JP3379868B2 - Manufacturing method of chip saw - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [0001] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cutting steel plates and steel pipes.
Especially for the durability of the tip saw used for
It relates to an improved tip saw. [0002] 2. Description of the Related Art As shown in FIG.
A circular disc-shaped circular saw is used. As this circular saw
Is a tip saw 2 in which a carbide tip 1 is brazed to the cutting edge.
It is commonly used. This tip saw 2 is shown in FIG.
As described above, the flank wear amount 3 of the carbide tip 1 increases.
And the cutting resistance increases, so the service life (lifetime) will be limited.
If this life is short, the replacement frequency increases and the work efficiency decreases.
Therefore, it is preferable that the life is as long as possible. [0003] Problems to be Solved by the Invention Such steel plates and steel pipes
The life of the tip saw is determined by the amount of tip wear and chip
Depends on the occurrence of chipping at the tip of the
Increasing the hardness of the chip in an attempt to improve
This causes a problem that the chip is easily lost. The present invention addresses these disadvantages of the prior art.
It was devised to be resolved,The present inventionThe purpose of
Increases wear resistance and reduces the risk of chipping
Improved long-lasting tipso-Efficient manufacturing
It is to provide a manufacturing method. [0005] SUMMARY OF THE INVENTION Such an object is achieved by the present invention.
According to Ming,bladeSurface of carbide tip to be brazed first
One of Ti, Al, Hf and Zr
Or carbides, nitrides, or carbonitrides containing two or more
With a film thickness of 1 μm or more and 10 μm or less
In the method of manufacturing a chip saw for forming a
Using a plating method, set the substrate temperature to 100 ° C or higher4
Set below 00 ° C and ion density on substrate surface
3 A / m for 10 seconds or more and 15 minutes or less at the beginning of film formation²that's all
5A / m²Hereinafter, 1 A / m²3A / m or more²Less than
A tip saw made by adjusting the film thickness below
This is achieved by providing a fabrication method. [0006] DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below.
I do. [0007] The life of the tip saw is
Is determined by the wear of the tip and the chip tip loss.
Increasing the hardness to achieve the top results in loss of toughness at the expense of toughness
Is more likely to occur. Therefore, the toughness of the carbide chip
The ceramic coating on the surface for wear resistance.
To improve it. Carbide chip substrate and
The Vickers hardness is 800 to 1600 Hv (load
50 g) and the transverse rupture strength as an index of toughness is 1 to 4 GPin a
Certain sintered alloy is suitable, WC carbide containing 10% Co
Use alloy. [0008] Even if the hardness is high, adhesion to steel may occur.
Wear resistance decreases, so it is difficult to cause adhesion with steel
It is important to choose a film. Therefore, Ti, Al, H
f, Zr carbide, nitride or carbonitride
Lamix coating on the surface of carbide tips
I do. These ceramic films have high hardness and
It does not adhere easily and has excellent wear resistance. For example, TiC
N, TiAlCN, ZrC, HfC are Vickers hardness
At 2500 to 4000, 2000 to 2700, respectively.
2600-2800, 2600-3200, carbide
High hardness compared to 800-1200 chip base
It is. When the hardness is 1600 or more, in particular,
Excellent wear resistance to steel. Further, if the thickness of the film is less than 1 μm,
When the abrasion resistance is not enough and it is thicker than 10 μm,
This can cause problems such as film peeling as well as
From this, the thickness is set to 1 μm or more and 10 μm or less. In particular, to obtain a highly durable tip saw
It is preferable that the ceramic film has a three-layer structure
No. In other words, Tias well asNitriding of Ti
One or more of the main components
Inner layer and any one of Ti carbide and Ti carbonitride
Or an intermediate layer mainly composed of one or two or more kinds;
One of nitrides of Ti and carbonitrides of Ti
Is to sequentially laminate two or more types of outer layers
I do. First, ensure sufficient adhesion between the film and the substrate
In order to achieve this, Ti and / or Ti
It is effective to apply a compound. This is because carbon in the film
Contains poor adhesion to steel-based substrates
It depends. Then, in order to increase the hardness of the film, T
Forming an intermediate layer made of carbide and / or carbonitride of i
I do. When the carbon content in the film is increased in this way,
The coating can be hardened. And in the outer layer,
Chemically stable properties such as corrosion resistance and oxidation resistance are required
Because of this, nitride of Ti and / or carbonitriding of Ti
Things are appropriate. In addition, it is necessary to make a multilayer film like this.
To prevent coarsening of crystal grains in the film and to maintain defect continuity.
Benefits such as improved durability.
You. By the way, toughness should be ensured as described above.
With a carbide tip, its bending strength is a problem.
The transverse strength depends on the residual stress of the film. This skin
The residual stress of the film is 0.5GP4G or morePCompression below a
It is desirable to make it stress. Do this
And, the bending strength of the coated carbide tip increases,
The chip resistance of the carbide tip can be improved. 0.
