JP3340060B2 - Semiconductor inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device, and more particularly to a semiconductor inspection device suitable for use in inspecting a semiconductor chip having a spherical connection terminal and a semiconductor device (device to be inspected). 2. Description of the Related Art In recent years, high density, high speed, and miniaturization of semiconductor devices have been demanded. In order to meet this demand, a semiconductor chip (so-called bare chip) or a semiconductor having a BGA (Ball Grid Array) structure which is not sealed in a package. A mounting method of mounting a plurality of devices directly on a circuit board has been frequently used.

In this mounting method, if, for example, one of a plurality of bare chips or semiconductor devices is defective, the entire device becomes defective, so that each bare chip or semiconductor device has high reliability. Required. Therefore, inspection for checking whether individual bare chips or semiconductor devices function normally has become an important issue.

[0003]

2. Description of the Related Art Conventionally, a semiconductor device having a spherical connection terminal projecting spherically on a lower surface thereof (hereinafter, a bare chip and a resin-sealed semiconductor device which are not resin-sealed) is generally referred to as a "semiconductor device". Various inspection methods have been proposed and implemented as inspection methods.

When an electrical operation test of a semiconductor device of this kind is performed, an inspection needle of an inspection device is brought into contact with the spherical connection terminal. Therefore, the electrical connection of each spherical connection terminal is inspected without deteriorating the spherical connection terminal as much as possible. In addition, it is required that the reliability of the inspection is high and the cost is low. 2. Description of the Related Art As a conventional semiconductor inspection apparatus, for example, there is an apparatus using a semiconductor test socket. The semiconductor test socket is configured to inspect the electrical operation of the semiconductor device using a probe (inspection needle).
In this inspection method, a plurality of probes are arranged on an inspection substrate so as to correspond to a plurality of spherical connection terminals formed on the lower surface of the semiconductor device, and the tip of the probe is brought into direct contact with the spherical connection terminal. This is an inspection method for performing an inspection.

That is, the semiconductor test socket has a plurality of probes provided in the same arrangement as the plurality of spherical connection terminals of the semiconductor device, and the probes have a U-shaped bent portion. ing. When the tip of the probe comes into contact with the spherical connection terminal of the semiconductor device and is pressed, the bent portion is deformed to reduce damage to the spherical connection terminal.

[0006]

However, when an electrical inspection of a semiconductor device is performed by the above-described probe inspection method, the connection with the tip of the probe is not sufficient because the height of the spherical connection terminals varies. And there is a problem that the inspection accuracy may be reduced.

Further, although the probe has a bent portion bent in a U-shape, when the tip of the probe comes into contact with the spherical connection terminal, the spherical connection terminal formed by solder is deformed. There was a fear. The present invention has been made in view of the above points, and provides a semiconductor inspection apparatus capable of performing inspection of a device to be inspected having a spherical connection terminal with high reliability and without deforming the spherical connection terminal. With the goal.

[0008]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means. In the invention of claim 1, wherein, in the semiconductor testing device for testing against the inspection device having spherical connection terminals, an insulating substrate in which an opening is formed at a position corresponding to said spherical connection terminals, at least the spherical connection Terminal
The connection portion to which is connected is deformable, and the insulating substrate
The wiring formed thereon is configured to extend to the opening.
And a contact member .

According to a second aspect of the present invention, in the semiconductor inspection apparatus according to the first aspect, the connecting portion has a cantilever shape extending from only one of the openings. It is characterized by the following. According to a third aspect of the present invention, in the semiconductor inspection apparatus according to the first aspect, the connecting portion has a beam-shaped support at both ends which is fixed to a position of the opening facing each other. It is characterized by having.

Further , according to the fourth aspect of the invention, a spherical connection is provided.
Semiconductor inspection for testing equipment under inspection with terminals
In the device, an opening is provided at a position corresponding to the spherical connection terminal.
An insulating substrate formed with a portion, and the opening of the insulating substrate
Fixed at a nearby position and at least the spherical connection terminal
The connected part extends to the opening in a deformable configuration
And a contact member having a configuration as described above.
It is assumed that. Further, in the fifth aspect of the present invention, prior to
The semiconductor inspection apparatus according to claim 4 , wherein the connection portion is formed by a wire.
According to a sixth aspect of the present invention, in the semiconductor inspection apparatus of the first aspect, one or more slit portions are formed in the connection portion.

[0011] In the invention of claim 7, wherein the billing
Item 7. The semiconductor inspection device according to any one of Items 1 to 6 , wherein at least a region of the connection portion connected to the spherical connection terminal has a rough surface. According to an eighth aspect of the present invention, in the semiconductor inspection apparatus according to any one of the first to seventh aspects, the semiconductor inspection apparatus is further formed of an elastically deformable material and configured to support at least the connection part. Characterized in that a reinforcing material is provided.

[0012] According to the ninth aspect of the present invention, the above-mentioned claim is provided.
Item 9. The semiconductor inspection device according to Item 8 , wherein an anisotropic conductive rubber is used as the reinforcing material. According to a tenth aspect of the present invention, in the semiconductor inspection apparatus according to the eighth aspect, a reticulated elastic body is used as the reinforcing member.

Further, in the invention according to claim 11 , the contract
9. The semiconductor inspection apparatus according to claim 8 , wherein the reinforcing member is a tubular member containing a liquid or gas inside. Each of the means described above operates as follows.

According to the first and fourth aspects of the present invention, even if the spherical connection terminals vary in size, the variation can be absorbed by deforming the connection portion. Therefore, all the spherical connection terminals can be reliably connected to the contact members, and the reliability of the test can be improved.

Further, when the connection portion is connected to the spherical connection terminal, the connection portion is deformed, so that sliding occurs between the connection portion and the spherical connection terminal. Therefore, even if an oxide film or dust exists on the surface of the connection portion and the spherical connection terminal, a wiping effect of removing the oxide film or dust by the above-described sliding can be obtained. According to the second aspect of the present invention,
By forming the connection portion in a cantilever shape extending from only one of the openings, the displacement of the connection portion can be increased, and the contact area between the connection portion and the spherical connection terminal is increased, so that the electric power is increased. Connection can be reliably performed.

According to the third aspect of the present invention, since the connecting portion has the shape of a support beam at both ends, the strength of the connecting portion can be increased, and the connecting portion is deteriorated by use over time. Can be prevented. According to the fifth aspect of the present invention, since the connecting portion is formed of a wire, the connecting portion can be formed by using a wire bonding technique, so that the formability of the connecting portion can be improved and the cost can be reduced. Can be achieved.

