JP3363252B2 - Tape remover for printed circuit board stack - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board stack in which, for example, a plurality of printed circuit boards are superposed, a bottom plate is superposed on the bottom thereof, and an aluminum plate is superposed on the top thereof, and side edges thereof are fixed with adhesive tape. A device for automatically peeling and removing a tape.

[0002]

2. Description of the Related Art Generally, a printed circuit board is provided with through holes for inserting conductive wires of electronic components to be mounted, or for electrically connecting upper and lower surfaces of the printed circuit board and conductor patterns of respective layers. These through holes are usually drilled with NC drilling machines, but these through holes are
There are hundreds to thousands on a single printed circuit board. Therefore, in order to improve the efficiency of drilling of this through hole,
About 2 to 8 printed circuit boards are superposed, and through holes are simultaneously punched in these plural printed circuit boards.

To make such holes, a bottom plate such as a bakelite plate is placed at the bottom of the plurality of printed circuit boards so that the tip of the drill does not damage the bed of the drilling machine. Also, an aluminum plate with a thickness of about 0.15 to 0.2 mm is placed on the uppermost of these stacked printed circuit boards to prevent heat dissipation during drilling and swinging of the tip of the drill when starting drilling. Is configured to. Then, an adhesive tape is attached to the side edge portion of the stack of the bakelite plate, the printed circuit board and the aluminum plate stacked in this way to integrally bind them. In the present specification, what is thus stacked and bound is referred to as a printed circuit board stack, and an example of this printed circuit board stack 1 is shown in FIG. In FIG. 1, 2 is a bakelite plate, 3 is a printed circuit board, 4 is an aluminum plate,
Reference numeral 5 is an adhesive tape, and these adhesive tapes 5 are attached to the side edge portions of the Bakelite plate 2 and the aluminum plate 4 to bind them together. In an actual product, positioning holes are formed at both ends of the printed circuit board stack 1, and pins are inserted into these positioning holes to position the bakelite plate 2, the printed circuit board 3, and the aluminum plate 4. It is omitted in FIG. When punching a single printed board, it goes without saying that the above bakelite plate and aluminum plate are stacked on the upper and lower sides of this single printed board.

In such a printed circuit board stack 1, after the through holes are punched, the positioning pins are removed, the adhesive tape 5 is removed, and the printed circuit boards 3 are separated from each other and then washed. After the step, it is sent to the next step, for example, a copper plating step.

By the way, conventionally, the work of peeling and removing the adhesive tape 5 of the printed circuit board stack 1 which has been subjected to such a punching step has been performed manually. Therefore, the work was inefficient. In addition, recently, attempts have been made to automate the entire manufacturing process of this printed circuit board as much as possible. However, in the above-mentioned adhesive tape removing operation, the shape of the peeled tape is not constant, and the peeled adhesive tape has adhesiveness. It was difficult and I had to resort to manual work.

[0006]

SUMMARY OF THE INVENTION The present invention has been made based on the above circumstances, and the adhesive tape of a printed circuit board stack as described above is automatically removed and the peeled adhesive tape can be easily processed. A reliable and reliable adhesive tape removing device for a printed circuit board stack is provided.

[0007]

The device of the present invention comprises a cutting mechanism for cutting only the above-mentioned aluminum plate along the side edge to which the above-mentioned adhesive tape is attached, and aluminum plates on both sides of this cut portion. And a holding mechanism for holding the inverted aluminum plate, the cut and inverted aluminum plate and the printed circuit board stack are relatively moved in the plate thickness direction, The adhesive tape is provided with a tape stripping mechanism for stripping the adhesive tape from the side surface and the lower surface of the printed circuit board stack while one end portion of the adhesive tape is being adhered to the aluminum plate.

