JP3271244B2 - Electronic component mounting method and electronic component mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and an electronic component mounting machine for mounting an electronic component on a substrate, and more particularly to a mounting machine for automatically mounting electronic components. Things.

[0002]

2. Description of the Related Art In recent years, electronic components have been steadily progressing without knowing where the miniaturization of mounted components and the densification of substrates remain.

[0003]

With the increase in the density of mounted components described above, there is a tendency that the requirements for accuracy are also strict for manufacturing equipment for mounting, and the accuracy of existing equipment structures has been exceeded. In some cases, high accuracy is required.

[0004] The improvement of mounting accuracy can be achieved only by configuring equipment (mounting machine) so as to have the same rigidity as a three-dimensional measuring machine, for example. However, if the rigidity of the mounting machine is increased, the weight is increased by that much, and the inertia force is increased, so that a large force is required for the operation and the power consumption is increased, so that it is difficult to operate at high speed. That is, since the requirement for the mounting speed cannot be satisfied, only the rigidity of the mounting machine cannot be increased.

In recent years, since the size of the substrate has been increasing, it is necessary to increase the size of the equipment in response to the increase in the size of the substrate. It is becoming.

By the way, in a modified component mounting machine (deformed mounter) for mounting a plurality of types of electronic components on a substrate,
The average level of the current catalog specification is as follows. 1. 1. Board size: 460 × 510 mm (The movable range needs to be about 800 × 800 mm including the component suction point.) 2. Mounting accuracy (value when mounting 0.3 mm pitch VQFP (Very Quad Flat Plastic)): ± 0.025 mm Part size: 50 × 50mm 4. Mounting time per board: 2.0 seconds (including lead recognition time) Mounting angle: Can be set in units of 1 degree

Since the positioning of the component to be mounted uses image recognition, the component itself has some errors. Therefore, the mechanical part of the mounting equipment is required to have an accuracy of about ± 0.02 mm, which is higher than the mounting accuracy.

However, in actuality, in order to emphasize high-speed performance, a structure having a lightened mechanism and a movable portion of 1000 mm or more is employed. ± 0.0 above
In many cases, an accuracy of about 2 mm cannot be realized, which is a problem.

Here, since the position of both the component and the board is recognized by the camera, the mounting position should not normally be displaced. However, in practice, there is some error even if the mechanism of the movable part of the robot, that is, the mounting machine is within the tolerance, and there is some error in reading the position by the camera. It is actually difficult to make it completely zero.

Conventionally, this deviation has not been a problem. However, in recent high-precision mounting due to miniaturization of components, the requirement for accuracy has become more severe, and the deviation has become unacceptable.

This displacement or mounting error can be reduced to some extent by making the mechanism of the movable part of the mounting machine as precise as possible.

However, the component head is hung on a rail extending in the X-axis direction (horizontal direction), which is generally used as a mechanism of the movable portion of the mounting machine, and the component suction nozzle is moved in the Z-axis direction from the tip of the component head. In the extended configuration, the rail bends or twists due to the weight of the rail and the component head. In addition, the position of the component head portion is shifted due to wear of the rail or the like.

At this time, the tip of the component suction nozzle of the component head portion, which is the free end, has the largest amount of displacement, and in some cases, exceeds the allowable tolerance range described above.

For example, when a component head extending nearly 150 mm in the Z-axis direction (vertical direction) hangs on a rail having a length of 1 m or more in the X-axis direction, at the tip of the component suction nozzle of the component head portion, For example, a deviation exceeding ± 0.025 mm has occurred.

Further, the component head unit usually incorporates a TV camera for image recognition for recognizing the mounting position and a component suction nozzle (in some cases, two or more nozzles).

FIG. 6 shows the amount of change in the Y-axis direction of the TV camera and the component suction nozzle accompanying the movement in the X-axis direction.
S indicates a movement start point, curve I indicates a change amount of the TV camera in the Y-axis direction, and curve II indicates a change amount of the component suction nozzle in the Y-axis direction. The mounting range of the mounting machine used for this measurement is X: -155 to 415 (mm).

