JP3254373B2 - Clean room and its operation method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clean room, and more particularly to a clean room and a method of operating the same between a ceiling plenum chamber and an underfloor retan chamber, and more particularly, to laminar flow and turbulence in a clean space such as a bay type or mixed flow type clean room. The present invention relates to a clean room in which a stream coexists and an operation method thereof.

[0002]

2. Description of the Related Art Conventionally, in a clean room requiring a high cleanliness (for example, classes M4 to M1 of US Federal Standard 209E), such as a clean room for semiconductor manufacturing,
A vertical laminar flow system as shown in FIG. 4 is employed.
The clean room 402 of the entire vertical laminar flow system is formed between the ceiling plenum chamber 404 and the underfloor retan chamber 406. A high-performance filter 408 such as an ULPA filter is disposed on the entire boundary surface between the ceiling plenum chamber 404 and the clean room 402 to form a clean air blowing surface. Underfloor urethane chamber 4
A suction surface 410 in which a plurality of suction ports are formed is formed on a boundary surface between the cleaning room 06 and the clean room, and various devices 411a to 411d such as a semiconductor manufacturing apparatus are installed on an upper surface thereof.

The outside air OA supplied from the outside air supply duct 412 and the return air 414 from the clean room pass through the filter 418, the non-condensing coil 420, and the silencers 422, 424 by a fan 416, and are passed to the ceiling plenum chamber 404. Sent, high-performance filter 408
, As vertical laminar clean air,
The water flows in the direction of the floor surface (suction surface) 410.

A clean room of the vertical laminar flow type as shown in FIG. 4 can achieve almost the same cleanliness over the entire clean room 402, so that the degree of freedom of use of the clean room is increased. There was a problem that equipment costs and operating costs also increased. In addition, since almost the same vertical airflow is circulated throughout the clean room, there is a problem that the blowing power is increased and the running cost is increased.

As a method for overcoming the problem of the vertical laminar flow system, a so-called open bay type clean room has recently been proposed. FIG. 5 shows this open bay type clean room. Note that the basic configuration of the open bay type clean room is substantially the same as the entire vertical laminar flow type clean room described with reference to FIG. 4, and thus the same reference numerals are given to components having the same functions. Thus, the duplicate description will be omitted.

[0006] In this open bay type clean room, the installation area ratio and performance of the filter 408 are selected according to the cleanliness required in the area. For example, a process area that is extremely resistant to contamination, such as when a wafer moves or is transferred to a load section of a manufacturing apparatus (for example,
402a and 402c), the installation area ratio of the filter 408 installed on the ceiling is increased,
The performance of No. 8 is improved, and the cleanliness is set high. On the other hand, the maintenance unit (for example, 402b, 40
In areas where high cleanliness is not normally required, such as 2d) and the passage of maintenance personnel (for example, 402e), the installation area ratio of the filter 408 installed on the ceiling is reduced, or the performance of the filter 408 is reduced. And the cleanliness is set low. Further, in the case of this open bay system, a back panel (for example, a fixed wall made of a sandwich steel plate or the like that separates a back surface of the manufacturing apparatus from a maintenance area) 430 or a droop is provided at a boundary surface between an area with high cleanliness and an area with low cleanliness. A wall (for example, a hanging wall made of a transparent acrylic plate or the like used to separate the front of the manufacturing apparatus from the work passage) 432, a wall such as a vinyl curtain, an eye lid (not shown), and the like are installed to separate the two areas. In addition, cross contamination is prevented by eliminating or reducing air flow mixing.

In the above-described open bay type clean room, the amount of circulating air is smaller than that in the entire vertical laminar flow system shown in FIG. 4, so that the air blowing power is reduced and the running cost is also reduced. In an area with low cleanliness, the installation area of the filter is relatively small, so that the equipment cost and the operating cost are reduced. However, since the installation location of the filter 408, the hanging wall 432, the back panel 430, the vinyl curtain, and the eye lid is fixed, when the manufacturing apparatus is replaced or the line is changed, the installation location of the filter is changed (accordingly, the sealing is performed). Also, it is necessary to remove and attach the hanging wall 432 and the back panel 430, and it is troublesome, and when making large-scale changes, it is necessary to stop the clean room.