[0008]

By cutting the aluminum plate in the direction along the side edge by the above cutting mechanism, the aluminum plates on both sides of the cut portion are connected to the printed circuit board stack only through the adhesive tape on the side edge. Will be
The adhesive tape acts like a hinge to allow the cut aluminum plates to rotate laterally outward. Then, the cut aluminum plate is inverted by about 180 ° to the outside by the above-mentioned inversion mechanism. Next, the inverted aluminum plate is held by the holding mechanism.
Then, for example, when the printed circuit board stack is raised, the inverted aluminum plate and the printed circuit board stack are relatively moved in the plate thickness direction by the tape peeling mechanism. As a result, the adhesive tape is peeled off from the side surface and the lower surface of the printed circuit board stack. In this case, the adhesive tape is peeled while being inverted by about 360 ° with respect to the side surface of the printed circuit board stack, and is substantially orthogonal to the lower surface, that is, the adhesive surface while being inverted by about 90 ° with respect to the lower surface. To be peeled off. Therefore, the adhesive tape is easily peeled off, and the adhesive tape is not cut in the middle. Also, since one end of the adhesive tape remains adhered to the inverted aluminum plate, the peeled adhesive tape can be treated and discarded together with the cut aluminum plate. In addition, the peeled pressure-sensitive adhesive tape does not adhere to other members and a reliable operation can be performed, and the reliability is high.

[0009]

An embodiment of the present invention will be described below with reference to the drawings. The apparatus of this embodiment is an apparatus for removing the adhesive tape 5 of the printed circuit board stack 1 as shown in FIG. FIG. 2 shows an outline of this device. 11 in the figure
A supply mechanism of the printed circuit board stack 1, wherein a plurality of printed circuit board stacks 1 that are stacked are taken out one by one
It is placed on the roller conveyor on the upper surface. A cutting mechanism 12, a first removing mechanism 13, and a second removing mechanism 14 are sequentially arranged downstream of the supply mechanism 11 in the transport direction. A continuous roller conveyor is provided on the upper surfaces of these mechanisms, and the printed circuit board stack 1 supplied from the supply mechanism 11 is sequentially conveyed on these mechanisms. Incidentally, these mechanisms will be described in detail later.

Further, a separating mechanism 15 is provided on the downstream side of the second removing mechanism 14 and separates each of the printed circuit boards 3 of the printed circuit board stack 1 from which the adhesive tape 5 has been removed. Further, a cleaner mechanism 16 is further provided on the downstream side of the separating mechanism 15 to wash the separated printed circuit board 3. Further, a counter mechanism 17 is provided on the downstream side to count the printed circuit boards 3. Further, on this downstream side, a sorting mechanism (not shown) or other mechanism for removing the defective printed circuit board 3 is connected,
A line for performing a series of steps is configured.

Next, the cutting mechanism 12 will be described in detail with reference to FIGS. FIG. 3 is a plan view of this cutting mechanism. The arrow A in the figure indicates the conveyance direction of the printed circuit board stack 1. From the space between the rollers 20 of the roller conveyor of the cutting mechanism 12, a stopper 21 is provided so as to project and retract on the conveying surface, and is placed horizontally on the conveying surface of the roller conveyor and conveyed. The printed circuit board stack 1 comes into contact with the stopper 21 and stops at a predetermined position. Further, the cutting mechanism 12 is provided with a side stopper 22 and a width mechanism 23 as shown in FIG. The width-shifting mechanism 23 is provided with a width-shifting member 24 projecting between the rollers 20 and above the transport surface. Then, the width-direction mechanism 23 is used for the screw rod 2
It is configured to move in a direction orthogonal to the transport direction by rotation of 7. Therefore, the above stopper 2
The printed board stack 1 stopped at the predetermined position by 1 moves in the direction orthogonal to the transport direction by the movement of the width member 24, and the side stopper 2 described above.
It is sandwiched between 2 and the width member 24 and positioned at a predetermined position.

Further, upper stoppers 25 and 26 are provided at the upper ends of the side stopper 22 and the width-approaching member 24, and push-up cylinders 28 and 26 are provided on the sides of the side stopper 22 and the width-approaching mechanism 23. 29 are provided. The piston rods 30 and 31 of the push-up cylinders 28 and 29 extend to push the printed circuit board stack 1 upward, and the printed circuit board stack 1 abuts the upper stoppers 25 and 26 to move in the vertical direction. Is positioned.

