JP3329542B2 - Detecting soldering failure of surface mount components due to lead deformation - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a defective soldering of an electronic component such as an IC mounted on a printed circuit board by surface mounting using an in-circuit tester.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board, on which leads (electrodes) of a large number of electronic parts are inserted into holes and soldered, is appropriately probed at each required measuring point of the board using an in-circuit tester. Are contacted, and the presence or absence of each component is electrically detected, or the characteristic value of each part is electrically measured to determine the quality of the board. In particular, the one in which the XY unit is installed on the measuring table on which the substrate to be inspected is mounted is provided with a Z-axis unit movable in the Y-axis direction on the arm movable in the X-axis direction, and the Z-axis unit is Since the probe is movably supported in the Z-axis direction, it is easy to use. When the XY unit is controlled, the probe is appropriately moved in the X-axis, Y-axis, and Z-axis directions from above the substrate, and Each set measurement point can be contacted sequentially. In addition, 1
Since a plurality of measurement points must be measured simultaneously for each part, the in-circuit tester is usually provided with a plurality of XY units.

However, in recent years, electronic components have become much smaller, and the lengths of leads to be soldered and the pitch between leads have both become finer. The soldering method is also called SMT (Surface Mount Technology). It is changing to. Therefore, when inspecting the soldering state of an IC (integrated circuit) surface-mounted on a printed circuit board using an XY type in-circuit tester, one probe 10 is used as shown in FIG. IC12
After the other probe 16 is brought into contact with the pattern 20 of the printed circuit board 18, the resistance value is measured in order to know the conduction state between the lead 14 and the pattern 20. The quality of the soldering state (contact state) of the lead 14 is determined. Note that these probes 10 and 16 usually have a spring property in the axial direction, and the tip is applied to a measurement point, and an electric contact is obtained by applying a static load.

[0004]

However, when such probes 10 and 16 are used, there is a problem in that an originally defective product may be determined as a non-defective product due to its spring load. This is because the tip of the lead 14 of the IC 12 has poor soldering as shown in FIG.
Even if the probe is away from the pattern 20 (floating foot), when the tip of the probe 10 hits the same and a spring load is applied in a direction perpendicular to the surface of the substrate 18 (Z-axis direction), as shown in FIG. This is because the tip portion comes into good contact with the pattern 20. In addition, there are some electronic components that have short leads, have small contact areas such as shoulders and tips, and cannot perform stable contact. Therefore, there is a limit in using only the electric method.

The present invention has been made in view of such a conventional problem, and uses an in-circuit tester to solder fine surface mount components or the like having short leads and a narrow pitch between leads. It is an object to provide a method capable of reliably detecting a defective state.

[0006]

In order to achieve the above object, the present invention provides a method for detecting defective soldering of a surface-mounted component due to lead deformation, on a arm movable in the X-axis direction and on a Z-movable arm in the Y-axis direction. X-Y including a shaft unit, and supporting the probe 34 movably in the Z-axis direction with the Z-axis unit.
Using an in-circuit tester in which one or a plurality of units are installed, the quality of the soldering state of the leads 28 of the electronic components 24 surface-mounted to the printed circuit board 22 is determined. In addition, the probe 34 comes into contact with the lead 28 of the electronic component 24, and the probe 34 is moved in the X-axis or Y-axis direction (the direction horizontal to the surface of the substrate 22) to
, An amount of deformation of the lead 28 is detected, and the quality of the soldered state is determined from the detection result.

At this time, an L-shaped probe 34 having a bent end portion 35 (60) in contact with the lead 28 (54) is provided.
It is preferable to use (58). Further, it is preferable to use a flipping probe 72 having high elasticity.

Further, the strain sensor 3 is attached to the probe 34 (58).
6 (62) is preferably used. Further, a directional microphone 73 may be used.

Further, it is preferable to use a pattern probe unit in which a plurality of pattern contact probes projecting from each other are connected to each other. Further, for a lead having a plurality of probes 78 with a plurality of strain sensors 80, which are arranged and protruded in a row at intervals substantially equal to the intervals of the leads 88 of the electronic component 84 in which a plurality of leads 88 are arranged in a row and protrude at equal intervals. Preferably, a probe unit 74 is used.

Also, two large and small terminals 102, 10 each having an L-shape having a bent end portion abutting on the lead 96 and protruding therefrom.
4, the small terminal 104 is disposed inside the large terminal 102 so as to overlap, and an insulator 106 is interposed between the small terminal 104 and the tip 10 of the two terminals 102, 104.
It is preferable to use a two-terminal L-shaped probe 100 in which 8, 10 are brought close to each other, and the whole is formed in an L-shape and integrated.

Further, the distance between the insulating substrate 120 and the plate-shaped conductive probe 122 is slightly increased, and the distal end portion 140 of the probe 122 is disposed so as to protrude slightly from the distal end of the insulating substrate 120. The connecting protrusions 124a, b are provided on the inner surface of the probe 122 and the connecting protrusions 124a, b, respectively, and the connecting protrusions 124a, b are connected by a shaft 126 to rotatably support the probe 122 with respect to the insulating substrate 120. Insulating substrate 12 remote from both connecting projections 124a, b
A compression spring 128 is interposed between the probe 122 and the inner surface of the probe 122, and at least one end of the compression spring 128 is fixed to the insulating substrate 120 or the probe 122. It is preferable to use a switch-type probe unit 118 provided with a first terminal 130 which is kept apart from the insulating substrate 120 and is kept in a fixed state, and a second terminal 132 provided on the inner surface of the insulating substrate 120 with which the probe 122 contacts when used.

It is preferable to use an insulated probe 152 having an insulator 155 at the end. Also, the image camera 162
It is good to use.

[0013]

The probe is brought into contact with the lead of the electronic component 24, and the probe is moved in the X-axis or Y-axis direction to apply an external force to the lead, and the amount of deformation of the lead is made. Is detected, and the quality of the soldering state is determined based on the detection result.
4 can be brought into contact with each part of the lead 28, particularly the rising portion, and an external force can be applied. Therefore, the fine surface mount component 2 having a short length of the lead 28 and a narrow interval between the leads 28 is used.
4 is easy to detect the poor soldering. Moreover, when an external force is applied, if the soldering state is good, the lead 28 is not deformed, and if not soldered, the tip portion 35 of the lead 28 or the like is in a horizontal direction (X-axis or (Y-axis direction) and deforms. Therefore, even when the probe 34 is brought into contact with the lead 28 and an external force is applied, the unsoldered lead 28 does not come into good contact with the pattern 30, and the amount of deformation of the lead 28 is detected. Based on the above, it is possible to accurately determine the quality of the soldering state.

