JP2001197630A - Bus-bar wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of components and assembly man-hours, when a plurality of bus-bar wiring boards are layered to form a wiring assembly unit. SOLUTION: First surface side bus-bars 12 of a first wiring layer 13, formed on a first surface 11a of an insulating board 11, and second surface side bus-bars 14 of a second wiring layer 15, formed on a second surface 11b of the insulating board 11, are connected electrically to each other via through-holes 20 formed in the insulating board 11. When the insulating board 11 is molded, the second wiring layer 15 is formed integrally with the insulating board 11, so as to be isolated from the outside with an insulating layer 18 provided by the insulating board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar wiring board for forming a wiring assembly of an electric junction box provided in, for example, an automobile.

[0002]

2. Description of the Related Art Conventionally, an electric connection box such as a fuse box or a relay box is provided with a wiring assembly in which a plurality of bus bar wiring boards each having a bus bar wiring layer composed of a plurality of bus bars formed on an insulating substrate made of synthetic resin. ing. Each bus bar provided on each bus bar wiring board has a tab integrally formed at an end thereof, penetrating each bus bar wiring board of the upper layer or the lower layer of the bus bar wiring board to the uppermost surface and the lowermost surface of the wiring assembly. Has been extended.

A tab of each bus bar of each bus bar wiring board extending to the uppermost surface of the wiring assembly is connected to, for example, a connection terminal to which a relay terminal serving as a female electrical terminal in a fuse housing or a relay housing is connected. To form or,
The tab of each bus bar of each bus bar wiring board extending to the lowermost surface of the wiring assembly forms, for example, a male electrical terminal of a connector housing to which a connector of a wire harness is connected. That is, the wiring assembly is formed with a three-dimensional wiring structure including each bus bar provided on each bus bar wiring board.

The positions of the tabs on the uppermost surface of the wiring assembly of each bus bar and the positions of the tabs on the lowermost surface are vertically incompatible positions. Therefore, it is necessary to connect between the uppermost surface and the lowermost position so as not to interfere with other busbars, so that there are many types of busbars having different shapes. As a result, there are many types of dies for forming each bus bar.

In order to solve such a problem,
As shown in FIG. 6, busbar wiring layers 51 and 52 are formed on a first surface 50a and a second surface 50b of one insulating substrate 50 as busbar wiring boards, respectively. There is a bus bar wiring board in which each bus bar 53 and each bus bar 54 of the bus bar wiring layer 52 on the second surface side are welded at a desired position via a through hole 55 provided in the insulating substrate 50 and are electrically connected. .

In such a bus bar wiring board, the first surface 5
The bus bar 53 on the 0a side and the bus bar 54 on the second surface 50b side
And tabs 53a, 54a formed at each end thereof are first.
What is necessary is just to arrange | position at the desired position of the surface 50a and the 2nd surface 50b, and to provide so that it may cross | intersect at the appropriate position on the 1st surface 50a and the 2nd surface 50b. Then, both bus bars 53 and 54 may be welded through the through holes 55 of the insulating substrate 50 provided at the intersection positions. Therefore, the first surface 5
0a and each desired position on the second surface 50b,
Compared to the case of connecting with one bus bar, the shapes of both bus bars 53 and 54 are less likely to be restricted, so that the types of bus bars 53 and 54 having different shapes can be reduced.

[0007]

In the above-mentioned bus bar wiring board, both the bus bar wiring layer 51 and the bus bar wiring layer 52 are exposed to the outside. Therefore, when laminating the bus bar wiring boards to form a wiring assembly, it is necessary to interpose an insulating substrate between the bus bar wiring boards to be superposed. Therefore, the wiring assembly cannot be formed by stacking only the bus bar wiring boards, and the number of parts and the number of assembly steps cannot be reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to reduce the number of parts and the number of assembling steps when a plurality of bus bar wiring boards are stacked to form a wiring assembly. It is an object of the present invention to provide a bus bar wiring board which can be used.

[0009]

According to a first aspect of the present invention, a first wiring layer comprising a first surface side bus bar is formed on a first surface side of an insulating substrate. A second wiring layer including a second surface side bus bar is formed on the second surface side, and the first wiring layer is formed through a through hole provided in the insulating substrate.
In a bus bar wiring board in which a surface side bus bar and a second surface side bus bar are electrically connected to each other, the insulating substrate may be provided in the second side bus bar.
This is a bus bar wiring board molded in a state where the wiring layer is integrated so as to be covered from the outside by the insulating layer formed by the insulating substrate.