Further, the cutting mechanism 12 is provided with a cutter mechanism 32 and a shearing mechanism 33, which cut only the aluminum plate 4 of the printed circuit board stack 1. FIG. 5 shows the details of the cutter mechanism 32. The cutter mechanism 32 includes a moving table 34, and the moving table 3
4 is guided by a guide rod 36 along the carrying direction, and is reciprocated in the carrying direction by a screw rod 35 that is rotationally driven, that is, along the side edge of the printed circuit board stack 1 on which the adhesive tape 5 is attached. To be done. A vertical position adjusting member 37 is provided on the moving base 34 so as to be movable in the vertical direction, and a vertical rotary cutter 38 having a V-shaped or single-edged thin edge is rotatable on the vertical position adjusting member 37. 39 is attached to. The vertical position of the vertical adjustment member 37, that is, the rotary cutter 38 is configured to be accurately adjusted by the micrometer 40.

In such a cutter mechanism 32, while the rotary cutter 38 is rotated while being pressed against the surface of the aluminum plate 4, the movable table 34 is moved in the carrying direction, as shown in FIG.
As shown in FIG. 5, the rotary cutter 38 forms a kerf G along the edge of the aluminum plate 4 of the printed board stack 1. In this case, the height of the rotary cutter 38 is accurately adjusted. For example, when the thickness of the aluminum plate 4 is 0.15 mm, it is 0.05 to 0.0.
A kerf having a depth of 8 mm is formed. As a result, the aluminum plate 4 is rotated by the rotary cutter 38.
Is completely cut and the printed circuit board 3 therebelow is prevented from being damaged. The distance S from the side edge of the printed circuit board stack 1 to the kerf G is preferably about 7 mm. In this case, it is preferable that the end portion of the adhesive tape 5 be attached within the range of 7 mm.

The shearing mechanism 33 will be described with reference to FIGS. 7 and 8. As shown in FIG. 7, the shearing mechanism 33 is provided with a moving table 43. The moving table 43 is guided by the guide rod 36 so as to be movable in the conveying direction, and is driven to rotate.
It is configured to be moved in the transport direction by.
Further, the moving table 43 is provided with a position adjusting member 44 that is positionally adjustable in a direction orthogonal to the carrying direction, and the position adjusting member 44 is provided with a shearing cutter 45 and a scraper member 46. The shearing cutter 45 has the same structure as the rotating cutter 38, but is non-rotatably attached. In addition, the scraper member 4 described above
6 has a wedge shape protruding in the horizontal direction, and the side edge of the scraper member 46 and the side surface of the shearing cutter 45 face each other with a slight gap. Further, the blade portion on the peripheral edge of the shearing cutter 45 is adjusted in position so as to accurately correspond to the kerf G formed by the cutter mechanism 32.

In addition to the above-mentioned shearing mechanism 33, a suction lifting mechanism 50 is provided. This suction lifting mechanism 50
Is an actuator 52 provided on a member on the fixed side,
It is composed of an elevating member 53 which is moved up and down by the actuator 52, and a suction pad 51 which is provided so as to project downward from the elevating member 53. The suction pad 51 is provided in correspondence with the end portion of the printed circuit board stack 1, and a negative pressure mechanism (not shown) acts on the suction pad 51 to apply a negative pressure.

The operation of these mechanisms will be described with reference to FIG. When the cutting mechanism 32 forms the kerf G on the edge of the aluminum plate 4 of the printed circuit board stack 1, the suction pad 51 of the suction lifting mechanism 50 is lowered to move the end of the aluminum plate 4 to the edge. While adsorbing,
The suction pad 51 rises, lifts the end portion of the aluminum plate 4, and forms a gap between the suction pad 51 and the printed circuit board 3 therebelow. Next, the shearing cutter 45 of the shearing mechanism 33 described above.
And the scraper member 46 is in the carrying direction, that is, the kerf
Move in the direction of. Then, the scraper member 46 enters below the aluminum plate 4 lifted by the suction lifting mechanism 50 and lifts the aluminum plate 4 on one side of the kerf G. On the other hand, the blade portion on the peripheral edge of the shearing cutter 45 exactly corresponds to the position of the kerf G and moves along the kerf G. Therefore, the kerf G cannot move upward. Therefore, due to the movement of the shearing cutter 45 and the scraper member 46, a large shearing stress is generated in the portion of the kerf G, and the aluminum plate 4 is cut from the portion of the kerf G. In this case, since the lower surface of the scraper member 46 is separated from the printed circuit board 3 therebelow, the printed circuit board 3 is
Will not damage. When the shearing cutter 45 and the scraper member 46 move to the other end, the aluminum plate 4 moves from the position of the kerf G to the first portion 4.
It is completely cut into a and the second portion 4b. In this state, since the first portion 4a and the second portion 4b are only connected to the printed circuit board stack 1 by the adhesive tape 5, the adhesive tape 5 acts like a hinge and these The first portion 4a and the second portion 4b are rotatable and can be inverted.