Incidentally, a manufacturing apparatus for manufacturing a semiconductor wafer, an LCD substrate and the like is installed in the clean room. Such a manufacturing apparatus is usually provided with a maintenance unit having a door that can be opened and closed. This maintenance unit is closed during normal manufacturing in which a wafer flows on a manufacturing line, and contaminated air does not enter the inside of the apparatus. However, the maintenance unit is opened as needed or at the time of maintenance such as cleaning of the inside of the apparatus which is performed periodically (for example, once a day or once a week). Therefore, while the maintenance unit is open, it is necessary to flow clean air around the manufacturing apparatus in order to prevent contamination inside the apparatus. In this regard, in the conventional open bay type clean room, regardless of whether the manufacturing equipment is maintained,
Air of a certain degree of cleanliness must always be supplied, leading to an increase in running costs.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of a conventional clean room, and its object is to use a wall such as a hanging wall or a back panel. It is possible to freely configure areas with different cleanliness in the clean room without changing the area, and it is also possible to easily change those areas and simplify the construction and construction method of the clean room Therefore, the construction period can be shortened, the construction cost can be reduced, the degree of freedom of the clean room can be increased, and the running cost can be reduced. Is to provide a clean room.

[0010]

According to the present invention, a ceiling plenum chamber (102) is provided.
A clean room (104) formed between the high-purity area and the under-floor urethane chamber (106) has a high cleanliness area (104H) and a low cleanliness that is relatively lower than the cleanliness of the high cleanliness area. And a high cleanliness area (104L).
H) and the buffer space between the low cleanliness area (104L)
(104B) is provided . Then, set up a fan filter unit (200), respectively to the ceiling plenum chamber at least highly clean area (104H) and buffer space (104B), the more the fan filter unit (200), per unit area in each space The average wind speed in the buffer space (104B) is equal to or lower than the average wind speed in the high cleanliness area (104H), and the average wind speed in the low cleanliness area (104L) is
Adjust so as to be lower than the average wind speed of 4B). According to this configuration, the clean air is supplied to the high cleanliness area (104).
H), it is possible to adjust the air flow direction so as to flow naturally from the low cleanliness area (104L) to the low cleanliness area (104L).
The phenomenon of causing backflow to H) or causing cross-contamination can be eliminated by providing the buffer space (104B).

Therefore, according to the present invention, as in the prior art,
Even without using any walls such as hanging walls and back panels,
Low cleanliness area (104L) and high cleanliness area (104L)
H) It is possible to effectively prevent the cross contamination. Also fan filter unit (200)
Can be installed by a dry method without using a silicone seal or the like, so that the transfer can be performed very easily. Also,
By taking advantage of the negative pressure in the ceiling plenum chamber (102), it is possible to relocate the clean room during operation. Furthermore, according to the present invention, since no hanging wall or back panel is used, the manufacturing apparatus (110a to 110a)
It is easy to change the layout in the clean room (104) due to replacement of 110e) or change of lines. Further, since there is no hanging wall or back panel, the degree of freedom of movement of the worker is increased, and the workability can be improved.
In addition, equipment costs can be reduced by the amount that the eye lid and the back panel are not used.

According to the present invention, the effective opening area of the floor (108) used as the suction port (108a) of the high cleanliness area (104H) is changed to the low cleanliness area (10H).
Floor (1L) used as a suction port (108b)
08), the air flow direction can be more effectively adjusted from the high cleanliness area (104H) to the low cleanliness area (104L) by making the air flow ratio of each space smaller than the effective opening area of (08). .

Further, the manufacturing apparatuses (110a to 110e) are installed in the clean room (104) configured as described above.
When installing the maintenance unit, it is preferable that the maintenance unit side is installed toward the low cleanliness area (104L), and at least near the ceiling of the maintenance unit (for example, the buffer space (104B) or the low cleanliness area (104L)). It is preferable to configure the fan filter units (200a, 200b) installed on the upper portions (116, 118) of the devices so that the operation can be stopped as required.

