JP3343541B2 - Probe card - Google Patents
Probe cardInfo
- Publication number
- JP3343541B2 JP3343541B2 JP2000040656A JP2000040656A JP3343541B2 JP 3343541 B2 JP3343541 B2 JP 3343541B2 JP 2000040656 A JP2000040656 A JP 2000040656A JP 2000040656 A JP2000040656 A JP 2000040656A JP 3343541 B2 JP3343541 B2 JP 3343541B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- probe card
- reinforcing member
- probe
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、測定対象物である
ＬＳＩ等の半導体集積回路素子を加熱して電気的諸特定
の測定を行ういわゆるバーンインテストに用いられるプ
ローブカードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for a so-called burn-in test in which a semiconductor integrated circuit device such as an LSI to be measured is heated to perform various electrical measurements.
【０００２】[0002]
【従来の技術】従来のこの種のプローブカード５００、
６００を図５及び図６を参照しつつ説明する。このプロ
ーブカード５００は、図５に示すように、開口５１１が
開設された基板５１０と、この基板５１０の表面側に前
記開口５１１を覆うように設けられた補強部材５２０
と、前記開口５１１から基板５１０の裏面側に突出した
補強部材５２０の突出部５２１に取り付けられるプロー
ブ固定部材５３０と、後端を前記基板５１０に形成され
た配線パターン（図示省略）に接続し、中腹部を前記プ
ローブ固定部材５３０に固定した複数本のプローブ５４
０とを有している。そして、前記補強部材５２０とプロ
ーブ固定部材５３０とは接着剤で接着され、補強部材５
２０は接着剤及び固定ネジ５５０で基板５１０に固定さ
れている。2. Description of the Related Art A conventional probe card 500 of this kind,
600 will be described with reference to FIGS. As shown in FIG. 5, the probe card 500 includes a substrate 510 having an opening 511 and a reinforcing member 520 provided on the front surface of the substrate 510 so as to cover the opening 511.
A probe fixing member 530 attached to the protrusion 521 of the reinforcing member 520 protruding from the opening 511 to the back side of the substrate 510, and a rear end connected to a wiring pattern (not shown) formed on the substrate 510; A plurality of probes 54 each having a middle part fixed to the probe fixing member 530
0. The reinforcing member 520 and the probe fixing member 530 are bonded with an adhesive, and the reinforcing member 5
20 is fixed to the substrate 510 by an adhesive and fixing screws 550.
【０００３】また、他のこの種のプローブカード６００
としては、図６に示すように、基板６１０と、この基板
の表面側に取り付けられた補強部材６２０と、前記基板
６１０の裏面側に取り付けられたプローブ固定部材６３
０と、後端を前記基板６１０に形成された配線パターン
（図示省略）に接続し、中腹部を前記プローブ固定部材
６３０に固定した複数本のプローブ６４０とを有してい
る。そして、前記基板６１０と補強部材６２０とは接着
剤及び固定ネジ６５０で固定され、前記基板６１０とプ
ローブ固定部材６３０とは接着剤で固定されている。[0003] Another type of probe card 600
As shown in FIG. 6, a substrate 610, a reinforcing member 620 attached to the front side of the substrate, and a probe fixing member 63 attached to the back side of the substrate 610
And a plurality of probes 640 whose rear ends are connected to a wiring pattern (not shown) formed on the substrate 610 and whose middle portions are fixed to the probe fixing member 630. The substrate 610 and the reinforcing member 620 are fixed with an adhesive and a fixing screw 650, and the substrate 610 and the probe fixing member 630 are fixed with an adhesive.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述し
たプローブカード５００は以下のような問題点がある。
まず、第１に基板５１０に開口５１１を設けるため、基
板５１０の強度が低下するとともに、基板５１０を積層
基板としても中層の配線の効率が低下する。次に、基板
５１０、補強部材５２０及びプローブ固定部材５３０は
相互に接着剤で固定されるため、分解修理が困難であ
る。また、膨張率の異なる部材を接着剤で固定している
ため、バーンインテストでは全体に歪みが生じ、その結
果、プローブの先端の接触部の高さ位置や、平面方向で
の位置が変わり、場合によっては測定が不正確になった
り、測定が不能になったりすることがある。However, the above-described probe card 500 has the following problems.
