JP3398713B2 - Pretreatment method for electroless plating - Google Patents
Pretreatment method for electroless platingInfo
- Publication number
- JP3398713B2 JP3398713B2 JP01171099A JP1171099A JP3398713B2 JP 3398713 B2 JP3398713 B2 JP 3398713B2 JP 01171099 A JP01171099 A JP 01171099A JP 1171099 A JP1171099 A JP 1171099A JP 3398713 B2 JP3398713 B2 JP 3398713B2
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- pretreatment method
- laser
- inorganic filler
- plating according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、無電解めっきの前
処理方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pretreatment method for electroless plating.
【０００２】[0002]
【従来の技術】一般に、高分子材料からなる成形品に
は、表面を化学薬品によって粗面化し、パラジウムを吸
着させた後、無電解めっきを施すようにしている。但
し、前記パラジウムのみの吸着は困難であるので、錫パ
ラジウム化合物を吸着させた後、還元する必要がある。2. Description of the Related Art Generally, a molded article made of a polymer material is roughened with a chemical agent to adsorb palladium and then electroless plated. However, since it is difficult to adsorb only the palladium, it is necessary to reduce the tin-palladium compound after adsorbing it.
【０００３】ところで、化学薬品による粗面化は、選択
的に行うことができないため、特定箇所のみをめっきす
る場合には、一旦、全面をめっきした後、フォトレジス
トによる露光・現像処理を行う必要があった。このた
め、簡単に高分子成形品の表面にめっき可能な方法が望
まれていた。By the way, since surface roughening by chemicals cannot be selectively carried out, when plating only a specific portion, it is necessary to perform the exposure / development treatment with a photoresist after plating the entire surface once. was there. Therefore, there has been a demand for a method capable of easily plating on the surface of a polymer molded article.
【０００４】そこで、特開平４─１８３８７３号公報に
示すように、高分子材料からなる成形品に紫外線レーザ
照射することにより、特定箇所へのめっきを可能とする
方法が提案された。Therefore, as disclosed in Japanese Patent Laid-Open No. 183873/1992, a method has been proposed in which a molded article made of a polymer material is irradiated with an ultraviolet laser to enable plating on a specific portion.
【０００５】この方法によれば、紫外線レーザを照射
し、パラジウムコロイド水溶液に浸漬した後、無電解め
っきを行うだけで、特定箇所のみをめっきすることが可
能である。すなわち、紫外線レーザの照射により、照射
領域のみが正に帯電するので、陰イオン性のパラジウム
コロイド水溶液に浸漬すると、簡単に照射領域のみにパ
ラジウムコロイドを付着させることができる。そして、
前記水溶液中に還元剤を含有させておくことにより、無
電解めっきの触媒となるパラジウムのみを析出させるこ
とが可能である。According to this method, it is possible to plate only a specific portion by irradiating an ultraviolet laser and immersing in an aqueous palladium colloid solution and then performing electroless plating. That is, since only the irradiation region is positively charged by the irradiation of the ultraviolet laser, the palladium colloid can be easily attached only to the irradiation region by immersing in the anionic palladium colloid aqueous solution. And
By containing a reducing agent in the aqueous solution, it is possible to deposit only palladium, which serves as a catalyst for electroless plating.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前記レ
ーザ照射による方法では、次のような問題点があり採用
されるに至っていないのが現状である。However, under the present circumstances, the method by laser irradiation has not been adopted because of the following problems.
【０００７】すなわち、レーザを高フルーエンスで照射
した場合、照射領域（特定箇所）の周囲のみ帯電するた
め、低フルーエンスで行う必要があるが、それでは帯電
量が不十分となり、パラジウムコロイドが十分に付着し
ない。また、レーザを相当数照射する必要が生じ、作業
性が悪化する。具体的に、レーザを、０．０５Ｊ／ｃｍ
2／１パルスの低フルーエンスで照射した場合、十分な
帯電量を得るためには照射回数を１０００回としなけれ
ばならない。That is, when the laser is irradiated with a high fluence, only the periphery of the irradiation area (specific portion) is charged, and therefore it is necessary to perform the irradiation with a low fluence, but this would result in an insufficient charge amount and sufficient palladium colloid adhesion. do not do. Further, it becomes necessary to irradiate a considerable number of lasers, which deteriorates workability. Specifically, a laser of 0.05 J / cm
When irradiation is performed with a low fluence of 2/1 pulse, the number of irradiation must be 1000 times in order to obtain a sufficient charge amount.
