JPH06120124A - Mask for x-ray exposure and its manufacture - Google Patents

Abstract

PURPOSE:To obtain a high quality X-ray mask and its manufacture wherein the parallelism of an X-ray mask with a reinforcing frame is high, the warp due to the strain caused by bonding is restrained, and flatness is high, and to make it possible for the X-ray mask to exhibit excellent performance when it is practically used as an original sheet for replication. CONSTITUTION:Penetrating holes 10 are formed in a reinforcing frame 5 or a mask substrate 1 for X-ray exposure. The frame 5 and the mask substrate 1 are mutually linked on a bonding surface, and the sectional area is wide on the bonding surface. In other case, a trench 9 having a part protruding outside from the region where the mask substrate 1 is arranged is formed in the sticking surface of the reinforcing frame 5, and the frame 5 and the mask substrate 1 are mutually linked on the bonding surface. At the time of bonding, adhesive agent is injected from the penetrating holes 10 or the trench 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray exposure mask (hereinafter referred to as "X-ray mask") and a method for manufacturing the same, and more particularly to an X-ray mask having high plane accuracy and a method for manufacturing the same. Is.

[0002]

2. Description of the Related Art A typical method for manufacturing a conventional X-ray mask will be described below with reference to FIGS. 6 to 8 (FIG. 6).
As shown in FIG. 1, after the X-ray transparent support film 2 and the X-ray absorber pattern 3 are formed on the silicon wafer base material 1, and the back etching mask 4 is formed on the back surface of the silicon wafer base material 1, Back etching of the base material 1 is performed (FIG. 7), and finally, the reinforcing frame 5 is bonded via the adhesive 11 (FIG. 8).

The X-ray mask has a reinforcing frame 5 (FIG. 8).
Is used by being attached to an X-ray exposure apparatus, and the wafer to be transferred with the X-ray absorber pattern 3 is installed close to several tens μm to several μm. Therefore, the surface of the reinforcing frame 5 and the X
It is necessary to be parallel to the surface of the line-transparent support film 2 from the viewpoint of the transfer process. Therefore, the X-ray transparent support film 2 holding the X-ray absorber pattern 3 is required to have high flatness.

However, in the conventional X-ray mask shown in FIG. 8, the X-ray mask substrate is bonded to the reinforcing frame 5 via the adhesive 11, and the reinforcing frame is caused by the difference in the thickness of the adhesive. It was difficult to remove the deviation in parallelism between No. 5 and the X-ray mask substrate. In addition, the silicon wafer base material 1 is also distorted due to the uneven thickness of the adhesive 11, so that the X-ray transmission support film 2 having the X-ray absorber pattern 3 is also distorted and the flatness may be worse than that before the bonding.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to have a high parallelism of the X-ray mask substrate with respect to the reinforcing frame and to prevent distortion caused by bonding. We provide a good quality X-ray mask that suppresses warpage and high flatness and its manufacturing method so that it can exhibit good performance when the X-ray mask is actually used as a master for duplication. To do.

[0006]

[Means for Solving the Problems] Means provided by the present invention in order to solve the above-mentioned problems, namely, in an X-ray mask in which an X-ray mask substrate and a reinforcing frame are bonded together, at least the reinforcing frame Alternatively, the X-ray mask is characterized in that the X-ray mask substrate has a through hole.

Preferably, the X-ray mask is characterized in that the through holes are connected to each other by an adhesive surface.

More preferably, the X-ray mask is characterized in that a cross-sectional area of the through hole is widened on an adhesive surface.

Alternatively, in an X-ray mask in which an X-ray mask substrate and a reinforcing frame are bonded together, a groove having a portion protruding outside the region where the X-ray mask substrate is provided on the bonding surface of the reinforcing frame. It is an X-ray mask characterized by having.

Preferably, the X-ray mask is characterized in that the grooves are connected to each other by an adhesive surface.

Alternatively, in an X-ray mask manufacturing method in which an X-ray mask substrate is attached to a reinforcing frame, an adhesive is injected from at least the reinforcing frame or a through hole in the X-ray mask substrate. Characteristic X
It is a manufacturing method of a line mask.

[0012] Preferably, in the method of manufacturing the X-ray mask, the adhesive is injected from a groove having a portion on the reinforcing frame surface which is outside the region where the X-ray mask substrate is provided. The X-ray mask manufacturing method described above.

