JP3314335B2 - Electronic component mounting method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for picking up an electronic component at a nozzle head of a suction head and removing the electronic component from a component supply position. Correction processing of the suction head in the X, Y and θ directions is performed according to the data obtained in step (1), and the electronic component is carried by the suction head to a board mounting position distant from the component supply position and is moved to a predetermined board surface position of the circuit board. The present invention relates to a method of mounting electronic components to be mounted and an improvement of the device.

[0002]

2. Description of the Related Art Conventionally, in an electronic component mounting apparatus,
As shown in FIG. 3, an imaging camera 2 that captures, as an image, the state of suction of the electronic component E by the suction head 1 is installed below the path along which the suction head 1 moves from the component supply position to the substrate mounting position. There is something.

In the electronic component mounting apparatus, the suction state of the electronic component E held by the suction head 1 needs to be captured by an imaging camera 2 installed below.
Have to stop once above. For this reason, a loss of time required for mounting the electronic components occurs.

Instead of installing the imaging camera below the suction head, as shown in FIG. 4, a mirror 3 for displaying the suction state of the electronic component E by the suction head 1 and reflection surfaces 3a and 3a of the mirror 3. An imaging camera 2 that captures reflected light going upward from below by 3b as an image;
Some are provided integrally with

In the electronic component mounting apparatus, when the suction head 1 moves to the component supply position and the component mounting position, the mirror 3 is kept on standby, but when the suction head 1 moves from the component supply position to the substrate mounting position, the mirror 3 is held together. , The sucking state of the electronic component E by the suction head 1 is captured by the imaging camera 2 as an image.
In this electronic component mounting apparatus, since the imaging camera 2 and the mirror 3 are both provided integrally with the suction head 1, the suction head 1 becomes large and heavy, and cannot be moved at high speed.

Further, as shown in FIG. 6, an imaging camera 2 is provided integrally with the suction head 1 and nozzles 1a and 1b of the suction head 1 are provided so as to be rotatable up and down by 180 ° by a rotation drive unit 1c. .

In this electronic component mounting apparatus, the nozzle portions 1a and 1b can be moved up and down by 180 ° even without a mirror.
Since the suction head 1 rotates, the suction state of the electronic component E by the suction head 1 can be captured by the imaging camera 2 while the suction head 1 is moving. However, the rotation drive unit 1c of the nozzle units 1a and 1b
In addition to the fact that the suction head becomes large and heavy in weight, the nozzle portions 1a and 1b that hold the electronic component E rotate from upward to downward, so that a highly accurate position by the suction head is obtained. Affects correction.

In addition, as shown in FIGS. 6 and 7, a line sensor 2 'instead of an imaging camera is provided integrally with the suction head 1, and a pair of mirrors 3a and 3b opposed to each other with the reflecting surface directed obliquely upward. The suction head 1 is located below the moving path between the component supply position 4 and the substrate mounting position 5 in a direction perpendicular to the moving direction of the suction head 1, and the suction head 1 is moved from the component supply position 4 to the component mounting positions A and B. , And C, the image of the electronic component is captured by the line sensor 2 ′ as the electronic component E traverses the mirrors 3a and 3b, and the outer shape of the entire image is recognized by the composite image. It has been proposed (JP-A-8-78895).

In the electronic component mounting apparatus, the suction head 1 is used.
Can be moved linearly from the component supply position 4 to the component mounting positions A, B, and C in the shortest distance, but the image of the electronic component is displayed on the line sensor 2 as the electronic component E crosses over the mirrors 3a and 3b. In order to accurately and surely capture the image of the electronic component, it is necessary to move the suction head 1 at least above the mirrors 3a and 3b slowly.

[0010]

SUMMARY OF THE INVENTION According to the present invention, even if the suction head is kept small and light, and the suction head is moved at a constant high speed, the suction state of the electronic components by the suction head can be accurately and reliably achieved. It is an object of the present invention to provide a method and an apparatus for mounting an electronic component that can be captured, eliminate loss of time, and mount the electronic component at a predetermined board surface position with high accuracy.

