JP3467297B2 - Electronic cooling unit - Google Patents
Electronic cooling unitInfo
- Publication number
- JP3467297B2 JP3467297B2 JP27687493A JP27687493A JP3467297B2 JP 3467297 B2 JP3467297 B2 JP 3467297B2 JP 27687493 A JP27687493 A JP 27687493A JP 27687493 A JP27687493 A JP 27687493A JP 3467297 B2 JP3467297 B2 JP 3467297B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electrode
- substrate
- cooling unit
- electronic cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば冷蔵庫、エアコ
ン、冷水機などに使用する電子冷却ユニツトに係り、特
にペルチエ素子（電子冷却素子）を使用した電子冷却ユ
ニツトに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic cooling unit used in, for example, a refrigerator, an air conditioner, a chiller, etc., and more particularly to an electronic cooling unit using a Peltier element (electronic cooling element).
【０００２】[0002]
【従来の技術】熱電変換素子のうち、電気エネルギーを
投入して所定のものを冷却する素子はペルチエ素子ある
いは電子冷却素子と称され、例えばコンパクトな冷蔵庫
などの電子冷却ユニツトに使用されている。2. Description of the Related Art Among thermoelectric conversion elements, an element that applies electric energy to cool a predetermined element is called a Peltier element or an electronic cooling element, and is used in an electronic cooling unit such as a compact refrigerator.
【０００３】従来の電子冷却ユニツトは図１３に示すよ
うに、アルミナなどからなる下側絶縁基板１００の上に
吸熱側半田層１０１を介して吸熱側電極１０２が形成さ
れ、その吸熱側電極１０２の上にＰ形半導体層１０３と
Ｎ形半導体層１０４とがそれぞれ形成されている。この
Ｐ形半導体層１０３とＮ形半導体層１０４とを接続する
ように放熱側電極１０５が形成され、さらにその上に放
熱側半田層１０６を介してアルミナなどからなる上側絶
縁基板１０７が設けられている。In a conventional electronic cooling unit, as shown in FIG. 13, a heat absorbing side electrode 102 is formed on a lower insulating substrate 100 made of alumina or the like via a heat absorbing side solder layer 101. A P-type semiconductor layer 103 and an N-type semiconductor layer 104 are formed on each. A heat radiation side electrode 105 is formed so as to connect the P type semiconductor layer 103 and the N type semiconductor layer 104, and an upper insulating substrate 107 made of alumina or the like is further provided thereon via a heat radiation side solder layer 106. There is.
【０００４】前記Ｐ形半導体層１０３とＮ形半導体層１
０４は一対になつて下側絶縁基板１００と上側絶縁基板
１０７の間に多数並列に介在されているとともに、電気
的には直列に接続されて電子冷却素子群を構成してい
る。The P-type semiconductor layer 103 and the N-type semiconductor layer 1
A plurality of 04 are interposed in parallel between the lower insulating substrate 100 and the upper insulating substrate 107, and are electrically connected in series to form an electronic cooling element group.
【０００５】この電子冷却ユニツトに所定の電流を流す
ことにより、下側絶縁基板１００側の方が吸熱され、そ
の周囲が冷却される。一方、上側絶縁基板１０７側は放
熱するから、放熱フインやフアンなどによつて外部へ放
熱されることにより熱移動が起こる仕組みになつてい
る。By passing a predetermined current through the electronic cooling unit, the lower insulating substrate 100 side absorbs heat and the surrounding area is cooled. On the other hand, since the upper insulating substrate 107 side radiates heat, the heat is transferred by being radiated to the outside by a heat radiation fin or fan.
【０００６】そして前記下側絶縁基板１００と上側絶縁
基板１０７の外周部は、図示していないがシール剤によ
つてシールされている。The outer peripheral portions of the lower insulating substrate 100 and the upper insulating substrate 107 are sealed with a sealant (not shown).
【０００７】[0007]
【発明が解決しようとする課題】この電子冷却ユニツト
を使用していると、吸熱側に相当する下側絶縁基板１０
０の外表面に結露を生じる。When this electronic cooling unit is used, the lower insulating substrate 10 corresponding to the heat absorbing side is used.
Condensation occurs on the outer surface of 0.
【０００８】従来の電子冷却ユニツトは下側絶縁基板１
００とシール剤との密着性が不十分なため、結露によっ
て下側絶縁基板１００に付着した水分が下側絶縁基板１
００の表面を伝わつて電子冷却ユニツトの内部に侵入す
る。そしてその水分によつて半導体が酸化されたり、電
極が腐食されたりして、性能劣化を引き起こすという欠
点を有している。The conventional electronic cooling unit has a lower insulating substrate 1
00 is not sufficiently adhered to the sealant, so that moisture attached to the lower insulating substrate 100 due to dew condensation may cause the lower insulating substrate 1
00 to penetrate the inside of the electronic cooling unit. The moisture causes the semiconductor to be oxidized and the electrode to be corroded, resulting in a performance deterioration.
【０００９】また図示していないが、この電子冷却ユニ
ツトへ給電するためのリード体が電極に接続される訳で
あり、従来の電子冷却ユニツトではそのリード体をシー
ル剤層の内部を貫通して、または絶縁基体とシール剤層
の接合部を貫通してユニツトの外側に引き出していた。Although not shown, the lead body for supplying power to the electronic cooling unit is connected to the electrode. In the conventional electronic cooling unit, the lead body penetrates the inside of the sealant layer. Alternatively, it penetrates through the joint between the insulating substrate and the sealant layer and is pulled out to the outside of the unit.
【００１０】このように従来のものはリード体がシール
部を横断した構造になっているため、例えばリード体と
シール剤層の間、ならびにリード体と絶縁基体の間など
において隙間ができ易く、さらにリード体があることか
らシール強度を十分に高くすることができず、そのため
に水分（湿気）が電子冷却ユニツトの内部に侵入し、前
述と同じ弊害を引き起こしていた。As described above, since the conventional lead body has a structure in which the lead body traverses the seal portion, gaps are easily formed between the lead body and the sealant layer and between the lead body and the insulating substrate, for example. Further, since there is a lead body, the sealing strength cannot be made sufficiently high, which causes moisture (humidity) to enter the electronic cooling unit, causing the same adverse effect as described above.
