JP3456185B2 - Busbar wiring board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar wiring board forming a wiring assembly of an electric junction box provided in, for example, an automobile.

[0002]

2. Description of the Related Art Conventionally, an electrical junction box such as a fuse box or a relay box has a wiring assembly in which a plurality of bus bar wiring boards each having a bus bar wiring layer composed of a plurality of bus bars formed on an insulating substrate made of synthetic resin are laminated. ing. Each busbar provided on each busbar wiring board has tabs integrally formed at the end of each busbar wiring board that penetrates through each busbar wiring board above or below the busbar wiring board to the top and bottom surfaces of the wiring assembly. It has been extended.

A tab of each busbar of each busbar wiring board extending to the uppermost surface of the wiring assembly is connected to a connection terminal to which a relay terminal, which is a female electric terminal in a fuse housing or a relay housing, is connected. To form. or,
The tab of each bus bar of each bus bar wiring board extended to the lowermost surface of the wiring assembly forms, for example, a male electric terminal of the connector housing to which the connector of the wire harness is connected. That is, the wiring assembly has a three-dimensional wiring structure formed of the bus bars provided on the bus bar wiring boards.

The position of the tab on the uppermost surface of the wiring assembly of each bus bar does not correspond to the position of the tab on the lowermost surface in the vertical direction. Therefore, since it is necessary to connect both positions of the uppermost surface and the lowermost surface so as not to interfere with other busbars, there are many types of busbars having different shapes. As a result, there are many types of molds for forming each bus bar.

Therefore, in order to solve such a problem,
As a bus bar wiring board, as shown in FIG. 6, bus bar wiring layers 51 and 52 are formed on the first surface 50a and the second surface 50b of one insulating substrate 50, respectively, and the bus bar wiring layer 51 on the first surface side is formed. There is a bus bar wiring board in which each bus bar 53 and each bus bar 54 of the bus bar wiring layer 52 on the second surface side are welded at a desired position through a through hole 55 provided in the insulating substrate 50 so as to be electrically connected. .

In such a bus bar wiring board, the first surface 5
0a side bus bar 53 and second surface 50b side bus bar 54
And tabs 53a and 54a formed on each end of the
The surface 50a and the second surface 50b may be arranged at desired positions, and the first surface 50a and the second surface 50b may be provided so as to intersect at appropriate positions. Then, both bus bars 53, 54 may be welded through the through hole 55 of the insulating substrate 50 provided at the intersecting position. Therefore, the first surface 5
0a and the respective desired positions on the second surface 50b,
Compared with the case of connecting with one busbar, the shapes of both busbars 53 and 54 are less likely to be restricted, so that it is possible to reduce the types of busbars 53 and 54 having different shapes.

[0007]

In the bus bar wiring board described above, both the bus bar wiring layer 51 and the bus bar wiring layer 52 are exposed to the outside. Therefore, when forming the wiring assembly by stacking the bus bar wiring boards, it is necessary to interpose an insulating substrate between the bus bar wiring boards to be stacked. Therefore, the wiring assembly cannot be formed by stacking only the bus bar wiring boards, and the number of parts and the number of assembly steps cannot be reduced.

The present invention has been made to solve the above problems, and an object thereof is to reduce the number of parts and the number of assembling steps when forming a wiring assembly by laminating a plurality of bus bar wiring boards. It is to provide a busbar wiring board that can be.

[0009]

In order to solve the above problems, the invention according to claim 1 forms a first wiring layer composed of a first surface side bus bar on the first surface side of an insulating substrate, and A second wiring layer including a second surface side bus bar is formed on the second surface side, and the first wiring layer is formed through a through hole provided in the insulating substrate.
In the busbar wiring board in which the surface-side busbar and the second surface-side busbar are electrically conducted, the second wiring layer is a strip-shaped material.
A straight strip formed from the
Make sure that the bus bars on the two sides are parallel to each other and are equally spaced.
Insert bus so that the bus bar on the second surface side is covered with an insulating layer formed of an insulating substrate from the outside.
The shape is integrated with the insulating substrate, and the first surface has a linear band.
-Shaped groove is orthogonal to the longitudinal direction of the second surface side bus bar
Provided in parallel with each other at equal intervals so as to extend in the direction
And the first surface side bus bar is cut from the strip material.
In the groove, which is formed in the shape of a straight line extending in the same width
Are arranged respectively.

According to a second aspect of the invention, in the first aspect of the invention, the first surface side bus bar and the second surface side bus bar are electrically connected by being joined by welding.

