JP3411761B2 - Handling member for workpiece and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to semiconductor devices and LCs.
The present invention relates to a handling member for holding an object to be processed such as a D substrate, and further to a method and an apparatus for manufacturing such a handling member.

[0002]

2. Description of the Related Art In the process of manufacturing semiconductor devices, LCD substrates, etc., particles such as particles adhering to the surface of an object to be processed such as a semiconductor wafer or a glass substrate, organic contaminants such as etching residues, and various contaminants such as metal impurities are removed. Various cleaning devices have been used to remove.
Among them, the wet type cleaning system, in which the object to be processed is immersed in the cleaning liquid in the processing bath for cleaning, can effectively remove the object to be cleaned and has a good throughput, and is therefore widely used.

This wet-type cleaning system is constructed so that a loader for taking out an object to be processed loaded in a carrier unit from a carrier and a plurality of objects to be processed can be washed and dried in a batch system. The cleaning / drying processing unit, the unloader for loading the cleaned and dried processing target objects into the carrier, and the plurality of processing target objects are collectively conveyed between the loader, the cleaning / drying unit and the unloader. And a transporting means configured to do so.
The cleaning / drying section is provided with a cleaning processing tank filled with various cleaning liquids for cleaning the object to be processed, and a drying processing tank for drying the object to be processed cleaned in these cleaning processing tanks. A boat for holding a plurality of objects to be processed is arranged in each of the cleaning processing tank and the drying processing tank. In addition, the transfer device includes a chuck configured to be capable of collectively gripping a plurality of objects to be processed and separating them at a time. Then, the plurality of objects to be processed aligned in the loader are collectively gripped by the chuck of the transfer device and carried into each cleaning processing tank and drying processing tank, and the objects to be processed are transferred onto the boat. A washing and drying process is performed. Furthermore, by finally grasping the object to be processed, which has been dried in the drying processing tank, with the chuck of the transfer device, it is possible to collectively take it out from the boat in the drying processing tank and deliver it to the unloader. .

In the cleaning system as described above, the chuck of the transfer device that directly holds the object to be processed and the boat arranged in each processing tank are called a handling member. This handling member has sufficient mechanical properties to hold the object to be processed, dimensional stability for accurate delivery of the object, chemical resistance to withstand various cleaning liquids, and heat resistance. Various excellent properties such as durability are required. For this reason, tough and highly rigid polyetheretherketone (PEEK) is generally used for the handling member of the wet type cleaning system.

Here, the conventional manufacturing method of the handling member will be described as follows. That is, FIG.
As shown in FIG. 1, conventionally, the parts 100 and 101 are welded to each other by blowing hot air from the surroundings with a heat gun 102 in a state where the joints 100a and 101a of the parts 100 and 101 that form a handling member are butted against each other. I am trying to do it. The heat gun 102 has a built-in heating coil 103, and the air heated by the heating coil 103 is blown out from a nozzle 104 at the tip. In addition, as shown in FIG. 14, the joint portions 100a and 101a of the respective parts 100 and 101 of the handling member.
A method of press-fitting the pin 110 from the outside to join the parts 100 and 101 together in a state where they are butted against each other is also adopted.

[0006]

However, in the manufacturing method shown in FIG. 11, as shown in FIG. 12, only the outer portions 106 of the components 100 and 101 are melted, so that the joining force is poor.
Further, when the handling member is manufactured by this method, as shown in FIG.
The compressive stress 107 remains in the central part of 0 and 101, and the tensile stress 108 remains in the outer peripheral part. Therefore, the handling member manufactured by the method of FIG. 11 is likely to have cracks on the outside.

When the pin is press-fitted as shown in FIG. 14, fine cracks are generated when the pin is press-fitted. Then, there is a concern that the crack will gradually increase and the handling member will be damaged, and the object to be processed will be damaged.

Therefore, an object of the present invention is to provide a semiconductor wafer and L
It is an object of the present invention to provide a means for manufacturing a handling member having excellent rigidity and durability when a handling member for holding an object to be processed such as a CD glass substrate is manufactured using polyether ether ketone.