【０００８】また、レーザを低フルーエンスで照射した
場合、照射領域の表面粗さが小さくなり、形成しためっ
きが剥離しやすい。Further, when the laser is irradiated with a low fluence, the surface roughness of the irradiation region becomes small, and the formed plating is easily peeled off.
【０００９】さらに、低フルーエンスでの照射による帯
電現象は紫外線レーザに特有のものであり、選択可能な
設備が制限される。Furthermore, the charging phenomenon by irradiation with low fluence is peculiar to the ultraviolet laser, and the selectable equipment is limited.
【００１０】そこで、本発明は、使用するレーザの種類
に拘わらず、特定箇所を効率的に、しかも強固にめっき
することのできる無電解めっきの前処理方法を提供する
ことを課題とする。Therefore, it is an object of the present invention to provide a pretreatment method for electroless plating capable of efficiently and firmly plating a specific location regardless of the type of laser used.
【００１１】[0011]
【課題を解決するための手段】本発明者等は、レーザ照
射により成形品の表面が帯電する原因が、アブレーショ
ンにより発生する除去飛散物（以下、デブリーと記載す
る。）が主要因であることを突き止めた。そして、前記
デブリーは、成形品に無機フィラーを含有させることに
より飛散しにくくできることを見出した。Means for Solving the Problems The inventors of the present invention have found that the cause of electrification of the surface of a molded article by laser irradiation is mainly the removed scattered matter (hereinafter referred to as debris) generated by ablation. I found out. Then, they have found that the debris can be prevented from scattering by including an inorganic filler in the molded product.
【００１２】本発明は、前記課題を解決するための手段
として、無電解めっきの前処理方法を、高分子材料に無
機フィラーを添加し、得られた高分子成形品に波長が６
００ｎｍ以下のレーザを照射し、陰イオン性の貴金属水
溶液に浸漬するようにしたものである。As a means for solving the above problems, the present invention employs a pretreatment method for electroless plating, in which an inorganic filler is added to a polymer material, and the obtained polymer molded article has a wavelength of 6%.
A laser having a wavelength of 00 nm or less is irradiated and immersed in an aqueous solution of an anionic precious metal.
【００１３】この構成により、添加した無機フィラー
が、レーザ照射時に、そのフルーエンスの大きさの違い
に拘わらず、十分な量の帯電したデブリーを発生させる
と共に、照射領域以外への飛散を防止する。したがっ
て、陰イオン性の貴金属水溶液に浸漬すると、レーザ照
射領域のみに貴金属を付着させることができる。この結
果、無電解めっきを行うと、レーザ照射領域に付着した
貴金属が触媒として作用し、所望箇所（照射領域）に良
好なめっき膜を形成することが可能である。With this structure, the added inorganic filler generates a sufficient amount of charged debris during laser irradiation regardless of the difference in fluence size, and prevents scattering to areas other than the irradiation area. Therefore, when immersed in an anionic aqueous solution of a noble metal, the noble metal can be attached only to the laser irradiation region. As a result, when electroless plating is performed, the noble metal attached to the laser irradiation region acts as a catalyst, and it is possible to form a good plating film at a desired portion (irradiation region).
【００１４】[0014]
【発明の実施の形態】以下、本発明に係る無電解めっき
の前処理方法の実施形態を説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a pretreatment method for electroless plating according to the present invention will be described below.
【００１５】この無電解めっきの前処理方法では、ま
ず、高分子材料に無機フィラーを添加し、得られた高分
子成形品にレーザを照射する。In this pretreatment method for electroless plating, first, an inorganic filler is added to a polymer material, and the obtained polymer molded product is irradiated with laser.
