is fixed to the ground potential. To be done. Further, since the back surface of the high-frequency semiconductor chip element 1, that is, the die bonding surface is generally in electrical contact with the surface of the base substrate 20 via the die bonding material 3 such as solder, the potential thereof is the ground potential. In this case, the ground potential bonding pad 11 is fixed to the ground potential by being connected to the back surface of the semiconductor substrate by a through hole (not shown). The through hole is formed by metalizing the inner surface of the through hole provided between the front surface and the back surface of the semiconductor substrate forming the element 1 by Au plating or the like. Although not shown in the drawing, this through hole is provided in a region adjacent to the ground potential bonding pad 11, and the through hole and the ground potential bonding pad 1 are provided.
A metal film may be formed on the surface of the semiconductor substrate and connected between 1 and 2. The ground potential bonding pad 11 and the back surface of the semiconductor substrate may be connected by metalizing the side surface of the semiconductor substrate without using the through hole.

【００１９】本実施例１による上記高周波半導体チップ
素子１をパッケージ７０に実装してなる高周波回路装置
の上面図を図４に、図４におけるＡ−Ａ’面での断面図
を図５に示す。これらの図においては、図１，図２，図
３と同一部分には同一符号を付している。パッケージ７
０は、ベース基板２０，この基板２０上に設けられた下
層セラミック枠体２１，及びこの下層セラミック枠体２
１上に設けられた上層セラミック枠体２２からなるもの
である。上層セラミック枠体２２上には、通常パッケー
ジ７０内を気密封止するための蓋が接着されるが、この
図ではその記載を省略している。FIG. 4 is a top view of a high frequency circuit device in which the high frequency semiconductor chip element 1 according to the first embodiment is mounted in a package 70, and FIG. 5 is a sectional view taken along the line AA 'in FIG. . In these figures, the same parts as those in FIGS. 1, 2 and 3 are designated by the same reference numerals. Package 7
Reference numeral 0 denotes the base substrate 20, the lower layer ceramic frame body 21 provided on the substrate 20, and the lower layer ceramic frame body 2.
The upper layer ceramic frame 22 is provided on the upper part 1. A lid for hermetically sealing the inside of the package 70 is usually adhered to the upper ceramic frame body 22, but the illustration thereof is omitted in this figure.

【００２０】上記下層セラミック枠体２１の表面上に
は、上層セラミック枠体２２の内側と外側（すなわちパ
ッケージ７０の内側と外側）の間で高周波信号の伝達を
行うためのパッケージ側伝送線路９が、上層セラミック
枠体２２の下を通って設けられており、そのパッケージ
７０の内側の部分はボンディングパッドともなってい
る。このパッケージ側伝送線路９においても、高周波信
号を伝送するための所望の線路特性インピーダンスが得
られるように、下層セラミック枠体２１の誘電率，厚
み，線路の幅などが設定されている。なお、パッケージ
側伝送線路９は、一般にＷ等からなる金属膜で構成さ
れ、露出した表面にはＡｕメッキが施されている。A package side transmission line 9 for transmitting a high frequency signal between the inside and the outside of the upper ceramic frame 22 (ie, the inside and the outside of the package 70) is provided on the surface of the lower ceramic frame 21. It is provided under the upper ceramic frame 22, and the inner portion of the package 70 also serves as a bonding pad. Also in this package side transmission line 9, the dielectric constant, thickness, line width, etc. of the lower ceramic frame body 21 are set so that a desired line characteristic impedance for transmitting a high frequency signal can be obtained. The package-side transmission line 9 is generally made of a metal film made of W or the like, and the exposed surface is plated with Au.

【００２１】また、パッケージ７０内部（上層セラミッ
ク枠体２２の内側）の上記下層セラミック枠体２１表面
上のパッケージ側伝送線路９の両側の領域には、パッケ
ージ側接地電位ボンディングパッド３１が設けられてい
る。このパッケージ側接地電位ボンディングパッド３１
も、上記接地電位ボンディングパッド１１と同様に、下
層セラミック枠体２１に形成された貫通孔内の全体にタ
ングステンを混入したペースト等を充填して形成された
スルーホールにより、または上記下層セラミック枠体２
１の側面に施されたメタライズにより、上記ベース基板
２０の表面に接続され、その電位は接地電位に固定され
ている。Package-side ground potential bonding pads 31 are provided in regions inside the package 70 (inside the upper-layer ceramic frame 22) on both sides of the package-side transmission line 9 on the surface of the lower-layer ceramic frame 21. There is. This package side ground potential bonding pad 31
Similarly to the ground potential bonding pad 11, a through hole formed by filling a paste or the like in which tungsten is mixed into the entire through hole formed in the lower layer ceramic frame 21 or the lower layer ceramic frame Two
It is connected to the surface of the base substrate 20 by the metallization applied to the side surface of No. 1, and its potential is fixed to the ground potential.

【００２２】上記ベース基板２０上には、上記の高周波
半導体チップ素子１と、アルミナセラミックあるいはサ
ファイア等からなる基板にメッキ等により金属膜からな
る高周波伝送線路６が形成された高周波信号伝送用スル
ー線路８がハンダなどによりダイボンディングされてい
る。このスルー線路８においても、高周波信号を伝送す
るため線路の特性インピーダンスが所望の値となるよう
に、上記基板の誘電率，厚み，線路の幅などが設定さ
れ、また高周波信号ボンディングパッド４の両側に接地
電位ボンディングパッド１１が形成されている。このス
ルー線路８においても、上記半導体チップ素子１と同様
に、接地電位ボンディングパッド１１は、上記基板に形
成された貫通孔内の全体にタングステンを混入したペー
スト等を充填して形成されるスルーホール、または上記
基板の側面に施されたメタライズにより、ベース基板２
０の表面に接続され、接地電位に固定されている。On the base substrate 20, the high frequency semiconductor chip element 1 and a high frequency signal transmission through line in which a high frequency transmission line 6 made of a metal film is formed by plating or the like on a substrate made of alumina ceramic, sapphire or the like. 8 is die-bonded by solder or the like. Also in this through line 8, the dielectric constant, the thickness, the width of the line, etc. of the substrate are set so that the characteristic impedance of the line for transmitting a high frequency signal becomes a desired value, and both sides of the high frequency signal bonding pad 4 are set. A ground potential bonding pad 11 is formed on the ground. In this through line 8 as well, similar to the semiconductor chip element 1, the ground potential bonding pad 11 is a through hole formed by filling the entire inside of the through hole formed in the substrate with a paste containing tungsten. , Or the metallization applied to the side surface of the substrate, the base substrate 2
It is connected to the surface of 0 and is fixed to the ground potential.

【００２３】図４，図５に示した例では、高出力を得る
ため、二つの高周波半導体チップ素子１を直列に配置
し、さらにパッケージ７０の内部寸法にこれら二つの素
子の長さを合わせるためのスルー線路８が設けられ、そ
してこれらの素子１の間、素子１とスルー線路８との
間、スルー線路８とパッケージ７０との間、及び素子１
とパッケージ７０との間において、高周波信号ボンディ
ングパッド４，９間に高周波信号ワイヤ２，接地電位ボ
ンディングパッド１１，３１間に接地電位ワイヤ１２を
張架することにより、これらの間を電気的に接続してい
る。接地電位ワイヤ１２は、高周波信号ワイヤ２に平行
になるように設けられており、これらのワイヤは疑似的
なコプレーナ型高周波伝送線路を構成している。高周波
半導体チップ素子１，及び高周波伝送用スルー線路８に
設けられた高周波伝送線路６，並びにパッケージ側伝送
線路９の特性インピーダンスは通常５０Ωとなってお
り、この場合上記の高周波信号ワイヤ２と接地電位ワイ
ヤ１２とから構成される疑似的なコプレーナ型伝送線路
のインピーダンスも５０Ωに近づくように、高周波信号
ワイヤ２と接地電位ワイヤ１２との間の距離等を設定す
る。なお、スルー線路８は、上記の高周波回路装置では
高周波半導体チップ素子１の長さ調整のために用いてい
るが、入出力のインピーダンス整合回路として用いる場
合もある。また、図では簡易化のため高周波信号ワイヤ
２，及び接地電位ワイヤ１２による高周波信号線路の接
続についてのみ記載し、バイアス端子等に接続されてい
るボンディングワイヤは省略している。In the example shown in FIGS. 4 and 5, in order to obtain a high output, two high frequency semiconductor chip elements 1 are arranged in series, and the lengths of these two elements are matched with the internal dimensions of the package 70. Through lines 8 are provided, and between these elements 1, between the element 1 and the through line 8, between the through line 8 and the package 70, and the element 1
Between the package 70 and the package 70, the high-frequency signal wire 2 is stretched between the high-frequency signal bonding pads 4 and 9 and the ground potential wire 12 is stretched between the ground potential bonding pads 11 and 31 to electrically connect them. is doing. The ground potential wire 12 is provided so as to be parallel to the high-frequency signal wire 2, and these wires form a pseudo coplanar high-frequency transmission line. The characteristic impedance of the high-frequency semiconductor chip element 1, the high-frequency transmission line 6 provided on the high-frequency transmission through line 8 and the package-side transmission line 9 is usually 50Ω. In this case, the high-frequency signal wire 2 and the ground potential are used. The distance between the high-frequency signal wire 2 and the ground potential wire 12 is set so that the impedance of the pseudo coplanar transmission line composed of the wire 12 also approaches 50Ω. Although the through line 8 is used for adjusting the length of the high frequency semiconductor chip element 1 in the above high frequency circuit device, it may be used as an input / output impedance matching circuit. Further, in the figure, for simplification, only the connection of the high-frequency signal line with the high-frequency signal wire 2 and the ground potential wire 12 is shown, and the bonding wire connected to the bias terminal or the like is omitted.

【００２４】本実施例１においては、高周波半導体チッ
プ素子１の間、高周波半導体チップ素子１と高周波スル
ー線路８との間、高周波半導体チップ素子１とパッケー
ジ７０との間、及び高周波スルー線路８とパッケージ７
０との間を、上記のように高周波信号ワイヤ２とこれと
平行に設けられた接地電位ワイヤ１２とにより接続し、
疑似的なコプレーナ型伝送線路を構成するようにしたか
ら、これらのワイヤの間の距離等を適切な値に設定する
ことにより、上記のワイヤで構成される疑似的なコプレ
ーナ型伝送線路の特性インピーダンスを、上記高周波半
導体チップ素子１，及び高周波伝送用スルー線路８にお
ける伝送線路６，及びパッケージ側伝送線路９の特性イ
ンピーダンスと整合させることができる。このため、上
記高周波信号ワイヤ２と上記伝送線路６，９との間のイ
ンピーダンス不整合に起因する高周波信号の減衰を防止
することができる。In the first embodiment, between the high frequency semiconductor chip element 1, the high frequency semiconductor chip element 1 and the high frequency through line 8, the high frequency semiconductor chip element 1 and the package 70, and the high frequency through line 8. Package 7
0 is connected by the high frequency signal wire 2 and the ground potential wire 12 provided in parallel with the high frequency signal wire 2 as described above,
Since the pseudo-coplanar transmission line is configured, the characteristic impedance of the pseudo-coplanar transmission line composed of the above wires can be set by setting the distance between these wires to an appropriate value. Can be matched with the characteristic impedances of the high frequency semiconductor chip element 1, the transmission line 6 in the high frequency transmission through line 8 and the package side transmission line 9. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wire 2 and the transmission lines 6 and 9.

