JP3289400B2 - LED module - Google Patents

LED module

Info

Publication number
JP3289400B2
JP3289400B2 JP12503093A JP12503093A JP3289400B2 JP 3289400 B2 JP3289400 B2 JP 3289400B2 JP 12503093 A JP12503093 A JP 12503093A JP 12503093 A JP12503093 A JP 12503093A JP 3289400 B2 JP3289400 B2 JP 3289400B2
Authority
JP
Japan
Prior art keywords
led
board
control circuit
circuit board
display surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12503093A
Other languages
Japanese (ja)
Other versions
JPH06314067A (en
Inventor
淳一 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP12503093A priority Critical patent/JP3289400B2/en
Publication of JPH06314067A publication Critical patent/JPH06314067A/en
Application granted granted Critical
Publication of JP3289400B2 publication Critical patent/JP3289400B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、複数のLED(発光ダ
イオード)がマトリックス状に実装されたLEDモジュ
ールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED module in which a plurality of LEDs (light emitting diodes) are mounted in a matrix.

【0002】[0002]

【従来技術】従来、図3(a),(b) に正面図、側面図を示
したように、複数のLEDが所定のピッチにてマトリッ
クス状に実装され、文字や図形等を表示するLEDモジ
ュール(基本単位構成から成るLED表示素子)が知ら
れている。
2. Description of the Related Art Conventionally, as shown in front and side views in FIGS. 3A and 3B, a plurality of LEDs are mounted in a matrix at a predetermined pitch to display characters, figures, and the like. Modules (LED display elements having a basic unit configuration) are known.

【0003】[0003]

【発明が解決しようとする課題】上述のLEDモジュー
ルを多数並べて使用する際、見栄えを良くするためには
LEDが高密度実装されたピッチを変更することなくL
ED表示面を隣接させる必要からLED基板の外形寸法
はLED表示面より大きくすることはできない。又、L
EDモジュールの各LEDには所定の電流を流す必要か
ら微細な回路パターンを用いることはできない。このよ
うな理由により、LEDモジュールでは各LEDが実装
されたLED基板と各LEDを駆動するための制御回路
基板との電気的な接続は、LEDの端子をそのまま用い
て達成していた。従って、LEDの実装組み付けはコス
ト高となり自動化が困難であった。又、LED基板と制
御回路基板との電気的な接続はLEDの端子のはんだ付
けであるためアッセンブリ後に不良が発生するとLED
基板又は制御回路基板単位の交換は不可能であった。
When a large number of the above-mentioned LED modules are used side by side, in order to improve the appearance, the LED is mounted without changing the pitch at which the LEDs are densely mounted.
The outer dimensions of the LED substrate cannot be made larger than the LED display surface because the ED display surface needs to be adjacent. Also, L
A fine circuit pattern cannot be used for each LED of the ED module because a predetermined current needs to flow. For this reason, in the LED module, the electrical connection between the LED board on which each LED is mounted and the control circuit board for driving each LED has been achieved by using the LED terminals as they are. Therefore, the mounting and mounting of the LED is expensive and automation is difficult. Also, since the electrical connection between the LED board and the control circuit board is by soldering the LED terminals, if a failure occurs after assembly, the LED
It was not possible to replace the board or control circuit board unit.