First, since the opening 511 is provided in the substrate 510, the strength of the substrate 510 is reduced, and the efficiency of wiring in the middle layer is reduced even when the substrate 510 is a laminated substrate. Next, since the substrate 510, the reinforcing member 520, and the probe fixing member 530 are fixed to each other with an adhesive, it is difficult to disassemble and repair. In addition, since the members with different expansion rates are fixed with adhesive, the entire surface is distorted in the burn-in test. In some cases, the measurement may be inaccurate or impossible.
【０００５】また、上述したプローブカード６００には
以下のような問題点がある。すなわち、基板６１０、補
強部材６２０及びプローブ固定部材６３０は相互に接着
剤で固定されるため、分解修理が困難である。また、膨
張率の異なる部材を接着剤で固定しているため、バーン
インテストでは全体に歪みが生じ、その結果、プローブ
の先端の接触部の高さ位置や、平面方向での位置が変わ
ることがあり、場合によっては測定が不正確になった
り、測定が不能になったりすることがある。ただし、プ
ローブカード５００のような開口５１１がないため、基
板６１０の強度の低下や積層基板とした場合の中層の配
線の効率の低下等の問題は発生しない。The above-described probe card 600 has the following problems. That is, since the substrate 610, the reinforcing member 620, and the probe fixing member 630 are fixed to each other with an adhesive, it is difficult to disassemble and repair. In addition, since the members with different expansion rates are fixed with adhesive, the whole is distorted in the burn-in test, and as a result, the height position of the contact part at the tip of the probe and the position in the plane direction may change In some cases, the measurement may be inaccurate or impossible. However, since there is no opening 511 as in the probe card 500, problems such as a decrease in the strength of the substrate 610 and a decrease in the efficiency of wiring in the middle layer in the case of a laminated substrate do not occur.
【０００６】本発明は上記事情に鑑みて創案されたもの
で、常に正確な測定が可能で、分解修理ができ、基板に
積層基板を用いた場合でも、中層の配線の効率が低下せ
ず、基板の強度にも悪影響を及ぼさないプローブカード
を提供することを目的としている。The present invention has been made in view of the above circumstances, and can always perform accurate measurement, can be disassembled and repaired, and does not reduce the efficiency of the wiring of the middle layer even when a laminated substrate is used as the substrate. It is an object of the present invention to provide a probe card that does not adversely affect the strength of a substrate.
【０００７】[0007]
【課題を解決するための手段】本発明に係るプローブカ
ードは、基板と、この基板の裏面側に取り付けられるス
ペーサと、前記基板の表面側に取り付けられる補強部材
と、前記スペーサに取り付けられるプローブ固定部材
と、前記基板に形成された配線パターンに接続され、前
記プローブ固定部材に固定される複数本のプローブと、
前記スペーサを基板に取り付けるための第１の取付用ネ
ジとを備えており、少なくとも基板と補強部材との間及
び基板とスペーサとの間は接着剤では固定されておら
ず、かつ前記基板と補強部材との間には、両者の摩擦を
低減するシート状の摩擦低減シートを介在させる。 According to the present invention, there is provided a probe card comprising: a substrate; a spacer attached to the back surface of the substrate; a reinforcing member attached to the front surface of the substrate; and a probe fixed to the spacer. A member and a plurality of probes connected to a wiring pattern formed on the substrate and fixed to the probe fixing member,
A first mounting screw for mounting the spacer to the substrate, wherein at least a portion between the substrate and the reinforcing member and a portion between the substrate and the spacer are fixed with an adhesive.
And the friction between the substrate and the reinforcing member
A sheet-shaped friction reducing sheet to be reduced is interposed.
