JPH11352152A - Contact of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact of an electronic part which is suitable for being used together with an electronic part having a narrow pitch terminal and which can contact from both sides. SOLUTION: This contact is equipped with an insulating board 12, contact electrodes 18 installed on the positions corresponding to terminals 16 of an electronic part 14 to be loaded on one side of the insulating board 12, wiring 20 extending from the contact electrodes 18, pads 22 for outside connection connected to the wiring 20, and a means 26 which contacts from the other side of the insulating board 12 to at least one of the wiring 20 and the pads 22 for outside connection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a contactor for electronic components such as LSI and LCD.

[0002]

2. Description of the Related Art In recent years, the trend toward higher integration and higher density of semiconductor devices such as LSIs and VLSIs has been remarkable, and the terminals of the semiconductor devices have been miniaturized. After the semiconductor device is manufactured, the semiconductor device is tested. The semiconductor device test apparatus includes a socket for mounting the semiconductor device, and tests the semiconductor device while energizing electrodes provided on the socket.

When the semiconductor element cannot be directly mounted on the socket, the semiconductor element is mounted on a contactor (or a carrier), and the semiconductor element is mounted on the socket together with the contactor. However, as the electrodes of semiconductor devices become finer, the supply of contactors becomes very difficult, and it becomes necessary to prepare suitable contactors simultaneously with the development of semiconductor devices.

There is a tendency to mount a semiconductor element (bare chip) in an unpackaged state on a substrate of an apparatus. For example, portable devices (cellular phones, portable terminals, TV-integrated videos, and the like) often use bare chips to reduce the size and weight. Also, from the viewpoint of high-speed performance, a semiconductor device package incorporating a plurality of semiconductor devices, that is, an MCM (multi-chip module) has been developed. For this reason, it is unavoidable to test a semiconductor element in an unpackaged state, that is, a semiconductor element in a bare chip or wafer state (kGD Known Good Die).

However, the terminals of an unpackaged semiconductor device are significantly smaller than the terminals of a packaged semiconductor device, have a narrow pitch, and require a large number of contacts. As with conventional sockets or needle-type probe cards, it is not technically possible to use a contact that incorporates mechanical individual springs. Also, packaged semiconductor element devices, such as CSP (Chip Saize Package), are expected to have narrower terminal pitches in the future, and have similar problems.

[0006] Therefore, a so-called membrane type contactor has been developed. In this method, a metal wiring layer of Cu or the like is formed on an electrically insulating thin film of PI or the like, and a metal projection as a contact electrode is formed on the wiring layer mainly by plating. Ni is mainly used as the metal in many cases. However, in consideration of the performance as a contact electrode, it is general to apply Au plating on the Ni projections. Further, an external connection terminal for exchanging an electric signal from the outside is provided on an outer peripheral portion of the membrane.

[0007] The membrane type contactor uses a plating technique to form electrodes compared to a conventional LSI socket or probe card in which individually prepared mechanical springs or needle type probe terminals are incorporated at a narrow pitch. Further, since a larger number of electrodes can be formed at the same time, there is an advantage that it is more advantageous to have a multipolarity. Furthermore, since the wiring section for fan-out is also provided, it is a very effective means for contacting and testing a device with a narrow pitch.

[0008]

However, the membrane type contactor has the following problems. (A) Multi-layer wiring is difficult (cost becomes very high). For this reason, the membrane type contactors currently used are almost single-layered and the external terminals are limited to one side, so the direction in which external contacts such as sockets can contact is limited (from the back side). Contact is not possible).

(B) Even in a multilayer wiring, it is difficult to form a portion connecting the layers such as through holes and vias. In particular, when the pitch is narrow as in the case of a contactor for KGD, the diameter of the through hole itself becomes severe and the pattern of each layer is shifted, so that the yield of consistent through holes and vias decreases. Therefore, the test performance is not significantly improved even with the multilayer wiring.

(C) When the pitch is narrow, the contact between the external terminal and the socket is not stable. It is difficult to obtain accurate alignment between the membrane and the socket. (D) The contactor for the KGD (KGD carrier) using the current membrane is only the contact with the semiconductor chip, and the contact between the test board and the contactor for the KGD is performed using a separate socket. In this case, The wire length becomes longer, and the high-speed test performance decreases. The cost of the socket is wasted (two contactors are prepared for testing one device). The mounting efficiency decreases (the number of mounting on the test board decreases due to the large outer shape of the socket).