The printed board stack 1 from which the aluminum plate 4 has been completely cut in this way is conveyed to the above-mentioned first removing mechanism 13. Hereinafter, FIG. 9 to FIG.
The first removing mechanism 13 will be described with reference to FIG. Figure 9
Is a plan view of the first removing mechanism 13, and shows a stopper 55 and a crossing mechanism 5 having the same configuration as the cutting mechanism 12 described above.
Printed circuit board stack 1 provided with 6 and conveyed
Is stopped at a predetermined position by this stopper 55,
Further, it is moved in the direction orthogonal to the conveying direction by the width-shifting mechanism 56 and abuts against the side stopper to be positioned at a predetermined position.

The first removing mechanism 13 is provided with a reversing mechanism 60 as shown in FIGS. 9 and 10. The reversing mechanism 60 is provided with a large number of nozzles 61, and these nozzles 61 are supported by a supporting member 62 and are directed to the cutting edge of the cut first portion 4a of the aluminum plate 4. ing. Then, high-pressure air is ejected from these nozzles 61, and the pressure of the air causes the first portion of the aluminum plate 4 to float. Further, as shown in FIG. 10, the reversing mechanism 60 is provided with a reversing claw mechanism 63. The reversing claw mechanism 63 includes an actuator 64 such as a rodless cylinder, a moving table 65 that is moved by the actuator 64 in a direction orthogonal to the carrying direction, and an air cylinder 66 attached to the moving table 65. The piston rod of the cylinder 66 is directed downward, and the reversing claw member 67 is attached to the tip portion thereof. The reversal claw member 67 is oriented obliquely downward and has elasticity. When the piston rod of the cylinder 66 extends downward, the tip of the reversing claw member 67 comes into contact with the upper surface of the aluminum plate 4 of the printed circuit board stack 1, and this elastic force causes the tip of the reversing claw member 67. Is lightly pressed against the upper surface of the aluminum plate 4. Next, the reversing claw member 67 is moved toward the first portion 4 a of the aluminum plate 4 by the actuator 64. Then, the first air that has been floated by the air pressure from the nozzle 61 is
The reversal claw member 67 hooks the cut edge of the portion 4a of (1) to mechanically invert the first portion 4a by 180 °.

Further, in the first removing mechanism 13, the side stopper portion is constructed as a holding mechanism 70. That is, reference numeral 71 in the figure is a lower clamp member that also serves as a side stopper, and an upper clamp member 73 is provided above the lower clamp member 71. The lower clamp member 71 is horizontally moved by an air cylinder 72, and the upper clamp member 73 is vertically moved by an air cylinder 74.

As shown in FIG. 11, when the inversion mechanism 60 inverts the first portion 4a of the aluminum plate 4, the upper clamp member 73 is moved upward, and the inversion is performed. The interference with the first portion 4a is prevented. And, this first portion 4a is about 180 °
When inverted, the first portion 4a is placed on the upper surface of the lower clamp member 71. Then, after this, the upper clamp member 73 is lowered, and as shown in FIG. 12, the upper clamp member 73 and the lower clamp member 71 make up the first clamp member 73.
The portion 4a is clamped and held.

