JP3306922B2 - X-ray exposure mask and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask for X-ray exposure (hereinafter referred to as "X-ray mask") and a method of manufacturing the same, and more particularly, to an X-ray mask having high planar accuracy and a method of manufacturing the same. It is.

[0002]

2. Description of the Related Art A typical method of manufacturing a conventional X-ray mask will be described with reference to FIGS.
As shown in FIG. 1, an X-ray transmission support film 2 and an X-ray absorber pattern 3 are formed on a silicon wafer substrate 1 and a back etching mask 4 is formed on the back surface of the silicon wafer substrate 1. The base material 1 is back-etched (FIG. 7), and finally the reinforcing frame 5 is bonded via the adhesive 11 (FIG. 8).

[0003] The X-ray mask is a reinforcing frame 5 shown in FIG.
Is used by attaching to the X-ray exposure apparatus, and the wafer to be transferred with the X-ray absorber pattern 3 is set close to several tens μm to several μm. Therefore, the surface of the reinforcing frame 5 and X
It is necessary for the transfer process to be parallel to the surface of the line transmitting support film 2. Therefore, the X-ray transmission support film 2 holding the X-ray absorber pattern 3 is required to have high flatness.

[0004] However, in the conventional X-ray mask shown in FIG. 8, the X-ray mask substrate is bonded to the reinforcing frame 5 via the adhesive 11, and the reinforcing frame due to the difference in the thickness of the adhesive. It was difficult to remove the deviation of the parallelism between the sample No. 5 and the X-ray mask substrate. In addition, since the silicon wafer substrate 1 is distorted due to the uneven thickness of the adhesive 11, the X-ray transmission support film 2 having the X-ray absorber pattern 3 is also distorted, and the flatness may be worse than before bonding.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned conventional problems, and has as its object to increase the degree of parallelism of an X-ray mask substrate with respect to a reinforcing frame and to prevent distortion due to adhesion. To provide a high-quality X-ray mask that suppresses the warpage caused by the X-ray and has a high flatness, and a method of manufacturing the same, so that the X-ray mask can exhibit good performance when it is actually used as a master for duplication. Is to do.

[0006]

The means provided by the present invention for solving the above-mentioned problems is that an X-ray exposure mask substrate and a reinforcing frame provided with a bonding concave portion are bonded to each other. in X-ray exposure mask, to the X-ray exposure mask substrate, with the adhesive injection holes, and the combined recesses and paste through hole are connected to each other by the adhesive surface, the adhesive through the through hole An X-ray exposure mask characterized by being implanted.

[0007]

[0008] More preferably, the X-ray mask is characterized in that the cross-sectional area of the through-hole is wider at the bonding surface.

Alternatively, a mask substrate for X-ray exposure is bonded
The method of manufacturing a X-ray exposure mask comprising laminated reinforcing frame provided with recesses so, the pre-adhesive injection holes to the X-ray exposure mask substrate provided, the reinforcing frame and the X-ray exposure mask After contacting the substrate, from the through hole,
Inject adhesive and connect the through holes to each other at the adhesive surface
A method of manufacturing a mask for X-ray exposure, comprising bonding a mask substrate for X-ray exposure and a reinforcing frame as described above.

FIGS. 1 to 5 are explanatory diagrams relating to an X-ray mask. In the manufacture of the X-ray mask shown in FIG. 1, first, the X-ray absorber substrate 3 is formed and the back-etched X-ray mask substrate is brought into contact with the reinforcing frame 5. The X-ray mask substrate bonding position 8 is the portion shown in the plan view of FIG. An adhesive injection hole 6 and a bonding recess 7 are formed in the reinforcing frame in advance. Subsequently, an adhesive is injected into the bonding concave portion 7 through the adhesive injection hole 6 to be solidified. Since the auxiliary frame 5 and the X-ray mask substrate are in contact with each other at the portion of the mask 4 for back etching, as long as the flatness of both is high, the substrate is tilted or distorted due to the thickness of the adhesive, resulting in poor flatness. It does not become.

Although the adhesive injection hole 6 and the bonding concave portion 7 are shown at four positions in FIG. 2 (FIG. 2), the number of bonding portions is not particularly limited. If there are two or more bonded portions, the X-ray mask substrate and the reinforcing frame 5 can be held. Further, it is desirable that the bonding recess 7 has a larger opening than the adhesive injection hole 6 so that the contact area of the adhesive becomes large. Further, the bonding concave portions 7 may have a structure in which the bonding surfaces are connected to each other by grooves.

[0012] The shape of the reinforcing frame 5 is square, it may be any such circle, permissible without not particularly limited as long short accommodate X-ray exposure apparatus. As for the material, any of quartz, glass such as Pyrex, metal plate, ceramics and the like may be used. The point is that there is no problem as long as a dimensional shape to be used by mounting it on an X-ray exposure apparatus can be obtained and it is also possible to bond the substrate to an X-ray mask substrate. still,
Preferably, the material has a thermal expansion coefficient close to that of the X-ray mask substrate.

FIG . 3 shows another X-ray mask. The present invention
The contact between the X-ray mask substrate and the reinforcing frame 5 is performed in the same manner as in FIG. 1 (FIG. 1), but as shown in the plan view of the reinforcing frame 5 in FIG. Form a groove on the bonding surface of 5 from the lateral direction of the X-ray mask substrate
After contacting the X-ray mask substrate and the reinforcing frame,
An adhesive can be injected from the adhesive injection groove 9 . This
At this time, the X-ray mask bonding position 8 is as shown in FIG. After the injection, the adhesive is solidified to complete the bonding completely. The shape of the groove for injecting the adhesive may be various, such as circular, oval, rectangular, etc., but is not particularly limited.
Alternatively, the adhesive injection grooves 9 may have a shape connected to each other on the adhesive surface.