It is an object of the present invention to provide a contactor for an electronic component which is suitable for use with an electronic component having narrow pitch terminals and which can be contacted from both sides.

[0012]

According to the present invention, there is provided a contactor for an electronic component, comprising: an insulating substrate; a contact electrode provided at a position corresponding to a terminal of the electronic component to be mounted on one side of the insulating substrate; Wiring extending from the contact electrode;
An external connection pad connected to the wiring; and means for allowing at least one of the wiring and the external connection pad to be contacted from the other side of the insulating substrate. .

According to this configuration, the contactor is formed as a single-layer substrate, but can be contacted from both upper and lower sides. Therefore, it can be easily applied to various test devices. It is not necessary to use a socket. Preferably, the insulating substrate has a hole at a position directly below at least one of the wiring and the external connection pad, and the hole constitutes a means for enabling the contact.

[0014] Preferably, the width of the hole is smaller than the width of at least one of the wiring and the external connection pad. Alternatively, the width of the hole is larger than the width of at least one of the wiring and the external connection pad. Alternatively, the width of the hole is a size extending over the plurality of wirings. Preferably, the one hole is provided for the one conductive line and the external connection pad. Alternatively, it has two or more holes for the one conductive line and the external connection pad.

[0015] Preferably, at least one of the wiring and the external connection pad is coated with an insulating material in a region covering the hole. Preferably, a cover is provided for covering the electronic component having the terminal to be brought into contact with the contact electrode, and a part of the cover contacts a region of the insulating substrate covering the hole.

The hole of the insulating substrate may be formed so that a contact pin can be inserted from the back side of the insulating substrate, and the shape of the hole can be used as a positioning guide for the contact pin. In addition, a conductive elastic body or an anisotropic conductive elastic body can be incorporated in the hole of the insulating substrate. Furthermore, the contactor of the electronic component according to the present invention,
A frame, a contact electrode provided at a position corresponding to a terminal of an electronic component to be mounted on the elastically deformable insulating film, a wiring provided on the insulating film and extending from the contact electrode, And a first and a second external connection pad connected to the wiring, wherein the insulating film has at least the contact electrode and the first external connection pad on one side of the frame. And at least the second external connection pad is folded and attached so as to be located on the other side of the frame.

In this case as well, the contactor is formed as a single-layer substrate, but can be contacted from both upper and lower sides. Therefore, it can be easily applied to various test devices. It is not necessary to use a socket. Preferably, an elastic body is inserted between the folded insulating film and the frame.

[0018]

1 and 2 show a first embodiment of the present invention. The electronic component contactor 10 according to the present invention extends from the insulating substrate 12, the contact electrode 18 provided at a position corresponding to the terminal 16 of the electronic component 14 to be mounted on one side of the insulating substrate 12, and the contact electrode 18. The wiring 20 includes an external connection pad 22 connected to the wiring 20.

FIG. 7 is a detailed perspective view of a portion of the contactor 10 of FIGS. Although not shown in FIG. 1, an electrically insulating thin film 24 such as PI is adhered on the insulating substrate 12, and the contact electrode 18, the wiring 20, and the external connection pad 22 are electrically insulated from each other. Thin film 2
4 is formed. The contact electrode 18 protrudes upward as compared with other conductor portions. Such a configuration is called a membrane contact 10 and is suitable for forming a wiring pattern at a narrow pitch.

FIGS. 1 and 2 show the electronic component 14 mounted on the contactor 10. That is, the terminal 16 of the electronic component 14 is brought into contact with the contact electrode 18. One example of the electronic component 14 is an LSI bare chip having terminals 16 having a narrow pitch. Another example of the electronic component 14 is an LSI packaged chip having narrow pitch terminals 16.

The contactor 10 is provided with means for making it possible to contact at least one of the wiring 20 and the external connection pad 22 from the other side of the insulating substrate 12. In the embodiment, the insulating substrate 12 has a hole 26 at a position directly below at least one of the wiring 20 and the external connection pad 22, and constitutes means for making the hole 26 contactable. That is, the wiring 20 and the external connection pad 22 are exposed on the side of the insulating substrate 12 opposite to the side where the contact electrode 18 is provided. 20 and the external connection pads 22.

