JP3453210B2 - Molding equipment for resin sealing - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing mold device used for manufacturing a resin-sealing type semiconductor device or the like.

[0002]

2. Description of the Related Art FIG. 10 is a cross-sectional view showing the configuration of a conventional example of a resin-sealing mold device used for manufacturing a resin-sealing type semiconductor device. In this resin molding die device, the substrate 14 (molded product) is clamped by the lower die 10 and the upper die 12, and the gate opening is provided from the pot 13 provided in the upper die 12 to the bottom surface of the inner wall of the cavity 22. The resin 20 is pressure-fed into the cavity 22 by the plunger 18 through the opened gate 16 to mold the resin. In this way, the resin sealing mold device of the type in which the gate opening is opened on the bottom surface of the inner wall of the cavity 22 and the resin is sealed is a side gate type in which the cavity is filled with the resin by passing over the article to be molded. Unlike the above, there is a feature that the resin 20 passing through the gate 16 can be resin-sealed without directly contacting the substrate 14.

[0003]

By the way, in the case of the resin encapsulation method in which the cavity is filled with the resin from the gate opening opened on the bottom surface of the inner wall of the cavity, the gate is formed in the resin encapsulation portion after the resin molding. There was a problem that void remains around the connection part with. FIG. 11 shows a state in which the semiconductor device after resin sealing is broken at a diagonal position.
Reference numeral 16a is a rupture mark when the resin cured in the gate 16 is removed, and 17 is a single-sided resin-sealed semiconductor device (for example, Ball
The voids left on the outer surface of the resin sealing portion 24 of the (Grid Array type semiconductor device) are shown. The voids 17 thus remain around the gate end because the resin 20 wraps around the periphery of the cavity 22 when the resin 20 is injected into the cavity 22, as shown by the arrow in FIG. It is thought that this is because the area near the gate edge is finally filled. Figure 10
The portion A indicates a portion where air remains during resin sealing.

The void 17 is a trace 16a of the gate fracture.
Is left on the surface of the resin sealing portion 24 in the form of a ring. Such void residue also occurs when a product having a storage recess for storing the semiconductor chip 15 as shown in FIG. 12 is resin-sealed. In the case of a product in which resin is filled in the cavity from the gate opening opened on the bottom surface of the inner wall of the cavity in this way and is resin-sealed, not only the above example, but a void residue occurs around the gate end, which is the appearance of the product. Also, there is a problem in terms of reliability.

The present invention has been made to solve these problems, and the purpose thereof is to provide a cavity.
Resin from the gate opening on the bottom of the inner wall of the
To provide a mold device for resin encapsulation which can prevent voids from being left on the surface of a resin encapsulation portion when filling and prevent defective products from being produced reliably. It is in.

[0006]

The present invention has the following constitution in order to achieve the above object. That is, a molded product to be resin-molded is clamped by an upper mold and a lower mold, and a sealing resin is injected into a cavity for molding a resin-sealed portion of the molded product from a gate port opened on an inner wall surface of the cavity. in injected resin sealing die apparatus for resin sealing, the air vent hole for discharging air of the gate opening and <br/> said cavity, before
In addition to being provided on the bottom surface of the inner wall of the cavity,
A plurality of vent holes are provided around the gate opening in a ring shape.
Characterized in that it has been. Further, the open end of e Abento holes, characterized in that protrudes from the cavity inner wall bottom surface inwardly of the cavity. Also, the upper mold and the lower
Clamp the molded product to be molded by resin with the mold,
Into the cavity for molding the resin sealing part of
Resin is injected by injecting the sealing resin from the gate opening opened on the inner wall surface.
In a resin molding die device for sealing, the gate opening
And an air vent hole for discharging the air in the cavity
Is provided on the bottom surface of the inner wall of the cavity, and
Serial air vent hole is characterized in that provided on the annular gate opening concentric about said gate opening, before Symbol gate opening, characterized in that is movable in a direction to protrude into the cavity . Further, it is preferable that an ejector pin for release of the sealing resin is inserted into the air vent hole, and that the air vent hole has a circular cross section and the ejector pin has a substantially semicircular cross section.