According to a third aspect of the present invention, in the first or second aspect of the invention, the first surface side bus bars are electrically connected to each other via the second surface side bus bar, or
The second surface side bus bars are electrically connected to each other via the first surface side bus bar.

(Operation) According to the invention described in claim 1,
The second wiring layer formed on the second surface of the insulating substrate having the first wiring layer formed on the first surface is integrated with the insulating substrate and covered from the outside with the insulating layer formed by the insulating substrate. Therefore, it is not necessary to assemble the second surface side bus bar to the insulating substrate, and an insulating plate for insulating the bus bar wiring board from the bus bar wiring board when it is laminated with another bus bar wiring board is unnecessary. .

According to the invention of claim 2, claim 1
In addition to the operation of the invention described in 1, the first surface side bus bar and the second surface side
Since the surface-side busbars are welded to be electrically conducted, new parts such as rivets for connecting the two busbars are not required.

According to the invention of claim 3, claim 1
In addition to the function of the invention described in claim 2, the first surface side busbars are electrically connected to each other via the second surface side busbars, or
Since the second surface side busbars are electrically connected to each other via the first surface side busbars, the busbars are electrically connected to each other in the same wiring layer without using jumper wires or the like.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. As shown in FIGS. 2 and 3, the bus bar wiring board 10 of the present embodiment includes a rectangular flat plate-shaped insulating substrate 11 made of synthetic resin. The insulating substrate 11 has a first surface 11a on which a first wiring layer 13 including a plurality of first surface side bus bars 12 is formed, and a second surface 11b including a second wiring surface bus bar 14 on which a second wiring layer 13 is formed.
The wiring layer 15 is formed.

Insulating substrate 11 on which the first wiring layer 13 is formed
On the first surface 11a of the two pairs of opposite side edges 11c,
A plurality of linear belt-shaped grooves 16 extending along both side edges 11c of 11d are formed at equal intervals. A linear belt-shaped first surface side bus bar 12 extending along the groove 16 with the same width is fixed to each groove 16 by caulking or the like.

A tab 17 which stands upright from the insulating substrate 11 is integrally formed at one end of the first surface side bus bar 12. A relay terminal is connected to the tab 17.
This relay terminal is provided on the case body (not shown).
Female end of the housing and relay housing
Child or male electrical terminal in the connector housing
Become. The case body is different from the busbar wiring board 10 in that
Directly or with a plurality of bus bar wiring boards on the one surface 11a side
It is fixed in the closed state.

On the second surface 11b side of the insulating substrate 11 on which the second wiring layer 15 is formed, two sets of opposite side edges 1 are provided.
A plurality of linear belt-shaped second surface side bus bars 14 extending at the same width are arranged at equal intervals along the other side edges 11d of 1c and 11d. That is, each second surface side bus bar 14 is arranged in a state of being orthogonal to each first surface side bus bar 12.

Each second surface side bus bar 14 has an insulating substrate 11
Is integrated with the insulating substrate 11 by insert molding. Then, each second surface side bus bar 14 is
It is covered from the outside by an insulating layer 18 formed by the insulating substrate 11. Each second surface side bus bar 14 is integrally formed with a tab 19 standing upright from the insulating substrate 11 at one end thereof. The tab 19 is, for example, a male side in a connector housing provided in a case body (not shown) fixed to the second surface 11b side of the busbar wiring board 10 directly or in a state where a plurality of busbar wiring boards are interposed. It becomes an electrical terminal.

As shown in FIG. 1, each of the first-surface-side bus bars 12 is provided on the insulating substrate 11 at an intersection with one of the second-surface-side bus bars 14 sandwiching the insulating substrate 11. It is welded through the through hole 20. Welding is on the first surface 11
A welded portion 21 that is laser-welded from the a side and is inserted through the through hole 20 is formed in a conical shape having a larger diameter on the first surface 11a side. The through hole 20 and the welded portion 21 have a conical shape because the laser welding performed from the first surface side is performed in a state of being slightly inclined with respect to the axis of the through hole 20.

Then, the welded first surface side bus bar 12
The second surface side bus bar 14 forms an electrical path that electrically connects the tab 17 arranged on the first surface 11a and the tab 19 arranged on the second surface.

In order to form a wiring assembly by laminating a plurality of bus bar wiring boards including the bus bar wiring board 10 of the present embodiment having the above-described configuration, first, the first surface side bus bar 1
2 is formed so that the tab 17 formed at the end thereof is arranged at a desired position in the longitudinal direction of the groove 16. Further, in the groove 16, a through hole for inserting the tab of each bus bar of each bus bar wiring board laminated on the first surface 11a side is formed in a region where the first surface side bus bar 12 is not arranged.