According to the sixth aspect of the present invention, a single or a plurality of slits are formed in the connecting portion.
The deformability of the connection portion can be improved, and the height variation of the spherical connection terminal can be effectively absorbed. Also,
Since the contact area between the connection portion and the spherical connection terminal increases, electrical connectivity can be improved.

According to the seventh aspect of the present invention, at least a region of the connection portion connected to the spherical connection terminal is made rough, so that the formed rough surface is in a state where fine irregularities are formed. The surface area is widened, and the fine projections bite into the spherical connection terminal, so that the electrical connection between the connection portion and the spherical connection terminal can be improved.

According to the eighth aspect of the present invention, the provision of the elastically deformable reinforcing member for supporting at least the connecting portion can improve the stability of the inspection. To explain this, it is necessary to deform the connection portion in order to absorb the height variation of the spherical connection terminal, and it is necessary to make the contact member in the connection portion thin. On the other hand, positions other than the opening of the contact member are supported by the insulating substrate, so that the mechanical strength of the contact member is maintained.

Further, the connection portion needs to be electrically connected to the spherical connection terminal, so that an opening is formed at a position of the insulating substrate facing the connection portion. Therefore, the connecting portion formed thin to deform as described above is exposed to the opening, and the mechanical strength of the connecting portion is reduced.
However, by providing a reinforcing material and supporting the connecting portion with the reinforcing material, the connecting portion can be protected by the reinforcing material even when a strong force is applied to the connecting portion. As a result, it is possible to prevent permanent deformation from occurring in the connection portion, and thus it is possible to always perform a stable inspection.

According to the ninth aspect of the present invention, since the anisotropic conductive rubber is used as the reinforcing material, the anisotropic conductive rubber has a function of mechanically reinforcing the connecting portion and a function of reinforcing the connecting portion. And an electrical function for electrical connection. Therefore, permanent deformation of the connection portion can be prevented by the above mechanical function, and the degree of freedom of wiring of the semiconductor inspection device can be improved by the electrical function.

According to the tenth aspect of the present invention, the use of the net-like elastic body as the reinforcing member makes it possible to reduce the space in which the reinforcing member is provided, and to reduce the size of the semiconductor inspection apparatus. Can be. Further, the cost can be reduced as compared with a block-shaped reinforcing material. Furthermore,
According to the eleventh aspect of the present invention, by using a tubular member having a liquid or gas inside as a reinforcing member, the reinforcing member is generated by adjusting the amount of liquid or gas filling the tubular member. The elastic force to be applied can be adjusted. Therefore, it is possible to reliably absorb variations in height of the spherical connection terminal and generate an appropriate elastic force that does not cause unnecessary deformation of the connection portion.

[0023]

Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show the first embodiment of the present invention.
It is a figure for explaining semiconductor inspection equipment 10A which is an example. FIG. 1 is a side sectional view of the semiconductor inspection device 10A, and FIG. 2 is a bottom view of the semiconductor inspection device 10A. The semiconductor inspection apparatus 10A according to the present embodiment is roughly composed of an insulating substrate 14 and a contact member 18.

This semiconductor inspection apparatus 10A is used when the semiconductor device 1 is mounted as shown in the figure and an electrical operation test is performed on the device under test in this mounted state. The device under test to be tested by the semiconductor inspection device 10A is a device having a spherical connection terminal 2 (hereinafter, referred to as a bump) as an external connection terminal. still,
In the following description, an example in which the semiconductor device 1 having the bumps 2 is mainly used as the device under test will be described. However, the semiconductor inspection device described in each of the following embodiments is a device having a spherical connection terminal as an external connection terminal. (For example, bare chips, wafers, etc.).

Hereinafter, a specific configuration of the semiconductor inspection apparatus 10A will be described. The insulating substrate 14 is a film-shaped member formed of an insulating resin material such as polyimide, and thus has some flexibility. A plurality of openings 16 are formed in the insulating substrate 14, and the positions where the openings 16 are formed correspond to the positions where the bumps 2 formed on the semiconductor device 1 are arranged.

Therefore, when the insulating substrate 14 and the semiconductor device 1 are positioned, each opening 16 formed in the insulating substrate 14 and the bump 2 are in a state of facing each other. The size of the opening 16 is set to be slightly larger than the diameter of the bump 2. Therefore, when the semiconductor device 1 is mounted on the semiconductor inspection apparatus 10 </ b> A, the opening 16 also functions as a guide hole for the bump 2. I do.

On the other hand, the contact member 18 is made of, for example, copper (C
u) a film formed in a predetermined pattern using a thin film forming technique such as a plating method, a vapor deposition method, an etching method, and a photolithography technique. The contact member 18 includes a wiring portion 20, a terminal portion 22, a connecting portion 24A, and the like, which are integrally formed. For example, as shown in FIG. 3, the terminal portion 22 is a portion to which a connection pin 42 that electrically connects the inspection board and the semiconductor inspection device 10 </ b> A is connected. Have been. The connection portion 24A is connected to the bump 2 of the semiconductor device 1.
And is provided at a position corresponding to the formation position of the bump 2. Wiring unit 20
Has the function of connecting the terminal portion 22 and the connection portion 24A.

As shown in FIG. 2, the connecting portion 24A
It has a substantially circular shape to correspond to the shape of the bump 2,
A slit 26A is formed in the center portion. In this embodiment, the shape of the slit 26 is a cross shape. Further, as described above, since the formation position of the connection portion 24A corresponds to the formation position of the bump 2, it also corresponds to the formation position of the opening 16 formed in the insulating substrate 14.

That is, the insulating substrate 14 is not formed at the position where the connecting portion 24A is formed, and the connecting portion 24A extends (exposes) from the opening 16. Therefore, when the semiconductor device 1 is mounted on the semiconductor inspection device 10A, the bump 2 is electrically connected to the connection portion 24A through the opening 16. At this time, as described above, the insulating substrate 14 is not formed at the formation position of the connection portion 24A, and the slit 26A is formed at the center position of the connection portion 24A. Therefore, the connection portion 24A is configured to be easily deformed by being pressed by the bump 2.

Next, a method of inspecting the semiconductor device 1 using the semiconductor inspection device 10A having the above configuration will be described. To perform an inspection on the semiconductor device 1,
The bump 2 provided on the semiconductor device 1 and the connecting portion 24A (opening 1) formed on the semiconductor inspection device 10A.
6), and then the semiconductor device 1 is pressed against the semiconductor inspection device 10A to connect the bump 2 to the connection portion 24A. A semiconductor inspection tester (not shown) is connected to the semiconductor inspection apparatus 10A, so that an electrical operation inspection is performed on the semiconductor device 1 while the semiconductor inspection apparatus is mounted on the semiconductor inspection apparatus 10A.