【００２５】図６にそれぞれ長さ４ｍｍの二つの上記高
周波伝送用スルー線路８を７５〜１００μｍの間隔で並
べ、その間を直径２５μｍのＡｕワイヤからなる高周波
信号ワイヤ２，及び接地電位ワイヤ１２により、これら
のワイヤがスルー線路８内の伝送線路６と同一の特性イ
ンピーダンスを有する上記の疑似的なコプレーナ型伝送
線路を構成するように接続した場合の，上記高周波伝送
用スルー線路８の間の高周波信号の減衰量を示す。ただ
し、この減衰量は、上記二つの高周波伝送用スルー線路
６のワイヤで接続されていない側の入出力端子（ボンデ
ィングパッド）の間で測定されたものである。この図か
ら、図２８に示した従来の場合に比べて明らかに高周波
信号の減衰量が少ないことがわかる。In FIG. 6, the two high-frequency transmission through lines 8 each having a length of 4 mm are arranged at intervals of 75 to 100 μm, and the high-frequency signal wire 2 and the ground potential wire 12 made of Au wire having a diameter of 25 μm are arranged between them. When these wires are connected so as to form the above-mentioned pseudo coplanar type transmission line having the same characteristic impedance as the transmission line 6 in the through line 8, a high frequency signal between the above high frequency transmission through lines 8 Shows the amount of attenuation. However, this amount of attenuation is measured between the input / output terminals (bonding pads) of the two high-frequency transmission through lines 6 that are not connected by wires. From this figure, it can be seen that the amount of attenuation of the high frequency signal is obviously smaller than that in the conventional case shown in FIG.

【００２６】なお、ここでは高周波信号ワイヤ２，及び
接地電位ワイヤ１２にＡｕワイヤを用いたが、これにＡ
ｌワイヤ、Ｃｕワイヤ、Ａｕリボン等を用いてもよい。
また、高周波半導体チップ素子１を構成する半導体基板
としては、上記のＧａＡｓ以外にも、他の化合物半導
体、またはＳｉ等を用いてもよい。Although Au wires were used for the high-frequency signal wire 2 and the ground potential wire 12 here,
You may use 1 wire, Cu wire, Au ribbon, etc.
Further, as the semiconductor substrate forming the high frequency semiconductor chip element 1, other compound semiconductors, Si, or the like may be used in addition to the above GaAs.

【００２７】実施例２．この発明の実施の形態１におけ
る他の実施例について説明する。本実施例２は、その内
部に高周波半導体チップ素子を備えたパッケージからな
る高周波半導体パッケージ素子の間を、上記実施例１と
同様の高周波信号ワイヤ及び接地電位ワイヤを用いて接
続するようにしたものである。Example 2. Another example of the first embodiment of the present invention will be described. In the second embodiment, the high-frequency semiconductor package elements including the package having the high-frequency semiconductor chip element therein are connected to each other by using the same high-frequency signal wire and ground potential wire as in the first embodiment. Is.

【００２８】図７，図８に本実施例２による、基板４０
上に二つの高周波半導体パッケージ素子１００を備え、
これらの素子の間をワイヤ１０２，１１２で接続してな
る高周波回路装置の斜視図，側面図を示す。図１〜５と
同一部分には同一符号を付して、その詳しい説明は省略
する。図において、２３はパッケージ内部を気密封止す
るための蓋、３２はその電位が接地電位に固定されてい
る接地電位ボンディングパッド、１０２は高周波信号ワ
イヤ、１１２は接地電位ワイヤである。高周波半導体パ
ッケージ素子１００は、図に示されているように、ベー
ス基板３０，下層セラミック枠体２１，上層セラミック
枠体２２，蓋２３，及びベース基板３０上に設けられた
高周波半導体チップ素子１０１，高周波伝送用スルー線
路等からなるものである。ただし、高周波伝送用スルー
線路の図示は省略している。また、上層セラミック枠体
２２の外側の下層セラミック枠体２１表面には、パッケ
ージ側伝送線路９の両側に接地電位ボンディングパッド
３２が設けられている。このボンディングパッド３２
は、上記実施例１に記載したパッケージ側接地電位ボン
ディングパッド３１と同様に、スルーホールまたは下層
セラミック枠体２１の側面に形成されたメタライズによ
りベース基板３０に接続され、その電位は接地電位に固
定されている。A substrate 40 according to the second embodiment is shown in FIGS.
With two high frequency semiconductor package devices 100 on top,
A perspective view and a side view of a high-frequency circuit device in which these elements are connected by wires 102 and 112 are shown. 1 to 5 are denoted by the same reference numerals, and detailed description thereof will be omitted. In the figure, 23 is a lid for hermetically sealing the inside of the package, 32 is a ground potential bonding pad whose potential is fixed to the ground potential, 102 is a high frequency signal wire, and 112 is a ground potential wire. As shown in the figure, the high frequency semiconductor package device 100 includes a base substrate 30, a lower ceramic frame body 21, an upper ceramic frame body 22, a lid 23, and a high frequency semiconductor chip device 101 provided on the base substrate 30. It is composed of a through line for high frequency transmission. However, illustration of the through line for high frequency transmission is omitted. Further, ground potential bonding pads 32 are provided on both surfaces of the package side transmission line 9 on the surface of the lower ceramic frame body 21 outside the upper ceramic frame body 22. This bonding pad 32
Are connected to the base substrate 30 by metallization formed on the side surface of the through-hole or the lower ceramic frame body 21 like the package side ground potential bonding pad 31 described in the first embodiment, and the potential is fixed to the ground potential. Has been done.

【００２９】さらに、これらの高周波半導体パッケージ
素子１００の間においては、パッケージ側伝送線路９間
はこの伝送線路９にワイヤボンディングされた高周波信
号ワイヤ１０２により接続され、接地電位ボンディング
パッド３２間はこのボンディングパッド３２にワイヤボ
ンディングされた接地電位ワイヤ１１２により接続され
ている。この接地電位ワイヤ１１２も、上記実施例１と
同様に、高周波信号ワイヤ１０２に平行になるように設
けられており、これらのワイヤ１０２，１１２は疑似的
なコプレーナ型高周波伝送線路を構成している。これら
のワイヤは直径２５μｍ程度のＡｕワイヤである。パッ
ケージ側伝送線路９の特性インピーダンスは通常５０Ω
となっているため、上記の高周波信号ワイヤ１０２と接
地電位ワイヤ１１２から構成される上記の疑似的なコプ
レーナ型伝送線路の特性インピーダンスも５０Ωに近づ
くように、高周波信号ワイヤ１０２と接地電位ワイヤ１
１２との間の距離等が設定されている。Further, between the high frequency semiconductor package elements 100, the package side transmission lines 9 are connected by the high frequency signal wires 102 wire-bonded to the transmission lines 9, and the ground potential bonding pads 32 are connected by the bonding. It is connected to the pad 32 by a ground potential wire 112 wire-bonded. The ground potential wire 112 is also provided so as to be parallel to the high frequency signal wire 102 as in the first embodiment, and these wires 102 and 112 form a pseudo coplanar high frequency transmission line. . These wires are Au wires with a diameter of about 25 μm. The characteristic impedance of the package side transmission line 9 is usually 50Ω
Therefore, the high-frequency signal wire 102 and the ground potential wire 1 are arranged so that the characteristic impedance of the pseudo coplanar transmission line composed of the high-frequency signal wire 102 and the ground potential wire 112 also approaches 50Ω.
The distance to 12 and the like are set.

【００３０】本実施例２においては、高周波半導体パッ
ケージ素子１００の間を、上記のように高周波信号ワイ
ヤ１０２とこれと平行に設けられた接地電位ワイヤ１１
２とにより接続し、これらのワイヤが疑似的なコプレー
ナ型伝送線路を構成するようにしているから、これらの
ワイヤの間の距離等を適切な値に設定することにより、
上記のワイヤ１０２，１１２で構成される疑似的なコプ
レーナ型伝送線路の特性インピーダンスをパッケージ側
伝送線路９の特性インピーダンスに整合させることがで
きる。このため、上記高周波信号ワイヤ１０２と上記伝
送線路９との間のインピーダンス不整合に起因する高周
波信号の減衰を防止することができる。In the second embodiment, between the high frequency semiconductor package element 100, the high frequency signal wire 102 and the ground potential wire 11 provided in parallel with the high frequency signal wire 102 as described above.
Since these wires are connected to each other and these wires form a pseudo coplanar transmission line, by setting the distance between these wires to an appropriate value,
It is possible to match the characteristic impedance of the pseudo coplanar transmission line formed by the wires 102 and 112 with the characteristic impedance of the package side transmission line 9. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wire 102 and the transmission line 9.

【００３１】なお、高周波半導体パッケージ素子１００
の間を接続するワイヤには、Ａｕワイヤを用いている
が、これに幅０．１〜０．２ｍｍ，厚さ５０μｍ程度の
Ａｕリボンを用いてもよい。The high frequency semiconductor package device 100
Although an Au wire is used as a wire connecting between the two, an Au ribbon having a width of 0.1 to 0.2 mm and a thickness of about 50 μm may be used.