[0009]

According to the present invention, the object to be processed is
Treatment to be carried on the washing system for washing the body
A wafer chuck or boat for holding the body
A method for manufacturing a winding member, the method comprising:
The paralleling members are attached across a pair of supports
The holding rod is provided, and the object to be processed is held on the upper surface of the holding rod.
The holding grooves for
Both the support and the holding rod are made of polyetherether.
Ton (PEEK) for connecting the support and the holding rod.
By bringing the heating means close to the joint without contact,
After heating and melting the joint portions of the support and the holding rod,
By contacting and solidifying the joints,
Adhere the support and the holding bar to each other and then perform annealing treatment.
After that, machine processing is performed on the upper surface of the holding rod to be processed.
The holding groove for holding the
After processing, annealing treatment is not performed.
A method of manufacturing a body handling member is provided.

Further , according to the present invention, the object to be processed is washed.
For holding the object to be processed, which is provided in the cleaning system for
Wafer chuck or boat handling for handling
The handling member is a pair of supporting members.
With parallel retaining rods mounted over
A holding groove for holding the object to be processed is provided on the top surface of the bar.
It is formed with a pitch, and the support and the holding rod are
This is also made of polyether ether ketone (PEEK)
The heating means is not in contact with the joint between the support and the holding rod.
The support and the holding rod are connected by
After heating and melting the joints, contact the joints.
The support and the holding rods by making them solidify.
Adhesive, then annealed, then machined
Holding groove for holding the object to be processed on the upper surface of the holding rod
Are formed at a specified pitch, and annealing is performed after machining.
Processed object characterized by being manufactured by
Is provided.

[0011]

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a cleaning system 1 for cleaning a wafer W as an example of an object to be processed. The cleaning system 1 includes wafer chucks 36, 37, 38 and a boat 51 as a handling member for holding a wafer W which is an object to be processed.

The cleaning system 1 is a loader 2 for taking out the uncleaned wafers W carried in by the carrier C unit from the carrier C in an aligned state, and the wafers W for two carriers C are collectively cleaned and dried. Washing / drying processing unit 3
Can be roughly classified into three parts of the unloader 4 in which the wafer W is loaded into the carrier C and carried out.

The loader 2 is provided adjacent to a carry-in section 5 for carrying in and mounting a carrier C containing a wafer W before cleaning and a take-out section 6 for taking out and aligning the wafer W from the carrier C. In addition, the carrier C is loaded into the loading section 5
There is provided a transfer device 7 for transferring from the to the take-out section 6.

In the cleaning / drying processing section 3, the wafer chuck 3 of the transfer device 30 is arranged in this order from the loader 2 side to the unloader 4 side.
6, a processing bath 11 for cleaning and drying 6, a processing bath 12 for cleaning the wafer W with a cleaning liquid, processing baths 13, 14 for rinsing and cleaning the wafer W, and a wafer using a cleaning liquid different from the cleaning liquid in the processing bath 12. Treatment tank 15 for cleaning W,
Processing tanks 16 and 17 for rinsing and cleaning the wafer W, a processing tank 18 for cleaning and drying the wafer chuck 38 of the transfer device 32, and a processing tank 19 for drying the wafer W are arranged.

However, the arrangement and combination of the processing tanks 11 to 19 can be arbitrarily combined depending on the type of cleaning for the wafer W. In some cases, a certain processing tank may be omitted, or conversely, another processing tank may be added. You may.

The unloader 4 includes the loader 2 described above.
Loading section 20 and loading section 5 having the same configuration as the take-out section 6 of
An unloading section 21 having the same configuration as that of (1) and a transfer device (not shown) having the same configuration as the transfer device 7 are provided.

The front side of the cleaning / drying processing section 3 (see FIG. 1).
On the front side), three transfer devices 30, 31, 32 are arranged in this order from the loader 2 side to the unloader 4 side, and these transfer devices 30, 31, 32 are all arranged along the guide 33. The cleaning system 1 is configured to be slidable in the longitudinal direction. Each transfer device 30, 31, 3
2 includes wafer chucks 36, 37 and 38 as a handling member for holding the wafer W, respectively. Then, each of the transfer devices 30, 31, and 32 collectively holds and transfers a predetermined number of wafers W (for example, 50 wafers W corresponding to two carriers C) by the wafer chucks 36, 37, and 38.