As described above, the process of mounting the semiconductor device 1 on the semiconductor inspection device 10A is extremely simple. Therefore, mounting processing of semiconductor device 1 to semiconductor inspection device 10A can be easily performed. The connecting portion 24A to which the bump 2 is connected has a deformable configuration. Therefore, even if there is a variation in the size of the bump 2 (that is, the bump height), the variation can be absorbed by the deformation of the connecting portion 24A. Therefore, all the bumps 2 can be reliably connected to the connection portion 24A (contact member 18), and the reliability of the test can be improved.

Also, as shown in FIG.
When A is connected to the bump 2, the connecting portion 24A is deformed, but the deformation of the connecting portion 24A causes sliding between the connecting portion 24A and the bump 2. Therefore, the connection portion 24A
And even if an oxide film or dust exists on the surface of the bump 2,
Oxide film and dust are scraped and removed by the above-mentioned sliding (this is called a wiping effect).

As a result, the surface of the connection portion 24A and the surface of the bump 2 can be always kept in a good state, and the inspection accuracy of the semiconductor inspection device 10A can be improved.
In addition, the mounting reliability of the semiconductor device 1 can be improved. Further, the semiconductor device 1 is a semiconductor inspection device 10
In the state of being mounted on A, the connecting portion 24A is deformed along the outer shape of the bump 2 as shown in FIG. As a result, the contact area between the connection portion 24A and the bump 2 is increased, so that electrical connection can be reliably performed. The operation and effect of the present embodiment described above also occur in each of the embodiments described later.

FIG. 3 shows a case where the semiconductor inspection apparatus 10A according to the first embodiment is applied to an inspection socket 30A used when inspecting the semiconductor device 1. Semiconductor inspection device 10
A is disposed in the main body 32 constituting the inspection socket 30A. A lid 34 is rotatably attached to the main body 32 by a shaft 36, and the lid 34 is configured to be locked in a closed position by a lock claw 38 (FIG. State).

In this locked state, the lid 34 presses the mounted semiconductor device 1 toward the semiconductor inspection device 10A,
As a result, the bumps 2 formed on the semiconductor device 1 as described above are connected to the connection portions 24A formed on the semiconductor inspection device 10A.
Connect with The semiconductor inspection device 10A is connected to an inspection board 40 via a terminal portion 22 and a connection pin 42. Therefore, a predetermined test can be performed on semiconductor device 1.

The semiconductor inspection apparatus 10A according to the present embodiment
Is not limited to the inspection of the semiconductor device 1 shown in FIG. 3, but can also be applied to the wafer contactors 44A and 44B shown in FIGS. The wafer contactors 44A and 44B are used when inspecting the wafer 3 on which the bumps 2 are formed after a predetermined electronic circuit is formed. Each of the wafer contactors 44A and 44B includes a wafer holder 46 for holding the wafer 3 and a base 48.

The wafer 3 is disposed on the wafer holder 46 with the bumps 2 facing upward, and the semiconductor inspection apparatus 10A is mounted thereon. Subsequently, a base 48 is provided on the upper part. At this time, since the base 48 has a small shape with respect to the wafer holder 46, the terminal 2 of the contact member 18 formed in the semiconductor inspection apparatus 10A is formed.
2 is exposed to the outside of the base 48.

With respect to the terminal portion 22 thus exposed,
In the wafer contactor 44A shown in FIG.
0 is electrically connected, and in the wafer contactor 44B shown in FIG. 5, the inspection is performed on the wafer 3 by electrically connecting the connector 52. As described above, the semiconductor inspection apparatus 10A according to the present embodiment can be applied to the inspection of the wafer 3 and can achieve the same effects as described above.
The same applies to each of the embodiments described below.

Next, a second embodiment of the present invention will be described. FIG. 6 shows a semiconductor inspection device 10B according to a second embodiment of the present invention. FIG. 6A shows a semiconductor inspection device 1.
FIG. 6B is a side cross-sectional view of FIG.
It is a bottom view of 0B. In FIG. 6, FIGS.
The same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIG.

The semiconductor inspection apparatus 10B according to the present embodiment
The connecting portion 24B has a cantilever shape extending from only one of the openings 16, and a rough surface 35 is formed at least in a region of the connecting portion 24B connected to the bump 2. . In this manner, by forming the connecting portion 24B in a cantilever shape, the displacement of the connecting portion 24B can be made large, so that even when the height variation of the bumps 2 is large, this can be reliably absorbed. And a highly reliable inspection can be performed. In addition, since the connecting portion 24B is largely displaced during connection, the contact area between the connecting portion 24B and the bump 2 is increased, so that the electrical connection between the connecting portion 24B and the bump 2 can be reliably performed.

Further, at least the bump 2 of the connecting portion 24B
Even if the region to be connected to the bumps 2 is formed as the rough surface 25, the electrical connection between the connection portion 24B and the bump 2 can be reliably performed. That is, since the rough surface 25 is in a state in which fine irregularities are formed, the surface area is large. Also,
The fine projections are in a state of being cut into the bumps 2 when the bumps 2 are in sliding contact with the connection portions 24B. Therefore, the connection portion 24
The electrical connectivity between B and the bumps 2 can be improved.

As a method of forming the rough surface 25, for example, a method of treating the surface of the connection portion 24B with a chemical, a method of using blasting, and the like are considered.
Next, a third embodiment of the present invention will be described. FIG.
Shows a semiconductor inspection apparatus 10C according to a third embodiment of the present invention. FIG. 7A is a side sectional view of the semiconductor inspection apparatus 10C, and FIG. 7B is a bottom view of a main part of the semiconductor inspection apparatus 10C. In FIG. 7, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

The semiconductor inspection apparatus 10C according to the present embodiment
The connecting portion 24C is constituted by a pair of cantilever portions 56. Specifically, the connection portion 24C
Is formed with a pair of cantilever portions 56 extending toward a central portion from a position opposed to the annular portion 56 as shown in FIG. 7B. It has been.

According to the structure of this embodiment, the cantilever portion 56 that is urged by the bump 2 and deformed when the semiconductor device 1 is mounted.
Is larger than the connecting portion 24A according to the first embodiment and smaller than the connecting portion 24B according to the second embodiment. Therefore, when the height variation of the bump 2 can be expected, the configurations of the first to third embodiments can be appropriately selected.