Further, the first removing mechanism 13 has a tape removing mechanism 75 for removing the adhesive tape 5 on the one edge portion.
Is provided. The tape stripping mechanism 75 includes an air cylinder 76 provided upward on the side of the lower clamp member 71, and a push-up member 77 is provided at the tip end portion of the piston rod. Then, with the upper clamp member 73 and the lower clamp member 71 of the holding mechanism 70 holding and holding the first portion 4a, the push-up member 77 rises and pushes up the printed circuit board stack 1. Therefore, the printed circuit board stack 1 and the first portion 4a relatively move in the plate thickness direction of the printed circuit board stack 1, and as a result, as shown in FIG. 13, the adhesive tape 5 covers the printed circuit board stack 1. The stack 1 is peeled off from the side surface and the lower surface. In this case, when the adhesive tape 5 is peeled from the side surface of the printed circuit board stack 1, the adhesive tape 5 is sequentially peeled while being inverted by 180 °, so that the resistance at the peeling is extremely small. Also, when the adhesive tape 5 is peeled off from the lower surface of the printed circuit board stack 1, that is, the lower surface of the bottom plate 2 such as a bakelite plate, the adhesive tape 5 is about 90 °.
As it is inverted, it is peeled off sequentially in the direction perpendicular to the lower surface, so the resistance at the time of peeling is small. Therefore, the peeling resistance when the adhesive tape 5 is peeled off is small, and the adhesive tape 5 is not cut during the peeling.

When the adhesive tape 5 is completely peeled off, the lower clamp member 71 moves horizontally and separates from the upper clamp member 73, as shown in FIG. As a result, the first portion 4a of the aluminum plate and the adhesive tape 5 adhered thereto drop, are accommodated in a receiving box or the like (not shown) installed below, and are processed. In this case, one end of this adhesive tape 5 is
It is easy to handle as it remains adhered to a and is treated together with this first part 4a. That is,
In this state, the adhesive surface at one end of the adhesive tape 5 is still adhered to the first portion 4a, and the adhesive surface of the adhesive tape 5 is not exposed at the first portion 4a. It does not adhere to the part. Further, the adhesive tape 5 is flexible and deforms after being peeled off. However, the first portion 4a of this aluminum plate is a rigid member 4a and is easy to handle. Therefore, as described above, even after the adhesive tape 5 is peeled off, the peeled adhesive tape 5 is removed from the upper clamp member 73 and the lower clamp member 7.
It is possible to hold the first tape 4 and the lower clamp member 71 as described above, so that the first portion 4a and the adhesive tape 5 can be securely attached without sticking to other members. To be released.

The printed circuit board stack 1 from which the first portion 4a and the adhesive tape 5 on one side are removed
Are then sent to the second removal mechanism 14. Below, FIG.
The second removing mechanism 14 will be described with reference to FIGS. FIG. 15 is a side view of the second removing mechanism 15, FIG.
6 is a view on arrow 16-16 of FIG. The second removing mechanism 15 is provided with a stopper 81 and a width-approaching mechanism 82 similar to those described above, and the conveyed printed board stack 1 is positioned at a predetermined position by these mechanisms. The second removing mechanism 14 has a holding mechanism 83 that also serves as a side stopper and a second holding mechanism for the aluminum plate 4.
Reversing mechanism 84 for reversing the portion 4b of the
A tape peeling mechanism 85 for peeling off the adhesive tape 5 on the other portion and the other edge portion is provided.

The holding mechanism 83 described above includes a lower clamp member 91 which also serves as a side stopper, and the lower clamp member 9
And an upper clamp member 92 that abuts on the upper surface of 1. The upper clamp member 92 is configured to be moved up and down by an air cylinder 93. This second
In the case of the removing mechanism 14 of No. 2, since the width of the second portion 4b to be removed is wide, the ascending stroke of the upper clamp member 92 is set to be large in order to prevent the second portion 4b from interfering when it is inverted. A pushing member 94 is provided inside the upper clamp member 92.
Is configured to move horizontally inward by an air cylinder 95.

The reversing mechanism 84 includes a suction lifting mechanism 100 and an engagement reversing mechanism 101. As shown in FIG. 17, the suction lifting mechanism 100 includes an air cylinder 102 attached to a stationary member, and an elevating member 1 vertically moved by the air cylinder 102.
03 and a suction pad 104 projecting downward from the elevating member 103.
4, a negative pressure mechanism (not shown) is used to apply a negative pressure. Then, the suction lifting mechanism 100 is
As shown in FIG. 20, the suction pad 14 descends to adsorb the second portion 4b of the aluminum plate of the printed circuit board stack 1 and then rises, lifts the second portion 4b, and lowers the printed circuit board 3 below. It is configured to form a gap therebetween.