【００３２】実施の形態２． 構成１． この発明の実施の形態２における高周波回路装置は、図
９，１０，１１，１２，または図１３，１４，１５，１
６に示すように、高周波信号ボンディングパッド
（４），（９），及びこの高周波信号ボンディングパッ
ド（４），（９）の両側に設けられた接地電位ボンディ
ングパッド（１１），（３２）を各々有する複数の高周
波回路要素（１），（１００）と、隣接する二つの上記
高周波回路要素（１），（１００）の間において上記高
周波信号ボンディングパッド（４），（９）の間を接続
する高周波信号ワイヤ（２），（１０２）と、これら二
つの高周波回路要素（１），（１００）の間においてこ
の高周波信号ボンディングパッド（４），（９）の両側
に設けられた上記接地電位ボンディングパッド（１
１），（３２）の間を接続する、この高周波信号ワイヤ
（２），（１０２）に平行に設けられた接地電位ワイヤ
（１２），（１１２）と、その表面上に上記高周波回路
要素（１），（１００）が設けられており、少なくとも
上記高周波信号ワイヤ（２），（１０２）及び上記接地
電位ワイヤ（１２），（１１２）の直下の表面部分が接
地電位である接地電位基板（３０），（５０）と、この
接地電位基板（３０），（５０）と、上記高周波信号ワ
イヤ（２），（１０２）及び上記接地電位ワイヤ（１
２），（１１２）との間に設けられた誘電体（１３，１
５），（１１３，１１５）とを備えたものである。これ
により、上記高周波信号ワイヤ（２），（１０２），上
記接地電位ワイヤ（１２），（１１２），上記接地電位
基板（３０），（５０），及び上記誘電体（１３，１
５），（１１３，１１５）は、疑似的な接地面付コプレ
ーナ型高周波伝送線路を構成することとなり、これらの
ワイヤの間の距離，ワイヤと接地電位基板（３０），
（５０）表面との間の距離，上記誘電体（１３，１
５），（１１３，１１５）の誘電率等を適切な値に設定
することにより、この伝送線路の特性インピーダンス
を、上記高周波回路要素（１），（１００）のインピー
ダンスに整合させることができる。このため、上記高周
波信号ワイヤ（２），（１０２）と上記高周波回路要素
（１），（１００）との間のインピーダンス不整合に起
因する高周波信号の減衰を防止することができる。Embodiment 2. Configuration 1. Frequency circuit equipment according to the second embodiment of the invention, FIGS. 9, 10, 11, 12 or Figure, 13,14,15,1
As shown in FIG. 6, high frequency signal bonding pads (4) and (9) and ground potential bonding pads (11) and (32) provided on both sides of the high frequency signal bonding pads (4) and (9), respectively. The high-frequency signal bonding pads (4) and (9) are connected between the plurality of high-frequency circuit elements (1) and (100) and the two adjacent high-frequency circuit elements (1) and (100). The high-frequency signal wires (2) and (102) and the ground potential bonding provided on both sides of the high-frequency signal bonding pads (4) and (9) between these two high-frequency circuit elements (1) and (100). Pad (1
1) and (32), which are connected in parallel with the high-frequency signal wires (2) and (102), and ground potential wires (12) and (112), and the high-frequency circuit element ( 1) and (100) are provided, and at least the surface portions immediately below the high-frequency signal wires (2) and (102) and the ground potential wires (12) and (112) are at the ground potential ( 30) and (50), the ground potential substrates (30) and (50), the high frequency signal wires (2) and (102), and the ground potential wire (1).
2), a dielectric (13, 1) provided between (112)
5) and (113, 115). Thereby, the high frequency signal wires (2) and (102), the ground potential wires (12) and (112), the ground potential substrates (30) and (50), and the dielectric (13, 1).
5) and (113, 115) constitute a pseudo coplanar type high-frequency transmission line with a ground plane, and the distance between these wires, the wires and the ground potential substrate (30),
(50) Distance to surface, dielectric (13,1)
By setting the dielectric constants of 5) and (113, 115) to appropriate values, the characteristic impedance of this transmission line can be matched to the impedance of the high frequency circuit elements (1) and (100). Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wires (2) and (102) and the high frequency circuit elements (1) and (100).

【００３３】構成２． この発明の実施の形態２における高周波回路装置は、図
９，１０，または図１３，１４に示すように、上記の構
成１の高周波回路装置において、上記誘電体（１３），
（１１３）を、樹脂からなるものとしたものである。こ
れにより、上記誘電体を容易に形成することができ、ま
た、樹脂の材料を変えることにより、誘電体（１３），
（１１３）の誘電率を変えることができ、上記の疑似的
な接地面付コプレーナ型高周波伝送線路の特性インピー
ダンスを広い範囲で制御することができる。Configuration 2. Frequency circuit equipment according to the second embodiment of the invention, FIGS. 9 and 10 or 13 and 14, Oite high frequency circuit equipment configuration 1 above, the dielectric (13),
(113) is made of resin. As a result, the dielectric can be easily formed, and by changing the resin material, the dielectric (13),
The permittivity of (113) can be changed, and the characteristic impedance of the above-mentioned pseudo coplanar high-frequency transmission line with a ground plane can be controlled in a wide range.

【００３４】構成３． この発明の実施の形態２における高周波回路装置は、図
１１，１２，または図１５，１６に示すように、上記の
構成１の高周波回路装置において、上記誘電体（１
３），（１１３）を、高誘電率材料（１５），（１１
５）が混入された樹脂からなるものとしたものである。
これにより、上記誘電体を容易に形成することができ、
また、樹脂の材料を変えることにより、上記誘電体（１
３），（１１３）の誘電率を変えることができるだけで
なく、上記高誘電率材料（１５），（１１５）の材質ま
たは混入比率を変化させることにより、上記誘電体の誘
電率を変えることができ、上記の疑似的な接地面付コプ
レーナ型高周波伝送線路の特性インピーダンスを上記構
成２の高周波回路装置より広い範囲で制御することがで
きる。Configuration 3. Frequency circuit equipment according to the second embodiment of the invention, as shown in FIGS. 11, 12 or 15 and 16, Oite high frequency circuit equipment configuration 1 mentioned above, the dielectric (1
3) and (113) are replaced with high dielectric constant materials (15) and (11
It is made of a resin mixed with 5).
This allows the dielectric to be easily formed,
Further, by changing the resin material, the dielectric (1
3) Not only can the dielectric constant of (113) be changed, but the dielectric constant of the dielectric can be changed by changing the material or mixing ratio of the high dielectric constant materials (15) and (115). Therefore, it is possible to control the characteristic impedance of the pseudo-coplanar type high frequency transmission line with a ground plane in a wider range than that of the high frequency circuit device having the above configuration 2.

【００３５】構成４． この発明の実施の形態２における高周波回路装置は、図
９，１０，１１，１２に示すように、上記の構成１の高
周波回路装置において、上記複数の高周波回路要素のう
ちの少なくとも一つを、半導体チップからなる高周波半
導体チップ素子（１）としたものである。これにより、
上記のように上記高周波信号ワイヤ（２），上記接地電
位ワイヤ（１２），上記接地電位基板（３０），及び上
記誘電体（１３，１５）は、疑似的な接地面付コプレー
ナ型高周波伝送線路を構成することとなり、高周波半導
体チップ素子（１）の間を接続するこの伝送線路を高周
波半導体チップ素子（１）にインピーダンス整合させる
ことができ、上記高周波信号ワイヤ（２）の接続部分で
のインピーダンス不整合に起因する高周波信号の減衰を
防止することができる。Structure 4. Frequency circuit equipment according to the second embodiment of the invention, as shown in FIG. 9, 10, 11, 12, Oite high frequency circuit equipment configuration 1 mentioned above, at least of the plurality of high-frequency circuit components One is a high frequency semiconductor chip element (1) including a semiconductor chip. This allows
As described above, the high frequency signal wire (2), the ground potential wire (12), the ground potential substrate (30), and the dielectrics (13, 15) are the coplanar type high frequency transmission line with a pseudo ground plane. The transmission line connecting between the high frequency semiconductor chip elements (1) can be impedance-matched to the high frequency semiconductor chip element (1), and the impedance at the connection part of the high frequency signal wire (2) It is possible to prevent the high frequency signal from being attenuated due to the mismatch.

【００３６】構成５． この発明の実施の形態２における高周波回路装置は、図
１３，１４，１５，１６に示すように、上記の構成１の
高周波回路装置において、上記複数の高周波回路要素の
うちの少なくとも一つを、半導体チップからなる高周波
半導体チップ素子（１０１）をパッケージの内側に設け
てなる高周波半導体パッケージ素子（１００）としたも
のである。これにより、上記のように上記高周波信号ワ
イヤ（１０２），上記接地電位ワイヤ（１１２），上記
接地電位基板（５０），及び上記誘電体（１１３，１１
５）は、疑似的な接地面付コプレーナ型高周波伝送線路
を構成することとなり、高周波半導体パッケージ素子
（１００）の間を接続するこの伝送線路を高周波半導体
パッケージ素子（１００）にインピーダンス整合させる
ことができ、上記高周波信号ワイヤ（１０２）の接続部
分でのインピーダンス不整合に起因する高周波信号の減
衰を防止することができる。Structure 5. Frequency circuit equipment according to the second embodiment of the invention, as shown in FIG. 13, 14, 15, 16 Oite high frequency circuit equipment configuration 1 mentioned above, at least of the plurality of high-frequency circuit components One is a high frequency semiconductor package element (100) in which a high frequency semiconductor chip element (101) made of a semiconductor chip is provided inside a package. Thereby, as described above, the high frequency signal wire (102), the ground potential wire (112), the ground potential substrate (50), and the dielectric (113, 11).
In 5), a pseudo coplanar type high frequency transmission line with a ground plane is constructed, and this transmission line connecting between the high frequency semiconductor package devices (100) can be impedance-matched to the high frequency semiconductor package device (100). Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch at the connection part of the high frequency signal wire (102).

【００３７】実施例３．この発明の実施の形態２におけ
る一実施例について説明する。本実施例３は、高周波半
導体チップ素子の間を、上記実施例１と同様の高周波信
号ワイヤ及び接地電位ワイヤを用いて接続し、さらにこ
れらのワイヤとベース基板（接地電位基板）との間に誘
電体を設けるようにしたものである。Example 3. An example of the second embodiment of the present invention will be described. In the third embodiment, the high-frequency semiconductor chip elements are connected using the same high-frequency signal wire and ground potential wire as in the first embodiment, and further these wires and the base substrate (ground potential substrate) are connected. A dielectric is provided.

【００３８】図９，１０に本実施例３による、ベース基
板３０上に二つの高周波半導体チップ素子１を備え、こ
れらの素子の間をワイヤ２，１２で接続した高周波回路
装置の斜視図，側面図を示す。図１〜８と同一部分には
同一符号を付して、その詳しい説明は省略する。図にお
いて、１３はエポキシ樹脂からなる誘電体であり、３０
は少なくともその表面の電位が接地電位に固定されてい
るベース基板（接地電位基板）である。このベース基板
３０は、その全体がＣｕＷ等の金属であるか、または表
面にメッキなどによりＡｕ等の金属膜が形成されたセラ
ミック基板であり、この金属または金属膜の電位は常に
接地電位に固定されている。9 and 10 are perspective views and a side view of a high frequency circuit device according to the third embodiment, in which two high frequency semiconductor chip elements 1 are provided on a base substrate 30 and the elements are connected by wires 2 and 12. The figure is shown. 1 to 8 are designated by the same reference numerals, and detailed description thereof will be omitted. In the figure, 13 is a dielectric made of epoxy resin, and 30
Is a base substrate (ground potential substrate) whose surface potential is fixed to the ground potential. The base substrate 30 is entirely a metal such as CuW or a ceramic substrate having a metal film such as Au formed on the surface by plating or the like, and the potential of the metal or metal film is always fixed to the ground potential. Has been done.

