JP3387412B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus such as a die bonding apparatus and an electronic component mounting method.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, a cam mechanism having a cam and a cam follower and a transmission mechanism such as a link mechanism for transmitting the movement of the cam mechanism to a suction tool are used to control the lifting and lowering operation of the suction tool. By using a transmission system utilizing such a cam mechanism, a plurality of operations can be performed simultaneously on a plurality of suction tools with the same drive source, for example, lifting and lowering operations for picking up and mounting electronic components, and electronic components. There is an advantage that the raising and lowering operations for applying the adhesive can be synchronized with each other and can be surely performed at high speed.

[0003]

By the way, as a method of applying an adhesive for mounting an electronic component, the entire surface of the electronic component to which the adhesive is to be applied is coated, and a few points within the range of the adhesive surface are coated. There is a multi-point application in which the adhesive is only partially applied to. The entire surface application is applied to mounting a small electronic component, and a method of landing the electronic component on an adhesive applied on a flat surface and transferring the adhesive to a surface to be adhered is widely used. In this case, it is sufficient to perform only one elevating operation for landing the electronic component on the adhesive as the coating operation. Therefore, the pick-up and mounting operations of the electronic component and the coating operation are completely synchronized to perform the same drive. The aforementioned cam mechanism driven by a source can be used.

However, multi-point coating is performed on large-sized electronic components in order to secure an appropriate coating amount. In this case, the same electronic component requires a plurality of raising and lowering operations for raising and lowering the dispenser at each coating point position in the coating operation, and therefore cannot be synchronized with the picking up and mounting operations of the electronic component. For this reason, when the conventional electronic component mounting apparatus is made to perform the above-described multi-point coating operation, the head provided with the suction tool is provided with a single vertical movement mechanism.

However, in the system in which the head is moved up and down independently, it is not possible to use the cam drive mechanism which has many advantages as described above, and it is not necessary to make this electronic component mounting apparatus perform multi-point coating. Even when used for electronic components, the vertical movement mechanism provided on the head causes the mounting operation, which unnecessarily lengthens the mounting takt time and lowers productivity. .

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method which have high productivity and can handle a wide variety of electronic components.

[0007]

According to another aspect of the present invention, there is provided an electronic component mounting apparatus including a positioning means for horizontally moving and positioning a substrate, a reciprocating body reciprocating by a first cam mechanism, and the reciprocating body. first a transmission mechanism, a second transmission mechanism for converting the reciprocating motion of the reciprocating member to lift operation in the electronic component supply position, said electrons to convert the reciprocating motion to the lifting operation in the electronic component mounting position Component mounting position and
In the child component supply position, the first conduction mechanism and the second conduction mechanism.
A transfer head having a suction tool of an electronic component to a lifting operation by the powertrain, in the electronic component mounting position
An application head including a dispenser that moves up and down by the first transmission mechanism to apply the adhesive to the substrate, and the transfer head and the application head are located at the electronic component mounting position and the front side.
The transfer head is moved forward by reciprocating horizontally provided at a distance equal to the distance between the electronic component supply positions.
Stop at the electronic component mounting position and the electronic component supply position.
And stop the coating head at the electronic component mounting position.
The moving block and the coating head are the electronic components.
When stopped at the mounting position, the
Make the dispenser move up and down several times
By the second cam mechanism for moving up and down and the second cam mechanism,
With a contact and separation <br/> hand stage to separate the transfer movement between the said and the reciprocal moving body of the first conduction mechanism prior to vertical movement first transmission mechanism I.

