JP3313232B2 - Grinding wheel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The invention according to claim 1 of the present application relates to a grinding wheel for grinding and polishing suitable for processing optical parts, machine parts, ceramics, metals and the like.

[0002]

2. Description of the Related Art Conventionally, as a prior art corresponding to the invention according to claim 1 of the present application, a grinding and polishing grindstone composed of a resin bond grindstone disclosed in Japanese Patent Application Laid-Open No. Sho 53-63692 is known. The above-mentioned conventional grinding and polishing whetstone is formed by containing particles (sodium chloride, potassium chloride, calcium chloride, sodium carbonate, sodium bromide, potassium bromide, etc.) soluble in the grinding and polishing liquid, A resin-bonded diamond grindstone or cubic boron nitride grindstone using a thermosetting resin in which the soluble particles have a particle size of 100 to 325 mesh and a thermosetting resin obtained by adding 10 to 30 vol% of the soluble particles as they are to the abrasive grain-containing portion as a binder. .

FIG. 5 is a block diagram showing a method of manufacturing the above-mentioned conventional grinding and polishing grindstone. In this production method, first, a required amount of soluble particles pulverized to a desired particle size is added to a thermosetting resin to form a binder. Next, abrasive grains are mixed with the binder so as to have a desired degree of concentration. Then, the mixed substance is fired under predetermined temperature and pressure conditions to produce a pellet-shaped grinding / polishing grindstone.

[0004]

The conventional grinding and polishing whetstone is manufactured by molding and firing a mixture of a thermosetting resin, abrasive grains and a soluble powder (particles).
The gap after forming each component remains even after firing, and a continuous air hole is generated in the grinding wheel structure due to its production. The continuous air holes function as chip pockets in terms of the performance of the grindstone and greatly contribute to preventing clogging. However, in the above-described conventional grindstone, if the grinding and polishing liquid penetrates into the continuous air holes when the grindstone is used, the grinding and polishing liquid contacts and dissolves the soluble particles disposed in the grindstone structure. This increases chip pockets in the grindstone structure. In addition, in the conventional grinding and polishing whetstone, since the soluble particles themselves are a part of the constituent elements responsible for the strength of the whetstone, the portion where the soluble particles eluted (space)
Causes the strength of the grindstone to decrease. Therefore, when a processing pressure is applied to the grindstone during the processing, the grindstone is easily deformed, and as a result, the processed shape of the workpiece is distorted. In addition, there is a problem in that the processing pressure must be reduced in order to prevent the occurrence of the distortion, and as a result, the processing time is increased.

[0005] The invention according to claim 1 of the present application has been made in view of the above-mentioned problems of the prior art, and a film material made of a polyimide resin contains particles that are soluble in a grinding and polishing solution inside a grinding and grinding wheel. It is an object of the present invention to provide a grinding wheel for grinding and polishing which is disposed in a microcapsule, prevents soluble particles from being eluted from the inside of the grinding wheel, and does not cause a change in the structure of the grinding wheel or a decrease in strength.

[0006]

Means for Solving the Problems In order to solve the above problems, the invention according to claim 1 of the present application is directed to a grinding wheel for grinding and polishing in which particles soluble in a grinding and polishing liquid are contained inside the grinding wheel for grinding and polishing. In the above method, abrasive grains and soluble particles encapsulated in microcapsules made of polyimide resin were dispersed in a synthetic resin binder and mixed.

[0007]

According to the first aspect of the present invention, since the soluble particles are completely sealed by the microcapsules whose film material is made of polyimide resin, the grinding and polishing liquid penetrates into the grindstone during the grinding and polishing process. However, it does not come into contact with the soluble particles and does not generate pores in the internal structure of the grinding wheel. Also, when the microcapsules come into contact with the workpiece on the surface of the grindstone, the film material of the microcapsules is removed or broken by friction, and the soluble particles in the microcapsules are dissolved by touching the grinding and polishing solution, so only the surface of the grindstone It becomes possible to arrange a chip pocket. Furthermore, since there is no step of generating friction between the solid matter and the microcapsules after the production of the microcapsules enclosing the soluble particles, it is possible to prevent the membrane material of the microcapsules from peeling from the soluble particles due to external force, The probability that the soluble particles come into contact with the grinding and polishing liquid in the grindstone can be reduced.