【００３９】これらの高周波半導体チップ素子１の間に
おいては、上記実施例１と同様に、高周波信号ボンディ
ングパッド４の間は高周波信号ワイヤ２により接続さ
れ、接地電位ボンディングパッド１１の間は高周波信号
ワイヤ２に平行な接地電位ワイヤ１２により接続されて
いる。さらに、上記実施例１とは異なり、これらのワイ
ヤ２，１２と接地電位基板である上記ベース基板３０表
面の間にはエポキシ樹脂からなる誘電体１３が設けら
れ、ワイヤ２，１２，誘電体１３，及びベース基板３０
は疑似的な接地面付コプレーナ型高周波伝送線路を構成
している。なお、誘電体１３には、上記のエポキシ樹脂
の他にシリコン樹脂，ポリイミド樹脂等を用いてもよ
い。誘電体１３の材質を変化させることにより、その誘
電率を変えることができる。Between these high-frequency semiconductor chip elements 1, the high-frequency signal bonding pads 4 are connected by the high-frequency signal wires 2 and the ground potential bonding pads 11 are connected between the high-frequency signal wires, as in the first embodiment. They are connected by a ground potential wire 12 parallel to 2. Further, unlike the first embodiment, a dielectric 13 made of epoxy resin is provided between the wires 2 and 12 and the surface of the base substrate 30 which is a ground potential substrate. , And the base substrate 30
Constitutes a coplanar type high frequency transmission line with a pseudo ground plane. In addition to the above epoxy resin, silicon resin, polyimide resin, or the like may be used for the dielectric 13. The dielectric constant can be changed by changing the material of the dielectric 13.

【００４０】本実施例３においては、高周波信号ワイヤ
２，接地電位ワイヤ１２，誘電体１３，及びベース基板
（接地電位基板）３０は、疑似的な接地面付コプレーナ
型高周波伝送線路を構成することとなり、これらのワイ
ヤ２，１２の間の距離，ワイヤ２，１２と接地電位基板
３０表面との間の距離，誘電体１３の誘電率等を適切な
値に設定することにより、この伝送線路の特性インピー
ダンスを、高周波半導体チップ素子１において高周波信
号ボンディングパッド４に接続されている伝送線路６の
特性インピーダンスと整合させることができる。このた
め、上記高周波信号ワイヤ２と上記高周波回路要素１と
の間のインピーダンス不整合に起因する高周波信号の減
衰を防止することができる。In the third embodiment, the high frequency signal wire 2, the ground potential wire 12, the dielectric 13 and the base substrate (ground potential substrate) 30 constitute a pseudo coplanar type high frequency transmission line with a ground plane. Therefore, by setting the distance between these wires 2 and 12, the distance between the wires 2 and 12 and the surface of the ground potential substrate 30 and the dielectric constant of the dielectric 13 to appropriate values, The characteristic impedance can be matched with the characteristic impedance of the transmission line 6 connected to the high frequency signal bonding pad 4 in the high frequency semiconductor chip element 1. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wire 2 and the high frequency circuit element 1.

【００４１】上記高周波半導体チップ素子１に設けられ
た伝送線路６の特性インピーダンスは通常５０Ωとなっ
ているため、高周波信号ワイヤ２と接地電位ワイヤ１２
とから構成される上記の疑似的な接地面付コプレーナ型
伝送線路のインピーダンスも５０Ωに近づくように、高
周波信号ワイヤ２と接地電位ワイヤ１２との間の距離，
これらのワイヤとベース基板３０表面との間の距離，誘
電体１３の誘電率等が設定されている。Since the characteristic impedance of the transmission line 6 provided in the high frequency semiconductor chip element 1 is usually 50Ω, the high frequency signal wire 2 and the ground potential wire 12 are provided.
The distance between the high-frequency signal wire 2 and the ground potential wire 12 is set so that the impedance of the above-described pseudo-coplanar type transmission line with a ground plane also approaches 50Ω.
The distance between these wires and the surface of the base substrate 30 and the dielectric constant of the dielectric 13 are set.

【００４２】また、上記の図９，１０に示した高周波回
路装置においては、誘電体１３にはエポキシ樹脂を用い
ているが、図１１，１２に示すように、この誘電体とし
てエポキシ樹脂に高誘電率材料であるチタン酸バリウム
１５等の粒子を混入したものを用いてもよい。なお、こ
の高誘電率材料には上記のチタン酸バリウムの他に、チ
タン酸カルシウム，ニオブ酸リチウム等を用いてもよ
い。このような高誘電率材料の粒子の混入密度，または
この高誘電率材料の材質を変えることにより、誘電体１
３の誘電率を広い範囲で変化させることができ、上記の
疑似的な接地面付コプレーナ型高周波伝送線路の特性イ
ンピーダンスの制御を容易に行うことができることとな
る。In the high-frequency circuit device shown in FIGS. 9 and 10, the epoxy resin is used for the dielectric 13, but as shown in FIGS. You may use the thing which mixed particles, such as barium titanate 15 which is a dielectric constant material. In addition to the above barium titanate, calcium titanate, lithium niobate or the like may be used as the high dielectric constant material. By changing the mixing density of particles of such a high dielectric constant material or the material of this high dielectric constant material, the dielectric 1
The dielectric constant of No. 3 can be changed in a wide range, and the above-mentioned pseudo characteristic impedance of the coplanar type high frequency transmission line with a ground plane can be easily controlled.

【００４３】また、上記の図９〜１２に示した高周波回
路装置においては、高周波半導体チップ素子１の間を接
続しているが、上記実施例１と同様に、高周波半導体チ
ップ素子１と高周波伝送用スルー線路８との間，高周波
半導体チップ素子１とパッケージ７０との間，高周波伝
送用スルー線路８とパッケージ７０との間を、上記のよ
うなワイヤ２，１２，誘電体１３，及びベース基板３０
からなる疑似的な接地面付コプレーナ型高周波伝送線路
により接続してもよく、この場合もワイヤによる接続部
分でのインピーダンス不整合に起因する高周波信号の減
衰を防止することができる。In the high frequency circuit device shown in FIGS. 9 to 12, the high frequency semiconductor chip elements 1 are connected to each other. However, as in the first embodiment, the high frequency semiconductor chip element 1 and the high frequency transmission are connected. The wires 2, 12, the dielectric 13, and the base substrate as described above are provided between the high-frequency semiconductor chip element 1 and the package 70, and between the high-frequency transmission through line 8 and the package 70. Thirty
It may be connected by a pseudo-coplanar type high frequency transmission line with a ground plane, and in this case as well, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch at the connection part by the wire.

【００４４】実施例４．この発明の実施の形態２におけ
る他の実施例について説明する。本実施例４は、その内
部に高周波半導体チップ素子を備えたパッケージからな
る高周波半導体パッケージ素子の間を、上記実施例３と
同様に、高周波信号ワイヤ及び接地電位ワイヤを用いて
接続し、これらのワイヤと接地電位基板表面との間に誘
電体を設けるようにしたものである。Example 4. Another example of the second embodiment of the present invention will be described. In the fourth embodiment, the high-frequency semiconductor package elements including the package having the high-frequency semiconductor chip element therein are connected by using the high-frequency signal wire and the ground potential wire as in the third embodiment, and A dielectric is provided between the wire and the surface of the ground potential substrate.

【００４５】図１３，図１４に本実施例４による、基板
（接地電位基板）５０上に二つの高周波半導体パッケー
ジ素子１００を備え、これらの素子１００の間をワイヤ
１０２，１１２で接続した高周波回路装置の斜視図，側
面図を示す。図１〜１２と同一部分には同一符号を付し
て、その詳しい説明は省略する。図１３，図１４に示し
た高周波回路装置は、高周波半導体パッケージ素子１０
０の間において、パッケージ側伝送線路９の間を高周波
信号ワイヤ１０２で接続し、接地電位ボンディングパッ
ド３２の間を接地電位ワイヤ１１２により接続し、さら
に高周波信号ワイヤ１０２，及び接地電位ワイヤ１１２
と基板５０表面との間にエポキシ樹脂からなる誘電体１
１３を設けたものである。なお、誘電体１１３には、上
記のエポキシ樹脂の他にシリコン樹脂，ポリイミド樹脂
等を用いてもよい。誘電体１１３の材質を変化させるこ
とにより、その誘電率を変えることができる。ただし、
上記基板５０は少なくとも上記ワイヤ１０２，１１２直
下の表面部分が接地電位に固定されている接地電位基板
である。パッケージ側伝送線路９，接地電位ボンディン
グパッド３２，及びこれらを接続する高周波信号ワイヤ
１０２，接地電位ワイヤ１１２は上記実施例２の図７，
図８に示したものと同じでものである。これらのワイヤ
１０２，１１２と接地電位基板５０の間にエポキシ樹脂
からなる誘電体１１３が設けられているため、上記実施
例３と同様に、ワイヤ１０２，１１２，誘電体１１３，
及び接地電位基板５０により、疑似的な接地面付コプレ
ーナ型高周波伝送線路が構成されることとなる。In FIGS. 13 and 14, according to the fourth embodiment, a high frequency circuit in which two high frequency semiconductor package devices 100 are provided on a substrate (ground potential substrate) 50 and the devices 100 are connected by wires 102 and 112. The perspective view and side view of an apparatus are shown. The same parts as those in FIGS. 1 to 12 are designated by the same reference numerals, and detailed description thereof will be omitted. The high frequency circuit device shown in FIGS. 13 and 14 is a high frequency semiconductor package element 10.
0, the package side transmission lines 9 are connected by the high frequency signal wire 102, the ground potential bonding pads 32 are connected by the ground potential wire 112, and the high frequency signal wire 102 and the ground potential wire 112 are further connected.
1 made of epoxy resin between the substrate and the surface of the substrate 50
13 is provided. In addition to the above epoxy resin, silicon resin, polyimide resin, or the like may be used for the dielectric 113. The dielectric constant can be changed by changing the material of the dielectric 113. However,
The substrate 50 is a ground potential substrate in which at least the surface portions immediately below the wires 102 and 112 are fixed to the ground potential. The package-side transmission line 9, the ground potential bonding pad 32, the high-frequency signal wire 102 and the ground potential wire 112 that connect them are shown in FIG.
It is the same as that shown in FIG. Since the dielectric 113 made of epoxy resin is provided between the wires 102 and 112 and the ground potential substrate 50, the wires 102 and 112, the dielectric 113,
The ground potential substrate 50 constitutes a pseudo-coplanar type high frequency transmission line with a ground plane.