【００１１】本発明の目的は、このような従来技術の欠
点を解消し、性能劣化が少なく、耐用寿命の長い電子冷
却ユニツトを提供することにある。An object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide an electronic cooling unit which has little performance deterioration and has a long service life.
【００１２】[0012]
【課題を解決するための手段】前記目的を達成するた
め、第１の本発明は、吸熱側電極と、放熱側電極と、前
記吸熱側電極と放熱側電極との間に並設されたＰ型半導
体層ならびにＮ型半導体層と、前記吸熱側電極の外側に
配置された吸熱側基体と、前記放熱側電極の外側に配置
された放熱側基体とを備え、その吸熱側基体と放熱側基
体を対向して配置し、その両基体間に前記吸熱側電極、
Ｐ型半導体層ならびにＮ型半導体層、放熱側電極が介在
された電子冷却ユニツトを対象とするものである。In order to achieve the above object, the first aspect of the present invention is to provide a heat absorbing side electrode, a heat radiating side electrode, and a P provided in parallel between the heat absorbing side electrode and the heat radiating side electrode. -Type semiconductor layer and N-type semiconductor layer, a heat-absorption-side substrate arranged outside the heat-absorption-side electrode, and a heat-dissipation-side substrate arranged outside the heat-dissipation-side electrode. Are arranged to face each other, and the heat absorption side electrode is disposed between the two bases,
The target is an electronic cooling unit in which a P-type semiconductor layer, an N-type semiconductor layer, and a heat dissipation side electrode are interposed.
【００１３】そして前記吸熱側基体と放熱側基体の対向
部でかつ前記電極が施されていない外周部全周にＯリン
グを介在して吸熱側基体と放熱側基体との間を締め付
け、前記対向部とＯリングの外周部とによつて形成され
る溝部にシール剤を充填して、吸熱側基体と放熱側基体
の外周部を密封したことを特徴とするものである。Then, an O-ring is interposed between the heat absorbing side base body and the heat radiating side base body at the opposing portions and the entire circumference of the outer peripheral portion where the electrodes are not provided, and the heat absorbing side base body and the heat radiating side base body are clamped to each other. The sealant is filled in the groove formed by the portion and the outer peripheral portion of the O-ring to seal the outer peripheral portion of the heat absorbing side base and the heat radiating side base.
【００１４】前記目的を達成するため、第２の本発明
は、吸熱側電極と、放熱側電極と、前記吸熱側電極と放
熱側電極との間に並設されたＰ型半導体層ならびにＮ型
半導体層と、前記吸熱側電極の外側に配置された吸熱側
基体と、前記放熱側電極の外側に配置された放熱側基体
とを備え、その吸熱側基体と放熱側基体を対向して配置
し、その両基体間に前記吸熱側電極、Ｐ型半導体層なら
びにＮ型半導体層、放熱側電極が介在された電子冷却ユ
ニツトを対象とするものである。In order to achieve the above-mentioned object, a second aspect of the present invention provides a heat absorbing side electrode, a heat radiating side electrode, a P type semiconductor layer and an N type semiconductor layer arranged in parallel between the heat absorbing side electrode and the heat radiating side electrode. A semiconductor layer, a heat absorption side substrate arranged outside the heat absorption side electrode, and a heat radiation side substrate arranged outside the heat radiation side electrode, and the heat absorption side substrate and the heat radiation side substrate are arranged to face each other. , An electronic cooling unit in which the heat absorption side electrode, the P-type semiconductor layer and the N-type semiconductor layer, and the heat radiation side electrode are interposed between the two substrates.
【００１５】そして前記吸熱側基体と放熱側基体の対向
部でかつ前記電極が施されていない外周部全周にかけ
て、例えばＯリングなどのガスケットあるいはシール剤
またはガスケットとシール剤の併用などから構成される
シール部が設けられ、その吸熱側基体ならびに放熱側基
体のうちの少なくとも一方の基体の前記シール部と接す
るシール面よりも内周側からそのシール面を横断しない
で当該基体の外側に貫通する透孔を形成し、その透孔に
リード体を挿入して、リード体の先端部を前記電極に接
続して、透孔の少なくとも一部を接着剤で閉塞したこと
を特徴とするものである。Then, a gasket such as an O-ring or a sealing agent or a combination of a gasket and a sealing agent is formed over the entire peripheral portion where the electrodes are not provided and where the heat absorbing side substrate and the heat radiating side substrate face each other. that the sealing portion is provided, on the outside of the substrate without traversing the sealing surface from the inner peripheral side than the sealing surface in contact with the sealing portion of the at least one substrate of the heat radiating side substrate each time if the heat-absorption body A through hole is formed, a lead body is inserted into the through hole, the tip of the lead body is connected to the electrode, and at least a part of the through hole is closed with an adhesive. Is.
【００１６】[0016]
【作用】前記第１の本発明は前述したように、吸熱側基
体と放熱側基体との間にＯリングが介在されて両基体ど
うしが機械的に締め付けられ、そのＯリングの外周部が
シール剤で密封された二重のシール構造になっている。As described above, according to the first aspect of the present invention, the O-ring is interposed between the heat absorbing side base and the heat radiating side base to mechanically clamp the bases together, and the outer peripheral portion of the O ring is sealed. It has a double seal structure that is hermetically sealed with a chemical.