[0008]

Embodiment 1 An embodiment of the invention according to claim 1 of the present application will be described below. FIG. 1 is an explanatory view showing Example 1 of a manufacturing process in a method for manufacturing a grinding and grinding wheel of the present invention, and FIG. 2 is a cross-sectional view showing Example 1 of a grinding and grinding wheel manufactured by the above manufacturing method. In the present embodiment, a grinding wheel for grinding and polishing in which a substance soluble in a grinding and polishing solution is arranged in a grinding wheel in order to generate a chip pocket for the purpose of reducing grinding resistance and preventing clogging, and a method of manufacturing the grinding wheel will be described. .

First, a grinding wheel 10 for grinding and polishing according to this embodiment will be described with reference to FIG. The grinding wheel 10 for grinding and polishing includes sodium chloride particles (particle diameter: about 100 μm) 1 which is a substance soluble in a grinding fluid and synthetic diamond particles (particle diameter: about 5 μm) in a phenol resin 5 as a binder. 4) are dispersed and arranged, and the sodium chloride particles 1 are encapsulated in microcapsules 3 using a polyimide resin 2 as a film material.

Next, a method of manufacturing the grinding wheel 10 will be described with reference to FIGS. A phenolic resin powder serving as a binder of the grindstone 10 and methyl alcohol serving as a solvent thereof are weighed at a weight ratio of 1: 2, mixed and dissolved to obtain a resin solution. In addition, sodium chloride particles (particle diameter: about 100 μm) 1 selected as a soluble substance for forming a chip pocket are encapsulated in a microcapsule 3 made of a polyimide resin 2 as a film material. The microcapsules 3 are manufactured by a known method such as a Wurster method (air suspension coating method) and a spray drying method (spray drying method). Then, the synthetic diamond particles 4 (particle diameter: about 5 μm) serving as abrasive grains are weighed so that the concentration is 25, and the microcapsules 3 are weighed so that the concentration is 10 and are added to the resin solution. . Then, the synthetic diamond particles 4 and the microcapsules 3 are mixed so as to be uniformly dispersed in the resin solution. Next, the mixture is poured into a mold having a desired shape, and air bubbles in the mixture are removed by vacuum defoaming. Then, the mixture is dried in a drying oven at 50 ° C., and methyl alcohol as a solvent of the phenol resin 5 is removed. Is evaporated off. Then, the formed body obtained here is fired in a drying furnace at 180 ° C. for 12 hours to obtain a grinding wheel 10 for grinding and polishing.

Next, the operation of the grinding and polishing grindstone 10 of this embodiment and the method of manufacturing the same will be described with reference to FIG. In the grinding wheel 10 of this embodiment, the sodium chloride particles 1 eluted by themselves to form chip pockets are sealed in the microcapsules 3 made of polyimide resin 2 in the grinding wheel 10. Therefore, since the grinding fluid 6 penetrating into the grindstone 10 is not directly touched, the sodium chloride particles 1 do not dissolve in the grinding fluid 6 and the chip pocket 8 is not generated inside the grindstone 10. Thus, the strength of the grindstone 10 does not decrease even though the soluble particles, sodium chloride, are a part of the component that bears the strength of the grindstone 10. In addition, microcapsule 3
When appears on the surface of the grindstone 10 and comes into contact with the workpiece 7, the polyimide resin 2 as a film material is removed by friction with the workpiece 7, and the sodium chloride particles 1 appear on the surface. The sodium chloride particles 1 appearing on the surface come into contact with the grinding fluid 6 and dissolve in the grinding fluid 6. Traces of the sodium chloride particles 1 eluted are formed as chip pockets 8 on the surface of the grindstone 10 and serve as a relief for grinding chips generated by machining, thereby preventing clogging. Further, in the method of manufacturing the grinding and polishing whetstone 10 of the present embodiment, the sodium chloride particles 1 soluble in the grinding fluid 6 are coated with the polyimide resin 2 insoluble in the grinding fluid 6 and microencapsulated. Since the microcapsules 3 and the workpiece 7 are dispersed and arranged in the grindstone 10, chip pockets can be generated only on the surface of the grindstone 10 where the microcapsules 3 and the workpiece 7 are in contact with each other. By not forming the chip pockets 8 inside, it is possible to manufacture a grindstone with the strength of the grindstone maintained.