【0004】本発明は、上記の課題を解決するために成
されたものであり、その目的とするところは、LEDモ
ジュールにおけるLEDの実装の自動化によるコスト低
減及び基板単位の交換を容易にすることである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to reduce costs by automating the mounting of LEDs in an LED module and to facilitate replacement of a board unit. It is.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の発明の構成は、複数のLEDが所定のピッチにてマト
リックス状に配列されたLED表示面により文字や図形
等を表示するLEDモジュールにおいて、前記LEDが
実装され、前記LED表示面の外形寸法より少なくとも
一辺方向に大きくしてコネクティングスペースを設けた
LED基板と、該LED基板に対応して前記LEDを駆
動するための制御回路基板と、前記LED基板の前記コ
ネクティングスペースを利用し、該LED基板と前記制
御回路基板とを電気的に接続するコネクタとを有し、前
記LED表示面を隣接させて配設するとき、前記LED
基板は前記コネクティングスペースを設けた方向で隣合
ったもの同士の高さ位置が互いに異なるように前記LE
D実装の高さを変えることを特徴とする。
According to an embodiment of the present invention, there is provided an LED module for displaying characters, figures, and the like on an LED display surface on which a plurality of LEDs are arranged in a matrix at a predetermined pitch. An LED board on which the LED is mounted and provided with a connecting space that is larger than the outer dimensions of the LED display surface in at least one side direction, and a control circuit board for driving the LED corresponding to the LED board; A connector for electrically connecting the LED board and the control circuit board by utilizing the connecting space of the LED board, wherein when the LED display surface is arranged adjacent to the LED,
The LEs are so arranged that the heights of the substrates adjacent to each other in the direction in which the connecting space is provided are different from each other.
D The height of the mounting is changed.

【0006】[0006]

【作用】上記の手段によれば、LED基板は制御回路基
板とコネクタを介して電気的に接続されるため、LED
の実装はLED基板単体に対してのみとなり自動化が容
易となる。コネクティングスペースを設けた方向で隣接
したLED基板同士では、LED実装の高さが異なるた
め互いに邪魔になることはなく、見栄えの良い大きなL
ED表示面を得ることができる。
According to the above means, the LED board is electrically connected to the control circuit board via the connector.
Mounting is performed only on the LED substrate alone, which facilitates automation. LED boards adjacent to each other in the direction in which the connecting space is provided do not hinder each other because the LED mounting heights are different, and a large L with good appearance is provided.
An ED display surface can be obtained.

【0007】[0007]

【実施例】以下、本発明を具体的な実施例に基づいて説
明する。図1は本発明に係るLEDモジュールを3個隣
接させ組み合わせた状態を示した側面図である。又、図
2は図1の組合せのLEDモジュールを10列(3×10
個)隣接させ組み合わせたLED表示面の配列状態を示
した説明図である。LEDモジュール10Aは、主とし
て、 256(=16×16)個のLED11Aがマトリックス
状に実装されたLED基板13Aと制御回路基板16A
とから成る。上記LED11Aは仕切板12Aにより等
間隔保持され、外観見栄え良く配列されている。上記L
ED基板13Aは一辺方向に大きくしたコネクティング
スペース131Aを有している。又、上記LED基板1
3Aには、樹脂製から成るスペーサ15Aを介して制御
回路基板16Aが一体的に配設されている。この制御回
路基板16AにはLED11Aを駆動するための各種回
路部品17Aが搭載されている。上記LED基板13A
のコネクティングスペース131Aと対応する制御回路
基板16Aとがコネクタ14Aを介して電気的に接続さ
れている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to specific embodiments. FIG. 1 is a side view showing a state in which three LED modules according to the present invention are adjacently combined. FIG. 2 shows the LED module of the combination of FIG. 1 in 10 rows (3 × 10
FIG. 5 is an explanatory diagram showing an arrangement state of LED display surfaces that are adjacently combined. The LED module 10A mainly includes an LED board 13A on which 256 (= 16 × 16) LEDs 11A are mounted in a matrix and a control circuit board 16A.
Consisting of The LEDs 11A are held at equal intervals by a partition plate 12A, and are arranged with a good appearance. L above
The ED substrate 13A has a connecting space 131A enlarged in one side direction. Also, the LED board 1
A control circuit board 16A is integrally provided on 3A via a spacer 15A made of resin. Various circuit components 17A for driving the LED 11A are mounted on the control circuit board 16A. LED board 13A
The connecting space 131A and the corresponding control circuit board 16A are electrically connected via the connector 14A.