【００４６】本実施例４においては、高周波信号ワイヤ
１０２，接地電位ワイヤ１１２，誘電体１１３，及び接
地電位基板５０は、疑似的な接地面付コプレーナ型高周
波伝送線路を構成することとなり、これらのワイヤ１０
２，１１２の間の距離，ワイヤ１０２，１１２と接地電
位基板５０表面との間の距離，誘電体１１３の誘電率等
を適切な値に設定することにより、この伝送線路の特性
インピーダンスを、パッケージ側伝送線路９の特性イン
ピーダンスと整合させることができる。このため、上記
高周波信号ワイヤ１０２と上記高周波半導体パッケージ
素子１００との間のインピーダンス不整合に起因する高
周波信号の減衰を防止することができる。In the fourth embodiment, the high-frequency signal wire 102, the ground potential wire 112, the dielectric 113, and the ground potential substrate 50 constitute a pseudo ground plane-equipped coplanar high-frequency transmission line. Wire 10
The characteristic impedance of the transmission line is set to a suitable value by setting the distance between the wires 2 and 112, the distance between the wires 102 and 112 and the surface of the ground potential substrate 50, and the dielectric constant of the dielectric material 113 to appropriate values. It is possible to match the characteristic impedance of the side transmission line 9. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wire 102 and the high frequency semiconductor package element 100.

【００４７】パッケージ側伝送線路９の特性インピーダ
ンスは通常５０Ωとなっており、この場合上記の高周波
信号ワイヤ１０２と接地電位ワイヤ１１２から構成され
る疑似的な接地面付コプレーナ型伝送線路のインピーダ
ンスも５０Ωに近づくようにする。The characteristic impedance of the package side transmission line 9 is usually 50Ω, and in this case the impedance of the pseudo ground plane coplanar type transmission line composed of the high frequency signal wire 102 and the ground potential wire 112 is also 50Ω. Try to get closer to.

【００４８】また、上記の図１３，図１４に示した高周
波回路装置においては、誘電体１１３にエポキシ樹脂を
用いているが、図１５，図１６に示すように、この誘電
体としてエポキシ樹脂に高誘電率材料であるチタン酸バ
リウム１１５等の粒子を混入したものを用いてもよい。
なお、この高誘電率材料には上記のチタン酸バリウムの
他に、チタン酸カルシウム，ニオブ酸リチウム等を用い
てもよい。このような高誘電率材料の粒子の混入密度，
またはこの高誘電率材料の材質を変えることにより、誘
電体１１３の誘電率を広い範囲で変化させることがで
き、上記の疑似的な接地面付コプレーナ型高周波伝送線
路の特性インピーダンスの制御を容易に行うことができ
ることとなる。Further, in the high frequency circuit device shown in FIGS. 13 and 14, the epoxy resin is used for the dielectric 113, but as shown in FIGS. 15 and 16, the epoxy resin is used as the dielectric. A material in which particles such as barium titanate 115 which is a high dielectric constant material are mixed may be used.
In addition to the above barium titanate, calcium titanate, lithium niobate or the like may be used as the high dielectric constant material. The mixing density of particles of such a high dielectric constant material,
Alternatively, by changing the material of the high dielectric constant material, the dielectric constant of the dielectric 113 can be changed in a wide range, and the characteristic impedance of the pseudo ground plane coplanar high frequency transmission line can be easily controlled. You will be able to do it.

【００４９】なお、高周波半導体パッケージ素子１００
の間を接続するワイヤには、Ａｕワイヤを用いている
が、これには幅０．１〜０．２ｍｍ，厚さ５０μｍ程度
のＡｕリボンを用いてもよい。The high frequency semiconductor package device 100
An Au wire is used as the wire connecting between the two, but an Au ribbon having a width of 0.1 to 0.2 mm and a thickness of about 50 μm may be used as the wire.

【００５０】実施の形態３． 構成１． この発明の実施の形態３における高周波回路装置は、図
１７，１８，１９，２０，または図２１，２２，２３，
２４に示すように、高周波信号ボンディングパッド
（４），（９）を各々有する複数の高周波回路要素
（１），（１００）と、隣接する二つの上記高周波回路
要素（１），（１００）の間において、これら各高周波
回路要素（１），（１００）の高周波信号ボンディング
パッド（４），（９）の間を接続する高周波信号ワイヤ
（２），（１０２）と、その表面上に上記高周波回路要
素（１），（１００）が設けられており、少なくともこ
の高周波信号ワイヤ（２），（１０２）の直下の表面部
分が接地電位である接地電位基板（３０），（５０）
と、上記接地電位基板（３０），（５０）と上記高周波
信号ワイヤ（２），（１０２）との間に設けられた誘電
体（１３，１５），（１１３，１１５）とを備えたもの
である。これにより、上記高周波信号ワイヤ（２），
（１０２），上記接地電位基板（３０），（５０），及
び上記誘電体（１３，１５），（１１３，１１５）は、
疑似的なマイクロストリップ型高周波伝送線路を構成す
ることとなり、このワイヤ（２），（１０２）と接地電
位基板（３０），（５０）表面との間の距離，上記誘電
体（１３，１５），（１１３，１１５）の誘電率等を適
切な値に設定することにより、この伝送線路の特性イン
ピーダンスを、上記高周波回路要素（１），（１００）
のインピーダンスに整合させることができる。このた
め、上記高周波信号ワイヤ（２），（１０２）と上記高
周波回路要素（１，８），（１００）との間のインピー
ダンス不整合に起因する高周波信号の減衰を防止するこ
とができる。Embodiment 3. Configuration 1. Frequency circuit equipment in the third embodiment of the invention, FIGS. 17, 18, 19, 20 or FIG. 21, 22, 23,
24, a plurality of high frequency circuit elements (1) and (100) each having high frequency signal bonding pads (4) and (9) and two adjacent high frequency circuit elements (1) and (100) are provided. Between the high-frequency signal bonding pads (4) and (9) of the high-frequency circuit elements (1) and (100), and the high-frequency signal wires on the surface thereof. Circuit elements (1) and (100) are provided, and ground potential substrates (30) and (50) in which at least the surface portions directly under the high-frequency signal wires (2) and (102) are at the ground potential.
And dielectrics (13, 15), (113, 115) provided between the ground potential substrates (30), (50) and the high frequency signal wires (2), (102). Is. Thereby, the high frequency signal wire (2),
(102), the ground potential substrates (30), (50), and the dielectrics (13, 15), (113, 115),
A pseudo microstrip high-frequency transmission line is constructed, and the distance between the wires (2) and (102) and the surface of the ground potential substrate (30) and (50), the dielectric (13, 15). , (113, 115) by setting the dielectric constant and the like to appropriate values, the characteristic impedance of the transmission line is set to the high frequency circuit elements (1), (100).
Can be matched to the impedance of. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wires (2) and (102) and the high frequency circuit elements (1, 8) and (100).

【００５１】構成２． この発明の実施の形態３における高周波回路装置は、図
１７，１８，または図２１，２２に示すように、上記の
構成１の高周波回路装置において、上記誘電体（１
３），（１１３）を、樹脂からなるものとしたものであ
る。これにより、上記誘電体を容易に形成することがで
き、また、樹脂の材料を変えることにより、誘電体（１
３），（１１３）の誘電率を変えることができ、上記の
疑似的なマイクロストリップ型高周波伝送線路の特性イ
ンピーダンスを広い範囲で制御することができる。Configuration 2. Frequency circuit equipment in the third embodiment of the invention, as shown in FIGS. 17 and 18 or 21 and 22, Oite high frequency circuit equipment configuration 1 mentioned above, the dielectric (1
3) and (113) are made of resin. Thereby, the above-mentioned dielectric can be easily formed, and by changing the material of the resin, the dielectric (1
The dielectric constants of 3) and (113) can be changed, and the characteristic impedance of the pseudo microstrip high-frequency transmission line can be controlled in a wide range.

【００５２】構成３． この発明の実施の形態３における高周波回路装置は、図
１９，２０，または図２３，２４に示すように、上記の
構成１の高周波回路装置において、上記誘電体（１
３），（１１３）を、高誘電率材料（１５），（１１
５）が混入された樹脂からなるものとしたものである。
これにより、上記誘電体（１３），（１１３）を容易に
形成することができ、また、樹脂の材料を変えることに
より、上記誘電体（１３），（１１３）の誘電率を変え
ることができるだけでなく、上記高誘電率材料（１
５），（１１５）の材質または混入比率を変化させるこ
とにより、上記誘電体の誘電率を変えることができ、上
記の疑似的なマイクロストリップ型高周波伝送線路の特
性インピーダンスを上記構成２の高周波回路装置より広
い範囲で制御することができる。Configuration 3. Frequency circuit equipment in the third embodiment of the invention, as shown in FIGS. 19, 20, or 23 and 24, Oite high frequency circuit equipment configuration 1 mentioned above, the dielectric (1
3) and (113) are replaced with high dielectric constant materials (15) and (11
It is made of a resin mixed with 5).
Thereby, the dielectrics (13) and (113) can be easily formed, and the dielectric constants of the dielectrics (13) and (113) can be changed only by changing the resin material. Not the high dielectric constant material (1
By changing the material or mixing ratio of 5) and (115), the dielectric constant of the dielectric can be changed, and the characteristic impedance of the pseudo microstrip type high frequency transmission line can be changed to the high frequency circuit of the above configuration 2. It can be controlled over a wider range than the device.

【００５３】構成４． この発明の実施の形態３における高周波回路装置は、図
１７，１８，１９，２０に示すように、上記の構成１の
高周波回路装置において、上記複数の高周波回路要素の
うちの少なくとも一つを、半導体チップからなる高周波
半導体チップ素子（１）としたものである。これによ
り、上記のように、上記高周波信号ワイヤ（２），上記
接地電位基板（３０），及び上記誘電体（１３，１５）
は、疑似的なマイクロストリップ型高周波伝送線路を構
成することとなり、高周波半導体チップ素子（１）の間
を接続するこの伝送線路を高周波半導体チップ素子
（１）にインピーダンス整合させることができ、上記高
周波信号ワイヤ（２）の接続部分でのインピーダンス不
整合に起因する高周波信号の減衰を防止することができ
る。Configuration 4. Frequency circuit equipment in the third embodiment of the invention, as shown in FIG. 17, 18, 19, 20, Oite high frequency circuit equipment configuration 1 mentioned above, at least of the plurality of high-frequency circuit components One is a high frequency semiconductor chip element (1) including a semiconductor chip. Thereby, as described above, the high frequency signal wire (2), the ground potential substrate (30), and the dielectric (13, 15).
Constitutes a pseudo microstrip type high frequency transmission line, and this transmission line connecting between the high frequency semiconductor chip elements (1) can be impedance-matched to the high frequency semiconductor chip element (1). It is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch at the connection portion of the signal wire (2).

