JP5203874B2 - Lighting device and vehicle - Google Patents

Lighting device and vehicle Download PDF

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JP5203874B2
JP5203874B2 JP2008250633A JP2008250633A JP5203874B2 JP 5203874 B2 JP5203874 B2 JP 5203874B2 JP 2008250633 A JP2008250633 A JP 2008250633A JP 2008250633 A JP2008250633 A JP 2008250633A JP 5203874 B2 JP5203874 B2 JP 5203874B2
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substrate
control circuit
lamp
heat
light source
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JP2010080410A (en
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良雄 大島
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Imasen Electric Industrial Co Ltd
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Imasen Electric Industrial Co Ltd
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本発明は、照明装置及び車両に関する。   The present invention relates to a lighting device and a vehicle.

従来より、自動車室内用の照明装置が知られている。例えば、特許文献１には、制御回路と光源とを有する基板と、遮蔽状態と透過状態とを切り替え可能な遮蔽カバーと、を備えた照明装置が記載されている。この照明装置では、遮蔽カバーの透過部を選択することで、単一の光源で複数の場所を照射することができる。
特開２００７−１５３０１５ 2. Description of the Related Art Conventionally, lighting devices for automobile interiors are known. For example, Patent Literature 1 describes an illumination device including a substrate having a control circuit and a light source, and a shielding cover that can be switched between a shielding state and a transmission state. In this illuminating device, a plurality of places can be irradiated with a single light source by selecting the transmission part of the shielding cover.
JP2007-153015

しかしながら、この照明装置では、同一の基板に制御回路と光源とが備えられているため、光源で発生した熱が基板を介して制御回路に伝導するという問題点がある。例えば、制御回路が熱によって寿命の影響を受ける部品を含んでいる場合には、光源で発生した熱が基板を介して制御回路に伝導し、部品の寿命に影響することになる。   However, in this lighting device, since the control circuit and the light source are provided on the same substrate, there is a problem that heat generated by the light source is conducted to the control circuit through the substrate. For example, when the control circuit includes a component that is affected by the life due to heat, the heat generated by the light source is conducted to the control circuit via the substrate, which affects the life of the component.

本発明は、このような課題に鑑みなされたものであり、光源の熱が基板を介して制御回路へ伝導することを低減させる照明装置を提供することを主目的とする。   This invention is made | formed in view of such a subject, and it aims at providing the illuminating device which reduces that the heat | fever of a light source conducts to a control circuit through a board | substrate.

本発明は、上述の目的を達成するために以下の手段を採った。   The present invention adopts the following means in order to achieve the above-mentioned object.

本発明は、光源を有する第１基板(20)と、電子部品を含む制御回路を有する第２基板(30)と、前記第１基板と前記第２基板とを電気的に接続する接続部としてのコネクターケーブル(28)と、前記光源と前記制御回路とを熱的に遮断するための遮熱部材(40)とを備え、
前記第１基板及び第２基板は垂直配置がずれていると共に水平方向においても配置がずれており、その結果、第１基板及び第２基板は階段状に配置されており、
前記遮熱部材は第１基板と第２基板との段差境界位置に配置されて、該遮熱部材の少なくとも一部が前記第１基板の光源と前記第２基板の制御回路との間に位置している、
ことを特徴とする照明装置である。 The present invention provides a first substrate (20) having a light source, a second substrate (30) having a control circuit including an electronic component, and a connection portion for electrically connecting the first substrate and the second substrate. A connector cable (28), and a heat shield (40) for thermally blocking the light source and the control circuit,
The first substrate and the second substrate are displaced in the vertical direction and also in the horizontal direction. As a result, the first substrate and the second substrate are disposed in a step shape,
The heat shield member is disposed at a step boundary position between the first substrate and the second substrate, and at least a part of the heat shield member is located between the light source of the first substrate and the control circuit of the second substrate. doing,
This is a lighting device.

