JPH11108989A - Measuring method of semiconductor device and socket for measurement - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring method of a semiconductor device and a socket for measurement which facilitates mounting work of a contact, while improving contacting performance between the contact and an electrode part of a wire board. SOLUTION: A contact mounting plate material 22 in which contacts 4 are arranged corresponding to an array interval of terminals 10a of a semiconductor device 10 is interposed between a positioning member 2 for positioning the semiconductor device 10 and a wire board 3, and the contacts 4 are arranged between the terminals 10a and electrode parts 3a of the wire board 3. The contacts 4 are supported on the contact mounting plate 22 to eliminate bonding work of the electrode parts 3a, thereby lowering production costs with easier mounting work of the contacts 4. This also enables the maintenance of the contacts 4. Moreover, higher improvement is realized in the contacting ability between the contacts 4 and the electrode parts 3a thereby minimizing a contact resistance value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a socket for measuring a semiconductor device, and more particularly, to an electrical measurement of a semiconductor device by connecting an electrode portion of the semiconductor device to a test circuit via the socket for measurement. The present invention relates to a method for measuring a semiconductor device and a socket for measurement.

[0002]

2. Description of the Related Art In recent years, a BGA (Ball Grid Arra) has been developed as a new package having excellent mountability, mounting cost and electrical characteristics.
y) / CSP (Chip Size Package, Chip Scale Packa)
ge) is on the market and is becoming a major semiconductor package component. BGA has solder bumps (terminals) arranged in a mesh pattern on the surface of the mounting board side. Even if there is some misalignment when mounting on the mounting board, the component is applied by the surface tension when solder is melted. Has a self-alignment function (automatic alignment function) for adjusting the position to a predetermined mounting position. Note that the CSP has a narrower arrangement interval of terminals in the BGA.

Electrical measurement of these semiconductor devices such as BGA / CSP (function test, measurement of disconnection / short circuit, etc., high temperature test such as burn-in process, or measurement for evaluation)
Is conventionally performed by connecting to a test circuit via a measuring socket. That is, as shown in FIG. 4, a positioning member 2 mainly having an insertion hole 2a for positioning the semiconductor device 10, a wiring board 3 connected to an external circuit such as a test circuit, and a terminal 1 of the semiconductor device 10
The electrical characteristics of the semiconductor device are measured by using a socket 1 composed of a stylus 4 that electrically connects the first electrode 0a and the electrode portion 3a of the wiring board 3.

The conventional measuring socket 1 will be further described. The probe 4 is constituted by a conductive spring positioned by a resin partition plate 6 so as to correspond to the arrangement interval of the terminals 10a of the semiconductor device 10. The contactor 2 and the partition plate 6 are bonded and fixed on the wiring board 3 by the anisotropic conductive adhesive film 5. At this time, the probe 4 is connected via an adhesive film 5 to an electrode portion 3a formed on the wiring board 3 as shown in FIG. Further, the positioning member 2
It is inserted into the guide pin 7 fixed to the wiring board 3 and is positioned with respect to the wiring board 3. The semiconductor device 10 mounted on the positioning member 2 is electrically connected to the electrode portions 3a of the wiring board 3 while receiving the pressing action of the pressing block 15 as shown by the arrow F. Reference numeral 8 denotes a lead pin for connecting the wiring board to an external circuit such as a test circuit (not shown).

[0005]

However, in the conventional measuring socket 1, the entire contact 4 is bonded to the wiring board 3 at one time.
If the number of 0 terminals 10a is 100, for example, the same number of the tentacles 4 is required, and the arrangement interval is 0.5 mm.
If only one of them is defective, the entire socket 1 will be defective. Therefore, there is a problem that it is very difficult to properly adhere and fix all of the tentacles 4 on the wiring board 3. . The reason is that once the stylus 4 is adhered, it cannot be repaired (removed), and if even one stitch of the stylus 4 becomes defective, the wiring board 3 must be replaced.