【0008】LEDモジュール10Bは、LEDモジュ
ール10Aと基本的構成は同様であり対応する構成要素
における符号のうちAをBに置き換えた符号を用いてお
りその説明を省略する。ここで、LEDモジュール10
Bは、そのLED11BのLED基板13Bに対する実
装高さがLEDモジュール10AにおけるLED11A
のLED基板13Aに対する実装高さと異なっている。
The LED module 10B has the same basic configuration as the LED module 10A, and uses the same reference numerals as those of the corresponding components except that A is replaced with B, and a description thereof will be omitted. Here, the LED module 10
B indicates that the mounting height of the LED 11B with respect to the LED board 13B is the LED 11A of the LED module 10A.
Is different from the mounting height of the LED board 13A.

【0009】LED11A,11BのLED基板13
A,13Bに対する実装高さを変えたため、LEDモジ
ュール10AとLEDモジュール10Bとを組み合わせ
ても、LED基板13Bにおけるコネクティングスペー
ス131Bが隣接したLED基板13Aに当接すること
がなくなる。LED基板13A,13Bは、コネクティ
ングスペース131A,131Bを利用して制御回路基
板16A,16Bと電気的に接続されている。このた
め、本発明のLEDモジュールは、LEDをLED基板
のみに実装するだけで良いため自動化が容易であり、L
ED基板及び制御回路基板の固定が堅牢となり電気的信
頼性が向上する。又、LED基板と制御回路基板とはコ
ネクタによる接続のため着脱可能であり基板交換などメ
ンテナンスが極めて容易となる。
The LED substrate 13 of the LEDs 11A and 11B
Since the mounting height with respect to A and 13B is changed, even when the LED module 10A and the LED module 10B are combined, the connecting space 131B of the LED board 13B does not contact the adjacent LED board 13A. The LED boards 13A and 13B are electrically connected to the control circuit boards 16A and 16B using the connecting spaces 131A and 131B. For this reason, the LED module of the present invention can be easily automated because it is only necessary to mount the LED on the LED substrate only,
The ED board and the control circuit board are firmly fixed, and the electrical reliability is improved. In addition, the LED board and the control circuit board are detachable because they are connected by a connector, and maintenance such as board replacement becomes extremely easy.

【0010】[0010]

【発明の効果】以上説明したように、LEDのLED基
板に対する実装高さを変えることによりLED表示面の
外にコネクティングスペースを設けても隣合ったLED
基板同士の当接がなくLEDモジュールを多数個並べて
見栄えの良い大きなLED表示面を形成することができ
る。このとき、LEDはLED基板のみに実装するだけ
で良いため自動化によるコスト低減が可能である。更
に、LED基板と制御回路基板との電気的な接続はコネ
クタによるため基板同士の着脱・交換が容易である。
As described above, even if a connecting space is provided outside the LED display surface by changing the mounting height of the LED with respect to the LED substrate, the adjacent LEDs can be provided.
Since there is no contact between the substrates, a large number of LED modules can be arranged to form a large-sized large-sized LED display surface. At this time, since the LED need only be mounted on the LED substrate only, the cost can be reduced by automation. Further, since the electrical connection between the LED board and the control circuit board is made by a connector, it is easy to attach / detach / exchange the boards.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の具体的な一実施例に係るLEDモジュ
ールを3個隣接させ組み合わせた状態を示した側面図で
ある。
FIG. 1 is a side view showing a state in which three LED modules according to a specific embodiment of the present invention are adjacently combined.

【図2】同実施例に係るLEDモジュールを3×10個隣
接させ組み合わせたLED表示面の配列状態を示した説
明図である。
FIG. 2 is an explanatory diagram showing an arrangement state of LED display surfaces in which 3 × 10 LED modules according to the embodiment are adjacently combined.

【図3】従来のLEDモジュールを示した外観図であ
る。
FIG. 3 is an external view showing a conventional LED module.

