JP3258805B2 - Display device - Google Patents

Display device

Info

Publication number
JP3258805B2
JP3258805B2 JP01108594A JP1108594A JP3258805B2 JP 3258805 B2 JP3258805 B2 JP 3258805B2 JP 01108594 A JP01108594 A JP 01108594A JP 1108594 A JP1108594 A JP 1108594A JP 3258805 B2 JP3258805 B2 JP 3258805B2
Authority
JP
Japan
Prior art keywords
terminal
row
connection
terminals
solder particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP01108594A
Other languages
Japanese (ja)
Other versions
JPH07218926A (en
Inventor
雅則 田村
修 山下
正義 磯部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP01108594A priority Critical patent/JP3258805B2/en
Publication of JPH07218926A publication Critical patent/JPH07218926A/en
Application granted granted Critical
Publication of JP3258805B2 publication Critical patent/JP3258805B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は駆動素子を表示器の基板
に接続した表示装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device in which a driving element is connected to a display substrate.

【0002】[0002]

【従来の技術】従来より、液晶表示器等の透明電極を有
する基板を持つ表示装置においては、特開平4−158
338号公報に示されるように、表示器の列を成す端子
を含む端子部に異方性導電材料からなる接続剤を用いて
駆動素子の端子部を接続していた。これは、小さい金属
粒子や半田粒子などの導電粒子を混練した接着剤などを
異方性導電材料として用い、表示器の端子部と駆動素子
の端子部を対向させ、その両方の端子列の間に異方性導
電材料を配置し、これを加熱加圧するなどして接続する
ものである。
2. Description of the Related Art Conventionally, a display device having a substrate having a transparent electrode, such as a liquid crystal display, has been disclosed in Japanese Patent Application Laid-Open No. 4-158.
As disclosed in Japanese Patent No. 338, a terminal portion of a driving element is connected to a terminal portion including terminals forming a row of a display using a connecting agent made of an anisotropic conductive material. This is done by using an adhesive made by kneading conductive particles such as small metal particles and solder particles as an anisotropic conductive material, with the terminal of the display and the terminal of the drive element facing each other, and between both terminal rows. An anisotropic conductive material is disposed on the substrate, and the material is connected by heating and pressing.

【0003】[0003]

【発明が解決しようとする課題】ところが表示器の列を
成す端子部は表示容量が大きくなり表示密度が高くなる
につれて数が多く密集して設けられるので、露出した端
子部が損傷しやすく、とりわけ端子部が透明電極である
場合には比較的軟質なので表示器製造作業中等に傷が付
き易く、又付いた傷が判別し難いため端子接続の直前に
なるまで端子修復などの処理ができない事が多い。この
様な場合に上述した異方性導電材料で端子部を接続する
と、損傷した表示面側の端子が短いために接続面積が不
足したり、損傷した箇所の末端側でのみ接続され表示面
側では接続されなかったりして、接続不良が多発してい
た。この様な接続不良を検討しているとき、接続剤の導
電粒子がランダムに混練されているために、損傷してい
る端子部分で導電粒子が密集している確率も低くなって
いることも分かった。
However, the terminal portions forming the rows of the display are provided in large numbers and densely as the display capacity increases and the display density increases, so that the exposed terminal portions are liable to be damaged. When the terminal is a transparent electrode, it is relatively soft, so it is easy to be scratched during display device manufacturing work, and it is difficult to distinguish the scratches. Many. In such a case, when the terminals are connected with the anisotropic conductive material described above, the connection area is insufficient due to the short length of the terminal on the damaged display surface side, or the connection is made only at the terminal side of the damaged portion and the display surface side In some cases, connection was not established, and connection failures occurred frequently. When examining such poor connection, it is also found that the probability that the conductive particles are crowded at the damaged terminal part is low because the conductive particles of the connecting agent are randomly kneaded. Was.

【0004】[0004]

【課題を解決するための手段】本発明は上述した点を考
慮して成されたもので、表面に露出して設けられた透明
電極からなる端子の列を含む端子部を有する表示器の基
板と、その基板の端子部に接続される端子部を有した駆
動素子と、表示器の基板の端子部と駆動素子の端子部と
の間に介在し両端子を接続する接続剤とを有し、その接
続剤として端子の列に斜交した列を成す半田粒子の列を
持たせたものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has been made in view of the above, and is provided with a substrate for a display having a terminal portion including a row of terminals formed of transparent electrodes exposed on the surface. And a driving element having a terminal portion connected to the terminal portion of the substrate, and a connecting agent interposed between the terminal portion of the display device substrate and the terminal portion of the driving element to connect both terminals. And a row of solder particles forming an oblique row to the row of terminals as the connecting agent.

