JPH0229733Y2 - - Google Patents
Info
- Publication number
- JPH0229733Y2 JPH0229733Y2 JP1981010260U JP1026081U JPH0229733Y2 JP H0229733 Y2 JPH0229733 Y2 JP H0229733Y2 JP 1981010260 U JP1981010260 U JP 1981010260U JP 1026081 U JP1026081 U JP 1026081U JP H0229733 Y2 JPH0229733 Y2 JP H0229733Y2
- Authority
- JP
- Japan
- Prior art keywords
- busbar
- circuit
- conductor
- insulating substrate
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004080 punching Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Description
【考案の詳細な説明】
本考案は、ブスバー回路板の改良に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a busbar circuit board.
ブスバー回路板は、絶縁基板にブスバー回路を
配設して構成され、主として自動車の電気接続盤
して使用するコントロールボツクスやヒユーズボ
ツクスの内部回路の構成部材として、プリント基
板と共に利用されている。 A busbar circuit board is constructed by disposing a busbar circuit on an insulating substrate, and is used together with a printed circuit board as a component of the internal circuits of control boxes and fuse boxes, which are mainly used as electrical connection boards in automobiles.
ブスバー回路は、複雑な回路パターンをとる場
合でも、一枚の金属板から打抜き、折曲加工等に
より容易に形成できるという利点がある。しか
し、第５図のブスバー回路板に示すように、内側
の回路a1および回路a2に連成された雄タブ端子
b1，b1，b2に対し、外側の回路a3の雄タブ端子b3
を並列状態で配列し電極群を構成する場合には、
回路a3は大きく迂回（斜線部）させ、内部の回路
a1，a2との交叉を避けるようにしなければならな
い。従つて、回路構成が複雑になり、その配設に
必要なスペースを確保するために回路板全体が大
型化し、その割には回路密度を高くできないとい
う欠点がある。また、ブスバーの打抜き形成に際
し、多量の打抜残が生じ、材料が無駄になる。一
方、回路a1，a2と回路a3との交叉を避けるため、
回路板を二つに分けて積層する方法も考えられる
が、この場合には二枚の絶縁基板を要するため重
量が増加するという欠点がある。 Busbar circuits have the advantage that even if they have a complex circuit pattern, they can be easily formed from a single metal plate by punching, bending, etc. However, as shown in the busbar circuit board in Figure 5, the male tab terminals connected to the inner circuit a 1 and circuit a 2
male tab terminal b 3 of outer circuit a 3 for b 1 , b 1 , b 2
When arranging them in parallel to form an electrode group,
Circuit a 3 is largely detoured (shaded area) and the internal circuit
Intersection with a 1 and a 2 must be avoided. Therefore, the circuit configuration becomes complicated, and the entire circuit board becomes large in order to secure the space necessary for its arrangement, which has the disadvantage that the circuit density cannot be increased. Further, when forming the bus bar by punching, a large amount of punching remains, resulting in wasted material. On the other hand, in order to avoid crossover between circuits a 1 and a 2 and circuit a 3 ,
Although it is possible to divide the circuit board into two and laminate them, this method requires two insulating substrates, resulting in an increase in weight.
本考案は上記の欠点を改善するためになされた
もので、回路構成が簡単でしかも回路密度が高く
小型化および軽量化に適したブスバー回路板を提
供することを目的とする。 The present invention has been made to improve the above-mentioned drawbacks, and an object of the present invention is to provide a busbar circuit board that has a simple circuit configuration, high circuit density, and is suitable for miniaturization and weight reduction.
以下、本考案を図面に基いて説明すると、第１
図において、１はコントロールボツクス等の電気
接続盤Ａを構成するブスバー回路板、２はそのケ
ース、３は蓋体であり、蓋体３には外部コネクタ
挿着用のハウジング４が一体的に形成されてい
る。 Below, the present invention will be explained based on the drawings.
In the figure, 1 is a bus bar circuit board constituting an electrical connection board A such as a control box, 2 is a case thereof, and 3 is a lid body. A housing 4 for inserting an external connector is integrally formed on the lid body 3. ing.