When an L-shaped probe 34 having a bent distal end portion 35 is used, since the distal end portion 35 is bent and protrudes from the main body of the probe 34, even if the rising portion of the lead 28 is curved. Then, it is easy to apply an external force by bringing the tip portion into contact with an arbitrary portion of the rising portion.
Further, if the shape of the distal end portion 60 is selected and, for example, a needle shape is used, even if the interval between the leads 54 is narrow, the distal end needle 60 is inserted between the adjacent leads 54 and both sides of the distal end needle 60 are connected to the leads on both sides. 54, and then both leads 5
4 can be applied with an external force.

Further, if a resilient flipping probe 72 is used, even if the probe 72 is bent, it returns to the original state immediately after the force is removed, so that one end of the lead group is provided at the tip of the probe 72. The probe 72 can be moved in a constant high-speed state while hitting each lead 70 by sequentially flicking the shoulder or the like of each lead 70 from the lead 70a at the other end to the lead 70f at the other end. In addition,
The probe 72 may be kept stationary, and the substrate 64 may be moved to repel the lead 70.

The strain sensor 3 is connected to the probe 34 (58).
When the probe 6 (62) is attached and used, the probe 34 (5
In step 8), a deformation amount proportional to the deformation amount of the lead 28 (54) generated when an external force is applied to the lead 28 (54) is generated in the probe 34 (58).
The deformation amount proportional to the deformation amount of (8) is obtained by the distortion sensor 36 (6).
Occurs in 2). Therefore, the distortion sensor 36 (62) can detect the amount of deformation of the lead 28 (54) by converting it into an electric signal.

When the directional microphone 73 is used, a sound is generated by striking each lead 70 with the probe 72 moving at a constant high speed, and the sound is transmitted to a high sensitivity microphone located at a place away from the electronic component 66. The sound is collected at 73, and the time interval of playing each lead 70 can be measured. At this time, since the unsoldered lead 70 is deformed, a sound is generated later than the lead 70 with good soldering.

Further, when a pattern probe unit having a plurality of pattern contact probes projecting from each other is used, the flipping probe 72 is moved at a constant high speed, and each of the leads 70 contacts each other while flipping each of the leads 70. The time between flipping each lead 70 can be measured by a short open check between all patterns to be touched or touched. At this time, the unsoldered lead 70 has a longer or shorter open time than the lead 70 with good soldering.

When a lead probe unit 74 in which a plurality of probes 78 with strain sensors 80 are arranged in a line and protruded at equal intervals is used, the interval between the probes 78 is substantially equal to the interval between the leads 88 of the electronic component 84. For a lead group in which a plurality of leads 88 are arranged in a line and project at equal intervals, the probes 78 can be arranged on both sides of each corresponding lead 88. Therefore, when the lead probe unit 74 is moved, the corresponding probe 78 comes into contact with one side surface or the other side surface of each lead 88, and an external force is applied to each lead 88 at a time. Therefore, each distortion sensor 80 can detect the amount of deformation of the corresponding lead 88 by converting it into an electric signal.

A terminal 10 composed of two large and small L-shaped members
2 and 104 with an insulator 106 interposed therebetween.
By using the two-terminal probe 100 in which the tips 108 and 110 of the terminals 2 and 104 are brought close to each other, and formed as a whole in an L-shape and integrated, the tips 108 and 110 of the terminals 102 and 104 are lead. 96 can be brought into contact with arbitrary portions such as rising portions. Then
Both terminals 102 and 104 are short-circuited. Therefore, when the probe 100 is moved and an external force is applied to the lead 96, the lead 96 does not move when the soldering state is good, so that the lead 96 is not deformed, and the terminals 102 and 104 are still in a short-circuit state. However, in the case of unsoldering, small terminals 10
The leading end 110 of the large terminal 102 is deformed by the movement of the leading end side of the lead 96.
, Both terminals 102 and 104 are open. Therefore, these short and open states can be detected.

Further, the probe 12 is
2 are rotatably supported, and a compression spring 128 is interposed between the insulating substrate 120 and the inner surface of the probe 122,
When a switch type probe unit 118 in which a first terminal 130 is provided in contact with the outer surface of the probe 122 and a second terminal 132 is provided on the inner surface of the insulating substrate 120 is used,
The distal end 140 of the probe 122 protruding from the distal end of the insulating substrate 120 is brought into contact with the rising portion of the lead 142, and the probe unit 118 is moved to move the lead 14
2, an external force can be applied. Then, the probe 12
The tip end 140 of the second probe serves as a point of force, and the rotation shaft 126 serves as a fulcrum. A force in the direction away from the first terminal 130 acts on the rear end of the probe 122 against the force of the spring 128.

For this reason, the connection between the first terminal 130 and the probe 122 is now in a non-conductive state. When the probe 122 further rotates, the rear end of the probe 122 comes into contact with the second terminal 132 this time.
A conduction state is established between the terminal 22 and the second terminal 132. that time,
When the soldering state is good, the lead 142 does not move even when a force is applied, and hardly deforms. On the other hand, in the unsoldered state, the lead 142 moves and deforms when the force is applied. . Therefore, the probe 122 and the first terminal 1
By measuring the time from when the connection between the probe 30 and the second terminal 132 becomes non-conductive to when the connection between the probe 122 and the second terminal 132 becomes conductive, the amount of movement of the switch-type probe unit 118 and the amount of deformation of the lead 28 can be determined. Can be detected.

When a tip-insulated probe 152 having an insulator 155 at the tip is used, when the probe 152 is set near one side of the lead 148, the pattern 150
The probe 152 does not conduct with the pattern 150. Therefore, another conductive probe 154 is connected to lead 1
48, and the external force is applied to the lead 148. Then, when the soldering state is good, the lead 148 does not move even when a force is applied and hardly deforms, whereas in the unsoldered state, the lead 148 moves and deforms when the force is applied. Then, the lead 148 comes into contact with the distal end insulated probe 152 and becomes conductive. Therefore, a short / open state of both probes 152 and 154 is detected.

Further, when the image camera 162 is used, the camera 162 is first moved along the lead group before applying an external force to each lead 160, and images can be sequentially taken at each set position.
At this time, image data indicating the state of the lead 160 included in each imaging circle 164 is obtained. Therefore, each image data is stored in the storage device. Next, the probe 166 is also moved along the lead group using the probe 166, and sequentially brought into contact with each lead 160 to apply an external force. At this time, an external force is applied to such an extent that the unsoldered lead 160 causes plastic deformation. Thereafter, the camera 162 is moved again along the lead group, and images are sequentially taken at each set position. At this time, when an external force is applied to the unsoldered lead 160, the lead 160 undergoes plastic deformation, so that image data indicating the state is obtained. Therefore, by comparing the corresponding image data before and after applying an external force for each set position, the amount of deformation of each lead can be detected.