【0005】[0005]

【作用】この様な構成は、半田粒子が端子と接続される
ときに近接粒子同士が連接することに着目して成された
もので、端子部の電極が損傷しても半田粒子が高い確率
で端子部分を有効接続面として確保し接続する。
This structure is made by paying attention to the fact that adjacent particles are connected to each other when the solder particles are connected to the terminal. To secure and connect the terminal as an effective connection surface.

【0006】[0006]

【実施例】図1は本発明実施例の表示装置の要部平面図
aとそれに用いられている接続剤4の要部平面図bを示
している。図において、1は液晶表示器等の基板で、ガ
ラス板などの基台11の表面に露出して設けられ、透明
電極からなり、列を成す端子12を含む端子部(領域)
2を有する。3は液晶表示器などの表示器を駆動するた
めの駆動素子で、フィルム状支持体31に集積回路素子
32を有し、銅箔などの舌片状の金属箔集合体からなる
列を成す端子部電極33を有する。4は一般に異方性導
電材料と呼ばれる接続剤で、半田粒子の列が斜めに配置
されるように接着性樹脂剤に混練したもので、厚み方向
に圧力を加えることで厚み方向には電気的導通が取られ
るが、幅方向、即ち厚み方向に交わる平面方向には電気
的導通しないものである。これにより端子部2は、接続
剤4を介して駆動素子の端子部電極33に接続される。
FIG. 1 shows a plan view a of a main part of a display device according to an embodiment of the present invention and a plan view b of a main part of a connecting agent 4 used therein. In the drawing, reference numeral 1 denotes a substrate such as a liquid crystal display, which is provided on a surface of a base 11 such as a glass plate and is exposed, and is made of a transparent electrode, and includes a terminal portion (region) including terminals 12 in a row.
2 Reference numeral 3 denotes a driving element for driving a display such as a liquid crystal display, which has an integrated circuit element 32 on a film-like support 31 and which constitutes a row of tongue-shaped metal foil aggregates such as copper foil. It has a unit electrode 33. Reference numeral 4 denotes a connection agent generally called an anisotropic conductive material, which is kneaded with an adhesive resin agent so that rows of solder particles are arranged obliquely, and is electrically connected in the thickness direction by applying pressure in the thickness direction. Electrical continuity is obtained, but no electrical continuity is achieved in the width direction, that is, the plane direction intersecting the thickness direction. Thereby, the terminal portion 2 is connected to the terminal portion electrode 33 of the drive element via the connection agent 4.

【0007】より具体的に説明すると、基板1の端子1
2は60〜120μmの幅をもち75〜170μmピッ
チで48〜2,000本が整列して配列されており、露
出部分の長さは2.2〜20mmである。そして端子部
2としての有効接続端子列の幅(端子の長さ)は例えば
2mmであり、端子12の幅、つまり電極幅が90μm
の場合の各端子12の接続部分の面積は0.09×2m
mとなる。一方駆動素子3の端子部電極33は幅50〜
120μmで、整列ピッチは端子部2と等しくなるよう
に設定されている。
More specifically, the terminal 1 of the substrate 1
No. 2 has a width of 60 to 120 μm, has 48 to 2,000 lines arranged at a pitch of 75 to 170 μm, and the length of the exposed portion is 2.2 to 20 mm. The width (length of the terminal) of the effective connection terminal row as the terminal portion 2 is, for example, 2 mm, and the width of the terminal 12, that is, the electrode width is 90 μm.
In this case, the area of the connection portion of each terminal 12 is 0.09 × 2 m
m. On the other hand, the terminal electrode 33 of the driving element 3 has a width of 50 to
The alignment pitch is set to be equal to that of the terminal portion 2 at 120 μm.