The engagement reversing mechanism 101 described above is shown in FIG.
8 and FIG. 19. The engagement reversing mechanism 101 includes an actuator 106 such as a rodless cylinder.
Is attached to a member on the fixed side while being directed obliquely downward in a plane orthogonal to the transport direction. The moving member 107 is attached to the movable member 107 of the actuator 106, and the moving member 107 is reciprocally moved in an oblique direction by the actuator 106. An air cylinder 108 is provided at the tip of the moving member 107, and the air cylinder 108 is attached so as to be oriented in the carrying direction. And this air cylinder 10
An engaging element 109 is attached to the tip portion of the piston rod 8 of FIG.

In this engagement reversing mechanism 101, as shown in FIG. 20, when the moving member 107 descends obliquely, the air cylinder 108 attached to the moving member 107 has the suction lifting mechanism. It is adjusted so as to direct the gap between the second portion 4b of the aluminum plate lifted by 100 and the printed circuit board 3 therebelow. Then, from that state, this air cylinder 1
No. 08 piston rod extends, and its tip end is an engaging element 1
09 enters the gap between the second portion 4b and the printed circuit board 3. Then, next, the above-mentioned actuator 1
01 causes the moving member 107 to move diagonally upward. Accordingly, the second portion 4b is pushed up by the engagement element 109 and rotates upward. Since the actuator 106 is obliquely arranged, as the engaging element 109 moves upward, the engaging element 109 moves toward the side edge, and the rotation angle of the second portion 4b becomes larger and larger. The turning angle exceeds 90 °, and the second portion 4b is inverted by 180 ° due to gravity.

Next, the adhesive tape 5 is removed together with the inverted second portion 4b in the same manner as in the case of the first removing mechanism described above. That is, the upper clamp member 92 descends, and the edge portion of the inverted second portion 4b is clamped and held by the upper clamp member 92 and the lower clamp member 91. The tape stripping mechanism 85 has an air cylinder 110 and a push-up member 111 provided at the tip of its piston rod. The piston rod extends and the push-up member 111 rises, and the printed board Push up stack 1. Thereby, this second part 4b
And the printed circuit board stack 1 relatively move in the plate thickness direction, and the adhesive tape 5 is peeled off from the side surface and the lower surface of the printed circuit board stack 1. In this case, when the printed board stack 1 is pushed up, the pushing member 94 of the upper clamp member 92 moves in the horizontal direction to separate the printed board stack 1 from the upper clamp member 92 and the lower clamp member 91. As described above, the peeling of the adhesive tape 5 is made more reliable.

When the peeling of the adhesive tape 5 is completed, the upper clamp member 92 is raised and the second portion 4 is removed.
Release the holding of b, this second part 4b is adhesive tape 5
While attached, drops by gravity along the side surface of the second removing mechanism, and drops into the container arranged below. In this case, since the second portion 4b has a large shape, the second portion 4b may collide with the side surface or the like of the device during the fall. In order to prevent such inconvenience, an air nozzle 112 is provided on the side surface of the second removing mechanism 14, high pressure air is jetted from the air nozzle 112, and the second portion 4b, which falls under the pressure, is provided in the device. It is controlled so that it is separated from the side surface and falls accurately at a predetermined position.

In this way, the printed circuit board stack from which the adhesive tape and the aluminum plate have been removed is sent to the separating mechanism 15 as described above to be separated into individual printed circuit boards, and also to the cleaner mechanism 16. After being cleaned, it is sent to the next step.