That is, the transfer device 30 located on the loader 2 side
Holds a predetermined number of wafers W by the wafer chuck 36 and slides the wafers W along the guide 33 to remove the wafers W taken out of the take-out section 6 of the loader 2 in the cleaning / drying processing section 3 into the processing tank 12, It is conveyed in batches in the order of 13 and 14. In addition, the transport device 31 located in the center
Holds a predetermined number of wafers W on the wafer chuck 37 and slides the wafers W along the guide 33, so that the cleaning / drying processing unit 3 processes the processing tanks 14, 15, 1, 1.
The wafer W is collectively transported in the order of 6 and 17. Further, the transfer device 32 located on the unloader 4 side holds a predetermined number of wafers W by the wafer chuck 38 thereof and holds the guide 33.
The wafers W are collectively transported in the cleaning / drying processing section 3 in the order of the processing tank 17 and the processing tank 19 in the cleaning / drying processing section 3, and further, the wafers W are collectively transferred from the processing tank 19 to the unloading section 20 of the unloader 4. And then transport.

Here, the wafer W is held in a lump and is transferred in the cleaning / drying processing section 3 by the transfer device 3 described above.
Since 0, 31, and 32 have the same configuration,
For example, the transfer device 30 that transfers the wafer W between the unloading unit 6 and the processing tanks 12, 13, and 14 will be described as an example. The wafer chuck 36 of the transfer device 30 is, for example, a carrier C as shown in FIG. A pair of left and right holding members 41a, 4 which collectively hold 50 wafers W as two pieces
1b is provided.

The holding members 41a and 41b are bilaterally symmetrical, and the holding members 41a and 41b are supported by the supporting portions 43 of the conveying device 30 by the corresponding rotating shafts 42a and 42b, and can be freely opened and closed. Is configured. The support portion 43 is moved in the vertical direction (Z direction) by a drive mechanism 44, and the wafer chuck 36 itself is moved in the front-back direction (Y direction) by a drive mechanism (not shown) built in the support portion 43. It is configured to be movable. Further, the drive mechanism 44 itself is provided above the transport base 45 which is movable along the longitudinal direction (X direction) of the loader 2, the washing / drying processing unit 3 and the unloader 4 shown in FIG. Then, the rotating shaft 4 is moved by a driving body (not shown) such as a motor provided in the support portion 43.
2a and 42b are configured to be reciprocally rotatable as indicated by a reciprocating rotation arrow θ in FIG. Further, the support portion 43 itself is also configured so that its angle can be finely adjusted in the horizontal plane.

The rotating shafts 42a and 42b have struts 46a,
The upper ends of 46a, 46b and 46b are fixed to each other, and the lower ends of the columns 46a and 46a and the column 46 are fixed.
Between the lower ends of b and 46b, quartz-made holding rods 47a, 47b, 48a and 48b are arranged in parallel in two stages in the vertical direction. On the surface of each of the holding rods 47a, 47b, 48a, 48b, for example, 50 holding grooves into which the peripheral portion of the wafer W is inserted are formed. The intervals (groove pitch) between the holding grooves are arranged at a predetermined distance so as to be equal in the front-rear direction (Y direction). And each strut 46
The a and 46b hold the wafer W by the holding rods 47a, 47b, 48a and 48b in accordance with the rotating operation of the rotating shafts 42a and 42b, and have desired positions in the vertical direction (Z direction) and the longitudinal direction (X direction). It is configured so that it can be transferred to.

The other transfer devices 31 and 32 and the wafer chucks 37 and 38 thereof are also included in the transfer device 3 described above.
The wafer chuck 36 has the same structure as that of the wafer chuck 36, and is configured such that, for example, 50 wafers W can be collectively held and transported in the same manner as described above.

As shown in FIG. 2 as a representative, boats 51, which are handling members for holding the wafer W in each processing tank, are installed at the bottoms of the processing tanks 12 to 17. FIG. 3 shows a state in which the boat 51 is pulled out above the processing tank 12 for the sake of explanation. As shown in the figure, the boat 51 includes three parallel holding rods 53, 54, 55 horizontally attached to the lower ends of a pair of supports 52, 52 'vertically installed in the processing tank 12. There is.
In the illustrated example, of the holding rods 53, 54, 55, the central holding rod 54 has the lowest height, and the left and right holding rods 53,
55 is arranged at a position symmetrical with respect to the holding rod 54 and at a position higher than the holding rod 54. Each holding rod 53,
Holding grooves 56 for holding the wafer W are formed on the upper surfaces of 54 and 55 at a predetermined pitch, for example, 50 grooves each. The interval (groove pitch) between the holding grooves 56 is equal to the pitch of the holding grooves formed on the holding rods 47a, 47b, 48a, 48b of the wafer chuck 36 (37, 38) described above. Thus, they are arranged at a predetermined interval in the front-rear direction (Y direction).