【０００８】[0008]
【発明の実施の形態】図１は本発明の第１の実施の形態
に係るプローブカードの概略的断面図、図２は本発明の
第１の実施の形態に係るプローブカードに用いられる補
強部材の概略的平面図、図３は本発明の第２の実施の形
態に係るプローブカードの概略的断面図、図４は本発明
の第３の実施の形態に係るプローブカードの概略的断面
図である。FIG. 1 is a schematic sectional view of a probe card according to a first embodiment of the present invention, and FIG. 2 is a reinforcing member used in the probe card according to the first embodiment of the present invention. FIG. 3 is a schematic sectional view of a probe card according to a second embodiment of the present invention, and FIG. 4 is a schematic sectional view of a probe card according to a third embodiment of the present invention. is there.
【０００９】本発明の第１の実施の形態に係るプローブ
カード１００は、基板１１０と、この基板１１０の裏面
側に取り付けられるスペーサ１２０と、前記基板１１０
の表面側に取り付けられる補強部材１３０と、前記スペ
ーサ１２０に取り付けられるプローブ固定部材１４０
と、前記基板１１０に形成された配線パターン（図示省
略）に接続され、前記プローブ固定部材１４０に固定さ
れる複数本のプローブ１５０と、前記スペーサ１２０及
び補強部材１３０を基板１１０に取り付けるための第１
の取付用ネジ１６０とを備えており、前記基板１１０と
補強部材１３０との間は接着剤では固定されていない。The probe card 100 according to the first embodiment of the present invention comprises a substrate 110, a spacer 120 attached to the back side of the substrate 110,
And a probe fixing member 140 attached to the spacer 120
And a plurality of probes 150 connected to a wiring pattern (not shown) formed on the substrate 110 and fixed to the probe fixing member 140, and a plurality of probes 150 for attaching the spacer 120 and the reinforcing member 130 to the substrate 110. 1
And the reinforcing member 130 is not fixed with an adhesive.
【００１０】まず、前記基板１１０は積層基板であっ
て、複数層にわたる配線パターンが形成されている。そ
して、各配線パターンは、プローブ１５０に接続される
ため、基板１１０の裏面側にその端部を露出させてい
る。この基板１１０には、２種類の貫通孔１１１、１１
２が開設されている。一方は、基板１１０に補強部材１
３０を取り付ける際に用いられる第１の基板貫通孔１１
１であり、他方は基板１１０、補強部材１３０及びスペ
ーサ１２０を相互に取り付ける際に用いられる第２の基
板貫通孔１１２である。First, the substrate 110 is a laminated substrate on which a wiring pattern covering a plurality of layers is formed. Since each wiring pattern is connected to the probe 150, its end is exposed on the back surface side of the substrate 110. The substrate 110 has two types of through holes 111 and 11.
2 have been established. On one side, the reinforcing member 1 is attached to the substrate 110.
First substrate through hole 11 used when mounting 30
The other is a second substrate through hole 112 used when the substrate 110, the reinforcing member 130, and the spacer 120 are attached to each other.
【００１１】また、この基板１１０の裏面側に取り付け
られるスペーサ１２０は、後述のプローブ固定部材１４
０を固定するための基台となるものであって、例えば放
熱性に優れ、線膨張率が低いステンレス（ＳＵＳ４３
０）等から構成されている。そして、このスペーサ１２
０には、前記第２の基板貫通孔１１２に対応するスペー
サ貫通孔１２２が開設されている。The spacer 120 attached to the back side of the substrate 110 is used for a probe fixing member 14 described later.
For example, stainless steel (SUS43) having excellent heat dissipation and low linear expansion coefficient
0) and the like. And this spacer 12
At 0, a spacer through-hole 122 corresponding to the second substrate through-hole 112 is opened.
【００１２】さらに、前記前記補強部材１３０は、基板
１１０がバーンインテストの際に歪むことを防止するた
めのものであって、例えば放熱性に優れ、線膨張率が低
いステンレス（ＳＵＳ４３０）等から構成されている。
この補強部材１３０には、前記第１の基板貫通孔１１１
に対応する第１の補強部材貫通孔１３１と、前記第２の
基板貫通孔１１２に対応する第２の補強部材貫通孔１３
２とが開設されている。なお、この補強部材１３０は、
図２に示すように、略円形の中心部１３１から複数の腕
部１３２が外側に向かって放射状に突出した形状に形成
されている。Further, the reinforcing member 130 is for preventing the substrate 110 from being distorted during a burn-in test, and is made of, for example, stainless steel (SUS430) having excellent heat dissipation and a low coefficient of linear expansion. Have been.
