JPH06314071A - Led module - Google Patents

Led module

Info

Publication number
JPH06314071A
JPH06314071A JP5125034A JP12503493A JPH06314071A JP H06314071 A JPH06314071 A JP H06314071A JP 5125034 A JP5125034 A JP 5125034A JP 12503493 A JP12503493 A JP 12503493A JP H06314071 A JPH06314071 A JP H06314071A
Authority
JP
Japan
Prior art keywords
led
substrate
control circuit
board
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5125034A
Other languages
Japanese (ja)
Inventor
Junichi Mizutani
淳一 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP5125034A priority Critical patent/JPH06314071A/en
Publication of JPH06314071A publication Critical patent/JPH06314071A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards

Abstract

PURPOSE:To reduce cost and to facilitate exchange in substrate units by automatizing the mounting of an LED in an LED module. CONSTITUTION:The LED module 10 is principally constituted of an LED substrate 12 on which plural LEDs 11 are mounted in a matrix state, a control circuit substrate 14 on which various kinds of circuit parts 13 are packaged, a connector member 15, and a holding member 16. The LED substrate 12 and the control circuit substrate 14 are electrically connected through the connector member 15. Thus, the mounting of the LED is performed only to the LED substrate simple substance and automatized, and the attachment/detachment and the exchange of the substrate ae facilitated. Since space for the wiring and the electrode pattern of the LED substrate is small, an interval between the LEDs and the space other than an LED display surface are kept to a minimum on the LED substrate. Therefore, the large LED display surface of fine appearance is formed by arranging many LED modules.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、複数のLED(発光ダ
イオード)がマトリックス状に実装されたLEDモジュ
ールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED module in which a plurality of LEDs (light emitting diodes) are mounted in a matrix.

【0002】[0002]

【従来技術】従来、図4(a),(b) に正面図、側面図を示
したように、複数のLEDが所定のピッチにてマトリッ
クス状に実装され、文字や図形等を表示するLEDモジ
ュール(基本単位構成から成るLED表示素子)が知ら
れている。
2. Description of the Related Art Conventionally, as shown in FIGS. 4 (a) and 4 (b), a front view and a side view, a plurality of LEDs are mounted in a matrix at a predetermined pitch to display characters and figures. A module (LED display element having a basic unit configuration) is known.

【0003】[0003]

【発明が解決しようとする課題】上述のLEDモジュー
ルを多数並べて使用する際、見栄えを良くするためには
LEDが高密度実装されたピッチを変更することなくL
ED表示面を隣接させる必要からLED基板の外形寸法
はLED表示面より大きくすることはできない。又、L
EDモジュールの各LEDには所定の電流を流す必要か
ら微細な回路パターンを用いることはできない。このよ
うな理由により、LEDモジュールでは各LEDが実装
されたLED基板と各LEDを駆動するための制御回路
基板との電気的な接続は、LEDの端子をそのまま用い
て達成していた。従って、LEDの実装組み付けはコス
ト高となり自動化が困難であった。又、LED基板と制
御回路基板との電気的な接続はLEDの端子のはんだ付
けであるためアッセンブリ後に不良が発生するとLED
基板又は制御回路基板単位の交換は不可能であった。
When a large number of the above-mentioned LED modules are arranged and used, in order to improve the appearance, the LEDs are mounted at a high density without changing the pitch.
The outer dimensions of the LED substrate cannot be made larger than the LED display surface because the ED display surfaces must be adjacent to each other. Also, L
Since it is necessary to pass a predetermined current to each LED of the ED module, a fine circuit pattern cannot be used. For these reasons, in the LED module, the electrical connection between the LED board on which each LED is mounted and the control circuit board for driving each LED is achieved by directly using the terminals of the LED. Therefore, the mounting and assembling of the LED are expensive and difficult to automate. Further, the electrical connection between the LED board and the control circuit board is soldering of the terminals of the LED, so if a defect occurs after assembly, the LED
It was not possible to replace the board or control circuit board unit.

