JP3417110B2 - How to connect electronic components - Google Patents

How to connect electronic components

Info

Publication number
JP3417110B2
JP3417110B2 JP33955794A JP33955794A JP3417110B2 JP 3417110 B2 JP3417110 B2 JP 3417110B2 JP 33955794 A JP33955794 A JP 33955794A JP 33955794 A JP33955794 A JP 33955794A JP 3417110 B2 JP3417110 B2 JP 3417110B2
Authority
JP
Japan
Prior art keywords
temperature
electronic components
solder particles
solder
thermosetting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33955794A
Other languages
Japanese (ja)
Other versions
JPH08186156A (en
Inventor
政光 岸上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP33955794A priority Critical patent/JP3417110B2/en
Priority to CN95119443A priority patent/CN1132931A/en
Publication of JPH08186156A publication Critical patent/JPH08186156A/en
Application granted granted Critical
Publication of JP3417110B2 publication Critical patent/JP3417110B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は電子部品の接続方法に
関し、特に、半導体チップ等の一の電子部品と基板等の
他の電子部品とを異方導電性接着剤を介して接続する電
子部品の接続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electronic parts, and more particularly to an electronic part for connecting one electronic part such as a semiconductor chip to another electronic part such as a substrate through an anisotropic conductive adhesive. Connection method.

【０００２】[0002]

【従来の技術】例えば液晶表示装置には、液晶表示パネ
ル上にこの液晶表示パネルを駆動するためのＬＳＩチッ
プ等からなる半導体チップを異方導電性接着剤を介して
搭載したり、液晶表示パネルにこの液晶表示パネルと回
路基板とを接続するためのフレキシブル配線基板の一端
部を同じく異方導電性接着剤を介して接続したりしたも
のがある。異方導電性接着剤としては、熱硬化性接着剤
中に、樹脂粒子の表面にＮｉメッキ等からなる金属被膜
を被覆してなる導電性粒子を混入したものがある。2. Description of the Related Art For example, in a liquid crystal display device, a semiconductor chip such as an LSI chip for driving the liquid crystal display panel is mounted on the liquid crystal display panel via an anisotropic conductive adhesive, or the liquid crystal display panel is mounted. There is also one in which one end of a flexible wiring board for connecting the liquid crystal display panel and the circuit board is also connected via an anisotropic conductive adhesive. As the anisotropic conductive adhesive, there is a thermosetting adhesive in which conductive particles obtained by coating the surface of resin particles with a metal coating such as Ni plating are mixed.

【０００３】このような液晶表示装置の場合には、液晶
表示パネル上に例えば半導体チップを異方導電性接着剤
を介して載置し、熱圧着することにより、液晶表示パネ
ルと半導体チップの相対応する接続端子同士を異方導電
性接着剤の導電性粒子を介して導電接続するとともに、
液晶表示パネルと半導体チップを異方導電性接着剤の熱
硬化性接着剤を介して接着している。この場合、導電性
粒子は、ある程度つぶれることにより、接続端子に対し
て面接触することになる。In the case of such a liquid crystal display device, for example, a semiconductor chip is placed on the liquid crystal display panel via an anisotropic conductive adhesive and thermocompression bonded to the liquid crystal display panel and the semiconductor chip. While correspondingly connecting the corresponding connection terminals through the conductive particles of the anisotropic conductive adhesive,
The liquid crystal display panel and the semiconductor chip are bonded together via a thermosetting adhesive which is an anisotropic conductive adhesive. In this case, the conductive particles come into surface contact with the connection terminal by being crushed to some extent.