The reinforcing member 130 includes the first substrate through hole 111.
And a second reinforcing member through hole 13 corresponding to the second substrate through hole 112.
2 has been established. In addition, this reinforcing member 130
As shown in FIG. 2, a plurality of arm portions 132 are formed in a shape protruding radially outward from a substantially circular center portion 131.
【００１３】上述した基板１１０、スペーサ１２０及び
補強部材１３０は、第２の基板貫通孔１１２、スペーサ
貫通孔１２２及び第２の補強部材貫通孔１３２を貫通す
る第１の取付用ネジ１６０で相互に取り付けられてい
る。また、基板１１０と補強部材１３０とは、第１の基
板貫通孔１１１及び第１の補強部材貫通孔１２１を貫通
する第２の取付用ネジ１７０で相互に取り付けられてい
る。The above-mentioned substrate 110, spacer 120 and reinforcing member 130 are mutually connected by a first mounting screw 160 which penetrates through second substrate through-hole 112, spacer through-hole 122 and second reinforcing member through-hole 132. Installed. Further, the substrate 110 and the reinforcing member 130 are attached to each other with the second mounting screw 170 penetrating the first substrate through hole 111 and the first reinforcing member through hole 121.
【００１４】従って、基板１１０と補強部材１３０との
間、基板１１０とスペーサ１２０との間は、従来のこの
種のプローブカードとは違って接着剤では固定されてい
ない。Therefore, unlike the conventional probe card of this type, the space between the substrate 110 and the reinforcing member 130 and the space between the substrate 110 and the spacer 120 are not fixed with an adhesive.
【００１５】一方、前記プローブ固定部材１４０は、プ
ローブ１５０の中腹部１５３が絶縁性を有する接着剤等
で固定される傾斜面１４１を有する例えばセラミックス
からなる略リング状の部材である。このプローブ固定部
材１４０は、接着剤で前記スペーサ１２０に固定され
る。On the other hand, the probe fixing member 140 is a substantially ring-shaped member made of, for example, ceramics having an inclined surface 141 to which the middle part 153 of the probe 150 is fixed with an insulating adhesive or the like. The probe fixing member 140 is fixed to the spacer 120 with an adhesive.
【００１６】また、前記プローブ１５０は、例えばタン
グステン等からなり、先端が半導体集積回路素子２１０
の電極２１１に接触する接触部１５１となって折曲され
ており、後端が基板１１０の裏面側に露出した配線パタ
ーンに接続される接続部１５２となっている。The probe 150 is made of, for example, tungsten or the like, and the tip thereof is a semiconductor integrated circuit device 210.
A contact portion 151 that contacts the electrode 211 is bent, and a rear end is a connection portion 152 that is connected to a wiring pattern exposed on the back surface side of the substrate 110.
【００１７】次に、上述した構成に係るプローブカード
１００による半導体集積回路素子２１０のバーンインテ
ストにおける電気的諸特性の測定について説明する。Next, measurement of electrical characteristics in a burn-in test of the semiconductor integrated circuit device 210 by the probe card 100 having the above-described configuration will be described.
【００１８】ウエハ状の半導体集積回路素子２１０は、
加熱ヒータを内蔵したテーブル２００の上に真空吸着さ
れてセットされる。かかるテーブル２００の上方にセッ
トされたプローブカード１００とテーブル２００とが相
対的に移動し、プローブカード１００のプローブ１５０
の接触部１５１が半導体集積回路素子２１０の電極２１
１に接触する。プローブ１５０が電極２１１に接触した
後も、テーブル２００とプローブカード１００との間の
距離を縮め、プローブ１５０と電極２１１の間の接触圧
が所定の値になるようにする。The wafer-like semiconductor integrated circuit device 210 is
It is set by being vacuum-sucked on a table 200 having a built-in heater. The probe card 100 set above the table 200 and the table 200 relatively move, and the probe 150 of the probe card 100 is moved.