5GPWith compressive stress less than a
Not conversely, 4GPAt compressive stress exceeding a, film peeling
Is likely to occur, which is not preferable. On the other hand, in tensile stress
It is not suitable because it lowers the bending strength. Actually, the film thickness is 5.2 μm.
1.5G at mPThe TiC film having the compressive stress a
15% increase in transverse rupture strength of cemented carbide
Was seen. Thus, the compressive stress remains in the film.
In order to reduce the temperature of the substrate to 400 ° C or less,
Is effective. Residual stress in the film (internal stres
s) is, as shown in FIG.
Stress that occurs when a trapped atom attempts to return to a stable position,
In other words, intrinsic stress, substrate and film
Stress caused by the difference in thermal expansion coefficient between
It is the sum of thermal stress and thermal stress.
In low-temperature film forming such as filming, the contribution of thermal stress is small,
Influence of intrinsic stress is large. Therefore, film formation at low temperature
The higher the compressive residual stress, the lower the substrate temperature
, The compressive stress becomes remarkably high and the film is easily peeled.
You. For example, at 200 ° C., T
When iN is formed in a thickness of 3 μm, the intrinsic stress is 2.7 GPa,
Thermal stress is 0.8GPa in the film which is the sum of
Residual stress is 3.5GPa. On the other hand, when the substrate temperature is 5
When the film is formed at 00 ° C., the intrinsic stress is 0.2 GP
a, Thermal stress is 2.2GPa, the residual stress in the film is 2.4
GPa, and the intrinsic stress is low. The measurement of the residual stress is performed by an X-ray stress measurement method as follows:
2θ-sin²と method and the method to obtain from the deformation amount of the substrate
(The measurement method is described in the following literature, for example.)
R: Norihide Nishida, Mitsumasa Okada, Kazuo Honda, Hitoshi Kawasaki, Satoshi Hosokawa
Raw / Surface Technology, vol. 40, No. 2, (1989), p. 332). Base
When obtaining from the deformation of the plate, the thickness of the substrate is 0.3 mm
Before and after film formation using a SUS304 disk with a diameter of 30 mm
Of the substrate was measured by a surface roughness meter. [0016] Carbides and nitrides of Ti, Al, Hf, Zr
Ceramics made of materials or carbonitrides
Displacement also uses plasma as a medium, metal vapor or metal vapor
Plating for ionizing gas and gas to form a film
Can be obtained by law. That is, as a metal evaporation source
1 × 10 for Ti, Al, Hf and Zr^-3Torr or less
Dissolved by an electron gun under high vacuum and evaporate it
Positive DC bias on the ionization electrode located above the source
Activated in a DC plasma generated by applying
Obtained. Negative DC bias during coating
Apply nitrogen gas and acetylene gas while applying
It is introduced near the substrate as a reactive gas. In addition, as a film forming method, other than the above, a thermal spraying method,
There are CVD method and sputtering method.
Is difficult to obtain a high-purity dense film of nitride and carbide,
In the CVD method, crystal grains become coarse due to high-temperature film formation, and
Or the tip saw is deformed by heat,
It is difficult to obtain a thick film with adhesion
is there. The adhesion of the film is determined, for example, by using LEVETES
T scratch tester (for details, see, for example,
Published by Takahiro Yamaguchi / Material Testing Technology, Vol.32, No.3, (198
2) The critical peeling load value measured in p.229.) Is 20N or more.
It is desirable that This scratch tester
Diamond indenter scratching the membrane and attached to it
Consists of an AE (acoustic emission) sensor
You. The indenter is a Rockwell C type conical diamond
Yes, the radius of the tip of the indenter is 0.2mm, the apex angle is 120 °
is there. The load speed is 100 N / min and the sample feed speed is
It was 10 mm / min. To obtain a homogeneous film, the tip saw is evaporated.
And place it directly on the line connecting the evaporation source and the center of the tip saw.
It is desirable that the film be formed by rotating about an intersecting axis.
If the film surface roughness is also about 10 μm, it is almost the same as the substrate
Since the film can be formed to a roughness, there is no need for repolishing,
It is easy to form a film. The temperature of the tip saw during film formation depends on the temperature.
To avoid deformation, use normal ion plating (substrate
It is necessary to form the film at a lower temperature than
In low-temperature film formation, improvement is necessary due to poor film adhesion.
You. The method will be described below. First, the temperature of the tip saw during film formation is 10
The temperature is set to 0 ° C or more and 400 ° C or less. If it exceeds 400 ° C, 1
Deformation due to temperature of tip saw due to holding for about time
Surface runout of 2 / 100mm or more
The service life is significantly deteriorated. Meanwhile, the temperature of the tip saw
If the temperature is lower than 100 ° C., a hard film with adhesiveness cannot be formed.