The above embodiment is suitable for storing the aluminum plate 4 as a record because the aluminum plate 4 is cut near the side edges thereof. That is, when a through hole is drilled in this printed circuit board stack, a defective product may occur due to a cause such as a loss of the tip of a small diameter drill. In this case, if the aluminum plate 4 is stored, it is possible to later analyze which printed circuit board stack has the defect by inspecting the holes formed in the aluminum plate, and collect the defective product. And exclusion is certain. In this case,
If the aluminum plate is cut at the central portion or the like, the above analysis cannot be performed. However, in this embodiment, the aluminum plate 4 is cut at its side edge portion and the portion where the hole is formed is cut. Since it remains without being saved, this can be saved and the above analysis can be performed. Of course, if you do not need to save this aluminum plate, or if you want to form a pattern for multiple printed boards on one printed board and cut it into multiple printed boards later, It is needless to say that a part, or a blank part to be cut later may be cut. When the aluminum plate 4 is cut at the center, a mechanism such as the second removing mechanism described above is used to cut the cut aluminum plate into the first and second portions and both sides. It is also possible to remove the adhesive tape at the same time.

Further, a cut groove may be formed in advance on the aluminum plate 4. In this case, the cutter mechanism 32 of the cutting mechanism 12 is unnecessary and only the shearing mechanism 33 needs to be provided.

Further, as the reversing mechanism, it is possible to adopt various mechanisms other than those in the above-mentioned embodiments, depending on the shape and size of the aluminum plate to be cut, the cutting position and the like. Further, in this embodiment, the printed circuit board stack is configured to be conveyed horizontally, but the printed circuit board stack may be configured to be retained in the vertical direction or in the oblique direction and conveyed. Is also possible.

[0035]

As described above, according to the present invention, the aluminum plate is cut by the cutting mechanism in the direction along the side edge of the aluminum plate, and the cut aluminum plate is flipped outward by about 180 ° by the reversing mechanism. By this, the inverted aluminum plate and the printed circuit board stack relatively move in the plate thickness direction, and the adhesive tape is peeled off from the side surface and the lower surface of the printed circuit board stack. Therefore, the adhesive tape is peeled while being inverted by about 360 ° with respect to the side surface of the printed circuit board stack, and is substantially orthogonal to the lower surface, that is, the adhesive surface while being inverted by about 90 ° with respect to the lower surface. Stripped off. Therefore, the adhesive tape is easily peeled off, and the adhesive tape is not cut in the middle. Also, since one end of the adhesive tape remains adhered to the inverted aluminum plate, the peeled adhesive tape can be treated and discarded together with the cut aluminum plate. Is easy, and the peeled adhesive tape does not adhere to other members,
It can operate reliably and is highly reliable.

[Brief description of drawings]

FIG. 1 is a perspective view of a printed circuit board stack.

FIG. 2 is a schematic view of an apparatus according to an embodiment of the present invention.

FIG. 3 is a plan view of the cutting mechanism.

FIG. 4 is a view on arrow 4-4 of FIG.

5 is a view on arrow 5-5 of FIG.

FIG. 6 is a perspective view of a part of the cutter mechanism.

FIG. 7 is a view on arrow 7-7 of FIG.

FIG. 8 is a perspective view of a part of the shearing mechanism.

FIG. 9 is a plan view of the first removing mechanism.

FIG. 10 is a front view of a part of the removing mechanism.

FIG. 11 is an enlarged view of a part of the removing mechanism for explaining the operation.

FIG. 12 is an enlarged view of a part of the removing mechanism for explaining the operation.

FIG. 13 is an enlarged view of a part of the removing mechanism for explaining the operation.

FIG. 14 is an enlarged view of a part of the removing mechanism for explaining the operation.

FIG. 15 is a side view of the second removing mechanism.

FIG. 16 is a front view of a second removing mechanism.

FIG. 17 is a front view of the suction lifting mechanism.

FIG. 18 is a front view of the engagement reversing mechanism.

FIG. 19 is a view on arrow 19-19 of FIG.

FIG. 20 is a perspective view of a part of the second removing mechanism.