According to a second aspect of the present invention, in the first aspect, the first surface side bus bar and the second surface side bus bar are electrically connected by welding.

According to a third aspect of the present invention, in the first or second aspect of the invention, the first surface side bus bars are electrically connected to each other via the second surface side bus bar, or
The second surface busbars were electrically connected to each other via the first surface busbar.

(Operation) According to the first aspect of the present invention,
The second wiring layer formed on the second surface of the insulating substrate having the first wiring layer formed on the first surface is integrated with the insulating substrate and is externally covered with the insulating layer formed by the insulating substrate. Therefore, it is not necessary to attach the second surface side bus bar to the insulating substrate, and it is not necessary to provide an insulating plate for insulating the bus bar wiring board from the bus bar wiring layer at the time of lamination with another bus bar wiring board. .

According to the second aspect of the present invention, the first aspect is provided.
In addition to the operation of the invention described in the above, the first surface side bus bar and the second surface
Since the surface side busbars are electrically connected by welding, new parts such as rivets for connecting both busbars are not required.

According to the invention described in claim 3, according to claim 1 of the present invention,
Or, in addition to the effect of the invention described in claim 2, the first surface side bus bars are electrically connected to each other via the second surface side bus bar, or
Since the second surface side busbars are electrically connected via the first surface side busbars, the busbars are electrically connected in the same wiring layer without using a jumper wire or the like.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. As shown in FIGS. 2 and 3, the bus bar wiring board 10 of the present embodiment includes a rectangular flat insulating substrate 11 made of a synthetic resin. On the insulating substrate 11, a first wiring layer 13 composed of a plurality of first surface side bus bars 12 is formed on a first surface 11a, and a second wiring layer 13 composed of a plurality of second surface side bus bars 14 is formed on a second surface 11b.
The wiring layer 15 is formed.

The insulating substrate 11 on which the first wiring layer 13 is formed
The first surface 11a has two pairs of opposite edges 11c,
A plurality of linear strip-shaped grooves 16 extending along one side edge 11c of one of 11d are formed at equal intervals. Each of the grooves 16 has a first surface-side bus bar 12 in the form of a straight band extending at the same width along the groove 16 and fixed by caulking or the like.

A tab 17 standing upright from the insulating substrate 11 is integrally formed at one end of the first surface side bus bar 12. The tab 17 is formed, for example, on the bus bar wiring board 1.
A relay terminal serving as a female-side electric terminal is connected to a fuse housing or a relay housing provided in a case body (not shown) fixed directly or on a first surface 11a side with a plurality of bus bar wiring boards interposed therebetween. Connection terminal. Alternatively, it is a male electrical terminal in the connector housing.

On the second surface 11b side of the insulating substrate 11 on which the second wiring layer 15 is formed, two sets of two opposite edges 1 are provided.
A plurality of linear band-shaped second surface side busbars 14 extending at the same width along the other two side edges 11d of 1c and 11d are arranged at equal intervals. That is, each second surface side bus bar 14 is disposed orthogonally to each first surface side bus bar 12.

Each second surface side bus bar 14 is connected to the insulating substrate 11
Is integrated with the insulating substrate 11 by insert molding. And each 2nd surface side bus bar 14
It is covered from the outside by an insulating layer 18 formed by the insulating substrate 11. A tab 19 that stands upright from the insulating substrate 11 is integrally formed at one end of each second surface side bus bar 14. The tab 19 is, for example, a male side in a connector housing provided in a case body (not shown) fixed to the bus bar wiring board 10 directly or with a plurality of bus bar wiring boards interposed on the second surface 11b side thereof. It becomes an electric terminal.

As shown in FIG. 1, each of the first surface side bus bars 12 is provided on the insulating substrate 11 at an intersection of one of the second surface side bus bars 14 with the insulating substrate 11 interposed therebetween. It is welded through the through hole 20. Welding the first surface
The welding portion 21 is formed by laser welding from the side a, and is formed in a conical shape with a larger diameter toward the first surface 11a side, through which the through hole 20 is inserted. The reason why the through hole 20 and the welded portion 21 are conical is that laser welding performed from the first surface side is performed with a slight inclination with respect to the axis of the through hole 20.