[0025]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a side view showing a contact state of an L-shaped probe to a lead of a PLCC flat package IC during a soldering state inspection by an in-circuit tester to which the present invention is applied. FIG. It is a side view showing the state where external force was applied. FIG. 1 shows a case where the leads of the flat package IC are well soldered, and FIG. 2 shows a case where the leads are not soldered. In the figure, reference numeral 22 denotes a substrate to be inspected installed on a measurement table of an in-circuit tester;
4 is a PLCC flat package IC surface-mounted on the substrate 22, 26 is a main body of the IC 24, 28 is a lead (electrode) projecting from the main body 26, and 30 is a substrate 22
Is a probe provided on a Z-axis unit (not shown) of an XY unit installed above the measurement table. The probe 34 is an elongated L-shaped elastic plate protruding in a right angle direction by bending a distal end portion 35, and includes a resistance wire strain gauge 36 attached to a central portion of one surface near the base end portion. Then, a voltage detection circuit 38 as shown in FIG. 3 is provided in a measurement circuit (not shown) of the in-circuit tester, and the strain gauge 36 is incorporated in one side of the Wheatstone bridge 40 for use. Reference numeral 42 denotes a power supply, 44 denotes an amplifier, and 46 denotes an output terminal.

In order to inspect the soldering state of the lead 28 of the IC 24, the tip of the probe 34 is appropriately brought into contact with the center of the rising portion of the lead 28 by controlling the XY unit. Then, the probe 34 is moved in the X-axis or Y-axis direction (the substrate 2
(In the direction horizontal to the second surface) and apply an external force to the lead 28. In the figure, the probe 34 is moved only to the left (one direction of the X axis). Then, the probe 34 is deformed, and a deformation proportional to the amount of deformation is generated in the strain cage 36. Therefore, a voltage is detected by using a change in resistance value due to the amount of deformation, and the soldering state of the lead 28 is determined from the detection result. Is determined. At this time, if the soldering of the lead 28 is good, the lead 28 is not deformed even if it is pushed by the tip of the probe 34, and the base end of the probe 34 moves by a fixed amount, while the tip end 35 is almost Do not move. Therefore, the probe 34 is greatly deformed. However, if the lead 28 is not soldered, the lead 28 moves and bends further, causing plastic deformation, and the tip 35 moves by the amount of the deformation, so that the deformation of the probe 34 is reduced.

Therefore, the voltage V0 of the power supply 42 of the voltage detection circuit 38 is set to 5 V, the resistance R of each of the three sides of the Wheatstone bridge 40 is set to 200 Ω, and the movement amount of the probe 34 is reduced to 0 by using the amplifier 44 having a magnification of 1000. When the output voltage V at 0.3 mm is obtained, the output voltage V is about 0.65 V when the soldering of the lead 28 is good, and the output voltage V is about 0.27 V when not soldered. . As a result, the amount of deformation of the lead 28 becomes apparent from the output voltage V, and the lead 2 is in contact with the pattern 30 but is not soldered.
8 can also be detected, and the quality of the soldering state of the lead 28 can be determined satisfactorily. In the soldering failure detection method of the present embodiment, the tip of the lead 28 is
It is particularly suitable for a J-lead (PLCC type) bent downward, but can also be applied to a lead (QFP type) whose leading end protrudes away from the IC body. In addition, the probe can be appropriately changed in shape by, for example, protruding a distal end portion in a vertical or horizontal direction in a triangular shape so as to be able to cope with minute ones such as a short lead and a narrow lead pitch. However, the lead can be pushed without needing to bend the tip to project, or the lead may be moved while inserted between the leads. The strain cage 36 is used to detect the amount of deformation of the lead 28, and can be replaced with a displacement sensor including another strain sensor such as a tension gauge.

Incidentally, the probe 34 as in the above embodiment is used.
If the distal end 35 of the lead 28 is bent from the main body and projected in the perpendicular direction, the spring load is not applied in the vertical direction (Z-axis direction) even when the lead 35 is brought into contact with the lead 28. Since the portion does not make good contact with the pattern 30, it is suitable for a method of detecting a defective soldering by measuring a resistance value between the lead 28 and the pattern 30.

FIG. 4 is a side view showing an arrangement relationship of the L-shaped probe with the insertion needle with respect to the lead of the QFP type flat package IC at the time of the soldering state inspection by the in-circuit tester. In the drawing, reference numeral 48 denotes a board to be inspected installed on a measurement table of an in-circuit tester; 50, a QFP flat package IC mounted on the board 48;
The body of C50, 54 is a lead projecting from the body 52, 56 is a pattern provided on the substrate 48, 58 is an insertion needle provided on a Z-axis unit (not shown) of an XY unit installed above the measuring table. This is an L-shaped probe. The probe 58 is an elongated elastic plate body provided with a pyramid-shaped needle 60 at the distal end thereof and projecting in a direction perpendicular to the main body. 62 (62a, 62b). Then, two strain gauges 62 are connected in series and used by being incorporated in one or two sides of a Wheatstone bridge provided in a voltage detection circuit. In addition, as described above, the two strain cages 6
The use of 2 makes it easier to detect the deformation of the probe 58.

To inspect the soldering state of the lead 54 of the IC 50, the XY unit is controlled to move the tip needle 60 of the probe 58 in the X-axis or Y-axis direction, and the adjacent lead is indicated by a dotted line. Insert between 54. Incidentally, an IC usually has a large number of leads protruding at equal intervals on the same surface. Therefore, both ends of the tip needle 60 are connected to the leads 5 on both sides.
After contacting the leads 4 respectively, the lead further moves to apply external force to both the leads 54. Then, the probe 58 is deformed with the insertion of the tip needle 60, and deformation proportional to the amount of deformation is generated in each of the strain gauges 62. Therefore, a voltage is detected by using a change in resistance value due to the amount of strain, From the detection result, the quality of the soldering state of the lead 54 is determined. At this time, if the soldering of the leads 54 is good, even if the leads 54 are pushed by the tip needle 60 as shown in FIG.
Since a and b do not deform much and do not open on both sides, the insertion amount after contact is small. However, the amount of deformation of the probe 58 increases.

However, if the lead 54a is not soldered, for example, as shown in FIG. 6, the unsoldered lead is opened as the lead 54a is greatly deformed, so that the insertion amount after contact increases by Δx. However, the probe 58
Is small. The relationship between the displacement X of the probe 58 and the output voltage V based on the deformation thereof is shown as follows.
As shown in FIG. 7, the case of good soldering has an A curve, and the case of unsoldering has a B curve. So, choose the threshold,
Based on the output voltage V, it is determined whether the soldering is good or not. X0 is the amount of movement until the tip needle 60 comes into contact with the lead 54, and X1 is the amount of movement required to determine the quality of the soldered state.