Further, since the adhesive film 5 is interposed between the probe 4 and the electrode portion 3a of the wiring board 3, the contact resistance is large, and the measurement depends on the resistance value (measurement other than high frequency). Not suitable for). That is, there is a problem that the contact between the probe 4 and the electrode portion 3a is poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a method of measuring a semiconductor device capable of facilitating a work of attaching a probe and improving a contact property between the probe and an electrode portion of a wiring board. And a socket for measurement.

[0008]

According to the present invention, a contact is provided on a mounting plate corresponding to an arrangement interval of terminals of a semiconductor device, and the mounting plate is connected to a wiring board connected to the semiconductor device and an external circuit. Between the terminal of the semiconductor device and the electrode portion of the wiring board, so that the tentacle can be attached to and detached from the wiring board.
The electrode portion of the wiring board and the contact are directly brought into contact with each other. Thus, the operation of attaching the tentacles is made easier than before, and the maintenance of the tentacles can be performed. Further, the contact property between the tentacles and the electrode portion can be improved.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a measuring socket of a semiconductor device according to an embodiment of the present invention.
Indicated by In the figure, parts corresponding to those in FIG. 4 are denoted by the same reference numerals. Measurement socket 21
Are mainly insertion holes 2 for positioning the semiconductor device 10.
a, a wiring board 3 connected to an external circuit such as a test circuit (not shown), and a semiconductor device 10.
And a contact 4 for electrically connecting the terminal 10a of the wiring board 3 to the electrode portion 3a of the wiring board 3. The semiconductor device 10 is a chip-size package component (CSP) having one terminal.
00, the arrangement interval of the terminals 10a is 0.5 mm. The contact 4 is made of a spring, has an outer diameter of 0.215 mm, and a wire diameter of 0.0
The surface is gold-plated at 5 mm. The positioning member 2 is made of an aluminum-based metal. The electrode portion 3a of the wiring board 3 has a height of 33 μm, and its surface is plated with gold.

The tentacles 4 are attached to a tentacle mounting plate member 22 made of, for example, a polyimide film having a thickness of 0.5 mm so as to correspond to the arrangement interval of the terminals 10a of the semiconductor device 10. Therefore, in the present embodiment, as shown in FIG. 2, a mounting hole 22a smaller than the outer diameter of the touch element 4 is formed in the touch element mounting plate 22, and the touch element 4 is screwed here, that is, a bolt is attached to the nut. The tentacle 4 is inserted by twisting (along the spiral) so as to fit. In the present embodiment,
The stainless steel guide pins 7 for positioning the positioning member 2 with respect to the wiring board 3 allow the contactor mounting plate 2
2 is positioned with respect to the wiring board 3 in common with the positioning member 2.

As described above, in the present embodiment, by supporting the tentacles 4 with the tentacle mounting plate member 22, the electrode portion 3a of the wiring board 3 and the
The operation of bonding the tentacle 4 to the terminal 10a of the semiconductor device 10 and the electrode portion 3a of the wiring board 3 is performed by interposing the tentacle mounting plate 22 between the positioning member 2 and the wiring board 3. It is arranged between.

Therefore, according to the present embodiment, since the work of bonding the electrode portion 3a of the wiring board 3 and the touch element 4 is not required, the measuring socket 21 can be easily manufactured, and the production socket is correspondingly manufactured. The cost can be reduced as compared with the conventional case. In addition, the replacement of the tentacle 4 is performed by the tentacle mounting member 22.
Can be easily performed by removing the measuring socket 21, so that the maintenance of the measuring socket 21 which has been impossible in the related art can be performed. In addition, according to the present embodiment, since the tentacles 4 are attached to the tentacle mounting member 22 by screwing, the separation operation can be easily performed, and therefore, the replacement operation of each tentacle 4 can be performed. Can also be realized.

Further, according to the present embodiment, the wiring board 3
The contact 4 can be directly contacted with the electrode portion 3a, so that the contact property (contact property) between the two can be improved and the contact resistance value can be reduced. Measurement (measurement other than high-frequency) can be sufficiently supported. Further, a contact error can be prevented for a semiconductor device (CSP) having 100 to 300 terminals.