[0007]

[Action] resin sealing die apparatus according to the present invention is the air vent holes around the gate opening which is opened in the inner wall bottom surface of the cavity
Multiple circles are provided in a circle, or a circle concentric with the gate opening
By provided in an annular, air trapped in the cavity when filled with resin into the cavity from the gate is discharged from the air vent hole is sealed with resin to prevent the occurrence of voids. A ring or gate around the gate
By providing the air vent hole in an annular shape concentric with the gate opening, the air remaining around the gate opening can be effectively discharged. Also, by inserting an ejector pin into the air vent hole, air can be discharged from the air vent hole for resin sealing, and the ejector pin can facilitate release of the resin sealing portion from the mold. .

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a structure of a mold and a substrate 14 as a mold as a first embodiment of a resin sealing mold device according to the present invention.
It shows how the resin is clamped and sealed. The overall structure of the mold of this embodiment is the same as that of the mold of the conventional example shown in FIG.
The resin 20 is filled in the cavity 22 by means of 8, but the characteristic point is that the air vent hole 30 is provided in the bottom surface of the inner wall of the cavity 22. Air vent hole 3
0 is for discharging the air in the cavity 22 to the outside, and is provided in the vicinity of the gate port where air tends to remain when the resin is filled in the cavity 22. In the embodiment, a through-hole-shaped air vent hole 30 is provided so that air can be discharged.

FIG. 2 shows a plane arrangement of the air vent holes 30 provided on the bottom surface of the inner wall of the cavity 22. In the embodiment, eight air vent holes 30 are provided in an annular arrangement slightly apart from the gate port 16b. Of course, the number of air vent holes 30 arranged,
The distance from the gate port 16b and the like can be set as appropriate. Further, the air vent holes 30 may be arranged in a scattered manner instead of the annular arrangement. The arrangement of the air vent holes 30 in the ring shape in the embodiment corresponds to the formation of the voids 17 in the ring shape, and the air vent holes 30 may be arranged according to the position where the voids are generated depending on the product. The air vent hole 30 is for discharging the air trapped in the cavity 22 and the gas in the sealing resin, and is set to have a hole diameter necessary for degassing.

When the air vent hole 30 is provided on the bottom surface of the inner wall of the cavity 22 and the resin is filled in the cavity 22 as in this embodiment, the resin 20 injected into the cavity 22 is filled from the peripheral portion of the cavity 22. Be done,
Cavity 22 gradually fills up
When the air inside 2 is finally collected up to the vicinity of the gate port 16b, it is discharged by the resin pressure from the air vent hole 30 to the outside of the cavity 22 to prevent the generation of voids.

In the resin-sealing mold device of the above-described embodiment, the resin may be discharged at the same time when the air is discharged from the air vent hole 30, and a resin flash may occur on the surface of the resin-sealing portion 24. FIG. 3 shows the air vent hole 30 and the resin sealing portion 24.
Air vent hole 30 so that the resin burr does not project on the surface of
It is an embodiment (second embodiment) in which the open end 30a of the above is projected from the inner wall bottom surface of the cavity 22. By doing so, even if the resin 20 enters the air vent hole 30, the tip of the resin burr can be prevented from protruding beyond the outer surface of the resin sealing portion 24.

FIG. 4 shows a third embodiment of the resin sealing mold device. This embodiment is characterized in that an ejector pin 32 that also functions as an air vent is installed near the gate 16 provided in the upper mold 12. That is, the ejector pin 32
An air vent hole 30 is provided to surround the. The ejector pin 32 originally has a function of releasing the molded product, but in this embodiment, since the portion where the ejector pin 32 is installed also serves as an air vent function, the air vent hole 30 through which the ejector pin 32 is inserted is used. Is provided so that the air vent action is performed in the gap between the outer peripheral surface of the ejector pin 32 and the inner surface of the air vent hole 30.

The ejector pin 32 is located on the same surface as the inner wall surface of the cavity 22 during resin molding, and projects from the bottom surface of the inner wall of the cavity 22 after resin molding to release the molded product. In the embodiment, in order to prevent the generation of voids, the ejector pin 32 is arranged at a position where air is likely to remain during resin sealing, that is, a position near the gate port 16b. The number of ejector pins 32 to be arranged can also be set appropriately.

In order to make the air vent action more effective between the ejector pin 32 and the air vent hole 30, as shown in FIG. 5, the ejector pin formed in the air vent hole 30 having the circular cross section has a substantially semicircular cross section. You may make it insert 32. In this case, in order to adjust the air vent action, the ejector pin 32 may have a shape in which the outer peripheral surface of the cross-sectional shape is partially cut away.