FIG. 8 is a perspective view showing an arrangement relationship between a flipping probe and a directional microphone immediately before flipping with respect to a lead group of a flat package IC at the time of soldering state inspection by the in-circuit tester. In the drawing, reference numeral 64 denotes a substrate to be inspected installed on a measurement table of an in-circuit tester, 66 denotes a flat package IC mounted on the substrate 64, 68 denotes a main body of the IC 66, and 70 (70a,... 70f) denotes a main body 68 thereof. Six leads 72 protruding at equal intervals from one surface are flipping probes provided on the Z-axis unit of the XY unit installed above the measuring table. In the drawing, a pattern for soldering each lead 70 is omitted. The probe 72 is a long and thin rod-shaped body having a small elasticity and a tapered end. Therefore, when a force is applied to the vicinity of the distal end of the probe 72, it is particularly easy to bend as compared with other portions. However, once the force is removed, once the force is removed, the probe 72 immediately returns to the original linear state.

In order to inspect the soldering state of the lead 70 of the IC 66, the probe 72 is moved in the X-axis or Y-axis direction at a constant high speed by controlling the XY unit, and one end of the probe 72 is moved at the tip. From the lead 70a at the other end to the lead 70f at the other end in order. At this time, if there are unsoldered leads 70 in the lead group,
The lead 70 deforms when it is played with the probe 72,
The well-soldered leads 70 do not deform. Therefore, if there are unsoldered leads 70, the time interval for flipping each lead 70 will not be constant. Using this feature,
Defective soldering of each lead 70 is detected. It is also possible to keep the flipping probe 72 stationary, move the substrate to be inspected 64 with respect to the probe 72, and flip each lead 70.

Therefore, using the other two sets of XY units, the directional microphones 73 (73
a, 73b) are attached to each other, and are arranged, for example, in the vicinity of both ends of the lead group of the IC 66 in a stationary state. Sound generated when each lead 70 is played by the probe 72 is collected with high sensitivity and converted into a voltage. The quality of the soldering state of each lead 70 is determined by measuring the time interval of flipping 70. For example, when a sound is generated as shown in FIG. 9, it is determined that the third lead 70c is not soldered, and thus it is determined to be defective. This is because the third sound should be generated after 2t if soldering is good, but the third sound is generated slightly later due to deformation of the lead 70c.

The other part of the probe 72 except for the tip part is enlarged flat, and a resistance wire strain gauge is attached thereto.
The probe 72 detects a change in the resistance value due to the deformation that occurs when each of the leads 70 is flipped, and determines the quality of the soldering state of each of the leads 70 by measuring the time interval of flipping each of the leads 70. For example, when the resistance value changes as shown in FIG. 10, the time interval of the third resistance value 0 becomes shorter than the other time interval t, so that the third lead 70
It can be seen that c is not soldered.

Each lead 70 of the IC 66 is brought into contact with the Z-axis unit of the set of XY units so as to conduct all the patterns to be soldered or to be soldered.
Equipped with a pattern probe unit (not shown) having a pattern contact probe, and measure the time interval of flipping each lead 70 by short / open check with the pattern while flipping each lead 70 with the probe 72. Thus, the quality of the soldering state of each lead 70 is determined. For example, when the current value changes as shown in FIG. 11, the time interval of the second current value 0 is longer than the other time interval t, and the time interval of the fourth current value 0 is shorter. It is determined that the first and fifth leads 70c and e are not soldered and are defective.

FIG. 12 is a front view of a lead probe unit having five probes with strain gauges provided on the Z-axis unit of the XY unit installed on the in-circuit tester, and FIG. 13 is a flat package mounted on a substrate to be inspected. It is a perspective view which shows the arrangement | positioning relationship of the probe unit for leads just before the soldering state inspection with respect to the lead of IC. In the figure, 74 is a lead probe unit, 76 is an elongated rectangular parallelepiped main body of the probe unit 74, and 78 (78
a,... 78e) are five elongated plate-like probes protruding from the lower surface of the body 76 at equal intervals along the longitudinal direction of the main body 76, and 80 (80a,.
8 is a resistance strain gauge provided from the base of No. 8 to the main body near the base. The interval between adjacent probes 78 is substantially equal to the interval between adjacent leads of an IC to be inspected. Reference numeral 82 denotes a substrate to be inspected installed on a measurement table of an in-circuit tester; 84, a flat package IC mounted on the substrate 82;
88d are leads protruding at equal intervals from one surface of the main body 86.

In order to inspect the soldering state of the lead 88 of the IC 84, the XY unit is controlled to move the probe unit 74 in, for example, the-direction of the X-axis shown by the arrow, and FIG.
As shown in FIG. 4, the first probe 78a is connected to the first lead 88a.
The second probe 78b with the first and second leads 88
a and b, the third probe 78c between the second and third leads 88b and c, the fourth probe 78d between the third and fourth leads 88c and d, and the fifth probe 78e between the second and third leads 88c and d. It is arranged outside each of the four leads 88d. Then, the probe unit 74 is moved in the positive direction of the Y-axis (to the right in FIG. 14), and the respective probes 78 are appropriately brought into contact with the rising portions of the corresponding leads 88 and the like. Thereafter, when an external force is applied to each lead 88 by further moving the lead 88 in the same direction, deformation occurs in each lead 88. Therefore, each deformation amount is converted into a corresponding resistance value by each strain gauge 80. Then, it is further converted into a voltage value and detected. At this time, for example, the first lead 88a has good soldering, no deformation, and the second lead 88b
Is not soldered, no deformation, the third lead 88c is not soldered, deformed, and the fourth lead 88d is good soldering, deformed, the output from the first probe 78a is large, the second
The output from the probe 78b is small, the output from the third probe 78c is small, the output from the fourth probe 78d is large, and the output from the fifth probe 78e is small (actually, none).

Next, when the probe unit 74 is similarly moved in the negative direction (left direction) of the Y axis and an external force is applied to each of the leads 88 by each of the probes 78, the respective leads 88 are deformed. Therefore, a voltage value corresponding to each of these deformation amounts is detected. At this time, the first probe 78a
Is small (actually none), the output from the second probe 78b is large, the output from the third probe 78c is small, the output from the fourth probe 78d is small, and the fifth probe 78e.
Output is small. Then, when the output large is changed to a numerical value of 1 and the output small is converted to a numerical value of 0 and added and evaluated, the measurement results corresponding to the first, second, third, and fourth leads 88 are 2,
0, 0, and 1. Therefore, the shape of the lead 88 may be slightly deformed before the inspection, or the distance between the probe 78 and the lead 8
The first and fourth leads 88 may be slightly different even if the distance between the first and second leads 88 is slightly different.
Each of the leads 88 can be comprehensively determined as “a” and “d” as good and “second” and “third” leads 88b and c as defective, and it is possible to inspect four leads 88 at the same time. In the movement of the probe unit 74 in only one direction, when the detection is performed as in the latter case, even if the fourth lead 88d is satisfactorily soldered,
This is inconvenient because it is likely to be determined to be defective due to shape deformation before inspection. By the way, such a probe unit can be used for pattern contact as the above-mentioned pattern probe unit when a plurality of probes are all conducted without mounting a strain sensor.