In the structure of this embodiment, the cantilever 5
Reference numeral 6 denotes a configuration in which the bump 2 is in contact at two locations on both sides of the bump 2, so that the bump 2 can be held in a more stable state as compared with the configuration of the second embodiment. Further, since the strength of the connecting portion 24C can be increased as compared with the configuration of the first embodiment, it is possible to prevent the plastic deformation of the connecting portion 24C.

Next, a fourth embodiment of the present invention will be described. FIG. 8 shows a semiconductor inspection apparatus 10D according to a fourth embodiment of the present invention. FIG. 8A shows a semiconductor inspection apparatus 1.
FIG. 8B is a side cross-sectional view of FIG.
It is a principal part bottom view of 0D. In FIG. 8, the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS.
The same components as those described above are denoted by the same reference numerals and description thereof is omitted.

In the above-described second embodiment, the connecting portion 24B has a flat cantilever shape. On the other hand, in the semiconductor inspection apparatus 10D according to the present embodiment, the connecting portion 24D has a bifurcated cantilever shape. 58. According to the configuration of the present embodiment, the connecting portion 24D is further easily deformed as compared with the second embodiment, and the height variation of the bump 2 can be effectively absorbed.

However, since the connecting portion 24D is easily deformed, the material of the contact member 18 is made of copper (C
In the case of u), plastic deformation may occur. Therefore, in the configuration of the present embodiment, the contact member 18
As the material of the (connecting portion 24D), it is desirable to select a material that is a spring material and has high conductivity. continue,
A fifth embodiment of the present invention will be described.

FIG. 9 shows a semiconductor inspection apparatus 10E according to a fifth embodiment of the present invention. FIG. 9A is a side sectional view of the semiconductor inspection device 10E, and FIG. 9B is a bottom view of a main part of the semiconductor inspection device 10E. In FIG. 9,
The same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

In the semiconductor inspection apparatuses 10B to 10E according to the second to fourth embodiments, the connection portions 24B to 24E have a cantilever shape. On the other hand, the semiconductor inspection apparatus 10E according to the present embodiment is characterized in that the connection portion 24E has a shape of a support beam at both ends. That is, the connecting portion 24E has the both-ends support beam portion 60, and both ends of the both-ends support beam portion 60 are integrally connected to the annular portion 54.

As described above, since the connecting portion 24E is constituted by the both-ends supporting beam portions 60 whose both ends are supported, the mechanical strength of the connecting portion 24E can be increased. Can be prevented from deteriorating. Next, a sixth embodiment of the present invention will be described. FIG. 10 shows a semiconductor inspection apparatus 10F according to a sixth embodiment of the present invention. Figure 10 (A) is a side sectional view of the semiconductor inspection device 10F, FIG. 10 (B) semiconductor
It is a principal part bottom view of the inspection apparatus 10F . In FIG. 10, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

The connecting portion 24F according to the present embodiment has a groove 63 formed at the center of the beam portion 60 at both ends according to the fifth embodiment shown in FIG. A beam portion 62 is formed.
As described above, the connection portion 2 is formed by the pair of support beam portions 62 at both ends.
By forming the 4F, the amount of deformation of the beam 62 at both ends of the support portion is increased, so that the height variation of the bump 2 can be effectively absorbed.

Further, since the groove 63 exists between the pair of support beam portions 62 at both ends, the lower end of the bump 2 is
Will be located within. Therefore, the bump 2 is connected to the connection 2
4F, the semiconductor inspection device 10
The positioning of the semiconductor device 1 with respect to F can be improved. Next, a seventh embodiment of the present invention will be described.

FIG. 11 shows a semiconductor inspection apparatus 10G according to a seventh embodiment of the present invention. FIG. 11A is a side sectional view of the semiconductor inspection device 10G, and FIG. 11B is a bottom view of a main part of the semiconductor inspection device 10G. In FIG. 11, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

The connecting portion 2 provided in the first embodiment described above.
In 4A, the connecting portion 24A is configured to be deformable by forming a cross-shaped slit 26A at the center thereof. On the other hand, the semiconductor inspection device 1 according to the present embodiment
The connecting portion 24G provided 0G, by forming a straight slit 26B, it is characterized in that it has a deformable structure the connecting portion 24G.

Although the connecting portion 24G provided in the present embodiment has a smaller deformation amount than the connecting portion 24A provided in the first embodiment, the mechanical strength is improved. Therefore, bump 2
It is effective to appropriately select the shape of the slits 26A and 26B depending on the material (for example, whether the bump 2 is solder or gold). Subsequently, the eighth aspect of the present invention
An example will be described.

FIG. 12 shows a semiconductor inspection apparatus 10H according to an eighth embodiment of the present invention. FIG. 12A is a side sectional view of the semiconductor inspection device 10H, and FIG. 12B is a bottom view of a main part of the semiconductor inspection device 10H. 12, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

The present embodiment is characterized in that the slit 26C formed in the connecting portion 24H has a circular shape and is provided at the center of the connecting portion 24H. With this configuration, the amount of deformation of the connection portion 24H can be adjusted in the same manner as described above. Further, since the slit 26C is located at the center of the connecting portion 24H and is circular, the bump 2 is always located at the center of the connecting portion 24H.
Can be improved.

Next, a ninth embodiment of the present invention will be described. FIG. 13 shows a semiconductor inspection apparatus 10I according to a ninth embodiment of the present invention. FIG. 13A is a side sectional view of the semiconductor inspection device 10I, and FIG. 13B is a bottom view of a main part of the semiconductor inspection device 10I. In FIG. 13, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

This embodiment is characterized in that a large number of small-diameter circular slits 26D are formed in the connection portion 24I. Thus, by forming a large number of circular slits 26D in the connecting portion 24I , it is possible to deform the connecting portion 24I in the same manner as in each of the above-described embodiments, and the amount of deformation is the number and diameter of the circular slits 26D. It is possible to adjust the size.

Also, as in the present embodiment, the circular slit 26
By forming a large number of D, the bumps 2
When pressed by I, the edge portion of each slit 26D comes into contact with and bumps into the bump 2 more. Therefore,
The connection portion 24I exhibits the same operation as the rough surface 25 described in the second embodiment, and thus the electrical connectivity between the bump 2 and the connection portion 24I can be improved.

