JP3446874B2 - Substrate clamping device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate clamping device for holding an introduced substrate at a predetermined position of a substrate introduction table in an electronic component mounting apparatus or the like.

[0002]

2. Description of the Related Art Conventionally, as a clamp device for a substrate of this type, one disclosed in Japanese Patent Laid-Open No. 6-318798 is known. This clamp device includes a pair of substrate introduction bases in which guides are arranged so as to face each other inwardly, five pairs of clampers arranged in a row in the pair of substrate introduction bases so as to face each other, and introduced into the substrate introduction base. And a sensor that detects the position (range) of the substrate in the introduction direction. On the other hand, the substrate is
It is introduced into the substrate introduction table along the guide portion, and the tip in the introduction direction is positioned at a predetermined position where it substantially coincides with the front end of the clamper located at the foremost end. When the substrate is introduced,
The position of the substrate is detected by the sensor, and a plurality of sets of clampers corresponding to the position of the substrate are moved upward to press the substrate against the guide portion for clamping. That is, the clamper that overlaps (overlaps) the substrate in the introduction direction is selectively operated to clamp the substrate.

[0003]

In such a conventional board clamping device, depending on the length of the board, the last clamper of the plurality of clamper clamped sets slightly overlaps the board. This may be clamped. In such a case, the clamping force of the rearmost clamper may act intensively on the overlapping portion of the substrate, resulting in chipping at the edge of the substrate. Particularly in a high-speed mounter, since the substrate is set on the XY table, there is no choice but to strongly clamp it, and when clamping a thin substrate, there is a problem that the substrate is easily chipped by the clamper.

An object of the present invention is to provide a substrate clamping device which can effectively prevent chipping of the substrate when clamping the substrate using a plurality of clampers.

[0005]

SUMMARY OF THE INVENTION A substrate clamping device according to the present invention comprises a plurality of substrates arranged in a row along a guide portion with respect to a substrate introduced at a predetermined position of a substrate introduction table while guiding a side portion by the guide portion. Of the plurality of clampers, the controller slightly controls the operation of the plurality of clampers, and the controller slightly overlaps the board in the introduction direction. It is characterized by canceling the operation of the clamper.

According to this structure, when the substrate is introduced to the predetermined position of the substrate introduction table, the plurality of clampers are operated,
Clamp so that the board is pressed against the guide part. At that time, the controller cancels the operation of the clamper that is slightly overlapped with the substrate in the introduction direction among the plurality of clampers. Therefore, among the clampers that clamp the substrate, there is no clamper that clamps only the end portion of the substrate, and as a result, chipping of the substrate due to the clamping force can be effectively prevented.

In this case, it is preferable that the controller further comprises storage means for storing the dimension data of the board, and the controller cancels the operation of the clamper based on the tip position in the introduction direction of the board and the dimension data.

According to this structure, the controller cancels the operation of the clamper based on the tip position in the substrate introducing direction and the dimension data. Therefore, if the tip position of the substrate to be introduced is determined in advance, the above cancellation can be performed using existing data such as NC data without the need for a sensor or the like for detecting the position of the substrate. .

In these cases, the controller has a clamper that slightly overlaps in the width direction with a substrate having a narrow portion in the width direction orthogonal to the introduction direction.
It is preferable to notify that effect.

According to this structure, even when the clamper slightly overlaps the board having the narrow portion in the width direction in the width direction, it is possible to prompt the operator to take action by notifying that fact. . In most cases, the narrow portion of the substrate and the clamper are positioned parallel to each other, so in most cases, even if they slightly overlap in the width direction, they sufficiently overlap in the introduction direction. . Therefore, the situation where the clamper force is concentrated on the end portion of the substrate becomes extremely rare, and in such a case, it is preferable for the operator to rely on the operator's judgment rather than automatically canceling the operation of the clamper.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a case where a board clamping device according to an embodiment of the present invention is applied to a board supply portion of an electronic component mounting apparatus (mounter) will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a board supply unit of a so-called high-speed mounter. The board supply unit 1 carries an XY table 2 that moves the board S in XY directions and a board S that is carried into the XY table 2 when mounting electronic components. And a substrate unloading mechanism 4 for unloading the substrate S from the XY table 2. A clamp device 5 is mounted on the XY table 2. The clamp device 5 constitutes a transport path for the substrate S together with the substrate loading mechanism 3 and the substrate unloading mechanism 4, and the introduced substrate S is used for mounting electronic components. Clamp for that purpose.