【００１７】そのため、特に吸熱側基体からの水分の侵
入が有効に阻止され、半導体の酸化や電極の腐食などの
問題が解消されて、性能劣化の少ない耐用寿命の長い電
子冷却ユニツトを提供することができる。Therefore, in particular, it is possible to effectively prevent the invasion of water from the heat absorbing side substrate, solve the problems such as semiconductor oxidation and electrode corrosion, and provide a thermoelectric cooling unit having a long service life with little performance deterioration. You can
【００１８】前記第２の本発明は前述したように、基体
のシール面を横断しないように透孔を形成してそれにリ
ード体を挿入した構造になっているから、前記シール面
に高い平面性をもたせることが可能で、しかも基体のシ
ール面を横断しないように逃げて透孔を形成することに
よりシール面付近の機械的強度はそのまま維持でき、Ｏ
リングなどのガスケットやシール剤層などによるシール
強度を高めることができ、その結果水分の侵入が有効に
阻止され、半導体の酸化や電極の腐食などの問題が解消
されて、性能劣化の少ない耐用寿命の長い電子冷却ユニ
ツトを提供することができる。As described above, the second aspect of the present invention has a structure in which a through hole is formed so as not to cross the seal surface of the base body and the lead body is inserted into the through hole, so that the seal surface has high flatness. The mechanical strength in the vicinity of the seal surface can be maintained as it is by forming a through hole so that it does not traverse the seal surface of the substrate.
The sealing strength of gaskets such as rings and the sealing agent layer can be increased, which effectively prevents the ingress of moisture and eliminates problems such as semiconductor oxidation and electrode corrosion, resulting in a durable service life with little deterioration in performance. A long electronic cooling unit can be provided.
【００１９】[0019]
【実施例】次に、本発明の実施例を図とともに説明す
る。図１は本発明の第１実施例に係る電子冷却ユニツト
の断面図、図２はその電子冷却ユニツトの平面図、図３
はその電子冷却ユニツトの内部拡大断面図、図４はその
電子冷却ユニツトに使用する電子冷却素子群の拡大斜視
図、図５はその電子冷却ユニツトに使用する基体の一部
斜視図である。Embodiments of the present invention will now be described with reference to the drawings. 1 is a sectional view of an electronic cooling unit according to a first embodiment of the present invention, FIG. 2 is a plan view of the electronic cooling unit, and FIG.
FIG. 4 is an internal enlarged cross-sectional view of the electronic cooling unit, FIG. 4 is an enlarged perspective view of an electronic cooling element group used in the electronic cooling unit, and FIG. 5 is a partial perspective view of a substrate used in the electronic cooling unit.
【００２０】電子冷却ユニツトは図１に示すように、吸
熱側基体１と、放熱側基体２と、両基体１，２間に介在
された電子冷却素子群３と、両基体１，２間を機械的に
締め付けるためのボルト４ならびに湾曲した皿バネ５
と、Ｏリング６と、シール剤７とから主に構成されてい
る。As shown in FIG. 1, the electronic cooling unit includes a heat absorbing side base 1, a heat radiating side base 2, an electronic cooling element group 3 interposed between the bases 1 and 2, and a space between the bases 1 and 2. Bolts 4 for mechanical tightening and curved disc springs 5
And an O-ring 6 and a sealant 7.
【００２１】前記基体１，２は板状をしており、例えば
アルミニウムや銅などから構成され、基体１と基体２の
対向部であつてかつ前記電子冷却素子群３の外周部全周
には浅い溝８が形成されている。さらに図５に示すよう
に、この溝８よりもさらに外側の対向面と外側端面は、
例えばプライマー処理あるいはサンドブラスト処理によ
つて表面に微細な凹凸を有するよう粗面化されている。
この粗面化により、シール剤７との密着性が良好に維持
される。The bases 1 and 2 have a plate shape, and are made of, for example, aluminum or copper, and are located at the opposing portions of the bases 1 and 2 and on the entire outer peripheral portion of the electronic cooling element group 3. The shallow groove 8 is formed. Further, as shown in FIG. 5, the facing surface and the outer end surface further outside the groove 8 are
For example, the surface is roughened by a primer treatment or a sandblast treatment so as to have fine irregularities.
Due to this roughening, good adhesion with the sealant 7 is maintained.
【００２２】前記電子冷却素子群３は図３に示すよう
に、所定の間隔をおいて配置された吸熱側電極９と、例
えばバルク状あるいは膜状（厚膜または薄膜）のＰ形半
導体層１０と、例えばバルク状あるいは膜状（厚膜また
は薄膜）のＮ形半導体層１１と、放熱側電極１２と、接
着剤層１３と、グリース層１４とから構成されている。As shown in FIG. 3, the electronic cooling element group 3 includes heat absorbing side electrodes 9 arranged at a predetermined interval and a P-type semiconductor layer 10 in bulk or film form (thick film or thin film), for example. And a N-type semiconductor layer 11 in a bulk or film shape (thick film or thin film), a heat dissipation side electrode 12, an adhesive layer 13, and a grease layer 14, for example.
【００２３】前記Ｐ形半導体層１０とＮ形半導体層１１
とは多数並列に配置され、電気的には図４に示すように
直列に接続されている。The P-type semiconductor layer 10 and the N-type semiconductor layer 11
Are arranged in parallel, and are electrically connected in series as shown in FIG.
【００２４】このように本実施例の電子冷却素子群３
は、アルミナセラミツク等からなる絶縁基板は使用され
ておらず、モジユール化された状態では一方の面に吸熱
側電極９が、他方の面に放熱側電極１２が露呈してい
る。As described above, the electronic cooling element group 3 of this embodiment
No insulating substrate made of alumina ceramic or the like is used, and the heat absorbing side electrode 9 is exposed on one surface and the heat radiating side electrode 12 is exposed on the other surface in a modularized state.
【００２５】前記接着剤層１３には、例えばシリコーン
系などの有機化合物単独、あるいは例えばシリカ、アル
ミナ、酸化亜鉛などの無機化合物からなるフイラーを適
量混入した有機化合物などが使用される。この接着剤層
１３は硬化後においても弾性を有し、かつ良好な熱伝導
性を有しており、膜厚は２０〜２００μｍが適当であ
る。For the adhesive layer 13, for example, an organic compound such as a silicone type is used alone, or an organic compound containing an appropriate amount of a filler made of an inorganic compound such as silica, alumina or zinc oxide is used. The adhesive layer 13 has elasticity and good thermal conductivity even after being cured, and the film thickness is preferably 20 to 200 μm.