The hole 26 is provided with the contact electrode 18 and the wiring 20.
Further, it can be formed by attaching an electrically insulating thin film 24 on which the external connection pads 22 are formed to the insulating substrate 12 and then performing etching. The insulating substrate 12 is partially removed from the electrically insulating thin film 24 by etching to form a hole 26, and the contact electrode 18 and the wiring 20 are removed.
The external connection pads 22 are left without being removed. On the other hand, before attaching the electrically insulating thin film 24 to the insulating substrate 12, holes may be formed in each layer.

The contact electrode 18 is formed in a substantially central area of the insulating substrate 12, and the external connection pad 22 is formed in an outer peripheral area of the insulating substrate 12. In FIG. 2, the area where the hole 26 is to be formed is indicated by 30;
This region 30 is in the outer peripheral region of the insulating substrate 12 and
0, only the external connection pad 22, or both the wiring 20 and the external connection pad 22 can be selected.

In this way, the terminal of the test socket can be brought into contact with the contact electrode 18 on the upper side of the insulating substrate 12, and the wiring 20 and the external connection pad 22 exposed on the lower side of the insulating substrate 12 are A contact pin, a needle type probe 28 and the like can be contacted. Thus, according to the present embodiment, the contact can be easily made from both sides of the insulating substrate 12. In addition, it is possible to make contact from not only the upper side but also both the upper and lower sides with the single-layer wiring board, and it is possible to contact the desired position from the back side without through holes or vias. Since the hole 26 has a probe guide function,
The alignment with the socket is stabilized. In addition, the socket can be eliminated, so that direct contact can be made with the substrate. Thereby, cost reduction, mounting efficiency increase, and high-speed test performance can be obtained.

FIG. 3 is a view showing an example of a position where the hole 26 is formed. FIG. 3 shows an example in which one hole 26 is provided for one wiring 20 and one external connection pad 22. The width of the hole 26 is smaller than the width of at least one of the wiring 20 and the external connection pad 22. In this way, thin C
Wiring 20 which is a conductive film such as U and pad 22 for external connection
Can be prevented from being deformed by a contact from the back side, and the reduction of the strength of the insulating substrate 12 can be minimized by making the holes 26 in the insulating substrate 12.

FIG. 4 is a view showing another example of the position where the hole 26 is formed. FIG. 3 shows an example in which one hole 26 is provided for one wiring 20 and one external connection pad 22. The width of the hole 26 is larger than the width of at least one of the wiring 20 and the external connection pad 22. Hole 26 is insulated substrate 1
2 partially visible from above. This configuration may be adopted when it is not possible to make it as shown in FIG. 3 due to the narrow pitch, or when it is desired to reduce the influence of adjacent pins.

FIG. 5 is a view showing another example of the position where the hole 26 is formed. An example is shown in which two (or two or more) holes 26 are provided for one conductive wiring 20 and one external connection pad 22. This can be adopted, for example, in a four-terminal method or when it is desired to separately provide a sensing probe and a forcing probe. FIG. 6 is a diagram showing another example of the position where the hole 26 is formed. The width of one hole 26 is a size that extends over the plurality of wiring lines 20 and the external connection pads 22.

In the above embodiment, for example, every other one of the wirings 20 and the external connection pads 22 arranged in a line is contacted from the upper side of the insulating substrate 12, and the other one is located on the lower side of the insulating substrate 12. You can contact from. Also, instead of contacting every other one, it is possible to make contact with a certain number from the upper side of the insulating substrate 12 and make contact with the remaining ones from the lower side of the insulating substrate 12. The holes 26 do not necessarily need to be provided for all the wirings 20 and the external connection pads 22. For example, the holes 26 may be provided only for the wiring 20 and the external connection pads 22 necessary for a specific test, and the other may be blocked by the insulating substrate 12 so that contact from the back surface is impossible.

FIG. 8 is a sectional view showing a modification of the contactor of FIG. In FIG. 8, at least one of the wiring 20 and the external connection pad 22 is coated with an insulating material 32 in a region covering the hole 26. Preferably, the coating insulating material 32 is made of a material (for example, epoxy resin) that is harder than the material of the wiring 20 and the external connection pad 22 so as to reinforce the strength of the wiring 20 and the external connection pad 22 in the region where the hole 26 is formed. It has become. On the other hand, the coating insulating material 32 is made of a material softer than the material of the wiring 20 and the pad 22 for external connection,
6, the strength of the wiring 20 and the external connection pad 22 can be reinforced, and the vertical variation of the wiring 20 and the external connection pad 22 can be absorbed.