【0008】この様な端子部2は、例えば1980本2
列の端子部を持つ基板1000枚のロットに対して、お
よそ5〜60%の表示器(パネル)には傷13が発生
し、そのうち半分強のものは端子部2における端子12
の断線を生じている。これらのロットに対して、厚さ2
0〜30μmのエポキシ樹脂ベースの接着剤を母材とす
る接続剤4で接続すると、混練金属である導電粒子の直
径が5μm粒子の半田の場合、5〜40%の接続不良表
示装置を生じるが、端子12の傷13に基づくものは、
そのおよそ90%を占める。
[0008] Such terminal portions 2 are, for example, 1980
About 5 to 60% of the display devices (panels) have scratches 13 on a lot of 1000 substrates having terminal portions in a row.
Disconnection has occurred. For these lots, thickness 2
When a connection is made with a connection agent 4 having an epoxy resin-based adhesive of 0 to 30 μm as a base material, a connection failure display device of 5 to 40% occurs when the diameter of conductive particles as kneaded metal is 5 μm. , Based on the scratch 13 of the terminal 12
It accounts for about 90% of that.

【0009】それに対して本発明においては、接続剤4
は接着剤からなる母材40の中に、端子12の列に斜交
した列を成す半田粒子41の列を有している。半田粒子
41の列は例えば直径5ミクロンの粒子の密度の高い列
が幅30〜150μm、60〜200μmピッチで設け
られたもので、端子13が基板1の端縁に垂直な方向に
設けられている場合には接続剤の長手方向に対して45
〜85度の角度θを成す方向に設けられている。
On the other hand, in the present invention, the connecting agent 4
Has a row of solder particles 41 forming a row oblique to the row of terminals 12 in a base material 40 made of an adhesive. The rows of the solder particles 41 are, for example, rows in which high-density rows of particles having a diameter of 5 μm are provided at a pitch of 30 to 150 μm and a pitch of 60 to 200 μm. The terminals 13 are provided in a direction perpendicular to the edge of the substrate 1. 45
It is provided in a direction forming an angle θ of up to 85 degrees.

【0010】この様な接続剤4を用いた場合、傷13の
ある端子12が存在していても、接続剤4で加圧加熱し
た場合、接続不良表示装置の95〜100%がなくなっ
た。
When such a connecting agent 4 is used, 95 to 100% of the connection failure display devices disappear when pressurized and heated with the connecting agent 4 even if the terminal 12 having the scratch 13 is present.

【0011】この様な接続においては、従来技術、本発
明実施例のいずれの場合にも、接続剤4は厚さが1.5
〜3μmになる程度まで加圧加熱しているが、その間直
径5μmであった半田粒子は端子部2,33に触れる部
分において凝集し、端子12等と接触する大きさは略直
径30〜60μmにまで至り、上下間の各々の端子部と
の密着が良好になる。
In such a connection, the connection agent 4 has a thickness of 1.5 in both the prior art and the embodiment of the present invention.
The solder particles having a diameter of 5 μm agglomerate at the portions touching the terminal portions 2 and 33, and the size in contact with the terminals 12 and the like is reduced to approximately 30 to 60 μm. And the close contact with the upper and lower terminals is improved.

【0012】この接続の様子を観察した結果、従来は図
2aのように半田粒子がその溶解に任せて勝手に集結
し、ランダムに混練した半田粒子43が本当に均一な散
布になっていれば接続できていたかもしれないが、現実
には密度にムラがあるので不良が増加していることが分
った。これに対し、本発明においては図2bのように半
田粒子の列と端子の交差部分を中心に半田粒子41が集
結しており、接続に十分な半田量となるとともに、傷1
3をまたがる半田も存在した。この例のような半田粒子
は通常1端子当り10〜15個以上が接続に寄与しなけ
れば電気的な接続不良になることも分かった。
As a result of observing the state of this connection, as shown in FIG. 2A, if the solder particles 43 were randomly dispersed and kneaded in a truly uniform manner as shown in FIG. It may have been done, but in reality it was found that the density was uneven and the number of defects was increasing. On the other hand, in the present invention, as shown in FIG. 2B, the solder particles 41 are concentrated around the intersection of the row of the solder particles and the terminals, so that the amount of solder sufficient for the connection is obtained and
There was also solder that straddled No. 3. It was also found that electrical connection failure would occur unless 10 to 15 or more solder particles per terminal normally contributed to the connection.