Further, at the upper ends of the supports 52, 52 ', a pair of hooks 57, which are bent outward in the horizontal direction,
57 'is attached. By engaging the hooks 57 and 57 ′ with the upper end of the processing tank 12, the boat 51 is kept suspended at a predetermined height in the processing tank 12.

The 50 wafers W held together by the above-mentioned wafer chuck 36 are transferred to the transfer device 3
When the lower end of the 50 wafers W is inserted into the holding grooves 53 of the holding rods 53, 54, 55 of the boat 51, the wafer W is transferred as the support unit 43 is lowered by the driving mechanism 44 of No. 0. The drive mechanism 44 of the device 30 is configured to stop the lowering of the support portion 43. Thus, the 50 wafers W are held by the holding rods 53, 5 of the boat 51.
The wafer chucks 36 are collectively held by the holding grooves 56 of 4, 55.
The holding state of the wafer W by the holding members 41a and 41b is released by the rotation of 42b, and the drive mechanism 44 of the transfer device 30 is opened.
The wafer chuck 36 is retracted above the processing bath 12 as the supporting portion 43 is raised by the above.

When the predetermined processing in the processing tank 12 is completed, the wafer chuck 36 is moved to the processing tank 1 by the lowering of the supporting portion 43 by the driving mechanism 44 of the transfer device 30 again.
50 holding the wafers W, which are inserted into the holder 2, and the holding members 41a and 41b are closed by the turning of the turning shafts 42a and 42b and held on the holding rods 53, 54 and 55 of the boat 51, collectively. It is supposed to do. After that, the support portion 23
As the wafer chuck 36 moves upward,
Retreat upwards from inside 2 and, along with it, 50 wafers W
Are taken out of the processing tank 12 in a batch, and the next processing tank 13
Be transported to.

The processing tanks 13 to 1 other than the processing tank 12
The same thing as the boat 51 described above is installed also in No. 7, and similarly to the above, it is configured so that 50 wafers W can be collectively held in each of the processing tanks 13 to 17. .

Further, the processing bath 12 is a box-shaped inner bath 60 having a size large enough to accommodate a wafer W as an object to be processed, and an outer bath for receiving a processing liquid overflowing from the upper end of the inner bath 60. It is composed of a tank 61. The upper surface of the inner tank 60 is open, and the treatment liquid is supplied into the inner tank 60 from the opening. Further, at the bottom of the inner tank 60, a circulation nozzle (not shown) that circulates the treatment liquid by discharging the treatment liquid taken out of the outer tank 61 again at the bottom of the inner tank 60.
Are arranged. By discharging the processing liquid from the circulation nozzle, the processing liquid is circulated on the surface of the wafer W held on the holding rods 53, 54, 55 of the boat 51 in the inner tank 60, and good cleaning can be performed. . Also,
By this circulation, the processing liquid overflowing from above the inner tank 60 is received by the outer tank 61 and circulated. The processing tanks 13 to 17 other than the processing tank 12 also have substantially the same configuration, and the boats 51 as the handling members installed in the processing tanks 13 to
It is configured to hold 0 wafers W at once and clean them in the same manner.

Next, the wafer W in this cleaning system 1
First, the carrier C is placed on the carry-in section 5 of the loader 2 by an appropriate carrying means such as a carrying robot (not shown), as shown in FIG. Wafers W that have not been cleaned on the carrier C are, for example, 2
A predetermined number such as 5 is loaded. And the mounting part 5
The carrier C placed on the table is transferred by the transfer device 7 to the alignment section 6
Is transferred to, for example, 50 wafers W corresponding to two carriers C are aligned in the alignment section 6 in a state where the orientation flats are aligned,
Wait for the subsequent cleaning process.