【００２６】この実施例の場合、平均粒径が１０μｍ以
下のアルミナ微粒子を適量分散、保持したシリコーン系
接着剤で、硬化後においてもゴム弾性を有し、熱伝導率
は４．５×１０-3ｃａｌ／ｃｍ・ｓｅｃ・℃、伸率は３
０％、引張強さは５０ｋｇｆ／ｃｍ2 であり、−６０〜
２５０℃の広い温度範囲にわたつて良好なゴム弾性を保
持する。この実施例の場合、シリコーン系接着剤層１３
によつて放熱側基体２と放熱側電極１２との間が一体に
接合されている。In the case of this embodiment, a silicone adhesive in which a proper amount of alumina fine particles having an average particle diameter of 10 μm or less are dispersed and held, has rubber elasticity even after curing and has a thermal conductivity of 4.5 × 10 −. 3cal / cm · sec · ° C, elongation is 3
0%, tensile strength is 50 kgf / cm2, -60 ~
It retains good rubber elasticity over a wide temperature range of 250 ° C. In this example, the silicone adhesive layer 13
Thus, the heat radiation side substrate 2 and the heat radiation side electrode 12 are integrally joined.
【００２７】前記グリース層１４としては、シリコーン
グリースが好適である。このシリコーングリースは、ベ
ースオイルに対して例えばシリカ、アルミナ、酸化亜鉛
などの無機化合物の微細状フイラー（平均粒径１０μｍ
以下のもの）を５０重量％以上添加したものが好適であ
る。このようにフイラーを高い含率で分散、保持したシ
リコーングリース層の熱伝導率は６．０×１０-3ｃａｌ
／ｃｍ・ｓｅｃ・℃以上と高く、一般のシリコーングリ
ースの３×１０-4ｃａｌ／ｃｍ・ｓｅｃ・℃に比較する
と、熱伝導率が１桁以上も高い。またこのシリコーング
リース層は、−５５〜２００℃までの広い温度範囲にわ
たつて良好な弾性を保持している。なお、膜厚は２０〜
１００μｍが適当である。Silicone grease is suitable for the grease layer 14. This silicone grease is a fine filler (average particle size: 10 μm) of an inorganic compound such as silica, alumina, zinc oxide, etc. with respect to the base oil.
It is preferable to add 50% by weight or more of the following. In this way, the silicone grease layer having the filler dispersed and held at a high content has a thermal conductivity of 6.0 × 10 −3 cal.
/ Cm · sec · ° C. or higher, which is higher than that of general silicone grease by 3 × 10 −4 cal / cm · sec · ° C. by one digit or more. Further, this silicone grease layer retains good elasticity over a wide temperature range from −55 to 200 ° C. The film thickness is 20-
100 μm is suitable.
【００２８】前記基体１，２に設けられた溝８にＯリン
グ６の上端部ならびに下端部をそれぞれ挿入して、基体
１，２どうしが適当な圧力をもつて締め付けられる。The upper and lower ends of the O-ring 6 are inserted into the grooves 8 formed in the bases 1 and 2, respectively, and the bases 1 and 2 are clamped with an appropriate pressure.
【００２９】前記Ｏリング６は例えばニトリルゴムなど
の水蒸気を通し難い合成ゴムからなり、前記ボルト４は
ガラス繊維を５０％含有したポリアミド製、前記皿バネ
５はステンレス鋼製のものが使用される。The O-ring 6 is made of synthetic rubber such as nitrile rubber which is hard to pass water vapor, the bolt 4 is made of polyamide containing 50% of glass fiber, and the disc spring 5 is made of stainless steel. .
【００３０】ユニツト内部への水分の侵入を極力避ける
ため、ボルト４の挿入孔は放熱側基体２に設けられ、さ
らにボルト締めされた後、ボルト４の頭部はシール剤７
によって埋め込まれている。In order to prevent water from entering the unit as much as possible, the insertion hole for the bolt 4 is provided in the heat radiating side substrate 2, and after the bolt is further tightened, the head of the bolt 4 is sealed with a sealant 7
Embedded by.
【００３１】ボルト締めされた後、図１に示すように基
体１，２の外周対向部とＯリング６によつて形成される
溝部から基体１，２の端面にかけてシール剤７が塗布さ
れてシールされる。After bolting, as shown in FIG. 1, a sealing agent 7 is applied from the groove formed by the outer peripheral facing portions of the bases 1 and 2 and the O-ring 6 to the end faces of the bases 1 and 2 for sealing. To be done.
【００３２】この実施例の場合、中空状のガラス微粒子
を２０〜６５重量％（好ましくは３０〜６０重量％）均
一に分散したエポキシ樹脂からなるシール剤７が使用さ
れる。この中空状ガラス微粒子は２０〜１３０μｍの径
を有し、壁厚は０．５〜２μｍ、平均粒子比重は０．１
〜０．４で、中空状ガラス微粒子を含有したエポキシ樹
脂は、熱伝導率が１×１０-4ｃａｌ／ｃｍ・ｓｅｃ・℃
と低い。In the case of this embodiment, a sealing agent 7 made of an epoxy resin in which hollow glass fine particles are uniformly dispersed in an amount of 20 to 65% by weight (preferably 30 to 60% by weight) is used. The hollow glass fine particles have a diameter of 20 to 130 μm, a wall thickness of 0.5 to 2 μm, and an average particle specific gravity of 0.1.
~ 0.4, the epoxy resin containing hollow glass particles has a thermal conductivity of 1 × 10 -4 cal / cm · sec · ° C.
And low.
【００３３】図６は、本発明の第１変形例を示す図であ
る。この変形例の場合、吸熱側基体１と吸熱側電極９と
の間、ならびに放熱側基体２と放熱側電極１２との間に
シリコーングリース層１４が介在されている。FIG. 6 is a diagram showing a first modification of the present invention. In the case of this modification, the silicone grease layer 14 is interposed between the heat absorption side substrate 1 and the heat absorption side electrode 9 and between the heat radiation side substrate 2 and the heat radiation side electrode 12.