In FIG. 6, the Y coordinate is fixed (Y = 250
mm), the movement is performed in the X-axis direction, and therefore, the amount of change in the Y-axis direction is ideally zero, but actually, the μ-axis is changed by μm due to the degree of engagement between the rail and the component head. A unit change has occurred. In addition, since the TV camera and the component suction nozzle have a certain interval of, for example, about 100 mm, there is a slight difference in the amount of change in the Y-axis direction.
It can be seen that these relative positional relationships are not always constant.

As described above, it has been found that the relative positional relationship between the TV camera and the component suction nozzle changes depending on the XY coordinates of the component mounting position, which complicates the accuracy problem described above.

In order to solve the above-mentioned problem, in the present invention, by correcting an error generated at the time of mounting,
An object of the present invention is to provide an electronic component mounting method and an electronic component mounting machine capable of securing sufficient mounting accuracy even at high speed operation.

[0020]

According to a method of mounting an electronic component of the present invention, a component mounting head capable of moving in a horizontal direction and a vertical direction is used to automatically mount a component on a substrate in accordance with a predetermined mounting program. For an electronic component mounting machine that mounts multiple electronic components, measure the position coordinates of the marks on the jig board on which multiple marks are provided in a matrix, and use the component mounting head to determine the position of the marks. Mount the dummy component on the jig board, measure the coordinates of the position where the dummy component is mounted, and calculate the error amount between the position coordinates of the mark on the jig substrate and the position coordinates of the dummy component mounted Then, a modified mounting program in which a predetermined mounting program is modified based on an error amount is obtained, and the electronic component is mounted on the board by the modified mounting program.

The electronic component mounter of the present invention automatically mounts a plurality of electronic components on a substrate in accordance with a predetermined mounting program using a component mounting head that can be moved in the horizontal and vertical directions. And a measuring device for measuring coordinates, and a jig substrate on which a plurality of marks whose coordinates have been measured in advance are provided in a matrix, wherein the coordinates of the marks are measured by the measuring device. From the first measured value obtained and the second measured value obtained by measuring the coordinates of the dummy component mounted at the position of the mark by the component head by the measuring means, the coordinates of the mark on the jig board and the dummy component are mounted. Error amount calculating means for calculating an error amount between the set coordinates, storage means for storing the error amount, and a mounting program for correcting a predetermined mounting program based on the error amount stored in the storing means. And a correction means, the corrected mounting program by the mounting program modifying means,
The mounting position of the electronic component on the substrate is defined.

According to the electronic component mounting method of the present invention described above, the amount of error between the coordinates of the mark on the jig board and the coordinates at which the dummy component is mounted is calculated and corrected based on the amount of error. By mounting the electronic component on the board by the mounting program, the error amount generated when the component mounting head is moved can be corrected and the component can be mounted at a correct position on the board with high accuracy.

According to the electronic component mounter of the present invention described above, the amount of error between the coordinates of the mark on the jig substrate and the coordinates of the dummy component is calculated, and this error stored in the storage means is calculated. By defining the mounting position of the electronic component on the board by the mounting program corrected based on the amount,
It is possible to configure a mounting machine that can correct the amount of error generated when the component mounting head is moved and mount the component at a correct position on the board with high accuracy.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, a plurality of electronic components are automatically mounted on a substrate according to a predetermined mounting program by using a component mounting head which can be moved in a horizontal direction and a vertical direction. For the electronic component mounter, measure the position coordinates of the marks on a jig substrate on which a plurality of marks are provided in a matrix, and use the component mounting head to set the position of the mark as a mounting position to the dummy component on the jig substrate. And the step of measuring the coordinates of the position where the dummy component is mounted, and the step of calculating the amount of error between the position coordinates of the mark on the jig board and the position coordinate of the dummy component. And
Obtain a modified mounting program that makes a correction based on the error amount to a predetermined mounting program, and by the corrected mounting program,
This is an electronic component mounting method for mounting an electronic component on a substrate.

Further, according to the present invention, in the electronic component mounting method, the measurement of the coordinates of the position where the component is mounted is performed by an imaging camera which is attached to the component mounting head and moves following the component mounting head. Do.