The wafers W thus aligned in the take-out section 6 of the loader 2 are next cleaned and dried in the processing tank 11 of the cleaning / drying processing section 3 by the transfer device 30.
The wafer W is collectively held by the wafer chuck 36 while maintaining the aligned state, and is transported to each of the processing tanks 12, 13 and 14, where the wafer W is immersed in the cleaning liquid and sequentially cleaned.

For example, the cleaning process will be described by taking the treatment tank 12 as an example.
Before the wafer W is transferred by the wafer chuck 36, the processing liquid is pre-filled. Then, the wafer chuck 36 of the transfer device 30 described with reference to FIG.
The 50 wafers W held in 1 are collectively lowered and loaded into the inner bath 60 of the processing bath 12. In this way, after 50 wafers W are transferred to the boat 51 in the inner tank 60 in an aligned state, the wafer chuck 36 releases the gripped state of the wafer W, and the wafer chuck 36 retreats above the processing tank 12. .

When the cleaning in the processing tank 12 is completed, for example, after a lapse of a predetermined time, the wafer chuck 36 of the transfer device 30 descends into the inner tank 60 of the processing tank 12 and is held on the boat 51. 50 wafers W
Grasp and lift all at once. Then, 50 wafers W are collectively taken out of the inner bath 60 of the processing bath 12 and transferred to the next processing bath 13. 50 carried into the processing tank 13
The wafers W are rinsed and washed by using, for example, pure water according to the same process. Further, the wafer W that has been cleaned in the processing tank 13 is similarly transferred to the next processing tank 14 by the wafer chuck 36 of the transfer device 30 and cleaned again.
In this way, the wafer W that has been cleaned by the processing baths 12, 13, and 14 stands by on the boat at the bottom of the processing bath 14 for cleaning with another processing liquid in the subsequent processing baths 15 to 17. Then, the next wafer transfer device 31 takes out the wafer W waiting on the boat at the bottom of the processing tank 14,
It is conveyed to each processing tank 14-17. Then, after the predetermined cleaning process according to the same process as the above, the wafer W is processed into the processing tank 17
The subsequent drying process in the processing tank 19 is awaited on the bottom boat. Hereinafter, after performing the vapor drying process by IPA in the drying process tank 19, the wafer W is passed through the unloader 4.
Are carried out of the device in units of carrier C.

Next, the manufacturing apparatus for the wafer chucks 36, 37, 38 and the boat 51 as the handling members for directly holding the wafer W in the cleaning system 1 as described above will be described.

FIG. 4 schematically shows an apparatus 69 for manufacturing such a handling member. Rail 7 as shown
On the 0, a pair of left and right support blocks 71, 72 are arranged so as to face each other. In the example shown in this figure, the left support block 71 is fixed on the rail 70. On the other hand, the right support block 72 can be moved in the left-right direction along the rail 70. However, a stopper 73 for restricting the forward movement position of the right support block 72 is provided at an appropriate position on the rail 70.

A heater 75 is arranged between the left and right support blocks 71, 72. This heater 75 is
For example, it is composed of a ceramics heater, and can be heated to a melting temperature of polyetheretherketone (PEEK) or higher. In the illustrated example, the heater 75
Is configured to be movable upward from a position between the left and right support blocks 71, 72.

The left and right support blocks 71, 72 are
Clamping mechanisms 78 and 79 for gripping the respective components 76 and 77 that form the handling member are provided, respectively. By grasping the respective parts 76, 77 of the handling member by these clamp mechanisms 78, 79, the joint parts 76a, 77a are supported so as to face each other. Then, as shown in FIG. 5, when the heater 75 is moved upward and the right support block 72 is moved forward to the position where it abuts against the stopper 73 (moved leftward in the figure), the component 7
The position of the stopper 73 is adjusted so that the joint portions 76a and 77a of the joints 6 and 77 are exactly in contact with each other. Also, FIG.
As shown in FIG. 7, the right support block 72 is retracted (moved to the right in the figure) to join the joints 76a, 77a of the parts 76, 77.
When the heater 75 is lowered to a position between the left and right support blocks 71, 72 when the two are separated from each other,
The heater 75 is configured to approach the joints 76a and 77a of the components 76 and 77 in a non-contact state.