Contacts 151 of the semiconductor integrated circuit device 210
Touch 1. Even after the probe 150 contacts the electrode 211, the distance between the table 200 and the probe card 100 is reduced so that the contact pressure between the probe 150 and the electrode 211 becomes a predetermined value.
【００１９】この状態で、図外のテスターと半導体集積
回路素子２１０との間で測定用の信号のやり取りを行
い、半導体集積回路素子２１０の電気的諸特性の測定を
行う。In this state, signals for measurement are exchanged between a tester (not shown) and the semiconductor integrated circuit device 210, and the electrical characteristics of the semiconductor integrated circuit device 210 are measured.
【００２０】このバーンインテストでは、テーブル２０
０にセットされた加熱ヒータによって半導体集積回路素
子２１０が加熱されているため、プローブカード１００
も輻射熱等によって加熱されることになる。プローブカ
ード１００を構成する各部材の膨張率は異なるが、基板
１１０、スペーサ１２０及び補強部材１３０は、従来の
ように接着剤では固定されておらず、単に第１の取付用
ネジ１６０及び第２の固定用ネジ１７０で取り付けられ
ているだけであるから、各部材の膨張が他の部材に与え
る影響は従来のものより格段に少ないと考えられる。In this burn-in test, the table 20
Since the semiconductor integrated circuit element 210 is heated by the heater set to 0, the probe card 100
Is also heated by radiant heat or the like. Although the expansion rates of the members constituting the probe card 100 are different, the substrate 110, the spacer 120, and the reinforcing member 130 are not fixed with an adhesive as in the related art, and are simply fixed by the first mounting screw 160 and the second It is considered that the influence of the expansion of each member on the other members is significantly smaller than that of the conventional member because it is merely attached with the fixing screw 170.
【００２１】このため、一部の部材の歪みが他の部材へ
と及び、その結果として、プローブ１５０の接触部１５
１の位置が変わる、例えば上下方向に接触部１５１が移
動することが格段に少なくなる。このため、プローブ１
５０の接触部１５１の主として平面方向への移動に起因
する接触ミスや、主として上下方向への移動に起因する
電極２１１との間の接触圧の変動等は格段に少なくなる
と推測される。For this reason, the distortion of some members spreads to other members, and as a result, the contact portions 15 of the probe 150 are displaced.
The position of the contact portion 151 changes, for example, the contact portion 151 moves in the vertical direction is significantly reduced. Therefore, probe 1
It is presumed that contact errors caused mainly by the movement of the 50 contact portions 151 in the plane direction, and fluctuations in the contact pressure between the contact portions 151 and the electrodes 211 caused mainly by the movement in the vertical direction are significantly reduced.
【００２２】なお、図３に示す第２の実施の形態に係る
プローブカード２００は、第１の実施の形態に係るプロ
ーブカード１００の変形例であって、基板１１０と補強
部材１３０との間には、両者の摩擦を低減するシート状
のフッ素樹脂であるテフロン（登録商標）製の摩擦低減
シート１８０を介在させている点が、プローブカード１
００と相違する点である。The probe card 200 according to the second embodiment shown in FIG. 3 is a modified example of the probe card 100 according to the first embodiment, and is provided between the substrate 110 and the reinforcing member 130. The probe card 1 is characterized in that a friction reducing sheet 180 made of Teflon (registered trademark), which is a sheet-like fluororesin that reduces friction between the two, is interposed.
This is different from 00.