FIG. 17 is a front view showing the state of contact of the L-shaped probe with two terminals with the leads of the flat package IC during the soldering state inspection by the in-circuit tester. In the figure, 90 is a substrate to be inspected installed on a measurement table of an in-circuit tester, 92 is a flat package IC mounted on the substrate, 94 is a main body of the IC, 96 is a lead projecting from the main body 94, 98 is a substrate A pattern provided at 90 and 100 is an L-shaped probe with two terminals provided on the Z-axis unit of the XY unit installed above the measuring table. This probe 100 uses two large and small terminals 102 and 104 each formed of an L-shaped elongated columnar body protruding at right angles by bending the distal end, and arranged so that the small terminal 104 is overlapped inside the large terminal 102. And both terminals 10
2 and 104 with an insulator 106 interposed therebetween.
The tips 108, 110 of 2, 104 are brought close to each other, and the whole is formed into an L-shape to be integrated. Note that, instead of interposing the insulator 106 between the terminals 102 and 104, the terminals may be insulated while keeping a space.

In order to inspect the soldering state of the lead 96 of the IC 92, the XY unit is controlled to
Is moved and inserted between the leads 96 or the like. Then, it moves in the direction of the lead 96 (left direction in the figure), and the both terminals 10 are moved.
The tips 108 and 110 of the leads 2 and 104 are brought into contact with the rising portions of the leads 96, respectively. At that time, both terminals 102, 1
The tips 108 and 110 of 04 are at the positions indicated by the dotted lines in FIG. 18, and both terminals 102 and 104 are in a short-circuit state. Therefore,
Further, an external force is applied to the lead 96 by moving the lead 96 by a certain amount. Then, if the soldering condition of the lead 96 is good,
Since the lead 96 does not move as shown in FIG.
02 and 104 remain short-circuited. However, when the lead 96 is not soldered, the leading end of the lead 96 moves and deforms as shown in FIG. 20, and the lead 96 is separated from the leading end 108 of the large terminal 102.
04 is open. This is because the root of the lead 96 is the fulcrum 112 and the point closest to the fulcrum 112 of the lead 96 with which the tip 110 of the small terminal 104 contacts is the power point 11.
The reason for this is that the end point of the lead 96 from the power point 114 becomes the action point 116. Therefore, both terminals 102, 1
By detecting the short / open state of No. 04, it is possible to easily detect whether the soldering state is good or bad. Moreover, lead 9
Reference numeral 6 denotes an unsoldered state, and it is possible to easily detect an electrically conductive foot floating lead 96 in contact with the pattern 98.

FIG. 21 is a perspective view of a switch-type probe unit provided on the Z-axis unit of the XY unit installed on the in-circuit tester. In the figure, 118 is a switch type probe unit, 120 is its rectangular insulating substrate,
Reference numeral 122 denotes a conductive probe made of a rectangular metal plate disposed slightly apart from the insulating substrate 120, and 124 (124a,
124b) is the insulating substrate 120 and the probe 122
The connecting protrusions 126 provided at positions near the front end of the center of the inner surface of the inner surface are coupled with the protrusions 124, and are shafts that rotatably support the probe 122 with respect to the insulating substrate 120, and 128 are the insulating substrate 120. And a compression coil spring having one end fixed to the insulating substrate 120 and the other end fixed to the probe 122.
Reference numeral 30 denotes a frame supporting the insulating substrate 120 (shown in FIG. 1), the tip of which abuts against the center of the rear end of the outer surface of the probe 122 to keep the probe 122 receiving the urging force outward from the spring 128 parallel to the insulating substrate 120. No.) is a long columnar first terminal, 132 is a short columnar second terminal provided in the center of the rear end of the inner surface of the insulating substrate 120. Then, the first measurement cable 134 is connected to the first terminal 130, and the second
The measurement cable 136 is connected to the probe 122, and the third measurement cable 138 is connected to the second terminal 132. In addition,
The probe 120 projects from the tip of the insulating substrate 120 with the tip 140 slightly bent inward.

To inspect the soldering state of the leads of the flat package IC mounted on the board to be inspected, use X
By controlling the -Y unit, the switch type probe unit 118 is moved in the direction of the arrow with respect to the lead 142 of the IC as shown in FIG. 22, and the tip 140 of the probe 122 is inserted between the leads 142 and the like. Reference numeral 144 denotes the position of the surface of the inspected substrate from which the pattern is omitted. Next, FIG.
As shown in FIG. 3, the switch type probe unit 118 is moved in the direction of the arrow (the direction of the lead 142), and the probe 12 is moved.
The second tip 140 is appropriately brought into contact with the rising portion of the lead 142 or the like. Then, further move in the direction of the arrow to
An external force is applied to 42. Then, the conduction between the first and second measurement cables 134 and 136 has been performed, and the conduction between the first and third measurement cables 134 and 138 and the second and third measurement cables 136 and 138 have not been performed. Since the probe 122 is separated from the first terminal 130 in the state,
The first and second measurement cables 134 and 136 are also in a non-conductive state. This is because the distal end 140 of the probe 122 serves as a point of force, the rotation shaft 126 serves as a fulcrum, and a force in the direction away from the first terminal 130 acts on the rear end against the force of the spring 128.

As described above, when the probe 122 is rotated and its rear end is brought into contact with the second terminal 132,
As shown in FIG. 4, the second and third measurement cables 136 and 138
Become conductive. At this time, if the soldering condition of the lead 142 is good, the lead 142
Does not move and hardly deforms, whereas in the unsoldered state, when a force is applied, the lead 142 moves and deforms. Therefore, the first and second measurement cables 134 and 13
By measuring the time from when the connection between the first and second measurement cables 6 becomes non-conductive to when the second and third measurement cables 136 and 138 become conductive, the amount of movement of the switch-type probe unit 118 and the lead 142 can be measured. The amount of movement can be detected. Therefore,
The lead 142 having a short time is determined to be good in soldering, and the lead 142 having a long time is determined to be defective.

FIG. 25 is a front view showing an arrangement state of the distal end insulated probe and the conductive probe with respect to the lead of the flat package IC immediately before the soldering state inspection by the in-circuit tester. In the drawing, reference numeral 146 denotes a substrate to be inspected installed on a measurement table of an in-circuit tester; 148, leads of a flat package IC mounted on the substrate 146;
Reference numeral 50 denotes a pattern provided on the substrate 148, and reference numerals 152 and 154 denote an insulated tip probe and a conductive probe respectively provided on the Z-axis units of two sets of XY units installed above the measurement table. However, the tip of the probe 152 has an insulator 1 so that it does not conduct even when it comes into contact with the pattern 150.
55.