Further, according to the present invention, in the above electronic component mounting method, after measuring the position coordinates of the mark on the jig board by a measuring machine having an accuracy sufficiently higher than the reading accuracy of the imaging camera, the jig board is again used by the imaging camera. The position coordinates of the mark are measured, and the reading error amount of the imaging camera is calculated.

According to the present invention, in the electronic component mounting method, the reading error amount of the imaging camera is stored for all the mark positions, and the stored reading error amounts are read to correct the reading error of the mounting program.

Further, according to the present invention, in the above electronic component mounting method, the mark of the jig substrate may be a hole formed in a matrix on the jig substrate and having a diameter larger than the diameter of the hole as a dummy component. Disc-shaped dummy parts are used.

According to the present invention, in the electronic component mounting method, a correction amount is calculated from the error amount of at least one or more of the marks in the vicinity of a position coordinate at which the electronic component is mounted, and the correction is performed by the mounting program. Do.

According to the present invention, a plurality of electronic components are automatically mounted on a substrate according to a predetermined mounting program by using a component mounting head that can move in a horizontal direction and a vertical direction. A measuring device for measuring coordinates, and a first measurement in which the coordinates of the marks are measured by the measuring device on a jig substrate on which a plurality of marks whose coordinates have been measured in advance are provided in a matrix. From the value and the second measurement value obtained by measuring the coordinates of the dummy component mounted at the position of the mark by the component mounting head by the measurement unit,
An error amount calculating means for calculating an error amount between the coordinates of the mark of the jig board and the coordinates at which the dummy component is mounted; a storage means for storing the error amount; And a mounting program correcting means for correcting a predetermined mounting program, wherein the mounting position of the electronic component on the substrate is defined by the mounting program corrected by the mounting program correcting means.

According to the present invention, in the electronic component mounting machine, a second error amount calculating means for calculating an error amount between the first measured value and the measured value of the coordinates of the mark measured in advance, A second storage unit for storing the error amount calculated by the second error amount calculation unit, wherein the second measurement value is corrected by the error amount stored in the second storage unit. .

Further, in the electronic component mounting machine according to the present invention, the measuring means is an imaging camera which is provided alongside the component mounting head and moves following the component mounting head.

FIG. 1 is a schematic configuration diagram of an embodiment of an electronic component mounting machine according to the present invention.

The mounting machine 1 shown in FIG. 1 is an embodiment of a deformed component mounting machine (deformed mounter) for mounting a plurality of types of components on a substrate, and is based on a general orthogonal type three-axis robot. Have been. The mounting machine 1 mounts a substrate 20 on which an electronic component is mounted, a component supply unit 3 for supplying the electronic component, and sucks (or holds) the electronic component from the component supply unit 3. A component mounting head (hereinafter referred to as a component head unit 12) for mounting the component head on a substrate 20, a position recognition camera 15 which is an imaging camera for confirming a component position, and a component head unit based on a mounting program. And a control box 5 for performing the control of Twelve.

The component head 12 has an X axis and a Y
It has a mechanism that can move in the X-axis direction, the Y-axis direction, and the Z-axis direction, with the axis as the axis and the vertical direction as the Z-axis direction.

That is, as a specific movable mechanism, there is provided a component head section 12 which can move in the X-axis direction and is connected to the cable bear 11 across the beam-shaped rail 2.

As shown in FIG. 2 which is an enlarged view of the component head section 12, the component head section 12 is provided with two component holding nozzles 13 and 14, and further photographs and detects the position of the component. A position recognition camera 15 is provided as a detection unit (imaging device). In the case of FIG. 2, two nozzles, a component suction nozzle 13 and a component gripping nozzle 14, are provided.

The component holding nozzles 13 and 14 are replaceable, and may be replaced by other types of nozzles, not limited to the suction nozzles and the gripping nozzles. You may.

The beam-shaped rail 2 can be moved in the Y-axis direction by sliding both ends thereof. Also, Z
The movement in the axial direction is performed when the roots of the component holding nozzles 13 and 14 enter and exit from the component head 12.