【００１６】この場合、前記高分子材料には、液晶ポリ
マ（ＬＣＰ：Liquid Crystal Polymer）、ポリエーテル
スルホン、ポリブチレンテレフタレート、ポリカーボネ
ート、ポリフェニレンエーテル、ポリフェニレンオキサ
イド、ポリアセタール、ポリエチレンテレフタレート、
ポリアミド、アクリロニトリル・ブタジエン・スチレン
（ＡＢＳ）、ポリフェニレンサルファイド、ポリエーテ
ルイミド、ポリエーテルエーテルケトン、ポリスルホ
ン、ポリイミド、エポキシ樹脂、又は、これらの複合樹
脂等が使用可能である。In this case, the polymer material is a liquid crystal polymer (LCP: Liquid Crystal Polymer), polyether sulfone, polybutylene terephthalate, polycarbonate, polyphenylene ether, polyphenylene oxide, polyacetal, polyethylene terephthalate,
Polyamide, acrylonitrile butadiene styrene (ABS), polyphenylene sulfide, polyether imide, polyether ether ketone, polysulfone, polyimide, epoxy resin, or a composite resin thereof can be used.
【００１７】前記無機フィラーとしては、ガラスフィラ
ー、セラミックス粒子等が挙げられ、形状をφ１〜２０
μｍ、長さ１０μｍ以上のファイバー状、又は、φ０．
５〜２０μｍの粒子状で、その高分子材料に対する添加
量を１０〜５０重量％とすると、より一層デブリーの飛
散を抑制することが可能となる点で好ましい。Examples of the inorganic fillers include glass fillers and ceramic particles, and the shapes are φ1 to 20.
μm, a fiber shape having a length of 10 μm or more, or φ0.
A particle size of 5 to 20 μm and an addition amount of 10 to 50% by weight with respect to the polymer material are preferable because the scattering of debris can be further suppressed.
【００１８】また、前記レーザとしては、エキシマレー
ザ（波長λ＝１９３，２４８，３１８，３５１ｎｍ）、
ＹＡＧ第２高調波（波長λ＝５３２ｎｍ）、ＹＡＧ第３
高調波（波長λ＝３５５ｎｍ）等の波長が６００ｎｍ以
下のものが使用できる。As the laser, an excimer laser (wavelength λ = 193, 248, 318, 351 nm),
YAG second harmonic (wavelength λ = 532 nm), YAG third
A wavelength of 600 nm or less such as a harmonic (wavelength λ = 355 nm) can be used.
【００１９】また、前記レーザによる投入エネルギーの
総計を１０〜５００J／ｃｍ2とすると、レーザ照射領域
の帯電状態を貴金属の付着に適した状態とすることが可
能となる。When the total energy input by the laser is 10 to 500 J / cm 2 , the charged state of the laser irradiation area can be made suitable for the attachment of the noble metal.
【００２０】特に、前記レーザの照射条件を、フルーエ
ンス（単位パルスの単位面積当たりのエネルギー：Ｊ／
ｃｍ2／１パルス）及び照射回数が、貴金属を析出させ
るのに適した帯電状態となるように設定するのがよい。
具体的には、レーザのフルーエンス及び照射回数が、図
１に示すグラフの領域Ａ内のいずれかの値となるように
設定すればよい。これにより、レーザ照射領域で、アブ
レーションにより発生するデブリーの帯電状態が良好と
なり、後述する貴金属の析出を適切に行わせ、めっきを
レーザ照射領域の全面に施すことが可能となる。In particular, the laser irradiation conditions are fluence (energy of unit pulse per unit area: J /
cm 2/1 pulse) and irradiation number, may be set so that the charged state suitable to deposit the noble metal.
Specifically, the fluence of the laser and the number of times of irradiation may be set to any value within the area A of the graph shown in FIG. As a result, the charged state of the debris generated by ablation becomes good in the laser irradiation region, and it becomes possible to appropriately deposit the noble metal described below and perform plating on the entire surface of the laser irradiation region.