【００５４】構成５． この発明の実施の形態３における高周波回路装置は、図
２１，２２，２３，２４に示すように、上記の構成１の
高周波回路装置において、上記複数の高周波回路要素の
うちの少なくとも一つを、半導体チップからなる高周波
半導体チップ素子（１０１）をパッケージの内側に設け
てなる高周波半導体パッケージ素子（１００）としたも
のである。これにより、上記のように、上記高周波信号
ワイヤ（１０２），上記接地電位基板（５０），及び上
記誘電体（１１３，１１５）は、疑似的なマイクロスト
リップ型高周波伝送線路を構成することとなり、高周波
半導体パッケージ素子（１００）の間を接続するこの伝
送線路を高周波半導体パッケージ素子（１００）にイン
ピーダンス整合させることができ、上記高周波信号ワイ
ヤ（１０２）の接続部分でのインピーダンス不整合に起
因する高周波信号の減衰を防止することができる。Structure 5. Frequency circuit equipment in the third embodiment of the invention, as shown in FIG. 21, 22, 23, Oite high frequency circuit equipment configuration 1 mentioned above, at least of the plurality of high-frequency circuit components One is a high frequency semiconductor package element (100) in which a high frequency semiconductor chip element (101) made of a semiconductor chip is provided inside a package. As a result, as described above, the high frequency signal wire (102), the ground potential substrate (50), and the dielectrics (113, 115) form a pseudo microstrip high frequency transmission line, This transmission line connecting between the high-frequency semiconductor package elements (100) can be impedance-matched to the high-frequency semiconductor package element (100), and the high-frequency resulting from the impedance mismatch at the connection part of the high-frequency signal wire (102). It is possible to prevent signal attenuation.

【００５５】実施例５．この発明の実施の形態３におけ
る一実施例について説明する。本実施例５は、高周波半
導体チップ素子の間を、高周波信号ワイヤを用いて接続
し、さらにこのワイヤとベース基板（接地電位基板）と
の間に誘電体を設けるようにしたものである。Example 5. An example of the third embodiment of the present invention will be described. In the fifth embodiment, high frequency semiconductor chip elements are connected by using high frequency signal wires, and a dielectric is provided between the wires and the base substrate (ground potential substrate).

【００５６】図１７，図１８に本実施例５による、基板
３０上に二つの高周波半導体チップ素子１を備え、これ
らの素子１の間をワイヤ２で接続した高周波回路装置の
斜視図，側面図を示す。図１〜１６と同一部分には同一
符号を付して、その詳しい説明は省略する。図におい
て、１３はエポキシ樹脂からなる誘電体であり、３０は
少なくともその表面の電位が接地電位に固定されている
ベース基板（接地電位基板）である。17 and 18, a perspective view and a side view of a high frequency circuit device according to the fifth embodiment in which two high frequency semiconductor chip elements 1 are provided on a substrate 30 and the elements 1 are connected by wires 2. Indicates. The same parts as those in FIGS. 1 to 16 are designated by the same reference numerals, and detailed description thereof will be omitted. In the figure, 13 is a dielectric made of epoxy resin, and 30 is a base substrate (ground potential substrate) whose surface potential is fixed to the ground potential.

【００５７】これらの高周波半導体チップ素子１の間に
おいては、高周波信号ボンディングパッド４間は、この
ボンディングパッド４にワイヤボンディングされた高周
波信号ワイヤ２により接続され、さらに、このワイヤ２
と接地電位基板である上記ベース基板３０表面の間にエ
ポキシ樹脂からなる誘電体１３が設けられ、高周波信号
ワイヤ２，誘電体１３，及びベース基板３０は疑似的な
マイクロストリップ型高周波伝送線路を構成している。
なお、誘電体１３には、上記のエポキシ樹脂の他にシリ
コン樹脂，ポリイミド樹脂等を用いてもよい。誘電体１
３の材質を変化させることにより、その誘電率を変える
ことができる。本実施例５は、上記実施例３のように高
周波半導体チップ素子１の間を高周波信号ワイヤ２，及
び接地電位ワイヤ１２により接続するのではなく、高周
波信号ワイヤ２のみによって接続している。Between the high-frequency semiconductor chip elements 1, the high-frequency signal bonding pads 4 are connected by the high-frequency signal wires 2 wire-bonded to the bonding pads 4, and the wires 2 are also connected.
A dielectric 13 made of epoxy resin is provided between the base substrate 30 and the surface of the base substrate 30 which is a ground potential substrate, and the high frequency signal wire 2, the dielectric 13 and the base substrate 30 constitute a pseudo microstrip high frequency transmission line. is doing.
In addition to the above epoxy resin, silicon resin, polyimide resin, or the like may be used for the dielectric 13. Dielectric 1
By changing the material of No. 3, the dielectric constant can be changed. In the fifth embodiment, the high frequency semiconductor chip elements 1 are not connected by the high frequency signal wire 2 and the ground potential wire 12 as in the third embodiment, but are connected only by the high frequency signal wire 2.

【００５８】本実施例５においては、高周波信号ワイヤ
２，誘電体１３，及びベース基板（接地電位基板）３０
は、疑似的なマイクロストリップ型高周波伝送線路を構
成することとなり、高周波信号ワイヤ２と接地電位基板
３０表面との間の距離，誘電体１３の誘電率等を適切な
値に設定することにより、この伝送線路の特性インピー
ダンスを、高周波半導体チップ素子１において高周波信
号ボンディングパッド４に接続されている伝送線路６の
特性インピーダンスと整合させることができる。このた
め、上記高周波信号ワイヤ２と上記高周波回路要素１と
の間のインピーダンス不整合に起因する高周波信号の減
衰を防止することができる。In the fifth embodiment, the high frequency signal wire 2, the dielectric 13, and the base substrate (ground potential substrate) 30 are used.
Will constitute a pseudo microstrip high-frequency transmission line, and by setting the distance between the high-frequency signal wire 2 and the surface of the ground potential substrate 30 and the dielectric constant of the dielectric 13 to appropriate values, The characteristic impedance of the transmission line can be matched with the characteristic impedance of the transmission line 6 connected to the high frequency signal bonding pad 4 in the high frequency semiconductor chip element 1. Therefore, it is possible to prevent the attenuation of the high frequency signal due to the impedance mismatch between the high frequency signal wire 2 and the high frequency circuit element 1.

【００５９】高周波半導体チップ素子１に設けられた伝
送線路６の特性インピーダンスは通常５０Ωとなってお
り、この場合、高周波信号ワイヤ２から構成される上記
の疑似的なマイクロストリップ型伝送線路のインピーダ
ンスも５０Ωに近づくように、高周波信号ワイヤ２とベ
ース基板３０表面との間の距離，誘電体１３の誘電率等
を設定すればよい。The characteristic impedance of the transmission line 6 provided on the high-frequency semiconductor chip element 1 is usually 50Ω, and in this case, the impedance of the pseudo microstrip type transmission line composed of the high-frequency signal wire 2 is also. The distance between the high-frequency signal wire 2 and the surface of the base substrate 30 and the dielectric constant of the dielectric 13 may be set so as to approach 50Ω.

【００６０】また、上記の図１７，図１８に示した高周
波回路装置においては、誘電体１３には樹脂を用いてい
るが、図１９，図２０に示すように、この誘電体として
樹脂１３に高誘電率材料であるチタン酸バリウム１５等
の粒子を混入したものを用いてもよい。なお、この高誘
電率材料には上記のチタン酸バリウムの他に、チタン酸
カルシウム，ニオブ酸リチウム等を用いてもよい。この
ような高誘電率材料の粒子の混入密度，またはこの高誘
電率材料の材質を変えることにより、誘電体１３の誘電
率を広い範囲で変化させることができ、上記の疑似的な
マイクロストリップ型高周波伝送線路の特性インピーダ
ンスの制御を容易に行うことができることとなる。In the high frequency circuit device shown in FIGS. 17 and 18, resin is used as the dielectric 13, but as shown in FIGS. 19 and 20, the resin 13 is used as the dielectric. A material in which particles such as barium titanate 15 which is a high dielectric constant material are mixed may be used. In addition to the above barium titanate, calcium titanate, lithium niobate or the like may be used as the high dielectric constant material. By changing the mixing density of the particles of the high dielectric constant material or the material of the high dielectric constant material, the dielectric constant of the dielectric body 13 can be changed in a wide range. It is possible to easily control the characteristic impedance of the high frequency transmission line.

【００６１】また、上記の図１７〜２０に示した高周波
回路装置は、高周波半導体チップ素子１の間を接続した
ものであるが、上記実施例１と同様に、高周波半導体チ
ップ素子１と高周波伝送用スルー線路８との間，高周波
半導体チップ素子１とパッケージ７０との間，高周波伝
送用スルー線路８とパッケージ７０との間を、上記のよ
うなワイヤ２，誘電体１３，及びベース基板３０からな
る疑似的なマイクロストリップ型高周波伝送線路により
接続してもよく、この場合もワイヤによる接続部分での
インピーダンス不整合に起因する高周波信号の減衰を防
止することができる。なお、ここでは高周波信号ワイヤ
２にＡｕリボン等を用いてもよい。The high-frequency circuit device shown in FIGS. 17 to 20 has the high-frequency semiconductor chip elements 1 connected to each other. However, similar to the first embodiment, the high-frequency semiconductor chip element 1 and the high-frequency transmission signal are transmitted. From the wire 2, the dielectric 13, and the base substrate 30 as described above, between the through line 8 and the high frequency semiconductor chip element 1 and the package 70 and between the high frequency transmission through line 8 and the package 70. The pseudo-microstrip high-frequency transmission line may be used for connection, and in this case as well, it is possible to prevent attenuation of the high-frequency signal due to impedance mismatch at the connection portion by the wire. Here, an Au ribbon or the like may be used for the high frequency signal wire 2.

【００６２】実施例６．この発明の実施の形態３におけ
る他の実施例について説明する。本実施例６は、その内
部に高周波半導体チップ素子を備えたパッケージからな
る高周波半導体パッケージ素子の間を、上記実施例５と
同様に、高周波信号ワイヤにより接続し、この高周波信
号ワイヤと接地電位基板表面との間に誘電体を設けるよ
うにしたものである。Example 6. Another example of the third embodiment of the present invention will be described. In the sixth embodiment, high-frequency semiconductor package elements including a package having a high-frequency semiconductor chip element therein are connected by high-frequency signal wires as in the fifth embodiment, and the high-frequency signal wires and the ground potential substrate are connected. A dielectric is provided between the surface and the surface.