At the rear of the mounting machine 1, there is provided a component supply unit 3 configured to store electronic components stored in a container such as a component supply tray and to send out the component supply tray at the time of mounting. . A component recognition camera (not shown) is provided in the vicinity of a container such as a component supply tray sent out from the component supply unit 3, and the component nozzles 13 and 13 are recognized by image recognition.
14 allows the shape and position of the electronic component sucked or gripped to be recognized at high speed.

A monitor 4 for displaying the image of the component recognition camera and a control box 5 for controlling the movement of the component holding nozzles 13 and 14 are provided on the side of the mounting machine 1. On the surface of the control box 5, buttons for inputting control data and commands, a display for displaying input contents, and the like are provided.

Note that, in FIG. 1, the configuration of the mechanism for discharging the board after the components are mounted is omitted.

The mounting of components in the mounting machine 1 is performed in accordance with a command from a control unit based on a mounting program, for example, in the following flow. Here, QFP (Quad Fla
t Plastic) The case of mounting will be described.

First, a component supply tray (not shown) is sent from the component supply unit 3 into the movable range of the component holding nozzles 13 and 14, and moves in the X-axis direction, the Y-axis direction, and the Z-axis direction. By doing so, the component holding nozzles 13 and 14
Sucks or grips the electronic component specified by the mounting program in the supply tray.

Next, the shape and position (including angle) of the electronic component are read by the component recognition camera looking up from below. QF
In P mounting, the bending of the lead is also recognized here.

Then, while holding the component, the component is moved upward in the Z-axis direction and taken out of the component supply tray, and then moved in the X-axis direction and the Y-axis direction to mount the electronic component on the substrate 20. Move to the specified mounting position. At this time,
The position and the angle of the substrate 20 are read from the target mark described as a mark on the substrate 20.

Further, after correcting the displacement in the X-axis direction and the Y-axis direction, the component holding nozzles 13 and 14 move downward in the Z-axis direction, and the components are mounted on the substrate 20. After the mounting, the suction of the component suction nozzle 13 is stopped, or the grip of the component gripping nozzle 14 is loosened, and the component holding nozzles 13 and 14 are further moved upward in the Z-axis direction. Then, the next part can be attached. These operations are repeated for a predetermined number of times, and the mounting is completed.

When the above-mentioned QFP (Quad Flat Plastic) is mounted, it is necessary to recognize the bending direction of the lead.
Although the speed is about 2 seconds / piece, the mounting is performed at about 0.5 seconds / piece when mounting a chip component without a lead, for example, so that the mounting machine 1 swings at a high speed.

Here, since the position of both the component and the board is recognized by the camera, the displacement of the mounting position should normally not occur. However, in practice, there is some error even if the robot, that is, the mechanism of the movable part is within the tolerance, and there is some error in reading the position by the camera. Is actually difficult.

However, since the shift amount corresponds to the coordinates of the component mounting position and is known to have reproducibility, the positions of the component holding nozzles 13 and 14 must be corrected by the shift amount. Is possible.

The correction method will be described below. 4 and 5 show the flow of a series of steps. 4 and 5, a thick arrow indicates that the process is executed based on a program or a process such as an original mounting program of the arrow.

1. In a first step S1 in FIG. 4, a jig substrate is created. As the jig substrate 21, a metal plate having the maximum size of the substrate 20 applicable to the mounting machine 1 and having a small thermal expansion is preferable. A hole 22 having a diameter of, for example, about 3 mm is formed in the metal plate so as to be arranged in a grid pattern with marks of about 50 mm square, and a jig substrate 21 is manufactured.

FIG. 3 shows an embodiment of the jig substrate 21. The jig substrate 21 has X coordinates X0, X1, X2, X3, and X, respectively, using the position of (X0, Y0) as a coordinate reference point.
, X5,..., Y coordinates are Y0, Y1, Y, respectively.
At positions 2, Y3, and Y4, grid holes 22 serving as marks are formed, and the grid holes 22 are arranged in a grid.

It is preferable that the lattice spacing of the lattice holes 22 is equal to the spacing in the X direction and the spacing in the Y direction as shown in FIG. In such a case, a configuration in which the interval in that direction is narrower than the interval in other directions may be adopted.