[Explanation of symbols]

1 ... Printed circuit board stack 4 ... Aluminum plate 5 ... Adhesive tape 12 ... Cutting mechanism 13 ... First removing mechanism 14 ... Second removal mechanism 32 ... Cutter mechanism 33 ... Shearing mechanism 38 ... rotary cutter 46 ... scraper 60 ... Inversion mechanism 61 ... Nozzle 67 ... Reversing claw member 70 ... Holding mechanism 71 ... Lower clamp member 74 ... Upper clamp member 75 ... Tape stripping mechanism 77 ... Push-up member 83 ... Holding mechanism 84 ... Inversion mechanism 85 ... Tape stripping mechanism 91 ... Lower clamp member 92 ... Upper clamp member 100 ... Suction lifting mechanism 101 ... Engagement reversing mechanism

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naohito Anase 2-2046 Horifune, Kita-ku, Tokyo Inside JT Engineering Co., Ltd. (72) Inventor Kogo Sakuma 2-2046 Horifune, Kita-ku, Tokyo Issued within JT Engineering Co., Ltd. (72) Inventor Takeshi Miyoshi 2-2046 Horifuna, Kita-ku, Tokyo Within JT Engineering Co., Ltd. (56) Reference JP 3-3389 (JP, A) (58) ) Fields surveyed (Int.Cl. ⁷ , DB name) B65H 41/00

Claims (7)

(57) [Claims] 1. An apparatus for removing the adhesive tape of a printed circuit board stack in which a bottom plate is stacked under a printed circuit board, an aluminum plate is stacked on the printed circuit board, and adhesive tapes are adhered to both side edges of the printed circuit board stack. , A cutting mechanism for cutting only the above aluminum plate in a direction along both side edges thereof, a reversing mechanism for laterally reversing the aluminum plates on both sides of the cutting position, and a holding mechanism for holding the reversed aluminum plate. The mechanism, the inverted aluminum plate and the printed circuit board stack are relatively moved in the plate thickness direction, and the above-mentioned printing is performed with the adhesive tape being adhered to the inverted aluminum plate at one end thereof. A tape removing device for a printed circuit board stack, comprising a tape removing mechanism for removing the tape from the side surface and the lower surface of the substrate stack. . 2. The cutting mechanism comprises a cutter mechanism for forming a cutting groove having a depth equal to or less than the plate thickness on the aluminum plate, and shearing is applied to a portion of the cutting groove to cut from the cutting groove portion. The tape removing device for a printed circuit board stack according to claim 1, further comprising a shearing mechanism for cutting the aluminum plate. 3. The cutter mechanism presses a rotary cutter having a blade-shaped peripheral edge against the surface of the aluminum plate and moves the rotary cutter while rotating the same so that the aluminum plate is cut at a predetermined depth. A groove is formed, and the shearing mechanism is a scraper member that is inserted between the aluminum plate and a printed circuit board under the aluminum plate and that moves while lifting a portion of the aluminum plate in the vicinity of the kerf. And a shearing cutter that moves together with the scraper member in contact with the cut groove portion, and cuts the aluminum plate by shearing the cut groove portion with the scraper member and the shear cutter. The tape removing device for a printed circuit board stack according to claim 2, wherein 4. The tape removing device for a printed circuit board stack according to claim 1, wherein the cutting mechanism cuts the vicinity of the edge of the aluminum plate along a side edge thereof. 5. The nozzle for ejecting high-pressure air to the cutting edge portion of the cut aluminum plate and lifting the aluminum cutting edge portion by the air pressure,
A reversing claw mechanism having a reversing claw member that moves toward the cutting edge while sliding on the upper surface of the printed circuit board stack and hooks the cutting edge to reverse the cut aluminum plate. The tape removing device for a printed circuit board stack according to claim 1, wherein 6. The reversing mechanism is inserted into a gap between a suction lifting mechanism that suctions and lifts the cut aluminum plate, and the lifted aluminum plate and a printed circuit board stack below it. 2. The printed circuit board stack according to claim 1, further comprising: an engagement reversing mechanism having an engaging element that mechanically engages with the aluminum plate and moves diagonally upward to invert the aluminum plate. Tape removal device. 7. The printed circuit board stack is horizontally placed on a transfer mechanism to be transferred, the holding mechanism is attached to a fixed member of the apparatus, and the tape peeling mechanism is The printed board stack is raised with respect to the aluminum plate held by the holding mechanism by raising the printed board stack while the cut and inverted aluminum plate is held by the holding mechanism. 3. The adhesive tape is moved in the plate thickness direction, and is peeled off from the side surface and the lower surface of the printed circuit board stack with one end thereof being adhered to the aluminum plate to be removed.
Removal equipment for printed circuit board stacks.