ブスバー回路板１は、絶縁基板５に複数のブス
バー回路６，７，８，９および１０を配設すると
共に、回路６，７および１０の端部には雄タブ端
子１１を立上げ連成して構成され、各雄タブ端子
１１はハウジング４内に突出し、外部コネクタと
接続するための双極雌端子１２が嵌挿されてい
る。 The busbar circuit board 1 has a plurality of busbar circuits 6, 7, 8, 9, and 10 arranged on an insulating substrate 5, and male tab terminals 11 are connected to the ends of the circuits 6, 7, and 10. Each male tab terminal 11 protrudes into the housing 4, and a bipolar female terminal 12 for connection to an external connector is inserted therein.
以上のブスバー回路板の構成は従来と同様であ
るが、本考案においては、ブスバー回路７および
１０の端部にはそれぞれ絶縁基板５の下面に貫通
突出する連結片１３が折曲げ形成され、銅単芯線
等の導体１４によつて連結されると共に、ケース
２にはこれに対応する樋状部１５が形成されてい
る。 The configuration of the above-mentioned busbar circuit board is the same as that of the conventional one, but in the present invention, connection pieces 13 are bent and formed at the ends of the busbar circuits 7 and 10, respectively, to protrude through the lower surface of the insulating substrate 5. The case 2 is connected by a conductor 14 such as a single core wire, and a gutter-like portion 15 corresponding to the conductor 14 is formed in the case 2 .
この連結片１３は、第２図イに示すように、そ
の先端側に導体１４を嵌込むＵ字状の導体挾持溝
１３ａが形成されており、第２図ロのように図示
しない治具により加締めて導体１４と圧着し、又
は導体１４の圧入を受けることによつて直ちにこ
れを固定する。 As shown in FIG. 2A, this connecting piece 13 has a U-shaped conductor clamping groove 13a formed at its tip side into which the conductor 14 is fitted, and is mounted using a jig (not shown) as shown in FIG. 2B. This is immediately fixed by crimping and crimping with the conductor 14, or by being press-fitted with the conductor 14.
その結果は、ブスバー回路７と１０は、絶縁基
板５の裏面において、連結片１３，１３および導
体１４によつて表面のブスバー回路８，９と立体
交叉状態において接続される。即ち、ブスバー回
路７と１０とは短絡され、従来の如く（第５図参
照）回路を大きく迂回させる必要がなくなる。こ
の際において、導体１４は表面のブスバー回路全
体と略平行状態をもつて配設される。 As a result, the busbar circuits 7 and 10 are connected to the busbar circuits 8 and 9 on the front surface by the connecting pieces 13, 13 and the conductor 14 on the back surface of the insulating substrate 5 in a three-dimensionally crossed state. That is, the busbar circuits 7 and 10 are short-circuited, and there is no need to make a large circuit detour as in the conventional case (see FIG. 5). At this time, the conductor 14 is arranged substantially parallel to the entire busbar circuit on the surface.
従つて、ブスバー回路の構成が簡単となり、製
作が容易になる他、絶縁基板若しくは回路板自体
の小型化および回路密度を図ることができる。 Therefore, the configuration of the busbar circuit becomes simple and manufacturing becomes easy, and the insulating substrate or circuit board itself can be miniaturized and the circuit density can be increased.
第３図は上記架橋接続の他の方法を示し、連結
片１３，１３と直交する位置に該片１３よりも長
い連結片１３′，１３′を突出させて配置し、導体
１４，１４′がクロスした状態で接続したもので
ある。このようにすれば、絶縁基板上に配置され
る所望のブスバー回路を複数組最短距離で短絡す
ることができる。 FIG. 3 shows another method of the above-mentioned bridge connection, in which connecting pieces 13', 13', which are longer than the connecting pieces 13, are protruded and placed at positions orthogonal to the connecting pieces 13, 13, and the conductors 14, 14' They are connected in a crossed state. In this way, a plurality of desired busbar circuits arranged on the insulating substrate can be short-circuited over the shortest distance.
第４図はケース２に樋状部１５を形成する代り
に導体受溝１６ａを有する導体支持部１６を突設
したものであり、導体１４は表面のブスバー回路
８′と絶縁基板５を介在させつつ立体交叉状態に
配設されてブスバー回路９′の連結片９a′と接続
され、この場合にはケース２の構造および製作が
より簡単になる。 FIG. 4 shows a case 2 in which a conductor support part 16 having a conductor receiving groove 16a is provided in a protruding manner instead of forming a gutter-like part 15, and the conductor 14 is connected to a busbar circuit 8' on the surface with an insulating substrate 5 interposed therebetween. In this case, the structure and manufacture of the case 2 are simplified.