【０００４】しかるに、熱圧着条件によっては、導電性
粒子がつぶれずに接続端子に対して点接触することがあ
る。このような場合でも、一応接触しているので、電気
的検査を行っても、良品と判定されることになる。しか
しながら、点接触による導電接続であると、衝撃等に弱
く、導電接続不良が発生しやすい。また、液晶表示装置
は室温以上の温度で例えば３５〜４５℃の範囲で使用さ
れることもある。このような場合には、熱硬化性接着剤
が比較的大きく熱膨張することにより、液晶表示パネル
と半導体チップの相対応する接続端子間の間隔が広がる
ことになる。すると、導電性粒子がある程度つぶれて接
続端子に対して面接触している場合には、熱硬化性接着
剤の熱膨張に追従して導電性粒子が原形に復帰しようと
することにより、導電性粒子の接続端子に対する接触が
保持されることになる。これに対して、導電性粒子がつ
ぶれずに接続端子に対して点接触している場合には、導
電性粒子が熱硬化性接着剤の熱膨張に追従することがで
きず、導電接続不良が発生することになる。However, depending on the thermocompression bonding conditions, the conductive particles may not be crushed and may come into point contact with the connection terminal. Even in such a case, since they are in contact with each other, they are judged to be non-defective even if an electrical inspection is performed. However, the conductive connection by point contact is vulnerable to shock and the like, and a defective conductive connection is likely to occur. Further, the liquid crystal display device may be used at a temperature of room temperature or higher, for example, in the range of 35 to 45 ° C. In such a case, the thermosetting adhesive undergoes a relatively large thermal expansion, so that the gap between the corresponding connection terminals of the liquid crystal display panel and the semiconductor chip is widened. Then, when the conductive particles are crushed to some extent and are in surface contact with the connection terminal, the conductive particles try to return to the original shape by following the thermal expansion of the thermosetting adhesive, thereby reducing the conductivity. The contact of the particles with the connection terminals will be retained. On the other hand, when the conductive particles are not crushed and are in point contact with the connection terminal, the conductive particles cannot follow the thermal expansion of the thermosetting adhesive, resulting in poor conductive connection. Will occur.

【０００５】[0005]

【発明が解決しようとする課題】このように、従来の異
方導電性接着剤を用いた接続方法では、導電性粒子の接
続端子に対する導電接続状態が単なる接触であるので、
導電性粒子がつぶれずに接続端子に対して点接触してい
ることにより、液晶表示装置が不良品に近い場合でも、
電気的検査で良品と判定してしまい、導電接続の信頼性
が低いという問題があった。この発明の目的は、両電子
部品の相対向する接続端子同士を強固に導電接続するこ
とができる電子部品の接続方法を提供することにある。As described above, in the conventional connecting method using the anisotropic conductive adhesive, since the conductive connection state of the conductive particles to the connection terminal is mere contact,
Even if the liquid crystal display device is close to a defective product, the conductive particles are not crushed and are in point contact with the connection terminal.
There was a problem that the reliability of the conductive connection was low because it was judged as a non-defective product by the electrical inspection. An object of the present invention is to provide a method of connecting electronic components that can firmly and conductively connect opposing connection terminals of both electronic components.

【０００６】[0006]

【課題を解決するための手段】この発明は、一の電子部
品の一の面に設けられた複数の接続端子と他の電子部品
の一の面に設けられた複数の接続端子との間に、熱硬化
性接着剤中に半田粒子を混入してなる異方導電性接着剤
を介在させ、前記半田粒子が溶融しない温度で仮加熱す
ることにより、前記熱硬化性接着剤をある程度硬化さ
せ、次いで前記半田粒子が溶融する温度で本加熱するこ
とにより、前記熱硬化性接着剤を完全に硬化させるとと
もに、前記半田粒子を溶融させ、この溶融した半田が固
化することにより、この固化した半田を介して前記両電
子部品の相対向する接続端子同士を導電接続するように
したものである。According to the present invention, there are provided a plurality of connection terminals provided on one surface of one electronic component and a plurality of connection terminals provided on one surface of another electronic component. , Interposing an anisotropic conductive adhesive made by mixing solder particles in a thermosetting adhesive, and temporarily heating the thermosetting adhesive at a temperature at which the solder particles do not melt, thereby curing the thermosetting adhesive to some extent, Then, the thermosetting adhesive is completely cured by heating the solder particles at a temperature at which the solder particles are melted, and the solder particles are melted. By solidifying the melted solder, the solidified solder is The connection terminals of the electronic components facing each other are electrically connected to each other via the interposition.

