JPH07227765A - Grinding/polishing wheel and its manufacture - Google Patents

Abstract

PURPOSE:To make soluble particles put in a grinding/polishing wheel dissolve a grinding/polishing fluid only on the surface (machining surface) of the grinding wheel. CONSTITUTION:Sodium chloride particles 1 soluble in a grinding/polishing fluid are sealed inside each microcapsule 3 which has a film of polyimide resin 2 insoluble in the grinding/polishing fluid. The microcapsules 3 and synthetic diamond grains 4 are dispersed in phenol resin 5. The microcapsules 3 are broken on contact with a workpiece and the sodium chloride particles 1 in each microcapsule 3 are dissolved into the grinding/polishing fluid. This leads to formation of chip pockets, which prevent the grinding wheel 10 from clogging up and reduce the resistance to grinding and polishing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The invention according to claims 1 to 6 of the present invention relates to a grinding and polishing grindstone suitable for processing optical parts, mechanical parts, ceramics, metals and the like, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Heretofore, as a conventional technique corresponding to the inventions according to claims 1 to 6 of the present application, a grindstone for grinding and polishing made of a resin bond grindstone disclosed in JP-A-53-63692 is known. There is. The conventional grindstone for grinding and polishing is formed by containing particles (sodium chloride, potassium chloride, calcium chloride, sodium carbonate, sodium bromide, potassium bromide, etc.) soluble in a grinding and polishing liquid inside. The soluble particles are made to have a particle size of 100 to 325 mesh, and the soluble particles are directly added to the abrasive grain containing portion in an amount of 10 to 30.
It is a resin-bonded diamond grindstone or cubic boron nitride grindstone using a thermosetting resin added by vol% as a binder.

FIG. 5 is a block diagram showing a method of manufacturing the conventional grinding and polishing grindstone. In this manufacturing method, first, soluble particles pulverized to a desired particle size are added to a thermosetting resin in a necessary amount to form a binder. Next, abrasive grains are mixed with the binder so as to have a desired concentration. Then, a pellet-shaped grindstone for grinding and polishing is manufactured by firing this mixed substance under a predetermined temperature and pressure condition.

[0004]

Since the conventional grindstone for grinding and polishing is produced by molding and firing a mixture of thermosetting resin, abrasive grains and soluble powder (particles),
The gaps after molding each component remain after firing, and in the production thereof, continuous air holes are formed in the grindstone structure. The continuous vent hole functions as a chip pocket in terms of the performance of the grindstone and greatly contributes to preventing clogging. However, in the above-mentioned conventional grindstone, when the grinding / polishing liquid permeates the continuous air holes when the grindstone is used, the grindstone contacts and dissolves the soluble particles arranged in the grindstone structure. This increases the chip pockets within the grindstone structure. Further, in the conventional grinding and polishing grindstone, the soluble particles themselves are a part of the constituent elements responsible for the strength of the grindstone.
As a result, the strength of the grindstone decreases. Therefore, if a processing pressure is applied to the grindstone during processing, the grindstone is likely to be deformed, and as a result, the processed shape of the workpiece is distorted. Further, there is a problem in that the processing pressure must be lowered in order to prevent this distortion, resulting in an increase in processing time.

The inventions according to claims 1, 5 and 6 of the present application have been made in view of the above problems of the prior art. Particles soluble in a grinding / polishing liquid are formed into microcapsules in a grindstone for grinding / polishing. An object of the present invention is to provide a grinding wheel for grinding and polishing and a method for manufacturing the grinding wheel, which is placed in a sealed state, prevents soluble particles from eluting from the inside of the wheel, and does not cause a change in the structure of the wheel or a decrease in strength. .

Further, in the invention according to claim 2, the particles soluble in the grinding and polishing liquid are enclosed in microcapsules inside the grindstone for grinding and polishing, and the microcapsules exposed on the surface of the grindstone during the grinding and polishing process. An object of the present invention is to provide a grinding / polishing grindstone capable of forming a chip pocket on the surface of the grindstone when soluble particles are eluted from the grind / polishing liquid to prevent clogging and reduce the grinding resistance.