Similarly, each second surface side bus bar 14 is formed so that the tab 19 formed at the end thereof is arranged at a desired position in the longitudinal direction of the second surface side bus bar 14.
In the area where the second surface side bus bar 14 is not arranged,
A through hole is formed to insert the tab of each bus bar of each bus bar wiring board to be laminated on the second surface 11b side.

On the other hand, the first surface 11a of the bus bar wiring board 10
Through holes for inserting the tabs 17 of the first surface side bus bars 12 are formed at positions corresponding to the tabs 17 in the bus bar wiring boards laminated on the side. Similarly, in each bus bar wiring board laminated on the second surface 11b side, a through hole for inserting the tab 19 of each second surface side bus bar 14 is formed at a position corresponding to the tab 19.

Then, the tabs 1 of the first surface side bus bars 12 are inserted into the through holes of the respective bus bar wiring boards laminated on the first surface 11a side.
7 is inserted, and the tabs of each bus bar of each bus bar wiring board are inserted into the through holes provided in the bus bar wiring board 10. As a result, the bus bar wiring boards are laminated on the first surface 11a side of the bus bar wiring board 10, and the end portions of the tabs 17 of the first side bus bars 12 of the bus bar wiring board 10 are formed on the outermost surfaces of the laminated bus bar wiring boards. And project the end portion of the tab of each bus bar of the other bus bar wiring board. Then, the tab 17 of each first surface side bus bar 12 protruding from the outermost surface
And the tabs of each busbar of the other busbar wiring board,
For example, it is a connection terminal in a fuse housing or a relay housing provided in a case accommodating the wiring assembly.

Similarly, the tabs 1 of the second surface side bus bars 14 are inserted into the through holes of the respective bus bar wiring boards laminated on the second surface 11b side.
9 is inserted, and the tabs of each bus bar of each bus bar wiring board are inserted into the through holes provided in the bus bar wiring board 10. As a result, the busbar wiring boards are stacked on the second surface 11b side of the busbar wiring board 10, and the end portions of the tabs 19 of the second surface side busbars 14 of the busbar wiring board 10 are formed on the outermost surfaces of the stacked busbar wiring boards. And project the end portion of the tab of each bus bar of the other bus bar wiring board. Then, the tab 19 of each second surface side bus bar 14 protruding from the outermost surface is formed.
And the tabs of each busbar of the other busbar wiring board,
For example, it is a male-side electric terminal in a connector housing provided in a case accommodating the wiring assembly.

The present embodiment described in detail above has each operation and effect described below. (1) According to the present embodiment, the second wiring layer 15 provided on the second surface 11b of the insulating substrate 11 and the first wiring layer 13 provided on the first surface 11a are formed. Second surface side bus bar 14 electrically connected to first surface side bus bar 12 through through hole 20 provided in insulating substrate 11.
Was integrated with the insulating substrate 11 and covered with an insulating layer 18 formed of the insulating substrate 11 from the outside. For this reason, it is not necessary to assemble the second surface side bus bar 14 to the insulating substrate 11, and an insulating plate for insulating between the bus bar wiring layer of the bus bar wiring board and another bus bar wiring board when laminated with another bus bar wiring board becomes unnecessary. . As a result, it is possible to reduce the number of parts and the number of assembling steps when forming a wiring assembly by stacking a plurality of bus bar wiring boards.

(2) In addition, according to the present embodiment, the first surface side bus bar 12 and the second surface side bus bar 14 are welded to be electrically connected to each other.
No new parts such as rivets for connecting 4 are required. As a result, the number of parts can be prevented from increasing.

(3) Further, according to the present embodiment, each first surface side bus bar 12 is formed in a linear strip shape having the same width and extending in the same direction, and each second surface side bus bar 14 is formed in each first surface side. It was formed in the shape of a straight band that has the same width as the bus bar 12 and extends in the same direction intersecting each first surface side bus bar 12. Therefore, the tabs 17 of the first surface side busbars 12 and the tabs 19 of the second surface side busbars 14 are provided at desired positions, respectively, and through holes are provided at positions where the two busbars 12 and 14 to be conducted intersect with each other. By welding through 20, the first surface 1
A desired position on 1a and a desired position on the second surface 11b can be electrically connected.

Therefore, the desired position on the first surface 11a and the desired position on the second surface 11b are set to the first surface 11a or the second surface.
Unlike the case of connecting with one bus bar provided on either one of the surfaces 11b, it is not necessary to make each bus bar different in shape, and it is possible to configure the bus bar in the form of a strip alone. As a result, each bus bar can be formed by cutting and bending the band-shaped material, so that a mold for each bus bar is not required unlike the conventional case.