[0011]

According to a first aspect of the present invention, there is provided a method for mounting an electronic component, wherein the electronic component is sucked by a tip of a nozzle of a suction head, taken out from a component supply position, and sucked by the suction head. In addition to projecting the holding state with a mirror, the reflected light from the mirror is captured as an image by an imaging camera, and the position of the suction head in the X, Y or θ directions is corrected based on data obtained by image processing from the image, and the electronic components are mounted. While the suction head is moved from the component supply position to the substrate mounting position, the suction head is used to carry the suction head to a board mounting position remote from the component supply position and mount it on a predetermined board surface position of the circuit board. The sucking state of the electronic components is projected upward by a mirror arranged in the same direction as the moving direction below the moving path of the suction head, and the reflected light of this mirror is fed to the suction head. It is adapted captured as an image by de and imaging camera provided integrally.

In the electronic component mounting apparatus according to a second aspect of the present invention, a suction head for picking up the electronic component at the nozzle tip and taking it out of the component supply position, and displaying a suction state of the electronic component by the suction head. Equipped with a mirror and an imaging camera that captures light reflected by the mirror as an image,
The position of the suction head in the X, Y or θ directions is corrected based on data obtained by image processing from the image of the imaging camera, and the electronic component is carried by the suction head to a board mounting position distant from the component supply position. Mounted on a predetermined plate surface position of the substrate, a mirror that reflects the suction state of the electronic component by the suction head with the reflection surface facing upward is arranged in the same direction as the movement direction below the suction head moving path, It is configured by integrally providing an imaging camera that captures the light reflected by the mirror as an image with the suction head.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 and 2, this electronic component mounting apparatus has an electronic component suction head 1 as a basic configuration as shown in FIG. An imaging camera 2 that captures the state of suction of the electronic component E by the suction head 1 as an image is provided integrally with the suction head 1, and further, the state of suction of the electronic component E by the suction head 1 is reflected obliquely upward. The mirror 3 projected on the surfaces 30 and 31 is arranged below the moving path of the suction head 1.

As shown in FIG. 2, the electronic component mounting apparatus includes a tape feeder for individually supplying various electronic components E ₁ , E ₂ . A plurality of units 41 are provided in parallel to constitute a component supply position 4. On the other hand, a substrate transfer unit 50, 51 is provided, on which a printed board P is placed and temporarily stopped at a relative side distant from the component supply position 4. 5. In addition, the suction head 1 individually sucks the electronic components from each of the component supply positions 4 and moves from each of the component supply positions 4 to the board mounting position 5 to move the electronic components to a predetermined plate surface position of the printed circuit board P. A, B... Are sequentially mounted.

In the electronic component mounting apparatus, FIG.
As shown in the figure, the suction state of the electronic component E by the suction head 1 is captured by the imaging camera 2 as an image, and the data obtained from this image is used by the image processing device 6 and the control device 7 to determine the normal mounting posture and position of the electronic component. The electronic component can be mounted on a predetermined board surface position of the printed circuit board P by calculating the error of the suction head 1 and performing position correction based on the amount of movement of the suction head 1 in the X, Y or θ directions by the component detection signal. I have.

The mirror 3, which reflects the sucking state of the electronic component, is arranged in the same direction as the moving direction below the moving path of the suction head 1 as a rail-shaped mirror whose reflecting surfaces 30, 31 face diagonally upward. ing. That is, a plurality of the mirrors 3 can be individually placed between the component supply position 4 of each of the component supply mechanisms 40 and 41 and the substrate mounting position 5 and are arranged in parallel.
While the suction head 1 integrally including the imaging camera 2 linearly moves from each component supply position 4 to the substrate mounting position 5,
It is provided so that the suction state of the electronic component by the suction head 1 is projected so that the reflected light can be refracted from below toward the imaging camera 2 as reflected light.