In order to inspect the soldering state of the lead 148 of the IC, first, the XY unit is controlled to move the tip insulating probe 152 in the Z-axis direction indicated by the arrow,
8 stands near one side (the left side in the figure). And
By controlling the other XY units, the conductive probe 154 is moved in the vertical direction (Z-axis direction) also indicated by the arrow, and the lead 1 is moved.
48, etc., and then stand in the horizontal direction (X
(In the direction of the axis or the Y-axis) and comes into contact with the lead 148 from the other side (the right side in the figure). Therefore, the probe 15
4 is moved laterally to apply a force to the lead 148. At this time, when the soldering state of the lead 148 is good, the lead 148 does not move and hardly deforms even if a force is applied. In particular, the rising portion and the distal end move laterally and are deformed, and the lead 148 is connected to the distal insulating probe 15.
2 and becomes conductive. Therefore, both probes 15
The conduction state of the leads 154 and 154 is detected. If the conduction state is not maintained, it is determined that the soldering of the lead 148 is good. In order to move the lead 148 in the horizontal direction, the conductive probe 154 may be made to approach the lead 148 from an oblique direction as shown in FIG. However, in this case, the probe 15
Flatten the tip of 4. By the way, the probes 152, 15
4 and the like do not have to be tapered, but may be plate-shaped as long as they are between the leads 148.

FIG. 27 is a perspective view showing an arrangement state of the image camera with respect to the leads of the flat package IC before applying an external force to the leads during the soldering state inspection by the in-circuit tester. In the figure, reference numeral 156 denotes a flat package IC mounted on a substrate to be inspected installed on a measurement table of an in-circuit tester; 158, a main body of the IC 156;
0 is a lead projecting from one side of the body 158, 162
Denotes an image camera mounted on a Z-axis unit of an XY unit installed above a measurement table, and 164 denotes a camera 162 thereof.
Is a circle showing the imaging region of the. This camera 162 is connected to IC5
When the image is taken toward 6, image data of a portion included in the circle 164 is obtained.

In order to inspect the soldering state of the leads 160 of the IC 156, first, before applying an external force to each lead 160, the XY unit is controlled to move the camera 162 along the group of leads in the direction of the arrow. Images are sequentially taken at each set position from one end to the other end. At this time, since the leads 160 included in the lead group protruding from one surface of the IC 156 are arranged at substantially equal intervals, three leads 160 adjacent to the imaging circle 164 are included as shown in FIG. When,
Image data indicating the state of the leads 160 is obtained. Therefore, each image data is stored in the storage device. Next, the same XY unit is controlled, this time using a probe 166 as shown in FIG. 29, moving from one end to the other end in the direction of the arrow, and sequentially contacting each lead 160, Go. At that time, lead 1 that has not been soldered
An external force is applied to such an extent that the lead 60 and the poorly soldered lead 160 cause plastic deformation. Since the probe 166 is mounted on the same Z-axis unit as the image camera 162, the contact position of the probe 166 is set in consideration of the dimensional difference between the mounting positions.

Next, the XY unit is controlled in the same manner as before the external force is applied, and the camera 162 is moved in the direction of the arrow along the lead group, and images are sequentially taken at each set position. At this time, the central lead 1 included in the imaging circle 164 of FIG.
The unsoldered lead 160, such as 60, undergoes plastic deformation when an external force is applied, so that image data indicating the state is obtained. Then, after storing each image data after the external force is applied, the corresponding image data before and after the external force is applied is compared to determine the amount of deformation of the lead 160, and it is determined whether the images are different before and after. However, since the images differ greatly and the deformation amount is large, the lead 160 is determined to be defective in soldering. Note that the lead 160 having good soldering does not undergo plastic deformation.

[0050]

According to the present invention described above, claim 1
In this case, the probe can be brought into contact with each part of the lead of the electronic component, particularly the rising part, and an external force can be applied. Therefore,
It is easy to detect soldering defects such as fine surface-mounted components such as short leads and narrow lead intervals. In addition, if the soldering condition is good when an external force is applied, the lead will not be deformed if the soldering condition is good, and if it is not soldered, the tip of the lead will move horizontally to the board surface and be deformed. Soldering leads do not make good contact with the pattern. Therefore, the quality of the soldered state of the lead can be accurately determined by detecting the amount of deformation of the lead.

When the L-shaped probe is used, since the tip is bent and protruded from the main body, even if the lead is curved, it can be easily brought into contact with an arbitrary portion to apply an external force. Moreover, it is easy to select the shape of the tip according to the lead,
With a needle shape, it can be inserted between adjacent leads to apply external force to both leads at once.

According to the second aspect of the present invention, by moving the flipping probe at a constant high speed, the probe can flip the lead group of the electronic component in order from the end, contact the probe with each lead, and apply an external force. . The sound generated when the probe moving at a constant high speed plays each lead is collected by a directional microphone separated from the electronic components, and the time interval for playing each lead of the lead group is measured, and the time interval of each lead is measured. The amount of deformation can be detected. Therefore, it is possible to speed up the detection of the soldering failure of the surface mount component.

According to a third aspect of the present invention, while each of the leads is flipped by a flipping probe which moves at a constant high speed, the pattern probe unit is used to short-open the leads with or in contact with all the patterns to be contacted. By checking, the time interval of flipping each lead can be measured to detect the amount of deformation of each lead. Therefore, it is possible to speed up the detection of the soldering failure of the surface mount component.

According to a fourth aspect of the present invention, all the probes with a strain sensor of the lead probe unit are respectively arranged on both sides of each corresponding lead of the electronic component, and the corresponding probe is brought into contact with one side surface of each lead, respectively. External force can be applied to the lead. Therefore, the deformation amount of each lead is detected by converting the amount of deformation of each lead into an electric signal by the strain sensor provided in each probe, and the detection of the soldering failure of the surface mount component can be speeded up. Moreover, when the corresponding probe is brought into contact with the side opposite to the side where the external force was applied to the tip of each lead, the external force is applied to each lead, and the amount of deformation of each lead is similarly detected. The shape deformation can be comprehensively determined, and the detection of the soldering failure of the surface mount component can be speeded up.

According to a fifth aspect of the present invention, the ends of the large and small terminals of the L-shaped probe with two terminals are brought into contact with arbitrary points such as the rising portions of the leads, and both terminals are short-circuited.
When an external force is applied to the lead, if not soldered, the tip of the small terminal becomes the point of emphasis, the tip of the lead moves and deforms, the lead separates from the tip of the large terminal, and both terminals are opened. . Therefore, the amount of deformation of the lead can be detected by a short / open check of both terminals provided in the probe.