【0004】本発明は、上記の課題を解決するために成
されたものであり、その目的とするところは、LEDモ
ジュールにおけるLEDの実装の自動化によるコスト低
減及び基板単位の交換を容易にすることである。
The present invention has been made to solve the above problems, and an object of the present invention is to facilitate cost reduction and easy replacement of substrate units by automating the mounting of LEDs in an LED module. Is.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の発明の構成は、複数のLEDが所定のピッチにてマト
リックス状に配列されたLED表示面により文字や図形
等を表示するLEDモジュールにおいて、前記LEDが
実装されたLED基板と、該LED基板に対応して前記
LEDを駆動するための制御回路基板と、前記LED基
板と前記制御回路基板との間に配設され、金属導体及び
絶縁材料から成るコネクタ部材と、前記LED基板と前
記制御回路基板とを所定の間隔に挟持することにより前
記コネクタ部材を圧接状態とし該両基板の対向する電極
又はランドパターン間を電気的に接続する保持部材とを
備えたことを特徴とする。
The structure of the invention for solving the above-mentioned problems is an LED module for displaying characters, figures, etc. on an LED display surface in which a plurality of LEDs are arranged in a matrix at a predetermined pitch. An LED board on which the LED is mounted; a control circuit board for driving the LED corresponding to the LED board; and a metal conductor and an insulating member disposed between the LED board and the control circuit board. Holding for holding the connector member made of a material and the LED board and the control circuit board at a predetermined interval to bring the connector member into a pressure contact state and electrically connecting the opposing electrodes or land patterns of the both boards. And a member.

【0006】[0006]

【作用】上記の手段によれば、LED基板と制御回路基
板とは保持部材により挟持されコネクタ部材を介して電
気的に接続される。このため、LEDの実装はLED基
板単体に対してのみとなり、LED基板と制御回路基板
とを容易に着脱することができる。又、LED基板及び
制御回路基板間の電気的な接続に必要な配線・電極パタ
ーンスペースが小さくできる。このため、LED基板は
LED間の隙間及びLED表示面以外のスペースを最小
限とすることができる。
According to the above means, the LED board and the control circuit board are sandwiched by the holding member and electrically connected to each other through the connector member. Therefore, the LED is mounted only on the LED substrate alone, and the LED substrate and the control circuit substrate can be easily attached and detached. Moreover, the wiring / electrode pattern space required for electrical connection between the LED substrate and the control circuit substrate can be reduced. Therefore, the LED substrate can minimize the gap between the LEDs and the space other than the LED display surface.

【0007】[0007]

【実施例】以下、本発明を具体的な実施例に基づいて説
明する。図1は本発明に係るLEDモジュールの構成を
示した分解斜視図、図2は図1のLED基板を裏面側か
ら見た斜視図である。LEDモジュール10は、主とし
て、複数のLED11がマトリックス状に実装されたL
ED基板12と各種回路部品13が搭載された制御回路
基板14とコネクタ部材15と保持部材16とから成
る。上記LED基板12の各LED11が配設された裏
面側にはそれらのアノード/カソード間に電流を流すた
めの回路パターン及びそれらが所定箇所にまとめられて
電極パターン12aが形成されている(図2参照)。
又、上記制御回路基板14には上記LED基板12の電
極パターン12aに対向する位置に電極パターン14a
が形成されている。そして、上記LED基板12の電極
パターン12aと上記制御回路基板14の電極パターン
14aとの間には所定の厚み及び幅を有するコネクタ部
材15が配設されている。このコネクタ部材15として
は、弾性を有するシリコンゴムから成る絶縁材料と金属
細線から成る金属導体とが一体成形され、上記LED基
板12と上記制御回路基板14とに垂直な単一方向に導
電性を有したものが採用される。即ち、上記電極パター
ン12a,14aとはコネクタ部材15の金属導体を介
して電気的に接続される。上記保持部材16が適所に複
数設けられた上記LED基板12の切欠部12bと上記
制御回路基板14の切欠部14bとを利用して組み付け
られる。この保持部材16により上記LED基板12と
上記制御回路基板14とが所定間隔に挟持され、上記コ
ネクタ部材15は両基板12,14と適切な圧接状態と
され電気的な接続が維持される。
EXAMPLES The present invention will be described below based on specific examples. FIG. 1 is an exploded perspective view showing the configuration of an LED module according to the present invention, and FIG. 2 is a perspective view of the LED substrate of FIG. 1 seen from the back side. The LED module 10 is mainly composed of a plurality of LEDs 11 mounted in an L-shape.
An ED board 12, a control circuit board 14 on which various circuit components 13 are mounted, a connector member 15, and a holding member 16. On the rear surface side of the LED substrate 12 on which the LEDs 11 are arranged, a circuit pattern for passing a current between the anodes / cathodes and electrode patterns 12a are formed by collecting the circuit patterns at predetermined positions (FIG. 2). reference).
Further, the control circuit board 14 has an electrode pattern 14a at a position facing the electrode pattern 12a of the LED board 12.
Are formed. A connector member 15 having a predetermined thickness and width is arranged between the electrode pattern 12a of the LED board 12 and the electrode pattern 14a of the control circuit board 14. As the connector member 15, an insulating material made of elastic silicon rubber and a metal conductor made of thin metal wires are integrally molded, and are electrically conductive in a single direction perpendicular to the LED board 12 and the control circuit board 14. What you have is adopted. That is, the electrode patterns 12a and 14a are electrically connected via the metal conductor of the connector member 15. The holding member 16 is assembled using the cutouts 12b of the LED board 12 and the cutouts 14b of the control circuit board 14, which are provided in plural at appropriate places. The LED board 12 and the control circuit board 14 are sandwiched by the holding member 16 at a predetermined interval, and the connector member 15 is brought into an appropriate pressure contact state with both boards 12 and 14 to maintain electrical connection.