(FIG. 1) to (FIG. 5) are explanatory views relating to the X-ray mask of the present invention. In the manufacture of the X-ray mask (FIG. 1), first, the X-ray absorber pattern 3 is formed and the back-etched X-ray mask substrate is brought into contact with the reinforcing frame 5. The X-ray mask substrate bonding position 8 is the portion shown in the plan view of FIG. An adhesive injection hole 6 is previously provided in the reinforcing frame.
And the bonding recess 7 is formed. Then, the adhesive is injected into the bonding concave portion 7 through the adhesive injection hole 6 and solidified. Since the auxiliary frame 5 and the X-ray mask substrate are in contact with each other at the back etching mask 4, the substrate is inclined due to the thickness of the adhesive as long as the flatness of both is high,
The flatness does not deteriorate due to distortion.

Although the adhesive injection hole 6 and the bonding concave portion 7 are shown at four places in FIG. 2, the number of adhesive portions is not particularly limited, but considering the balance of forces, If there are two or more bonded portions, the X-ray mask substrate and the reinforcing frame 5 can be held. Further, it is desirable that the bonding recess 7 has a larger opening than the adhesive injection hole 6 so that the contact area of the adhesive becomes large. Furthermore, the bonding recesses 7 may have a structure in which they are connected to each other by grooves on the adhesive surface.

The shape of the reinforcing frame 5 may be any of corners, circles, etc. The point is that there is no problem as long as it can be applied to the X-ray exposure apparatus, and there is no particular limitation. As for the material, any of quartz, glass such as Pyrex, metal plate, ceramics and the like may be used. In short, it does not matter as long as the dimensions and shape for loading and using in the X-ray exposure apparatus can be obtained and the bonding with the X-ray mask substrate is possible. still,
Preferably, the material has a thermal expansion coefficient close to that of the X-ray mask substrate.

FIG. 3 shows another X-ray mask of the present invention. The contact between the X-ray mask substrate and the reinforcing frame 5 (Fig. 1)
As shown in the plan view of the reinforcing frame 5 (FIG. 4), the adhesive injection groove 9 is formed in a groove shape from the lateral direction of the X-ray mask substrate on the bonding surface of the reinforcing frame 5. After bringing the X-ray mask substrate and the reinforcing frame into contact with each other, the adhesive is injected from the adhesive injection groove 9. The X-ray mask bonding position 8 is as shown in (FIG. 4). After the injection, the adhesive is solidified to complete the adhesion. The shape of the groove for injecting the adhesive may be circular, oval, rectangular, or the like, but is not particularly limited. Further, the adhesive injection groove 9 may have a shape in which they are connected to each other on the adhesive surface.

FIG. 5 shows another X-ray mask of the present invention. The adhesive is injected into the bonding recess 7 through the substrate adhesive injection through hole 10 which is provided through the silicon wafer substrate 1, the permeable film 2 and the back etching mask 4 in advance.
In (FIG. 5) as well (FIG. 1) and (FIG. 2), it is desirable that the opening of the bonding recess 7 be larger than the adhesive injection through hole 10 for a substrate to increase the adhesion area.

In the (FIG. 1) to (FIG. 5) of the present invention, the X-ray mask substrate has a shape in which the back etching mask 4 is left on the back surface, but the back etching mask 4 is particularly necessary for bonding. It's not something.

[0019]

According to the present invention, since the X-ray mask substrate and the reinforcing frame are brought into contact with each other in the planes in advance and the adhesive is injected and bonded in that state, it is unnecessary to swell the adhesive. There is no need to worry about thickness. Further, it is possible to avoid uneven application of the adhesive, and if the flatness and the parallelism of the front and back sides of the X-ray mask substrate and the reinforcing frame are maintained, there will be no distortion due to their adhesion and there will be no warpage. No worries.

[0020]

EXAMPLES Example 1 The present invention will be described in more detail below with reference to examples. On a silicon wafer substrate with a diameter of 3 mm and a thickness of 1 mm, an S-layer having a thickness of 2 μm as an X-ray transmission supporting film
Steps shown in (FIG. 6) and (FIG. 7) from a blank substrate on which iN _x is formed by a low pressure CVD method and 0.7 μm-thick tantalum (Ta) as an X-ray absorber thin film is formed thereon by a sputtering method. The X-ray absorber pattern was formed according to the above, and finally, the silicon wafer substrate was back-etched from the back surface side by wet etching using a hot alkaline solution.