【００３４】図７は、本発明の第２変形例を示す図であ
る。この変形例の場合、吸熱側基体１と吸熱側電極９と
の間、ならびに放熱側基体２と放熱側電極１２との間が
弾性を有するシリコーン接着剤層１３によつて接着され
ている。FIG. 7 is a diagram showing a second modification of the present invention. In the case of this modified example, the heat-absorption side substrate 1 and the heat-absorption side electrode 9 and the heat radiation side substrate 2 and the heat radiation side electrode 12 are bonded by a silicone adhesive layer 13 having elasticity.
【００３５】前述のように従来のものは、アルミナセラ
ミツク等からなる絶縁基板と電極との間ならびに電極と
Ｐ型半導体層、Ｎ型半導体層との間が半田付けられてい
るため、熱履歴の繰り返しによつて生じる絶縁基板の反
りが電極ならびに半導体層に悪影響を及ぼす。As described above, in the conventional case, since the insulating substrate made of alumina ceramic or the like and the electrode and the electrode and the P-type semiconductor layer and the N-type semiconductor layer are soldered to each other, thermal history is not generated. The warp of the insulating substrate caused by repetition has a bad influence on the electrode and the semiconductor layer.
【００３６】これに対して本発明の実施例ならびに変形
例のように、基体と電極との間にグリース層あるいは弾
性を有する接着剤層を介在して、電極が前記基体の面に
対して水平方向あるいは（ならびに）垂直方向に変位可
能にすれば、熱履歴による電極ならびに半導体層への悪
影響が解消され、従来のような接続不良や断線がなく、
耐用寿命の長い、性能的に安定した電子冷却ユニツトを
提供することができる。On the other hand, as in the embodiment and the modification of the present invention, the electrode is horizontal with respect to the surface of the substrate by interposing a grease layer or an elastic adhesive layer between the substrate and the electrode. Direction and / or vertical displacement eliminates the adverse effects of heat history on the electrodes and semiconductor layers, and eliminates the conventional connection failures and disconnections.
It is possible to provide a thermoelectric cooling unit having a long service life and stable performance.
【００３７】前記実施例ならびに変形例で説明した電子
冷却ユニツトでは、従来の電極と絶縁基板とを半田で一
体化したものに比較して、冷−暖を繰り返す熱履歴テス
トにおいて耐用寿命を１０倍程度延長することができ
た。In the electronic cooling unit described in the above embodiments and modifications, the service life is 10 times as long as in the conventional thermal history test of cooling and warming, as compared with the conventional one in which the electrode and the insulating substrate are integrated with solder. I was able to extend it.
【００３８】図８は、本発明の第３変形例を示す図であ
る。この変形例の場合、基体１，２の溝８内に例えばゴ
ム系、ビニル系、エポキシ系、アミド系、フツ素樹脂系
などの防湿シール剤１５が装填されている。FIG. 8 is a diagram showing a third modification of the present invention. In the case of this modified example, a moisture-proof sealant 15 of rubber type, vinyl type, epoxy type, amide type, fluorine resin type, or the like is loaded in the grooves 8 of the bases 1 and 2.
【００３９】図９ならびに図１０は本発明の第２実施例
を説明するための図で、図９は電子冷却ユニットの一部
を断面にした側面図、図１０はその電子冷却ユニットの
要部拡大断面図である。9 and 10 are views for explaining the second embodiment of the present invention. FIG. 9 is a side view in which a part of the electronic cooling unit is shown in section, and FIG. 10 is a main part of the electronic cooling unit. It is an expanded sectional view.
【００４０】この実施例の場合には吸熱側基体１と放熱
側基体２の間に２つの電子冷却素子群３が所定の間隔を
おいて並設されているとともに、その電子冷却素子群３
を取り囲むように剛性を有し熱伝導性の悪い支持体１６
が介在されている。In the case of this embodiment, two electronic cooling element groups 3 are arranged in parallel between the heat absorption side substrate 1 and the heat radiation side substrate 2 at a predetermined interval, and the electronic cooling element group 3 is also provided.
A support body 16 which has rigidity so as to surround the
Is intervening.
【００４１】この支持体１６は例えば内部に独立した空
気層をもつハニカム構造になっており、吸熱側基体１と
放熱側基体２の間を樹脂製ボルト（図示せず）で締め付
けた際、その締付力は主に支持体１６で受け、前記電子
冷却素子群３にはほとんど締付力がかからないように、
電子冷却素子群３を保護した構造になっている。図示し
ていないが、前記ボルトの挿通孔は前記第１実施例と同
様に放熱側基体２に形成されている。The support 16 has, for example, a honeycomb structure having an independent air layer inside, and when the heat absorbing side base 1 and the heat radiating side base 2 are fastened with resin bolts (not shown), The tightening force is mainly received by the support body 16, and the tightening force is hardly applied to the electronic cooling element group 3.
The structure is such that the electronic cooling element group 3 is protected. Although not shown, the bolt insertion hole is formed in the heat radiation side substrate 2 as in the first embodiment.
【００４２】前記吸熱側基体１と放熱側基体２の対向部
でかつ前記電子冷却素子群３の電極９（１２）が施され
ていない外周部全周にかけてシール部１７が設けられて
おり、本実施例の場合このシール部１７は図１０に示す
ようにＯリング６とシール剤７とから構成されている。A seal portion 17 is provided over the entire circumference of the outer peripheral portion of the electronic cooling element group 3 where the electrodes 9 (12) are not provided, facing the heat absorbing side substrate 1 and the heat radiating side substrate 2. In the case of the embodiment, the seal portion 17 is composed of an O-ring 6 and a sealant 7 as shown in FIG.
【００４３】このＯリング６と接する吸熱側基体１なら
びに放熱側基体２の周囲には予め溝８が形成され、締め
付け力によりＯリング６の一部が溝８内に食い込んだ状
態になっている。Grooves 8 are preliminarily formed around the heat absorbing side base 1 and the heat radiating side base 2 which are in contact with the O-ring 6, and a part of the O-ring 6 bites into the groove 8 by the tightening force. .