According to a second aspect of the present invention, there is provided an electronic component mounting method, wherein a dispenser is moved up and down to apply a bonding agent to a horizontally positioned substrate, and the substrate is coated with the bonding agent. A method of mounting an electronic component by mounting and mounting the electronic component by causing a transfer head that picks up the electronic component from a supply unit of the electronic component to pick up and move the electronic component. When applying a single point of adhesive, the first cam mechanism causes the transfer head to move up and down at the electronic component supply position and the transfer head and the dispenser to move up and down at the electronic component mounting position. When performing multi-point application of adhesive for a single mounting operation, the first cam mechanism drives the raising / lowering operation of the transfer head at the electronic component supply position, and Disconnect the moving means of the transmission from the first cam mechanism to the component mounting position, and to drive the vertical movement of the transfer head and the dispenser in an electronic component mounting position by the second cam mechanism.

According to the invention described in each claim, when the one-point application of the adhesive is carried out, the first cam mechanism moves up and down the transfer head at the electronic component supply position and at the electronic component mounting position. When the transfer head and the dispenser are moved up and down to perform multi-point application of adhesive, the first cam mechanism drives the transfer head up and down at the electronic component supply position, and The transmission from the first cam mechanism to the electronic component mounting position is separated by the contacting / separating means, and the second cam mechanism drives the ascending / descending operation of the transfer head and the dispenser at the electronic component mounting position. Multi-point coating can be performed using the mechanism.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. In this embodiment, the die bonding apparatus will be described, but the present invention can be applied to other types of electronic component mounting apparatuses as they are.

FIG. 1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are operation explanatory diagrams of the electronic component mounting apparatus. In FIG. 1, a substrate 2 is placed on a movable table 1. Movable table 1
By driving, the substrate 2 is moved in the horizontal direction and the position is adjusted. Therefore, the movable table 1 serves as a positioning means for the substrate 2. A supply unit 3 for electronic components is arranged on the side of the movable table 1, and a wafer 4 on which electronic components P are arranged in a matrix is placed on the supply unit 3.

A moving block 5 is arranged above the movable table 1 and the supply unit 3. Moving block 5
Is reciprocated in the direction of arrow N by moving means (not shown). On the front surface of the moving block 5, a coating head 6 provided with a dispenser 7 and a transfer head 8 provided with a suction tool 9 are separated from each other by a center position which is approximately equal to the distance between the electronic component mounting position and the electronic component supplying position. And are provided. Vertical rods 10 and 11 are vertically movably supported at the centers of the coating head 6 and the transfer head 8, respectively, and the rods 10 and 11 are urged upward by a spring S. The rollers 12 and 13 are pivotally supported on the upper ends of the rods 10 and 11, respectively.

Next, the first cam mechanism A will be described. The rotational force of the motor 20 is transmitted to the eccentric cam 24 via the pulley 21, the timing belt 22, and the pulley 23. A cam follower 25 is in contact with the peripheral surface of the cam 24. And for the cam follower 25,
A frame 26 (reciprocating body) whose fork is divided into two halves is rigidly connected, and at the tip of the frame 26 which is divided into two,
An electromagnet 27 as a first contact / separation unit and an electromagnet 28 as a second contact / separation unit are independently fixed. Reference numeral 29 is a control unit that controls the motor 20 and the electromagnets 27 and 28.

The moving block 5 reciprocates in the direction of the arrow N1 so that the rods 10 and 11 can be stopped at two stop positions (these are electronic component mounting positions above the substrate 17 and the wafer 18). A first transmission mechanism 31 and a second transmission mechanism 32 are provided at the upper electronic component supply position).

Next, the structure and operation of the first transmission mechanism 31 will be described with reference to FIGS. 2 and 3 because the second transmission mechanism 32 is the same as the first transmission mechanism 31 and the description thereof is omitted. To do.

In FIG. 2, reference numeral 33 denotes a link swingable in the direction of arrow M about a shaft 34, the lower surface of the horizontal portion of which is in contact with the upper end portion of the roller 12, and the vertical portion of which is a return position by a spring 35. (The position where the vertical part faces vertically upward)
Is urged to.

A pivot portion 36 is provided at the upper end of the vertical portion, and a left end portion of a horizontal plate 37 is attached to the pivot portion 36. The magnetic plate 38 (magnetic body) that contacts the electromagnet 27 is fixed to the plate 39.