Then, the first surface side bus bar 12 welded
The second surface side bus bar 14 forms an electric path for electrically connecting the tab 17 arranged on the first surface 11a and the tab 19 arranged on the second surface.

In order to form a wiring assembly by laminating a plurality of bus bar wiring boards including the bus bar wiring board 10 of the present embodiment configured as described above, first, each first surface side bus bar 1
2 is formed such that the tab 17 formed at the end thereof is arranged at a desired position in the longitudinal direction of the groove 16. In the groove 16, in a region where the first surface side bus bar 12 is not arranged, a through hole is formed to insert a tab of each bus bar of each bus bar wiring board laminated on the first surface 11 a side.

Similarly, each second surface side bus bar 14 is formed such that the tab 19 formed at the end thereof is arranged at a desired position in the longitudinal direction of the second surface side bus bar 14.
In the area where the second surface side bus bar 14 is not arranged,
A through hole is formed on the side of the second surface 11b, through which a tab of each bus bar of each bus bar wiring board is inserted.

On the other hand, the first surface 11a of the bus bar wiring board 10
In each bus bar wiring board laminated on the side, a through hole for inserting the tab 17 of each first surface side bus bar 12 is formed at a position corresponding to the tab 17. Similarly, in each bus bar wiring board laminated on the second surface 11 b side, a through hole for inserting the tab 19 of each second surface side bus bar 14 is formed at a position corresponding to the tab 19.

The tab 1 of each first surface side bus bar 12 is inserted into the through hole of each bus bar wiring board laminated on the first surface 11a side.
7 and the tab of each bus bar of each bus bar wiring board is inserted into a through hole provided in the bus bar wiring board 10. Thus, the bus bar wiring board is laminated on the first surface 11a side of the bus bar wiring board 10, and the end portion of the tab 17 of each first surface side bus bar 12 of the bus bar wiring board 10 is provided on the outermost surface of the laminated bus bar wiring board. Then, the end of the tab of each bus bar of the other bus bar wiring boards is projected. Then, the tab 17 of each first surface side bus bar 12 protruding from the outermost surface
And the tab of each bus bar of the other bus bar wiring board,
For example, a connection terminal in a fuse housing or a relay housing provided in a case accommodating the wiring assembly.

Similarly, the tab 1 of each bus bar 14 on the second surface side is inserted into the through hole of each bus bar wiring board laminated on the second surface 11b side.
9 is inserted, and the tab of each bus bar of each bus bar wiring board is inserted into a through hole provided in the bus bar wiring board 10. As a result, the bus bar wiring board is laminated on the second surface 11b side of the bus bar wiring board 10, and the end of the tab 19 of each second surface side bus bar 14 of the bus bar wiring board 10 is provided on the outermost surface of the laminated bus bar wiring board. Then, the end of the tab of each bus bar of the other bus bar wiring boards is projected. The tab 19 of each second surface side bus bar 14 protruding from the outermost surface.
And the tab of each bus bar of the other bus bar wiring board,
For example, it is a male electrical terminal in a connector housing provided in a case that houses the wiring assembly.

The embodiment described above has the following functions and effects. (1) According to the present embodiment, the second wiring layer 15 provided on the second surface 11b of the insulating substrate 11 and the first wiring layer 13 provided on the first surface 11a are formed. Second surface side bus bar 14 electrically connected to first surface side bus bar 12 through through hole 20 provided in insulating substrate 11.
Is integrated with the insulating substrate 11 and is externally covered with an insulating layer 18 formed on the insulating substrate 11. For this reason, it is not necessary to attach the second surface side bus bar 14 to the insulating substrate 11, and an insulating plate for insulating the bus bar wiring board from the bus bar wiring layer at the time of lamination with another bus bar wiring board becomes unnecessary. . As a result, it is possible to reduce the number of components and the number of assembly steps when forming a wiring assembly by laminating a plurality of bus bar wiring boards.

(2) In addition, according to the present embodiment, the first surface side bus bar 12 and the second surface side bus bar 14 are electrically connected by welding, so that both bus bars 12, 1
No new parts, such as rivets, for connecting 4 are required. As a result, the number of components can be prevented from increasing.