2. In the second step S2 of FIG.
The coordinates of each of the grid holes 22 are precisely measured by a high-precision measuring device such as a three-dimensional measuring device. The measured values obtained here are referred to as Data. Let it be 1. At this time, the position of the center (or the center of gravity) of the grid hole 22 is obtained by the measuring instrument, and the coordinates of the center of the grid hole 22 are set as the coordinates of the grid hole 22. When the lattice hole 22 is circular, the coordinates of the center position are used, and in other cases, the coordinates of the center of gravity are used.

The position of the center or the center of gravity of the lattice hole 22 is
It is also possible to automatically determine the position and determine the coordinates by a computer using an image processing program or the like.

3. In the third step S3 in FIG.
A mounting program for mounting a component at the same position as one lattice hole 22 is created. This mounting program is a program configured to give control such that the component can be mounted at the position of the coordinates on the board by giving the coordinate data of the position where the component is to be mounted. That is,
In this step, the center (or the center of gravity) coordinate data (Data. 1) of the grid hole 22 measured by the high-precision measuring device is input to the mounting program (Prog. 1).

The input of the coordinate data of the center (or the center of gravity) of the lattice hole 22 may be performed by manually inputting a measurement value by a high-precision measuring device, or by inputting the data from the high-precision measuring device to an electronic storage medium. And the data may be input through this storage medium, or the data transfer program may be used to automatically transfer the data from the high-precision measuring machine to the mounting machine 1 using the mounting program and perform the measurement. A value may be taken in.

4. In the fourth step S4 in FIG.
1 is set on the mounting machine 1 and the origin is aligned. Then, the position recognition camera 15 mounted on the component head 12 is moved to measure the coordinates of each lattice hole 22. Data obtained at this time is referred to as Data. Let it be 2.

Measurement of coordinates by the position recognition camera 15 is as follows.
As in the measurement by the high-precision measuring device described above,
Measurement can be performed by automatically recognizing the center or the position of the center of gravity.

5. The coordinates (Data.2) of the grid holes (marks) 22 measured by the position recognition camera 15 in the fifth step S5 of FIG. 4 are the coordinates (Data.1) of the grid holes (marks) 22 measured by a highly accurate measuring device. Compare with Thereby, the reading error of the camera (Data.
C) is obtained. Data. 2-Data. 1 = Reading error of camera (Data.C)

The error amount Data. The calculation of C is performed by including a calculation program in the control program of the mounting machine 1 as an error amount calculation means.
ata. 1 and Data. 1 obtained by measurement by the position recognition camera 15. 2 can be automatically calculated.

Incidentally, the reading error of the camera is determined by storing the value calculated for each coordinate of each grid hole 22 in the storage means of the mounting machine 1 and performing the measurement by the position recognition camera 15 thereafter. The control program may be configured so that the value can be modified. At this time, as the correction value of an arbitrary point, the amount of the camera reading error in the closest lattice hole 22 among the lattice holes 22 around the point is adopted.

6. In a sixth step S6 in FIG. 4, a dummy component is mounted at the position of the grid hole (mark) 22 of the jig board 21 based on the mounting program (Prog. 1). For example, a dummy component having a circular shape with a diameter of 5 mm and a thickness of 2 mm is suctioned by the component suction nozzle 13 and mounted on each of the lattice holes 22 with a diameter of 3 mm of the jig substrate 21. At this time, in order to prevent a displacement after the mounting of the dummy component, the jig substrate 2 is used.
It is desirable to stick an adhesive tape or the like on one lattice hole 22.

The dummy part has a diameter larger than the diameter of the lattice hole 22 so that it can be mounted on the lattice hole 22. Further, it is desirable that the dummy component has a circular shape having the same length in each direction and the center can be easily obtained.

7. In a seventh step S7 in FIG. 4, the coordinates of the mounting position of the dummy component in the mounting machine 1 are measured by the position recognition camera 15 mounted on the component head 12. Data obtained at this time is referred to as Data. 3 is assumed.