FIG. 9 is a sectional view showing a modification of the contactor of FIG. In FIG. 9, a cover 34 for covering the electronic component 14 having the terminal 16 to be brought into contact with the contact electrode 18 is provided.
A pressing force is applied to the terminal 8 and the terminal 16 to ensure contact. The cover 34 is fixed to the insulating substrate 12 by a latch mechanism. The contact electrode 18 and the terminal 16 are pressed by a spring force, and the contact can be maintained. Cover 34
The contact portion 36 contacts the region of the insulating substrate 12 that covers the hole 26. Therefore, the contact portion 3 of the cover 34
6 supports the contact pressure from the back side of the insulating substrate 12 through the hole 26, and prevents the wiring 20 and the external connection pad 22 from being deformed.

FIG. 10 is a sectional view showing a modification of the contactor of FIG. In FIG. 10, a contact pin or a needle probe 28 is
The hole 26 is formed so that it can be used as a positioning guide for the contact pin and the needle-type probe 28 as well as being inserted from the back side. More specifically, the diameter of the contact pin or the needle probe 28 is
And a taper is provided at the entrance of the hole 26 so that the contact pin and the head of the needle probe 28 can easily enter. When the hole 26 is formed by etching, such a taper is formed. The contact pins and the head of the needle type probe 28 are adapted to be in contact with the wiring 20 and the external connection pad 22.

FIG. 11 is a sectional view showing a modification of the contactor of FIG. In FIG. 11, the holes 2 of the insulating substrate 12 are shown.
6, a conductive elastic body or an anisotropic conductive elastic body 36 was incorporated. The conductive elastic body or the anisotropic conductive elastic body 36 has the hole 2
6 may be press-fitted or bonded. When the holes 26 are not provided separately for each wiring 20 and each external connection pad 22, an anisotropic conductive elastic body 36 is used so that conductivity is exhibited only when a contact pressure is applied. . Conductive elastic body or anisotropic conductive elastic body 36
The hole 26 protrudes from the back surface of the insulating substrate 12 so that, for example, when the contactor 10 is placed on the test substrate, the conductive elastic body or the anisotropic conductive elastic body 36 comes into contact with the terminal of the test substrate. To This eliminates the need to use contact pins and sockets.

FIG. 12 is a view showing a second embodiment of the present invention. The contactor 10 of the electronic component includes a frame (or an insulating substrate) 42 and an elastically deformable insulating film 24.
The contact electrode 18, a wiring 20 extending from the contact electrode 18, and first and second external connection pads 22 and 44 connected to the wiring 20 are provided on the insulating film 24. The contact electrode 18 is provided at a position corresponding to the terminal 16 of the electronic component 14 to be mounted. In order to increase the strength of the entire contactor, the contact electrode 18 is
Are arranged so that the center is substantially aligned with the upper surface of the.

The second external connection pad 44 is
The first external connection pad 22 is provided at an end remote from the contact electrode 18 of the second external connection pad 4.
It is provided more inward than 4. The first and second external connection pads 22 and 44 may be connected to the same wiring 20, or the first and second external connection pads 22 and
44 may be connected to different wirings 20.

The insulating film 24 is attached back to the frame 42. By folding, at least the contact electrode 18 and the first external connection pad 22 are located on one side of the frame 42 and at least the second external connection pad 44 is located on the other side of the frame 42. I have. The frame 42 is smaller than the insulating film 24. For example, the frame 42 is square, and the insulating film 24
Is rectangular and only two sides are folded into the back surface of the frame 42. Alternatively, the frame 42 is square,
The insulating film 24 may be rectangular, and four sides may be folded into the back surface of the frame 42. Other configurations are also possible.

In this manner, as in the previous embodiment, contact can be easily made from both sides of the frame 42. FIG.
FIG. 13 is a view showing a modified example of the contactor of FIG. FIG.
In this case, the elastic body 46 is sandwiched between the folded insulating film 24 and the frame 42. As a result, by forming a convex portion under the second external connection pad 44, the portion of the second external connection pad 44 becomes an elastic spring, and the socket is formed on the test board or the mounting board side. It is unnecessary, and good contact can be obtained simply by pressing directly on the pattern of the substrate.