(3) Further, according to the present embodiment, each first surface side bus bar 12 is formed in a straight band shape having the same width and extending in the same direction, and each second surface side bus bar 14 is formed on each first surface side. It was formed in the shape of a straight band extending in the same direction as the bus bar 12 and having the same width as the bus bar 12 and intersecting with the first surface side bus bar 12. Therefore, the tab 17 of each first surface side bus bar 12 and the tab 19 of each second surface side bus bar 14 are provided at desired positions, respectively, and the through holes provided at the positions where the bus bars 12, 14 to be conductive intersect. 20 through the first surface 1
A desired position on 1a and a desired position on second surface 11b can be electrically connected.

For this reason, the desired position on the first surface 11a and the desired position on the second surface 11b are defined by the first surface 11a or the second surface 11a.
Unlike the case where the connection is made by one bus bar provided on any one of the surfaces 11b, each bus bar does not need to be formed in a different shape, and can be constituted directly by only a band-shaped bus bar. As a result, each bus bar can be formed by cutting and bending the band-shaped material, so that a mold for each bus bar is not required as in the related art.

Further, by providing through holes 20 at positions where the first surface side bus bars 12 and the second surface side bus bars 14 to be electrically connected to the same insulating substrate 11, the bus bar wiring boards 10 having various wiring layouts are provided. Can be configured. For this reason, it is possible to reduce the number of molds by sharing the insulating substrate 11 between products of different types.

Hereinafter, embodiments other than the above embodiment embodying the present invention will be listed. In the above embodiment, the first surface side bus bar 12 and the second surface
Although the surface side busbars 14 are connected so as to conduct one-to-one, as shown in FIG. 4, the two first surface side busbars 12 are connected to each other through one second surface side busbar 14. Each first surface side bus bar 12 may be electrically connected to the second surface side bus bar 14. According to such a configuration, the first surface side busbars 12 are electrically connected to each other in the first wiring layer 13 without using a jumper wire or the like, so that the types of busbars having different shapes can be reduced or new busbars can be used. The degree of freedom in wiring layout can be improved without using components.

Similarly, each second surface bus bar 14 may be electrically connected to the first surface bus bar 12 such that the two second surface bus bars 14 are electrically connected to each other via one first surface bus bar 12. Good.

Further, three or more first surface side bus bars 12
Are connected to each other via one second surface side bus bar 14, or three or more second surface side bus bars 14 are connected to one first bus bar 14.
The electrical connection may be made via the surface side bus bar 12.

In the above embodiment, the first wiring layer 13
Each of the first surface side bus bars 12 is formed and fixed in a groove 16 formed in the first surface 11a of the insulating substrate 11, but as shown in FIG. You may integrate in the state exposed to the one surface 11a side. In this case, the man-hour for assembling each first surface side bus bar 12 can be reduced.

As shown in FIG. 5, a third surface 11 e is formed on the insulating substrate 11 outside the second wiring layer 15, and the third surface 11 e is provided with a third wiring layer 31 composed of the third surface side bus bar 30. To form The third surface side bus bar 30 and the second surface side bus bar 14 may be electrically connected by welding through a through hole 32 provided in the insulating substrate 11.

According to this configuration, the shape of the first, second and third surface side bus bars 12, 14, 30 connecting the desired position on the first surface 11a and the desired position on the third surface 11e. Are more difficult to restrict, the wiring layers 13, 15, 31 can be formed with fewer types of busbars, and the number of busbar dies can be further reduced.

The first surface side bus bar 12 and the second surface side bus bar 14 may be electrically connected by joining with a rivet inserted through the through hole. Even in this case, the number of dies can be reduced by reducing the types of bus bars having different shapes, and the number of parts and the number of assembling steps can be reduced.

In the above-described embodiment, the second surface side busbars 14 are integrated by insert molding of the insulating substrate 11, but may be integrated by foam molding.

The shapes of the first surface side bus bar and the second surface side bus bar and the shape of each groove 16 of the insulating substrate 11 are not limited to a straight band shape, but may be a curved shape as in the related art. The method of welding the first surface side bus bar and the second surface side bus bar is not limited to laser welding, but may be resistance welding such as spot welding or projection welding.