この照明装置では、光源を有する基板と、電子部品を含む制御回路を有する基板とを分離することで、光源が発熱する場合であっても、基板を介して制御回路へ伝導することを防止することができる。 In this lighting device, by separating the substrate having the light source and the substrate having the control circuit including the electronic components, even if the light source generates heat, conduction to the control circuit through the substrate is prevented. be able to.

本発明の照明装置において、前記制御回路は、電子部品を含んでいる。制御回路が熱に弱い電子部品を含んでいる場合には、同一基板上に光源と制御回路とを設置すると熱に弱い電子部品の寿命に影響を与える可能性が高いため、本発明を適用する効果が大きい。 In the illumination device of the present invention, the control circuit includes an electronic component . If the control circuit includes electronic components that are vulnerable to heat, installing the light source and the control circuit on the same substrate is likely to affect the life of the electronic components that are vulnerable to heat, so the present invention is applied. Great effect.

本発明の照明装置は、前記光源と前記第２基板とを熱的に遮断する遮熱部材を備え、前記遮熱部材は、該遮熱部材の少なくとも一部が前記第１基板の光源と前記第２基板の制御回路との間に位置している。このため、光源により発生した光及び熱（特に、赤外線等）が第２基板に到達する熱量を軽減又は遮断することができる。 The illumination device of the present invention includes a heat shield member that thermally shields the light source and the second substrate, and the heat shield member includes at least a part of the heat shield member and the light source of the first substrate. It is located between the control circuit of the second substrate . For this reason, the amount of heat that the light and heat (especially infrared rays) generated by the light source reaches the second substrate can be reduced or blocked.

本発明の車両は、上述した照明装置を備えたものである。本発明の照明装置を搭載した車両は、本発明の照明装置を搭載しているため、光源により発生した熱のうち、基板を介して制御回路に伝導する熱量を低減又は遮断することができるものであるから、これを搭載した車両も同様の効果が得られる。 Vehicle of the present invention has an illumination device as described above. Since the vehicle equipped with the illumination device of the present invention is equipped with the illumination device of the present invention, among the heat generated by the light source, the amount of heat conducted to the control circuit via the substrate can be reduced or blocked. Therefore, the same effect can be obtained for a vehicle equipped with this.

次に、本発明の実施の形態を図面に基づいて説明する。図１は、本発明の照明装置１０の内部状態を示す斜視図であり、図２は、第１基板２０及び第２基板３０を同一平面上に展開したときの展開図である。図２には、第１基板２０の下面及び第２基板３０の上面がそれぞれ紙面に示されている。なお、第２基板３０は、図１及び図２において同じ面（以下、第２基板３０の上面という）を示している。   Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an internal state of the lighting device 10 of the present invention, and FIG. 2 is a development view when the first substrate 20 and the second substrate 30 are developed on the same plane. In FIG. 2, the lower surface of the first substrate 20 and the upper surface of the second substrate 30 are shown on paper. The second substrate 30 shows the same surface (hereinafter referred to as the upper surface of the second substrate 30) in FIGS.

本発明の照明装置１０では、図１に示すように、ケース１２に第１基板２０及び第２基板３０が配設されている。このとき、第１基板２０が相対的高位置に、第２基板３０が相対的低１に配置されており、第１基板２０及び第２基板３０は垂直配置がずれていると共に、水平方向においても配置がずれている。この結果、第１基板２０及び第２基板３０は階段状に配置され、上方から見ると、第１基板２０と第２基板３０の一部が互いに重なりあって見える。また、第１基板２０と第２基板３０とはコネクタケーブル２８（本発明の接続部に相当）で電気的に接続されており、図示しない電源供給ユニットより第１基板２０及び第２基板３０に電気が供給される。   In the lighting device 10 of the present invention, as shown in FIG. 1, a first substrate 20 and a second substrate 30 are disposed in a case 12. At this time, the first substrate 20 is disposed at a relatively high position and the second substrate 30 is disposed at a relatively low position 1, and the first substrate 20 and the second substrate 30 are displaced in the vertical direction and in the horizontal direction. Is also misaligned. As a result, the first substrate 20 and the second substrate 30 are arranged stepwise, and when viewed from above, a part of the first substrate 20 and the second substrate 30 appear to overlap each other. The first board 20 and the second board 30 are electrically connected by a connector cable 28 (corresponding to the connecting portion of the present invention), and are connected to the first board 20 and the second board 30 from a power supply unit (not shown). Electricity is supplied.