【００６３】図２１，図２２に本実施例６による、接地
電位基板５０上に二つの高周波半導体パッケージ素子１
００を備え、これらの素子１００の間をワイヤ１０２で
接続した高周波回路装置の斜視図，側面図を示す。図１
〜２０と同一部分には同一符号を付して、その詳しい説
明は省略する。図２１，図２２に示した高周波回路装置
は、高周波半導体パッケージ素子１００の間において、
パッケージ側伝送線路９間を高周波信号ワイヤ１０２で
接続し、さらに高周波信号ワイヤ１０２と基板５０表面
との間にエポキシ樹脂からなる誘電体１１３を設けたも
のである。ただし、上記基板５０は少なくとも上記ワイ
ヤ１０２直下の表面部分が接地電位に固定されている接
地電位基板である。なお、誘電体１１３には、上記のエ
ポキシ樹脂の他にシリコン樹脂，ポリイミド樹脂等を用
いてもよい。誘電体１１３の材質を変化させることによ
り、その誘電率を変えることができる。パッケージ側伝
送線路９及びこれらを接続する高周波信号ワイヤ１０２
は上記実施例２の図７，８に示したものと同じでもので
ある。このワイヤ１０２と接地電位基板５０の間にエポ
キシ樹脂からなる誘電体１１３が設けられているため、
上記実施例５と同様に、ワイヤ１０２，誘電体１１３，
及び接地電位基板５０により、疑似的なマイクロストリ
ップ型高周波伝送線路が構成されることとなる。21 and 22, according to the sixth embodiment, two high frequency semiconductor package devices 1 are mounted on the ground potential substrate 50.
00 is provided, and a perspective view and a side view of a high frequency circuit device in which these elements 100 are connected by wires 102 are shown. Figure 1
The same parts as 20 to 20 are designated by the same reference numerals, and detailed description thereof will be omitted. The high frequency circuit device shown in FIG. 21 and FIG.
The package-side transmission line 9 is connected by a high-frequency signal wire 102, and a dielectric 113 made of epoxy resin is further provided between the high-frequency signal wire 102 and the surface of the substrate 50. However, the substrate 50 is a ground potential substrate in which at least the surface portion immediately below the wire 102 is fixed to the ground potential. In addition to the above epoxy resin, silicon resin, polyimide resin, or the like may be used for the dielectric 113. The dielectric constant can be changed by changing the material of the dielectric 113. The transmission line 9 on the package side and the high-frequency signal wire 102 connecting them
Is the same as that shown in FIGS. 7 and 8 of the second embodiment. Since the dielectric 113 made of epoxy resin is provided between the wire 102 and the ground potential substrate 50,
Similar to the fifth embodiment, the wire 102, the dielectric 113,
The ground potential substrate 50 constitutes a pseudo microstrip high-frequency transmission line.

【００６４】本実施例６においては、高周波信号ワイヤ
１０２，誘電体１１３，及び接地電位基板５０は、疑似
的なマイクロストリップ型高周波伝送線路を構成するこ
ととなり、高周波信号ワイヤ１０２と接地電位基板５０
表面との間の距離，誘電体１１３の誘電率等を適切な値
に設定することにより、この伝送線路の特性インピーダ
ンスを、パッケージ側伝送線路９の特性インピーダンス
と整合させることができる。このため、上記高周波信号
ワイヤ１０２と上記高周波半導体パッケージ素子１００
との間のインピーダンス不整合に起因する高周波信号の
減衰を防止することができる。In the sixth embodiment, the high-frequency signal wire 102, the dielectric 113, and the ground potential board 50 constitute a pseudo microstrip high-frequency transmission line, and the high-frequency signal wire 102 and the ground potential board 50.
The characteristic impedance of this transmission line can be matched with the characteristic impedance of the package side transmission line 9 by setting the distance from the surface, the dielectric constant of the dielectric 113, etc. to appropriate values. Therefore, the high-frequency signal wire 102 and the high-frequency semiconductor package device 100
It is possible to prevent the high frequency signal from being attenuated due to the impedance mismatch between and.

【００６５】パッケージ側伝送線路９の特性インピーダ
ンスは通常５０Ωとなっており、この場合上記の疑似的
なマイクロストリップ型伝送線路のインピーダンスも５
０Ωに近づくようにする。The characteristic impedance of the package side transmission line 9 is usually 50Ω, and in this case, the impedance of the pseudo microstrip type transmission line is also 5Ω.
Try to approach 0Ω.

【００６６】また、上記の図２１，図２２に示した高周
波回路装置においては、誘電体１１３には樹脂を用いて
いるが、図２３，図２４に示すように、この誘電体１１
３として樹脂に高誘電率材料であるチタン酸バリウム１
１５等の粒子を混入したものを用いてもよい。なお、こ
の高誘電率材料には上記のチタン酸バリウムの他に、チ
タン酸カルシウム，ニオブ酸リチウム等を用いてもよ
い。このような高誘電率材料の粒子の混入密度，または
この高誘電率材料の材質を変えることにより、誘電体１
１３の誘電率を広い範囲で変化させることができ、上記
の疑似的なマイクロストリップ型高周波伝送線路の特性
インピーダンスの制御を容易に行うことができることと
なる。In the high frequency circuit device shown in FIGS. 21 and 22, resin is used as the dielectric material 113. However, as shown in FIGS.
3 as barium titanate, which is a high dielectric constant material for resin
You may use what mixed particles, such as 15. In addition to the above barium titanate, calcium titanate, lithium niobate or the like may be used as the high dielectric constant material. By changing the mixing density of particles of such a high dielectric constant material or the material of this high dielectric constant material, the dielectric 1
The permittivity of 13 can be changed in a wide range, and the above-mentioned pseudo characteristic impedance of the microstrip type high frequency transmission line can be easily controlled.

【００６７】なお、ここでは高周波信号ワイヤ２にＡｕ
リボン等を用いてもよい。Note that, here, the high frequency signal wire 2 is made of Au.
A ribbon or the like may be used.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明の第１の実施例による高周波回路装置
を示す斜視図である。FIG. 1 is a perspective view showing a high frequency circuit device according to a first embodiment of the present invention.

【図２】 本発明の第１の実施例による高周波回路装置
を示す側面図である。FIG. 2 is a side view showing the high-frequency circuit device according to the first embodiment of the present invention.

【図３】 本発明の第１の実施例による高周波回路装置
を示す上面図である。FIG. 3 is a top view showing the high-frequency circuit device according to the first embodiment of the present invention.

【図４】 本発明の第１の実施例によるパッケージ内に
高周波半導体チップ素子を設けてなる高周波回路装置を
示す上面図である。FIG. 4 is a top view showing a high-frequency circuit device provided with a high-frequency semiconductor chip element in a package according to the first embodiment of the present invention.

【図５】 本発明の第１の実施例によるパッケージ内に
高周波半導体チップ素子を設けてなる高周波回路装置を
示す断面図である。FIG. 5 is a cross-sectional view showing a high frequency circuit device in which a high frequency semiconductor chip element is provided in a package according to the first embodiment of the present invention.

【図６】 本発明の第１の実施例による二つの高周波伝
送用スルー線路を接続してなる高周波回路装置における
高周波信号の減衰量を示す図である。FIG. 6 is a diagram showing an attenuation amount of a high frequency signal in a high frequency circuit device formed by connecting two through lines for high frequency transmission according to the first embodiment of the present invention.

【図７】 本発明の第２の実施例による高周波回路装置
を示す斜視図である。FIG. 7 is a perspective view showing a high frequency circuit device according to a second embodiment of the present invention.

【図８】 本発明の第２の実施例による高周波回路装置
を示す側面図である。FIG. 8 is a side view showing a high frequency circuit device according to a second embodiment of the present invention.

【図９】 本発明の第３の実施例による高周波回路装置
を示す斜視図である。FIG. 9 is a perspective view showing a high frequency circuit device according to a third embodiment of the present invention.

【図１０】 本発明の第３の実施例による高周波回路装
置を示す側面図である。FIG. 10 is a side view showing a high frequency circuit device according to a third embodiment of the present invention.

【図１１】 本発明の第３の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す斜視図である。FIG. 11 is a perspective view showing a high frequency circuit device provided with a dielectric made of a resin mixed with a high dielectric constant material according to a third embodiment of the present invention.

【図１２】 本発明の第３の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す側面図である。FIG. 12 is a side view showing a high frequency circuit device provided with a dielectric made of a resin mixed with a high dielectric constant material according to a third embodiment of the present invention.

【図１３】 本発明の第４の実施例による高周波回路装
置を示す斜視図である。FIG. 13 is a perspective view showing a high frequency circuit device according to a fourth embodiment of the present invention.

【図１４】 本発明の第４の実施例による高周波回路装
置を示す側面図である。FIG. 14 is a side view showing a high frequency circuit device according to a fourth embodiment of the present invention.

【図１５】 本発明の第４の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す斜視図である。FIG. 15 is a perspective view showing a high frequency circuit device provided with a dielectric made of a resin mixed with a high dielectric constant material according to a fourth embodiment of the present invention.

【図１６】 本発明の第４の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す側面図である。FIG. 16 is a side view showing a high frequency circuit device provided with a dielectric made of a resin mixed with a high dielectric constant material according to a fourth embodiment of the present invention.

【図１７】 本発明の第５の実施例による高周波回路装
置を示す斜視図である。FIG. 17 is a perspective view showing a high frequency circuit device according to a fifth embodiment of the present invention.

【図１８】 本発明の第５の実施例による高周波回路装
置を示す側面図である。FIG. 18 is a side view showing a high frequency circuit device according to a fifth embodiment of the present invention.

【図１９】 本発明の第５の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す斜視図である。FIG. 19 is a perspective view showing a high frequency circuit device including a dielectric made of a resin mixed with a high dielectric constant material according to a fifth embodiment of the present invention.

【図２０】 本発明の第５の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す側面図である。FIG. 20 is a side view showing a high frequency circuit device including a dielectric made of a resin mixed with a high dielectric constant material according to a fifth embodiment of the present invention.

【図２１】 本発明の第６の実施例による高周波回路装
置を示す斜視図である。FIG. 21 is a perspective view showing a high frequency circuit device according to a sixth embodiment of the present invention.

【図２２】 本発明の第６の実施例による高周波回路装
置を示す側面図である。FIG. 22 is a side view showing a high frequency circuit device according to a sixth embodiment of the present invention.