Next, a tenth embodiment of the present invention will be described. FIG. 14 shows a semiconductor inspection apparatus 10J according to a tenth embodiment of the present invention. FIG. 14A is a side sectional view of the semiconductor inspection device 10J, and FIG. 14B is a bottom view of a main part of the semiconductor inspection device 10J. In FIG. 14, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

In each of the above-described embodiments, the connection portions 24A to 24A
4I was formed integrally with the contact member 18. On the other hand, the semiconductor inspection apparatus 10J according to the present embodiment is characterized in that the connection portion 24J is configured separately from the contact member 18. In this way, by forming the connecting portion 24J and the contact member 18 as separate components, the respective materials can be separately selected. Therefore, it is possible to select the most suitable material for the function of the connection part 24J and the function of the contact member 18 (the wiring part 20, the terminal part 22).

In the semiconductor inspection apparatus 10J according to the tenth embodiment shown in FIG. 14, the connection portion 24J is constituted by the foil electrode 64 in order to set the deformation of the connection portion 24J large. In this embodiment, copper (Cu) is used for the contact member 18 and aluminum is used for the foil electrode 64. Next, an eleventh embodiment of the present invention will be described.

FIG. 15 shows a semiconductor inspection apparatus 10K according to an eleventh embodiment of the present invention. FIG. 15A is a side sectional view of the semiconductor inspection device 10K, and FIG. 15B is a bottom view of a main part of the semiconductor inspection device 10K. In FIG. 15, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

In this embodiment, as in the tenth embodiment, the connecting portion 24K is configured separately from the contact member 18. Further, in the present embodiment, as shown in the drawing, the connecting portion 24K is constituted by a cantilever wire 66. This cantilever wire 66
Are formed using a wire bonding technique. Specifically, a wire is bonded to a position near the opening 6 of the contact member 18 using a wire bonding device,
Subsequently, after a predetermined amount of the wire is drawn, the wire is cut.
This state is a state shown by a broken line in FIG.

Thereafter, this wire is bent toward the opening 16 to form a cantilever wire 66. As described above, by forming the connection portion 24K using the wire bonding technique, the connection portion 24K can be formed easily and efficiently, and the cost can be reduced. Further, in the present embodiment, since the end of the connecting portion 24K is a cantilever wire 66 having one end fixed and the other end being a free end, the amount of deformation is relatively large. Even if the variation in height is large, it is possible to cope with this.

Next, a twelfth embodiment of the present invention will be described. FIG. 16 shows a semiconductor inspection apparatus 10L according to a twelfth embodiment of the present invention. FIG. 16A is a side sectional view of the semiconductor inspection device 10L, and FIG. 16B is a bottom view of a main part of the semiconductor inspection device 10L. In FIG. 16, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

Also in this embodiment, the connection portion 24K is formed by a wire, as in the eleventh embodiment. However, in the eleventh embodiment, the connecting portion 24K
This embodiment is characterized in that the connecting portion 24L is formed by the both-end supporting beam-shaped wire 68 while the connecting portion 24L is formed by the cantilevered wire 66. The both-end supporting beam-shaped wires 68 are also formed by using a wire bonding technique, and specifically, the frame portions 54 forming the contact members 18 are formed.
First, first bonding is performed at a position in the vicinity of the opening 16 , and then second bonding is performed on the frame portion 54 on the side opposite to the first bonding. As a result, both ends of the beam 68 are fixed to the frame 54. With this configuration, the mechanical strength of the cantilever wire 66 shown in the eleventh embodiment can be improved.

Next, a thirteenth embodiment of the present invention will be described. FIG. 17 is a bottom view of a main part of a semiconductor inspection apparatus 10M according to a thirteenth embodiment of the present invention. 17, the same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted. Semiconductor inspection apparatus 10 according to the present embodiment
The connecting portion 24M provided at M is characterized by using two end-supported beam-shaped wires 68 described in the twelfth embodiment and arranging them so as to cross each other. With this configuration, the effects described in the twelfth embodiment can be realized, and the movement of the bump 2 can be restricted as compared with the configurations of the eleventh and twelfth embodiments (see FIGS. 15 and 16). The positioning of the semiconductor device 1 with respect to the inspection device 10M can be improved.

Next, a fourteenth embodiment of the present invention will be described. FIG. 18 shows a semiconductor inspection apparatus 10N according to a fourteenth embodiment of the present invention. Incidentally, in FIG.
The same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. In each of the embodiments described above, the semiconductor inspection apparatuses 10A to 10M are basically configured by the insulating substrate 14 and the contact members 18. On the other hand, the semiconductor inspection apparatus 10N according to the present embodiment is characterized in that a reinforcing member 70A is provided in addition to the insulating substrate 14 and the contact member 18.

The reinforcing member 70 A is formed of an elastic member having an insulating property (for example, rubber, flexible resin, or the like), and is disposed below the contact member 18. Specifically, in this embodiment, since the holder 72 is provided, the reinforcing member 70A is first located on the holder 72, and the contact member 18 and the insulating substrate 14 are sequentially stacked on the reinforcing member 70A. I have.

By the way, in order to absorb the variation in height of the bumps 2, it is necessary to deform the connecting portion 24, and therefore, it is necessary to make the connecting portion 24 thin. In contrast,
Since the positions other than the position facing the opening 16 of the contact member 18 are supported by the insulating substrate 14, the mechanical strength is maintained. Further, the connection portion 24 needs to be electrically connected to the bump 2, and thus the opening 16 is formed at a position of the insulating substrate 14 facing the connection portion 24. Therefore, the connecting portion 24 formed as described above is exposed to the opening 16 and the mechanical strength of the connecting portion 24 is reduced.

However, by providing the reinforcing member 70A as in this embodiment and supporting the connecting portion 24 with the reinforcing member 70A, even when a strong force is applied to the connecting portion 24, the connecting member 24A is provided. Can be protected. As a result, it is possible to prevent permanent deformation from occurring in the connection portion 24, and thus it is possible to always perform a stable inspection.

In the configuration of the present embodiment, the holder 72 is provided below the semiconductor inspection apparatus 10N. The holder 72 is formed of a material having a low elastic deformation rate, such as a metal or a hard resin. The holder 72 is provided below the reinforcing member 70A so that the reinforcing member 70
It has the function of supporting A. Thus, the reinforcing member 70A
Is provided, it is possible to prevent the reinforcing member 70A from being deformed more than necessary and displaced from a predetermined arrangement position even if the reinforcing member 70A is elastically deformed when the semiconductor device 1 is mounted. Can be. Therefore, this also enables the electrical connection between the connection portion 24 and the bump 2 to be performed in a stable state.