Of the reflecting surfaces 30 and 31 facing diagonally upward from the mirror 3, one side 30 is disposed immediately below along with the trajectory of the electronic component held by the suction head 1 and moves to the other side. Reference numeral 31 is arranged as a reflection surface that refracts light reflected from one side 30 toward the upper imaging camera 2. Thereby, the imaging camera 2 is equipped so as to continue until the suction head 1 linearly moves from each component supply position 4 to the substrate mounting position 5 and to capture the state of holding the electronic components by the suction head 1 as an image. ing.

Since it is necessary to correct the position of the suction head 1 in the X and Y directions from the image captured by the imaging camera 2, the mounting device for the electronic components is provided with X and Y guide rails which are arranged vertically. And an X, Y drive mechanism (not shown) including a slider slidably held by each guide rail, a ball screw shaft for slidingly driving each slider, and a reversible motor for rotating each ball screw shaft. With one slider attached to the guide rail on the other side,
By mounting the suction head on the other slider, the suction head can be moved in the X and Y directions by the guide rail.

In addition to the position correction in the X and Y directions and the position correction in the θ direction, that is, the correction of the holding posture by the suction head, a gear is provided around the cylinder of the suction head. Is provided with a θ drive mechanism (not shown) that meshes with a pinion that rotates by rotating the suction head about the longitudinal axis of the suction head.

In the position correction by the suction head 1,
The position correction in the X and Y directions is performed by setting the mounting head 1 to the substrate mounting position 5.
To the predetermined component mounting position on the printed circuit board p. On the other hand, the position correction in the θ direction is performed while the suction head 1 is linearly moved from each component supply position 4 to the substrate mounting position 5 or in the same manner as the position correction in the X and Y directions. 1 can be performed while moving to a predetermined component mounting position.

[0021] In mounting apparatus of electronic components to be configured in this manner, will be described in the case where the suction head 1 is taken out electronic components E ₁ from the component supply mechanism 40, the suction head 1 is an electronic component E ₁ from the component supply mechanism 40 When the suction head 1 sucks, the suction head 1 moves upward from the component supply position 4 of the component supply mechanism 40 to a predetermined height position, and horizontally thereafter from the raised position.
Move linearly along the mirror 3 arranged between the component supply position 4 and the substrate mounting position 5 below the moving path of the mirror.

While the suction head 1 moves linearly along the mirror 3, the suction state of the electronic components by the suction head 1 can be reflected on the reflection surface 30 of the mirror 3 arranged below and the reflection state can be obtained. The light is refracted upward from the reflection surface 31 of the mirror 3 and is captured by the imaging camera 2 provided integrally with the suction head 1.

In the electronic component mounting apparatus, when the suction head 1 is moved from the component supply position 4 to the position where the mirror 3 is disposed, the entire state of the sucked state of the electronic component can be immediately projected on the mirror 3 and the mirror 3 is used. Since the reflected light is continuously captured by the imaging camera 2 while the suction head 1 moves to the substrate mounting position 5, an image of the electronic component can be obtained accurately and reliably as data required for position correction of the suction head 1. it can.

The image captured by the imaging camera 2 is processed by the image processing device 6 and the control device 7. If there is an error in the comparison between the data obtained by the image processing and the predetermined mounting position of the electronic component, the suction head 1 Is transmitted from the control device 7 to the X, Y drive mechanism and the θ drive mechanism, and the position of the suction head 1 is corrected while the suction head 1 moves to the predetermined component mounting position at the substrate mounting position 5. I can do it.