【００４４】前記吸熱側基体１ならびに放熱側基体２の
うちの少なくとも一方の基体（本実施例では放熱側基体
２）の前記シール部１７と接するシール面１８よりも内
周側から、そのシール面１８を横断しないで放熱側基体
２の外側に水平方向に貫通する透孔１９が形成されてい
る。図１０に示すように透孔１９の電極９（１２）側の
開口部付近は、開口に向けて径大となったテーパ孔とな
っている。The sealing surface of at least one of the heat absorbing side base 1 and the heat radiating side base 2 (in this embodiment, the heat radiating side base 2) from the inner peripheral side of the seal surface 18 in contact with the seal portion 17 A through hole 19 penetrating in the horizontal direction is formed outside the heat dissipation side substrate 2 without traversing 18. As shown in FIG. 10, the vicinity of the opening of the through hole 19 on the electrode 9 (12) side is a tapered hole whose diameter increases toward the opening.
【００４５】本実施例では透孔１９を放熱側基体２に形
成したが、吸熱側基体１に形成することも可能である。
ただ、吸熱側基体１に透孔１９を形成して孔内に空気
（水分）が存在すると露結の心配があるため、本実施例
のように透孔１９は放熱側基体２に形成した方がよい。Although the through hole 19 is formed in the heat radiation side substrate 2 in this embodiment, it may be formed in the heat absorption side substrate 1.
However, if the through hole 19 is formed in the heat absorption side substrate 1 and air (moisture) exists in the hole, condensation may occur, so that the through hole 19 is formed in the heat radiation side substrate 2 as in the present embodiment. Is good.
【００４６】図９に示すように放熱側基体２の外側に
は、例えば金属薄板をジグザグ状に屈曲したものなどか
らなるフィン２０が一体に取り付けられている。このフ
ィン２０の間を通してリード体２１が前記透孔１９に挿
入され、リード体２１の先端部が前記電極９（１２）に
半田２２で接続、固定されている。As shown in FIG. 9, a fin 20 made of, for example, a thin metal plate bent in a zigzag shape is integrally attached to the outer side of the heat radiation side substrate 2. The lead body 21 is inserted into the through hole 19 through the space between the fins 20, and the tip of the lead body 21 is connected and fixed to the electrode 9 (12) with solder 22.
【００４７】リード体２１の先端部は所定の長さ被覆が
除去され、前記透孔１９のテーパ孔に例えばシリコーン
樹脂やエポキシ樹脂などからなる接着剤２３で閉塞する
ことにより、前記リード体２１の被覆除去部分がその接
着剤２３内に埋設される。この接着剤２３内の埋設によ
り、リード体２１の素線と被覆との隙間からの水分の侵
入を接着剤２３で阻止することができる。The tip portion of the lead body 21 has a coating of a predetermined length removed, and the taper hole of the through hole 19 is closed with an adhesive 23 made of, for example, a silicone resin or an epoxy resin. The coating removal portion is embedded in the adhesive 23. By being embedded in the adhesive 23, the adhesive 23 can prevent moisture from entering through the gap between the element wire of the lead body 21 and the coating.
【００４８】図１１は、本発明の第４変形例を示す要部
拡大断面図である。この例の場合、放熱側基体２のシー
ル面１８を残して断面形状がほぼＬ字形の透孔１９が形
成され、その透孔１９にリード体２１が挿入されて、接
着剤２３で埋設される。FIG. 11 is an enlarged cross-sectional view of an essential part showing a fourth modification of the present invention. In the case of this example, a through hole 19 having a substantially L-shaped cross section is formed except for the sealing surface 18 of the heat radiation side substrate 2, and a lead body 21 is inserted into the through hole 19 and embedded with an adhesive 23. .
【００４９】図１２は、本発明の第５変形例を示す要部
拡大断面図である。この例の場合、放熱側基体２のシー
ル面１８を残して傾斜した透孔１９が形成され、その透
孔１９にリード体２１が挿入されて、接着剤２３で埋設
される。FIG. 12 is an enlarged sectional view of the essential parts showing a fifth modification of the present invention. In the case of this example, an inclined through hole 19 is formed while leaving the sealing surface 18 of the heat radiation side substrate 2, and a lead body 21 is inserted into the through hole 19 and embedded with an adhesive 23.
【００５０】前記第４、５変形例ではフラットなシール
面１８を示しているが、シール面１８の所定位置に溝８
を形成することもできる。Although the fourth and fifth modified examples show the flat sealing surface 18, the groove 8 is provided at a predetermined position of the sealing surface 18.
Can also be formed.
【００５１】また前記第４、５変形例においてシール部
１７はＯリング６とシール剤７の組合せでもよいし、Ｏ
リング６だけ、シール剤７だけ、Ｏリングでない他の形
状のガスケット、あるいはそのガスケットとシール剤７
の組合せでもよい。In the fourth and fifth modified examples, the seal portion 17 may be a combination of the O-ring 6 and the sealant 7, or O
Only the ring 6, the sealant 7, the gasket having another shape other than the O-ring, or the gasket and the sealant 7
May be used in combination.
【００５２】[0052]
【発明の効果】第１の本発明は前述したように、吸熱側
基体と放熱側基体との間にＯリングが介在されて両基体
どうしが機械的に締め付けられ、そのＯリングの外周部
が接着剤でシールされた二重のシール構造になつてい
る。As described above, according to the first aspect of the present invention, the O-ring is interposed between the heat absorbing side base and the heat radiating side base to mechanically clamp both bases, and the outer peripheral portion of the O ring is It has a double seal structure that is sealed with an adhesive.