The clean room (10
According to 0), the fan filter units (200a, 200b) installed near the ceiling of the maintenance unit of the manufacturing apparatus (110a to 104e) are driven at least during maintenance of the manufacturing apparatus, and the low cleanliness area (104L)
In the case where the cleanliness is not required so much in the maintenance section in, for example, it is possible to stop during normal production, it is possible to reduce the amount of circulating air, to save power,
Operation at low running cost becomes possible.

That is, the manufacturing apparatuses (110a to 110a)
e) When the operation of the fan filter units (200a, 200b) installed near the ceiling of the maintenance section is stopped, the buffering action (eg, low cleanliness to the high cleanliness area (104H)) by the buffer space (108B) Although the effect of preventing the turbulent flow from the area (104L) is eliminated, the blowing direction of the air blown from the ceiling surface of the high cleanliness area (104H) depends on the difference in the opening area of the floor surface per air volume, and Depending on the pressure difference in each area,
Since it flows in the direction of the low cleanliness area (104L), and since this space is usually unmanned during manufacturing, cross contamination can be effectively prevented. On the other hand, at the time of maintenance of the manufacturing apparatuses (110a to 110e) or the like, the maintenance section of the manufacturing apparatuses (110a to 110e) needs to be opened. Required, but only then, the fan filter unit (2
00a, 200b), the low cleanliness area (1
04L) can be increased, and internal contamination of the manufacturing apparatus can be effectively prevented.

Further, on the ceiling of the low cleanliness area (104L), a fan filter unit (200c) that can be stopped independently of the fan filter units (200a, 200b) installed near the ceiling of the maintenance unit. Can be provided. This fan filter unit (2
00c) can supply, for example, cool air cooled by the non-condensing coil (114) into the low cleanliness area (104L). For example, during normal operation, for example, while the fan filter units (200a, 200b) are stopped, the fan filter unit (200c) can be driven to suppress heat generation of the manufacturing apparatus.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a clean room system according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 schematically shows a clean room system 100 according to the present invention. The clean room system 100 includes a ceiling plenum chamber 102, a clean room 104, and an underfloor urethane chamber 106. The clean room 104 includes a plurality of spaces 104H, 104L , and 104 having different required degrees of cleanliness.
B. In the illustrated example, in the clean room 104, a process area (hereinafter, referred to as a high cleanliness area) 104H in which the loading and unloading of the wafer is performed and the contamination is extremely disfavored, a maintenance of the manufacturing apparatus, and a maintenance staff come and go. (Hereinafter, referred to as a low cleanliness area) 10 in which a very high cleanliness is not required.
4L. Furthermore, high cleanliness area 10
Buffer space 1 between 4H and low cleanliness area 104L
04B (a region indicated by a dotted line in the figure) is configured. The buffer space B is provided above the manufacturing apparatus (work processing apparatus) so that the high cleanliness area is not contaminated by dust from the low cleanliness area. Thereby, the hanging wall which conventionally divides the load / unload section and the low cleanliness area of the work processing apparatus is omitted.

The floor 108 of the clean room 104 (that is, the clean room 104 and the under-floor
6) is composed of a lattice plate, a punching plate, or the like, and has a large number of suction ports 108a and 108b, and the clean room 10 is provided through the suction ports 108a and 108b.
4 is configured to be able to suck in the return air. The suction ports 108a and 108b are
It may be provided on the entire surface, or may be provided only at a necessary place. In particular, as will be described later, the airflow is controlled in the high cleanliness area 10.
When it is desired to flow from 4H to the low cleanliness area 104L, the effective opening area of the floor 108 having the suction port 108a of the high cleanliness area 104H is changed to the low cleanliness area 104.
It is preferable that the ratio is smaller than the effective opening area of the floor surface 108 having the L suction port 108b with respect to the suction air flow rate. That is, the high cleanliness area has an overwhelmingly larger supply of clean air than the low cleanliness area, so the total sum of the floor opening areas for each area must be larger than the latter. Regarding the ratio of the sum of the intake air volume and the sum of the opening areas for each area, if the former is smaller than the latter, resistance will occur on the floor surface, and the clean air will flow toward the low cleanliness area. become.