The substrate carry-in mechanism 3 has a fixed carry-in rail 3a and a movable carry-in rail 3b which are arranged in parallel with each other. The board S has both carry-in rails 3 on both sides in the width direction.
It is conveyed while being supported by a and 3b. The movable carry-in rail 3a is configured to be movable in parallel with the fixed carry-in rail 3b, and appropriately moves in the left-right direction according to the width of the substrate S to be carried. Similarly, the substrate unloading mechanism 4 has a fixed unloading rail 4a and a movable unloading rail 4b arranged in parallel with each other, and the substrate S has both widthwise side portions on both unloading rails 4a and 4b. It is transported while being supported. The movable unloading rail 4a is configured to be movable in parallel with the fixed unloading rail 4b, and appropriately moves in the left-right direction according to the width of the substrate S to be transported.

The substrate S transferred from the device (not shown) to the substrate loading mechanism 3 is transported to the position of the clamp device 5 by the substrate loading mechanism 3. Although not shown, a transfer device is arranged near the clamp device 5, and the transfer device receives the substrate S from the substrate loading mechanism 3 and conveys the substrate S to a predetermined clamp position of the clamp device 5. In parallel with this, the substrate S on which the electronic components have been mounted is transported from the clamp position to the substrate unloading mechanism 4 and further transported to the substrate unloading mechanism 4. Then, the substrate unloading mechanism 4 conveys the substrate S to a device (not shown) and delivers it. When a series of substrate S transport operations are completed and the predetermined substrate S is clamped by the clamp device 5, the XY table 2 as a whole is slightly lowered from the positions of the substrate loading mechanism 3 and the substrate unloading mechanism 4, The operation shifts to the electronic component mounting operation.

The XY table 2 is a base table 11
And an X table 12 placed on the base table 11.
And a Y table 13 placed on the X table 12, and the clamp device 5 is provided on the upper surface of the Y table 13.
Is installed. X on the upper surface of the base table 11.
A pair of X-direction rails 14 and 14 for guiding the movement of the table 12 in the X-direction and an X-direction ball screw 15 for moving the X-table 12 in the X-direction are provided, and an end portion of the X-direction ball screw 15 is provided. Is equipped with an X-direction motor 16. X direction ball screw 1 by X direction motor 16
When 5 rotates forward and backward, X table 12 becomes Y table 1
3 is placed and guided in the X-direction rail 14 to move back and forth in the X-direction.

Similarly, on the upper surface of the X table 12, a pair of Y direction rails 17, 17 for guiding the movement of the Y table 13 in the Y direction and a Y direction ball screw 18 for moving the Y table 13 in the Y direction. And a Y direction motor 19 is attached to the end of the Y direction ball screw 18. Y direction ball screw 18 by Y direction motor 19
Is rotated in the normal and reverse directions, the Y table 13 is clamped by the clamp device 5.
While being mounted, the vehicle is guided by the Y-direction rail 17 and moves back and forth in the Y-direction. Of course, in the mounting operation of electronic parts, this X
The forward / backward movement in the direction and the forward / backward movement in the Y direction are performed simultaneously.

The clamp device 5 is the substrate loading mechanism 3 described above.
And the fixed-side substrate introduction table 2 corresponding to the substrate unloading mechanism 4.
1a and a movable-side substrate introduction table 21b, and each of the four substrate introduction tables 21a and 21b is attached so that four clampers 22 forming a pair (group) with each other are continuous. ing. The movable substrate introduction table 21a, together with the four clampers 22 attached to it, on the Y table 13,
The movable-side substrate introduction table 21b is configured to be movable in parallel, and appropriately moves in the left-right direction according to the width of the substrate S to be transported. Fixed substrate introduction table 21a and movable substrate introduction table 2
Each of the guides 1b has an introduction table body 23 and a guide portion 24 extending horizontally from the upper end of the introduction table body 23, and the guide portions 24 are arranged so as to face each other.