【００５３】そのため、特に吸熱側基体からの水分の侵
入が有効に阻止され、半導体の酸化や電極の腐食などの
問題が解除されて、性能劣化の少ない耐用寿命の長い電
子冷却ユニツトを提供することができる。Therefore, in particular, the entry of water from the heat absorbing side substrate is effectively prevented, and problems such as oxidation of semiconductors and corrosion of electrodes are eliminated, and an electronic cooling unit with a long service life with little performance deterioration is provided. You can
【００５４】第２の本発明は前述したように、基体のシ
ール面を横断しないように透孔を形成してそれにリード
体を挿入した構造になっているから、前記シール面に高
い平面性をもたせることが可能で、しかも基体のシール
面を横断しないように逃げて透孔を形成することにより
シール面付近の機械的強度はそのまま維持でき、Ｏリン
グなどのガスケットやシール剤層などによるシール強度
を高めることができ、その結果水分の侵入が有効に阻止
され、半導体の酸化や電極の腐食などの問題が解消され
て、性能劣化の少ない耐用寿命の長い電子冷却ユニツト
を提供することができる。As described above, the second aspect of the present invention has a structure in which a through hole is formed so as not to traverse the seal surface of the base body and the lead body is inserted into the through hole, so that the seal surface has high flatness. The mechanical strength in the vicinity of the sealing surface can be maintained as it is by forming escape holes so that it does not traverse the sealing surface of the base body, and the sealing strength by the gasket such as O-ring or the sealing agent layer. As a result, moisture invasion can be effectively prevented, problems such as semiconductor oxidation and electrode corrosion can be solved, and a thermoelectric cooling unit with little deterioration in performance and a long service life can be provided.
【図１】本発明の第１実施例に係る電子冷却ユニツトの
断面図である。FIG. 1 is a sectional view of an electronic cooling unit according to a first embodiment of the present invention.
【図２】その電子冷却ユニツトの平面図である。FIG. 2 is a plan view of the electronic cooling unit.
【図３】その電子冷却ユニツトの内部拡大断面図であ
る。FIG. 3 is an enlarged cross-sectional view of the inside of the electronic cooling unit.
【図４】電子冷却素子群の拡大斜視図である。FIG. 4 is an enlarged perspective view of an electronic cooling element group.
【図５】その電子冷却ユニツトに使用する基体の一部斜
視図である。FIG. 5 is a partial perspective view of a base used in the electronic cooling unit.
【図６】本発明の第１変形例における電子冷却ユニツト
の内部拡大断面図である。FIG. 6 is an internal enlarged cross-sectional view of a thermoelectric cooling unit according to a first modification of the present invention.
【図７】本発明の第２変形例における電子冷却ユニツト
の拡大断面図である。FIG. 7 is an enlarged sectional view of an electronic cooling unit according to a second modification of the present invention.
【図８】本発明の第３変形例における電子冷却ユニツト
の一部拡大断面図である。FIG. 8 is a partially enlarged sectional view of an electronic cooling unit according to a third modified example of the present invention.
【図９】本発明の第２実施例に係る電子冷却ユニツトの
一部を断面にした側面図である。FIG. 9 is a side view, partly in section, of an electronic cooling unit according to a second embodiment of the present invention.
【図１０】その電子冷却ユニツトの内部拡大断面図であ
る。FIG. 10 is an internal enlarged cross-sectional view of the electronic cooling unit.
【図１１】本発明の第４変形例における電子冷却ユニツ
トの拡大断面図である。FIG. 11 is an enlarged sectional view of an electronic cooling unit according to a fourth modified example of the present invention.
【図１２】本発明の第５変形例における電子冷却ユニツ
トの拡大断面図である。FIG. 12 is an enlarged sectional view of an electronic cooling unit according to a fifth modified example of the present invention.
【図１３】従来の電子冷却ユニツトの拡大断面図であ
る。FIG. 13 is an enlarged sectional view of a conventional electronic cooling unit.
１ 吸熱側基体 ２ 放熱側基体 ３ 電子冷却素子群 ４ ボルト ５ 皿バネ ６ Ｏリング ７ 接着剤 ８ 溝 ９ 吸熱側電極 １０ Ｐ形半導体層 １１ Ｎ形半導体層 １２ 放熱側電極 １３ 接着剤層 １４ グリース層 １５ 防湿シール剤 １６ 支持体 １７ シール部 １８ シール面 １９ 透孔 ２０ フィン ２１ リード体 ２２ 半田 ２３ 接着剤 1 Heat absorption side substrate 2 Heat dissipation side substrate 3 Electronic cooling element group 4 volt 5 Disc spring 6 O-ring 7 adhesive 8 grooves 9 Heat absorption side electrode 10 P-type semiconductor layer 11 N-type semiconductor layer 12 Heat dissipation side electrode 13 Adhesive layer 14 Grease layer 15 Moisture-proof sealant 16 Support 17 Seal part 18 Sealing surface 19 through holes 20 fins 21 Lead body 22 Solder 23 Adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大澤 敦 神奈川県川崎市川崎区塩浜１丁目７番地 ７号 株式会社サーモボニック内 (58)調査した分野(Int.Cl.7，ＤＢ名) F25B 21/02 H01L 35/28 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Atsushi Osawa 1-7-7 Shiohama, Kawasaki-ku, Kawasaki-shi, Kanagawa Within Thermobonic Co., Ltd. (58) Fields investigated (Int.Cl. 7 , DB name) F25B 21 / 02 H01L 35/28
Claims (7)
側電極と放熱側電極との間に並設されたＰ型半導体層な
らびにＮ型半導体層と、前記吸熱側電極の外側に配置さ
れた吸熱側基体と、前記放熱側電極の外側に配置された
放熱側基体とを備え、 その吸熱側基体と放熱側基体を対向して配置し、その両
基体間に前記吸熱側電極、Ｐ型半導体層ならびにＮ型半
導体層、放熱側電極が介在された電子冷却ユニツトにお
いて、 前記吸熱側基体と放熱側基体の対向部でかつ前記電極が
施されていない外周部全周にＯリングを介在して吸熱側
基体と放熱側基体との間を締め付け、前記対向部とＯリ
ングの外周部とによつて形成される溝部にシール剤を充
填して、吸熱側基体と放熱側基体の外周部を密封したこ
とを特徴とする電子冷却ユニツト。1. A heat absorption side electrode, a heat radiation side electrode, P-type semiconductor layers and N-type semiconductor layers arranged in parallel between the heat absorption side electrode and the heat radiation side electrode, and an outer side of the heat absorption side electrode. And a heat radiation side substrate arranged outside the heat radiation side electrode, the heat absorption side substrate and the heat radiation side substrate are arranged to face each other, and the heat absorption side electrode, P In an electronic cooling unit having a heat-dissipating side substrate and a heat-dissipating side substrate, an O-ring is provided at the opposing portion between the heat-absorbing side substrate and the heat-dissipating side substrate and around the entire outer peripheral portion where the electrode is not provided. Then, the space between the heat absorbing side base and the heat radiating side is tightened, and the groove formed by the facing portion and the outer peripheral part of the O-ring is filled with a sealant to form the outer peripheral part of the heat absorbing side base and the heat radiating side base. An electronic cooling unit, which is characterized by sealing.