The movement of the suction head 1 can be performed at a high speed while maintaining a constant speed from the suction of the electronic components to the mounting of the substrate. Further, even while the suction head 1 is moving, it is necessary to correct the position of the suction head 1 as data. An image of the electronic component can be obtained accurately and reliably, and the position of the suction head 1 can be corrected before the suction head 1 moves to the predetermined component mounting position at the substrate mounting position 5, so that loss of time is eliminated and printing is performed. Electronic components can be mounted with high accuracy on a predetermined plate surface position of the substrate P.

[0026]

As described above, according to the electronic component mounting method according to the first aspect of the present invention, while the suction head moves from the component supply position to the substrate mounting position, the electronic component is moved by the suction head. The holding state is projected upward by a mirror arranged in the same direction as the moving direction below the moving path of the suction head,
By capturing the reflected light of the mirror as an image by an imaging camera provided integrally with the suction head, an image of the electronic component can be accurately and reliably obtained as data required for position correction of the suction head, and time is eliminated. In addition, it is possible to mount electronic components at a predetermined position on the circuit board with high accuracy.

According to the electronic component mounting apparatus of the second aspect of the present invention, the mirror for reflecting the suction state of the electronic component by the suction head with the reflecting surface facing upward is moved below the moving path of the suction head. In addition, the suction head is kept small and light by moving the suction head at a constant high speed by installing an imaging camera that captures the reflected light from the mirror as an image and integrally with the suction head. Even as a device that can accurately and reliably obtain an image of an electronic component as data required for position correction of the suction head, eliminates time loss, and can mount electronic components at a predetermined board surface position with high accuracy. Can be configured.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a main part of an electronic component mounting apparatus according to the present invention.

FIG. 2 is an explanatory diagram showing an overall arrangement of mechanical units and a moving path of a suction head in the electronic component mounting apparatus according to the present invention.

FIG. 3 is an explanatory view showing an electronic component mounting apparatus according to a conventional example.

FIG. 4 is an explanatory view showing an electronic component mounting apparatus according to another example of the related art.

FIG. 5 is an explanatory view showing an electronic component mounting apparatus according to still another conventional example.

FIG. 6 is an explanatory view showing an electronic component mounting apparatus according to still another conventional example.

FIG. 7 is an explanatory diagram showing an overall arrangement of mechanical units and a moving path of a suction head in the electronic component mounting apparatus of FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 suction head 2 imaging camera 3 mirror 30, 31 mirror reflecting surface 4 component supply position 5 substrate mounting position E electronic component P circuit board

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-78895 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] An electronic component is sucked by a nozzle tip of a suction head and taken out of a component supply position, a state in which the electronic component is sucked by the suction head is projected by a mirror, and light reflected by the mirror is imaged by an imaging camera. The position of the suction head in the X, Y and θ directions is corrected based on the data obtained by image processing from the image, and the electronic component is carried by the suction head to a board mounting position remote from the component supply position. In the method of mounting an electronic component to be mounted on a predetermined plate surface position of a substrate, while the suction head moves from the component supply position to the substrate mounting position, the suction state of the electronic component by the suction head is changed to a position below the moving path of the suction head. , The light is projected upward by a mirror arranged in the same direction as the moving direction, and the light reflected by this mirror is reflected by an imaging camera integrated with the suction head. An electronic component mounting method characterized by being captured as a video. 2. A suction head for holding an electronic component at a nozzle tip and taking it out of a component supply position, a mirror for displaying a suction state of the electronic component by the suction head, and an imaging camera for capturing light reflected by the mirror as an image. With
The position of the suction head in the X, Y or θ directions is corrected based on data obtained by image processing from the image of the imaging camera, and the electronic component is carried by the suction head to a board mounting position distant from the component supply position. In a mounting device for electronic components mounted on a predetermined plate surface position of a substrate, a mirror that reflects the suction state of the electronic components by the suction head with the reflection surface facing upward is moved in the same direction as the moving direction below the moving path of the suction head. An electronic component mounting device, comprising: an image pickup camera that is arranged and captures reflected light from the mirror as an image, and is integrated with a suction head.