8. In the eighth step S8 in FIG. 4, the mounting position (Data. 3) of the dummy component and the coordinates (Data.
By comparing with 2), a true mounting error is obtained. The value of this true mounting error is referred to as Data. 4 is assumed. Data.
3-Data. 2 = True mounting error (Data.4)
This step is performed after correcting the reading error of the position recognition camera 15.

This error amount Data. 4 is calculated by including a calculation program in the control program of the mounting machine 1 as an error amount calculation means, so that the position measurement value Data. 2 and a measured value Data. Of the mounting position of the dummy component obtained later. 3 can be automatically calculated.

This true mounting error is caused by the fact that each grid hole 2
It is preferable that the value calculated for each of the coordinates 2 is stored in the storage unit of the mounting machine 1 so that the mounting program for actually mounting the components on the board 20 can be modified as described later.

The flow up to the step of calculating the mounting error is performed as shown in FIG. Subsequently, a flow until components are mounted on the board 20 is shown in FIG.

9. Based on the design information of the component to be mounted, such as CAD information, a mounting program (Prog. 2) for each mounting machine 1 is created in a ninth step S9 in FIG.

10. In the tenth step S10 of FIG. 5, the mounting program (Prog. 2) for each mounting machine 1 is added to the true mounting error (Dat) obtained in the eighth step S8.
a. 4) is added, and a corrected mounting program (Prog. 3) is created.

The mounting program is modified by, for example, adding a true mounting error (Data.4) to the mounting program (Prog.2) for each mounting machine 1 in the control program of the mounting machine 1 as a mounting program correcting means. Then, it is preferable to include a program that automatically creates the corrected program (Prog. 3).

The modified implementation program (Pro
g. 3), the mounting program (Pro
g. 2) When reading, the true mounting error (Da
ta. In consideration of 4), it may be created each time, and may exist only in the storage area of the mounting machine 1, for example, in the control box 5.

11. In the eleventh step S11 in FIG. 5, the electronic component is mounted on the production board 20 by the modified mounting program (Prog. 3).

It should be noted that the true mounting error Data.
4, the modified mounting program (Prog. 3) created for one mounting machine 1 should not be diverted to another mounting machine 1.

By performing this series of steps periodically, it is possible not only to correct errors inherent in the mounting machine 1 but also to correct errors caused by temporal changes such as abrasion of rails. Become. Thereby, even if a change over time occurs,
Accuracy can be maintained as long as the reproducibility of the repetition is maintained and the amount of error generated is constant. Therefore, the substrate 2
It is not necessary to measure the mounting position to 0 for each sheet, and the component can be mounted at the correct position on the board 20 by the same modified mounting program while reproducibility is obtained.

When the reproducibility of the repetition is no longer maintained, the movable mechanisms such as the component head 12 and the rail 2 are inspected, repaired and replaced if necessary, and then the jig board 21 and the dummy component are re-exposed. , A corrected mounting program is created, and accuracy can be maintained while reproducibility is maintained.

The above-described series of steps will be described with more specific numerical values. Here, A which is a lattice hole (mark) 22 at the position (X3, Y2) of the jig substrate 21 shown in FIG.
The description will be given focusing on the points. The coordinates of the point A are precisely measured by a three-dimensional measuring device or the like (Data. 1), and X = 150 m
It is assumed that m, Y = 100 mm is obtained. Hereinafter, the unit mm will be omitted.

Subsequently, the point A is read by the position recognition camera 15, and the read measurement value (Data.2) is X = 14.
Suppose that 9.9, Y = 100.2. At this time, the reading error (Data.C) of the position recognition camera 15 is:
In the X direction, 149.9-150 = -0.1 In the Y direction, 1
00.2-100 = + 0.2.

Therefore, the camera reading correction value, that is, the correction value for canceling the error, corresponds to (-Data.C) and is as follows. X direction = +0.1, Y direction = -0.2

When the corrected value read by the camera is added to the value measured by the camera, the following is obtained. In the X direction, 144.9 (camera measurement value) +0.1 (correction value) = 150. In the Y direction, 100.2 (camera measurement value) −0.2 (correction value) = 100. It matches the measured value (Data.1).