These floors 108 have such a strength that a semiconductor manufacturing apparatus can be installed, for example.
In the illustrated example, a wafer load / unload device 110a is installed in the high cleanliness area 104H, and the processing device 110 is located adjacent to the load / unload device 110a.
b is installed. The maintenance side of the processing device 110b is disposed in the low cleanliness area 104L via the buffer space 104B. Another high cleanliness area 10
4H, processing devices 110c, 110d, and 110e are respectively installed.
The maintenance sides of 0d and 110e are similarly disposed in the low cleanliness area 104L via the buffer space 104B.

In the underfloor replenishment chamber 106, return air from the suction ports 108a and 108b of the floor surface 108 and outside air (OA) from the outside air processing device 112 are provided.
Is sent upward through a non-condensing coil 114 and further sent to the ceiling plenum chamber 102. Boundary surface 1 between ceiling plenum chamber 102 and clean room 104
16 (that is, the ceiling surface) is provided with a fan filter unit 2 composed of, for example, beams and frames that are extended vertically and horizontally.
A large number of installation frames for installation are formed, and the fan filter unit 200 is detachably provided on the installation frame so as to cover the opening of the installation frame. Note that a known air handling unit is used as the outside air processing device to cover the latent heat load of the clean room. The non-condensing coil 114 includes a sensor that measures the circulating air at the coil outlet, an automatic valve that controls the flow rate of the refrigerant in the coil, and a controller that calculates the opening of the automatic valve from the measurement value of the temperature sensor. Things. As the refrigerant, a CFC-based refrigerant and cold water are used, and the latter is more preferable.

Next, the outline of the fan filter unit 200 will be described. This fan filter unit 20
0 is disclosed, for example, in JP-A-7-243682. The fan filter unit 200 includes, for example, a fan unit and an ULPA (or HEPA) filter sequentially housed in a substantially rectangular parallelepiped casing from the suction port on the upper surface to the outlet on the lower surface. By performing inverter control, clean air having a desired wind speed can be supplied from the outlet on the lower surface. Note that the fan filter unit 200 is provided with a terminal unit connected to the central monitoring panel, and supplies power to the fan unit,
It is possible to relay a drive stop command and an operation frequency signal from the inverter. Therefore, the fan filter unit 200 can start and stop the fan, stop the supply of clean air, and control the number of revolutions of the fan in accordance with a command from the central monitoring panel.

The fan filter unit 200 configured as described above can be detachably installed on an installation frame formed on the ceiling surface. Then, according to this embodiment, the ceiling surface 11 3 of the high cleanliness area 104H, by increasing the installation rate of the fan filter unit 200 may provide the cleaner air.
On the other hand, since a very high cleanliness is not required in the low cleanliness area 104L, the installation ratio of the fan filter unit 200 installed on the ceiling surface 116 can be reduced. For cleanliness requirements,
As described above, the adjustment can be performed by the installation ratio of the fan filter unit 200. However, it is also possible to change the performance of the filter provided in the fan filter unit 200 or to stop the operation of the fan. Can be adjusted. That is, the high cleanliness area 104H
, A higher performance filter may be used, and a relatively low performance filter may be used for the low cleanliness area 104L.

Further, in the above embodiment, a buffer space 104B (a region shown by a dotted line in the figure) is formed between the high cleanliness area 104H and the low cleanliness area 104L. Then, according to the present invention, this buffer space 104
A fan filter unit 200a for the buffer space is installed on the ceiling surface 118 of B. As will be described later, the fan filter unit 200a has an average wind speed per unit area of the buffer space 104B equal to or less than an average wind speed per unit area of the high cleanliness area 104H, and an average wind speed per unit area of the low cleanliness area 104L. It is installed at an installation ratio that is higher than the wind speed.

It is sufficient that the filter used in the fan filter unit 200a for the buffer space 104B has at least the performance of the filter used in the fan filter unit 200 for the low cleanliness area 104L. . However, when prevention of cross contamination is more strictly required, it is preferable to use a filter equivalent to or more than a filter used in a fan filter unit for the high cleanliness area 104H.