【００２３】かかる摩擦低減シート１８０を基板１１０
と補強部材１３０との間に介在させると、バーンインテ
スト時の熱による基板１１０等の膨張によって生じる基
板１１０と補強部材１３０との間の摩擦を低減させるこ
とができるので、一方の歪みが他方に伝わる率をより低
減させることが可能である。なお、この第２の実施の形
態に係るプローブカード２００のその他の部分は、第１
の実施の形態に係るプローブカード１００と同様である
ので、詳細な説明は省略するとともに、同じ符号を用い
て指し示すことにする。なお、摩擦低減シート１８０の
素材として挙げたテフロンはディポン社のポリ四フッ化
エチレン（ＰＴＦＥ）の商品名であるが、他のポリ三フ
ッ化塩化エチレン（ＰＣＴＦＥ）、ポリフッ化ビエリデ
ン（ＰＶＤＦ）、ポリフッ化ビニル（ＰＶＦ）、四フッ
化エチレン−六フッ化プロピレンの共重合体（ＦＥ
Ｐ）、四フッ化エチレン−エチレンの共重合体（ＥＴＦ
Ｅ）、四フッ化エチレン−パーフルオロアルキルビニル
エーテルの共重合体（ＰＥＡ）、三フッ化塩化エチレン
−エチレンの共重合体（ＥＣＴＦＥ）を用いてもよい。The friction reducing sheet 180 is attached to the substrate 110
And the reinforcing member 130, friction between the substrate 110 and the reinforcing member 130 caused by expansion of the substrate 110 or the like due to heat during a burn-in test can be reduced, so that one strain is It is possible to further reduce the transmission rate. The other parts of the probe card 200 according to the second embodiment are the same as those of the first embodiment.
Since the configuration is the same as that of the probe card 100 according to the embodiment, the detailed description will be omitted and the same reference numeral will be used to indicate the same. The Teflon listed as a material of the friction reducing sheet 180 is a trade name of polytetrafluoroethylene (PTFE) manufactured by Dipon Co., Ltd. Polyvinyl fluoride (PVF), copolymer of ethylene tetrafluoride-propylene hexafluoride (FE
P), a copolymer of ethylene tetrafluoride-ethylene (ETF
E), a copolymer of ethylene tetrafluoride-perfluoroalkylvinyl ether (PEA), and a copolymer of ethylene trifluoride-ethylene chloride (ECTFE) may be used.
【００２４】また、上述した第１の実施の形態では、第
１の取付用ネジ１６０でスペーサ１２０及び補強部材１
３０を基板１１０に取り付けていたが、図４に示す第３
の実施の形態に係るプローブカード３００のように、第
１の取付用ネジ１６０はスペーサ１３０のみを基板１１
０に取り付けるようにしてもよい。この場合には、第１
の取付用ネジ１６０は、補強部材１３０の腕部１３２と
腕部１３２との間で基板１１０とスペーサ１２０とを取
り付けることになる。このようにすると、より各部の歪
みが他の部分へ及ばないようになると考えられる。な
お、この第３の実施の形態に係るプローブカード３００
のその他の部分は、第１の実施の形態に係るプローブカ
ード１００と同様であるので、詳細な説明は省略すると
ともに、同じ符号を用いて指し示すことにする。In the first embodiment, the spacer 120 and the reinforcing member 1 are fixed by the first mounting screw 160.
30 was attached to the substrate 110, but the third
As in the probe card 300 according to the embodiment, the first mounting screw 160 only
0 may be attached. In this case, the first
The mounting screw 160 attaches the substrate 110 and the spacer 120 between the arm 132 of the reinforcing member 130 and the arm 132. By doing so, it is considered that the distortion of each part does not reach other parts. The probe card 300 according to the third embodiment
Are the same as those of the probe card 100 according to the first embodiment, detailed description thereof will be omitted, and the same reference numerals will be used.
【００２５】[0025]
【発明の効果】本発明に係るプローブカードは、基板
と、この基板の裏面側に取り付けられるスペーサと、前
記基板の表面側に取り付けられる補強部材と、前記スペ
ーサに取り付けられるプローブ固定部材と、前記基板に
形成された配線パターンに接続され、前記プローブ固定
部材に固定される複数本のプローブと、前記スペーサを
基板に取り付けるための第１の取付用ネジとを備えてお
り、少なくとも基板と補強部材との間及び基板とスペー
サとの間は接着剤では固定されておらず、かつ前記基板
と補強部材との間には、両者の摩擦を低減するシート状
の摩擦低減シートを介在させる。 According to the probe card of the present invention, there are provided a substrate, a spacer attached to the back surface of the substrate, a reinforcing member attached to the front surface of the substrate, a probe fixing member attached to the spacer, A plurality of probes connected to a wiring pattern formed on the substrate and fixed to the probe fixing member; and a first mounting screw for mounting the spacer to the substrate. And between the substrate and the spacer are not fixed with an adhesive , and the substrate
Between the reinforcement member and the sheet
Intervening a friction reducing sheet.