【０００７】[0007]

【作用】この発明によれば、異方導電性接着剤として熱
硬化性接着剤中に半田粒子を混入してなるものを用い、
溶融した後固化した半田を介して両電子部品の相対向す
る接続端子同士を導電接続することになるので、両電子
部品の相対向する接続端子同士を強固に導電接続するこ
とができる。この場合、半田粒子が溶融しない温度での
仮加熱により熱硬化性接着剤をある程度硬化させるの
は、本加熱のとき半田粒子が溶融して流動する範囲を規
制し、隣接する接続端子間でのショートを防止するため
である。According to the present invention, as the anisotropic conductive adhesive, a thermosetting adhesive in which solder particles are mixed is used.
Since the opposing connecting terminals of both electronic components are conductively connected to each other via the solder that has been melted and then solidified, the opposing connecting terminals of both electronic components can be firmly conductively connected. In this case, the thermosetting adhesive is cured to some extent by temporary heating at a temperature at which the solder particles are not melted. This is to prevent a short circuit.

【０００８】[0008]

【実施例】図１（Ａ）〜（Ｃ）はそれぞれこの発明の一
実施例を適用した液晶表示装置の各接続工程を示したも
のである。そこで、これらの図を順に参照しながら、こ
の実施例の接続方法について説明する。まず、図１
（Ａ）に示す液晶表示パネル１は、ガラスや樹脂等から
なる下側の透明基板２と図示しない上側の透明基板とを
備え、下側の透明基板２の一端部が上側の透明基板の一
端面から突出され、この突出部分の上面にＩＴＯ(Indiu
m Tin Oxide)からなる接続端子３が複数設けられ、これ
ら接続端子３の表面に図示していないがＡｕからなるメ
ッキ層が設けられた構造となっている。半導体チップ４
は、チップ本体５の下面にＡｕバンプからなる接続端子
６が複数設けられた構造となっている。異方導電性接着
剤７は、全体の形状がシート状であって、エポキシ系樹
脂等からなる熱硬化性接着剤８中に半田粒子９を混入し
たものからなっている。1 (A) to 1 (C) show respective connecting steps of a liquid crystal display device to which an embodiment of the present invention is applied. Therefore, the connection method of this embodiment will be described with reference to these figures in order. First, Fig. 1
The liquid crystal display panel 1 shown in (A) includes a lower transparent substrate 2 made of glass or resin and an upper transparent substrate (not shown), and one end of the lower transparent substrate 2 is one of the upper transparent substrates. It is projected from the end face, and ITO (Indiu
(M Tin Oxide), a plurality of connection terminals 3 are provided, and a plating layer made of Au (not shown) is provided on the surface of these connection terminals 3. Semiconductor chip 4
Has a structure in which a plurality of connection terminals 6 made of Au bumps are provided on the lower surface of the chip body 5. The anisotropic conductive adhesive 7 has a sheet-like shape as a whole, and is composed of a thermosetting adhesive 8 made of epoxy resin or the like mixed with solder particles 9.

【０００９】さて、半導体チップ４の接続端子６を液晶
表示パネル１の接続端子３に異方導電性接着剤７を介し
て接続する場合には、まず図１（Ａ）に示すように、液
晶表示パネル１の接続端子３を含む接続部分の上面にシ
ート状の異方導電性接着剤７を載置する。次に、異方導
電性接着剤７の上面に半導体チップ４の接続端子６を含
む接続部分を位置合わせして載置する。When the connection terminal 6 of the semiconductor chip 4 is connected to the connection terminal 3 of the liquid crystal display panel 1 via the anisotropic conductive adhesive 7, first, as shown in FIG. A sheet-shaped anisotropic conductive adhesive 7 is placed on the upper surface of the connection portion including the connection terminals 3 of the display panel 1. Next, the connection portion including the connection terminals 6 of the semiconductor chip 4 is aligned and placed on the upper surface of the anisotropic conductive adhesive 7.

【００１０】次に、加圧するとともに、半田粒子９が溶
融しない温度で仮加熱する。すると、図１（Ｂ）に示す
ように、熱硬化性接着剤８の一部が流動して液晶表示パ
ネル１の接続端子３間及び半導体チップ４の接続端子６
間等に逃げることにより、原形を維持した半田粒子９の
一部が液晶表示パネル１と半導体チップ４の相対向する
接続端子３、６に共に接触し、また熱硬化性接着剤８が
ある程度硬化する。Next, pressure is applied and temporary heating is performed at a temperature at which the solder particles 9 do not melt. Then, as shown in FIG. 1B, a part of the thermosetting adhesive 8 flows to flow between the connection terminals 3 of the liquid crystal display panel 1 and the connection terminals 6 of the semiconductor chip 4.
By escaping into the space or the like, some of the solder particles 9 maintaining the original shape come into contact with the connection terminals 3 and 6 of the liquid crystal display panel 1 and the semiconductor chip 4 facing each other, and the thermosetting adhesive 8 is cured to some extent. To do.