【0008】上述したように、LED基板12と制御回
路基板14とは、コネクタ部材15を利用して電気的に
接続されている。このため、本発明のLEDモジュール
は、LED11をLED基板12のみに実装するだけで
良いため自動化が容易であり、LED基板及び制御回路
基板の固定が簡単となり電気的信頼性が向上する。又、
LED基板12と制御回路基板14とはコネクタ部材1
5による接続のため着脱可能であり基板交換などメンテ
ナンスが極めて容易となる。尚、LEDとしては表面実
装タイプでも良く、この場合には、スルーホールにより
LED基板12の裏面側に電極パターンを形成する。
As described above, the LED board 12 and the control circuit board 14 are electrically connected using the connector member 15. Therefore, the LED module of the present invention can be easily automated because the LED 11 only needs to be mounted on the LED board 12, and the LED board and the control circuit board can be easily fixed and the electrical reliability is improved. or,
The LED board 12 and the control circuit board 14 are connector members 1
Because of the connection by 5, it is detachable, and maintenance such as substrate replacement is extremely easy. The LED may be a surface mount type, and in this case, an electrode pattern is formed on the back surface side of the LED substrate 12 by a through hole.

【0009】上記コネクタ部材15は、この他、弾性を
有するシリコンゴム17から成る絶縁材料を芯材とし、
FPC(Flexible Printed Circuit Board:フレキシブル
プリント基板)18の金属導体を周囲に巻き付けた、図
5に示す形状のようなものでも同様の効果が得られる。
In addition to the above, the connector member 15 uses an insulating material made of elastic silicone rubber 17 as a core material,
The same effect can be obtained by using a metal conductor of an FPC (Flexible Printed Circuit Board) 18 wrapped around the metal conductor as shown in FIG.

【0010】更に、高密度にLEDの電極が存在するよ
うなフルカラー(R・G・B)LED(電極4端子)な
どではLED基板12の裏面側にスペース余裕がなく電
極パターン(コネクティングパターン)を設けることが
困難となる。このような場合には、図3に示したよう
に、弾性を有するシリコンゴムシートから成る絶縁材料
の厚み方向に金属細線から成る金属導体をマトリックス
状に配列した異方導電シートであるコネクタ部材15′
が採用できる。つまり、LED基板12の電極パターン
12aと制御回路基板14の電極パターン14aとを対
向させ、その間に上記コネクタ部材15′が配設され
る。上述の実施例と同様に保持部材16′はLED基板
12及び制御回路基板14の適所に複数設けられた切欠
部12b,14bを利用して組み付けられる。これによ
り、保持部材16′はLED基板12と制御回路基板1
4とを所定間隔に挟持し、コネクタ部材15′を両基板
12,14に圧接状態として電気的な接続を適切に維持
する。
Further, in a full-color (R, G, B) LED (electrode 4 terminals) or the like in which high density LED electrodes are present, an electrode pattern (connecting pattern) is provided on the rear surface side of the LED substrate 12 with no space. It will be difficult to provide. In such a case, as shown in FIG. 3, the connector member 15 is an anisotropic conductive sheet in which metal conductors made of thin metal wires are arranged in a matrix in the thickness direction of an insulating material made of a silicon rubber sheet having elasticity. ′
Can be adopted. That is, the electrode pattern 12a of the LED board 12 and the electrode pattern 14a of the control circuit board 14 are opposed to each other, and the connector member 15 'is disposed therebetween. Similar to the above-mentioned embodiment, the holding member 16 'is assembled by utilizing the notches 12b, 14b provided in plural places in the LED board 12 and the control circuit board 14. As a result, the holding member 16 ′ has the LED board 12 and the control circuit board 1
4 and 4 are sandwiched at a predetermined interval, and the connector member 15 'is brought into pressure contact with both substrates 12 and 14 to properly maintain the electrical connection.