When manufacturing a handling member by the manufacturing apparatus 69, first, as shown in FIG. 4, the parts 76 and 77 for constituting the handling member are clamped to the left and right support blocks 71 and 72 by the clamp mechanism 78. It is firmly gripped by 79, and the joint portions 76a and 77a are opposed to each other and supported. Also, the right support block 72
Is moved backward (moved in the right direction in the figure) to bring the joint portions 76a, 77a of the components 76, 77 into a separated state. In this state, the heater 75 is lowered to a position between the left and right support blocks 71, 72, and the joining portions 76a, 77 of the parts 76, 77 are brought together.
The heater 75 is brought closer to a in a non-contact state, and the component 76,
Polyether ether ketone (PEE), which is the material of 77
K) is heated to a temperature higher than the melting temperature to join the joints 76a, 77.
a is melted.

When heating the joints 76a, 77a of the components 76, 77 in this manner, the joints 76a, 77a
It is preferable that the heater 75 is not contacted with the heater 75 but is heated at a proper interval in a non-contact state. That is, the joint portion 76
When the heater 75 is directly brought into contact with the heaters a and 77a, the molten polyether ether ketone (PEEK) causes the heater 7
5 adheres to the surface, and the adhered matter becomes a carbide, which causes particles. Therefore, the joint portion 76a,
It is preferable that the 77a and the heater 75 be spaced apart from each other by about 0.5 to 1 mm.

On the other hand, the joints 76a and 77a and the heater 75
If a space is provided between the and, heat may escape upward due to convection. Therefore, as shown in FIG. 6, it is preferable to dispose the heater 75 slightly below the position between the left and right support blocks 71 and 72 to heat the joining portions 76a and 77a. Further, as shown in the drawing, by arranging the reflection plate 80 below the heater 75, the joining portions 76a, 77a
Can be heated efficiently.

Next, after the joints 76a and 77a of the components 76 and 77 are respectively heated and melted in this manner, the heater 75 is moved upward as shown in FIG. Then, the right support block 72 is moved forward (moved to the left in the drawing) to a position where it comes into contact with the stopper 73, so that the component 7
The joints 76a and 77a of the six and 77 are brought into contact with each other. In this way, the joints 76a and 77a are left in contact with each other for a while, and the components 76 and 77 are adhered to each other by solidifying due to the temperature decrease.

Thus, the handling member component 76,
After adhering 77 to each other, a handling member is manufactured by performing machining using an appropriate tool or the like.

Here, as an example of the handling member,
Processing tanks 12 to 18 of the cleaning system 1 described in FIGS.
Based on the case of manufacturing the boat 51 installed therein, the manufacturing method thereof will be described more specifically.

For example, when the boat 51 is manufactured from the material 90 made of polyetheretherketone (PEEK) as shown in FIG. 7, the material 90 is usually in the state of being processed by extrusion or the like. Therefore, first, the material 90 is annealed to remove the anisotropy of the material 90.

After annealing, the material 90 is processed to obtain the supports 52, 52 ', the holding rods 53, 54, 55 and the hooks 57, 57' which are parts of the boat 51, as shown in FIG. Then, the supports 52, 5 which are the processed parts
2 ', holding bars 53, 54, 55 and hooks 57, 5
7'is dried to remove water.

Next, as shown in FIG.
2 ', holding bars 53, 54, 55 and hooks 57, 5
The respective parts are arranged so that the joints of 7 ′ face each other.
Then, a heater is brought close to the joints to heat them in a non-contact state to heat and melt them. After this heating and melting,
The parts are adhered to each other by bringing the joints into contact with each other and solidifying them. For this adhesion, the handling member manufacturing apparatus 69 described above with reference to FIGS. 5 and 6 is preferably used. Further, after this adhesion is finished, an annealing treatment (annealing) is performed. This annealing treatment is mainly performed to remove the residual stress in the bonded portion between the components.

Next, as shown in FIG. 10, by using a tool 90 such as a grinder, for example, each holding rod 53, 54, 5
Necessary machining, such as forming a holding groove 56 on the upper surface of 5, is performed. Thus, the boat 51, which is a handling member for holding the wafer W, is completed. After this machining, in order to avoid the occurrence of dimensional error,
No annealing treatment is performed. Finally, the boat 51 manufactured in this way is washed.