When the idling operation in which the drive of the cam mechanism A is not transmitted to the first transmission mechanism 31 should be performed, the control unit 29 does not excite the electromagnet 27. Therefore, as shown by the chain line in FIG. 2, even if the cam follower 25 and the electromagnet 27 move in the direction of the arrow N2, the magnetic plate 38 remains stopped without adding it, and the rod 10 does not move up and down. That is, the first transmission mechanism 31 is completely separated from the cam mechanism A.

On the other hand, when the normal operation should be performed, the control unit 29 excites the electromagnet 27. Therefore, the magnetic plate 38 that is in contact with the electromagnet 27 in the original state is
And move at exactly the same speed V1. as a result,
The velocity V1 determined by the cam curve is reflected as it is, and the rod 10 faithfully descends by the distance t.

Further, when switching from the above-mentioned idling operation to the normal operation, as is apparent by comparing the solid line position of FIG. 2 and the chain line position of FIG. 3, the electromagnet 27 and the magnetic plate 38 come into contact with each other, No relative mechanical operation is performed, and the electromagnet 27 is simply switched from non-excitation to excitation. Therefore, at the time of this switching, an extra additional component is added to the rod 24.
It is not included in the ascending / descending operation of the cam and can be operated faithfully according to the cam curve.

Next, the second cam mechanism B used for driving the ascending / descending operation at the electronic component mounting position will be described. In FIG. 1, the rotational force of the motor 40 is transmitted to the eccentric cam 44 via the pulley 41, the timing belt 42, and the pulley 43. Then, as shown in FIG.
A cam follower 45 pivotally supported by a vertical rod 46 is in circumferential contact with the peripheral surface of the. The rod 46 is supported by a bearing 47 so as to be vertically movable, and the lower end portion of the rod 46 is in contact with the upper surface of the link 33. By driving the motor 40, the rod 46 moves up and down along the cam curve of the cam 44, and pushes the link 33 downward during the lowering operation. At this time, if the electromagnet 27 is in the non-excited state, the first transmission mechanism can be driven to perform the raising / lowering operation in a state of being completely separated from the first cam mechanism A.

This electronic component mounting apparatus is configured as described above, and its operation will be described below. First,
A mounting operation in the case of applying a single-size application of a normal-sized electronic component, that is, an adhesive will be described. In FIG. 1, the electromagnets 27 and 28 are excited, that is, the first cam mechanism A is used to raise and lower both the coating head 6 and the transfer head 8. Both the coating head 6 and the transfer head 8 are lowered, and the substrate 2 is discharged by the dispenser 7.
Apply adhesive to. At the same time, the electronic component P on the wafer 4 is vacuum-sucked and picked up by the suction tool 9. Next, the moving block 5 is moved in the horizontal direction to position the transfer head 8 holding the electronic component P on the substrate 2 which is the electronic component mounting position, and the first cam mechanism A lowers the transfer head 8. The electronic component P held by the suction tool 9 is mounted on the mounting position of the substrate 2 where the adhesive is applied. By repeating the coating operation and the mounting operation, the mounting of the electronic component P on the substrate 2 is completed.

Next, the operation when the size of the electronic component is large and multi-point application of the adhesive is required will be described.
At this time, the electromagnet 27 is kept in a non-excited state, that is, the drive of the first cam mechanism A is not transmitted by the first transmission mechanism 31. First, regarding the operation of picking up the electronic component P by the transfer head 8, as in the case of mounting the normal electronic component, the second cam mechanism A
The transfer head 8 is moved up and down through the power transmission mechanism. On the other hand, the lifting operation of the coating head 6 is performed by driving the second cam mechanism B. Then, the movable table 2 is driven to operate the dispenser 7 while positioning the substrate 2 to perform multi-point coating on a plurality of predetermined coating points. And when the application is finished. The moving block 5 is moved to position the transfer head 8 on the coating point of the substrate 2. Next, the first cam mechanism B
The transfer head 8 is lowered via the power transmission mechanism 31 and the electronic component P held by the suction tool is mounted on the substrate 2.