According to a sixth aspect of the present invention, after the tip of the probe protruding from the tip of the insulating substrate is brought into contact with the rising portion of the lead and the like, the switch-type probe unit is moved to apply an external force to the lead. It becomes a point of force, and the rotation axis becomes a fulcrum, and a force in a direction away from the first terminal acts on the rear end of the probe against the spring force, so that the first terminal and the probe become non-conductive. By measuring the time until the probe and the second terminal provided on the insulating substrate become conductive, the amount of deformation of the lead can be detected.

According to a seventh aspect of the present invention, when the tip-insulated probe is placed near one side of the lead and is brought into contact with the pattern, the probe has an insulator at the tip and does not conduct with the pattern. When the probe is brought into contact with the other side of the lead and an external force is applied to the lead, the lead moves and deforms when it is not soldered, and the lead comes into contact with the insulated probe.
The amount of deformation of the lead can be detected by the open check.

According to an eighth aspect of the present invention, before applying an external force to each lead of the electronic component, image data indicating the state of the lead is taken at each set position by an image camera remote from the electronic component, and the image data is stored. After memorizing, apply external force to each lead,
Further, after the image is similarly captured and stored by the same camera, the deformation amount of each lead can be detected by comparing the corresponding image data before and after applying an external force for each set position.

[0059]

[0060]

[Brief description of the drawings]

FIG. 1 shows a PLCC type flat package I during a soldering state inspection by an in-circuit tester to which the present invention is applied.
It is a side view which shows the contact state of the L-type probe with respect to the lead of C.

FIG. 2 is a side view showing a state in which an external force is applied to an unsoldered lead of the IC by an L-shaped probe.

FIG. 3 is a diagram illustrating a voltage detection circuit configured to incorporate a strain gauge provided in the L-shaped probe and configured to detect a deformation amount of a lead.

FIG. 4 is a side view showing an arrangement relationship of an L-shaped probe with an insertion needle with respect to a lead of a QFP type flat package IC during a soldering state inspection by the in-circuit tester.

FIG. 5 is a plan view showing a state of a tip needle inserted between adjacent leads having good solderability of the flat package IC.

FIG. 6 is a plan view showing a state of a tip needle inserted between adjacent soldered good leads and unsoldered leads of the flat package IC.

FIG. 7 is a diagram showing a relationship between an amount of movement of a probe between a lead with good soldering and a lead with no soldering of the flat package IC and an output voltage based on a deformation thereof.

FIG. 8 is a perspective view showing an arrangement relationship between a flipping probe and a directional microphone immediately before flipping with respect to a lead group of a flat package IC during a soldering state inspection by the in-circuit tester.

FIG. 9 is a diagram showing a relationship between sound and time generated when six leads are sequentially played from one end to the other end by the playing probe.

FIG. 10 is a diagram showing a relationship between a change in resistance value and a time which occur when a gauge is attached to the flipping probe and the ball is flipped in the same manner.

FIG. 11 shows six pattern contact probes provided in the pattern probe unit, each lead of the flat package IC being soldered or brought into contact with a pattern to be soldered, and then the same flipping probe is used. FIG. 6 is a diagram illustrating a relationship between a change in a current value generated when the player flips and time.

FIG. 12 is a front view showing a lead probe unit having five probes with strain gauges used for inspecting a soldering state of a flat package IC by the in-circuit tester.

FIG. 13 is a perspective view showing an arrangement relationship of a lead probe unit before a soldering state inspection for the flat package IC.

FIG. 14 is a front view showing the arrangement relationship of each strain gauge-equipped probe of the lead probe unit immediately before the soldering state inspection for each lead of the flat package IC.

FIG. 15 is a front view showing a state in which an external force is applied from one direction by a probe with each strain gauge of the lead probe unit during a soldering state inspection for each lead of the flat package IC.

FIG. 16 is a front view showing a state in which an external force is applied from another direction by each probe with a strain gauge of the lead probe unit.

FIG. 17 is a front view showing a contact state of an L-shaped probe with two terminals to a lead of a flat package IC during a soldering state inspection by the in-circuit tester.

FIG. 18 is a side view showing the tip positions of the two terminals when the L-shaped probe with two terminals comes into contact with the leads of the flat package IC.

FIG. 19 is a front view showing a positional relationship between the lead and the tip of the two terminals when an external force is applied by a two-terminal L-shaped probe to the lead having good soldering of the flat package IC.

FIG. 20 is a front view showing a positional relationship between the lead and the tip of the two terminals when an external force is applied to the unsoldered lead of the flat package IC by an L-shaped probe with two terminals.

FIG. 21 is a perspective view showing a switch-type probe unit used when inspecting a soldering state of a flat package IC by the in-circuit tester.

FIG. 22 is a schematic front view showing an arrangement relationship of a switch type probe unit before an inspection of a soldering state with respect to a lead of the flat package IC.

FIG. 23 is a schematic front view showing a contact state of a probe of the switch type probe unit at the time of inspecting a soldering state with respect to a lead of the flat package IC.

FIG. 24 is a schematic front view showing a state in which an external force is applied to the lead by the probe by moving the switch-type probe unit at the time of inspecting a soldering state with respect to the lead of the flat package IC.

FIG. 25 is a front view showing the positional relationship between the insulated tip probe and the conductive probe with respect to the lead of the flat package IC when the soldering state is inspected by the in-circuit tester.

FIG. 26 is a front view showing an arrangement relationship between a tip insulating probe with respect to a lead of the flat package IC and a conductive probe having a different tip shape in contact with the lead;

FIG. 27 is a perspective view showing an arrangement relationship of the image camera with respect to the leads of the flat package IC before applying an external force to the leads during the soldering state inspection by the in-circuit tester.

FIG. 28 is a plan view showing a state of a lead included in an imaging circle of the image camera before an external force is applied to the lead of the flat package IC.

FIG. 29 is a perspective view showing an arrangement state of a probe when an external force is applied to a lead of the flat package IC.

FIG. 30 is a perspective view showing an arrangement state of an image camera with respect to the lead of the flat package IC after an external force is applied to the lead.

FIG. 31 is a plan view showing a state of a lead included in an imaging circle of the image camera after an external force is applied to the lead of the flat package IC.

FIG. 32 is a side view showing an arrangement state of two probes with respect to a flat package IC during a soldering state inspection by a conventional in-circuit tester.

FIG. 33 is a side view showing an arrangement state of two probes with respect to a flat package IC immediately before a soldering state inspection by the in-circuit tester.

