JP3322924B2 - Plate heat treatment equipment using grooved plate for heat treatment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grooved play for heat treatment.
The present invention relates to a heat treatment apparatus for a plate-like body using a metal plate.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of an industrial product using a plate made of an inorganic material such as glass or ceramics as a substrate, a baking process for heat-treating the substrate employs a plate system which generates less dust. I have. This plate is provided with a number of ventilation holes for vacuum-sucking the substrate to the plate. Due to the presence of the ventilation holes, it is possible to improve the bias of the temperature distribution (temperature variation) in the substrate surface caused by the degree of contact between the substrate subjected to the heat treatment and the plate.

In the baking process, 100 to 200
Since a baking temperature of ° C. is used, heating with a single plate takes a long time until the temperature rises, and the processing capacity of the apparatus per unit time decreases. Therefore, a method is generally used in which a substrate is sequentially moved in a short time on a plurality of plates to improve the processing performance per unit time. Therefore, in the above-described plate method, a plurality of plates are usually used, and the substrate is sequentially moved to the plurality of plates to perform heating. An actual example of heat treatment of a substrate using a plate method will be described in a manufacturing process of a liquid crystal panel.

FIG. 4 is a schematic diagram of a developing apparatus A used in a photolithography process for forming a fine pattern, for example, in a manufacturing process of a liquid crystal panel using a glass substrate. FIG. 5 is a schematic view of the resist coating apparatus B in the same step.

[0005] In the case of the developing apparatus A, after passing through the developing section 2, the washing section 3, and the drying section 4, the baking processing in the baking section 5 for improving the etching resistance is performed by the above-mentioned plate method.

In the case of the resist coating apparatus B, cleaning (spin scrub cleaning) in the cleaning section 12 before resist coating.
After the dehydration baking process and the cool plate cooling process in the dehydration baking unit 13 for removing water, and the resist coating in the coating unit 14, the pre-baking in the baking unit 15 for solvent removal in the resist. The baking process is performed by the above-described plate method.

The above-mentioned baking section is composed of a plurality of hot plates (HP) and cold plates (CP), respectively.

[0008]

The substrate is successively transferred to such a hot plate (HP) or a cold plate (CP), and the substrate is vacuum-adsorbed to the plate through the ventilation holes of the plate to perform a heat treatment. In order to sequentially transport the substrates to the plate, the vacuum applied to the plate is released by air each time and the substrate is lifted. When the vacuum is released by the air, the substrate and the plate are not always sufficiently separated from each other, so that when the substrate is lifted, a separation charge is generated on the substrate.

When the substrate is charged, naturally, various kinds of dust (dust floating in the air and the like) are attracted to and adhere to the substrate by the electrostatic force. This contributes to a significant decrease in yield in the field of precision industry (for example, liquid crystal display manufacturing).

In addition, when the vacuum release of the plate is not sufficient, the substrate being attracted is mechanically lifted against the attraction force, so that stress is applied to the substrate and the substrate may be cracked.

As described above, the conventional heat-treating plate has problems of peeling charging and substrate cracking, and a solution has been desired.

SUMMARY OF THE INVENTION An object of the present invention is to provide an improved heat-treating plate which can cope with peeling charging and substrate cracking.

[0013]

According to the present invention, there are provided a plurality of heat treatment grooved plates each having a ventilation hole and having grooves formed on a surface thereof, and the object to be heated is sequentially moved onto the plate.
A heat treatment apparatus for a plate-like body to be heat-treated, wherein the plate
The positions of the grooves provided on the surface are different from each other with respect to the object to be heated
Grooved for heat treatment characterized by being arranged as follows
The above object has been achieved by a plate-like body heat treatment apparatus using a plate .

[0014]

[Action] By providing a groove on the surface of the heat treatment plate,
Air can easily enter between the substrate and the plate, and the vacuum can be easily released by air.

Further, by using a plurality of the heat-treated grooved plates so that the positions of the grooves provided on the surface are different from each other with respect to the object to be heated, the substrate corresponding to the position of the grooves can be obtained. Deterioration of the temperature distribution due to the difficulty in increasing the temperature of the portion can be compensated.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 3 shows an example of a grooved plate for heat treatment.

This plate is made of aluminum, for example, and its surface may be subjected to a surface treatment such as "hard alumite processing", "Teflon coating" or "nickel plating".

The width of the groove of the plate is 1-2 mm, and the depth of the groove is about 0.5 mm.

Since the heat conduction of the portion of the substrate corresponding to the groove portion is deteriorated, if the width is too wide, the temperature distribution in the substrate surface will be further deteriorated. The distribution worsens. Therefore, the width of the groove and the depth of the groove need to be determined in relation to the temperature distribution in the substrate surface.

The size (area) of the plate is, of course, larger than the size (area) of the substrate, and the larger the size (area) of the substrate, the better the apparatus can be seen from the plane of the in-plane temperature distribution of the substrate. Become. However, as the size of the plate increases, the floor area of the apparatus naturally increases, which is not preferable from the viewpoint of productivity. Then, from the viewpoint of the floor area of the apparatus, the smaller the plate size, the better the apparatus.

Therefore, the size of the plate is determined in consideration of the above points.

Embodiment 2 FIG. 2 shows heat treatment plates having different groove positions.

As described above, in order to compensate for the deterioration of the temperature distribution due to the difficulty in increasing the temperature of the substrate portion corresponding to the position of the groove, the groove shown in FIGS. Prepare several types of plates at different positions.

These plates are connected to the conventional developing device A
FIG. 3 shows an example used for the above.

The positions and angles of the grooves in the plate, the number of grooves, and the arrangement of the plates may be determined as appropriate from the viewpoint of minimizing the deviation of the temperature distribution in the substrate surface while coping with peeling charging and substrate cracking. However, the present invention is not limited to the above-described embodiments.

[0027]

As described above, in the present invention, the use of a grooved plate allows the vacuum to be released by air, thereby preventing peeling electrification that occurs when the substrate is lifted, and the conventional method. Since the load applied when lifting the substrate can be eliminated, the substrate is less likely to crack.

Further, by using a plurality of plates having different groove positions in combination, it is possible to compensate for the deterioration of the temperature distribution due to the difficulty in increasing the temperature of the substrate corresponding to the groove position.

[Brief description of the drawings]

FIG. 1 shows a grooved plate of the present invention.

FIG. 2 shows another example of the grooved plate of the present invention.

FIG. 3 shows an example of use of the grooved plate of the present invention.

FIG. 4 is a schematic view of a developing device in a photolithography process using a conventional plate.

FIG. 5 is a schematic view of a conventional photolithographic resist coating apparatus using a plate.

[Explanation of symbols]

 P Groove plate having vent holes g Groove provided on plate surface h Vent holes provided on plate HP hot plate CP cold plate

──────────────────────────────────────────────────続 き Continued on the front page (56) References JP-A 2-103700 (JP, U) JP-A 63-35000 (JP, U) JP-A 5-10998 (JP, U) (58) Survey Field (Int.Cl. ⁷ , DB name) F27D 3/12 F27B 9/00-9/40

Claims (1)

(57) [Claims] 1. A has a vent hole, formed by providing a groove on a surface double
Equipped with several grooved plates for heat treatment and placed on the plate
Heat treatment equipment for plate-like body that heats by moving the heated object sequentially
Wherein the position of the groove provided on the plate surface is
That they are different from each other
Features of plate-like body using grooved plate for heat treatment
Heat treatment equipment .