【図２３】 本発明の第６の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す斜視図である。FIG. 23 is a perspective view showing a high frequency circuit device having a dielectric made of a resin mixed with a high dielectric constant material according to a sixth embodiment of the present invention.

【図２４】 本発明の第６の実施例による高誘電率材料
が混入された樹脂からなる誘電体を備えた高周波回路装
置を示す側面図である。FIG. 24 is a side view showing a high frequency circuit device provided with a dielectric made of a resin mixed with a high dielectric constant material according to a sixth embodiment of the present invention.

【図２５】 従来の高周波回路装置を示す側面図であ
る。FIG. 25 is a side view showing a conventional high-frequency circuit device.

【図２６】 従来の高周波回路装置を示す上面図であ
る。FIG. 26 is a top view showing a conventional high-frequency circuit device.

【図２７】 従来のパッケージ内に高周波半導体チップ
素子を設けてなる高周波回路装置を示す上面図である。FIG. 27 is a top view showing a high-frequency circuit device provided with a high-frequency semiconductor chip element in a conventional package.

【図２８】 従来の二つの高周波伝送用スルー線路を接
続してなる高周波回路装置における高周波信号の減衰量
を示す図である。FIG. 28 is a diagram showing an attenuation amount of a high frequency signal in a high frequency circuit device in which two conventional through lines for high frequency transmission are connected.

【符号の説明】[Explanation of symbols]

１，６１，１０１ 高周波半導体チップ素子（高周波回
路要素）、２，１０２高周波信号ワイヤ、３ ダイボン
ド材、４ 高周波信号ボンディングパッド、５ 集積回
路（ＩＣ）パターン、６ 高周波伝送線路、８，６８
高周波伝送用スルー線路（高周波回路要素）、９ パッ
ケージ側伝送線路、１１ 接地電位ボンディングパッ
ド、１２，１１２ 接地電位ワイヤ、１３，１１３ 樹
脂（誘電体）、１５，１１５ チタン酸バリウム（高誘
電率材料）、２０ ベース基板、３０ ベース基板（接
地電位基板）、２１ 下層セラミック枠体、２２ 上層
セラミック枠体、２３ 蓋、３１ パッケージ側接地電
位ボンディングパッド、３２ 接地電位ボンディングパ
ッド、４０ 基板、５０ 基板（接地電位基板）、７０
パッケージ、１００ 高周波半導体パッケージ素子。1,61,101 high frequency semiconductor chip element (high frequency circuit element), 2,102 high frequency signal wire, 3 die bonding material, 4 high frequency signal bonding pad, 5 integrated circuit (IC) pattern, 6 high frequency transmission line, 8,68
High frequency transmission through line (high frequency circuit element), 9 package side transmission line, 11 ground potential bonding pad, 12,112 ground potential wire, 13,113 resin (dielectric), 15,115 barium titanate (high dielectric constant material) ), 20 base substrate, 30 base substrate (ground potential substrate), 21 lower layer ceramic frame, 22 upper layer ceramic frame, 23 lid, 31 package side ground potential bonding pad, 32 ground potential bonding pad, 40 substrate, 50 substrate ( Ground potential substrate), 70
Package, 100 High frequency semiconductor package device.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 25/04 H01L 25/18 H01L 23/538 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 25/04 H01L 25/18 H01L 23/538

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 高周波信号ボンディングパッド，及び該
高周波信号ボンディングパッドの両側に設けられた接地
電位ボンディングパッドを各々有する複数の高周波回路
要素と、 隣接する二つの上記高周波回路要素の間において、上記
高周波信号ボンディングパッドの間を接続する高周波信
号ワイヤと、 該二つの高周波回路要素の間において、該高周波信号ボ
ンディングパッドの両側に設けられた上記接地電位ボン
ディングパッドの間を接続する、該高周波信号ワイヤに
平行に設けられた接地電位ワイヤと、 その表面上に上記高周波回路要素が設けられており、少
なくとも上記高周波信号ワイヤ及び上記接地ワイヤの直
下の表面部分が接地電位である接地電位基板と、 該接地電位基板と、該高周波信号ワイヤ及び該接地電位
ワイヤとの間に設けられた樹脂からなる誘電体 とを備え
たことを特徴とする高周波回路装置。1. A plurality of high-frequency circuit elements each having a high-frequency signal bonding pad and a ground potential bonding pad provided on both sides of the high-frequency signal bonding pad, and the high-frequency circuit element between two adjacent high-frequency circuit elements. A high-frequency signal wire connecting between the signal bonding pads and the high-frequency signal wire connecting between the ground potential bonding pads provided on both sides of the high-frequency signal bonding pad between the two high-frequency circuit elements. and ground potential wire provided in parallel, the high frequency circuit element is provided on its surface, low
If not, directly connect the high frequency signal wire and the ground wire.
A ground potential substrate having a lower surface portion at the ground potential, the ground potential substrate, the high-frequency signal wire, and the ground potential
A high frequency circuit device, comprising: a dielectric made of resin provided between the wire and the wire . 【請求項２】 高周波信号ボンディングパッド，及び該
高周波信号ボンディングパッドの両側に設けられた接地
電位ボンディングパッドを各々有する複数の高周波回路
要素と、 隣接する二つの上記高周波回路要素の間において、上記
高周波信号ボンディングパッドの間を接続する高周波信
号ワイヤと、 該二つの高周波回路要素の間において、該高周波信号ボ
ンディングパッドの両側に設けられた上記接地電位ボン
ディングパッドの間を接続する、該高周波信号ワイヤに
平行に設けられた接地電位ワイヤと、 その表面上に上記高周波回路要素が設けられており、少
なくとも上記高周波信号ワイヤ及び上記接地ワイヤの直
下の表面部分が接地電位である接地電位基板と、 該接地電位基板と、該高周波信号ワイヤ及び該接地電位
ワイヤとの間に設けられた高誘電率材料が混入された樹
脂からなる誘電体とを備えたことを特徴とする高周波回
路装置。2. A high frequency signal bonding pad, and the same.
Grounding provided on both sides of the high frequency signal bonding pad
Multiple high frequency circuits each having a potential bonding pad
Between the element and two adjacent high frequency circuit elements,
High frequency signal for connecting between high frequency signal bonding pads
Between the signal wire and the two high-frequency circuit elements,
The ground potential bonder provided on both sides of the bonding pad.
The high-frequency signal wire that connects between the
A ground potential wire provided in parallel, the high frequency circuit element provided on the surface thereof, and a ground potential substrate having at least the high frequency signal wire and the surface portion immediately below the ground wire at the ground potential; A tree mixed with a high dielectric constant material provided between the potential substrate and the high frequency signal wire and the ground potential wire.
A high-frequency circuit device comprising a dielectric made of fat . 【請求項３】 高周波信号ボンディングパッドを各々有
する複数の高周波回路要素と、 隣接する二つの上記高周波回路要素の間において、上記
高周波信号ボンディングパッドの間を接続する高周波信
号ワイヤと、 その表面上に上記高周波回路要素が設けられており、少
なくとも該高周波信号ワイヤ直下の表面部分が接地電位
である接地電位基板と、 該接地電位基板と該高周波信号ワイヤとの間に設けられ
た樹脂からなる誘電体とを備えたことを特徴とする高周
波回路装置。3. A plurality of high-frequency circuit elements each having a high-frequency signal bonding pad, a high-frequency signal wire connecting between the high-frequency signal bonding pads between two adjacent high-frequency circuit elements, and a high-frequency signal wire on the surface thereof. The high-frequency circuit element is provided, and at least the surface portion immediately under the high-frequency signal wire has a ground potential, and a dielectric made of a resin provided between the ground potential substrate and the high-frequency signal wire. A high-frequency circuit device comprising: 【請求項４】 高周波信号ボンディングパッドを各々有
する複数の高周波回路要素と、 隣接する二つの上記高周波回路要素の間において、上記
高周波信号ボンディングパッドの間を接続する高周波信
号ワイヤと、 その表面上に上記高周波回路要素が設けられており、少
なくとも該高周波信号ワイヤ直下の表面部分が接地電位
である接地電位基板と、 該接地電位基板と該高周波信号ワイヤとの間に設けられ
た高誘電率材料が混入された 樹脂からなる誘電体とを備
えたことを特徴とする高周波回路装置。4. A high frequency signal bonding pad is provided respectively.
Between a plurality of high-frequency circuit elements and two adjacent high-frequency circuit elements
High frequency signal for connecting between high frequency signal bonding pads
No. wire and the above-mentioned high-frequency circuit element on its surface.
If not, the surface part directly under the high-frequency signal wire is at ground potential.
Ground potential substrate is provided between the ground potential substrate and said high-frequency signal wire
Bei a dielectric high dielectric constant material comprises entrained resin
Frequency circuit device, characterized in that was e.
JP30923895A 1995-11-28 1995-11-28 High frequency circuit device Expired - Fee Related JP3489926B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP30923895A JP3489926B2 (en) 1995-11-28 1995-11-28 High frequency circuit device
DE1996141875 DE19641875C2 (en) 1995-11-28 1996-10-10 High frequency circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30923895A JP3489926B2 (en) 1995-11-28 1995-11-28 High frequency circuit device

Publications (2)

Publication Number Publication Date
JPH09148524A JPH09148524A (en) 1997-06-06
JP3489926B2 true JP3489926B2 (en) 2004-01-26

Family

ID=17990598

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JP30923895A Expired - Fee Related JP3489926B2 (en) 1995-11-28 1995-11-28 High frequency circuit device

Country Status (2)

Country Link
JP (1) JP3489926B2 (en)
DE (1) DE19641875C2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3842201B2 (en) 2002-10-29 2006-11-08 三菱電機株式会社 High frequency circuit board connection structure, manufacturing method thereof, and high frequency circuit device
JP4083142B2 (en) * 2004-06-02 2008-04-30 富士通株式会社 Semiconductor device
DE102005012494A1 (en) * 2005-03-16 2006-09-28 Shf Communication Technologies Ag Bonding procedure for connecting microwave circuits, involves using bonding wire that has round cross-section, has no loss or low loss, and is covered with electrically non-conductive dielectric
JP4283820B2 (en) 2006-05-31 2009-06-24 ユーディナデバイス株式会社 Electronic equipment
WO2008041682A1 (en) 2006-10-02 2008-04-10 Kabushiki Kaisha Toshiba Semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
JP2763445B2 (en) * 1992-04-03 1998-06-11 三菱電機株式会社 High frequency signal wiring and bonding device therefor
JPH0883813A (en) * 1994-09-09 1996-03-26 Mitsubishi Electric Corp High-frequency semiconductor device and its manufacture

Also Published As

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JPH09148524A (en) 1997-06-06
DE19641875A1 (en) 1997-06-05
DE19641875C2 (en) 2001-03-15

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