FIG. 6 is an explanatory view showing a fourth embodiment of the resin sealing mold device. The figure shows a magnified view of the portion of the gate 16 which communicates with the cavity 22. In this embodiment, the gate 16
A ring-shaped air vent hole 34 is provided on the outside of the concentric with the gate port 16b. Gate opening 16b in FIG.
2 shows a plane arrangement of the air vent holes 34. Gate opening 16b
A ring-shaped air vent hole 34 is opened outside the. The air vent hole 34 is also formed in the cavity 22 as in the above embodiment.
Place it according to the position where air is likely to collect inside.

Also in the case of the resin-sealing die device of this embodiment, when the resin is filled from the gate 16 into the cavity 22 and the resin is sealed in the same manner as in the above-described respective embodiments, the gate port 16b is provided in the cavity 22. The air that has accumulated in the vicinity of can be discharged from the air vent hole 34, thereby preventing the generation of voids and performing resin sealing.

FIG. 8 shows a modification of the above embodiment (fifth embodiment).
Indicates. In this embodiment, the gate 16 for injecting the resin into the cavity 22 is formed by the nozzle portion 36 formed in a nozzle shape, and the nozzle is inserted into the insertion hole 38 capable of forming a gap for air vent with the outer periphery of the nozzle portion 36. It is characterized in that the nozzle portion 36 is attached through the portion 36 so as to be movable back and forth in the axial direction. The opening end 39 of the insertion hole 38 is formed so that the opening end side is gradually reduced in diameter so as to close the opening end 39 when the tip of the nozzle portion 36 projects into the cavity 22. Nozzle part 36 goes into cavity 22
The resin 20 is injected into the cavity 22 by the plunger 18 communicating with the pot 13 for supplying 0.

When injecting the resin 20 into the cavity 22 from the nozzle portion 36, as shown in FIG. 8, the tip of the nozzle portion 36 is projected into the cavity 22 and the outer peripheral surface of the nozzle portion 36 is inserted into the insertion hole 38. The opening end 39 is brought into contact with the peripheral surface.
Closed with almost no resin 2 inside the cavity 22.
When the filling of 0 is completed, the tip of the nozzle part 36 is flush with the inner wall of the cavity 22 until the nozzle part 36
Is retracted, the insertion hole 38 is opened, and resin molding is performed by the air vent action as in FIG.

In the case of this mold structure, the cavity 2
Since the air vent hole is opened in a state where the resin 20 is almost completely filled in 2, the resin can be prevented from entering the air vent hole while the resin 20 is being filled, and the inside of the cavity 22 can be prevented. The air remaining in the
Can be discharged from. In order to open and close the air vent hole by advancing and retracting the nozzle part 36 as in the present embodiment, the opening end 39 of the insertion hole 38 is squeezed, and as shown in FIG. It is advisable to form the tip of the taper into a tapered shape.

In each of the embodiments described above, the gate 16 is arranged only in the upper mold 12, but the gate 16 is provided in the lower mold 10 and the resin is introduced into the cavity 22 from the pot provided in the lower mold 10. The same can be applied to the case of injecting. The product of the above embodiment is a single-sided resin-sealed product in which the mounting surface of the semiconductor chip 15 of the substrate 14 is resin-sealed. However, as in the case where the lead frame 40 shown in FIG. The same can be applied to a product whose both surfaces are sealed with resin.

In the case of double-sided resin sealing, it is possible to install the pot 13 in one of the lower mold 10 and the upper mold 12 for resin sealing, or to pot both the lower mold 10 and the upper mold 12. It is also possible to install 13 and fill the cavity 22 with resin from the upper and lower molds. Also in this case, the method of arranging the air vent holes 30 can be the same as in the above embodiment,
Similarly, void-free resin sealing is possible.

Although the gate 16 is arranged at the center of the cavity 22 in each of the above embodiments, the position of the gate 16 is not limited to the center. Even when the gate is provided at a position deviated from the center position of the cavity 22 and the resin is filled, the air vent hole 30 may be provided in accordance with the void generation site at the time of resin sealing. Further, the gate 16 does not necessarily have to be vertically arranged with respect to the molded product. The same is applicable to the case where the resin is injected obliquely to the bottom surface of the inner wall of the cavity 22.
Further, the product targeted by the device of the present embodiment is not limited to the semiconductor resin-sealed product, but can be similarly applied to general resin-sealed products such as resin-sealed electronic parts.