The invention according to claim 3 arranges particles soluble in a grinding and polishing liquid in microcapsules inside a grindstone for grinding and polishing, and the microcapsules exposed on the surface of the grindstone during the grinding and polishing process. When soluble particles are dissolved in the grinding and polishing solution, chip pockets are created on the surface of the grindstone to prevent clogging and reduce grinding resistance, and to improve the processing speed of the workpiece that is easily attacked by acid. An object of the present invention is to provide a grinding and polishing whetstone that can be realized.

Further, in the invention according to claim 4, the particles which are soluble in the grinding and polishing liquid are enclosed in a microcapsule inside the grindstone for grinding and polishing, and the microcapsules exposed on the surface of the grindstone during the grinding and polishing process. When soluble particles are dissolved in the grinding / polishing liquid, they are generated in the chip pockets on the surface of the grindstone to prevent clogging and reduce grinding resistance, and to improve the processing speed of the workpiece that is easily attacked by alkali. An object of the present invention is to provide a grinding and polishing whetstone that can be realized.

[0009]

In order to solve the above-mentioned problems, the invention according to claim 1 of the present application is a grinding and grinding wheel in which particles soluble in a grinding and polishing liquid are contained in the grinding and grinding wheel. In the above, the abrasive grains and the soluble particles encapsulated in the synthetic resin microcapsules are dispersed and mixed in the binder of the synthetic resin. In the invention according to claim 2, the soluble particles encapsulated in the microcapsules are water-soluble neutral salts. In the invention according to claim 3, the soluble particles encapsulated in the microcapsules are water-soluble acids. In the invention according to claim 4, the soluble particles encapsulated in the microcapsules are water-soluble alkalis.

Further, the invention according to claim 5 is a method of manufacturing a grindstone for grinding and polishing in which particles soluble in a grinding and polishing liquid are contained in a grindstone for grinding and polishing, and a step of dissolving a synthetic resin in a solvent, , A step of encapsulating the soluble particles in microcapsules, a step of mixing the dissolved synthetic resin solution with abrasive grains and the microcapsules, and a step of drying and firing the mixture. Then, the step of encapsulating the soluble particles in the microcapsules was any one of the air suspension coating method, the spray drying coating method, the spray coagulation coating method, and the liquid dry coating method.

[0011]

In the inventions according to claims 1, 5 and 6, since the soluble particles are completely sealed by the microcapsules, even if the grinding / polishing liquid penetrates into the grindstone during the grinding / polishing process, it is soluble. It does not come into contact with particles and does not form pores in the internal structure of the grindstone. Also, when the microcapsules come into contact with the work piece on the surface of the grindstone, the film material of the microcapsules is removed or broken by friction, and the soluble particles in the microcapsules come into contact with the grinding / polishing liquid and dissolve, so only on the grindstone surface. It becomes possible to arrange the chip pocket. Furthermore, since there is no step for generating friction between the solid material and the microcapsules after the production of the microcapsules, it is possible to prevent the film material of the microcapsules from being separated from the soluble particles by an external force, and the soluble particles in the grindstone. It is possible to reduce the probability of contact with the grinding / polishing liquid.

Further, in the invention according to claim 2, since the microcapsules are removed or broken by contact with the workpiece as described above, the neutral salt in the microcapsules is ground and polished on the surface of the grindstone. Touch. As a result, the neutral salt soluble in the grinding / polishing liquid is dissolved, and chip pockets having the same particle size are formed only on the surface of the grindstone. And
In the invention according to claim 3, the water-soluble acid dissolved on the surface of the grindstone causes the liquid property of the grinding / polishing liquid to be in the acidic region.
At this time, the processing surface of the workpiece is in contact with the surface of the grindstone, and acid can be applied to the processing surface, which gives an erosion effect to the workpiece having low acid resistance. Further, in the invention according to claim 4, the water-soluble alkali dissolved on the surface of the grindstone causes the liquid property of the grinding / polishing liquid to be in the alkaline region. At this time, the processing surface of the workpiece is in contact with the surface of the grindstone, and alkali can act on the processing surface,
Gives an erosion effect to the work piece with low alkali resistance.

[0013]

Embodiment 1 An embodiment of the invention according to claims 1, 2, 5 and 6 of the present application will be described below. FIG. 1 is an explanatory view showing a first embodiment of a manufacturing process in a method for manufacturing a grinding and polishing grindstone of the present invention, and FIG. 2 is a sectional view showing a first embodiment of a grinding and polishing grindstone manufactured by the above manufacturing method. In this example, in order to generate chip pockets for the purpose of reducing grinding resistance and preventing clogging, a grinding and polishing grindstone in which a substance soluble in a grinding and polishing liquid is placed in the grindstone, and a manufacturing method thereof will be described. .