【0013】そしてこの様に交差部分での接続をより確
実にするためには、半田粒子41の列のピッチは端子1
2の列のピッチと略等しいかそれより短く、傾き角度θ
は60度を中心に半田粒子41の列のピッチの大きさに
合わせて10度前後ずらすのが特に好ましいものであっ
た。これは交差角が大きいと交差部分が四角形になりや
すく面積が限られやすいのに対し、交差角が小さいとピ
ッチ擦れに対して接続面積の制限を受けやすくなること
によるものである。なお半田粒子41の列42の内部に
おいては半田粒子が整列している必要はなく、また列以
外のところに半田粒子があってはならないということも
ない。例えば列以外では0〜5個/1端子の密度となる
ように配置され、10〜50個/1端子と半田粒子の密
度が高い部分が帯状に設けてあるという構成でもよい
し、半田粒子のない接続剤原料シートと半田粒子がラン
ダムに混練された接続剤原料シートを積層して所定の厚
みに切断整形するなどにより半田粒子の列を明確に形成
してもよい。主たる接続部分の列42においては比較的
長い長さにわたって異方性導電が崩されないように配慮
されればよいから、この列42部分の半田粒子41の密
度は15〜30個/1端子が最も好ましい。また母材4
0は前述のエポキシ樹脂系のもののほか、紫外線硬化型
アクリル樹脂、アルキッド樹脂、エステル系の樹脂など
が利用できた。これら母材40は接着性さえあれば、む
しろ補修するときに端子表面を汚さないで剥離可能かど
うかの問題のほうが大きく、半田粒子との親和性はこれ
ら4系統の接着剤では問題とならなかった。
In order to secure the connection at the intersection, the pitch of the row of the solder particles 41 should be set at the terminal 1.
The pitch of the second row is approximately equal to or shorter than the pitch, and the inclination angle θ
It was particularly preferable to shift about 10 degrees by about 10 degrees in accordance with the pitch of the row of the solder particles 41 around 60 degrees. This is because if the crossing angle is large, the crossing portion tends to be square and the area is easily limited, while if the crossing angle is small, the connection area is easily limited by the pitch rubbing. It is not necessary that the solder particles are aligned inside the row 42 of the solder particles 41, and that the solder particles must not be located outside the row. For example, other than the rows, the arrangement may be such that a density of 0 to 5 terminals / 1 terminal is provided, and a portion having a high density of 10 to 50 terminals / 1 terminal and solder particles is provided in a band shape. A row of solder particles may be clearly formed by laminating a bonding agent material sheet and a bonding agent material sheet in which solder particles are randomly kneaded, and cutting and shaping to a predetermined thickness. In the row 42 of the main connection portion, care should be taken so that the anisotropic conductivity is not broken over a relatively long length. Therefore, the density of the solder particles 41 in the row 42 is preferably 15 to 30 terminals / 1 terminal. preferable. Also base material 4
As for No. 0, besides the above-mentioned epoxy resin type, ultraviolet curable acrylic resin, alkyd resin, ester type resin and the like could be used. As long as the base material 40 has adhesiveness, the problem of whether or not it can be peeled off without repairing the terminal surface when repairing is greater, and the affinity with the solder particles is not a problem with these four types of adhesives. Was.

【0014】また接続剤としては半田粒子以外において
も、例えば直径が3〜10μmのインジウムや金の粒子
の場合、単にそれらの粒子が端子に当接するだけでなく
端子部において潰され擦られたように変形している場合
に電気的導通が良好となる。従って本発明の実施に当っ
ては、これらの金属粒子と半田粒子とを組み合わせて用
いてもよい。この場合接続導電粒子の密着性が高くなる
というよりも、半田により接続剤4の異方性導電性を局
所的に損なうことになり、接続がより確実になるものと
考えられる。また、この様な本発明に従う方法のほか、
異方性導電材料の混練導電粒子を大きくしたり混練密度
を高くすることも検討したが、傷に対して効果が生じる
程度の大きさや密度になると、任意の個所で厚み方向
(図1aの紙面に垂直な方向)に交わる方向(図1a、
bの紙面と平行な方向、例えば接続剤4の長手方向)の
電気的導通が生じ、とりわけ端子ピッチが小さくなると
端子間短絡が多く発生して好ましいものではなかった。
In addition to the solder particles other than the solder particles, for example, in the case of indium or gold particles having a diameter of 3 to 10 μm, the particles may not only come into contact with the terminals but also be crushed and rubbed at the terminal portions. In this case, the electrical conduction becomes good. Therefore, in practicing the present invention, these metal particles and solder particles may be used in combination. In this case, it is considered that the anisotropy conductivity of the connection agent 4 is locally impaired by the solder, and the connection is made more reliable, rather than the adhesion of the connection conductive particles is increased. In addition to the method according to the present invention,
It was also considered to increase the kneading conductive particles of the anisotropic conductive material and to increase the kneading density. (FIG. 1a,
Electric conduction occurs in a direction parallel to the paper surface of b, for example, in the longitudinal direction of the connection agent 4), and especially when the terminal pitch is small, short-circuiting between terminals frequently occurs, which is not preferable.