【００２１】次に、前記成形品を、陰イオン性の貴金属
水溶液に浸漬する。この場合、使用可能な貴金属水溶液
としては、ＰｄＣｌ2粉末をイオン交換水に溶解した
り、Ｎａ2ＰｄＣｌ4粉末をイオン交換水に溶解したり、
ＰｄＣｌ2粉末をイオン交換水に溶解してなるパラジウ
ム水溶液や、塩化パラジウム、塩化ナトリウム、ポリエ
チレングリコール・モノ・Ｐ・ノニルフェニルエーテ
ル、ホウ素化フッ化ナトリウムを混合したパラジウムコ
ロイド水溶液等が挙げられる。Next, the molded product is dipped in an anionic precious metal aqueous solution. In this case, as the usable precious metal aqueous solution, PdCl 2 powder is dissolved in ion-exchanged water, Na 2 PdCl 4 powder is dissolved in ion-exchanged water,
Examples thereof include a palladium aqueous solution obtained by dissolving PdCl 2 powder in ion-exchanged water, a palladium colloid aqueous solution in which palladium chloride, sodium chloride, polyethylene glycol / mono / P / nonylphenyl ether, and sodium boride fluoride are mixed.
【００２２】このように、前述の前処理方法によれば、
成形品のレーザ照射領域にのみ貴金属を析出させること
ができ、その後に無電解めっきを行うと、この領域のみ
に無電解めっき膜を形成することが可能である。Thus, according to the above-mentioned pretreatment method,
The noble metal can be deposited only in the laser irradiation region of the molded product, and if electroless plating is performed thereafter, the electroless plating film can be formed only in this region.
【００２３】なお、前記高分子材料は、レーザアブレー
ション閾値の異なる２種以上の樹脂とすると、レーザ照
射領域の凹凸をさらに大きくすることができ、めっきを
より一層剥離しにくい状態で形成することが可能とな
る。When the polymer material is made of two or more kinds of resins having different laser ablation thresholds, the unevenness of the laser irradiation region can be further increased, and the plating can be formed in a state in which it is more difficult to peel off. It will be possible.
【００２４】[0024]
【実施例】以下、本発明に係る無電解めっきの前処理方
法を、実施例によりさらに詳細に説明する。EXAMPLES Hereinafter, the pretreatment method for electroless plating according to the present invention will be described in more detail with reference to Examples.
【００２５】（実施例１） 高分子材料としてＬＣＰを
使用し、これに、無機フィラーとして、直径φ１０μｍ
のガラスフィラーを３０重量％添加した。そして、この
材料を射出成形し、得られた成形品の表面に、ＫｒＦエ
キシマレーザを用いることにより、フルーエンス０．２
Ｊ／ｃｍ2／１パルス、照射回数２００パルス、繰り返
し周波数５０Ｈｚの条件でレーザを照射した。続いて、
前記成形品を、塩化パラジウム、塩化ナトリウム、ポリ
エチレングリコール・モノ・Ｐ・ノニルフェニルエーテ
ル、ホウ素化フッ化ナトリウムを混合したパラジウムコ
ロイド溶液に１５分間浸漬した。その後、前記成形品を
軽くイオン交換水で洗浄し、無電解ニッケル液に１５分
間浸漬した。これにより、レーザ照射領域に、ニッケル
無電解めっきを付着させることができた。なお、無機フ
ィラーを添加しないＬＣＰでは、前記同条件の処理では
めっきを得ることができなかった。Example 1 LCP was used as a polymer material, and an inorganic filler having a diameter of 10 μm was used.
30% by weight of the above glass filler was added. Then, this material was injection-molded, and a KrF excimer laser was used on the surface of the obtained molded product to obtain a fluence of 0.2.
J / cm 2/1 pulse was irradiated with laser at conditions of irradiation frequency 200 pulse repetition frequency 50 Hz. continue,
The molded product was immersed for 15 minutes in a palladium colloid solution in which palladium chloride, sodium chloride, polyethylene glycol mono-P.nonylphenyl ether, and sodium boride fluoride were mixed. Then, the molded product was lightly washed with ion-exchanged water and immersed in an electroless nickel solution for 15 minutes. As a result, nickel electroless plating could be attached to the laser irradiation area. In addition, in LCP which did not add an inorganic filler, plating could not be obtained by the process of the said conditions.