Although the embodiments of the present invention have been described above, the present invention is, of course, not limited thereto, and various modifications can be made based on the technical concept of the present invention.

For example, in the above-described embodiment, an example in which a CSP is applied as the semiconductor device 10 has been described. However, the present invention is also applicable to electrical measurement of a flip-chip type semiconductor device having bumps formed on a bare chip. is there. Also,
The outer diameter, the wire diameter, etc. of the spring which is the contactor 4 can be changed as appropriate, and the present invention can be applied to all ball type, bump type, and round type terminal shapes.

In the above-described embodiment, the spring-made tentacles 4 are screwed into the attachment holes 22a of the tentacle attachment plate 22 and inserted. The tentacle 4 may be fixed by press-fitting it into the mounting hole 22a smaller than the outer diameter. Furthermore, the touch element 4 can be fixed to the mounting hole using an adhesive.

In the above embodiment, the wiring board 3
In contrast to the above, the contact member mounting plate 22 is positioned by the guide pin 7, but may be configured as shown in FIG. 3 instead. That is, the mounting plate member 25 on which the tentacles 4 are disposed may be positioned in common with the semiconductor device 10 by the insertion holes 2 a of the positioning member 2. According to this configuration, it is of course possible to obtain the same effect as that of the above-described first embodiment. However, according to this configuration example, the attachment / detachment work of the tentacle attachment plate 25 involves the removal of the positioning member 2. This is advantageous in that it can be performed without using any other method. In the figure, parts corresponding to those in FIG.
Detailed description is omitted.

[0019]

As described above, according to the method for measuring a semiconductor device and the measuring socket of the present invention, the measuring socket can be easily manufactured without the need for the work of bonding the electrode portion of the wiring board and the probe. And the production cost can be reduced accordingly. In addition, since the operation of replacing the tentacle can be easily performed by removing the tentacle mounting member, it becomes possible to perform maintenance of the measurement socket, which was impossible in the related art. further,
Since the contact property between the electrode portion and the touch element can be improved, it is possible to sufficiently cope with electrical measurement depending on the resistance value.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a measuring socket according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a main part in FIG.

FIG. 3 is a sectional view of a measuring socket showing a modification of FIG. 1;

FIG. 4 is a sectional view showing a conventional measuring socket.

FIG. 5 is an enlarged view of a main part in FIG.

[Explanation of symbols]

2 ... Positioning member, 3 ... Wiring board, 3a ...
Electrode part, 4 ... Touch, 7 ... Guide pin, 10 ...
... Semiconductor device, 10a ... Terminal, 21 ... Measurement socket, 22, 25 ... Tactor mounting plate material.

Claims (5)

[Claims] An electrical characteristic of a semiconductor device is measured by disposing a contact made of a conductive spring between a terminal of the semiconductor device and an electrode portion of a wiring board connected to an external circuit. In the method for measuring a semiconductor device, the terminal may be disposed between the semiconductor device and the wiring board by interposing a mounting plate member having the tentacles corresponding to an arrangement interval of the terminal between the semiconductor device and the wiring board. A method for measuring a semiconductor device, wherein the probe is arranged between the electrode and the electrode. 2. A positioning member for positioning a semiconductor device, a wiring board connected to an external circuit and having an electrode portion,
In a measuring socket for a semiconductor device, comprising: a terminal formed by electrically connecting a terminal of the semiconductor device and an electrode portion of the wiring board; and a contactor formed of a spring. A measuring socket for a semiconductor device, wherein a contact is arranged corresponding to an arrangement interval of the terminals. 3. The mounting plate member is disposed between the positioning member and the wiring board, and is commonly positioned with the positioning member by a guide pin fixed to the wiring board. The measurement socket of the semiconductor device according to claim 2. 4. The measuring socket according to claim 2, wherein the contact is supported by being pressed into a mounting hole formed in the mounting plate. 5. The measuring socket according to claim 2, wherein the contact is supported by being screwed into a mounting hole formed in the mounting plate.