【００１１】次に、加圧するとともに、半田粒子９が溶
融する温度で本加熱する。すると、図１（Ｃ）に示すよ
うに、液晶表示パネル１と半導体チップ４の相対向する
接続端子３、６間に位置する半田粒子９が溶融して流動
した後固化し、この固化した半田９ａが液晶表示パネル
１と半導体チップ４の相対向する接続端子３、６に共に
固着する。したがって、液晶表示パネル１と半導体チッ
プ４の相対向する接続端子３、６同士は半田９ａを介し
て強固に導電接続され、導電接続の信頼性を高めること
ができる。また、熱硬化性接着剤８が完全に硬化し、こ
れにより液晶表示パネル１の接続端子３を含む接続部分
と半導体チップ４の接続端子６を含む接続部分とが接着
される。Next, pressure is applied and main heating is performed at a temperature at which the solder particles 9 are melted. Then, as shown in FIG. 1C, the solder particles 9 located between the connection terminals 3 and 6 of the liquid crystal display panel 1 and the semiconductor chip 4 facing each other are melted and flowed, and then solidified. 9a are fixed to the connection terminals 3 and 6 of the liquid crystal display panel 1 and the semiconductor chip 4 which face each other. Therefore, the connection terminals 3 and 6 of the liquid crystal display panel 1 and the semiconductor chip 4 facing each other are strongly conductively connected through the solder 9a, and the reliability of the conductive connection can be improved. Further, the thermosetting adhesive 8 is completely hardened, whereby the connection part including the connection terminal 3 of the liquid crystal display panel 1 and the connection part including the connection terminal 6 of the semiconductor chip 4 are bonded.

【００１２】ここで、半田粒子９が溶融しない温度での
仮加熱により熱硬化性接着剤８をある程度硬化させてい
るので、本加熱のとき半田粒子９が溶融して流動する範
囲が規制されることとなる。すなわち、熱硬化性接着剤
８がある程度硬化すると、半田粒子９の位置が規制さ
れ、そして本加熱のとき半田粒子９が溶融しても、位置
規制された範囲内でしか流動することができない。この
結果、液晶表示パネル１と半導体チップ４の相対向する
接続端子３、６同士間に位置する半田粒子９は、位置規
制された位置において、溶融して流動した後固化する。
一方、液晶表示パネル１と半導体チップ４の相対向する
接続端子３、６同士の導電接続に寄与しない半田粒子９
は、位置規制された位置において、ただ単に溶融した後
固化し、原形をほぼ維持することになる。したがって、
半田粒子９は溶融しても横方向に流れることがなく、ひ
いては隣接する接続端子間でショートが発生しないよう
にすることができる。この結果、半田粒子９の粒径を５
〜２０μｍ程度とすると、接続端子３、６のピッチが１
００μｍ程度であっても、隣接する接続端子間でショー
トが発生しないようにすることができる。Since the thermosetting adhesive 8 is cured to some extent by temporary heating at a temperature at which the solder particles 9 do not melt, the range in which the solder particles 9 melt and flow during main heating is restricted. It will be. That is, when the thermosetting adhesive 8 is cured to some extent, the positions of the solder particles 9 are regulated, and even if the solder particles 9 are melted during the main heating, they can flow only within the position regulated range. As a result, the solder particles 9 located between the connection terminals 3 and 6 facing each other of the liquid crystal display panel 1 and the semiconductor chip 4 melt and flow at the position-regulated position, and then solidify.
On the other hand, the solder particles 9 that do not contribute to the conductive connection between the connection terminals 3 and 6 of the liquid crystal display panel 1 and the semiconductor chip 4 that face each other.
In the position-regulated position, is simply melted and then solidified to substantially maintain the original shape. Therefore,
Even if the solder particles 9 are melted, they do not flow in the lateral direction, so that it is possible to prevent a short circuit from occurring between adjacent connection terminals. As a result, the particle size of the solder particles 9 is set to 5
If the pitch is about 20 μm, the pitch of the connection terminals 3 and 6 is 1
Even if it is about 100 μm, it is possible to prevent a short circuit from occurring between adjacent connection terminals.