[Explanation of symbols]

22, 48, 64, 82, 90, 146...
24, 50, 66, 84, 92, 156 ... flat package ICs 28, 54, 70, 88, 96, 142,
148, 160 ... lead 30, 56, 98, 150 ...
Pattern 32: Solder 34: L-shaped probe 35, 1
40: Tip 36, 62, 80: Strain gauge 38:
Voltage detection circuit 58 ... L-shaped probe with needle at the tip 60 ...
Tip needle 72: Playing probe 73: Directional microphone 74: Lead probe unit 78: Probe with strain gauge 100: L with two terminals
Shaped probes 102, 104: large and small terminals 106: insulators 108, 110: tips of large and small terminals 112: fulcrum 114: force point 116: action point 118: switch type probe unit 120: insulating substrate 122, 15
4: Conductive probe 124: Connecting protrusion 126 ...
Shaft 128: Compression coil spring 130, 132 ...
First and second terminals 134, 136, 138: first, second, and third measurement cables 152: tip-insulated probe 1
55 ... insulator 162 ... image camera 164 ... imaging circle
166: Probe

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masahiko Takada 81, Sakuramachi, Koizumi, Ueda City, Nagano Prefecture Inside of Hioki Electric Co., Ltd. Inside (72) Inventor Yoshinori Sato 81, Sakuramachi, Koizumi, Oji, Ueda, Nagano Prefecture Inside (72) Inventor Masamichi Namo 81, Sakuramachi, Koizumi, Oaza, Ueda, Nagano Prefecture, Japan Hioki Electric Co., Ltd. Examiner Takashi Nakagawa (56) References JP-A-2-36371 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/34 B23K 1/00 G01N 19/04 G01R 1 / 073

Claims (8)

(57) [Claims] 1. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in the method of detecting poor soldering of a lead of an electronic component surface-soldered to a printed circuit board by using an in-circuit tester having a plurality of sets, a method of detecting poor soldering of a surface-mounted component, the lead as the probe is used as the probe. Using an L-shaped probe with its distal end bent and projecting, the probe is brought into contact with the lead of the electronic component, and the probe is moved in the X-axis or Y-axis direction to apply external force to the lead, A method for detecting defective soldering of a surface-mounted component due to lead deformation, wherein the method detects a deformation amount and determines the quality of a soldering state based on the detection result. 2. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in the method of detecting soldering failure of a surface-mounted component, which uses a plurality of in-circuit testers to determine the soldering state of the leads of the electronic component soldered to the printed board, Using a flipping probe with a high performance, the probe is brought into contact with the lead of the electronic component, the probe is moved in the X-axis or Y-axis direction to apply an external force to the lead, and the amount of deformation of the lead is measured using a directional microphone. A method for detecting defective soldering of a surface-mounted component due to lead deformation, wherein the quality of the soldered state is determined based on the detection result. 3. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in the method of detecting soldering failure of a surface-mounted component, which uses a plurality of in-circuit testers to determine the soldering state of the leads of the electronic component soldered to the printed board, Using a flipping probe having a high performance, the probe is brought into contact with the lead of the electronic component, the probe is moved in the X-axis or Y-axis direction to apply an external force to the lead, and a plurality of leads for conducting the deformation of the lead to each other are provided. A pattern contact probe is detected using a protruding pattern probe unit, and the quality of the soldering state is determined based on the detection result. Of soldering failure of surface mount components due to lead deformation. 4. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in the method of detecting poor soldering of leads of electronic components surface-mounted on a printed circuit board by using an in-circuit tester having a plurality of sets, a method of detecting a defective soldering of a surface-mounted component, a plurality of probes are used as the probe. Using a lead probe unit having a plurality of strain-sensor-equipped probes arranged and arranged in a row with a spacing substantially equal to the lead spacing of electronic components arranged in a row and projecting at equal intervals. The probe contacts the lead of the component, moves the probe in the X-axis or Y-axis direction, applies an external force to the lead, detects the amount of deformation of the lead, and detects the result. A method for detecting poor soldering of a surface-mounted component due to lead deformation, wherein the quality of a soldering state is determined based on results. 5. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in the method of detecting poor soldering of a lead of an electronic component surface-soldered to a printed circuit board by using an in-circuit tester having a plurality of sets, a method of detecting poor soldering of a surface-mounted component, the lead as the probe is used as the probe. Two large and small terminals made of an L-shaped body with a bent end protruding from the small terminal are used, and small terminals are arranged inside the large terminal so as to overlap with each other, and an insulator is interposed between both terminals. An L-shaped probe with two terminals is formed by bringing the tip of the probe closer to a close distance, forming the whole in an L-shape, and bringing the probe into contact with a lead of an electronic component, and moving the probe in the X-axis or Y-axis direction. And detecting an amount of deformation of the lead by applying an external force to the lead, and determining whether the soldering state is good or bad based on the detection result. . 6. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in a method of detecting a defective soldering of a surface-mounted component using a plurality of sets of in-circuit testers to determine whether a lead of an electronic component soldered to a surface-mounted solder is good or not, the probe is insulated. A little distance between the substrate and the plate-shaped conductive probe, the tip of the probe is arranged so as to protrude slightly from the tip of the insulating substrate, and connection projections are provided on the insulating substrate and the inner surface of the probe, respectively. , The connecting projections are connected by an axis to rotatably support the probe with respect to the insulating substrate, and a compression spring is provided between the insulating substrate and the inner surface of the probe away from the connecting projections. With at least one end of the compression spring fixed to an insulating substrate or a probe,
A switch having a first terminal that abuts on the outer surface of the probe when not in use, supports the probe in a fixed state away from the insulating substrate, and has a second terminal on the inner surface of the insulating substrate that the probe abuts when used. Using a type probe unit,
The probe is brought into contact with the lead of the electronic component, and the probe is moved in the X-axis or Y-axis direction to apply an external force to the lead,
A method for detecting defective soldering of a surface-mounted component due to lead deformation, wherein the method detects the amount of deformation of the lead and determines the quality of the soldering state based on the detection result. 7. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in a method of detecting a soldering failure of a surface-mounted component, the in-circuit tester including a plurality of sets is used to determine whether or not a lead of an electronic component soldered to a surface-mounted solder is good. Contact the lead of the part and move the probe to X-axis or Y-axis.
An external force is applied to the lead by moving in the axial direction, the amount of deformation of the lead is detected using a tip insulating probe having an insulator at the tip, and the quality of the soldering state is determined based on the detection result. Method for detecting defective soldering of surface mount components due to lead deformation. 8. A set of XY units, comprising a Z-axis unit movable in the Y-axis direction on an arm movable in the X-axis direction, and the Z-axis unit supporting the probe movably in the Z-axis direction. Alternatively, in a method of detecting a soldering failure of a surface-mounted component, the in-circuit tester including a plurality of sets is used to determine whether or not a lead of an electronic component soldered to a surface-mounted solder is good. Contact the component, move the probe in the X-axis or Y-axis direction, apply an external force to the lead, detect the amount of deformation of the lead using an image camera, and determine the soldering condition based on the detection result. A method for detecting a defective soldering of a surface mount component due to lead deformation, characterized by determining.