As described above, according to the present embodiment, 1
Since the blowing air speed can be changed freely for each table, the fan filter unit 20 installed in each area
0 indicates that the average wind speed per unit area of the buffer space 108B is less than or equal to the average wind speed per unit area of the high cleanliness area 104H and is higher than the average wind speed per unit area of the low cleanliness area 104L. Adjusted. That is, if the average wind speed per unit area of the buffer space 104B is Vb, the average wind speed per unit area of the high cleanliness area 104H is Vh, and the average wind speed per unit area of the low cleanliness area 104L is Vl, Vh ≧ Vb> The operating capacity of the fan filter unit 200 is controlled so as to be Vl. For example, Vh ≧ 0.35 (m / s), 0.35 (m / s) ≧ Vb ≧ 0.2 (m / s), 0.3 (m / s) ≧ Vl ≧ 0.1 (m / s) can be set to

As a result, as shown by the arrows in the figure, the clean air moves from the high cleanliness area 104H to the low cleanliness area 104H.
The direction of the air flow can be adjusted so that the air flows naturally into the air space L, and the phenomenon that the turbulence generated in the low clean space 104L flows back to the high clean area 104H can be eliminated by the buffer space 104B. Therefore, the buffer space 104B can be formed between the high cleanliness area 104H and the low cleanliness area 104L without installing a wall for preventing cross contamination such as a hanging wall or a back panel as in the conventional system. If provided, cross contamination between the high cleanliness area 104H and the low cleanliness area 104L can be effectively prevented, and areas having different cleanliness can coexist in the clean room 104.

FIG. 2 shows the excellent effect of the present invention in comparison with a conventional example using a hanging wall. In the figure, the vertical axis shows the height from the ceiling to the floor, the horizontal axis when the origin is the boundary between the high cleanliness area and the buffer space,
The distances on the high cleanliness area side and the buffer space side are shown, respectively. A fan filter unit used for supplying clean air is schematically illustrated in the upper part of the figure. In the experiment, the average wind speed in the high cleanliness area and the buffer space was set to 0.35 (m / s), and a linear dust source was installed on the low cleanliness area side, and the pollution degree in each area was measured. . The contamination status is shown in the figure by 0.1
The position where the average count number of particles of μm or more was 1 / CF (cubic feet) or more was plotted and determined. Therefore, in the figure, the cleanliness is maintained in the space on the left side of each plot boundary. Also, in the drawing, the plot of Δ indicates the case where a hanging wall of 1000 mm was installed, the plot of ○ indicates the case where a hanging wall of 450 mm was installed, and the plot of □ indicates the case where the hanging wall was set according to the present invention. Are not used. In the figure, the low cleanliness area is omitted. As a result, according to the present invention, if a buffer space is provided between the high cleanliness area and the low cleanliness area, it is better to omit the hanging wall between the high cleanliness area and the low cleanliness area. It has been found that cross contamination can be effectively prevented. This is considered to be because the position where the drift from the high cleanliness area to the low cleanliness area starts becomes higher due to the shorter hanging wall, and the dust is discharged in a wider range.

Further, according to the present invention, since there is no obstacle such as a hanging wall or a back panel, the layout can be easily changed when the manufacturing apparatus is replaced or the line is changed. Further, since there is no obstacle such as a hanging wall or a back panel in the clean room, the degree of freedom of movement of the worker is increased, and a clean room with good workability can be constructed. Furthermore, equipment costs can be reduced as much as no hanging wall or back panel is used.

As can be seen from FIG. 3, as the width of the buffer space 104B provided in the high cleanliness area 104H and the low cleanliness area 104L increases, the wider the width, the larger the clean area. The experimental conditions shown in FIG. 3 are the same as those shown in connection with FIG.
In the figure, the plot of △ indicates the width of the buffer space is 1200 mm.
, And the plot of ○ indicates the case where the width of the buffer space is set to 600 mm. As described above, according to the present invention, as the width of the buffer space is increased, cross contamination can be more effectively prevented and the cleanliness can be maintained. However, when designing equipment, securing high cleanliness area is the first priority, and then it is necessary to divide the remaining space into buffer space and low cleanliness area. It is preferable to set the optimum width of the buffer space according to the conditions required for the equipment, because it leads to a decrease and an increase in the installation cost of the fan filter unit.

