JP3455820B2 - Platinum material - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts, jewelry articles,
The present invention relates to a platinum material close to pure platinum that can be used in a wide range such as the medical field. 2. Description of the Related Art Platinum is used in a wide range of applications such as electronic parts due to its excellent corrosion resistance and heat resistance. [0003] However, pure platinum is very flexible, has low hardness and strength, and breaks in the course of fine wire processing with a die, and has a specific gravity when used at high temperatures. There is a problem that the line sags due to its own weight because of the large size. Also, when used as jewelry supplies,
High-grade high-grade products have the drawbacks that they are easily scratched and easily deformed, and also have the problem that surface finishing is difficult during the processing process. [0004] Accordingly, the present invention provides a method of forming a compound with Sm such as Co, Ni, Sn, In,
10 to 10 in total including Sm by adding one or more types of Cu
It is characterized by being 00 ppm and the balance being Pt .
The reason for using Sm as a main additive element is to improve hardness during casting and working, and Co, Ni, Sn, In, and Cu, which are sub-additive elements, have a relatively low melting point.
And a compound having a high melting point, and at the same time, eliminates the problem of suppression of Sm scattering at the time of melting at high temperature and the problem of heat resistance.
The hardness is improved by a synergistic effect with the above. The reason why the addition amount is set to 10 to 1000 ppm is that
If the content is less than 10 ppm, the effect of improving the hardness is small.
If it exceeds ppm, the electrical conductivity of electronic components will decrease,
This is because the elution of added elements for medical products and the deterioration of high-purity jewelry products. According to the present invention, the hardness after casting is improved as compared with pure platinum by the action of the additional element.
In plastic working such as processing of a wire rod, the increase in hardness due to work hardening was large, and a drastic improvement in hardness was observed as compared with pure platinum. Further, even in the heat treatment of the work material, the coarsening of the crystal grains is suppressed by the trace amount of the additional element, so that the occurrence of the disconnection observed in the fine wire processing of pure platinum is suppressed. An embodiment of the present invention will be described below. Table 1 shows Examples and pure Pt as a conventional example. [Table 1] Each of the samples shown in Table 1 was prepared by casting an alloy containing Sm, which is an additive element shown in Examples, as a main element by arc melting. Next, the above-mentioned mother alloy was blended with pure Pt with the composition shown in the embodiment, and arc melting was carried out in the same manner as described above, and a thickness of 10 mm was obtained.
A cake-like cast having a width of 30 mm and a length of 50 mm was formed, and the cast was formed into a wire or a plate by hot forging, processed into a predetermined shape, and used as a sample. As a result, as is clear from Table 1, Examples 1 to 6 have a higher hardness than pure Pt as a conventional example,
It can be seen that the workability is excellent. According to the present invention described in detail above,
By adding Sm as the main additive element to pure Pt and adding 10 to 1000 ppm of the additional element, the hardness becomes higher than pure Pt, the mechanical properties are excellent, and high purity platinum close to pure platinum is obtained. Materials, electronic components, jewelry supplies,
It has the effect of becoming useful platinum in a wide range such as the medical field.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-7-41886 (JP, A) JP-A-64-84715 (JP, A) JP-A-56-29641 (JP, A) (58) Investigation Field (Int.Cl. ⁷ , DB name) C22C 5/04

Claims (1)

(57) [Claims 1 elemental generates to as compound S m C
o, Ni, Sn, In, with the addition of one or more Cu Sm
And 10 to 1000 ppm in total, with the balance being Pt
Electronic parts, medical supplies, characterized in that there is, platinum material for decorating.