Next, a fifteenth embodiment of the present invention will be described. FIG. 19 shows a semiconductor inspection apparatus 10P according to a fifteenth embodiment of the present invention. In FIG. 19, the same components as those of the semiconductor inspection apparatuses 10A and 10N according to the first and fourteenth embodiments shown in FIGS. 1, 2 and 18 are denoted by the same reference numerals, and the description thereof is omitted.

The semiconductor inspection apparatus 10P according to the present embodiment is characterized in that a protrusion 74 protruding toward the connection portion 24 is formed in a portion of the reinforcing member 70B facing the connection portion 24. As described above, since the protrusion 74 protruding toward the connection portion 24 is formed at a portion of the reinforcing member 70B facing the connection portion 24, the separation distance between the connection portion 24 and the protrusion 74 is reduced. For this reason, even if the connecting portion 24 is deformed by application of an external force, the projecting portion 74 immediately
To protect it. Therefore, it is possible to reliably prevent the connection portion 24 from being excessively deformed and damaged.

Next, a sixteenth embodiment of the present invention will be described. FIG. 20 shows a semiconductor inspection apparatus 10Q according to a sixteenth embodiment of the present invention. 20, the same components as those of the semiconductor inspection apparatuses 10A and 10N according to the first and fourteenth embodiments shown in FIGS. 1, 2, and 18 are denoted by the same reference numerals, and the description thereof will be omitted.

The semiconductor inspection apparatus 10Q according to the present embodiment is characterized in that an inverted conical groove 76 which is recessed in an inverted conical shape is formed in a portion of the reinforcing member 70C facing the connecting portion 24. By forming an inverted conical groove 76 at a portion of the reinforcing member 70C facing the connecting portion 24 as in the present embodiment, positioning of the bump 2 is added to the opening 16 formed in the insulating substrate 14, This can be done by a conical groove 76. Therefore, the positioning of the semiconductor device 1 with respect to the semiconductor inspection device 10Q can be improved.

Since the inverted conical groove 76 has an inverted conical shape, its wall surface is tapered. For this reason, compared with a columnar or rectangular groove shape in which the wall surface is in a vertical state, the connecting portion 24 immediately comes into contact with the reinforcing member 70C at the time of deformation, thereby preventing the permanent deformation of the connecting portion 24. it can. Next, a seventeenth embodiment of the present invention will be described.

FIG. 21 shows a semiconductor inspection apparatus 10R according to a seventeenth embodiment of the present invention. In FIG. 21, the same components as those of the semiconductor inspection apparatuses 10A and 10N according to the first and fourteenth embodiments shown in FIGS. 1, 2, and 18 are denoted by the same reference numerals, and description thereof will be omitted. The semiconductor inspection apparatus 10R according to the present embodiment is characterized by using an anisotropic conductive rubber as the reinforcing member 70D.
This anisotropic conductive rubber has a configuration in which conductive metal powder is mixed into a flexible insulating material such as silicon rubber, and has a property of being conductive in the pressing direction.

Therefore, by using anisotropic conductive rubber as the reinforcing member 70D, a function of mechanically reinforcing the connecting portion 24 with the reinforcing member 70D and an electric function of electrically connecting to the connecting portion 24 can be obtained. It is possible to have two functions. Thereby, the connection part 2 is formed by the mechanical function described above.
4 can be prevented, and the degree of freedom of wiring of the semiconductor inspection device 10R can be improved by an electrical function.

Next, an eighteenth embodiment of the present invention will be described. FIG. 22 shows a semiconductor inspection apparatus 10S according to an eighteenth embodiment of the present invention. FIG. 22A is a side sectional view of the semiconductor inspection device 10S, and FIG. 22B is a bottom view of a main part of the semiconductor inspection device 10S. Note that, in FIG. 22, the first and fourteenth buttons shown in FIGS. 1, 2 and 18 are used.
The same components as those of the semiconductor inspection devices 10A and 10N according to the embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The semiconductor inspection apparatus 10S according to the present embodiment
A plurality of long holes 80 are formed in the reinforcing member 70E. The plurality of long holes 80 are formed as shown in FIG.
As shown in (1), they are formed in a configuration arranged substantially in parallel. As described above, by forming the plurality of elongated holes 80 in the reinforcing member 70E, even if the reinforcing member 70E is deformed by the pressing of the bumps 2 at each connection portion 24, this deformation is caused by the deformation of the elongated hole 80. Is absorbed by That is, even if deformation occurs in the area defined by the long holes 80 (indicated by 81A to 81C in the figure), the deformation occurs in the adjacent area 81A.
To 81C, so that the connecting portion 24
And the bump 2 can be reliably connected electrically.

Next, a nineteenth embodiment of the present invention will be described. FIG. 23 is a bottom view of a main part of a semiconductor inspection apparatus 10T according to a nineteenth embodiment of the present invention. In FIG. 23, the same components as those of the semiconductor inspection apparatuses 10A and 10N according to the first and fourteenth embodiments shown in FIGS. 1, 2, and 18 are denoted by the same reference numerals, and description thereof is omitted.

The semiconductor inspection apparatus 10T according to the present embodiment is characterized in that a net-like elastic body is used as the reinforcing member 70F. The reinforcing material 70F configured as this net-like elastic body has a configuration in which, for example, an elastic wire (insulating wire) is braided in a net shape. Therefore, the reinforcing member 70F is configured to be flexibly deformed when a pressing force is applied. The reinforcing member 70F is provided on the entire lower surface of the insulating substrate 14, including the lower surface of the connection portion 24.

As in the present embodiment, the use of a reticulated elastic body as the reinforcing member 70F allows the reinforcing member 70F to be used in comparison with the configuration of the fourteenth to eighteenth embodiments shown in FIGS.
Of the semiconductor inspection apparatus 10T can be reduced. Further, the cost can be reduced as compared with the block-shaped reinforcing members 70A to 70E.

Next, a twentieth embodiment of the present invention will be described. FIG. 24 is a side sectional view of a semiconductor inspection apparatus 10U according to a twentieth embodiment of the present invention. In FIG. 24, the same components as those of the semiconductor inspection apparatuses 10A and 10N according to the first and fourteenth embodiments shown in FIGS. 1, 2 and 18 are denoted by the same reference numerals and the description thereof will be omitted.