As described above, even when the adhesive application form varies depending on the type of electronic component, the required operation can be switched by simply turning the electromagnet 27 on and off.
This enables high-speed mounting with a cam mechanism for a wide variety of electronic components, and it is possible to handle electronic components of a variety that require multi-point coating without complicated product switching work. it can. Therefore,
It is possible to increase the equipment cost by equipping it with a dedicated electronic component mounting device, and to avoid the decrease in productivity due to the application of multi-point coating equipment to other types that do not require multi-point coating. It is possible to realize highly productive electronic component mounting with high equipment cost.

[0025]

According to the present invention, when mounting a normal electronic component, a normal high-speed mounting operation is performed by the first cam mechanism, and a mounting of an electronic component that requires multi-point application of an adhesive agent is performed. In this case, the transmission from the first cam mechanism to the electronic component mounting position is separated by the contacting / separating means, and the multi-point coating operation at the electronic component mounting position is performed by the second cam mechanism. This enables high-speed mounting with a cam mechanism for a wide variety of electronic components, and it is possible to deal with electronic components of a variety that require multi-point coating without complicated product switching work. Therefore, highly productive electronic component mounting can be realized at a low equipment cost.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is an operation explanatory diagram of the electronic component mounting apparatus according to the embodiment of the present invention.

[Explanation of symbols]

1 movable table 2 substrates 3 supply departments 6 Application head 7 dispensers 8 Transfer head 9 Suction tool 27,28 Electromagnet 31 First transmission mechanism 32 Second transmission mechanism A first cam mechanism B Second cam mechanism P electronic parts

Claims (2)

(57) [Claims] 1. A positioning means for positioning by moving the substrate in a horizontal direction, and the reciprocating member reciprocates by a first cam mechanism, the electronic component actual reciprocating motion of said reciprocating member
A first transmission mechanism for converting to a lifting operation at a mounting position ; a second transmission mechanism for converting the reciprocating motion of the reciprocating body into a lifting operation at an electronic component supply position; and an electronic component mounting position.
In front of the first conduction mechanism at the electronic component supply position
A transfer head having a suction tool of an electronic component to a lifting operation by serial second transfer mechanism, the electronic component mounting position
And a coating head including a dispenser that moves up and down by the first transmission mechanism to coat the substrate with adhesive.
The transfer head and the coating head are mounted on the electronic component.
And a transfer head by reciprocating in the horizontal direction with a distance equal to the distance between the mounting position and the electronic component supply position.
Stop at the electronic component mounting position and the electronic component supply position.
The application head to the electronic component mounting position.
The moving block to be stopped and the coating head are
The first conduction mechanism when stopped at the component mounting position
The dispenser multiple times to raise and lower.
A second cam mechanism that moves up and down several times, and the second cam mechanism
An electronic component mounting, characterized in that it comprises a <br/> SeHHanarete stage to separate the transfer movement between the said first conduction mechanism and the reciprocating body prior to vertical movement first transmission mechanism by apparatus. 2. A dispenser is vertically moved to a substrate positioned in a horizontal direction to apply an adhesive, and an electronic component is supplied from the electronic component supply unit to the substrate coated with the adhesive. A method of mounting an electronic component by mounting and mounting the electronic component by causing a transfer head picked up by suction to move up and down, in the case of performing one-point application of an adhesive for a single mounting operation. , The first cam mechanism causes the transfer head to move up and down at the electronic component supply position and the transfer head and the dispenser to move up and down at the electronic component mounting position, and When performing multi-point coating, the first cam mechanism drives the raising / lowering operation of the transfer head at the electronic component supply position, and the second cam mechanism drives the electronic component mounting position. Mounting method of electronic components and drives the lifting operation of the placing head and the dispenser.