【0015】[0015]

【発明の効果】以上の如く、本発明によれば密集した端
子部においても隣接端子部との短絡を生じることなく確
実に基板1と駆動素子3を接続することが出来、しかも
駆動素子との接続に当って傷を発見した場合にも接続確
率が高いので、とりわけ端子の本数が多く端子密度も高
い表示器において極めて効果が大きい。
As described above, according to the present invention, the substrate 1 and the driving element 3 can be reliably connected without causing a short circuit between adjacent terminals even in a dense terminal section. Since the probability of connection is high even when a flaw is found during connection, the effect is extremely large especially in a display device having a large number of terminals and a high terminal density.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明実施例の表示装置の要部平面図aとそれ
に用いた接続剤4の要部平面図bである。
FIG. 1 is a plan view a of a main part of a display device according to an embodiment of the present invention and a plan view b of a main part of a connecting agent 4 used for the same.

【図2】接続後の接続剤の表面の、従来における状態図
aと本発明における状態図bである。
FIG. 2 is a state diagram a in the related art and a state diagram b in the present invention on the surface of the connecting agent after connection.

【符号の説明】[Explanation of symbols]

1 基板 12 端子 2 端子部 3 駆動素子 33 端子部電極 4 接続剤 DESCRIPTION OF SYMBOLS 1 Substrate 12 Terminal 2 Terminal part 3 Drive element 33 Terminal part electrode 4 Connecting agent

フロントページの続き (72)発明者 磯部 正義 鳥取県鳥取市南吉方3丁目201番地 鳥 取三洋電機株式会社内 (56)参考文献 特開 昭61−277179(JP,A) 特開 平5−226021(JP,A) (58)調査した分野(Int.Cl.7,DB名) G02F 1/1345 G09F 9/00 Continuation of the front page (72) Inventor Masayoshi Isobe 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. (56) References (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) G02F 1/1345 G09F 9/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 表面に露出して設けられた透明電極から
なる端子の列を含む端子部を有する表示器の基板と、該
基板の端子部に接続される端子部を有した駆動素子と、
前記基板の端子部と前記駆動素子の端子部との間に介在
し両端子を接続する接続剤とを有し、前記接続剤は前記
端子の列に斜交した列を成す半田粒子の列を有している
ことを特徴とする表示装置。
1. A display device substrate having a terminal portion including a row of terminals made of transparent electrodes provided on a surface thereof, a driving element having a terminal portion connected to the terminal portion of the substrate,
A connecting agent interposed between the terminal portion of the substrate and the terminal portion of the driving element to connect the two terminals, wherein the connecting agent forms a row of solder particles forming a row oblique to the row of the terminals. A display device, comprising:
JP01108594A 1994-02-02 1994-02-02 Display device Expired - Fee Related JP3258805B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP01108594A JP3258805B2 (en) 1994-02-02 1994-02-02 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01108594A JP3258805B2 (en) 1994-02-02 1994-02-02 Display device

Publications (2)

Publication Number Publication Date
JPH07218926A JPH07218926A (en) 1995-08-18
JP3258805B2 true JP3258805B2 (en) 2002-02-18

Family

ID=11768145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP01108594A Expired - Fee Related JP3258805B2 (en) 1994-02-02 1994-02-02 Display device

Country Status (1)

Country Link
JP (1) JP3258805B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100232680B1 (en) * 1997-01-22 1999-12-01 구본준 Acf structure

Also Published As

Publication number Publication date
JPH07218926A (en) 1995-08-18

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