【0011】このようなコネクタ部材15′は、電極パ
ターン(コネクティングパターン)を設けることが困難
な上述の極めて高密度にLEDの電極が存在するような
フルカラーLEDの他、LEDを各ドット単位でスタテ
ィックに駆動するようなものにも有効である。即ち、コ
ネクタ部材15′は電極数が増大して物理的に電極パタ
ーン形成が不可能な高密度であるような場合に適用され
る。これにより、LEDのはんだ付け部と制御回路基板
との電極パターンとが直接接続されるのである。
Such a connector member 15 'includes a full-color LED in which the electrodes of the LED are present at an extremely high density, in which it is difficult to provide an electrode pattern (connecting pattern), and the LED is statically formed in dot units. It is also effective for things that drive to. That is, the connector member 15 'is applied in the case where the number of electrodes increases and the electrode pattern cannot be physically formed at a high density. As a result, the soldered portion of the LED and the electrode pattern of the control circuit board are directly connected.

【0012】[0012]

【発明の効果】以上説明したように、LED基板と制御
回路基板とは保持部材により挟持されコネクタ部材を介
して電気的に接続されるため、LEDはLED基板単体
に実装するだけで良く自動化によるコスト低減が可能で
ある。又、LED基板と制御回路基板との電気的な接続
はコネクタ部材によるため基板同士の着脱・交換が容易
である。更に、LED基板と制御回路基板との電気的な
接続に要する配線・電極パターンスペースが小さくて済
むためLED基板のLED表示面以外のスペース及びL
ED間の隙間を最小限にできる。これにより、LEDモ
ジュールを多数個並べて見栄えの良い大きなLED表示
面を形成することが可能となる。
As described above, since the LED board and the control circuit board are sandwiched by the holding members and electrically connected to each other through the connector member, the LED only needs to be mounted on the LED board as a single unit. Cost reduction is possible. Also, since the electrical connection between the LED board and the control circuit board is made by the connector member, the boards can be easily attached and detached and exchanged. Furthermore, since the wiring / electrode pattern space required for electrical connection between the LED board and the control circuit board is small, the space other than the LED display surface of the LED board and L
The gap between the EDs can be minimized. This makes it possible to arrange a large number of LED modules to form a large-sized LED display surface that looks good.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の具体的な一実施例に係るLEDモジュ
ールの構成を示した分解斜視図である。
FIG. 1 is an exploded perspective view showing a configuration of an LED module according to a specific embodiment of the present invention.

【図2】図1のLED基板を裏面側から見た斜視図であ
る。
FIG. 2 is a perspective view of the LED substrate of FIG. 1 viewed from the back surface side.

【図3】本発明に係るLEDモジュールの構成における
他の実施例を示した斜視図である。
FIG. 3 is a perspective view showing another embodiment of the configuration of the LED module according to the present invention.

【図4】従来のLEDモジュールを示した外観図であ
る。
FIG. 4 is an external view showing a conventional LED module.

【図5】FPCを用いたコネクタ部材を示した外観図で
ある。
FIG. 5 is an external view showing a connector member using an FPC.