According to this embodiment, when manufacturing the grinding wheel 10 for grinding and polishing, the sodium chloride particles 1 which are soluble particles which form the chip pockets 8 by being eluted in advance by themselves are converted into the polyimide resin 2 which is insoluble in the grinding fluid 6. Since it is microencapsulated and sealed and placed in the grindstone 10, it is possible to prevent a decrease in the strength of the grindstone 10 due to elution of soluble particles in the grindstone 10. Thereby, not only clogging is prevented, but also a processed surface with higher surface accuracy can be obtained.

In this embodiment, the case where sodium chloride is used as a soluble substance is exemplified. However, a water-soluble neutral salt such as potassium chloride / calcium chloride / sodium carbonate, sodium bromide / potassium bromide can be used. Even in such a case, the same operation and effect as those of the above embodiment can be obtained.

[0014]

Embodiment 2 Another embodiment of the invention according to claim 1 of the present application will be described below. FIG. 4 is an explanatory view showing Example 2 of the manufacturing process in the method for manufacturing a grinding wheel for grinding and polishing according to the present invention.
In this embodiment, a grindstone for grinding and polishing in which a soluble substance for the purpose of improving the chemical grinding ability and generating chip pockets is arranged in a grindstone and a method of manufacturing the same will be described.

The grindstone of the present embodiment comprises cerium ammonium nitrate particles (particle size: about 50 μm), which are soluble in a polishing liquid, and cerium oxide powder (grain particles) in a phenol resin as a binder. A diameter of about 1 μm) is dispersed and formed, and the cerium ammonium nitrate particles are encapsulated in microcapsules using a polyimide resin as a film material.

Next, a method for manufacturing a grindstone will be described with reference to FIG. A resin solution is obtained by weighing and mixing and dissolving a phenolic resin powder as a binder of a grindstone and methyl alcohol as a solvent in a weight ratio of 1: 2. In addition, cerium ammonium nitrate particles (particle diameter: about 50 μm) selected as a soluble substance for improving the chemical grinding ability and for generating chip pockets are encapsulated in microcapsules made of polyimide resin as a film material. 45 vol of cerium oxide powder (particle size about 1 μm) to be abrasive grains
% Of the microcapsules and 35 v
ol% and added to the resin solution.
Then, the cerium oxide powder and the microcapsules are mixed so as to be uniformly dispersed in the resin solution. Next, the mixture is poured into a mold having a desired shape, and air bubbles in the mixture are removed by vacuum defoaming. Then, the mixture is dried in a drying oven at 50 ° C. to evaporate methyl alcohol which is a solvent of the phenol resin. Let it be removed. Then, the molded body obtained here is dried in a drying oven for 1 hour.
It is baked under the conditions of 80 ° C. for 12 hours to obtain a grinding wheel for grinding and polishing.

According to the grinding wheel for grinding and polishing of this embodiment and the method for manufacturing the same, the clogging of the grinding wheel surface is effectively prevented while preventing the reduction of the grinding wheel strength due to the elution of soluble particles inside the grinding wheel as in the first embodiment. In addition to the generation of chip pockets, the soluble substance of cerium ammonium nitrate, which gives an action of acid to the workpiece to improve the processing efficiency, is generated only at the interface between the grindstone and the glass material that is the workpiece. Since it is dissolved in the polishing liquid, a high-concentration soluble material solution acts on the workpiece, making it possible to make full use of the chemical action capability of the soluble material, and in particular, the processing efficiency of glass having low acid resistance. There is an advantage that can be improved.