中空状のフイラーを含有していることを特徴とする電子
冷却ユニツト。2. The electronic cooling unit according to claim 1, wherein the sealing agent contains a hollow filler.
と放熱側基体との間がボルトで締め付けられ、そのボル
トの挿入孔が放熱側基体に設けられていることを特徴と
する電子冷却ユニツト。 3. The heat absorption side substrate according to claim 1.
The bolt is tightened between the heat dissipation side base and
The insertion hole of the heat sink is provided in the heat dissipation side base body.
Electronic cooling unit to do.
部がシール剤によって埋めこまれていることを特徴とす
る電子冷却ユニツト。 4. The head of the bolt according to claim 3,
It is characterized in that the part is embedded with a sealant.
Electronic cooling unit.
側電極と放熱側電極との間に並設されたＰ型半導体層な
らびにＮ型半導体層と、前記吸熱側電極の外側に配置さ
れた吸熱側基体と、前記放熱側電極の外側に配置された
放熱側基体とを備え、 その吸熱側基体と放熱側基体を対向して配置し、その両
基体間に前記吸熱側電極、Ｐ型半導体層ならびにＮ型半
導体層、放熱側電極が介在された電子冷却ユニツトにお
いて、 前記吸熱側基体と放熱側基体の対向部でかつ前記電極が
施されていない外周部全周にかけてシール部が設けら
れ、 その吸熱側基体ならびに放熱側基体のうちの少なくとも
一方の基体の前記シール部と接するシール面よりも内周
側からそのシール面を横断しないで当該基体の外側に貫
通する透孔を形成し、 その透孔にリード体を挿入して、リード体の先端部を前
記電極に接続して、透孔の少なくとも一部を接着剤で閉
塞したことを特徴とする電子冷却ユニツト。5. A heat absorption side electrode, a heat radiation side electrode, P-type semiconductor layers and N-type semiconductor layers arranged in parallel between the heat absorption side electrode and the heat radiation side electrode, and arranged outside the heat absorption side electrode. And a heat radiation side substrate arranged outside the heat radiation side electrode, the heat absorption side substrate and the heat radiation side substrate are arranged to face each other, and the heat absorption side electrode, P In a thermoelectric cooling unit in which an N-type semiconductor layer, an N-type semiconductor layer, and a heat-radiating-side electrode are interposed, a seal portion is provided at a portion where the heat-absorbing-side base and the heat-radiating-side base face each other and around the entire outer peripheral portion where the electrode is not provided. is, the through hole penetrating to the outside of the substrate without traversing the sealing surface from the inner peripheral side than the sealing surface in contact with the sealing portion of the at least one substrate of the heat radiating side substrate each time if the heat-absorption body Form and lead through its holes The insert, by connecting the distal end of the lead body to the electrode, electron cooling Yunitsuto, characterized in that closing the at least part of the hole with an adhesive.
先端部付近は被覆が除去され、その被覆除去部分と透孔
の間が接着剤で閉塞されていることを特徴とする電子冷
却ユニツト。6. The electronic cooling unit according to claim 5 , wherein the coating is removed in the vicinity of the tip portion of the lead body, and an adhesive is used to seal between the coating removal portion and the through hole.
側基体に形成されていることを特徴とする電子冷却ユニ
ツト。7. The electronic cooling unit according to claim 5 , wherein the through hole is formed in the heat dissipation side substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27687493A JP3467297B2 (en) | 1992-11-09 | 1993-11-05 | Electronic cooling unit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29869692 | 1992-11-09 | ||
| JP4-298696 | 1992-11-09 | ||
| JP27687493A JP3467297B2 (en) | 1992-11-09 | 1993-11-05 | Electronic cooling unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002336981A Division JP3739739B2 (en) | 1992-11-09 | 2002-11-20 | Electronic cooling unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06207762A JPH06207762A (en) | 1994-07-26 |
| JP3467297B2 true JP3467297B2 (en) | 2003-11-17 |
Family
ID=26552147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27687493A Expired - Lifetime JP3467297B2 (en) | 1992-11-09 | 1993-11-05 | Electronic cooling unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3467297B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4350884B2 (en) * | 2000-11-02 | 2009-10-21 | 株式会社Ｋｅｌｋ | Heat exchanger |
| US7051536B1 (en) * | 2004-11-12 | 2006-05-30 | Bio-Rad Laboratories, Inc. | Thermal cycler with protection from atmospheric moisture |
| JP4747919B2 (en) * | 2006-04-07 | 2011-08-17 | パナソニック電工株式会社 | Electrostatic atomizer |
| JP5074291B2 (en) * | 2008-05-15 | 2012-11-14 | 浜松ホトニクス株式会社 | Spectroscopic module |
| JP6417130B2 (en) * | 2014-07-02 | 2018-10-31 | 株式会社Kelk | Thermoelectric generator |
| JP6430781B2 (en) * | 2014-10-29 | 2018-11-28 | 京セラ株式会社 | Thermoelectric module |
| JP6527250B2 (en) | 2015-06-10 | 2019-06-05 | ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ | Low temperature plate assembly integrated vehicle battery thermoelectric element and method of assembling thermoelectric element |
| JP2018522408A (en) * | 2015-06-10 | 2018-08-09 | ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ | Thermoelectric module with provisionally compressible compression limiter for vehicle battery |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
-
1993
- 1993-11-05 JP JP27687493A patent/JP3467297B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06207762A (en) | 1994-07-26 |
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