[0048]

EXAMPLES Here, parts made of polyetheretherketone (PEEK) were actually joined by the method of the present invention, and the mechanical characteristics of the joined portion were examined. In addition, a bar member made of polyetheretherketone (PEEK) having a grade number of 450G was used for the parts.

As a result, it was possible to obtain a bonding strength of 80% or more as compared with the non-bonded portion. No cracks or bubbles were found at the joint. Further, when a heat cycle test was performed at room temperature to 100 ° C. for 85 cycles, no crack was generated. As described above, it was found that the handling member manufactured by the method of the present invention has sufficient strength and can withstand repeated temperature changes.

[0050]

According to the present invention, a semiconductor wafer or LCD
It has a feature that a handling member having excellent rigidity and durability, which is optimal for holding an object to be processed such as a glass substrate, can be easily and inexpensively manufactured. In the present invention, since the machining is performed after the parts constituting the handling member are joined together, no dimensional error occurs. Further, since the heater is brought close to the heater in a non-contact state to melt the joint portion of the components, there is an advantage that particles do not adhere to the heater surface.

[Brief description of drawings]

FIG. 1 is a perspective view of a cleaning system.

FIG. 2 is a perspective view showing a chuck and a boat that are handling members for holding a wafer.

FIG. 3 is a perspective view showing a state in which a boat is pulled out above a processing tank.

FIG. 4 is a schematic view of a handling member manufacturing apparatus.

5 is a schematic view showing a state in which parts are joined together by using the manufacturing apparatus shown in FIG.

FIG. 6 is an enlarged view of a portion where the parts are joined to each other in the manufacturing apparatus shown in FIG.

FIG. 7 is a perspective view of a material for manufacturing a handling member.

FIG. 8 is a perspective view of a support, a holding rod, and a hook, which are each part of the boat obtained by processing the material.

FIG. 9 is a perspective view of a state where the joint portions of the boat components are opposed to each other.

FIG. 10 is a perspective view of the boat showing a state where machining is performed.

FIG. 11 is an explanatory diagram of a conventional method for manufacturing a handling member that is welded using a heat gun.

FIG. 12 is an explanatory view of a molten portion of the component by the manufacturing method shown in FIG.

13 is an explanatory diagram of residual stress inside a component by the manufacturing method shown in FIG.

FIG. 14 is an explanatory diagram of a conventional method for manufacturing a handling member in which pins are press-fitted and joined.

[Explanation of symbols]

W wafer 36, 37, 38 chuck 51 boats 70 rails 71, 72 Support block 75 heater 76, 77 Handling member parts 76a, 77a joint

Continuation of front page (58) Fields investigated (Int.Cl. ⁷ , DB name) B29C 65/00-65/82 H01L 21/304 648

Claims (2)

(57) [Claims] 1.Cleaning system for cleaning objects
Wafer chuck for holding the object to be processed
By the method of manufacturing the handling member which is
There Mount the handling member across a pair of supports
Mounted parallel holding rods, and the upper surface of the holding rod is covered with
Holding grooves for holding the processing body are formed at a specified pitch.
Is Both the support and the holding rod are polyether ether
Made of ketone (PEEK), The heating means is not in contact with the joint between the support and the holding rod.
By bringing the support and the holding rod into contact with each other.
After heating and melting each other, contact the joints
Bonding the support and the holding rods by solidifying
And then annealed and then machined before
There is a holding groove on the upper surface of the holding rod to hold the object to be processed.
Formed at a fixed pitch and do not anneal after machining
Manufacture of a handling member for an object to be processed characterized by
Method. 2.Cleaning system for cleaning objects
Wafer chuck for holding the object to be processed
A handling member that is a boat or a boat, Mount the handling member across a pair of supports
Mounted parallel holding rods, and the upper surface of the holding rod is covered with
Holding grooves for holding the processing body are formed at a specified pitch.
Is Both the support and the holding rod are polyether ether
Made of ketone (PEEK), The heating means is not in contact with the joint between the support and the holding rod.
By bringing the support and the holding rod into contact with each other.
After heating and melting each other, contact the joints
Bonding the support and the holding rods by solidifying
And then annealed and then machined before
There is a holding groove on the upper surface of the holding rod to hold the object to be processed.
Formed at a fixed pitch and do not anneal after machining
Of the object to be processed, which is characterized by being manufactured by
Hand ring member.