First, the grindstone 10 for grinding and polishing of this embodiment will be described with reference to FIG. The grindstone 10 for grinding and polishing has a sodium chloride particle (particle size of about 100 μm) 1 which is a substance soluble in a grinding fluid and a synthetic diamond particle (particle size of about 5 μm) which is a substance soluble in a grinding fluid, in a phenol resin 5 as a binder. 4) are dispersed and arranged, and the sodium chloride particles 1 are enclosed in microcapsules 3 in which the polyimide resin 2 is used as a film material.

Next, a method of manufacturing the grindstone 10 for grinding and polishing will be described with reference to FIGS. A powder of the phenolic resin 5 serving as a binder of the grindstone 10 and methyl alcohol serving as a solvent thereof are weighed in a weight ratio of 1: 2, mixed and dissolved to obtain a resin solution. Further, sodium chloride particles (particle size: about 100 μm) 1 selected as a soluble substance for generating a chip pocket are enclosed in a microcapsule 3 having a polyimide resin 2 as a film material. The microcapsules 3 are manufactured by a well-known method such as the Wurster method (air suspension coating method) and the spray drying method (spray drying method). Then, the synthetic diamond grains 4 (particle size: about 5 μm) as abrasive grains are weighed so that the concentration becomes 25, and the microcapsules 3 are weighed so that the concentration becomes 10, and added to the resin solution. . Then, the synthetic diamond particles 4 and the microcapsules 3 are mixed in the resin solution so as to be uniformly dispersed. Next, this mixture was poured into a molding die in a desired shape, the bubbles in the mixture were removed by vacuum defoaming, and the mixture was dried in a drying oven at 50 ° C. to obtain methyl alcohol which is a solvent for the phenol resin 5. Are removed by evaporation. Then, the molded body obtained here is fired in a drying furnace at 180 ° C. for 12 hours to obtain a grindstone 10 for grinding and polishing.

Next, the operation of the grinding / polishing grindstone 10 of this embodiment and its manufacturing method will be described with reference to FIG. In the grindstone 10 for grinding and polishing of the present embodiment, sodium chloride particles 1 which elute by themselves to generate chip pockets are sealed in the microcapsules 3 in which the polyimide resin 2 is a film material in the grindstone 10. Therefore, since the grinding fluid 6 penetrating into the grindstone 10 is not directly touched, the sodium chloride particles 1 are not dissolved in the grinding fluid 6 and the chip pocket 8 is not formed inside the grindstone 10. As a result, the strength of the grindstone 10 does not decrease even though sodium chloride, which is a soluble particle, is a part of the constituent elements that bear the strength of the grindstone 10. In addition, microcapsule 3
When appears on the surface of the grindstone 10 and comes into contact with the workpiece 7, the polyimide resin 2 as a film material is removed by friction with the workpiece 7, and sodium chloride particles 1 appear on the surface. The sodium chloride particles 1 appearing on the surface come into contact with the grinding fluid 6 and dissolve in the grinding fluid 6. The traces of the eluted sodium chloride particles 1 become chip pockets 8 and are formed on the surface of the grindstone 10, which serves as an escape area for grinding dust generated by processing and prevents clogging. Further, in the method for manufacturing the grinding and polishing whetstone 10 of the present embodiment, the sodium chloride particles 1 soluble in the grinding fluid 6 are coated with the polyimide resin 2 insoluble in the grinding fluid 6 and are microencapsulated. Since they are dispersed in the grindstone 10, chip pockets can be generated only on the surface of the grindstone 10 in which the microcapsules 3 and the workpiece 7 are in contact, and not only can the clogging be prevented, but also the grindstone 10 By not producing the chip pockets 8 inside, it is possible to manufacture a grindstone in which the strength of the grindstone is maintained.

According to the present embodiment, when the grindstone 10 for grinding and polishing is manufactured, the sodium chloride particles 1 which are soluble particles which generate the chip pockets 8 by being preliminarily dissolved by themselves are micro-ized by a resin insoluble in the grinding fluid 6. Since it is placed in the grindstone 10 after being encapsulated and sealed, it is possible to prevent the strength of the grindstone 10 from decreasing due to the elution of soluble particles in the grindstone 10. As a result, not only clogging is prevented, but also a machined surface with higher surface accuracy can be obtained.