The applicable range of the camera reading correction value is as follows.
In the range defined by the middle line of each lattice hole 22 as a boundary, that is, in the case of the point A, the X direction: 125 to 175, the Y direction: 75 to 125
And

Subsequently, each grid hole (mark) 2 of the jig substrate
2, a mounting program for placing the components is prepared, and a dummy component (5 mm in diameter and 2 mm in thickness) is mounted by the mounting program. Then, the position of the mounted dummy component is measured by the position recognition camera 15 (Data. 3). For example, in the case of the point A, it is assumed that X = 149.7 and Y = 100.5.

Next, the corrected value (−Data.C) of the previously obtained camera reading error is added to the measured value (Data.3) read by the position recognition camera 15 for the position of the dummy part, and the dummy part is read. True mounting position coordinates (Data.3)
-Data. C). X direction 149.7 + 0.1 (camera correction value) = 14
9.8 Y direction 100.5-0.2 (camera correction value) = 10
0.3 At this time, the true mounting error (Data.4) is as follows. X direction 149.8−150 = −0.2 Y direction 100.5−100 = + 0.3 This is expressed by the following equation (1).

[0086]

(Data.3-Data.C) -Data. 1 = Data. 3- (Data.2-Data.1) -Data. 1 = Data. 3-Data. 2 = Data. 4

The correction value of the mounting position, that is, the value for canceling the true mounting error, corresponds to (-Data.4), and the value is as follows. X-direction +0.2, Y-direction -0.3 Using the corrected values, the modified mounting program (Pro
g. 3) can be created.

The range of application of this correction value may be the middle line of each lattice hole 22 as in the case of the correction value (−Data.C) of the camera reading error. The difference from the correction value (−Data.4) of the mounting position in the lattice hole 22 located next to the lattice hole 22 in the inside may be proportionally distributed.

In the above description, the coordinates of point A are (10
(0 mm, 150 mm), but the processing accuracy of the grid holes 22 of the jig substrate 21 may not be so high, and the coordinates of the center (or the center of gravity) of the grid holes 22 at the point A are, for example, (101 mm, 149 mm). ) Etc.
It is sufficient that a precise measurement value of coordinates is obtained by a highly accurate measuring machine such as a three-dimensional measuring machine.

In the accuracy calibration method described above, if there is a jig substrate and a dummy component, self-correction can be performed by using the function of the mounting machine 1. It is necessary to add control software.

Then, the modified mounting program (P
log. The following effects can be obtained by mounting components according to 3).

1. It is possible to mount components with high precision without significantly increasing the rigidity of the equipment.

2. If the jig board 21 and the corrected mounting program (Prog. 3) are prepared once, the mounting position can be corrected from the next time without requiring any special skills.

3. Accuracy can be maintained as long as reproducibility is obtained, even if there is a change in the mechanical section such as the rail 2 and the component head section 12 due to aging.

4. As long as the jig substrate 21 has a high measurement accuracy of the coordinates of the grid holes 22, the processing accuracy of the holes may be low. Therefore, the increase in manufacturing cost by using the jig substrate 21 is small. Since there is no need to measure and correct the mounting position of components, manufacturing time can be reduced,
As a result, the manufacturing cost can be reduced.

The electronic component mounting method and electronic component mounting machine of the present invention are not limited to the above-described embodiment, but may take various other configurations without departing from the gist of the present invention.

[0097]

According to the present invention described above, it is possible to mount components with high accuracy without increasing the rigidity of the equipment.

Further, once the jig board and the mounting program are prepared and the mounting program is corrected, the mounting position can be corrected from the next time without requiring any special skills. Further, even if there is a change in the mechanism due to a change over time, accuracy can be maintained as long as reproducibility is obtained. Since the processing accuracy of the jig substrate may be low as long as the measurement accuracy is high, the jig substrate can be manufactured at low cost. Therefore, it is not necessary to measure the mounting position for each substrate,
Since the time required for manufacturing is reduced and the cost increase due to the use of the jig substrate is small, the manufacturing cost for mounting components on the substrate can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram (perspective view) of an embodiment of an electronic component mounting machine according to the present invention.

FIG. 2 is an enlarged view of the vicinity of a component head of the mounting machine of FIG. 1;

FIG. 3 is a diagram showing a jig substrate provided with lattice holes.