【００２６】（実施例２） 高分子材料としてＰＥＳを
使用し、これに、無機フィラーとして、直径φ１０μｍ
のガラスフィラーを３０重量％添加した。以下、前記実
施例１と同条件で処理することにより、レーザ照射領域
に、ニッケル無電解めっきを付着させることができた。
なお、無機フィラーを添加しないＰＥＳでは、前記同条
件の処理ではめっきを得ることができなかった。Example 2 PES was used as the polymer material, and the diameter of the PES was 10 μm as the inorganic filler.
30% by weight of the above glass filler was added. The nickel electroless plating could be adhered to the laser irradiation region by performing the treatment under the same conditions as in Example 1 below.
In addition, with PES to which no inorganic filler was added, plating could not be obtained by the treatment under the same conditions.
【００２７】（実施例３） 高分子材料としてＰＣを使
用し、これに、無機フィラーとして、直径φ１０μｍの
ガラスフィラーを３０重量％添加した。そして、この材
料を射出成形し、得られた成形品の表面に、ＫｒＦエキ
シマレーザを用いることにより、フルーエンス０．４Ｊ
／ｃｍ2／１パルス、照射回数１０００パルス、繰り返
し周波数５０Ｈｚの条件でレーザを照射した。続いて、
前記成形品を、前記実施例１と同様なパラジウムコロイ
ド溶液に３０分間浸漬した。その後、前記成形品を軽く
イオン交換水で洗浄し、無電解ニッケル液に３０分間浸
漬した。これにより、レーザ照射領域に、ニッケル無電
解めっきを付着させることができた。Example 3 PC was used as the polymer material, to which 30% by weight of a glass filler having a diameter of 10 μm was added as an inorganic filler. Then, this material is injection-molded, and a KrF excimer laser is used on the surface of the obtained molded product to obtain a fluence of 0.4 J
/ Cm 2/1 pulse was irradiated with laser under the conditions of irradiation frequency 1000 pulse, repetition frequency 50 Hz. continue,
The molded product was immersed in the same palladium colloid solution as in Example 1 for 30 minutes. Then, the molded product was lightly washed with ion-exchanged water and immersed in an electroless nickel solution for 30 minutes. As a result, nickel electroless plating could be attached to the laser irradiation area.
【００２８】（実施例４） 高分子材料としてＬＣＰを
使用し、これに、無機フィラーとして、直径φ１０μｍ
のガラスフィラーを３０重量％添加した。そして、この
材料を射出成形し、得られた成形品の表面に、ＹＡＧ第
３高調波レーザを用いることにより、フルーエンス０．
５Ｊ／ｃｍ2／１パルス、照射回数２００パルス、繰り
返し周波数１０Ｈｚの条件でレーザを照射した。続い
て、前記成形品を、前記実施例１と同様なパラジウムコ
ロイド溶液に１５分間浸漬した。その後、前記成形品を
軽くイオン交換水で洗浄し、無電解ニッケル液に１５分
間浸漬した。これにより、レーザ照射領域に、ニッケル
無電解めっきを付着させることができた。なお、無機フ
ィラーを添加しないＬＣＰでは、前記同条件の処理では
めっきを得ることができなかった。Example 4 LCP was used as a polymer material, and an inorganic filler having a diameter of 10 μm was used.
30% by weight of the above glass filler was added. Then, this material was injection-molded, and a YAG third harmonic laser was used on the surface of the obtained molded product to obtain a fluence of 0.
5J / cm 2/1 pulse was irradiated with laser at conditions of irradiation frequency 200 pulse, repetition frequency 10 Hz. Subsequently, the molded product was immersed in the same palladium colloid solution as in Example 1 for 15 minutes. Then, the molded product was lightly washed with ion-exchanged water and immersed in an electroless nickel solution for 15 minutes. As a result, nickel electroless plating could be attached to the laser irradiation area. In addition, in LCP which did not add an inorganic filler, plating could not be obtained by the process of the said conditions.