As shown in FIG. 2, the above-mentioned four clampers 22 are arranged in a row along the lower side of each guide portion 24, and the substrate S is provided with each of the guide portions 24 and four. And is introduced into the clamp device 5. Then, the introduced substrate S is conveyed to a clamp position, and is clamped by being pressed by the guide portion 24 by the ascending clamper 22 at this clamp position. In this case, the clamp position is a position where the front end of the substrate S in the introduction direction matches the front end of the clamper 22 located at the forefront in the introduction direction (see FIG. 4), and depending on the length of the substrate S in the introduction direction, The number of clampers 22 that actually clamp the substrate S varies. That is, the substrate S is introduced into the clamp position such that the substrate S is always positioned at its tip.

As shown in FIGS. 2 and 3, each clamper 22 has a clamp member 3 that directly presses the substrate S from below.
1, a pair of front and rear air cylinders 32, 32 for clamping the clamp member 31, an air pipe 33 connected to the pair of air cylinders 32, 32, and an electromagnetic air valve 34 interposed in the air pipe 33. Has been done.
The upstream side of each air pipe 33 is connected to the air pipe 33 of another clamper 22, and finally connected to a compressed air supply device (not shown). Further, the electromagnetic air valves 34 of each clamper 22 are connected to the controller 35, and the total of eight electromagnetic air valves 34 are individually opened / closed by the controller 35. Further, the controller 35 is
It is connected to an NC controller 36 that stores C data.

The electromagnetic air valve 34 is composed of, for example, a three-way valve, and by opening the valve based on a command from the controller 35, the pair of air cylinders 32, 32 are simultaneously actuated, and the clamp member 31 is moved to the substrate. Move upward toward S. On the other hand, from this state, the valve closing operation is performed based on a command from the controller 35 to open the air pipe 33 on the air cylinder 32 side to the atmosphere, and the clamp member 31 is moved downward through the pair of air cylinders 32. Let

When the substrate S is clamped by the clamp device 5 thus constructed, the controller 35 causes the upper surface of the clamp member 31 to be introduced into the substrate S.
The clamper 22 that overlaps with the substrate S, that is, the clamper 22 that overlaps the substrate S is operated to perform the clamp operation. For example, as shown in FIG. 4, when the board S introduced into the clamp position overlaps the first, second and third clampers 22, 22, 22 from the front side in the introduction direction, the controller 35 causes the board S to move. 6 sets of clampers 22 from 1st to 3rd on both sides of
To operate the clamp.

In this case, the third clamper 22 only slightly overlaps with the rear end of the substrate S, and when the third clamper 22 is clamped, the substrate S is thin and easily damaged. In this case, damage such as chipping may occur at the rear end of the substrate S. Therefore, in the clamp device 5 of the embodiment, the clamp operation of the clamper 22 that slightly overlaps the substrate S introduced at the clamp position is canceled or an alarm is displayed (notified). Of course, other notification methods (means) such as issuing a warning sound with a beeper or the like can be used.

A more specific explanation will be given here. First,
The dimensional data that specifies the shapes of various boards S is stored in the NC control device 36 in advance as data necessary for mounting electronic components. In addition to the general rectangular one, this substrate S has a different shape with a corner cut out.
Here, it is assumed that the substrate has a shape in which possible irregularly shaped elements are taken into the maximum, that is, a substrate S in which four corners are cut out into square shapes with appropriate dimensions as shown in FIG.

On the other hand, in the controller 35, in addition to the positions of the clampers 22, as shown in FIGS. 6 (a) and 6 (b), the state of "slightly overlapping" in the introduction direction (length direction), Dimension C and dimension D (both dimensions differ depending on the board S, so can be set by the operator)
Is set and stored as. In this case, the size C and the size D are properly used depending on whether the slightly overlapping portion of the substrate S is the front side (size C) or the rear side (size D) in the transport direction.

Furthermore, as shown in FIG. 7, the state of "slightly overlapping" in the width direction is set on both sides by the dimension B1 + B2 (only one side is shown). Enabled) and stored. The dimension B2 takes into consideration a minute deviation of the substrate S when introduced and an error in manufacturing the substrate S.