Further, through-holes 20 are provided at positions where the first surface side bus bar 12 and the second surface side bus bar 14 which are electrically connected intersect with each other on the same insulating substrate 11, whereby the bus bar wiring boards 10 having various wiring layouts are provided. Can be configured. Therefore, it is possible to reduce the number of molds by sharing the insulating substrate 11 between products of different types.

Embodiments other than the above embodiment embodying the present invention will be listed below. -In the said embodiment, the 1st surface side bus bar 12 and the 2nd
The surface side busbars 14 are connected so as to be in one-to-one conduction, but as shown in FIG. 4, the two first surface side busbars 12 are electrically connected to each other through one second surface side busbar 14. Each first surface side bus bar 12 may be electrically connected to the second surface side bus bar 14. According to such a configuration, the first surface side busbars 12 are electrically connected to each other in the first wiring layer 13 without using jumper wires or the like, so that the types of busbars having different shapes can be reduced or a new type can be added. The degree of freedom in wiring layout can be improved without using parts.

Similarly, even if each second surface side bus bar 14 is electrically connected to the first surface side bus bar 12 so that the two second surface side bus bars 14 are electrically connected to each other via one first surface side bus bar 12. Good.

Further, three or more first surface side bus bars 12 are provided.
The two first surface side busbars 14 are electrically connected to each other, and three or more second surface side busbars 14 are connected to one first surface.
It may be electrically connected via the surface side bus bar 12.

In the above embodiment, the first wiring layer 13
The first-surface-side bus bars 12 forming the above are assembled and fixed in the groove 16 formed in the first surface 11a of the insulating substrate 11. However, as shown in FIG. You may integrate in the state exposed to the 1st surface 11a side. In this case, the number of assembling steps of each first surface side bus bar 12 can be reduced.

As shown in FIG. 5, a third surface 11e is formed on the outside of the second wiring layer 15 in the insulating substrate 11, and the third wiring layer 31 including the third surface side bus bar 30 is formed on the third surface 11e. To form. Then, the third surface side bus bar 30 and the second surface side bus bar 14 may be electrically connected by welding through the through holes 32 provided in the insulating substrate 11.

According to this configuration, the shapes of the first, second and third surface side bus bars 12, 14, 30 connecting the desired position on the first surface 11a and the desired position on the third surface 11e. However, since the wiring layers 13, 15, 31 can be formed with busbars having a smaller number of types, it is possible to further reduce the number of molds for the busbars.

The first surface side bus bar 12 and the second surface side bus bar 14 may be electrically connected to each other by joining them with a rivet inserted in the through hole. Even in this case, the number of molds can be reduced by reducing the types of busbars having different shapes, and the number of parts and the number of assembling steps can be reduced.

In the above-described embodiment, the insulating substrate 11 is insert-molded to integrate the second surface side bus bars 14, but it may be integrated by foam molding.

The shapes of the first surface side bus bar and the second surface side bus bar and the shape of each groove 16 of the insulating substrate 11 are not limited to the linear band shape, and may be a curved shape as in the related art. The welding method of the first surface side bus bar and the second surface side bus bar is not limited to laser welding, and may be resistance welding such as spot welding and projection welding.

A first wiring layer formed of the first surface side bus bar is formed on the first surface side of the insulating substrate forming the bus bar wiring board, and a second wiring layer formed of the second surface side bus bar is formed on the second surface side thereof. To form. Further, the insulating substrate is molded with the second wiring layer integrated. In such a bus bar wiring board, the insulating substrate is formed so that the insulating layer is integrally formed outside the second wiring layer. According to such a configuration, it is not necessary to assemble the second surface side bus bar to the insulating substrate, and when the other bus bar wiring board is laminated, the insulating board that insulates the bus bar wiring board from the bus bar wiring layer is provided. It becomes unnecessary. Therefore, it is possible to reduce the man-hours for assembling the bus bar, and further, it is possible to reduce the number of parts of the insulating substrate and the man-hours for assembling.

Below, in addition to the inventions described in the scope of the claims, the technical idea grasped from the above-mentioned respective embodiments and respective examples will be described together with their effects. (1) In the invention according to any one of claims 1 to 3, the insulating substrate is molded in a state in which the first surface side bus bar is integrated in a state of being exposed to the first surface side. . With such a configuration, the number of assembling steps for the first surface side bus bar can be reduced.