[0037]

As described above, according to the present invention,
Contactors that can be contacted from both sides with a single layer can be supplied, and testing can be performed at low cost. In some cases, sockets can be eliminated. Further, since it is easy to make contact with a wiring layer close to a terminal of an electronic component such as an LSI, high-speed testability is excellent and alignment accuracy is improved. When inserting the contactor into the socket, the hole can be used as having a guiding function.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a contactor according to a first embodiment of the present invention.

FIG. 2 is a plan view of the contactor of FIG. 1;

FIG. 3 is a diagram showing an example of a hole of the contactor of FIGS. 1 and 2;

FIG. 4 is a view showing another example of a hole of the contactor of FIGS. 1 and 2;

FIG. 5 is a view showing another example of a hole of the contactor of FIGS. 1 and 2;

FIG. 6 is a view showing another example of a hole of the contactor of FIGS. 1 and 2;

FIG. 7 is a perspective view of a part of the detailed structure of the contactor of FIGS. 1 and 2;

FIG. 8 is a sectional view showing a modified example of the contactor of FIG. 1;

FIG. 9 is a sectional view showing a modified example of the contactor of FIG. 1;

FIG. 10 is a sectional view showing a modification of the contactor of FIG. 1;

FIG. 11 is a sectional view showing a modification of the contactor of FIG. 1;

FIG. 12 is a sectional view showing a contactor according to a second embodiment of the present invention.

FIG. 13 is a diagram showing a modified example of the contactor of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Contactor 12 ... Insulating board 14 ... Electronic component 16 ... Terminal 18 ... Contact electrode 20 ... Wiring 22 ... External connection pad 24 ... Thin film 26 ... Hole 28 ... Contact pin 30 ... Area 32 ... Insulating material 34 ... Cover 36 ... Conductivity Elastic body 42 ... frame 44 ... pad for external connection 46 ... elastic body

Claims (13)

[Claims] An insulating substrate; a contact electrode provided at a position corresponding to a terminal of an electronic component to be mounted on one side of the insulating substrate; and a wiring extending from the contact electrode.
An electronic component, comprising: an external connection pad connected to the wiring; and means for allowing at least one of the wiring and the external connection pad to be contacted from the other side of the insulating substrate. Contactor. 2. The device according to claim 1, wherein the insulating substrate has a hole at a position directly below at least one of the wiring and the external connection pad, and the hole constitutes a means for making the contact possible. 2. A contactor for an electronic component according to 1. 3. The contactor according to claim 2, wherein the width of the hole is smaller than the width of at least one of the wiring and the external connection pad. 4. The contactor according to claim 2, wherein the width of the hole is larger than the width of at least one of the wiring and the external connection pad. 5. The electronic component contactor according to claim 2, wherein the width of the hole is large enough to extend over the plurality of wirings. 6. The electronic component contactor according to claim 2, wherein said one hole is provided for said one conducting wire and said external connection pad. 7. The contactor for an electronic component according to claim 2, wherein the contactor has two or more holes for the one conductive line and the external connection pad. 8. The electronic component contactor according to claim 2, wherein at least one of the wiring and the external connection pad is coated with an insulating material in a region covering the hole. 9. A cover for covering an electronic component having a terminal to be brought into contact with the contact electrode, wherein a part of the cover contacts an area of the insulating substrate covering the hole. Item 3. An electronic component contactor according to item 2. 10. The method according to claim 1, wherein the hole of the insulating substrate is formed so that a contact pin can be inserted from the back side of the insulating substrate, and the shape of the hole can be used as a positioning guide for the contact pin. Item 3. An electronic component contactor according to item 2. 11. A contactor for an electronic component according to claim 2, wherein a conductive elastic body or an anisotropic conductive elastic body is incorporated in said hole of said insulating substrate. 12. A frame, a contact electrode provided at a position corresponding to a terminal of an electronic component to be mounted on an elastically deformable insulating film, and a wiring provided on the insulating film and extending from the contact electrode. And first and second external connection pads provided on the insulating film and connected to the wiring, wherein the insulating film has at least the contact electrode and the first external connection pad of the frame. A contactor for an electronic component, which is located on one side and is folded and attached so that at least the second external connection pad is located on the other side of the frame. 13. The contactor for an electronic component according to claim 12, wherein an elastic body is inserted between the folded insulating film and the frame.