The semiconductor inspection apparatus 10U according to this embodiment is characterized in that a tubular member capable of containing a liquid or gas (air in this embodiment) is used as the reinforcing member 70G. The reinforcing member 70G configured as a tubular member is connected to, for example, a gas supply unit (for example, an air pump), and is configured to introduce air into the reinforcing member 70G. This reinforcing material 70G
Is disposed below the insulating substrate 14 and the contact member 18.

Semiconductor inspection apparatus 10U having the above configuration
According to this, the elastic force generated in the reinforcing member 70G can be adjusted by adjusting the amount of air filled in the reinforcing member 70G. Therefore, it is possible to reliably absorb variations in height of the bumps 2 and generate an appropriate elastic force that does not cause unnecessary deformation of the connection portion 24. Further, for example, after the bump 2 is connected to the connection portion 24, by intentionally increasing and decreasing the internal pressure in the reinforcing member 70G, a sliding operation can be generated between the connection portion 24 and the bump 2. Therefore, even if an oxide film or dust exists on the surfaces of the connection portion 24 and the bumps 2, the oxide film or dust can be removed by the wiping effect, and the connection portion 2 is always removed.
4 and the surfaces of the bumps 2 can be in a good state.

Next, a description will be given of a twenty-first embodiment of the present invention. FIG. 25 shows a twenty-first embodiment of the present invention. This embodiment is characterized in that the semiconductor inspection device 10U according to the twentieth embodiment shown in FIG. 24 is applied to an inspection socket 30B. In FIG. 25, the same components as those of the semiconductor inspection apparatuses 10A and 10U according to the first and twentieth embodiments shown in FIGS. 1, 2 and 24 are denoted by the same reference numerals, and the description thereof will be omitted.

As shown, the semiconductor inspection apparatus 10U
Are arranged in a holder 72 constituting the inspection socket 30B. The holder 72 is attached to the lid 3 by the shaft 36.
The cover 34 is rotatably mounted, and the cover 34 is configured to be locked in a closed position by a lock claw (not shown). In this locked state, the lid 34 presses the mounted semiconductor device 1 toward the semiconductor inspection device 10U,
Thereby, the bump 2 is connected to the connection part 24 formed in the semiconductor inspection device 10U. In addition, the semiconductor inspection device 1
0U is connected to the inspection board 40 via the terminal section 22 and the contactor 84. Therefore, a predetermined test can be performed on semiconductor device 1.

On the other hand, a pipe 86 connected to a high-pressure air source is provided in the reinforcing member 70G, and a valve device 88 is provided at an intermediate position of the pipe 86. This valve device 88
Is a three-way valve, for example, a mode for introducing high-pressure air into the reinforcing member 70G (hereinafter referred to as an introduction mode),
It is configured to be able to perform a switching process to a mode for discharging the air in 0G (hereinafter, referred to as a discharge mode).

Accordingly, by appropriately switching between the introduction mode and the discharge mode by controlling the valve device 88, the internal pressure of the reinforcing member 70G can be controlled to a desired value, and the wiping effect described above can be realized. Can be. Next, a twenty-second embodiment of the present invention will be described. FIG. 26 is a side sectional view of a semiconductor inspection apparatus 10V according to a twenty-second embodiment of the present invention. In FIG. 26,
The same components as those of the semiconductor inspection apparatus 10A according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

The semiconductor inspection apparatus 10V according to the present embodiment
It is characterized in that an insulating substrate 14A provided with a contact member 18A and an insulating substrate 14B provided with a contact member 18B are laminated. As described above, by using a configuration in which the configuration of the semiconductor inspection apparatus 10V is stacked, the connection portion 24P provided on the contact member 18A formed on the insulating substrate 14A is used for connection with the bump 2A, and is formed on the insulating substrate 14B. The bumps 2 (2A, 2A) that are connected in each layer, such as using the connection portions 24N provided on the contact members 18B provided for connection to the bumps 2B.
The number of B) can be reduced.

As a result, the wiring of the contact members 18A and 18B in each layer can be given a degree of freedom.
It is possible to sufficiently cope with a high-density semiconductor device 1 in which a large number of bumps 2 are provided.

[0097]

According to the present invention as described above, the following various effects can be realized. Claim 1 and Claim
According to the invention described in Item 4 , even if the spherical connection terminals vary in size, the variation can be absorbed by deforming the connection portion, and thus all the spherical connection terminals can be reliably connected to the contact member. , And the reliability of the test can be improved.

Further, when the connecting portion is connected to the spherical connecting terminal, the connecting portion is deformed, so that sliding occurs between the connecting portion and the spherical connecting terminal. Even if an oxide film or dust is present, the oxide film or dust can be removed by the above-described sliding. Also,
According to the second aspect of the present invention, by disposing the connection portion in a cantilever shape, the displacement of the connection portion can be increased, and the contact area between the connection portion and the spherical connection terminal increases.
Therefore, electrical connection can be reliably performed.

According to the third aspect of the present invention, the strength of the connecting portion can be increased by forming the connecting portion in the shape of a support beam at both ends, so that the connecting portion is degraded by use over time. Can be prevented. Claims
According to the fifth aspect of the invention, by forming the connection portion with a wire, it is possible to form the connection portion using a wire bonding technique, thereby improving the formability of the connection portion and reducing the cost. Can be.

According to the sixth aspect of the present invention, a single or a plurality of slits are formed in the connecting portion.
The deformability of the connection portion can be improved, and the height variation of the spherical connection terminal can be effectively absorbed. Also,
Since the contact area between the connection portion and the spherical connection terminal increases, electrical connectivity can be improved. Claim 7
According to the invention described, the rough surface formed on the connection portion is in a state in which fine irregularities are formed and the surface area is wide, and the fine protrusion is in a state of biting into the spherical connection terminal. The electrical connection with the spherical connection terminal can be improved.

According to the eighth aspect of the present invention, by providing a reinforcing member made of an elastically deformable material for supporting at least the connection portion, the stability of the inspection can be improved. According to the ninth aspect of the present invention, since the anisotropic conductive rubber has a function of mechanically reinforcing the connecting portion and an electrical function of electrically connecting to the connecting portion,
The permanent deformation of the connection portion can be prevented, and the degree of freedom of wiring of the semiconductor inspection device can be improved.

According to the tenth aspect of the present invention, the use of the net-like elastic body as the reinforcing member makes it possible to reduce the space in which the reinforcing member is provided, and to reduce the size of the semiconductor inspection apparatus. Can be. Further, the cost can be reduced as compared with a block-shaped reinforcing material. Furthermore,
According to the eleventh aspect of the present invention, since the elastic force generated in the reinforcing member can be adjusted by adjusting the amount of the liquid or gas to be filled in the tubular member, the height variation of the spherical connection terminal can be reliably reduced. And an appropriate elastic force that does not cause unnecessary deformation of the connection portion can be generated.