In this embodiment, the case where sodium chloride is used as the soluble substance is exemplified, but a water-soluble neutral salt such as potassium chloride / calcium chloride / sodium carbonate or sodium bromide / potassium bromide can be used. Even in such a case, the same operation and effect as those of the above-described embodiment can be obtained.

[0019]

Embodiment 2 An embodiment of the invention according to claims 1, 3, 5 and 6 of the present application will be described below. FIG. 4 is an explanatory view showing a second embodiment of the manufacturing process in the method for manufacturing the grinding and polishing grindstone of the present invention. In this embodiment, a grindstone for grinding and polishing in which a soluble substance is placed in the grindstone for the purpose of improving the chemical grinding ability and forming chip pockets, and a method for manufacturing the grindstone.

In the grindstone of this embodiment, cerium ammonium nitrate particles (particle diameter of about 50 μm), which is a substance soluble in the polishing liquid, and cerium oxide powder (particles, which are abrasive particles) are contained in a phenol resin as a binder. The cerium nitrate ammonium particles are formed by arranging dispersed particles having a diameter of about 1 μm), and the cerium nitrate ammonium particles are enclosed in microcapsules using a polyimide resin as a film material.

Next, a method for manufacturing a grindstone will be described with reference to FIG. A powder of the phenolic resin 5 as a binder of the grindstone and methyl alcohol as a solvent thereof are weighed in a weight ratio of 1: 2, mixed and dissolved to obtain a resin solution.
Also, cerium ammonium nitrate particles (particle size of about 50 μm) selected as a soluble substance for improving chemical grinding ability and generation of chip pockets are encapsulated in microcapsules having a polyimide resin as a film material. 45 vo of cerium oxide powder (particle size about 1 μm) to be the abrasive grain of the molded product (grinding stone)
Weigh to 1% and add 35 microcapsules.
It is weighed so as to be vol% and added to the resin solvent solution. Then, the cerium oxide powder and the microcapsules are mixed in the resin solution so as to be uniformly dispersed. Then, the mixture is poured into a mold having a desired shape, and the bubbles in the mixture are removed by vacuum defoaming, followed by drying in a drying oven at 50 ° C. to evaporate methyl alcohol which is a solvent for the phenol resin. To remove. Then, the molded body obtained here is fired in a drying furnace at 180 ° C. for 12 hours to obtain a grindstone for grinding and polishing.

According to the grindstone for grinding and polishing of this embodiment and the method for manufacturing the same, the clogging of the surface of the grindstone is effectively prevented while the strength of the grindstone is prevented from being lowered due to the elution of soluble particles in the grindstone as in the case of the first embodiment. In addition to the ability to generate chip pockets, the soluble substance of cerium ammonium nitrate, which imparts the action of acid to the work piece to improve the working efficiency, is only at the interface between the grindstone and the glass material that is the work piece. Since it will dissolve in the polishing liquid, a high-concentration soluble substance solution will act on the work piece, making it possible to fully utilize the chemical action capacity of the soluble substance, and especially the processing efficiency of glass with low acid resistance. Can be improved.

In this embodiment, cerium ammonium nitrate was used as the soluble substance, but a water-soluble acid such as citric acid, phthalic acid, picolinic acid or EDTA2Na can be used, and even in such a case. The same action and effect as those of the above-described second embodiment can be obtained.

[0024]

[Embodiment 3] An embodiment of the invention according to claims 1, 4, 5 and 6 of the present application will be described below. The grindstone for grinding and polishing and the method for manufacturing the same in this example are the same as those in Example 2 except that sodium hydroxide was used as the soluble substance.

Not only the same effects as those of the first embodiment can be obtained, but also the soluble substance of sodium hydroxide which gives the action of the alkali to the workpiece to improve the processing efficiency is the grindstone and the glass to be processed. Since it will dissolve in the polishing liquid only at the interface with the, the high-concentration soluble substance solution will act on the work piece, and it will be possible to make use of the chemical action capacity of the soluble substance, and especially the low alkali resistance. There is an advantage that the processing efficiency of glass can be improved.

In this example, the case where sodium hydroxide was used as the soluble substance was described, but a water-soluble alkali such as potassium hydroxide can be used, and in such a case, the same as in Example 3 above. The action and effect can be obtained.