【００２９】[0029]
【発明の効果】以上の説明から明らかなように、本発明
に係る無電解めっきの前処理方法によれば、高分子材料
に無機フィラーを添加し、得られた高分子成形品にレー
ザを照射するようにしたので、発生する帯電したデブリ
ーの飛散範囲をレーザ照射領域のみに制限することが可
能となる。したがって、陰イオン性の貴金属水溶液に浸
漬すると、レーザ照射領域のみに貴金属が析出し、この
貴金属を触媒としてレーザ照射領域にのみに無電解めっ
き膜を形成することが可能となる。As is apparent from the above description, according to the pretreatment method for electroless plating according to the present invention, an inorganic filler is added to a polymer material, and the obtained polymer molded product is irradiated with laser. By doing so, it becomes possible to limit the scattering range of the generated charged debris to only the laser irradiation region. Therefore, when immersed in an aqueous solution of anionic noble metal, the noble metal precipitates only in the laser irradiation region, and it becomes possible to form the electroless plated film only in the laser irradiation region using this noble metal as a catalyst.
【図１】 フルーエンスと照射回数の違いによる照射領
域の状態を示すグラフである。FIG. 1 is a graph showing a state of an irradiation area depending on a difference between fluence and the number of times of irradiation.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 廣野 聡 京都府京都市右京区花園土堂町10番地 オムロン株式会社内 (72)発明者 新納 弘之 茨城県つくば市東１−１ 工業技術院物 質工学工業技術研究所内 (72)発明者 矢部 明 茨城県つくば市東１−１ 工業技術院物 質工学工業技術研究所内 (56)参考文献 特開 昭61−127867（ＪＰ，Ａ) 特開 昭60−149783（ＪＰ，Ａ) 特開2000−212756（ＪＰ，Ａ) 特開 平４−183873（ＪＰ，Ａ) 特開 平３−215675（ＪＰ，Ａ) 特開 昭63−137176（ＪＰ，Ａ) 特開 昭62−142785（ＪＰ，Ａ) 特開 平２−294485（ＪＰ，Ａ) 特開 平６−256548（ＪＰ，Ａ) 特開 平６−235169（ＪＰ，Ａ) 特開 平８−253869（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 18/20 C23C 18/42 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Satoshi Hirono, Satoshi Hirono, 10 Hanazono Dodo-cho, Ukyo-ku, Kyoto City, Omron Co., Ltd. (72) Inventor Hiroyuki Shinno 1-1, Tsukuba City, Ibaraki Prefecture Industrial Technology Institute Industrial Technology Laboratory (72) Inventor Akira Yabe 1-1, East Tsukuba City, Ibaraki Institute of Industrial Technology Industrial Technology Laboratory (56) Reference JP 61-127867 (JP, A) JP 60-149783 (JP, A) JP 2000-212756 (JP, A) JP 4-183873 (JP, A) JP 3-215675 (JP, A) JP 63-137176 (JP, A) JP 62-142785 (JP, A) JP-A-2-294485 (JP, A) JP-A-6-256548 (JP, A) JP-A-6-235169 (JP, A) JP-A-8-253869 (JP , a) (58) investigated the field (Int.Cl. 7, D Name) C23C 18/20 C23C 18/42
Claims (8)
られた高分子成形品に波長が６００ｎｍ以下のレーザを
照射し、陰イオン性の貴金属水溶液に浸漬することを特
徴とする無電解めっきの前処理方法。1. Electroless plating comprising adding an inorganic filler to a polymer material, irradiating the obtained polymer molded product with a laser having a wavelength of 600 nm or less, and immersing the polymer product in an anionic precious metal aqueous solution. Pretreatment method.
加することを特徴とする請求項１に記載の無電解めっき
の前処理方法。2. The pretreatment method for electroless plating according to claim 1, wherein the inorganic filler is added in an amount of 10 to 50% by weight.
が１０〜５００J／ｃｍ2であることを特徴とする請求項
１又は２に記載の無電解めっきの前処理方法。3. The pretreatment method for electroless plating according to claim 1, wherein the total energy input by the laser is 10 to 500 J / cm 2 .
数が、貴金属を析出させるのに適した帯電状態となるよ
うに照射することを特徴とする請求項１ないし３のいず
れか１項に記載の無電解めっきの前処理方法。4. The laser according to claim 1, wherein the laser is irradiated so that the fluence and the number of times of irradiation are in a charged state suitable for depositing a noble metal. Pretreatment method for electrolytic plating.