【符号の説明】[Explanation of symbols]

10…LEDモジュール 11…LED 12…LED基板 12a…電極パターン 12b…切欠部 13…回路部品 14…制御回路基板 14a…電極パターン 14b…切欠部 15…コネクタ部材 16…保持部材 17…シリコンゴム 18…FPC(フレキシブルプリント基板) DESCRIPTION OF SYMBOLS 10 ... LED module 11 ... LED 12 ... LED board 12a ... Electrode pattern 12b ... Notch part 13 ... Circuit part 14 ... Control circuit board 14a ... Electrode pattern 14b ... Notch part 15 ... Connector member 16 ... Holding member 17 ... Silicon rubber 18 ... FPC (flexible printed circuit board)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 複数のLEDが所定のピッチにてマトリ
ックス状に配列されたLED表示面により文字や図形等
を表示するLEDモジュールにおいて、 前記LEDが実装されたLED基板と、 前記LED基板に対応して前記LEDを駆動するための
制御回路基板と、 前記LED基板と前記制御回路基板との間に配設され、
金属導体及び絶縁材料から成るコネクタ部材と、 前記LED基板と前記制御回路基板とを所定の間隔に挟
持することにより前記コネクタ部材を圧接状態とし該両
基板の対向する電極又はランドパターン間を電気的に接
続する保持部材とを備えたことを特徴とするLEDモジ
ュール。
1. An LED module that displays characters, figures, and the like on an LED display surface in which a plurality of LEDs are arranged in a matrix at a predetermined pitch, and corresponds to an LED substrate on which the LEDs are mounted and the LED substrate. And a control circuit board for driving the LED, and arranged between the LED board and the control circuit board,
A connector member made of a metal conductor and an insulating material and the LED board and the control circuit board are sandwiched at a predetermined distance to bring the connector member into a pressure contact state, and electrically connect between opposing electrodes or land patterns of both boards. An LED module comprising a holding member connected to the LED module.
JP5125034A 1993-04-28 1993-04-28 Led module Pending JPH06314071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5125034A JPH06314071A (en) 1993-04-28 1993-04-28 Led module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5125034A JPH06314071A (en) 1993-04-28 1993-04-28 Led module

Publications (1)

Publication Number Publication Date
JPH06314071A true JPH06314071A (en) 1994-11-08

Family

ID=14900214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5125034A Pending JPH06314071A (en) 1993-04-28 1993-04-28 Led module

Country Status (1)

Country Link
JP (1) JPH06314071A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006009391A1 (en) * 2004-07-23 2006-01-26 Hyuk-Jun Son Dual led pixel modul
WO2008057680A3 (en) * 2006-11-03 2008-11-06 Apple Inc Display system
JP2009544050A (en) * 2006-07-10 2009-12-10 ビジュアル グラフィック システムズ インク. Support device for electrical plug
EP2195706A2 (en) * 2007-08-31 2010-06-16 LG Innotek Co., Ltd. Lighting device
JP2010171340A (en) * 2009-01-26 2010-08-05 Panasonic Electric Works Co Ltd Light emitting device
US8169388B2 (en) 2007-07-02 2012-05-01 Apple Inc. Color correction apparatus
CN105960110A (en) * 2016-06-20 2016-09-21 南京工业职业技术学院 Manufacturing method for liquid crystal display screen of computer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006009391A1 (en) * 2004-07-23 2006-01-26 Hyuk-Jun Son Dual led pixel modul
JP2009544050A (en) * 2006-07-10 2009-12-10 ビジュアル グラフィック システムズ インク. Support device for electrical plug
WO2008057680A3 (en) * 2006-11-03 2008-11-06 Apple Inc Display system
US8748909B2 (en) 2006-11-03 2014-06-10 Apple Inc. Display system
US8169388B2 (en) 2007-07-02 2012-05-01 Apple Inc. Color correction apparatus
EP2195706A2 (en) * 2007-08-31 2010-06-16 LG Innotek Co., Ltd. Lighting device
EP2195706A4 (en) * 2007-08-31 2010-10-27 Lg Innotek Co Ltd Lighting device
US8721117B2 (en) 2007-08-31 2014-05-13 Lg Innotek Co., Ltd. Lighting device
JP2010171340A (en) * 2009-01-26 2010-08-05 Panasonic Electric Works Co Ltd Light emitting device
CN105960110A (en) * 2016-06-20 2016-09-21 南京工业职业技术学院 Manufacturing method for liquid crystal display screen of computer

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