【００１３】次に、具体的な例について説明する。第１
に、熱硬化性接着剤８が硬化温度１９５〜２００℃程度
のエポキシ系樹脂からなり、半田粒子９が溶融温度１８
０〜１８５℃程度の低融点半田（例えば、Ｐｂ３７％：
Ｓｎ６３％）からなる場合には、仮加熱の温度を１２０
〜１３０℃程度とし、本加熱の温度を２００〜２１０℃
程度とする。第２に、熱硬化性接着剤８が硬化温度１９
５〜２００℃程度のエポキシ系樹脂からなり、半田粒子
９が溶融温度３１０〜３１５℃程度の高融点半田（例え
ば、Ｐｂ９５％：Ｓｎ５％）からなる場合には、仮加熱
の温度を１２０〜１３０℃程度とし、本加熱の温度を３
２０〜３３０℃程度とする。Next, a concrete example will be described. First
In addition, the thermosetting adhesive 8 is made of an epoxy resin having a curing temperature of about 195 to 200 ° C., and the solder particles 9 have a melting temperature of 18
Low melting point solder of about 0 to 185 ° C. (for example, Pb 37%:
Sn63%), the temporary heating temperature is 120
~ 130 ℃, the main heating temperature is 200 ~ 210 ℃
The degree. Second, the thermosetting adhesive 8 has a curing temperature of 19
When the solder particles 9 are made of an epoxy resin having a temperature of about 5 to 200 ° C. and the solder particles 9 are made of high melting point solder having a melting temperature of about 310 to 315 ° C. (for example, Pb 95%: Sn 5%), the temporary heating temperature is 120 to 130. ℃ and the main heating temperature is 3
It is about 20 to 330 ° C.

【００１４】なお、上記実施例ではこの発明を液晶表示
装置に適用した場合について説明したが、電子時計、電
卓、メモリカード、携帯電話、ページング受信器等にも
適用し得ることはもちろんである。要は、半導体チップ
等の一の電子部品と基板等の他の電子部品とを異方導電
性接着剤を介して接続するものであればよい。In the above embodiment, the case where the present invention is applied to the liquid crystal display device has been described, but it goes without saying that the present invention can also be applied to an electronic timepiece, a calculator, a memory card, a mobile phone, a paging receiver and the like. What is essential is that one electronic component such as a semiconductor chip is connected to another electronic component such as a substrate via an anisotropic conductive adhesive.

【００１５】[0015]

【発明の効果】以上説明したように、この発明によれ
ば、異方導電性接着剤として熱硬化性接着剤中に半田粒
子を混入してなるものを用い、溶融した後固化した半田
を介して両電子部品の相対向する接続端子同士を導電接
続しているので、両電子部品の相対向する接続端子同士
を強固に導電接続することができ、導電接続の信頼性を
高めることができる。また、半田粒子が溶融しない温度
での仮加熱により熱硬化性接着剤をある程度硬化させて
いるので、本加熱のとき半田粒子が溶融して流動する範
囲が規制され、隣接する接続端子間でショートが発生し
ないようにすることができる。As described above, according to the present invention, as the anisotropic conductive adhesive, a thermosetting adhesive in which solder particles are mixed is used, and the solder which is solidified after being melted is used. Since the opposing connecting terminals of both electronic components are conductively connected to each other, the opposing connecting terminals of both electronic components can be firmly conductively connected to each other, and the reliability of the conductive connection can be improved. In addition, since the thermosetting adhesive is cured to some extent by temporary heating at a temperature at which the solder particles do not melt, the range in which the solder particles melt and flow during main heating is restricted, and short-circuiting occurs between adjacent connection terminals. Can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図１】（Ａ）〜（Ｃ）はそれぞれこの発明の一実施例
を適用した液晶表示装置の各接続工程を示す断面図。1A to 1C are cross-sectional views showing respective connecting steps of a liquid crystal display device to which an embodiment of the present invention is applied.