Hereinafter, the controller 3 for this substrate S
Among the control processes of 5, the process which is a feature of the present invention, that is, the Z clamp actuating clamper selection process will be described with reference to FIGS.

When the substrate S is conveyed to the above-mentioned predetermined clamp position in FIG. 4, this process is started, and as shown in FIG. 8, first, based on the dimensional data of the substrate stored in the NC controller. From the total length L of the substrate S, an operation clamp when the substrate S is not irregular (square) is selected (S1).

Next, it is determined whether or not there is a clamp 22 that "slightly overlaps" the substrate S (S2,
S4, S6, S8, S10, S12, S14, S1
6) If not present (S2, S4, S6, S8, S1
If 0, S12, S14, S16: No, this process is finished as it is (S18), and the operation clamp in the case of a square is selectively operated to clamp the substrate S.

On the other hand, for example, when the dimension X2 in the length direction (introduction direction) of FIG. 5 is slightly larger than the dimension E2 of FIG. 6A (E2 ≦ X2 ≦ E2 + C), as described above with reference to FIG. Damage may be caused by the third clamper 22. That is, the clamper 2 with the third end of the dimension X2
Since it is within the range of the dimension C of 2, in such a case, the controller 35 of the clamp device 5 has the third clamp 2
Cancel the selection of 2.

Of the cases where there is a “slightly overlapping” clamp 22 in the longitudinal direction, for example, the above-mentioned “case where the end of the dimension X2 is within the range of the dimension C of any one of the clamps 22”, "When the dimension X2 is in the C area". In addition to this, "when the dimension X1 is in the D area", "dimension X3"
Is in the D area ", and" when the dimension X4 is in the C area "are added.

For example, when the dimension X1 in FIG. 5 is slightly larger than the dimension F2 in FIG. 6B and slightly smaller than the dimension E2 in FIG. 6A (F2 + D≤X1≤E2), the second clamper is used. 22 may cause damage, which corresponds to the above-mentioned “when the dimension X1 is in the D area”, and in this case, the selection of the second clamper 22 is canceled. The "when the dimension X3 is in the D area" and the "when the dimension X4 is in the C area" are the same as the above-described cases of the dimension X1 and the dimension X2, respectively.

Then, in these cases, that is, when the dimension X1 is within the D area as shown in FIG. 8 (S2:
Yes), when the dimension X2 is within the C area (S4: Y
es), when the dimension X3 is within the D area (S6: Ye
s), when the dimension X4 is within the C area (S8: Ye
In s), the controller 35 sets the corresponding cancel data in order to cancel the selection of the corresponding gramper 22 that may cause damage to the edge of the substrate S (S3, S5, S7, S9). .

Further, for example, when the inner (upper side in the figure) end of the dimension Y3 in the width direction of FIG. 5 is within the range of the dimension B1 or the dimension B2 of FIG. 7 (this case will be referred to as "dimension" hereinafter). When Y3 is in the B1orB2 area. ”The same applies to the dimensions Y1, Y2, and Y4. An alarm indicating that (“ Dimension Y3 is in the B1orB2 area ”) is displayed (notified).

In most cases, the narrow portion of the substrate S and the clamper 22 are positioned parallel to each other, so that even if they slightly overlap in the width direction, they sufficiently overlap in the longitudinal direction (introduction direction). Mostly they are wrapped. For example, also in the above case, the dimension X3 in FIG.
Is sufficiently smaller than the dimension E1 of FIG. 6 (a), there is sufficient overlap in the longitudinal direction, and in most of such cases.

For this reason, the situation in which the clamper force is concentrated on the end portion of the substrate S becomes extremely rare. Therefore, in the case of the width direction, the operation of the clamper 22 is automatically canceled, and it is left to the judgment of the operator. Is preferable in terms of work.

Therefore, in such a case, the controller 35 of the clamp device 5 temporarily suspends the processing in a state in which an alarm is displayed to determine whether to continue or stop or cancel the operation of the corresponding clamper 22. The operator is prompted to input an instruction, which gives the operator an opportunity to confirm and make a decision, and after the instruction is input, a process according to the instruction is performed (however, in FIG. Alarm display ").