ルスルホン、ポリブチレンテレフタレート、ポリカーボ
ネート、ポリフェニレンエーテル、ポリフェニレンオキ
サイド、ポリアセタール、ポリエチレンテレフタレー
ト、ポリアミド、ＡＢＳ、ポリフェニレンサルファイ
ド、ポリエーテルイミド、ポリエーテルエーテルケト
ン、ポリスルホン、ポリイミド、エポキシ樹脂、又は、
これらの複合樹脂であることを特徴とする請求項１ない
し４のいずれか１項に記載の無電解めっきの前処理方
法。5. The polymer material is LCP, polyether sulfone, polybutylene terephthalate, polycarbonate, polyphenylene ether, polyphenylene oxide, polyacetal, polyethylene terephthalate, polyamide, ABS, polyphenylene sulfide, polyetherimide, polyetheretherketone, Polysulfone, polyimide, epoxy resin, or
The pretreatment method for electroless plating according to any one of claims 1 to 4, which is a composite resin of these.
ン閾値の異なる２種以上の樹脂からなることを特徴とす
る請求項１ないし５のいずれか１項に記載の無電解めっ
きの前処理方法。6. The pretreatment method for electroless plating according to claim 1, wherein the polymer material is made of two or more kinds of resins having different laser ablation threshold values.
溶液を使用したことを特徴とする請求項１ないし６のい
ずれか１項に記載の無電解めっきの前処理方法。7. The pretreatment method for electroless plating according to claim 1, wherein an aqueous palladium solution is used as the noble metal aqueous solution.
ーを使用したことを特徴とする請求項１ないし７のいず
れか１項に記載の無電解めっきの前処理方法。8. The pretreatment method for electroless plating according to claim 1, wherein a glass filler is used as the inorganic filler.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01171099A JP3398713B2 (en) | 1999-01-20 | 1999-01-20 | Pretreatment method for electroless plating |
| PCT/JP2000/004491 WO2002004705A1 (en) | 1999-01-20 | 2000-07-06 | Method for preliminary treatment of material to be subjected to electroless plating |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01171099A JP3398713B2 (en) | 1999-01-20 | 1999-01-20 | Pretreatment method for electroless plating |
| PCT/JP2000/004491 WO2002004705A1 (en) | 1999-01-20 | 2000-07-06 | Method for preliminary treatment of material to be subjected to electroless plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000212755A JP2000212755A (en) | 2000-08-02 |
| JP3398713B2 true JP3398713B2 (en) | 2003-04-21 |
Family
ID=26344914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01171099A Expired - Lifetime JP3398713B2 (en) | 1999-01-20 | 1999-01-20 | Pretreatment method for electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3398713B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000212756A (en) * | 1999-01-20 | 2000-08-02 | Agency Of Ind Science & Technol | Pretreating method of electroless plating |
| JP2000212757A (en) * | 1999-01-20 | 2000-08-02 | Agency Of Ind Science & Technol | Method for deposition of palladium catalyst |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3541931B2 (en) * | 1999-05-17 | 2004-07-14 | 富士ゼロックス株式会社 | Electrodeposition film forming method, electrode forming method and electrodeposition film forming apparatus |
| JP3399434B2 (en) * | 2001-03-02 | 2003-04-21 | オムロン株式会社 | Method for forming plating of polymer molding material, circuit forming part, and method for manufacturing this circuit forming part |
| JP4367623B2 (en) * | 2004-01-14 | 2009-11-18 | 住友電気工業株式会社 | Method for producing electrical circuit component made of porous stretched polytetrafluoroethylene sheet or porous stretched polytetrafluoroethylene film, and electrical circuit component |
-
1999
- 1999-01-20 JP JP01171099A patent/JP3398713B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000212756A (en) * | 1999-01-20 | 2000-08-02 | Agency Of Ind Science & Technol | Pretreating method of electroless plating |
| JP2000212757A (en) * | 1999-01-20 | 2000-08-02 | Agency Of Ind Science & Technol | Method for deposition of palladium catalyst |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000212755A (en) | 2000-08-02 |
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