[0023]

As described above, according to the resin sealing mold device of the present invention, the air remaining in the cavity during resin sealing can be discharged from the air vent hole to perform resin molding. it can be molded to the outer surface of the resin sealing portion without generating a void in case the gate opening which is opened in the inner wall bottom surface of the cavity of the resin sealing method according to method of filling the resin into the cavity through. Moreover, further the opening end of the air <br/> vent hole, cavitation from the cavity inner wall bottom surface
By which protrudes inwardly of I, it is possible to prevent the resin burr is generated on the surface of the resin sealing portion. In addition, the gate opening can be moved in the direction that projects into the cavity.
The resin can be prevented from flowing into the air vent hole during the resin sealing and the resin burrs can be prevented from being generated on the surface of the resin sealing portion. As a result, it is possible to prevent the generation of defective products and obtain a highly reliable resin-sealed product.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a mold structure and a resin sealing state of a first embodiment of a resin sealing mold device.

FIG. 2 is a bottom view of a cavity portion showing a planar arrangement of air vent holes.

FIG. 3 is a cross-sectional view showing a mold structure and a resin sealing state of a second embodiment of a resin sealing mold device.

FIG. 4 is a cross-sectional view showing a mold structure and a resin sealing state of a third embodiment of a resin sealing mold device.

FIG. 5 is an explanatory view showing an end face shape of an ejector pin.

FIG. 6 is an explanatory view showing a mold structure of a fourth embodiment of the resin sealing mold device.

FIG. 7 is an explanatory view showing an end face arrangement of a gate end and an air vent hole.

FIG. 8 is an explanatory view showing a mold structure of a fifth embodiment of a resin sealing mold device.

FIG. 9 is an explanatory view showing another embodiment of the resin sealing mold device.

FIG. 10 is an explanatory view showing a mold structure and a resin sealing state of a conventional example of a resin sealing mold device.

FIG. 11 is a partially cutaway perspective view showing a semiconductor device manufactured by a conventional resin molding die device.

FIG. 12 is an explanatory diagram showing a conventional mold structure of a semiconductor device and a state of resin sealing.

[Explanation of symbols]

10 Lower mold 12 Upper mold 13 pots 14 board 15 semiconductor chips 16 gates 16a Break mark 16b gate opening 17 void 18 Plunger 20 resin 22 cavities 24 Resin sealing part 30 Air vent hole 32 ejector pin 34 Air vent hole 36 nozzle 38 insertion hole

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B29C 33/00-33/76 B29C 39/26-39/34 B29C 45/26-45/38

Claims (6)

(57) [Claims] 1. An upper mold and a lower mold clamp a molded product to be resin-molded, and a resin molding part of the molded product is sealed into a cavity for molding from a gate opening formed on an inner wall surface of the cavity. In a resin-sealing mold device for injecting a sealing resin to perform resin sealing, an air vent hole for discharging air in the gate opening and the cavity is provided in a bottom surface of an inner wall of the cavity.
And the air vent holes around the gate opening.
A mold device for resin encapsulation , comprising a plurality of annular molds. 2. The cavitation means that the opening end of the air vent hole is
The resin molding die device according to claim 1, wherein the resin molding die device is provided so as to protrude from the bottom surface of the inner wall toward the inside of the cavity . 3. A molded object which is resin-molded by an upper mold and a lower mold.
Clamps the product and molds the resin-sealed part of the product.
A gate port that opens into the inner wall of the cavity
Mold device for resin sealing that injects sealing resin from the
At the gate port and the air for discharging the air in the cavity.
And an avent hole is provided on the bottom surface of the inner wall of the cavity.
At the same time, the air vent hole surrounds the gate opening.
Tree <br/> Aburafutome mold system you characterized in that provided in the over preparative opening concentric annular. 4. A method in which the gate opening projects into the cavity.
The mold device for resin encapsulation according to claim 3, wherein the mold device is provided so as to be movable in any direction . 5. A mold releasing agent for the sealing resin is provided in the air vent hole .
Claim, characterized in that the ejector pin is inserted 1
Or the mold device for resin sealing according to 2 . 6. The air vent hole has a circular cross section,
The mold device for resin encapsulation according to claim 5, wherein the ejector pin has a substantially semicircular cross section .