【００２６】このため、このプローブカードは分解修理
が容易である。また、膨張率の異なる部材を接着剤では
なくネジで取り付けているため、バーンインテストで各
部材が膨張しても、その歪みが他の部材に伝わらない。
その結果、プローブカードの全体の歪みが少なく、プロ
ーブの先端の接触部の上下方向の高さ位置や、平面方向
の位置の変化が従来のプローブカードより少なくなる。Therefore, the probe card can be easily disassembled and repaired. Further, since members having different expansion rates are attached with screws instead of adhesives, even if each member expands in the burn-in test, the distortion is not transmitted to other members.
As a result, the entire distortion of the probe card is small, and the vertical position of the contact portion at the tip of the probe and the change in the position in the planar direction are less than those of the conventional probe card.
【００２７】また、前記第１の取付用ネジが、前記スペ
ーサのみならず、補強部材をも基板に取り付けるものと
することも可能である。この場合には、特に基板への穴
明け箇所を減らすことにより、基板の配線を容易にし基
板の強度を低下させないという効果がある。Further, the first mounting screw may mount not only the spacer but also a reinforcing member on the substrate. In this case, there is an effect that the wiring of the substrate is facilitated and the strength of the substrate is not reduced, particularly by reducing the number of holes formed in the substrate.
【００２８】また、前記基板には、補強部材の一部又は
全部が入り込む開口が開設されていないので、基板に積
層基板を用いた場合、中層の配線の効率を低下させるこ
とがないとともに、基板の強度の低下それにともなう基
板の変形の容易さという問題を解消することができる。Further, since the substrate does not have an opening through which a part or the whole of the reinforcing member enters, when a laminated substrate is used as the substrate, the efficiency of the wiring in the middle layer is not reduced and the substrate is not reduced. The problem that the substrate is easily deformed due to the decrease in the strength of the substrate can be solved.
【００２９】さらに、前記基板と補強部材との間には、
両者の摩擦を低減するシート状の摩擦低減シートを介在
させると、バーンインテスト時の各部の膨張による歪み
がより他の部分に伝わりにくくなる。なお、摩擦低減シ
ートとしては、フッ素樹脂であるテフロン製のものがあ
る。Further, between the substrate and the reinforcing member,
If a sheet-like friction reducing sheet for reducing friction between both is interposed, distortion due to expansion of each part during the burn-in test is less likely to be transmitted to other parts. As the friction reducing sheet, there is a sheet made of Teflon which is a fluororesin.
【図１】本発明の第１の実施の形態に係るプローブカー
ドの概略的断面図である。FIG. 1 is a schematic sectional view of a probe card according to a first embodiment of the present invention.
【図２】本発明の第１の実施の形態に係るプローブカー
ドに用いられる補強部材の概略的平面図である。FIG. 2 is a schematic plan view of a reinforcing member used in the probe card according to the first embodiment of the present invention.
【図３】本発明の第２の実施の形態に係るプローブカー
ドの概略的断面図である。FIG. 3 is a schematic sectional view of a probe card according to a second embodiment of the present invention.
【図４】本発明の第３の実施の形態に係るプローブカー
ドの概略的断面図である。FIG. 4 is a schematic sectional view of a probe card according to a third embodiment of the present invention.
【図５】従来のこの種のプローブカードの概略的断面図
である。FIG. 5 is a schematic sectional view of a conventional probe card of this type.
【図６】従来のこの種のプローブカードの概略的断面図
である。FIG. 6 is a schematic sectional view of a conventional probe card of this type.