FIG. 5 shows an X-ray mask of the present invention. The adhesive is injected into the bonding recess 7 through an adhesive injection through hole 10 for the substrate, which is provided in advance through the silicon wafer substrate 1, the permeable film 2, and the mask 4 for back etching. (Fig. 5)
Also in (FIG. 1) and (FIG. 2), it is desirable that the opening of the bonding concave portion 7 is larger than the adhesive injection through hole 10 for the substrate to increase the bonding area.

In FIG . 1 to FIG. 5, the X-ray mask substrate has a shape in which the back etching mask 4 is left on the back surface, but the back etching mask 4 is not particularly required for bonding. Absent.

[0016]

According to the present invention, the X-ray mask substrate and the reinforcing frame are brought into contact with each other in a plane beforehand, and the adhesive is injected and bonded in that state. There is no need to worry about thickness. Also, it is possible to avoid uneven application of the adhesive, and if the flatness and the parallelism of the front and back of the X-ray mask substrate and the reinforcing frame are maintained, the adhesion does not cause distortion and warpage. No more worries.

[0017]

EXAMPLES Reference Example 1 Hereinafter, the present invention will be described more specifically with reference to examples. X on a 3 inch diameter 1 mm thick silicon wafer substrate
A 2 .mu.m thick SiNx film is formed by a low pressure CVD method as a radiation transmitting support film, and a 0.7 .mu.m
An X-ray absorber pattern is formed according to the steps shown in FIGS. 6 and 7 from a blank substrate on which a thick tantalum (Ta) is formed by a sputtering method. Finally, wet etching using a hot alkaline solution is performed. Back etching of the silicon wafer substrate from the back side.

The X-ray mask substrate thus produced was brought into contact with a 5-inch square, 5 mm thick reinforcing frame made of Pyrex according to the method of the present invention. The reinforcing frame is provided with through holes for injecting an adhesive in advance (FIG. 1) and (FIG. 2).
It was set up like this. Subsequently, an epoxy-based adhesive was injected from the injection port, and 2k was placed between the X-ray mask substrate and the reinforcing frame.
The weight was fixed by applying a g weight. After the solidification of the adhesive, the warpage of the X-ray mask substrate was measured.

Reference Example 2 An X-ray mask substrate was manufactured by the same steps as in Reference Example 1. The grooves shown in FIGS. 3 and 4 were previously formed in the reinforcing frame. The adhesive was injected from the side of the groove and solidified. After the solidification of the adhesive, the warpage of the X-ray mask substrate was measured.

[0020]

As described above in detail, according to the X-ray mask and the method for manufacturing the same according to the present invention, the parallelism of the X-ray mask substrate with respect to the reinforcing frame can be increased, and the warpage caused by the distortion caused by the bonding can be prevented. Suppression and flatness were improved, and a high-quality X-ray mask and a manufacturing method thereof could be provided.
Thus, when the X-ray mask is actually used as a duplication master, good performance can be exhibited.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a reference example of an X-ray mask according to the present invention using a cross-sectional view.

FIG. 2 is an explanatory view showing a reinforcing frame of the X-ray mask of FIG. 1 in a plan view.

FIG. 3 shows an embodiment of an X-ray mask not related to the present invention.
It is explanatory drawing shown using a sectional view.

FIG. 4 is an explanatory view showing a reinforcing frame of the X-ray mask of FIG. 3 in a plan view.

FIG. 5 shows another embodiment of the X-ray mask according to the present invention.
It is explanatory drawing shown using a sectional view.

FIG. 6 is an explanatory view showing an example of a conventional method of manufacturing an X-ray mask in the order of steps using cross-sectional views.

FIG. 7 is an explanatory view showing an example of a conventional method for manufacturing an X-ray mask in the order of steps using cross-sectional views.

FIG. 8 is an explanatory diagram showing an example of a conventional method for manufacturing an X-ray mask in the order of steps using cross-sectional views.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-290918 (JP, A) JP-A-63-236322 (JP, A) JP-A-2-94427 (JP, A) JP-A-1- 152625 (JP, A) JP-A-5-291123 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 G03F 1/16

Claims (3)

(57) [Claims] An X-ray exposure mask substrate and a bonding recess are provided.
In the vignetting reinforcing frame pasted is X-ray exposure mask comprising, on at least the X-ray exposure mask substrate,
An X-ray exposure mask, comprising a through hole for injecting an adhesive , wherein the through hole and the bonding concave portion are connected to each other at an adhesive surface, and the adhesive is injected through the through hole. Wherein said X-ray exposure mask according to claim 1, wherein the cross-sectional area of the through hole is characterized in that it is wider at the adhesive surface. 3. An X-ray exposure mask substrate is bonded to form a concave portion.
The method of manufacturing a X-ray exposure mask comprising laminated reinforcing frame kicked, advance against the said X-ray exposure mask substrate
After a through hole for injecting an adhesive is provided, and the reinforcing frame is brought into contact with the mask substrate for X-ray exposure, an adhesive is injected from the through hole, and X is applied so that the through holes are connected to each other at the bonding surface. A method of manufacturing a mask for X-ray exposure, comprising bonding a mask substrate for X-ray exposure to a reinforcing frame.