遮熱部材４０は、図１に示すように、ケース１２に配設され、第１基板２０と第２基板３０との段差境界位置に位置する。第１基板２０の下面には第１ランプ２２，第２ランプ２４，第３ランプ２６（図２参照，本発明の光源に相当，以下ランプ群とも言う。）が備えられており、この位置はランプ群の周囲の位置に相当する。このため、ランプ群の光が第２基板を直射することを妨げている。なお、この遮熱部材４０は、ポリエチレンテレフタラート（ＰＥＴ）製である。   As shown in FIG. 1, the heat shield member 40 is disposed in the case 12 and is located at a step boundary position between the first substrate 20 and the second substrate 30. A first lamp 22, a second lamp 24, and a third lamp 26 (see FIG. 2, corresponding to the light source of the present invention, hereinafter also referred to as a lamp group) are provided on the lower surface of the first substrate 20, and this position is This corresponds to the position around the lamp group. For this reason, the light of the lamp group is prevented from directly shining on the second substrate. The heat shield member 40 is made of polyethylene terephthalate (PET).

第１基板２０には、図２に示すように、第１ランプ２２、第２ランプ２４及び第３ランプ２６が備えられており、図示しない配線により、ランプ群とコネクタケーブル２８とがそれぞれ電気的に接続されている。なお、ここでそれぞれのランプは、公知のバルブである。   As shown in FIG. 2, the first substrate 20 is provided with a first lamp 22, a second lamp 24, and a third lamp 26. The lamp group and the connector cable 28 are electrically connected to each other by wiring not shown. It is connected to the. Here, each lamp is a known bulb.

第２基板３０には、図２に示すように、制御回路３２が備えられており、図示しない配線により制御回路３２及びコネクタケーブル２８が電気的に接続されている。なお、第１基板２０及び第２基板３０の材質は、特に限定されるものではなく、樹脂製であっても良いし、セラミック製であっても良い。第１基板２０及び第２基板３０が熱伝導性の高い材質であればあるほど、第１基板２０と第２基板３０とを分割することによる効果が大きい。ここで、制御回路３２には、例えば、電解コンデンサやＬＥＤ等の熱に弱い部品が含まれている。   As shown in FIG. 2, the second substrate 30 is provided with a control circuit 32, and the control circuit 32 and the connector cable 28 are electrically connected by wiring (not shown). The materials of the first substrate 20 and the second substrate 30 are not particularly limited, and may be made of resin or ceramic. The higher the thermal conductivity of the first substrate 20 and the second substrate 30, the greater the effect of dividing the first substrate 20 and the second substrate 30. Here, the control circuit 32 includes heat-sensitive components such as electrolytic capacitors and LEDs.

コネクタケーブル２８は、金属線をビニル樹脂で被覆したものの束であり、柔軟性を有している。このため、コネクタケーブル２８の両端部の位置は、コネクタケーブル２８の長さの範囲内であれば、自由に位置決めすることができる。すなわち、第１基板２０及び第２基板３０の配置位置の自由度が上がる。   The connector cable 28 is a bundle of metal wires coated with a vinyl resin and has flexibility. For this reason, if the position of the both ends of the connector cable 28 is in the range of the length of the connector cable 28, it can position freely. That is, the degree of freedom of the arrangement position of the first substrate 20 and the second substrate 30 is increased.