Absent. Coating at such a low substrate temperature
Increases the compressive residual stress in the coating as described above,
It is also effective in increasing the bending strength of hard alloys,
In plating, the lower the substrate temperature, the closer the coating
Poor nature. In order to improve the adhesion of this film, a superhard
Ion impact of 0.01 μm to 0.1 μm on the alloy surface
A ceramic layer is formed after forming a reaction layer by impact
It is effective to do. Reaction layer by this ion bombardment
Can be observed with a transmission electron microscope and many lattice defects
Depressions are observed at high density. Actually, the deposition temperature of the substrate is set to 2
When a 2 μm TiN film is formed at 00 ° C.,
Critical peeling load value is 11N without reaction layer due to impact
Although it does not reach the level (20N), it is shown in FIG.
The reaction layer was observed by the ion bombardment of 0.05 μm.
Sample showed a critical peeling load value of 25N,
Has been greatly improved. The reaction layer due to the ion bombardment is formed at the initial stage of film formation.
Impact by applying high bias to the substrate
Is obtained. At this time, the ion density on the substrate
3A / m within 15 minutes²5A / m or more²The following is assumed.
Ion bombardment for more than 15 minutes or 5A / m²Yo
For higher ion densities, the substrate temperature above 400 ° C
It is not preferable because it easily causes ascent. 3A / m²Not yet
At a full ion density, no reaction layer is formed. [0025] EXAMPLE As described above, the ion plating method was used.
Table 1 shows the properties of the films formed. Sample number 1-8
Are examples according to the present invention, and sample numbers 9 to 12 are
It is a comparative example using a product. The chemical composition of the film is G
Determined by DS (Glow Discharged Spectroscopy) method
Was. In the ion plating at this time, gold
Using Ti, Al, Hf, Zr as the evaporation source
After melting with a gun, it was activated in a DC plasma. reaction
Nitrogen and acetylene were used as the gas. Also,
During coating, a DC bias of 300 V
Apply pressure 4 × 10^-4Torr. For comparison of durability, a cemented carbide tip was added to the cutting edge by 50%.
Using a brazed tip saw, insert the tip
1 that could be cut until rank wear 3 became 0.5 mm in width
The cutting was performed with a cut area per sheet. This carbide tip
Attached at 15 ° angle and 8 ° clearance angle, the composition is WC7
2%, Co10%, TiC + TaC18%, Vicker
Hardness is 990 (50 g load). Size is outer diameter
It is 280 mm and 3.7 mm thick. Cutting conditions are peripheral speed
The speed was 200 m / min and the feed rate was 0.06 mm / blade.
The material to be cut 4 has an outer diameter of 340 mm, a thickness of 10 mm, and a strength.
(Ts) 0.71 Pa (70 kg / mm²) Hard oil well
Tube. [0028] [Table 1] As apparent from the comparison of the cut areas, the film
A ceramic coating with a thickness of 1 μm or more and 10 μm or less
More than twice as much as conventional products (comparative example)
It can be seen that the above durability can be obtained. Especially on the substrate surface
TiN, TiC_0.6N_0.4, TiN
The three-layer film structure (Sample No. 1) has the best properties
Have. Cutting without coating
The area is 0.7m²Per sheet. [0030] As described above, according to the present invention, the tip saw
Has a great effect on improving the durability of
Wear. That is, carbides of Ti, Al, Hf, and Zr, nitrides
Ceramic film made of carbide or carbonitride
High degree of adhesion, hardly adheres to steel, and excellent wear resistance.
These ceramic films are coated on the surface of a tough chip substrate.
To improve both wear resistance and fracture resistance
In addition, the durability of the tip saw is enhanced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial conceptual view of a tip saw to which the present invention is applied. FIG. 2 is a partially enlarged view of a carbide tip. FIG. 3 is a graph conceptually showing a relationship between a substrate temperature and a residual stress during film formation. FIG. 4 is a metallographic photograph by a transmission electron microscope showing a reaction layer due to ion bombardment at an interface between a carbide tip and a ceramic film. [Description of Signs] 1 Carbide tip 2 Tip saw 3 Flank wear 4 Material to be cut

Continuation of front page (56) References JP-A-6-126528 (JP, A) JP-A-5-38621 (JP, A) JP-A-8-1412 (JP, A) JP-A-5-285740 (JP) JP-A-63-65079 (JP, A) JP-A-3-32516 (JP, A) JP-A-6-316756 (JP, A) JP-B-6-74497 (JP, B2) (58) Field surveyed (Int. Cl. ⁷ , DB name) B23D 63/00 B23D 61/00 B23P 15/28

Claims (1)

(57) [Claims] [Claim 1] Table of carbide tips brazed to the cutting edge
Any one of Ti, Al, Hf and Zr
Or carbides, nitrides, or charcoals containing two or more
Ceramics with a film thickness of 1 μm or more and 10 μm or less made of nitride
In the method for manufacturing a chip saw for forming a coating film, a substrate temperature is set to 100 ° C. or lower by using an ion plating method.
Set to 400 ° C or lower and ion
Density is 3 A / m ² for 10 seconds or more and 15 minutes or less at the beginning of film formation.
Not less than 5 A / m ^{2 and not} more than 1 A / m ^{2 and not} less than 3 A / m ²
Tip saw characterized in that the film is formed by adjusting the thickness to ² or less.
Manufacturing method.