(2) In the invention according to any one of claims 1 to 3, each first surface side bus bar is formed in a linear strip shape having the same width and extending in the same direction, and each of the second surfaces is formed. The side bus bar has the same width as the first surface side bus bar and is formed in a straight strip shape extending in the same direction intersecting each of the first surface side bus bars. According to such a configuration,
Each bus bar can be easily formed from a strip material without using a mold. Also, between products with different wiring layouts,
It is possible to reduce the number of molds by using a common insulating substrate.

(3) In the invention according to any one of claims 1 to 3, the second insulating layer is formed on the insulating substrate.
A third surface is formed outside the wiring layer, and a third wiring layer including a third surface side bus bar is formed on the third surface, and the third surface side bus bar and the second bus bar are provided on the insulating substrate. It was electrically conducted through the through hole. According to such a configuration,
It is possible to further reduce the number of molds for busbars having different shapes.

(4) The first wiring layer made of the first surface side bus bar is formed on the first surface side of the insulating substrate, and the second wiring layer made of the second surface side bus bar is formed on the second surface side thereof. In a bus bar wiring board in which the insulating substrate is formed in a state where the second wiring layer is integrated, the insulating substrate is formed so that the insulating layer is integrally formed outside the second wiring layer. With such a configuration, it is possible to reduce the man-hours for assembling the bus bar, and it is also possible to reduce the number of parts of the insulating substrate and the man-hours for assembling.

[0046]

According to the inventions of claims 1 to 3, it is possible to reduce the number of parts and the number of assembling steps when forming a wiring assembly by laminating a plurality of bus bar wiring boards. In addition, each first surface side bus bar of the first wiring layer and the second wiring
All the second side bus bars of the wire layer are cut from the strip material.
Can be formed. And, in the insulating substrate
By changing the position of the through hole
It is possible to change the combination of the sub bar and the second side bus bar.
It is possible to configure busbar wiring boards with various wiring layouts.
You can For this reason, products with different wiring layouts
The bus bar and insulating board can be shared between products.
It

In addition, according to the invention described in claim 2 or 3, it is possible to prevent the number of parts from increasing. In addition, according to the invention described in claim 3, it is possible to further reduce the number of molds by reducing the types of bus bars having different shapes, and to improve the degree of freedom in wiring layout design without using new parts. You can

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a main part of a bus bar wiring board.

FIG. 2 is a schematic cross-sectional view taken along the line AA of FIG.

FIG. 3 is a side view of the bus bar wiring board.

FIG. 4 is a schematic cross-sectional view showing a main part of a bus bar wiring board of another example.

FIG. 5 is a schematic cross-sectional view showing a main part of a bus bar wiring board of another example.

FIG. 6 is a schematic cross-sectional view showing a main part of a conventional bus bar wiring board.

[Explanation of symbols]

10 ... Bus bar wiring board, 11 ... Insulating substrate, 11a ... 1st
Surface, 11b ... Second surface, 12 ... First surface side bus bar, 13 ...
First wiring layer, 14 ... Second surface side bus bar, 15 ... Second wiring layer, 16 ... Groove, 18 ... Insulating layer, 20 ... Through hole.

Continuation of the front page (56) Reference JP-A-8-163745 (JP, A) JP-A-11-215650 (JP, A) JP-A-9-29445 (JP, A) JP-A-2000-125447 (JP, A) JP 2000-125446 (JP, A) JP 2001-16745 (JP, A) JP 2000-324657 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H02G 3 / 16 B60R 16/02 H01R 4/58

Claims (3)

(57) [Claims] 1. A first wiring layer made of a first surface side bus bar is formed on a first surface side of an insulating substrate, and a second wiring layer made of a second surface side bus bar is formed on a second surface side thereof, In a bus bar wiring board in which the first surface side bus bar and the second surface side bus bar are electrically connected to each other through a through hole provided in an insulating substrate, the second wiring layer is cut from a strip-shaped material and has the same width. Extended by
The second surface side busbars formed in a straight strip shape are parallel to each other
And the second surface side bus bar is integrated with the insulating substrate by insert molding so that the second surface side bus bar is covered from the outside by the insulating layer formed by the insulating substrate.
And a linear strip groove is formed on the first surface of the second surface side bus bar.
A plurality to extend in the direction orthogonal to the longitudinal direction of the
The first surface side bus bars are provided at equal intervals in parallel with each other.
Is a straight strip that is cut from the strip and extends the same width.
Busbar wiring boards that are formed and are respectively disposed in the grooves . 2. The bus bar wiring board according to claim 1, wherein the first surface side bus bar and the second surface side bus bar are electrically connected by being joined by welding. 3. The first surface side busbars are electrically connected to each other via the second surface side busbars, or the second surface side busbars are electrically connected to each other via the first surface side busbars. The bus bar wiring board according to claim 1 or claim 2.