The X-ray mask substrate thus prepared was brought into contact with the 5 inch square 5 mm thick Pyrex reinforcing frame according to the method of the present invention. Through holes for injecting adhesive are previously formed in the reinforcing frame (Fig. 1) and (Fig. 2).
It was set up like. Then put an epoxy adhesive through the injection port and put 2k between the X-ray mask substrate and the reinforcing frame.
It was fixed by applying g-weight. The warpage of the X-ray mask substrate was measured after the adhesive was solidified, but there was no change from that before the bonding.

<Example 2> An X-ray mask substrate was manufactured by the same steps as in Example 1. Grooves shown in (FIG. 3) and (FIG. 4) were previously formed in the reinforcing frame. The adhesive was injected from the lateral direction of the groove and solidified. The warpage of the X-ray mask substrate was measured after the adhesive was solidified, but there was no change from that before the bonding.

[0023]

As described above in detail, according to the X-ray mask and the method for manufacturing the same according to the present invention, the parallelism of the X-ray mask substrate with respect to the reinforcing frame can be increased, and the warp caused by the distortion due to the adhesion can be prevented. As a result, the flatness was suppressed and the flatness was increased, and a good quality X-ray mask and its manufacturing method could be provided.
From this fact, it has become possible to exhibit excellent performance when the X-ray mask is actually used as a master for duplication.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment of an X-ray mask according to the present invention by using a sectional view.

FIG. 2 is an explanatory view showing a reinforcing frame of the X-ray mask of FIG. 1 in a plan view.

FIG. 3 shows another embodiment of the X-ray mask according to the present invention,
It is explanatory drawing shown using a cross-sectional view.

FIG. 4 is an explanatory view showing a reinforcing frame of the X-ray mask of FIG. 3 in a plan view.

FIG. 5 shows another embodiment of the X-ray mask according to the present invention,
It is explanatory drawing shown using a cross-sectional view.

6A to 6C are explanatory views showing an example of a conventional method for manufacturing an X-ray mask, in the order of steps using sectional views.

FIG. 7 is an explanatory diagram showing an example of a conventional method for manufacturing an X-ray mask in the order of steps using sectional views.

FIG. 8 is an explanatory diagram showing an example of a conventional method for manufacturing an X-ray mask in the order of steps using sectional views.

[Explanation of Codes] 1 ... Silicon wafer base material 2 ... X-ray transparent support film 3 ... X-ray absorber pattern 4 ... Back etching mask 5 ... Reinforcement frame 6 ... Adhesion Agent injection hole 7 ... Bonding recess 8 ... X-ray mask substrate bonding position 9 ... Adhesive injection groove 10 ... Substrate adhesive injection through hole 11 ... Adhesive

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Nobuhiko Fukuhara 1-5-1 Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.

Claims (7)

[Claims] 1. An X-ray exposure mask comprising an X-ray exposure mask substrate and a reinforcing frame bonded together, wherein at least the reinforcing frame or the X-ray exposure mask substrate has a through hole. X-ray exposure mask. 2. The X-ray exposure mask according to claim 1, wherein the through holes are connected to each other by an adhesive surface. 3. The X-ray exposure mask according to claim 1, wherein the cross-sectional area of the through hole is wide on the adhesive surface. 4. An X-ray exposure mask comprising an X-ray exposure mask substrate and a reinforcing frame bonded together, wherein the bonding surface of the reinforcing frame is located outside a region where the X-ray exposure mask substrate is provided. An X-ray exposure mask having a groove having a protruding portion. 5. The X-ray exposure mask according to claim 4, wherein the grooves are connected to each other by an adhesive surface. 6. A method for manufacturing an X-ray exposure mask, which comprises bonding an X-ray exposure mask substrate to a reinforcing frame, wherein at least the reinforcing frame or a through hole in the X-ray exposure mask substrate is used for bonding. A method for manufacturing an X-ray mask, which comprises injecting an agent. 7. A method for manufacturing an X-ray exposure mask, comprising: a groove having a portion on the reinforcing frame surface, the portion protruding outside from a region where the X-ray exposure mask substrate is provided;
An X-ray exposure mask manufacturing method according to claim 6, wherein an adhesive is injected.