以上詳述した本実施の形態の照明装置１０によれば、第１ランプ２２を有する第１基板２０と、制御回路３２を有する第２基板３０と、第１基板２０と第２基板３０とを電気的に接続するコネクタケーブル２８とを備えている。こうすることにより、高温状態になることが好ましくない制御回路３２を有する第２基板３０にランプ群から発生した熱が基板を介して伝導されることを防止することができる。したがって、耐熱タイプの部品ではなく、通常タイプの部品を用いて制御回路３２を構成することができる。   According to the lighting device 10 of the present embodiment described in detail above, the first substrate 20 having the first lamp 22, the second substrate 30 having the control circuit 32, the first substrate 20 and the second substrate 30 are provided. And a connector cable 28 for electrical connection. By doing so, it is possible to prevent the heat generated from the lamp group from being conducted through the substrate to the second substrate 30 having the control circuit 32 that is not preferably in a high temperature state. Therefore, the control circuit 32 can be configured using not a heat resistant type part but a normal type part.

また、第１基板２０と第２基板３０とを同一の基板で設計した場合には、制御回路３２に第１ランプ２２で発生した熱が基板を伝導する可能性がある。そして、この熱が基板によって伝導されることを防止するためには、ある程度大きな基板を用いてランプ群と制御回路３２とを離して配置する必要がある。しかしながら、本実施の形態の照明装置１０によれば、ランプ２２と制御回路３２との間に空間を設ける必要がないため、第１基板２０及び第２基板３０の合計の面積を小さくすることができる。このため、狭い領域であっても照明装置１０を設置することができる。   Further, when the first substrate 20 and the second substrate 30 are designed as the same substrate, heat generated by the first lamp 22 in the control circuit 32 may be conducted through the substrate. In order to prevent this heat from being conducted by the substrate, it is necessary to arrange the lamp group and the control circuit 32 apart from each other by using a somewhat large substrate. However, according to the illumination device 10 of the present embodiment, it is not necessary to provide a space between the lamp 22 and the control circuit 32, so that the total area of the first substrate 20 and the second substrate 30 can be reduced. it can. For this reason, the illumination device 10 can be installed even in a narrow area.

更に、第１基板２０と第２基板３０とをコネクタケーブル２８で電気的に接続しており、第１基板２０と第２基板３０との位置関係に自由度を持たせることができる。つまり、所定の形状に固定されている基板と異なり、コネクタケーブル３２は柔軟性を有しているため、コネクタケーブル２８で接続する範囲であれば、自由な位置に第１基板２０及び第２基板３０を配置することができる。このため、照明装置１０の取り付け位置に汎用性が高まる。   Furthermore, the first substrate 20 and the second substrate 30 are electrically connected by the connector cable 28, and the positional relationship between the first substrate 20 and the second substrate 30 can be given freedom. That is, unlike the board fixed to a predetermined shape, the connector cable 32 has flexibility, so that the first board 20 and the second board can be freely positioned as long as the connector cable 28 is connected. 30 can be arranged. For this reason, versatility increases at the mounting position of the illumination device 10.

更にまた、本実施の形態の照明装置１０は、制御回路３２に熱に弱い電子部品を含んでいるため、第１ランプ２２によって発生した熱が基板を介して制御回路３２に伝導すると電子部品が損傷する可能性がある。しかし、本発明の照明装置１０では、第１基板２０と第２基板３０とが物理的に分離しているため、基板を介して第１ランプ２２の熱が制御回路３２に伝導することはない。   Furthermore, since the lighting device 10 of the present embodiment includes electronic components that are vulnerable to heat in the control circuit 32, the electronic components are generated when the heat generated by the first lamp 22 is conducted to the control circuit 32 through the substrate. Possible damage. However, in the lighting device 10 of the present invention, the first substrate 20 and the second substrate 30 are physically separated, so that the heat of the first lamp 22 is not conducted to the control circuit 32 through the substrate. .