FIG. 4 is a diagram showing a process flow until a true mounting error is obtained.

FIG. 5 is a diagram showing a flow of processes until mounting is performed using a corrected mounting program.

FIG. 6 is a diagram showing the amount of change in the position of the position recognition camera and the component suction nozzle due to movement in the X-axis direction.

[Explanation of symbols]

1 mounting machine, 2 rails, 3 parts supply section, 4 monitor, 5 control box, 11 cable carrier, 12
Component head, 13 Component suction nozzle, 14 Component gripping nozzle, 15 Position recognition camera, 20 substrates, 21 Jig substrate, 22 Grid holes (marks)

Continuation of the front page (56) References JP-A-8-23196 (JP, A) JP-A-4-130800 (JP, A) JP-A-6-252596 (JP, A) JP-A-11-274794 (JP) , A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (9)

(57) [Claims] An electronic component mounting machine that automatically mounts a plurality of electronic components on a substrate according to a predetermined mounting program using a component mounting head that can move in a horizontal direction and a vertical direction. On the other hand, the position coordinates of the marks on a jig substrate on which a plurality of marks are provided in a matrix are measured, and mounting of the dummy component on the jig substrate is performed by using the component mounting head with the position of the mark as a mounting position. The coordinates of the position where the dummy component is mounted are measured, and the amount of error between the position coordinates of the mark on the jig board and the position coordinates where the component is mounted is calculated. A method for mounting an electronic component, comprising: obtaining a corrected mounting program that has been corrected based on the error amount; and mounting the electronic component on the substrate using the corrected mounting program. 2. The apparatus according to claim 1, wherein the measurement of the coordinates of the position at which the dummy component is mounted is performed by an imaging camera which is attached to the component mounting head and moves following the component mounting head. The electronic component mounting method described in the above. 3. After measuring the position coordinates of the mark on the jig board by a measuring instrument having sufficiently higher accuracy than the reading accuracy of the imaging camera, the position coordinates of the mark on the jig board are measured again by the imaging camera. 3. The method according to claim 2, further comprising calculating a reading error amount of the imaging camera.
The electronic component mounting method described in the above. 4. The reading error of the mounting program is stored by reading the reading error amount of the imaging camera for all the positions of the marks and reading the stored reading error amount. The mounting method of the described electronic component. 5. The mark of the jig substrate is a hole formed in a matrix on the jig substrate, and a disc-shaped dummy component having a diameter larger than the diameter of the hole is used as the dummy component. The method for mounting an electronic component according to claim 1, wherein the mounting method is used. 6. The mounting program according to claim 1, wherein a correction amount is calculated from the error amount of at least one or more marks in the vicinity of a position coordinate where the electronic component is mounted, and the mounting program is corrected. The mounting method of the described electronic component. 7. An electronic component mounting machine that automatically mounts a plurality of electronic components on a substrate according to a predetermined mounting program using a component mounting head that can move in a horizontal direction and a vertical direction. A measuring means for measuring the coordinates, and a first measurement wherein the coordinates of the marks are measured by the measuring means on a jig substrate on which a plurality of marks whose coordinates have been measured in advance are provided in a matrix. From the value and the second measurement value obtained by measuring the coordinates of the dummy component mounted at the position of the mark by the component head by the measurement unit,
Error amount calculating means for calculating an error amount between the coordinates of the mark on the jig board and the coordinates at which the dummy component is mounted; a storage means for storing the error amount; and an error amount stored in the storage means. Mounting program correcting means for correcting the predetermined mounting program based on the mounting program. The mounting program corrected by the mounting program correcting means defines a mounting position of the electronic component on the board. Electronic component mounting machine. 8. A second error amount calculating means for calculating an error amount between the first measured value and a measured value of the coordinates of the mark measured in advance, and the second error amount calculating means. 8. A second storage means for storing the calculated error amount, wherein the second measurement value is corrected by the error amount stored in the second storage means. Electronic component mounting machine. 9. The electronic component mounting machine according to claim 7, wherein said measuring means is an imaging camera which is attached to said component mounting head and moves following the component mounting head.