In the above case, that is, as shown in FIG. 8, when the dimension Y1 is in the B1orB2 area (S10: Yes), when the dimension Y2 is in the B1orB2 area (S12: Yes), Dimension Y3 is B1
When it is in the orB2 area (S14: Yes), when the dimension Y4 is in the B1 or B2 area (S16: Ye)
s), the controller 35 displays (notifies) an alarm of "to that effect" for notifying them (S11, S).
13, S15, S17).

As described above, the controller 35 determines whether or not there is the clamp 22 that "slightly overlaps" the substrate S in the Z clamp operation clamper selection process (S2, S4, S6, S8, S10, S1
2, S14, S16), if not present (S2, S4,
S6, S8, S10, S12, S14, S16: All N
In (o), this process is terminated as it is (S18), and if it exists, the cancellation data of the corresponding "slightly overlapping" grandpa 22 is set (S3, S5, S7, S9), or Displayed an alarm to that effect (S11, S13, S15, S17)
Then, this process is terminated (S18), and only the selected operation clamp is operated to clamp the substrate S.

That is, in the clamping device 5 for the substrate S of this embodiment, among the clampers 22 that perform the clamping operation, the substrate S introduced at the clamp position and the clamper 22 that slightly overlaps in the introduction direction are present. In this case, the clamp operation of the corresponding clamper 22 is canceled. Therefore, it is possible to prevent the specific clamper 22 from clamping only the end portion of the substrate S, and effectively prevent the end portion of the substrate S from being damaged such as chipped. . Therefore, it is possible to avoid the deterioration of the product yield due to the damage of the substrate S.

Further, the substrate S introduced at the clamp position,
Clamper 2 slightly overlapping in the width direction
When 2 is present, an alarm is displayed (notified) to that effect, so that the operator can be prompted to take action. In this case, the operator can take appropriate measures such as whether or not to cancel the operation of the corresponding clamper 22 by considering the overlap of the introduction directions.

The clamp device of the embodiment has four clampers, but the number of clampers is not limited to this. Further, it is sufficient to cancel the operation of only the clamper that slightly overlaps with the substrate, and whether or not the clampers not related to the clamps are simultaneously operated is free.

[0041]

As described above, according to the board clamping device of the present invention, the operation of the clamper slightly overlapping the board is canceled, so that the board is clamped by using a plurality of clampers. In addition, it is possible to effectively prevent damage such as chipping of the edge of the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view of a board supply unit of an electronic component mounting apparatus to which a clamp device according to an embodiment of the present invention is applied.

FIG. 2 is a front view of the clamp device according to the embodiment.

FIG. 3 is an explanatory diagram showing a configuration of a clamp device according to an embodiment.

FIG. 4 is a side view of the clamp device in a state where the substrate is introduced into the clamp position.

FIG. 5 is a plan view showing the shape and dimensions of a modified substrate.

FIG. 6 is an explanatory diagram for determining an overlap state in the introduction direction.

FIG. 7 is an explanatory diagram for determining an overlap state in the width direction.

FIG. 8 is a flowchart showing a Z clamp operation clamper selection process of the clamp device of the embodiment.

[Explanation of symbols]

1 Substrate supply unit 2 XY table 5 Clamp device 22 Clamper 24 Guide 31 Clamp member 32 air cylinders 33 Air piping 34 Electromagnetic air valve 35 controller 36 NC controller S substrate

Claims (3)

(57) [Claims] 1. A plurality of clampers arranged in a row along the guide portion are operated to guide a side portion of the substrate introduced into a predetermined position of the substrate introduction table while guiding the side portion to the guide portion of the substrate introduction table. A substrate clamping device that clamps a part to be pressed against a portion includes a controller that controls the operation of the plurality of clampers, and the controller includes a controller that slightly overlaps the substrate in the introduction direction among the plurality of clampers. A substrate clamping device characterized by canceling operation. 2. A storage means for storing the dimension data of the board is further provided, wherein the controller cancels the operation of the clamper based on the tip position in the introduction direction of the board and the dimension data. The substrate clamping device according to claim 1. 3. The controller, if there is a clamper slightly overlapping in the width direction with a substrate having a narrow portion in the width direction orthogonal to the introduction direction, notifies the effect to that effect. 3. The substrate clamping device according to 1 or 2.