【符号の説明】[Explanation of symbols]

１ 液晶表示パネル ３ 接続端子 ４ 半導体チップ ６ 接続端子 ７ 異方導電性接着剤 ８ 熱硬化性接着剤 ９ 半田粒子 1 Liquid crystal display panel 3 connection terminals 4 semiconductor chips 6 connection terminals 7 Anisotropic conductive adhesive 8 Thermosetting adhesive 9 Solder particles

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 G02F 1/1345 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/60 G02F 1/1345

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 一の電子部品の一の面に設けられた複数
の接続端子と他の電子部品の一の面に設けられた複数の
接続端子との間に、熱硬化性接着剤中に半田粒子を混入
してなる異方導電性接着剤を介在させ、 前記半田粒子が溶融しない温度で仮加熱することによ
り、前記熱硬化性接着剤をある程度硬化させ、 次いで前記半田粒子が溶融する温度で本加熱することに
より、前記熱硬化性接着剤を完全に硬化させるととも
に、前記半田粒子を溶融させ、 この溶融した半田が固化することにより、この固化した
半田を介して前記両電子部品の相対向する接続端子同士
を導電接続することを特徴とする電子部品の接続方法。1. A thermosetting adhesive is provided between a plurality of connection terminals provided on one surface of one electronic component and a plurality of connection terminals provided on one surface of another electronic component. Anisotropic conductive adhesive mixed with solder particles is interposed, and the thermosetting adhesive is cured to some extent by temporarily heating at a temperature at which the solder particles do not melt, and then at a temperature at which the solder particles melt. The main heating completely cures the thermosetting adhesive, melts the solder particles, and solidifies the melted solder, so that the relative electronic components of the two electronic components are passed through the solidified solder. A method of connecting electronic components, characterized in that facing connection terminals are conductively connected to each other. 【請求項２】 前記熱硬化性接着剤が硬化温度１９５〜
２００℃程度の熱硬化性樹脂からなり、前記半田粒子が
溶融温度１８０〜１８５℃程度の低融点半田からなると
き、 前記仮加熱の温度を１２０〜１３０℃程度とし、前記本
加熱の温度を２００〜２１０℃程度とすることを特徴と
する請求項１記載の電子部品の接続方法。2. The thermosetting adhesive has a curing temperature of 195 to 195.
When the solder particles are made of a thermosetting resin of about 200 ° C. and the solder particles are made of a low melting point solder having a melting temperature of about 180 to 185 ° C., the temporary heating temperature is about 120 to 130 ° C. and the main heating temperature is about 200 ° C. The method for connecting electronic components according to claim 1, wherein the temperature is set to about 210 ° C. 【請求項３】 前記熱硬化性接着剤が硬化温度１９５〜
２００℃程度の熱硬化性樹脂からなり、前記半田粒子が
溶融温度３１０〜３１５℃程度の高融点半田からなると
き、 前記仮加熱の温度を１２０〜１３０℃程度とし、前記本
加熱の温度を３２０〜３３０℃程度とすることを特徴と
する請求項１記載の電子部品の接続方法。3. The thermosetting adhesive has a curing temperature of 195 to 195.
When the solder particles are made of a thermosetting resin having a temperature of about 200 ° C. and the solder particles are made of a high melting point solder having a melting temperature of about 310 to 315 ° C., the temporary heating temperature is set to about 120 to 130 ° C. and the main heating temperature is set to 320. The method for connecting electronic components according to claim 1, wherein the temperature is set to about 330 ° C. 【請求項４】 前記熱硬化性接着剤はエポキシ系樹脂か
らなることを特徴とする請求項２または３記載の電子部
品の接続方法。4. The method of connecting electronic components according to claim 2, wherein the thermosetting adhesive is made of epoxy resin. 【請求項５】 前記両電子部品は半導体チップと基板と
からなることを特徴とする請求項１〜４のいずれかに記
載の電子部品の接続方法。5. The method for connecting electronic components according to claim 1, wherein the both electronic components are composed of a semiconductor chip and a substrate.
JP33955794A 1994-12-30 1994-12-30 How to connect electronic components Expired - Fee Related JP3417110B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP33955794A JP3417110B2 (en) 1994-12-30 1994-12-30 How to connect electronic components
CN95119443A CN1132931A (en) 1994-12-30 1995-12-29 Method of connecting terminals of one electronic part to terminals of another electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33955794A JP3417110B2 (en) 1994-12-30 1994-12-30 How to connect electronic components

Publications (2)

Publication Number Publication Date
JPH08186156A JPH08186156A (en) 1996-07-16
JP3417110B2 true JP3417110B2 (en) 2003-06-16

Family

ID=18328603

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3417110B2 (en)
CN (1) CN1132931A (en)

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