In the above-mentioned Examples 1, 2 and 3, synthetic diamond, cerium oxide was used for the abrasive grains and phenol resin was used for the binder. However, the abrasive grains such as zirconium oxide, aluminum oxide, CBN, SiC and red iron oxide and epoxy were used. A system, a synthetic resin such as a polyimide resin may be used. Further, the abrasive grains, the bonding material, and the soluble substance can take any combination. In addition, the method of microencapsulating the soluble particles, the physical properties of the soluble particles, the method of reliably separating and protecting the soluble particles from the grinding and polishing liquid depending on the particle size, etc., is an air suspension method, a spray drying method, a spray coagulation method, It can be selected from well-known means such as an in-liquid drying method.

[0028]

The invention according to each of the claims of the present application can exert the following effects. [Effects of Claims 1, 5, and 6] Since the soluble particles are placed in the grinding stone for grinding and polishing while the particles are soluble in the grinding and polishing liquid and are encapsulated in the synthetic resin microcapsules, the soluble particles are ground inside the grinding stone. Does not dissolve in polishing liquid. Therefore, even if the soluble particles are arranged in the grindstone, the strength of the grindstone is maintained and the surface accuracy of the workpiece is not deteriorated. Further, when the microcapsules are exposed or exposed to the surface of the grindstone, the microcapsules are removed or broken by contact with the workpiece, so that the soluble particles in the microcapsules are dissolved in the grinding / polishing liquid to generate chip pockets on the surface of the grindstone. Therefore, the surface of the grindstone can be prevented from being clogged, and the grinding and polishing resistance can be reduced. [Effect of Claim 2] It is possible to prevent clogging of the grindstone for grinding and polishing and realize reduction of grinding and polishing resistance. Further, it can be used regardless of the acid resistance and alkali resistance of the work piece without changing the properties of the grinding and polishing liquid. [Effect of claim 3] It is possible to prevent clogging of the grindstone for grinding and polishing and reduce the grinding and polishing resistance. Further, it is possible to improve the processing speed of a work piece having low acid resistance, for example, glass. [Effect of Claim 4] It is possible to prevent clogging of the grindstone for grinding and polishing and to reduce the grinding and polishing resistance. Further, it is possible to improve the processing speed of a workpiece having low alkali resistance, for example, glass.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a manufacturing process according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a grindstone for grinding and polishing according to a first embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining the action of the grindstone for grinding and polishing of Example 1 of the present invention.

FIG. 4 is an explanatory diagram showing a manufacturing process of a second embodiment of the present invention.

FIG. 5 is an explanatory view showing a manufacturing process of a conventional grinding and polishing whetstone.

[Explanation of symbols]

 1 Sodium Chloride Particles 2 Polyimide Resin 3 Micro Capsules 4 Synthetic Diamond Grains 5 Phenolic Resin 6 Grinding Fluid 7 Workpiece 8 Chip Pocket 10 Grinding / Grinding Stone

Claims (6)

[Claims] 1. A grinding / polishing grindstone in which particles that are soluble in a grinding / polishing liquid are contained in a grind / polishing grindstone, in which abrasive grains and soluble particles encapsulated in a synthetic resin microcapsule are bonded to a synthetic resin. A grindstone for grinding and polishing, characterized in that it is dispersed in the agent. 2. The grindstone for grinding and polishing according to claim 1, wherein the soluble particles are water-soluble neutral salts. 3. The grindstone for grinding and polishing according to claim 1, wherein the soluble particles are water-soluble acids. 4. The grindstone for grinding and polishing according to claim 1, wherein the soluble particles are water-soluble alkalis. 5. A method of manufacturing a grinding and polishing grindstone in which particles that are soluble in a grinding and polishing liquid are contained inside a grinding and grindstone, and a step of dissolving a synthetic resin in a solvent and encapsulating the soluble particles in microcapsules. And a step of mixing abrasive grains and the microcapsules in the dissolved synthetic resin solution, and a step of drying the mixture and then firing the mixture, a method for manufacturing a grindstone for grinding and polishing. . 6. The step of encapsulating the soluble particles in microcapsules is any one of an air suspension coating method, a spray drying coating method, a spray coagulation coating method, and a liquid dry coating method. 5. The method for producing a grindstone for grinding and polishing according to 5.