In this embodiment, the case where cerium ammonium nitrate is used as the soluble substance is described. However, a water-soluble acid such as citric acid, phthalic acid, picolinic acid, EDTA and 2Na can be used. The same operation and effect as those of the second embodiment can be obtained.

[0019]

Embodiment 3 Another embodiment of the invention according to claim 1 of the present application will be described below. The grinding wheel for grinding and polishing of this embodiment and the method of manufacturing the same are the same as those of the above-mentioned embodiment 2 except that sodium hydroxide is used as a soluble substance.

The same effects as those of the first embodiment can be obtained. Of course, the soluble material of sodium hydroxide which improves the processing efficiency by giving an alkali action to the workpiece is a grindstone and the glass which is the workpiece. Since it is dissolved in the polishing liquid only at the interface with the polishing solution, a high-concentration soluble substance solution acts on the workpiece, and the chemical action ability of the soluble substance can be utilized, and particularly, the alkali resistance is low. There is an advantage that the processing efficiency of glass can be improved.

In this embodiment, the case where sodium hydroxide is used as the soluble substance has been described. However, a water-soluble alkali such as potassium hydroxide can be used. Functions and effects can be obtained.

In the above Examples 1, 2 and 3, synthetic diamond, cerium oxide and phenol resin were used for the abrasive grains. However, abrasive grains such as zirconium oxide, aluminum oxide, CBN, SiC, and bran, and epoxy A system or a synthetic resin such as a polyimide resin may be used. The abrasive, the binder, and the soluble substance can be in any combination. In addition, the method of microencapsulating the soluble particles is a method that can reliably separate and protect the soluble particles from the grinding and polishing solution by the physical properties of the soluble particles, the particle size, etc., such as an air suspension method, a spray drying method, a spray coagulation method, It can be selected from well-known means such as a submerged drying method.

[0023]

According to the present invention, the particles soluble in the grinding and polishing liquid are encapsulated in microcapsules made of a polyimide resin, and the soluble particles are arranged in the grinding wheel for grinding and polishing. In addition, the soluble particles do not dissolve in the grinding / polishing liquid inside the grinding wheel due to the grinding / polishing liquid that penetrates into the continuous ventilation holes generated at the time of firing in the step of producing the grinding / polishing whetstone. For this reason, even if soluble particles are arranged in the grindstone, the strength of the grindstone is maintained, and the surface accuracy of the workpiece is not reduced. Furthermore, the surface of the grinding wheel gradually wears and disappears during processing of the workpiece, and the film material is removed by contact with the workpiece only when the microcapsules inside the grinding wheel are exposed on the surface of the grinding wheel. Or at this point, the soluble particles in the microcapsules dissolve in the grinding and polishing solution and chip pockets are generated on the surface of the grinding wheel, preventing clogging of the grinding wheel surface and reducing grinding and polishing resistance Can be done.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a manufacturing process of an example of the present invention.

FIG. 2 is a sectional view showing a grinding wheel for grinding and polishing according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining the operation of the grinding wheel for grinding and polishing according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram illustrating a manufacturing process according to a second embodiment of the present invention.

FIG. 5 is an explanatory view showing a manufacturing process of a conventional grinding and polishing whetstone.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sodium chloride particle 2 Polyimide resin 3 Microcapsule 4 Synthetic diamond particle 5 Phenol resin 6 Grinding fluid 7 Workpiece 8 Chip pocket 10 Grinding wheel for grinding and polishing

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B24D 3/34 B24D 3/02 310 B24D 3/28

Claims (1)

(57) [Claims] 1. A grinding wheel for grinding and polishing in which particles soluble in a grinding and polishing liquid are contained in a grinding wheel for grinding and polishing, wherein abrasive grains and soluble particles encapsulated in microcapsules whose film material is made of a polyimide resin. A grinding wheel for grinding and polishing characterized by being dispersed in a synthetic resin binder.