そして、本実施の形態の照明装置１０は、第１ランプ２２と第２基板３０とを熱的に遮断する遮熱部材４０とを備え、この遮熱部材４０は、遮熱部材４０の少なくとも一部が第１ランプ２２と制御回路３２との間に位置するため、第１ランプ２２で発生した光及び熱（特に、赤外線等）のうち、第２基板３０に達する熱量を低減又は遮断することができる。   The lighting device 10 according to the present embodiment includes a heat shield member 40 that thermally blocks the first lamp 22 and the second substrate 30, and the heat shield member 40 is at least one of the heat shield members 40. Since the unit is located between the first lamp 22 and the control circuit 32, the amount of heat reaching the second substrate 30 among light and heat (especially infrared rays) generated by the first lamp 22 is reduced or blocked. Can do.

そして更に、本実施の形態の照明装置１０は、第１基板２０と第２基板３０との少なくとも一部が重なっているため、第１基板２０と第２基板３０とを並列に配置する場合に比べて、狭い領域であっても第１基板２０及び第２基板３０を配置することができる。このとき、遮熱部材４０は第１基板２０と第２基板３０との間に配置されているため、第１ランプ２２から発生した光及び熱（特に、赤外線等）のうち、第２基板３０に達する熱量を低減又は遮断することができる。   Further, in the lighting device 10 of the present embodiment, since at least a part of the first substrate 20 and the second substrate 30 overlap, the first substrate 20 and the second substrate 30 are arranged in parallel. In comparison, the first substrate 20 and the second substrate 30 can be arranged even in a narrow region. At this time, since the heat shield member 40 is disposed between the first substrate 20 and the second substrate 30, the second substrate 30 out of light and heat (particularly, infrared rays) generated from the first lamp 22. The amount of heat reaching can be reduced or cut off.

なお、本発明は上述した実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の態様で実施し得ることはいうまでもない。   It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

例えば、上述した実施の形態では、第１基板２０に第１ランプ２２，第２ランプ２４，第３ランプ２６を備えることとしたが、第１基板２０に備えられるランプの個数は３つに限定されるものではなく、１又は２以上のいずれの個数であっても良い。このとき、ランプの個数が増加すれば、ランプから発生する熱量が増加するため、本発明を適用する効果が大きい。   For example, in the above-described embodiment, the first substrate 20 is provided with the first lamp 22, the second lamp 24, and the third lamp 26. However, the number of lamps provided on the first substrate 20 is limited to three. It may be any number of 1 or 2 or more. At this time, if the number of lamps increases, the amount of heat generated from the lamps increases, so the effect of applying the present invention is great.

上述した実施の形態では、ランプ２２はバルブであるものとしたが、バルブに限定されるものではなく、例えば、白熱灯や電球、ハロゲンランプなど発光に伴って熱を発生するものであればよい。このとき、ハロゲンランプ等はバルブよりも高温になるため、より本発明を適用する効果が大きい。   In the above-described embodiment, the lamp 22 is a bulb. However, the lamp 22 is not limited to a bulb, and any lamp that generates heat with light emission such as an incandescent lamp, a light bulb, or a halogen lamp may be used. . At this time, since the halogen lamp or the like has a higher temperature than the bulb, the effect of applying the present invention is greater.

上述した実施の形態では、遮熱部材４０を第１ランプ２２の周囲に備えられているものとしたが、遮熱部材４０を配置しなくても良いし、第１基板２０と第２基板３０との間に配置しても良いし、制御回路３２を覆うように配置しても良い。また、遮熱部材４０の代わりに、難熱伝導性の素材を配置しても良いし、断熱材等の板を配置しても良い。これらの場合であっても、上述した実施の形態と同様の効果が得られる。   In the embodiment described above, the heat shield member 40 is provided around the first lamp 22, but the heat shield member 40 may not be disposed, and the first substrate 20 and the second substrate 30 are not provided. It may be arranged between the control circuit 32 and the control circuit 32. Further, instead of the heat shield member 40, a material having poor heat conductivity may be disposed, or a plate such as a heat insulating material may be disposed. Even in these cases, the same effects as those of the above-described embodiment can be obtained.