１００ プローブカード １１０ 基板 １２０ スペーサ １３０ 補強部材 １４０ プローブ固定部材 １５０ プローブ REFERENCE SIGNS LIST 100 probe card 110 substrate 120 spacer 130 reinforcing member 140 probe fixing member 150 probe
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G01R 1/06 - 1/073 G01R 31/26 H01L 21/66 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) G01R 1/06-1/073 G01R 31/26 H01L 21/66
Claims (4)
れるスペーサと、前記基板の表面側に取り付けられる補
強部材と、前記スペーサに取り付けられるプローブ固定
部材と、前記基板に形成された配線パターンに接続さ
れ、前記プローブ固定部材に固定される複数本のプロー
ブと、前記スペーサを基板に取り付けるための第１の取
付用ネジとを具備しており、少なくとも基板と補強部材
との間及び基板とスペーサとの間は接着剤では固定され
ておらず、かつ前記基板と補強部材との間には、両者の
摩擦を低減するシート状の摩擦低減シートを介在させる
ことを特徴とするプローブカード。1. A substrate, a spacer attached to a back surface of the substrate, a reinforcing member attached to a front surface of the substrate, a probe fixing member attached to the spacer, and a wiring pattern formed on the substrate. A plurality of probes connected to each other and fixed to the probe fixing member, and a first mounting screw for mounting the spacer to the substrate, at least between the substrate and the reinforcing member and between the substrate and the spacer. Is fixed with adhesive between
And between the substrate and the reinforcing member,
Insert a sheet-shaped friction-reducing sheet to reduce friction
A probe card , characterized in that:
のみならず、補強部材をも基板に取り付けるものである
ことを特徴とする請求項１記載のプローブカード。2. The probe card according to claim 1, wherein the first attachment screw attaches not only the spacer but also a reinforcing member to the substrate.
が入り込む開口が開設されていないことを特徴とする請
求項１又は２記載のプローブカード。3. The probe card according to claim 1, wherein the substrate does not have an opening through which part or all of the reinforcing member enters.
ることを特徴とする請求項１、２又は３記載のプローブ
カード。 4. The friction reducing sheet is made of a fluororesin.
The probe card according to claim 1, 2 or 3, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000040656A JP3343541B2 (en) | 2000-02-18 | 2000-02-18 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000040656A JP3343541B2 (en) | 2000-02-18 | 2000-02-18 | Probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001228171A JP2001228171A (en) | 2001-08-24 |
| JP3343541B2 true JP3343541B2 (en) | 2002-11-11 |
Family
ID=18564005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000040656A Expired - Lifetime JP3343541B2 (en) | 2000-02-18 | 2000-02-18 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3343541B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6972578B2 (en) * | 2001-11-02 | 2005-12-06 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
| US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
| JP2004150999A (en) * | 2002-10-31 | 2004-05-27 | Advantest Corp | Probe card |
| JP4571133B2 (en) * | 2003-07-28 | 2010-10-27 | ネクステスト システムズ コーポレイション | Device for flattening probe cards |
| WO2005083773A1 (en) * | 2004-02-27 | 2005-09-09 | Advantest Corporation | Probe card, and method of producing the same |
| JP2006010629A (en) * | 2004-06-29 | 2006-01-12 | Tokyo Electron Ltd | Probe card having parallel adjustment mechanism |
| JP4585873B2 (en) * | 2005-02-01 | 2010-11-24 | 日本電子材料株式会社 | Probe card reinforcement plate |
| JP5065626B2 (en) * | 2006-06-26 | 2012-11-07 | 日本電子材料株式会社 | Probe card |
| JP5190195B2 (en) * | 2006-11-29 | 2013-04-24 | 株式会社日本マイクロニクス | Electrical connection device |
| JP5251395B2 (en) * | 2008-09-24 | 2013-07-31 | 富士通株式会社 | Multilayer wiring board, probe card, and method for manufacturing multilayer wiring board |
| JP5991823B2 (en) | 2012-02-14 | 2016-09-14 | 株式会社日本マイクロニクス | Electrical connection device and method of assembling the same |
| CN113140477B (en) * | 2020-01-20 | 2022-09-16 | 创意电子股份有限公司 | Probe card module |
-
2000
- 2000-02-18 JP JP2000040656A patent/JP3343541B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001228171A (en) | 2001-08-24 |
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