[Brief description of the drawings]

FIG. 1 is a view for explaining a semiconductor inspection apparatus according to a first embodiment of the present invention (part 1).

FIG. 2 is a view for explaining a semiconductor inspection apparatus according to a first embodiment of the present invention (part 2).

FIG. 3 is a diagram showing an inspection socket to which the semiconductor inspection device according to the first embodiment of the present invention is applied.

FIG. 4 is a view showing a wafer contactor to which the semiconductor inspection device according to the first embodiment of the present invention is applied (part 1);

FIG. 5 is a view showing a wafer contactor to which the semiconductor inspection apparatus according to the first embodiment of the present invention is applied (part 2).

FIG. 6 is a view for explaining a semiconductor inspection apparatus according to a second embodiment of the present invention.

FIG. 7 is a view for explaining a semiconductor inspection apparatus according to a third embodiment of the present invention.

FIG. 8 is a view for explaining a semiconductor inspection apparatus according to a fourth embodiment of the present invention.

FIG. 9 is a view for explaining a semiconductor inspection apparatus according to a fifth embodiment of the present invention.

FIG. 10 is a view for explaining a semiconductor inspection apparatus according to a sixth embodiment of the present invention.

FIG. 11 is a view for explaining a semiconductor inspection apparatus according to a seventh embodiment of the present invention.

FIG. 12 is a view for explaining a semiconductor inspection apparatus according to an eighth embodiment of the present invention.

FIG. 13 is a view for explaining a semiconductor inspection apparatus according to a ninth embodiment of the present invention.

FIG. 14 is a view for explaining a semiconductor inspection apparatus according to a tenth embodiment of the present invention.

FIG. 15 is a view for explaining a semiconductor inspection apparatus according to an eleventh embodiment of the present invention.

FIG. 16 is a view for explaining a semiconductor inspection apparatus according to a twelfth embodiment of the present invention.

FIG. 17 is a view for explaining a semiconductor inspection apparatus according to a thirteenth embodiment of the present invention.

FIG. 18 is a view for explaining a semiconductor inspection apparatus according to a fourteenth embodiment of the present invention.

FIG. 19 is a view illustrating a semiconductor inspection apparatus according to a fifteenth embodiment of the present invention.

FIG. 20 is a view for explaining a semiconductor inspection apparatus according to a sixteenth embodiment of the present invention;

FIG. 21 is a view for explaining a semiconductor inspection apparatus according to a seventeenth embodiment of the present invention.

FIG. 22 is a view illustrating a semiconductor inspection apparatus according to an eighteenth embodiment of the present invention.

FIG. 23 is a view for explaining a semiconductor inspection apparatus according to a nineteenth embodiment of the present invention;

FIG. 24 is a view for explaining a semiconductor inspection apparatus according to a twentieth embodiment of the present invention.

FIG. 25 is a view illustrating a semiconductor inspection apparatus according to a twenty-first embodiment of the present invention.

FIG. 26 is a view illustrating a semiconductor inspection apparatus according to a twenty-second embodiment of the present invention.

[Explanation of symbols]

 10A to 10V Semiconductor inspection apparatus 14, 14A, 14B Insulating substrate 16, 16A, 16B Opening 18, 18A, 18B Contact member 20 Wiring section 22 Terminal section 24, 24A to 24P Connection section 25 Rough surface 26A to 26D Slit 30A, 30B Inspection socket 40 Inspection board 44A, 44B Wafer contactor 50 Contactor 52 Connector 56 Cantilever part 58 Bifurcated cantilever part 60, 62 Both ends support beam part 64 Foil electrode 66 Cantilever wire 68 Both ends support form Wires 70A to 70G Reinforcement material 72 Holder 74 Projection 76 Inverted conical groove 78 Connection electrode 80 Slot 84 Contactor 88 Valve device

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A 8-271578 (JP, A) JP-A 8-83656 (JP, A) JP-A 8-64320 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 21/66 G01R 1/073 G01R 31/26

Claims (11)

(57) [Claims] 1. For a device to be inspected having a spherical connection terminal
An opening was formed at a position corresponding to the spherical connection terminal.
An insulating substrate;At least the connection part to which the spherical connection terminal is connected is deformed
In a possible configuration, the wiring formed on the insulating substrate is
A contact member configured to extend to the opening,  A semiconductor inspection device comprising: 2. The semiconductor inspection device according to claim 1, wherein the connection portion has a cantilever shape extending from only one of the openings. 3. The semiconductor inspection apparatus according to claim 1, wherein the connection portion has a configuration in which both ends are fixed to opposite ends of the opening in a shape of a support beam at both ends. Semiconductor inspection equipment. 4. An apparatus to be inspected having a spherical connection terminal.
In a semiconductor inspection apparatus for performing a test, an opening was formed at a position corresponding to the spherical connection terminal.
An insulating substrate , fixed at a position near the opening of the insulating substrate,
The connection part to which the spherical connection terminal is connected can be deformed
A contact portion configured to extend to the opening in the configuration
Semiconductor inspection device characterized by being provided with wood, a. 5. The semiconductor inspection apparatus according to claim 4, wherein
A semiconductor inspection device , wherein the connection portion is formed of a wire . 6. A semiconductor inspection apparatus according to claim 1, wherein
A single or a plurality of slit portions formed in the connection portion . 7. The method according to claim 1, wherein
In the semiconductor inspection device, a region of the connection portion connected to at least the spherical connection terminal.
A semiconductor inspection device characterized by having a roughened area . 8. The method according to claim 1, wherein
In the semiconductor inspection device, furthermore, the semiconductor inspection device is formed of an elastically deformable material, and at least
A semiconductor inspection device comprising a reinforcing member configured to support the connection portion . 9. A semiconductor inspection apparatus according to claim 8, wherein
Te, semiconductor inspection device characterized by using an anisotropic conductive rubber as the reinforcing material. 10. The semiconductor inspection apparatus according to claim 8, wherein
Te, semiconductor inspection device characterized by using the net-like elastic member as the reinforcing material. 11. The semiconductor inspection apparatus according to claim 8, wherein
And a tube containing a liquid or gas as the reinforcing material.
A semiconductor inspection apparatus characterized in that the semiconductor inspection apparatus is a probe member.