上述した実施の形態では、第２基板３０の上面斜め上方に第１基板２０が階段状に配置することとしたが、第２基板３０が第１基板２０の上方にあっても良い。第１基板２０と第２基板３０との位置関係はこれらに限定されるものではなく、例えば、略平行に配置しても、略垂直に配置しても、ねじれの関係である位置に配置しても、第１基板２０と第２基板３０とが当接しない状態であればどのような位置関係で配置しても良い。この場合であっても、上述した実施の形態と同様の効果が得られる。   In the embodiment described above, the first substrate 20 is arranged stepwise above the upper surface of the second substrate 30, but the second substrate 30 may be above the first substrate 20. The positional relationship between the first substrate 20 and the second substrate 30 is not limited to these. For example, the first substrate 20 and the second substrate 30 may be disposed in a position that is in a twisted relationship regardless of whether they are disposed substantially in parallel or substantially vertically. However, as long as the first substrate 20 and the second substrate 30 are not in contact with each other, they may be arranged in any positional relationship. Even in this case, the same effect as the above-described embodiment can be obtained.

図１は、照明装置１０の内部状態を示す斜視図である。FIG. 1 is a perspective view showing an internal state of the lighting device 10. 図２は、第１基板２０及び第２基板３０を同一平面上に展開したときの展開図である。FIG. 2 is a development view when the first substrate 20 and the second substrate 30 are developed on the same plane.

符号の説明Explanation of symbols

１０ 照明装置、１２ ケース、２０ 第１基板、２２ 第１ランプ、２４ 第２ランプ、２６ 第３ランプ、２８ コネクタケーブル、３０ 第２基板、３２ 制御回路、４０ 遮熱部材。   DESCRIPTION OF SYMBOLS 10 Illuminating device, 12 case, 20 1st board | substrate, 22 1st lamp | ramp, 24 2nd lamp | ramp, 26 3rd lamp | ramp, 28 connector cable, 30 2nd board | substrate, 32 control circuit, 40 thermal insulation member.

Claims (2)

光源を有する第１基板(20)と、
電子部品を含む制御回路を有する第２基板(30)と、
前記第１基板と前記第２基板とを電気的に接続する接続部としてのコネクターケーブル(28)と、
前記光源と前記制御回路とを熱的に遮断するための遮熱部材(40)とを備え、
前記第１基板及び第２基板は垂直配置がずれていると共に水平方向においても配置がずれており、その結果、第１基板及び第２基板は階段状に配置されており、
前記遮熱部材は第１基板と第２基板との段差境界位置に配置されて、該遮熱部材の少なくとも一部が前記第１基板の光源と前記第２基板の制御回路との間に位置している、
ことを特徴とする照明装置。 A first substrate (20) having a light source;
A second substrate (30) having a control circuit including electronic components ;
A connector cable (28) as a connecting portion for electrically connecting the first board and the second board;
A heat shield (40) for thermally shutting off the light source and the control circuit,
The first substrate and the second substrate are displaced in the vertical direction and also in the horizontal direction. As a result, the first substrate and the second substrate are disposed in a step shape,
The heat shield member is disposed at a step boundary position between the first substrate and the second substrate, and at least a part of the heat shield member is located between the light source of the first substrate and the control circuit of the second substrate. doing,
A lighting device characterized by that . 請求項１に記載の照明装置を備えた車両。 A vehicle comprising the lighting device according to claim 1 .
JP2008250633A 2008-09-29 2008-09-29 Lighting device and vehicle Active JP5203874B2 (en)

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