本考案は上記のように、絶縁基板に複数のブス
バー回路を配設してなるブスバー回路板におい
て、少くとも２個の所望のブスバー回路の端部若
しくは中間部に絶縁基板の裏面に貫通突出する連
結片を設け、該連結片を導体により接続し、該導
体が相互に連結されるブスバー回路以外の他のブ
スバー回路と絶縁基板を介在させつつ立体交叉状
態にあるようにして成るものであるから、ブスバ
ー回路の構成も簡単であり、小型化および軽量化
に適した回路密度の高いブスバー回路を提供する
ことができる。 As described above, the present invention provides a busbar circuit board in which a plurality of busbar circuits are disposed on an insulating substrate, in which at least two desired busbar circuits have penetrating protrusions from the back surface of the insulating substrate at the ends or middle portions of the desired busbar circuits. This is because a connecting piece is provided, the connecting piece is connected by a conductor, and the conductor is in a three-dimensional crossing state with other busbar circuits other than the interconnected busbar circuits with an insulating substrate interposed therebetween. The structure of the busbar circuit is also simple, and it is possible to provide a busbar circuit with high circuit density that is suitable for downsizing and weight reduction.
第１図は本考案の一実施例を示す一部切欠斜視
図、第２図イおよびロはそれぞれ連結片１３と導
体１４との接続を示す拡大説明図、第３図は連結
片と導体との他の接続を示す説明図、第４図は本
考案の他の実施態様を示す一部切欠斜視図、第５
図は従来のブスバー回路板を示す要部の斜視図で
ある。
５……絶縁基板、６〜１０……ブスバー回路、
１３，１３′……連結片、１４，１４′……導体。
FIG. 1 is a partially cutaway perspective view showing an embodiment of the present invention, FIG. FIG. 4 is a partially cutaway perspective view showing another embodiment of the present invention; FIG.
The figure is a perspective view of the main parts of a conventional busbar circuit board. 5...Insulating board, 6-10...Busbar circuit,
13, 13'... Connection piece, 14, 14'... Conductor.
Claims (1)
ブスバー回路板において、少なくとも２個の所望
のブスバー回路の端部若しくは中間部に絶縁基板
の裏面に貫通突出して先端部に導体挾持溝を有す
る連結片を設け、該連結片を該導体挾持溝を介し
て導体により接続し、該導体が相互に連結される
ブスバー回路以外の他のブスバー回路と絶縁基板
を介在させつつ立体交叉状態にして表面のブスバ
ー回路と略平行状態に配設されていることを特徴
とするブスバー回路。 In a busbar circuit board formed by disposing a plurality of busbar circuits on an insulating substrate, a connection having conductor clamping grooves at the tips thereof protruding through the back surface of the insulating substrate at the ends or intermediate portions of at least two desired busbar circuits. The connecting piece is connected by a conductor through the conductor holding groove, and the conductor is interposed with another busbar circuit other than the interconnected busbar circuit with an insulating substrate interposed in a three-dimensional cross state. A busbar circuit characterized in that the busbar circuit is arranged substantially parallel to the busbar circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981010260U JPH0229733Y2 (en) | 1981-01-29 | 1981-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981010260U JPH0229733Y2 (en) | 1981-01-29 | 1981-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57125138U JPS57125138U (en) | 1982-08-04 |
| JPH0229733Y2 true JPH0229733Y2 (en) | 1990-08-09 |
Family
ID=29808432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981010260U Expired JPH0229733Y2 (en) | 1981-01-29 | 1981-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229733Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2507323Y2 (en) * | 1989-01-27 | 1996-08-14 | 三菱電機株式会社 | Large current wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475062A (en) * | 1977-11-29 | 1979-06-15 | Yazaki Corp | Network device |
| JPS552129B2 (en) * | 1977-03-07 | 1980-01-18 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552129U (en) * | 1978-06-21 | 1980-01-09 |
-
1981
- 1981-01-29 JP JP1981010260U patent/JPH0229733Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552129B2 (en) * | 1977-03-07 | 1980-01-18 | ||
| JPS5475062A (en) * | 1977-11-29 | 1979-06-15 | Yazaki Corp | Network device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57125138U (en) | 1982-08-04 |
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