【符号の説明】[Explanation of symbols]

10A,10B…LEDモジュール 11A,11B…LED 13A,13B…LED基板 131A,131B…コネクティングスペース 14A,14B…コネクタ 16A,16B…制御回路基板 10A, 10B: LED module 11A, 11B: LED 13A, 13B: LED board 131A, 131B: Connecting space 14A, 14B: Connector 16A, 16B: Control circuit board

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI H05K 1/18 H05K 1/18 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI H05K 1/18 H05K 1/18

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 複数のLEDが所定のピッチにてマトリ
ックス状に配列されたLED表示面により文字や図形等
を表示するLEDモジュールにおいて、 前記LEDが実装され、前記LED表示面の外形寸法よ
り少なくとも一辺方向に大きくしてコネクティングスペ
ースを設けたLED基板と、 前記LED基板に対応して前記LEDを駆動するための
制御回路基板と、 前記LED基板の前記コネクティングスペースを利用
し、該LED基板と前記制御回路基板とを電気的に接続
するコネクタとを有し、 前記LED表示面を隣接させて配設するとき、前記LE
D基板は前記コネクティングスペースを設けた方向で隣
合ったもの同士の高さ位置が互いに異なるように前記L
ED実装の高さを変えることを特徴とするLEDモジュ
ール。
1. An LED module for displaying characters, figures, and the like on an LED display surface in which a plurality of LEDs are arranged in a matrix at a predetermined pitch, wherein the LED is mounted and at least larger than the outer dimensions of the LED display surface. An LED board provided with a connecting space by enlarging in one side direction, a control circuit board for driving the LED corresponding to the LED board, and using the connecting space of the LED board, the LED board and the A connector for electrically connecting the LED display surface to the control circuit board;
The D substrate is so formed that the heights of adjacent ones in the direction in which the connecting space is provided are different from each other.
LED module characterized by changing the height of ED mounting.
JP12503093A 1993-04-28 1993-04-28 LED module Expired - Fee Related JP3289400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12503093A JP3289400B2 (en) 1993-04-28 1993-04-28 LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12503093A JP3289400B2 (en) 1993-04-28 1993-04-28 LED module

Publications (2)

Publication Number Publication Date
JPH06314067A JPH06314067A (en) 1994-11-08
JP3289400B2 true JP3289400B2 (en) 2002-06-04

Family

ID=14900115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12503093A Expired - Fee Related JP3289400B2 (en) 1993-04-28 1993-04-28 LED module

Country Status (1)

Country Link
JP (1) JP3289400B2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10006092A1 (en) * 2000-02-11 2001-08-16 Gerhard Abler Luminaire for advertising, display etc. includes intermediate base made of weather resistant material, for mounting of circuit boards with LEDs
FR2807874A1 (en) * 2000-04-13 2001-10-19 Elkrief Simon Video screen image formation mechanism having support with electro luminescent diodes and control mechanism fixed face placed with diodes superimposed above.
FR2819616A1 (en) * 2000-12-26 2002-07-19 Simon Elkrief Display module having electroluminescent screen with electrically isolated/thermally conducting sheet between support card internal face and chassis reception face.
JP2005091824A (en) * 2003-09-18 2005-04-07 Sanyo Electric Co Ltd Display device
US20080012790A1 (en) * 2004-01-15 2008-01-17 Keisuke Matsuyama Rear Projection-Type Multi-Picture Display Device and Collective Screen, Optical Fiber for Collective Screen, and Flat Optical Fiber That are Used for the Display Device
JP5203874B2 (en) * 2008-09-29 2013-06-05 株式会社今仙電機製作所 Lighting device and vehicle
CN102149250B (en) * 2011-01-10 2016-04-27 深圳市中庆微科技开发有限公司 A kind of pcb board of contact pin type welding and LED display
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display
CN105679195B (en) * 2016-04-06 2018-07-31 深圳市创显光电有限公司 The LED display of LED display unit and its composition
GB2589215B (en) * 2018-05-04 2023-01-11 Ledman Optoelectronic Co Ltd Display module, display screen and display system

Also Published As

Publication number Publication date
JPH06314067A (en) 1994-11-08

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