The effective opening area of each space of the floor surface 108 having the suction ports 108a and 108b at the suction air volume ratio is set to be lower than the high cleanness area 104H and the low cleanness area 104L.
As described above, it is possible to more effectively adjust the direction of the airflow from the high cleanliness area 104H to the low cleanliness area 104L by making the adjustment to be larger.

As described above, the operation of each fan filter unit 200 can be freely stopped by a command from the central monitoring panel. So, for example,
Low cleanness area 104L or buffer space 104B
Among the fan filter units 200 installed on the ceiling surface, fan filter units 200 b and 200 c installed immediately above or near the maintenance unit of the manufacturing apparatus are driven only during maintenance, for example, and stopped during normal manufacturing. By performing such operation stop control, it is possible to prevent the inside of the device from being contaminated during maintenance and to reduce the running cost.

Alternatively, among the fan filter units 200 installed on the ceiling of the low cleanliness area 104L, the fan filter unit 200c for supplying cool air, for example, cools the cool air cooled by the non-condensing coil 114 into the low cleanliness area 1
Since it can be supplied in 04 L , for example,
During normal operation, that is, the fan filter unit 200
When the temperature in the low-cleanliness area 104L rises to a predetermined temperature or more due to the heat generated by the manufacturing apparatus while the a and 200b are stopped, by driving the fan filter unit 200c, the heat generated by the heat is generated. Load can be compensated.

Although the preferred embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, and those skilled in the art will appreciate the technical features described in the claims. It is needless to say that various changes and modifications can be made without departing from the spirit, and these are also included in the technical scope of the present invention.

In particular, the present invention is not limited to the above-described embodiment, but can be applied to any use as long as it is a clean room including a plurality of spaces having different degrees of cleanliness. For example, in the above embodiment, an example is shown in which only a removable fan filter unit is installed on the ceiling surface.
The present invention can be applied to an open bay type clean room as shown in FIG. In that case,
By forming a buffer space with a fan filter unit in the area where a hanging wall or back panel was previously installed, spaces with different cleanliness can coexist in a common clean room without using a hanging wall or back panel It is possible to do.

Also, the fan filter unit 200 applicable to the present invention may be a so-called fan filter unit according to the present invention as long as it has a filter mechanism, a blowing mechanism, a variable air volume mechanism, a power control mechanism, etc. in an individual unit. Needless to say, this is included in the scope of the present invention. Further, the non-condensing coil can be installed separately from the non-condensing coil 114 for circulating air on the indoor side near the fan filter unit 200c for heat generation countermeasures of the manufacturing apparatus installed above the maintenance area. .

[0037]

As described above, according to the present invention,
A plurality of spaces (104H, 104L) of different cleanliness in the clean room (104) are buffered (104B).
The average wind speed per unit area of the buffer space (104B) is less than or equal to the average wind speed per unit area of the high cleanliness area (104H), and the average wind speed per unit area of the low cleanliness area (104L). Is also set to be high, so that the flow of the clean air is directed from the high cleanliness area (104H) to the low cleanliness area (104L), and the turbulence of the low cleanliness area (104L) is changed to the high cleanliness area. (104H), it is possible to effectively prevent cross contamination between the high cleanliness area (104H) and the low cleanliness area (104L).

Further, without using any walls such as hanging walls, back panels, eyelids, vinyl curtains, etc., cross-contamination occurs in spaces (104H, 104L) having different degrees of cleanness in the common clean room (104). They can coexist without causing them to coexist. Since the fan filter unit (200) can be installed by a dry method without using a seal, it can be relocated very easily.
By taking advantage of the negative pressure in the ceiling plenum chamber (102), relocation during operation is also possible. Further, since no hanging wall or back panel is used, it is easy to change the layout in the clean room (104) due to replacement of the manufacturing equipment (110a to 110e) or change of the line. Further, since there is no hanging wall or back panel, the degree of freedom of movement of the worker is increased, and the workability can be improved. In addition, the equipment cost can be reduced by the amount that the hanging wall and the back panel are not used.