A first wiring layer composed of a first surface side bus bar is formed on the first surface side of the insulating substrate forming the bus bar wiring board, and a second wiring layer composed of the second surface side bus bar is formed on the second surface side To form Further, an insulating substrate is formed with the second wiring layer integrated. In such a bus bar wiring board, the insulating substrate is formed so that the insulating layer is integrally formed outside the second wiring layer. According to such a configuration, it is not necessary to attach the second surface side bus bar to the insulating substrate, and when the other bus bar wiring board is laminated, the insulating plate for insulating the bus bar wiring board from the bus bar wiring layer is formed. It becomes unnecessary. Therefore, the number of man-hours for assembling the bus bar can be reduced, and the number of parts and the number of assembling steps of the insulating substrate can be reduced.

In the following, in addition to the inventions described in the claims, the technical ideas grasped from the above-described embodiments and examples will be described together with their effects. (1) In the invention according to any one of claims 1 to 3, the insulating substrate is molded in a state where the first surface side bus bar is integrated with the first surface side bus bar while being exposed to the first surface side. . According to such a configuration, the number of steps for assembling the first surface side bus bar can be reduced.

(2) In the invention described in any one of claims 1 to 3, each of the first surface side bus bars is formed in a linear band shape having the same width and extending in the same direction, and each of the second surface bus bars. The side bus bar is formed in a linear band shape having the same width as the first surface side bus bar and extending in the same direction crossing each of the first surface side bus bars. According to such a configuration,
Each bus bar can be easily formed from a strip without using a mold. Also, between products with different wiring layouts,
The number of molds can be reduced by using a common insulating substrate.

(3) In the invention according to any one of claims 1 to 3, the insulating substrate may include
A third surface is formed outside the wiring layer, a third wiring layer including a third surface side bus bar is formed on the third surface, and the third surface side bus bar and the second bus bar are provided on the insulating substrate. Through the through hole. According to such a configuration,
The number of dies of bus bars having different shapes can be further reduced.

(4) A first wiring layer made of a first surface side bus bar is formed on the first surface side of the insulating substrate, and a second wiring layer made of the second surface side bus bar is formed on the second surface side. In a bus bar wiring board in which the insulating substrate is formed in a state where the second wiring layer is integrated, the insulating substrate is formed so that the insulating layer is integrally formed outside the second wiring layer. According to such a configuration, the number of man-hours for assembling the bus bar can be reduced, and further, the number of parts and the number of man-hours for assembling the insulating substrate can be reduced.

[0046]

According to the first to third aspects of the present invention, it is possible to reduce the number of parts and the number of assembling steps when forming a wiring assembly by laminating a plurality of bus bar wiring boards.

In addition, according to the second or third aspect of the invention, it is possible to prevent the number of parts from increasing. In addition, according to the third aspect of the present invention, the number of dies can be further reduced by reducing the types of bus bars having different shapes, and the degree of freedom in wiring layout design can be improved without using new components. Can be.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a main part of a bus bar wiring board.

FIG. 2 is a schematic cross-sectional view taken along line AA of FIG.

FIG. 3 is a side view of the bus bar wiring board.

FIG. 4 is a schematic cross-sectional view showing a main part of another example of a bus bar wiring board.

FIG. 5 is a schematic cross-sectional view showing a main part of another example of a bus bar wiring board.

FIG. 6 is a schematic sectional view showing a main part of a conventional bus bar wiring board.

[Explanation of symbols]

10: bus bar wiring board, 11: insulating substrate, 11a: first
Surface, 11b: second surface, 12: first surface side bus bar, 13 ...
First wiring layer, 14: second-side bus bar, 15: second wiring layer, 18: insulating layer, 20: through hole.

Claims (3)

[Claims] A first wiring layer made of a first surface side bus bar is formed on a first surface side of the insulating substrate, and a second wiring layer made of a second surface side bus bar is formed on the second surface side of the first wiring layer; A bus bar wiring board in which the first surface side bus bar and the second surface side bus bar are electrically connected to each other through a through hole provided in an insulating substrate, wherein the insulating substrate is formed by the insulating substrate. A busbar wiring board formed in an integrated state so as to be covered from the outside by an insulating layer to be formed. 2. The bus bar wiring board according to claim 1, wherein the first surface side bus bar and the second surface side bus bar are electrically connected by welding. 3. The bus bar according to claim 1, wherein the bus bars on the first side are connected to each other via the bus bar on the second side, or the bus bars on the second side are connected via the bus bars on the first side. The bus bar wiring board according to claim 1.