Furthermore, according to the present invention, only the necessary fan filter units among the fan filter units installed in the low cleanliness area (104L) or the buffer space (104H) are operated or stopped as necessary. As a result, the running cost can be reduced, and the internal contamination of the manufacturing apparatus can be effectively prevented during the maintenance of the manufacturing apparatus.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing a schematic configuration of an embodiment of a clean room according to the present invention.

FIG. 2 is a table showing a comparison of cleanliness between a clean room according to the present invention and a clean room using a conventional eyelid panel.

FIG. 3 is a table showing the relationship between the size of a buffer space and the cleanliness of the clean room in the clean room according to the present invention.

FIG. 4 is a partial cross-sectional view showing a schematic configuration of a conventional clean room of a general vertical laminar flow system.

FIG. 5 is a partial sectional view showing a schematic configuration of a conventional open bay type clean room.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 100 Clean room system 102 Ceiling plenum chamber 104 Clean room 104H High cleanliness area 104L Low cleanliness area 106 Underfloor ethane chamber 104B Buffer space 108 Floor surface 108a, 108b Suction port 116 Ceiling surface 200 Fan filter unit 200a Fan filter unit for buffer space

Continued on the front page (72) Noboru Hama, Inventor 1-1, Yukicho, Takatsuki-shi, Osaka Prefecture Inside Matsushita Electronics Corporation (72) Inventor Illumination 1-1, Yukicho, Takatsuki-shi, Osaka Matsushita Electronics Corporation In-company (72) Inventor Senji Iwama 5-6-15 Takada, Gifu City, Gifu Prefecture (72) Inventor Susumu Kawabata 416, Horikawacho, Toyama City, Toyama Prefecture (56) References JP-A-61-291850 (JP, A) JP-A-7-243682 (JP, A) JP-A-3-291436 (JP, A) JP-A-61-91434 (JP, A) JP-A-3-113221 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) F24F 7/06

Claims (7)

(57) [Claims] 1. A clean room configured between a ceiling plenum chamber and an underfloor retan chamber, wherein the clean room has a high cleanliness area and a cleanness relatively lower than the cleanliness of the high cleanliness area. A buffer space between the high cleanliness area and the low cleanliness area; and fan filters at least in the ceiling plenum chambers of the high cleanliness area and the buffer space, respectively. and installing the unit; more to the respective fan filter units, the average wind speed per unit area in each space, the average wind speed of the buffer space is less than the average wind speed of the high cleanliness area, the average of the low cleanliness area Wherein the wind speed is adjusted so as to be lower than the average wind speed in the buffer space. Room. 2. An effective opening area of a floor used as a suction port of the high cleanliness area is smaller in an air volume ratio of each space than an effective opening area of a floor of the low cleanliness area. The clean room according to claim 1. 3. The manufacturing apparatus installed in the clean room has its maintenance unit side installed toward the low cleanliness area, and at least a fan filter unit installed near the ceiling of the maintenance unit is required. The clean room according to claim 1, wherein the operation of the clean room can be freely stopped according to the following conditions. 4. A fan filter unit which can be stopped and operated independently of a fan filter unit installed near the ceiling of the maintenance section on a ceiling of the low cleanliness area, The clean room according to claim 3, wherein cool air can be supplied into the low cleanliness area according to the temperature of the area. 5. The method for operating a clean room according to claim 3, wherein the fan filter unit installed near a ceiling of a maintenance unit of the manufacturing apparatus is driven at least during maintenance of the manufacturing apparatus. A method for operating a clean room, characterized in that: 6. The clean room operating method according to claim 4, wherein the fan filter unit installed near a ceiling of a maintenance unit of the manufacturing apparatus has a predetermined cleanliness level in the low cleanliness area. The method for operating a clean room, characterized in that the method is stopped when no is required. 7. The method for operating a clean room according to claim 6, wherein when the operation of the fan filter unit installed near the ceiling of the maintenance unit of the manufacturing apparatus is stopped, the low cleanliness area is reduced. The operation of the clean room, characterized in that, when the temperature of the cleaning unit rises to a predetermined value or more, a fan filter unit that can be stopped independently of a fan filter unit installed near the ceiling of the maintenance unit is driven. Method.